CN212785995U

CN212785995U - PCB heat balance layout structure

Info

Publication number: CN212785995U
Application number: CN202021255878.7U
Authority: CN
Inventors: 刘贝贝; 何银山
Original assignee: Dongfeng Electric Drive Systems Co Ltd
Current assignee: Dongfeng Electric Drive Systems Co Ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2021-03-23
Anticipated expiration: 2030-06-30

Abstract

The utility model relates to a PCB board technical field, in particular to PCB heat balance layout structure, include: the device comprises a bottom plate, a core plate, a plate-to-plate connector and a power module; the core board and the board-to-board connector are arranged on the backplane; the power supply module is arranged on one side of a power pin of the board-to-board connector and is arranged on the bottom plate; the power supply is connected with the core board through the power supply pin of the board-to-board connector and supplies power. The utility model provides a PCB heat balance layout structure, the power module is arranged on the bottom plate instead of the core plate, which can prevent the technical problem that the components on the core plate can not work normally caused by the large amount of heat generated by the power module to the local part of the core plate; in addition, the power supply module is arranged on the bottom plate, so that the technical problems of difficult wiring and the like caused by arrangement of the power supply module in a core board office can be solved.

Description

PCB heat balance layout structure

Technical Field

The utility model relates to a PCB board technical field, in particular to PCB heat balance layout structure.

Background

The PCB layout of the core board of the IMX6 is that a main power supply DDR (double data rate) power supply chip of the IMX6 is placed on the core board, the layout mode is a layout of a cut official DEMO board, and when the PCB layout is practically applied to products, a module circuit of the IMX6 is integrated on a 6-8 layer board and then connected to a bottom board through a connector, and the bottom board has a large area due to structural and functional limitations. Therefore, the actual product is formed by combining the core board and the bottom board, the purpose is firstly to reduce the area of the core board, so that the cost is reduced, and secondly, the platform transplantation is more convenient. The current mainstream core board power chip PCB layout method still arranges power supplies for IMX6 and DDR3 on the core board. This arrangement has the following disadvantages: the area of the core board is increased, and the corresponding cost is increased; the power module belongs to a heating device, the total heat of the core board with small area can be increased when the power module is arranged on the core board, and the cost can be increased by using a radiating fin at the later stage; the power supply chip is arranged on the core board, so that the routing on the PCB with the small area is more difficult.

SUMMERY OF THE UTILITY MODEL

The utility model discloses arrange power module and the radiating effect that arouses is poor on the nuclear core plate to existence among the prior art, need set up special heat dissipation part increase cost to and arrange power module and the technical problem such as line difficulty that walks that causes on IMX 6's the nuclear core plate, provide a PCB heat balance layout structure.

The utility model provides an above-mentioned technical problem's technical scheme as follows:

a PCB thermal balance layout structure comprising: the device comprises a bottom plate, a core plate, a plate-to-plate connector and a power module; the core board and the board-to-board connector are arranged on the backplane; the power supply module is arranged on one side of a power pin of the board-to-board connector and is arranged on the bottom plate; the power supply is connected with the core board through the power supply pin of the board-to-board connector and supplies power.

Further, at least one heat dissipation area is arranged on the outer side of the bottom plate.

Furthermore, a heat dissipation copper foil is laid in the heat dissipation area.

Further, the heat dissipation area is arranged to be square; and the heat dissipation copper foil is uniformly laid in the heat dissipation area.

Further, the number of the power supply modules is at least one.

Further, the power module is a DDR power chip.

Further, the core board is an IMX6 core board.

The utility model provides a PCB heat balance layout structure possesses following beneficial effect or advantage at least:

the utility model provides a PCB heat balance layout structure, a core board and a board-to-board connector are arranged on a bottom board; the power supply module is arranged on one side of a power pin of the board-to-board connector and is arranged on the bottom plate; the power supply is connected with the core board through the power supply pins of the board-to-board connector and supplies power. The utility model provides a PCB heat balance layout structure, the power module is arranged on the bottom plate instead of the core plate, which can prevent the technical problem that the components on the core plate can not work normally caused by the large amount of heat generated by the power module to the local part of the core plate; in addition, the power supply module is arranged on the bottom plate, so that the technical problems of difficult wiring and the like caused by arrangement of the power supply module in a core board office can be solved.

Further, the utility model provides a PCB heat balance layout structure, the bottom plate outside is provided with the heat dissipation region, and the heat dissipation region can lead away partly heat to nuclear core plate radiation from power module, has further improved the radiating effect to nuclear core plate.

Further, the utility model provides a PCB heat balance layout structure has laid the heat dissipation copper foil in the heat dissipation region, and the heat dissipation copper foil has better heat conduction characteristic, has further improved the radiating effect in heat dissipation region.

Furthermore, the heat dissipation area of the PCB heat balance layout structure provided by the utility model is set to be square; the radiating copper foil is uniformly laid in the radiating area, so that the surface area of the radiating copper foil is increased as much as possible in the radiating area, and the radiating effect of the radiating area is improved.

Drawings

Fig. 1 is a schematic diagram of a thermal balance layout structure of a PCB according to an embodiment of the present invention;

fig. 2 is a comparison graph of core board temperature and traditional core board temperature curve in the PCB thermal balance layout structure provided by the embodiment of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1-bottom plate, 2-core plate, 4-power module, and 5-heat dissipation area.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

The embodiment of the utility model provides a PCB heat balance layout structure, see fig. 1, include: bottom plate 1, nuclear core plate 2, board to board connector and power module 4. The core board 2 is a multilayer board, and the required electronic components and the wiring among the electronic components are integrated on the core board 2. The core board 2 and the board-to-board connector are arranged on the base board 1; the power supply module 4 is arranged on one side of a power supply pin of the board-to-board connector and is convenient to be connected with the power supply pin of the board-to-board connector; and the power supply modules 4 are arranged on the base plate 1, it is possible to reduce about 2/5 area on the basis of the conventional core board 2, thereby reducing the production cost. In this embodiment, at least one power module 4 is provided, and the number of the power modules 4 is flexibly selected according to actual needs; in this embodiment, the core board 2 is an IMX6 core board, and the power module 4 is a DDR power chip. The power supply is connected with the core board 2 through power pins of the board-to-board connector and supplies power.

The utility model provides a in a preferred embodiment, see fig. 1, the outside of bottom plate 1 is provided with at least one heat dissipation area 5, and this embodiment symmetry is provided with four heat dissipation areas 5 in the outside of bottom plate 1, and the heat that partly follow power module 4 to nuclear core plate 2 radiation can be led away in the heat dissipation area. The heat dissipation copper foil is laid in the heat dissipation area 5 and has a good heat conduction characteristic, and the heat dissipation effect of the heat dissipation area 5 is further improved. Preferably, the heat dissipation area 5 is arranged in a square shape; the heat dissipation copper foil is uniformly laid in the heat dissipation area 5, the surface area of the heat dissipation copper foil is increased as much as possible in the heat dissipation area 5, and the heat dissipation effect of the heat dissipation area 5 is improved.

The embodiment of the utility model provides a PCB heat balance layout structure, no power module 4 on the core plate, reduced power chip's on traditional overall arrangement relatively and generated heat, as shown in figure 2, simulate normal atmospheric temperature to 75 degrees centigrade high temperature ambient temperature in the high temperature box, then read out CPU's temperature curve with the serial ports; it can be seen from fig. 2 that the temperature of the patented core board is better than that of the conventional core board, the highest temperature is lower than that of the conventional core board, and the addition of the fan heating sheet may be reduced to save the cost. Devices on the core board are fewer, imx6 main chips basically have no obstacles on the board-to-board connector from the network with pin fan-out, the wiring is more smooth, the layer changing is fewer, and the signal integrity is more facilitated.

Referring to fig. 1, the embodiment of the present invention provides a PCB thermal balance layout structure, which has at least the following beneficial effects or advantages:

in the PCB thermal balance layout structure provided by the embodiment of the utility model, the core board 2 and the board-to-board connector are arranged on the bottom board 1; the power supply module 4 is arranged on one side of a power supply pin of the board-to-board connector, and the power supply module 4 is arranged on the bottom plate 1; the power supply is connected with the core board 2 through the power pins of the board-to-board connector and supplies power. The utility model provides a PCB heat balance layout structure, power module 4 is arranged on the bottom plate 1 instead of on the core board 2, can prevent the power module 4 from generating heat to the local large amount of heat production of core board 2 and cause the technical problem that components and parts on the core board 2 can not work normally; in addition, the power module 4 is arranged on the bottom plate 1, so that the technical problems of difficult wiring and the like caused by the arrangement of the power module 4 on the core board 2 can be solved.

The embodiment of the utility model provides a PCB heat balance layout structure, the 1 outside of bottom plate is provided with heat dissipation area 5, and heat dissipation area 5 can lead away partly from power module 4 to the heat that nuclear core plate 2 radiated, has further improved the radiating effect to nuclear core plate 2.

The embodiment of the utility model provides a PCB heat balance layout structure has laid the heat dissipation copper foil in heat dissipation region 5, and the heat dissipation copper foil has better heat conduction characteristic, has further improved the radiating effect of heat dissipation region 5.

In the PCB heat balance layout structure provided by the embodiment of the utility model, the heat dissipation area 5 is square; the heat dissipation copper foil is uniformly laid in the heat dissipation area 5, the surface area of the heat dissipation copper foil is increased as much as possible in the heat dissipation area 5, and the heat dissipation effect of the heat dissipation area 5 is improved.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A PCB thermal balance layout structure, comprising: the device comprises a bottom plate (1), a core plate (2), a plate-to-plate connector and a power module (4); the core board (2) and the board-to-board connector are arranged on the backplane (1); the power supply module (4) is arranged on one side of a power pin of the board-to-board connector, and the power supply module (4) is arranged on the bottom plate (1); the power supply is connected with the core board (2) through the power supply pin of the board-to-board connector and supplies power.

2. The PCB thermal balance layout structure of claim 1, characterized in that the outside of the bottom plate (1) is provided with at least one heat dissipation area (5).

3. The PCB thermal balance layout structure of claim 2, wherein a heat dissipation copper foil is laid in the heat dissipation area (5).

4. The PCB thermal balance layout structure of claim 3, wherein the arrangement of the heat dissipation area (5) is square; the heat dissipation copper foil is uniformly laid in the heat dissipation area (5).

5. The PCB thermal balance layout structure of claim 1, wherein the number of the power supply modules (4) is at least one.

6. The PCB thermal balance layout structure of claim 1, wherein the power supply module (4) is a DDR power supply chip.

7. The PCB thermal balance layout structure of claim 1, wherein the core board (2) is an IMX6 core board.