CN212660367U

CN212660367U - PCB structure for optimizing heat dissipation performance of power chip

Info

Publication number: CN212660367U
Application number: CN202021516836.4U
Authority: CN
Inventors: 罗青; 郝彦霞; 汤昌才
Original assignee: Shenzhen Edadoc Circuit Co ltd
Current assignee: Shenzhen Edadoc Circuit Co ltd
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2021-03-05
Anticipated expiration: 2030-07-28

Abstract

The utility model discloses an optimize power chip heat dispersion's PCB plate structure, including the PCB board, the top layer surface of PCB board is provided with heat dissipation pad and first heat dissipation copper sheet, and first heat dissipation copper sheet covers in the top of heat dissipation pad, is provided with a plurality of heat dissipation via hole on the heat dissipation pad, and the bottom of heat dissipation via hole from the top layer of PCB board link up to the PCB board, and the bottom surface of PCB board is provided with the window, and the window covers a heat dissipation via hole at least. The utility model discloses a cover the copper sheet of the ground attribute that the one deck is as big as possible on the heat dissipation pad, effectively increaseed the area of heat dissipation copper sheet, go out power chip's heat conduction heat dissipation, improve power chip's electrical apparatus performance, be provided with the heat dissipation via hole on the heat dissipation pad simultaneously, through the back of these heat dissipation via holes with power chip's heat transmission to the PCB board, the back of PCB board is because windowing is handled, heat dissipation that can be better.

Description

PCB structure for optimizing heat dissipation performance of power chip

Technical Field

The utility model relates to a PCB technical field, specific theory relates to an optimize power chip heat dispersion's PCB plate structure.

Background

A Printed Circuit Board (PCB) is also called a PCB, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. Packaging refers to the routing of circuit pins on a silicon die to external connections for connection to other devices. The circuit of the schematic diagram is reflected to the PCB board by packaging and wiring, and one package corresponds to one component.

In general, a power module belongs to a power device, and generates relatively large heat, and if the heat is concentrated and not dissipated, the performance of a power chip is affected. A heat dissipation pad is disposed in the middle of the power module chip, and the pad generally occupies a large area, is usually used for heat dissipation, and is usually a ground return network. Due to the space limitation of the PCB, the heat dissipation pad cannot be made too large, which would otherwise result in the chip occupying a large area of the PCB, and thus is not beneficial for high-density and highly integrated PCB.

The above disadvantages need to be improved.

Disclosure of Invention

In order to overcome the not enough of traditional technique, the utility model provides an optimize power chip heat dispersion's PCB plate structure.

The utility model discloses technical scheme as follows:

the utility model provides an optimize power chip heat dispersion's PCB plate structure, a serial communication port, including the PCB board, the top layer surface of PCB board is provided with heat dissipation pad and first heat dissipation sheet copper, first heat dissipation sheet copper covers the top of heat dissipation pad, be provided with a plurality of heat dissipation via hole on the heat dissipation pad, the heat dissipation via hole is followed the top layer of PCB board link up extremely the bottom of PCB board, the bottom surface of PCB board is provided with the windowing, it covers one at least to window the heat dissipation via hole.

According to above-mentioned scheme the utility model discloses, a serial communication port, it covers wholly to open the window the heat dissipation via hole.

According to the above scheme the utility model discloses, its characterized in that, be provided with second heat dissipation copper sheet on the windowing.

Further characterized in that the second heat-dissipating brass skin is of the same size as the fenestration.

According to the above scheme the utility model discloses, its characterized in that, the size of first heat dissipation copper sheet is greater than the size of heat dissipation pad.

According to above-mentioned scheme the utility model discloses, its characterized in that, a plurality of the heat dissipation via hole is array distribution.

Further, the distance between every two adjacent heat dissipation through holes is not less than 8 mil.

Further, the distance between two adjacent heat dissipation through holes is 8 mil.

Further, the diameter of the heat dissipation through hole is larger than or equal to 8 mil.

According to above-mentioned scheme the utility model discloses, its characterized in that, one of them side, both sides of heat dissipation pad or be provided with a plurality of evenly distributed's pin pad all around.

According to the above scheme the utility model discloses, the beneficial effects of the utility model reside in that:

the utility model discloses a cover the copper sheet of the ground attribute as big as possible on the heat dissipation bonding pad, effectively enlarged the area of heat dissipation copper sheet, go out the heat conduction heat dissipation of power chip, improve the electrical apparatus performance of power chip, be provided with the heat dissipation via hole of a plurality of array distribution on the heat dissipation bonding pad simultaneously, through these heat dissipation via holes with the even transmission of the heat of power chip to the back of PCB board, the back of PCB board is because windowing, better heat dissipation can be carried out; the utility model discloses a windowing coats the copper sheet that is stamped ground attribute, further promotes heat dispersion.

Drawings

Fig. 1 is a top view of the present invention;

fig. 2 is a first bottom view of the present invention;

fig. 3 is a second bottom view of the present invention;

fig. 4 is a cross-sectional view of the present invention;

in the figures, the reference numerals are as follows:

1. a PCB board; 2. a heat-dissipating pad; 3. a first heat-dissipating copper sheet; 4. a heat dissipating via; 5. windowing; 6. a second heat-dissipating copper sheet; 7. a device pin; 11. a top layer; 12. an intermediate layer; 13. a bottom layer.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly or indirectly on the other element. The terms "upper", "lower", "top", "bottom", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are only for convenience of description and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a number" is one or more unless specifically limited otherwise. "plurality" means two or more unless specifically limited otherwise.

As shown in fig. 1 to 2, a PCB board structure for optimizing heat dissipation performance of a power chip includes a PCB board 1, wherein the PCB board 1 includes a top layer 11, a plurality of middle layers 12 and a bottom layer 13, which are sequentially disposed from top to bottom. The surface of the top layer 11 of the PCB board 1 is provided with a heat radiation pad 2 and a first heat radiation copper sheet 3 (copper sheet of ground property), the first heat radiation copper sheet 3 covers the upper part of the heat radiation pad 2, the size of the first heat radiation copper sheet 3 is larger than that of the heat radiation pad 2, and the size of the first heat radiation copper sheet 3 is as large as the allowable range of the wiring space of the PCB board 1. The radiating pads 2 are provided with a plurality of radiating through holes 4 distributed in an array mode, the radiating through holes 4 penetrate from the top layer 11 of the PCB 1 to the bottom layer 13 of the PCB 1, the surface of the bottom layer 13 of the PCB 1 is provided with a window 5, and the window 5 at least covers one radiating through hole 4. The utility model discloses a cover the copper sheet of the ground attribute that the one deck is as big as possible on heat dissipation pad 2, the area of heat dissipation copper sheet has effectively been increaseed, go out power chip's heat conduction heat dissipation, improve power chip's electrical apparatus performance, be provided with the heat dissipation via hole 4 that a plurality of array distributes on heat dissipation pad 2 simultaneously, through these heat dissipation via hole 4 with power chip's the even back of transmitting PCB board 1 of heat, PCB board 1's back is owing to the processing of windowing, heat dissipation that can be better.

As shown in fig. 2, in one embodiment, the window 5 covers all the heat dissipating vias 4, and the size of the window 5 is greater than or equal to that of the heat dissipating pad 2, which further improves the heat dissipation performance.

As shown in fig. 3 and 4, in one embodiment, the second heat dissipation copper sheet 6 (copper sheet with ground property) is disposed on the window 5, the size of the second heat dissipation copper sheet 6 is the same as that of the window 5, and the second heat dissipation copper sheet 6 covers the window 5.

In one embodiment, the diameter of each heat dissipation through hole 4 is greater than or equal to 8 mils, the distance between every two adjacent heat dissipation through holes 4 is not less than 8 mils, and the arrangement of the heat dissipation through holes 4 can ensure the heat dissipation effect and also considers the reliability of connection between the PCB board 1 and the heat dissipation pad 2. Preferably, the distance between two adjacent thermal dissipating vias 4 is 8 mils.

In one embodiment, a plurality of uniformly distributed pin pads are arranged on one side, two sides or the periphery of the heat dissipation pad 2, and the device pins 7 of the power chip are fixed in the pin pads, so that reliable packaging of the power chip and the PCB board 1 is realized.

It will be understood that modifications and variations can be effected by a person skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the appended claims.

The above exemplary description of the present invention is made in conjunction with the accompanying drawings, and it is obvious that the present invention is not limited by the above manner, and various improvements made by the method concept and technical solution of the present invention or by directly applying the concept and technical solution of the present invention to other occasions without improvement are all within the protection scope of the present invention.

Claims

1. The utility model provides an optimize power chip heat dispersion's PCB plate structure, a serial communication port, including the PCB board, the top layer surface of PCB board is provided with heat dissipation pad and first heat dissipation sheet copper, first heat dissipation sheet copper covers the top of heat dissipation pad, be provided with a plurality of heat dissipation via hole on the heat dissipation pad, the heat dissipation via hole is followed the top layer of PCB board link up extremely the bottom of PCB board, the bottom surface of PCB board is provided with the windowing, it covers one at least to window the heat dissipation via hole.

2. The PCB board structure for optimizing heat dissipation performance of a power chip as recited in claim 1, wherein the window covers all of the heat dissipating vias.

3. The PCB board structure for optimizing the heat dissipation performance of the power chip as recited in claim 1, wherein a second heat dissipation copper sheet is disposed on the window.

4. The PCB board structure for optimizing the heat dissipation performance of a power chip as recited in claim 3, wherein the second heat dissipation copper sheet is in accordance with the size of the window.

5. The PCB board structure for optimizing the heat dissipation performance of a power chip as recited in claim 1, wherein the first heat dissipation copper sheet has a size larger than that of the heat dissipation pad.

6. The PCB board structure for optimizing the heat dissipation performance of a power chip as recited in claim 1, wherein a plurality of the heat dissipation vias are distributed in an array.

7. The PCB board structure for optimizing the heat dissipation performance of a power chip as recited in claim 6, wherein the distance between two adjacent heat dissipation vias is not less than 8 mil.

8. The PCB board structure for optimizing the heat dissipation performance of the power chip as recited in claim 6, wherein the distance between two adjacent heat dissipation vias is 8 mil.

9. The PCB board structure for optimizing the heat dissipation performance of a power chip as recited in claim 6, wherein the diameter of the heat dissipation via is greater than or equal to 8 mil.

10. The PCB board structure for optimizing the heat dissipation performance of the power chip as claimed in claim 1, wherein a plurality of pin pads are disposed on one side, two sides or four sides of the heat dissipation pad.