TWI507289B - Heat-dissipating sheet and method for manufacturing heat-dissipating sheet - Google Patents

Description

Heat sink and heat sink manufacturing method

The present invention relates to a heat sink which is a constituent material for efficiently dissipating heat generated by a power supply device or a light-emitting device to an external heat dissipation module.

Conventionally, in a heat generating device such as a power supply device or a light-emitting device, a heat radiating mechanism is directly mounted, and heat energy generated from such a heat generating device is radiated to the outside of the heat generating device. Here, the heat dissipation mechanism refers to a heat sink or a frame having a heat dissipation function, or a heat dissipation module or the like.

The heat generating device is overheated by the heat generated by the body, causing the temperature of the body to rise, thereby causing deterioration in performance such as low electrical characteristics or low optical characteristics. Therefore, in order to maintain the performance of the heat generating device, it is necessary to efficiently dissipate the heat energy generated by the self-heating device and suppress the temperature rise of the heat generating device.

As a method for solving this problem, generally, in order to reduce the contact thermal resistance between the heat generating device and the heat sink, a method of sandwiching the heat sink is employed.

Although it is considered to use a single metal plate as a heat sink, if a single metal plate is used as a heat sink, the weight becomes heavier. Therefore, the use of a single metal plate as a heat sink is respected in applications such as mobile electronic devices where the weight is reduced as much as possible. Therefore, recently, in the material of the heat sink, a graphite sheet which is lightweight and has a high heat dissipation effect has been proposed in place of a single metal plate (for example, refer to Patent Documents 1 and 2).

However, the problem that the graphite sheet is prone to interlayer peeling is often criticized. Therefore, in order to prevent the interlayer peeling of the graphite sheet from occurring, there has been disclosed an example in which a graphite sheet made of a metal wire is sandwiched between graphite sheets and integrated into a heat sink (refer to Patent Document 3).

Further, another document discloses that a graphite film obtained by exfoliating graphite powder such as natural graphite is used, and an inorganic substance layer is formed on the surface of the graphite film to form a heat sink (refer to Patent Document 4). Here, the inorganic substance layer formed on the surface of the graphite film is a metal film formed by plating or the like, or an inorganic substance film formed by directly coating a liquid material in which an inorganic substance is formed on a graphite film. This heat sink has the flexibility of being easily attached to a curved portion of an electronic device or the like.

However, when a heat sink is formed using a graphite material as a heat conductive layer, dust such as toner is generated when the heat sink is cut. In the operation of sandwiching the heat sink between the heat generating device and the heat sink, the heat sink must be cut to a necessary size, but the toner or the like generated at this time may adhere to the electronic module mounted on the heat sink. In the above, there may be disadvantages such as electrical short circuits.

Further, according to the heat sink disclosed in the above Patent Document 3, although excellent heat dissipation characteristics can be obtained, the metal fibers protrude from the cut surface of the heat sink, and handling the metal fiber is troublesome. If the metal fiber is in contact with an electronic module mounted on the heat dissipation module, it may cause an electric short circuit or the like.

Among them, there is also a document that discloses a heat sink having a heat characteristic that can efficiently dissipate heat generated by a self-heating device, and is lightweight and easy to be mounted on a heat dissipation module, etc., without causing an electronic module. Dust such as toner that is adversely affected (refer to Patent Document 5).

[Practical Technical Literature]

[Patent Literature]

Patent Document 1 Japanese Patent Laid-Open No. Hei 11-240706

Patent Document 2 Japanese Patent Laid-Open Publication No. 2003-168882

Patent Document 3 Japanese Patent Laid-Open Publication No. 2005-229100

Patent Document 4 Japanese Patent Laid-Open Publication No. 2008-78380

Patent Document 5 Japanese Patent No. 4202409

The heat sink disclosed in the above-mentioned Patent Document 5 is a polypyrrole infiltration sheet formed by infiltrating a polypyrrole polymer on a cellulose sheet, and the surface of both the main surface and the back surface or the surface of the back surface is in close contact with the metal layer. Into the heat sink. In the step of producing a polypyrrole infiltration sheet, first, the cellulose sheet is impregnated with copper (II) chloride, and then, the pyrrole is polymerized by contact with a pyrrole in a gaseous state, thereby producing a polypyrrole infiltration sheet.

The heat sink produced by the method can obtain dust having excellent heat dissipation characteristics, is lightweight, and can be easily mounted on a heat dissipation module, and does not cause dust such as toner that adversely affects the electronic module. The above-mentioned excellent effect is that copper (II) chloride is used as a dopant oxidizing agent for the polypyrrole of the conductive polymer which contributes to heat dissipation, and the chlorine of the halogen remains in the polypyrrole infiltrated into the sheet. Therefore, this residual chlorine is slowly released from the heat sink. Therefore, it is expected that the heat sink having the concern of the residual chlorine corrosion will be limited in use.

The inventors of the present invention thought that by changing the dopant oxidizing agent of the conductive polymer from copper (II) chloride to a sulfonic acid system, it is possible to avoid the sheet-like substrate infiltrated by the conductive polymer which contributes to heat dissipation. The problem of residual chlorine in cellulose flakes.

Here, an object of the present invention is to provide a heat sink in which a conductive polymer penetrates into a sheet without residual chlorine, and has a heat characteristic capable of efficiently dissipating heat generated by the self-heating device while being lightweight It is easy to install on a heat dissipation module, etc., and does not generate dust such as toner that adversely affects the electronic module.

Based on the above concept, in accordance with the gist of the present invention, the following heat sink and heat sink manufacturing method are provided.

The first heat sink of the present invention according to the first aspect of the invention is a heat sink in which a conductive polymer penetrates into a surface of the main surface and the back surface of the sheet or the surface of the sheet and the metal layer are adhered to each other. The polymer infiltrated sheet is formed by infiltrating a sheet-like substrate with a sulfur-containing yellow π-conjugated conductive polymer polymerized with iron (III) oxidant. Further, in the first heat sink according to the sixth aspect of the invention, the conductive polymer penetrates into the surface of either or both of the main surface and the back surface of the sheet, and is adhered to the metal sheet via the adhesive member. Into the heat sink.

Here, the oxidizing agent aromatic iron (III) sulfonate is iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, dodecylbenzenesulfonate. Groups of iron (III) acid, iron (III) naphthalene sulfonate, iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalene sulfonate or iron (III) phenolsulfonate Any one selected in the group. Further, the sulfur-containing yellow π-conjugated conductive polymer is derived from 3,4-ethylenedioxythiophene, thiophene derivative, thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3,4-di A polymer formed by polymerizing any of the monomers selected from the group consisting of alkylthiophenes and 3,4-dialkoxythiophenes.

The second heat sink of the present invention according to the second aspect of the invention is a heat sink in which a conductive polymer penetrates into a surface of both the main surface and the back surface of the sheet and the surface of the sheet is adhered to the metal layer. The polymer infiltrated sheet is formed by infiltrating a sheet-like substrate with a sulfur-containing yellow conjugated conductive polymer polymerized by an oxidizing agent aromatic copper sulfonate (II). Further, in the second heat sink according to the seventh aspect of the invention, the conductive polymer penetrates into the surface of either or both of the main surface and the back surface of the sheet, and is adhered to the metal sheet via the adhesive member. Into the heat sink.

Here, the oxidizing agent aromatic copper sulfonate (II) is copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, and dodecylbenzenesulfonate. Copper (II) acid, copper (II) naphthalene sulfonate, copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalene or copper (II) phenolsulfonate Any one selected in the group. Further, the sulfur-containing π-conjugated conductive polymer is derived from 3,4-ethylenedioxythiophene, thiophene derivative, thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3,4- A polymer formed by polymerizing any of the monomers selected from the group consisting of dialkylthiophenes and 3,4-dialkoxythiophenes.

The third heat sink of the present invention according to claim 3 is a heat sink in which a conductive polymer penetrates into a surface of both the main surface and the back surface of the sheet and the surface of the sheet is in close contact with the metal layer. The polymer infiltrated sheet is formed by infiltrating a sheet-like substrate with a pyrrole conductive polymer polymerized with an oxidizing agent aromatic iron (III) sulfonate. Further, in the third heat sink according to the eighth aspect of the invention, the conductive polymer penetrates into the surface of either or both of the main surface and the back surface of the sheet, and is adhered to the metal sheet via the adhesive member. Into the heat sink.

Here, the oxidizing agent aromatic iron (III) sulfonate is iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, dodecylbenzenesulfonate. Groups of iron (III) acid, iron (III) naphthalene sulfonate, iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalene sulfonate or iron (III) phenolsulfonate Any one selected in the group.

The fourth heat sink of the present invention according to claim 4 is a heat sink in which a conductive polymer penetrates into a surface of both the main surface and the back surface of the sheet and the surface of the sheet is adhered to the metal layer. The polymer infiltrated sheet is formed by infiltrating a sheet-like substrate with a pyrrole conductive polymer polymerized with copper sulfonate aromatic sulfonate (II). Further, in the fourth heat sink according to the invention of claim 9, the conductive polymer penetrates into the surface of either or both of the main surface and the back surface of the sheet, and is adhered to the metal sheet via the adhesive member. Into the heat sink.

Here, the oxidizing agent aromatic copper sulfonate (II) is copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, and dodecylbenzenesulfonate. Copper (II) acid, copper (II) naphthalene sulfonate, copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalene or copper (II) phenolsulfonate Any one selected in the group.

The fifth heat sink of the present invention according to claim 5 is a heat sink in which a conductive polymer penetrates into a surface of both the main surface and the back surface of the sheet and the surface of the sheet is adhered to the metal layer. The polymer infiltrated into the sheet is formed by using a conductive polymer solution and infiltrating the sheet-like base material conductive polymer. Further, in the fifth heat sink according to the invention of claim 10, the conductive polymer penetrates into the surface of either or both of the main surface and the back surface of the sheet, and is adhered to the metal sheet via the adhesive member. Into the heat sink.

Here, the conductive polymer solution is a polystyrene sulfonic acid aqueous dispersion from a conductive poly(3,4-ethylenedioxythiophene), and a conductive poly(3,4-ethylenedioxythiophene). An organic solvent dispersion, a conductive polyaniline aqueous dispersion, a highly conductive polyaniline organic solvent dispersion using methanol as a disperse medium, and a highly conductive polyaniline using methyl ethyl ketone as a dispersion medium. Any one selected from the group consisting of an organic solvent dispersion and a highly conductive polypyrrole organic solvent dispersion containing methyl ethyl ketone as a dispersion medium.

In the first or sixth aspect of the invention, the conductive polymer of the constituent member of the first heat sink of the present invention penetrates into the sheet, and the method for producing the heat sink according to the invention of claim 11 is included in the method. The solvent removal step can be manufactured.

The method for producing a heat sink according to the invention of claim 11, wherein the step of oxidizing the oxidizing agent, the iron sulfonate aromatic sulfonate (III) solution diluted with the first solvent, is infiltrated into the first sheet substrate. a second sheet-like substrate is produced; and a polymerization reaction step evaporates the first solvent from the second sheet substrate, and then the sulfur-containing yellow conjugated conductive polymer forming material solution diluted with the second solvent is infiltrated into the base. The material is polymerized at a temperature ranging from 0 to 80 ° C to form a third sheet-like substrate; the solvent removal step evaporates the second solvent from the third sheet substrate, and the third sheet from which the second solvent has been removed The base material is produced as a conductive polymer infiltrated sheet; and the metal layer forming step is performed by infiltrating the conductive polymer into the surface of either or both of the main surface and the back surface of the sheet and the metal layer.

Here, the oxidizing agent aromatic iron (III) sulfonate is iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, dodecylbenzenesulfonate. Groups of iron (III) acid, iron (III) naphthalene sulfonate, iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalene sulfonate or iron (III) phenolsulfonate Any one selected in the group. Further, the sulfur-containing π-conjugated conductive polymer is derived from 3,4-ethylenedioxythiophene, thiophene derivative, thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3,4- A polymer formed by polymerizing any of the monomers selected from the group consisting of dialkylthiophenes and 3,4-dialkoxythiophenes.

In the second or seventh aspect of the invention, the conductive polymer of the component member of the second heat sink of the present invention penetrates into the sheet, and the method for producing the heat sink according to the invention of claim 12 is included in the method. The solvent removal step can be manufactured.

The method for producing a heat sink according to the invention of claim 12, wherein the step of oxidizing the oxidizing agent, the copper sulfonate aromatic sulfonate (II) solution diluted with the first solvent, is infiltrated into the first sheet substrate. a second sheet-like substrate is produced; and a polymerization reaction step evaporates the first solvent from the second sheet substrate, and then infiltrates the sulfur-containing yellow conjugated conductive polymer forming material solution diluted with the second solvent into the substrate. a material, which is polymerized at a temperature ranging from 0 to 80 ° C to form a third sheet-like substrate; a solvent removal step; evaporating the second solvent from the third sheet substrate, and removing the third sheet of the second solvent The substrate is produced as a conductive polymer infiltrated sheet; and the metal layer forming step is performed by infiltrating the conductive polymer into the surface of either or both of the main surface and the back surface of the sheet and the metal layer.

Here, the oxidizing agent aromatic copper sulfonate (II) is copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, and dodecylbenzenesulfonate. Copper (II) acid, copper (II) naphthalene sulfonate, copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalene or copper (II) phenolsulfonate Any one selected in the group. Further, the sulfur-containing yellow π-conjugated conductive polymer is 3,4-ethylenedioxythiophene, thiophene derivative, thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3,4-di A polymer formed by polymerizing any of the monomers selected from the group consisting of alkylthiophenes and 3,4-dialkoxythiophenes.

In the third or eighth aspect of the above-mentioned application, the conductive polymer of the constituent member of the third heat sink of the present invention is infiltrated into the sheet, and the method for producing the heat sink according to the thirteenth aspect of the invention is described. The solvent removal step can be manufactured.

The method for producing a heat sink according to the invention of claim 13, wherein the step of oxidizing the oxidizing agent, the iron sulfonate aromatic sulfonate (III) solution diluted with the first solvent, is infiltrated into the first sheet substrate. a second sheet-like substrate is produced; in the polymerization step, the first solvent is evaporated from the second sheet substrate, and the pyrrole conductive polymer forming material solution diluted with the second solvent is infiltrated into the substrate, and is 0 to 0. Polymerization reaction at a temperature range of 80 ° C to form a third sheet-like substrate; a solvent removal step; a solvent removal step, evaporating the second solvent from the third sheet-like substrate, and removing the third sheet-like base of the second solvent The material is made into a conductive polymer infiltration sheet; and the metal layer forming step is performed by infiltrating the conductive polymer into the surface of either or both of the main surface and the back surface of the sheet and the metal layer.

Here, the oxidizing agent aromatic iron (III) sulfonate is iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, dodecylbenzenesulfonate. Groups of iron (III) acid, iron (III) naphthalene sulfonate, iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalene sulfonate or iron (III) phenolsulfonate Any one selected in the group.

In the fourth or ninth aspect of the invention, the conductive polymer of the component member of the fourth heat sink of the present invention is infiltrated into the sheet, and the method for producing the heat sink according to the invention of claim 14 is included in the method. The solvent removal step can be manufactured.

The method for producing a heat sink according to the invention of claim 14, wherein the step of oxidizing the oxidizing agent, the copper sulfonate aromatic sulfonate (II) solution diluted with the first solvent, is infiltrated into the first sheet substrate. a second sheet-like substrate is produced; in the polymerization step, the first solvent is evaporated from the second sheet substrate, and the pyrrole conductive polymer forming material solution diluted with the second solvent is infiltrated into the substrate, and is 0 to 0. Polymerization reaction at a temperature of 80 ° C to form a third sheet-like substrate; solvent removal step; evaporating the second solvent from the third sheet substrate, and manufacturing the third sheet substrate from which the second solvent has been removed to be electrically conductive The polymer polymer is infiltrated into the sheet; and the metal layer forming step is performed by infiltrating the conductive polymer into the surface of either or both of the main surface and the back surface of the sheet and the metal layer.

Here, the oxidizing agent aromatic copper sulfonate (II) is copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, and dodecylbenzenesulfonate. Copper (II) acid, copper (II) naphthalene sulfonate, copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalene or copper (II) phenolsulfonate Any one selected in the group.

In the fifth or the tenth aspect of the invention, the conductive polymer of the component member of the fifth heat sink of the present invention penetrates into the sheet, and the method for producing the heat sink according to the fifteenth aspect of the invention is described in The solvent removal step can be manufactured.

The method for producing a heat sink according to the invention of claim 15, wherein the step of: infiltrating the conductive polymer, infiltrating the conductive polymer solution into the sheet substrate to form a conductive polymer solution into the sheet a substrate; a dispersing medium removing step, after the conductive polymer solution is infiltrated into the sheet-form substrate evaporating and dispersing medium, and the conductive polymer solution from which the dispersing medium has been removed is infiltrated into the sheet-like substrate to be a conductive polymer infiltrated sheet; In the metal layer forming step, the conductive polymer is infiltrated into the surface of either or both of the main surface and the back surface of the sheet and the metal layer.

Here, the conductive polymer solution is a polystyrene sulfonic acid aqueous dispersion from a conductive poly(3,4-ethylenedioxythiophene), and a conductive poly(3,4-ethylenedioxythiophene). ) an organic solvent dispersion, a conductive polyaniline aqueous dispersion, a highly conductive polyaniline organic solvent dispersion using methanol as a dispersion medium, and a highly conductive polyaniline organic solvent dispersion using methyl ethyl ketone as a dispersion medium Any one selected from the group consisting of a conductive polypyrrole organic solvent dispersion containing methyl ethyl ketone as a dispersion medium.

In the method for producing a heat sink according to the first to fourth aspects of the invention, after the solvent removal step of each of the heat sinks is completed, the conductive polymer solution coating step is further performed: the second solvent is removed. On the third sheet-like substrate, an aqueous dispersion of a conductive polymer or a solvent dispersion of a conductive polymer; and a dispersion removal step are performed to evaporate the conductive polymer from the third sheet substrate. An aqueous dispersion, or a solvent dispersion of a conductive polymer, a solvent thereof.

Further, in the method for producing a heat sink according to the first to fourth aspects of the invention, after the solvent removal step of each of the heat sinks is completed, it is more preferable to carry out an electrolytic polymerization step in which the second solvent has been removed. On the third sheet substrate, from tetraethylammonium p-toluenesulfonic acid, trifluoromethanesulfonic acid, sodium trifluoromethanesulfonate, tetraalkylammonium trifluoromethanesulfonate, sodium alkylbenzenesulfonate, alkane One of a group of sodium oxybenzenesulfonate or sodium alkylbenzenesulfonate tetraalkylammonium salt is selected as a supporting electrolyte, and the supporting electrolyte is derived from propylene carbonate, acetonitrile, γ-butyrolactone, nitric acid, Any one selected from the group consisting of methyl benzoate, ethyl benzoate, butyl benzoate, ethylene carbonate, dimethyl carbonate, diethyl carbonate, ethyl methyl carbonate, ethylene glycol, or water Or a plurality of supporting electrolyte solutions supporting electrolyte solvents, dissolved in 3,4-ethylenedioxythiophene, pyrrole, thiophene, thiophene derivative, 3-alkylthiophene, 3-alkoxythiophene, 3, 4 - a monomer selected from the group of dialkylthiophenes or 3,4-dialkoxythiophenes One is electrolytic polymerization; and a washing step of washing the third sheet-like substrate after the electrolytic polymerization step is completed.

Further, in the method for producing a heat sink according to the fifteenth aspect of the invention, after the solvent removal step is completed, it is more preferable to continue the electropolymerization step of the conductive polymer solution from which the dispersion medium has been removed. Infiltrated into a sheet-like substrate, from tetraethylammonium p-toluenesulfonic acid, trifluoromethanesulfonic acid, sodium trifluoromethanesulfonate, tetraalkylammonium trifluoromethanesulfonate, sodium alkylbenzenesulfonate, alkoxylate Any one selected from the group consisting of sodium benzenesulfonate or sodium alkylbenzenesulfonate tetraalkylammonium salt as a supporting electrolyte, the supporting electrolyte is derived from propylene carbonate, acetonitrile, γ-butyrolactone, nitric acid , selected from the group consisting of methyl benzoate, ethyl benzoate, butyl benzoate, ethylene carbonate, dimethyl carbonate, diethyl carbonate, ethyl methyl carbonate, ethylene glycol, or water. One or a plurality of supporting electrolyte solutions as a supporting electrolyte solvent, dissolved in 3,4-ethylenedioxythiophene, pyrrole, thiophene, thiophene derivative, 3-alkylthiophene, 3-alkoxythiophene, 3, 4 - in the group of dialkylthiophenes or 3,4-dialkoxythiophenes One monomer of the opt-out, so that the electrolytic polymerization; and a cleaning step in which after the electrolytic polymerization step of cleaning the conductive polymer solution penetrate the sheet substrate.

The first to fifth heat sinks described above are manufactured by the metal layer forming step of the method for producing a heat sink according to any one of claims 11 to 18, which is a conductive polymerization. The material penetrates into the surface of either or both of the major surface and the back surface of the sheet by PVD (Physical Vapor Deposition), Chemical Vapor Deposition (CVD), Electrolytic Plating, or Electrolytic plating is applied to the metal layer.

Further, in the above-described metal layer forming step, a metal paste composed of a viscous material may be applied to the surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet to be coated with a metal paste composed of a viscous material. The step of bonding the metal layers.

Further, in the above-described metal layer forming step, the metal fine particles may be printed and fixed to be in close contact with the metal layer on the surface of either or both of the main surface and the back surface of the conductive polymer.

The first heat sink according to the present invention contains a conductive polymer infiltrated sheet obtained by infiltrating a sheet-like base material into a sheet-like base material by using a sulfur-containing yellow conjugated conductive polymer polymerized with an iron sulfonate aromatic sulfonate (III). The surface of either or both of the main surface and the back surface of the conductive polymer infiltrating sheet is in close contact with the metal layer or is in close contact with the metal sheet via the bonding member.

The second heat sink according to the present invention contains a conductive polymer infiltrated sheet obtained by infiltrating a sheet-like base material with a sulfur-containing yellow conjugated conductive polymer polymerized with copper sulfonate aromatic sulfonate (II). The surface of either or both of the main surface and the back surface of the conductive polymer infiltrating sheet is in close contact with the metal layer or is in close contact with the metal sheet via the bonding member.

The third heat sink according to the present invention contains a conductive polymer infiltrated sheet obtained by infiltrating a sheet-like base material with a pyrrole conductive polymer polymerized with an iron sulfonate aromatic sulfonate (III), and the conductive polymer is polymerized. The surface of either or both of the main surface and the back surface of the infiltrated sheet is in close contact with the metal layer or is in close contact with the metal sheet via the bonding member.

The fourth heat sink according to the present invention contains a conductive polymer infiltrated sheet obtained by infiltrating a sheet-like base material with a pyrrole conductive polymer obtained by using an oxidizing agent aromatic copper sulfonate (II), and this conductive polymerization is carried out. The surface of either or both of the main surface and the back surface of the infiltrated sheet is in close contact with the metal layer or is in close contact with the metal sheet via the bonding member.

The fifth heat sink according to the present invention contains a conductive polymer infiltrated sheet which is formed by infiltrating a sheet-like base material using a conductive polymer solution, and the conductive polymer penetrates into either or both of the main surface and the back surface of the sheet. The surface is in close contact with the metal layer or is in close contact with the metal piece via the bonding member.

The thermal conductivity of the above-mentioned conductive polymer infiltrated into the sheet is smaller than the thermal conductivity of the metal sheet or the metal layer. However, in the first to fifth heat sinks of the present invention, since the conductive polymer infiltration sheet is formed in close contact with the metal piece or the metal layer, the thermal diffusivity α _p parallel to the surface of the heat sink is perpendicular to the vertical direction. The thermal diffusivity α _{t is} large, that is, α _p /α _t >1. Therefore, when the heat sink is mounted on the heat sink of the present invention, when the heat sink is mounted on the heat sink, the diffusion speed of the isothermal surface in the flat direction on the surface of the heat sink is faster than the vertical direction.

Here, the thermal conductivity is a physical quantity indicating thermal energy propagation characteristics, and the temperature diffusion rate is a physical quantity indicating temperature propagation characteristics. That is, the temperature diffusivity is a value proportional to the thermal conductivity of the material and inversely proportional to the heat capacity.

The polymer used for infiltrating the above-mentioned conductive polymer infiltrated sheet of the first to fifth fins of the present invention is a π-conjugated polymer. The π-conjugated polymer has a skeleton (backbone) in which a double bond and a single bond are alternately arranged, and it is presumed that an anisotropy of thermal properties occurs through the main chain. That is, it is considered that the π-conjugated polymer has a property of increasing thermal conductivity along the direction of the main chain as compared with the direction perpendicular to the direction of the main chain. Therefore, it has been found that the first to fifth heat sinks of the present invention have a thermal property satisfying the above relationship of α _p /α _t > 1 and effectively promote the thermal characteristics in the main chain direction of the π conjugated polymer. Anisotropy.

In addition, the conductive polymer produced by the above-mentioned conductive polymer infiltration sheet manufacturing method penetrates into the sheet, and in the manufacturing process, the aromatic sulfonic acid as a dopant is absorbed by the polymer, and a part of the π electron is extracted from the polymer. A hole (positive hole) is formed, thereby forming a polymer having high electron conductivity. By having such a high electron conductivity, it also contributes to the discovery of the anisotropy of the thermal properties along the main chain direction of the π-conjugated polymer.

Further, the conductive polymer infiltrated sheet produced by the solvent removing step or the dispersing medium removing step included in the heat sink manufacturing method according to the above-mentioned Patent Application Nos. 11 to 15 has the high electron conductivity as described above. Therefore, it can be applied to the production method of the electrolytic polymerization reaction described in claims 17 and 18. The step of infiltrating the conductive polymer of the sheet substrate is repeated several times instead of only one time, whereby the thermal conductivity and the electron conductivity can be improved. That is, it is possible to manufacture a heat sink having an excellent heat dissipation effect of a higher layer.

When the heat generating device is efficiently cooled, it is necessary to constantly keep the heat generating device in contact with the heat sink or the heat sink at a temperature lower than that of the heat generating device. The lower the temperature at which the heat generating device is in contact with the heat sink or the heat sink, the higher the efficiency of cooling the heat generating device, and the smaller the thermal resistance between the heat generating device and the heat sink, the better the efficiency of cooling the heat generating device.

Further, as is well known, thermal resistance refers to the amount of temperature rise per unit time of heat generation, which is approximately the reciprocal of the heat transfer coefficient between the heat generating device (high temperature portion) and the heat sink (low temperature portion), divided by the contact area of the heat generating device. The value obtained. The heat transfer coefficient is obtained by dividing the thermal energy per unit area between the heat generating device and the heat sink in a short period of time by the temperature difference between the heat generating device and the heat sink. That is, the thermal resistance is a value indicating the difficulty of temperature transmission, and the larger the value, the more difficult the transmission of the temperature.

Here, even when the low temperature portion corresponding to the heat sink is surrounded by the high temperature portion of the heat generating device or the like, the thermal resistance can be defined. As described below, the thermal resistance value and the like between the heat generating device and the space in which the heat generating device is located can be calculated. The larger the thermal resistance value between the heat generating device and the space in which the heat generating device is located, the more the heat generated by the heat generating device is less likely to diverge, which means that the temperature of the heat generating device itself is more likely to rise.

The first to fifth heat dissipating fins of the present invention have heat generated by a heat generating device provided directly or indirectly with the heat dissipating fin, and rapidly diffuse in a direction parallel to the surface of the heat dissipating fin, and are in contact with the heat sink. The thermal characteristics of the high temperature region are formed in a short period of time over a wide range of the surface of the heat sink. The temperature of the surface of the heat sink that is in contact with the heat sink is higher in a wide range, and the total amount of heat absorbed by the heat sink per unit time is larger.

In other words, when the first to fifth heat sinks of the present invention are placed in direct or indirect contact with the heat generating device and the heat sink, the heat generated by the heat generating device can be efficiently dissipated.

Further, the conductive polymer constituting the heat sink of the present invention penetrates into the sheet, and no carbon powder is generated in the work process such as the cutting treatment. Therefore, the heat sink of the present invention does not have a heat sink formed of a graphite material as in the prior art, and dust of the toner is generated in the work process such as the cutting process. Therefore, for example, when the heat dissipation module is configured by the heat sink of the present invention, the electronic module mounted on the heat dissipation module or the like does not cause the occurrence of an electrical short circuit due to adhesion of toner or the like.

The conductive polymer infiltration sheet produced by the solvent removal step or the dispersion medium removal step of the method for producing a heat sink according to any one of claims 11 to 18, wherein both the main surface and the back surface of the conductive polymer infiltration sheet are either or both The surface can be adhered to the metal layer by PVD, CVD, electrolytic plating, or electroless plating.

In addition, the surface of the main surface and the back surface of the conductive polymer infiltrating sheet is adhered to the metal sheet via the adhesive member, whereby the metal sheet and the conductive polymer are infiltrated into the sheet. The connecting members are closely connected.

The thermal resistance can be effectively reduced by infiltrating the conductive polymer into the main surface and the back surface of the sheet in close contact with the metal layer or the metal sheet.

The conductive polymer infiltrated sheet constituting the heat sink of the present invention is produced by using iron (III) aromatic sulfonate or copper (II) aromatic sulfonate as described above as an oxidizing agent responsible for polymerization reaction. The conductive polymer penetrates into the sheet without residual chlorine. Therefore, there is no fear that the heat generating electronic component or the like provided with the heat sink is corroded.

In addition, as described later, the sheet-like substrate can be produced by using a cellulose sheet or the like without causing toner, so that it can be easily attached to a heat-dissipating module or the like without causing a pair. A heat sink for dust such as toner that adversely affects the electronic module.

[Best Aspects of Implementing the Invention]

Embodiments of the present invention will be described below with reference to the drawings, but the embodiments of the present invention are not limited to the drawings. In the drawings, the shapes, sizes, and arrangement relationships of the constituent elements are schematically shown without departing from the scope of the present invention. The numerical values and other conditions described below are merely suitable examples, and the present invention is not limited only to the present invention. Embodiments of the invention.

<Configuration of Heat Sink of the Embodiment of the Present Invention and Method of Manufacturing the Same>

1(A) and (B), the configuration of the first to fifth heat sinks according to the embodiment of the present invention will be described. 1(A) and (B) are explanatory views each showing a structure of the first to fifth heat sinks, and FIG. 1(A) is a view in which the main surface and the back surface of the conductive polymer infiltrated sheet are in close contact with the metal layer. 1 to 5 are schematic cross-sectional structural views of the fifth heat sink, and FIG. 1(B) is a first to a fifth heat sink in which the main surface and the back surface of the conductive polymer infiltrated sheet are in close contact with each other via a bonding member and a metal piece. A schematic cross-sectional composition diagram.

Here, in the case where it is not necessary to distinguish the sulfur-containing yellow π-conjugated conductive polymer from the pyrrole conductive polymer, the following description is simply indicated by the conductive polymer. Further, among the marks of the first to fifth heat sinks, the first to fifth identification marks are marks indicating that the conductive polymer to be infiltrated is added, and the first to fifth heat sinks are respectively provided. It is a configuration shown in any of Figs. 1(A) and (B). Therefore, in the case where the identification of the infiltrated conductive polymer is not necessarily described, the following description is also referred to by the heat sink alone.

In order to reduce the thermal resistance between the heat generating device and the heat sink, an electric insulating film may be sandwiched and fixed between the heat generating device and the heat sink or between the heat sink and the heat sink as needed. Further, in order to make the heat sink adhere to the heat generating device or to make the heat sink and the heat sink adhere to each other, a bonding member or the like can be used.

However, the heat sink may be inserted between the heat generating device and the heat sink without electrical insulation, and the heat sink may not be permanently bonded to the heat generating device and the heat sink, and may be fixed only by crimping. In this case, the heat sink is crimped and fixed to the heat generating device or the heat sink.

In Figs. 1(A) and (B), the electric insulating film or the bonding member used in conjunction with the heat sink is omitted, and only the heat sink according to the embodiment of the present invention is shown. Although not shown in the drawings, in order to make the heat sink and the electric insulating film, or the heat sink and the heat generating device, or the heat sink and the heat sink adhere to each other, an adhesive member or the like may be appropriately provided.

The heat sink of the embodiment shown in Fig. 1(A) is a surface of at least one of the main surface 18a and the back surface 18b of the conductive polymer which is infiltrated by the conductive polymer, and is in close contact with the metal layer. And constitute. In Fig. 1(A), although the metal layer 16 and the metal layer 20 in which the main surface 18a and the back surface 18b of the conductive polymer infiltration sheet 18 are formed are shown, if only one of the metal layer 16 and the metal layer 20 is formed, can.

The heat sink of the embodiment shown in Fig. 1(B) is a surface of at least one of the main surface 26a and the back surface 26b of the conductive polymer which is infiltrated by the conductive polymer, and is adhered to each other. The member is formed by bonding to a metal piece. In Fig. 1(B), the main surface 26a of the conductive polymer infiltration sheet 26 is bonded to the metal piece 22 via the bonding member 24, and the back surface 26b is bonded to the metal piece 30 via the bonding member 28. The heat sink may be formed by forming only one of the metal piece 22 and the metal piece 30.

For the adhesive members 24 and 28, for example, a double-sided tape (product type NW-50) manufactured by NICHIBAN Co., Ltd., or a propylene-modified silicone resin CEMEDINE (registered trademark: product model SX720W) manufactured by CEMEDINE Co., Ltd., or the like can be appropriately selected.

The sheet-like base material constituting the conductive polymer-infiltrated sheet can be suitably used, for example, as a cellulose sheet, a pulp paper, a cloth, a non-woven fabric, and paper which are representative of the filter paper for filtration work. Here, the filter paper used for the filtration operation is used as a sheet-like base material.

The evaluation of the thermal characteristics described later was carried out by using a conductive polymer infiltrated sheet which was tested using a filter paper having a thickness of 0.1 mm as a constituent element. However, the conductive polymer of the present invention penetrates into the sheet, and is not limited to being formed by using a filter paper having a thickness of 0.1 mm for filtration work.

(Method for producing conductive polymer infiltrated sheet of the first heat sink constituent material)

A method of manufacturing a conductive polymer infiltrated sheet of the first heat sink constituent material will be described. The conductive polymer is infiltrated into a sheet by a conductive polymer infiltrated sheet obtained by infiltrating a sheet-like base material with a sulfur-containing yellow π-conjugated conductive polymer polymerized with an iron sulfonate aromatic sulfonate (III). As described above, the oxidizing agent aromatic iron (III) sulfonate can be iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate or dodecylbenzenesulfonate. Iron (III), iron (III) naphthalene sulfonate, iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalene sulfonate or iron (III) phenolsulfonate One, here the case of using iron (III) p-toluenesulfonate is explained. According to the following description, even if it is a substance other than iron (III) p-toluenesulfonate, any of the above may be used as an oxidizing agent.

Further, a monomer which is formed into a sulfur-containing π-conjugated conductive polymer can utilize 3,4-ethylenedioxythiophene, a thiophene derivative, a thiophene, a 3-alkylthiophene, a 3-alkoxythiophene, One of 3,4-dialkylthiophene and 3,4-dialkoxythiophene will be described here using 3,4-ethylenedioxythiophene. According to the following description, even if it is a monomer other than 3,4-ethylenedioxythiophene, any of the above monomers can be used in the same manner.

The oxidizing agent p-toluenesulfonic acid iron (III) is diluted with a first solvent, and the solution is allowed to permeate into the first sheet-like substrate, and the oxidizing agent infiltration step of forming the second sheet-like substrate is carried out as follows.

The first solvent was ethanol having a purity of 99.8%. Further, the first sheet-form substrate cellulose sheet is immersed in a container of 6 g of a 50%-concentration iron (III) p-toluenesulfonate solution diluted with ethanol and 4 g of a first solvent having a purity of 99.8% in a container. The iron (III) p-toluenesulfonate solution of % concentration was infiltrated for 5 minutes to form a second sheet-like substrate.

After evaporating the first solvent ethanol from the second sheet substrate, the solution containing the sulfur-containing yellow π conjugated conductive polymer-forming material diluted with the second solvent is infiltrated into the second sheet substrate at 0 to 80 ° C. The polymerization reaction in which the polymerization reaction is carried out in the temperature range to form the third sheet-like substrate is carried out as follows.

The second sheet-like substrate impregnated with iron (III) p-toluenesulfonate is immersed in a solution of a sulfuric yellow π-conjugated conductive polymer forming material at a concentration of 50% of a 3,4-ethylenedioxythiophene. It is placed in a room temperature atmosphere to cause a chemical polymerization reaction, and a second sheet-like substrate infiltrated with poly(3,4-ethylenedioxythiophene) containing a sulfur yellow π-conjugated conductive polymer is formed into a third sheet. Substrate. The second solvent which is a solvent of 3,4-ethylenedioxythiophene is ethanol. After the completion of the chemical polymerization reaction, the solvent removal step of the second solvent evaporation is performed.

The polymerization reaction step here is carried out at room temperature as described above, but is not limited to this temperature, and can be suitably carried out in the range of 0 °C to 80 °C. The polymerization reaction of the same type as described below is also the same, and it is not limited to being carried out at room temperature, and can be suitably carried out in the range of 0 °C to 80 °C.

The solvent removal step is carried out to remove the residue other than the polymer formed in the polymerization reaction of the third sheet substrate, and the mixture is washed with distilled water or ethanol and then left to dry in the atmosphere to remove the distilled water or ethanol to be contained. A sheet-like substrate into which the poly(3,4-ethylenedioxythiophene) of the sulfur-yellow π-co-conductive polymer is infiltrated is formed into a conductive polymer-infiltrated sheet.

Although the third sheet-like substrate is in a state in which the sulfur-containing π-conjugated conductive polymer is allowed to penetrate into the sheet, in order to further improve the conductivity, the oxidizing agent infiltration step, the polymerization step, and the solvent removing step are carried out. The procedure was repeated three times until the step of washing with distilled water or ethanol. Thus, the sulfur-containing yellow π-conjugated conductive polymer is allowed to penetrate into the sheet. As a result, a sulfur-containing yellow π-conjugated conductive polymer infiltrated sheet having a specific resistance of 1 × 10 ³ Ω/cm or less can be produced.

(Method for producing conductive polymer infiltrated sheet of the second heat sink forming material)

A method of manufacturing a conductive polymer infiltrated sheet of the second heat sink constituent material will be described. The conductive polymer is infiltrated into a sheet by a conductive polymer-infiltrated sheet obtained by infiltrating a sheet-like base material with a sulfur-containing yellow π-conjugated conductive polymer polymerized with copper sulfonate aromatic sulfonate (II). As described above, the oxidizing agent aromatic copper sulfonate (II), although copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, dodecylbenzenesulfonate Copper (II) acid, copper (II) naphthalenesulfonate, copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalene or copper (II) phenolsulfonate One case is described here using copper(II) p-toluenesulfonate. According to the following description, even if it is a substance other than copper (II) p-toluenesulfonate, any of the above may be used as an oxidizing agent.

Further, a monomer which is formed into a sulfur-containing π-conjugated conductive polymer can utilize 3,4-ethylenedioxythiophene, a thiophene derivative, a thiophene, a 3-alkylthiophene, a 3-alkoxythiophene, One of 3,4-dialkylthiophene and 3,4-dialkoxythiophene is illustrated by the use of 3,4-ethylenedioxythiophene. According to the following description, even if it is a monomer other than 3,4-ethylenedioxythiophene, any of the above monomers can be used in the same manner.

The oxidizing agent p-toluenesulfonate copper (II) is diluted with a first solvent, and the solution is allowed to permeate into the first sheet-like substrate, and the oxidizing agent infiltration step of forming the second sheet-like substrate is carried out as follows.

The first solvent was ethanol having a purity of 99.8%. Further, the first sheet-form substrate cellulose sheet is immersed in a container of 6 g of a 50%-concentration copper(II) p-toluenesulfonate solution diluted with ethanol and 4 g of a first solvent having a purity of 99.8% in a container. The copper (II) p-toluenesulfonate solution of % concentration was infiltrated for 5 minutes to form a second sheet-like substrate.

After evaporating the first solvent ethanol from the second sheet substrate, the solution containing the sulfur-containing yellow π conjugated conductive polymer-forming material diluted with the second solvent is infiltrated into the second sheet substrate at 0 to 80 ° C. The polymerization reaction in which the polymerization reaction is carried out in the temperature range to form the third sheet-like substrate is carried out as follows.

The second sheet-like substrate impregnated with copper (II) p-toluenesulfonate is immersed in a solution of a sulfuric yellow π-conjugated conductive polymer forming material at a concentration of 50% of a 3,4-ethylenedioxythiophene. It is placed in a room temperature atmosphere to cause a chemical polymerization reaction, and a second sheet-like substrate infiltrated with poly(3,4-ethylenedioxythiophene) containing a sulfur yellow π-conjugated conductive polymer is formed into a third sheet. Substrate. The second solvent which is a solvent of 3,4-ethylenedioxythiophene is ethanol. After the completion of the chemical polymerization reaction, the solvent removal step of the second solvent evaporation is performed.

The solvent removal step is carried out to remove the residue other than the polymer formed in the polymerization reaction of the third sheet substrate, and the mixture is washed with distilled water or ethanol and then left to dry in the atmosphere to remove the distilled water or ethanol to be contained. A sheet-like substrate into which the poly(3,4-ethylenedioxythiophene) of the sulfur-yellow π-co-conductive polymer is infiltrated is formed into a conductive polymer-infiltrated sheet.

Although the third sheet-like substrate is in a state in which the sulfur-containing π-conjugated conductive polymer is allowed to penetrate into the sheet, in order to further improve the conductivity, the oxidizing agent infiltration step, the polymerization step, and the solvent removing step are carried out. The procedure was repeated three times until the step of washing with distilled water or ethanol. Thus, the sulfur-containing yellow π-conjugated conductive polymer is allowed to penetrate into the sheet. As a result, a sulfur-containing yellow π-conjugated conductive polymer infiltrated sheet having a specific resistance of 1 × 10 ³ Ω/cm or less can be produced.

(Method for Producing Conductive Polymer Penetration Sheet of Third Heat Sink Material)

A method of manufacturing a conductive polymer infiltrated sheet of the third heat sink constituent material will be described. The conductive polymer is infiltrated into a sheet by a conductive polymer infiltrated sheet obtained by infiltrating a sheet-like base material with a pyrrole conductive polymer obtained by mixing an iron sulfonate aromatic sulfonate (III). As described above, the oxidizing agent aromatic iron (III) sulfonate can be iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate or dodecylbenzenesulfonate. Iron (III), iron (III) naphthalene sulfonate, iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalene sulfonate or iron (III) phenolsulfonate One, here the case of using iron (III) p-toluenesulfonate is explained. According to the following description, even if it is a substance other than iron (III) p-toluenesulfonate, any of the above may be used as an oxidizing agent.

The oxidizing agent p-toluenesulfonic acid iron (III) is diluted with a first solvent, and the solution is allowed to permeate into the first sheet-like substrate, and the oxidizing agent infiltration step of forming the second sheet-like substrate is carried out as follows.

The first solvent was ethanol having a purity of 99.8%. Further, the first sheet-form substrate cellulose sheet is immersed in a container of 6 g of a 50%-concentration iron (III) p-toluenesulfonate solution diluted with ethanol and 4 g of a first solvent having a purity of 99.8% in a container. The iron (III) p-toluenesulfonate solution of % concentration was infiltrated for 5 minutes to form a second sheet-like substrate.

After evaporating the first solvent ethanol from the second sheet substrate, a solution of the pyrrole conductive polymer forming material diluted with the second solvent is infiltrated into the second sheet substrate, and is allowed to be in a temperature range of 0 to 80 ° C. The polymerization reaction to form a third sheet-like substrate is carried out as follows. Here, the second solvent which dilutes the pyrrole conductive polymer forming material is ethanol.

The second sheet-like substrate impregnated with iron (III) p-toluenesulfonate was immersed in a 50%-concentration pyrrole solution prepared by mixing 5 g of ethanol having a purity of 99.8% and 5 g of pyrrole having a concentration of 100%, and placed at room temperature. The second sheet-like substrate infiltrated into the pyrrole conductive polymer is chemically polymerized in the atmosphere to form a third sheet-like substrate. After the completion of the chemical polymerization reaction, the solvent removal step of the second solvent evaporation is performed.

The solvent removal step is carried out to remove the residue other than the polymer formed in the polymerization reaction of the third sheet substrate, and the mixture is washed with distilled water or ethanol, and then left to dry in the atmosphere, thereby removing the distilled water or ethanol to remove the residue. The sheet-like base material intofiltrated by the pyrrole conductive polymer is formed into a conductive polymer infiltrated sheet.

Although the third sheet-like substrate is in a state in which the usable pyrrole conductive polymer is infiltrated into the sheet, in order to further improve the conductivity, the above-mentioned oxidizing agent infiltration step, polymerization step, and solvent removal step, to distilled water or ethanol The washing step was repeated three times. This completes the penetration of the pyrrole conductive polymer into the sheet. As a result, a pyrrole conductive polymer infiltrated sheet having a specific resistance of 1 × 10 ³ Ω/cm or less can be produced.

(Method for producing a conductive polymer infiltrated sheet of the fourth heat sink constituent material)

A method of manufacturing the conductive polymer infiltrated sheet of the fourth heat sink constituent material will be described. The conductive polymer is infiltrated into a sheet by a conductive polymer infiltrated sheet obtained by infiltrating a sheet-like base material with a pyrrole conductive polymer obtained by oxidizing an aromatic copper sulfonate (II). As described above, the oxidizing agent aromatic copper sulfonate (II), although copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, dodecylbenzenesulfonate Copper (II) acid, copper (II) naphthalenesulfonate, copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalene or copper (II) phenolsulfonate One case is described here using copper(II) p-toluenesulfonate. According to the following description, even if it is a substance other than copper (II) p-toluenesulfonate, any of the above may be used as an oxidizing agent.

The oxidizing agent p-toluenesulfonate copper (II) is diluted with a first solvent, and the solution is allowed to permeate into the first sheet-like substrate, and the oxidizing agent infiltration step of forming the second sheet-like substrate is carried out as follows.

The first solvent was ethanol having a purity of 99.8%. Further, the first sheet-form substrate cellulose sheet is immersed in a container of 6 g of a 50%-concentration copper(II) p-toluenesulfonate solution diluted with ethanol and 4 g of a first solvent having a purity of 99.8% in a container. The copper (II) p-toluenesulfonate solution of % concentration was infiltrated for 5 minutes to form a second sheet-like substrate.

After evaporating the first solvent ethanol from the second sheet substrate, a solution of the pyrrole conductive polymer forming material diluted with the second solvent is infiltrated into the second sheet substrate, and is allowed to be in a temperature range of 0 to 80 ° C. The polymerization reaction to form a third sheet-like substrate is carried out as follows. Here, the second solvent which dilutes the pyrrole conductive polymer forming material is ethanol.

The second sheet-like substrate impregnated with copper (II) p-toluenesulfonate is immersed in a 50%-concentration pyrrole solution prepared by mixing 5 g of ethanol having a purity of 99.8% and 5 g of pyrrole having a concentration of 100%, and is placed at room temperature. The second sheet-like substrate infiltrated into the pyrrole conductive polymer is chemically polymerized in the atmosphere to form a third sheet-like substrate. After the completion of the chemical polymerization reaction, the solvent removal step of the second solvent evaporation is performed.

The solvent removal step is carried out to remove the residue other than the polymer formed in the polymerization reaction of the third sheet substrate, and the mixture is washed with distilled water or ethanol and then left to dry in the atmosphere to remove the distilled water or ethanol to remove the distilled water or ethanol. The sheet-like base material intofiltrated by the pyrrole conductive polymer is formed into a conductive polymer infiltrated sheet.

Although the third sheet-like substrate is in a state in which the usable pyrrole conductive polymer is infiltrated into the sheet, in order to further improve the conductivity, the above-mentioned oxidizing agent infiltration step, polymerization step, and solvent removal step, to distilled water or ethanol The washing step was repeated three times. This completes the penetration of the pyrrole conductive polymer into the sheet. As a result, a pyrrole conductive polymer infiltrated sheet having a specific resistance of 1 × 10 ³ Ω/cm or less can be produced.

(Method for manufacturing conductive polymer infiltrated sheet of the fifth heat sink constituent material)

A method of manufacturing a conductive polymer infiltrated sheet of the fifth heat sink constituent material will be described. The conductive polymer solution is infiltrated into the sheet-like base material to form a conductive polymer infiltration step in which the conductive polymer penetrates into the sheet-like base material, and the conductive polymer solution is produced as follows.

5 g of an aqueous polystyrene sulfonate dispersion of conductive poly(3,4-ethylenedioxythiophene), 5 g of a purity of 99.8% ethanol, and 5% by volume of ethylene glycol were mixed as a conductive polymer solution. Instead of ethylene glycol, dimethyl hydrazine or N-methylpyrrolidone can also be used.

The cellulose sheet of the sheet substrate is immersed in the polystyrene sulfonic acid aqueous dispersion of the conductive poly(3,4-ethylenedioxythiophene) for 5 minutes, thereby forming a conductive polymer solution to permeate into a sheet. Substrate.

Here, although a conductive polystyrenesulfonic acid aqueous dispersion liquid of a conductive poly(3,4-ethylenedioxythiophene) is used as a conductive polymer solution, it is not limited to this, and conductive poly (3) can also be used. , an organic solvent dispersion of 4-vinyldioxythiophene), a conductive polyaniline aqueous dispersion, a highly conductive polyaniline organic solvent dispersion using methanol as a dispersion medium, and a high conductivity using methyl ethyl ketone as a dispersion medium A polyaniline organic solvent dispersion or a highly conductive polypyrrole organic solvent dispersion using methyl ethyl ketone as a dispersion medium.

The conductive polymer is permeated into the sheet by the step of removing the dispersion medium from the conductive polymer solution into the sheet-form substrate evaporation dispersion medium.

The conductive polymer thus formed was infiltrated into the sheet, and it was confirmed that it had a specific resistance of ×10 ³ Ω/cm or less.

(Additional chemical polymerization step following the solvent removal step)

After the solvent removal step included in the heat sink manufacturing method described above, the conductive polymer solution coating step and the dispersion medium removing step are continuously performed, and the former is coated with the third sheet substrate from which the second solvent has been removed. An aqueous dispersion of the substance or a solvent dispersion of the conductive polymer; the latter from which the third sheet-like substrate evaporates the solvent of the aqueous dispersion of the conductive polymer or the solvent dispersion of the conductive polymer to make the conductive polymer It can penetrate into the sheet substrate more densely, and the heat dissipation effect is improved. In the step of applying the conductive polymer solution, a chemical polymerization reaction is generated to infiltrate the conductive polymer formed by the polymerization into the sheet substrate.

The conductive polymer solution coating step can be carried out, for example, in the following manner. 5 g of polystyrenesulfonic acid-based aqueous dispersion of conductive poly(3,4-ethylenedioxythiophene), 5 g of purity 99.8% ethanol, and 5% by volume of ethylene glycol were mixed in a container to conduct conductive poly( A polystyrenesulfonic acid-based dispersion solution of 3,4-ethylenedioxythiophene) was blended as a solvent dispersion of a conductive polymer. The polystyrenesulfonic acid-based dispersion solution of the conductive poly(3,4-ethylenedioxythiophene) is applied to the third sheet-form substrate from which the second solvent has been removed.

The third sheet-like substrate formed after the coating step of the conductive polymer solution described above is polymerized at room temperature for 1 hour at 80 ° C for 10 minutes to carry out a dispersion removal step with ethanol to thereby conduct conductive polymerization. The material penetrates into the sheet to form.

(Additional electrolytic polymerization step following the solvent removal step)

After the solvent removal step included in the heat sink manufacturing method described above, the conductive polymer can be more densely infiltrated into the sheet substrate by continuously performing the electrolytic polymerization step and the cleaning step, and the heat dissipation effect is improved.

The conductive polymer formed after the solvent removal step described above is infiltrated into a sheet, and corresponds to the third sheet-like substrate, and the conductive polymer formed after the completion of the above-mentioned dispersion removing step is infiltrated into a sheet, which corresponds to conductive polymerization. The solution penetrates into the sheet substrate.

The electrolytic polymerization step can be carried out, for example, in the following manner.

Add 500 ml of propylene carbonate to a solution of 1% by volume of distilled water, and mix and dissolve 0.3 mol/L of tetraethylammonium p-toluenesulfonic acid with 0.2 mol/L of monomeric pyrrole to make electrolysis. Solution.

In the electrolytic solution, the platinum plate is used as a relative pole, and the sulfur-containing π-conjugated conductive polymer is infiltrated into the sheet-like substrate to be disposed at the working electrode, and the current is 0.2 mA/cm ² under the condition that the electrolytic solution is -20 ° C. The polymerization reaction was carried out for 2 hours, whereby the sulfur-containing yellow π-conjugated conductive polymer provided on the working electrode was infiltrated into the surface of the sheet-like substrate, and formed into a polypyrrole polymer film having a thickness of 5 μm by electrolytic polymerization to contain The sulfur π conjugated conductive polymer and the pyrrole conductive polymer are infiltrated into a composite substrate to form a sheet.

In the above examples, although tetraethylammonium p-toluenesulfonic acid is used as the supporting electrolyte for the blending electrolytic solution, propylene carbonate is used as the electrolyte solvent, but it is not limited thereto. The supporting electrolyte may be trifluoromethanesulfonic acid, sodium trifluoromethanesulfonate, tetraalkylammonium trifluoromethanesulfonate, sodium alkylbenzenesulfonate, sodium alkoxybenzenesulfonate, or sodium alkylbenzenesulfonate. Any one selected from the group of tetraalkyl plating. The electrolyte solvent can be used from acetonitrile, γ-butyrolactone, nitric acid, methyl benzoate, ethyl benzoate, butyl benzoate, ethylene carbonate, dimethyl carbonate, diethyl carbonate, ethyl methyl carbonate, Any one or more selected from the group consisting of ethylene glycol or water.

After the completion of the electrolytic polymerization step, the composite material impregnated into the sheet-like substrate infiltrated with the sulfur-containing π-conjugated conductive polymer and the pyrrole conductive polymer is washed with distilled water and ethanol to remove the solvent of the supporting electrolyte solution at room temperature. Drying is carried out under atmospheric pressure to put the washing step into practice. In the washing step, the composite impregnated with the sulfur-containing π-conjugated conductive polymer and the pyrrole conductive polymer is impregnated into the sheet-like substrate to remove the residue other than the polymer produced in the electrolytic polymerization step.

Further, after the completion of the dispersion medium removing step, the conductive polymer is more densely infiltrated into the sheet-like substrate by continuing the electrolytic polymerization step and the washing step, and the heat dissipation effect is improved.

<Method for manufacturing heat sink according to an embodiment of the present invention>

(Method of manufacturing heat sink by electrolytic plating method)

The conductive polymer infiltrated sheet produced by the solvent removal step or the dispersion medium removing step is subjected to electrolytic plating on at least one of the main surface and the back surface.

To 500 ml of distilled water, 150 g of copper (II) sulfate and 20 ml of sulfuric acid were added and stirred, and the electrolytic plating solution was prepared by dissolving copper (II) sulfate. In the electrolytic plating solution, a copper metal plate is placed on the anode, and a conductive polymer infiltration sheet produced through the solvent removal step or the dispersion medium removal step is placed on the cathode (working electrode), and electrolytic plating is performed. When the temperature of the electrolytic plating solution was maintained at 50 ° C, the conductive polymer penetrated into the metal layer of copper having a thickness of 0.01 mm on the main surface and the back surface of the sheet.

When the metal layer is formed only on the surface of one of the main surface and the back surface of the conductive polymer infiltration sheet, the surface of the metal layer side is not covered with the insulator and then subjected to electrolytic plating treatment.

The conductive polymer formed of a metal layer having a thickness of 0.01 mm was washed with distilled water to permeate the sheet, the electrolytic plating solution was removed, and dried at room temperature under atmospheric pressure to form a heat sink.

In the above description, the metal layer is formed by electrolytic plating, but it is not limited to the electrolytic plating method, and the metal layer may be formed by a PVD method, a CVD method, or an electroless plating method.

(Method of manufacturing heat sink according to metal paste coating method)

The conductive polymer infiltrated sheet produced by the solvent removal step or the dispersion medium removing step is coated with a metal paste on at least one of the main surface and the back surface to form a metal layer.

The conductive polymer is infiltrated into the surface of at least one of the main surface and the back surface of the sheet, and the silver paste is dispersed as an organic solvent of the metal paste, and the conductive polymer coated with the organic solvent-dispersed silver paste is infiltrated into the sheet at a temperature of 150 ° C. Under the conditions, it was heat-hardened in an oven for 30 minutes to form a heat sink in which a conductive polymer penetrated into the sheet and a metal layer was adhered thereto.

Here, the organic solvent-dispersed silver paste is FA-545 which is a Dotite (registered trademark) product manufactured by Fujikura Kasei Co., Ltd. Further, in addition to the organic solvent-dispersed silver paste, an organic solvent-dispersed silver paste used for a silver through-hole, a bonding wire, a carbon contact, a sliding electrode or the like which is generally used for a rigid substrate and a printed circuit board can be used. Ink, etc.

(Method of manufacturing heat sink according to printing technology)

The conductive polymer infiltrated sheet produced by the solvent removal step or the dispersion medium removing step is formed by a printing technique on at least one of the main surface and the back surface to form a metal layer.

The conductive polymer is infiltrated into the surface of at least one of the main surface and the back surface of the sheet, and the silver paste is printed as an organic solvent in a thickness of 5 μm by a screen printing, and the conductivity of the printed organic solvent is dispersed. The polymer infiltrated sheet was heated in an oven at a temperature of 150 ° C for 30 minutes to form a heat sink in which a conductive polymer penetrated into the sheet and a metal layer was adhered thereto.

Here, the organic solvent-dispersed silver paste is FA-545 which is a Dotite (registered trademark) product manufactured by Fujikura Kasei Co., Ltd. In addition to the organic solvent-dispersed silver paste, an organic solvent-dispersed silver paste ink or the like which is generally used for a silver through-hole, a bonding wire, a carbon contact, a sliding electrode, or the like of a rigid substrate and a printed circuit board can be used. .

(Method of manufacturing heat sink for metal sheet bonding technology)

The conductive polymer infiltrated sheet produced by the solvent removal step or the dispersion medium removing step is bonded to the metal sheet via at least one of the main surface and the back surface to form a metal layer.

For the adhesive member, a double-sided tape (product type NW-50) manufactured by NICHIBAN Co., Ltd. or CEMEDINE (registered trademark: product model SX720W) of propylene-modified silicone resin manufactured by CEMEDINE Co., Ltd., or the like can be appropriately selected.

<Verification of the thermal properties of the heat sink>

Referring to Figures 2 through 6, the results of the verification test of the thermal properties of the heat sink according to the embodiment of the present invention will be described.

2 is an explanatory view showing a test of the thermal properties of the heat sink according to the embodiment of the present invention, and schematically shows a cross-sectional composition of the arrangement relationship of the heat generating device 40, the electric wiring board 42, the heat sink 44, and the heat sink 46. Figure.

The heat generating device 40 uses a 1 W light emitting diode. The electric wiring board 42 uses a conventional general-purpose printed circuit board. This general-purpose printed circuit board is a general-purpose printed circuit board (Model: ICB-93SHG) manufactured by Sunhayato Co., Ltd. which is formed using a glass epoxy material. The heat sink 46 uses an aluminum plate heat sink having a thickness of 0.5 mm.

The electric wiring board 42, the heat sink 44, and the heat sink 46 are each cut into a square of 60 mm, and overlap as shown in FIG. The heat generating device 40 is placed at a position of 5 mm from one side of a 60 mm square, and is disposed at a position equidistant from both sides perpendicular to the side.

The heat sink 44 is used to verify the thermal characteristics of the first heat sink and the third heat sink according to the embodiment of the present invention. Since the thermal characteristics of the second heat sink, the fourth heat sink, and the fifth heat sink are not significantly different from the heat characteristics of the first heat sink and the heat characteristics of the third heat sink, the first heat sink and the third heat sink are proposed here. The verification result of the thermal characteristics of the heat sink.

In addition, for comparison, the results of the thermal properties of the fins formed by infiltrating the sheet using the pyrrole conductive polymer are disclosed, and the pyrrole conductive polymer is infiltrated into the sheet using copper chloride as a dopant oxidant of polypyrrole (II). ) Made.

A heat sink formed by using copper (II) chloride as an oxidizing agent to form a pyrrole conductive polymer into a sheet, and as a heat sink of Comparative Example 1, a polypyrrole polymer was formed on the main surface and the back surface of the metal sheet. The heat sink of the film. Further, as the heat sink of Comparative Example 2, a heat sink having a polypyrrole polymer-penetrated polypyrrole infiltration sheet in which a main surface and a back surface and a metal layer were in close contact with each other was used.

The evaluation of the heat characteristics of the heat sink was performed by observing the heat generating device 40 of the total of CH1 to CH8 shown in Fig. 2, which was subjected to temperature change at the start of energization. CH1, CH3, CH5, and CH7 indicate temperature measurement points on the surface on the side where the heat generating device 40 of the electric wiring board 42 is disposed. Further, CH2, CH4, CH6, and CH8 indicate temperature measurement points on the surface on the reverse side of the side on which the electric wiring board 42 of the heat sink 46 is disposed.

As shown in FIG. 2, CH1 is a temperature measurement point set directly below the heat generating device 40, and CH3, CH5, and CH7 are each set at a distance of 15 mm, 30 mm, and 45 mm from the heat generating device 40. Measuring point. Further, CH2 is a temperature measurement point set directly below the heat generating device 40, and each of CH4, CH6, and CH8 is a temperature measuring point set from a heat generating device 40 at a distance of 15 mm, 30 mm, and 45 mm.

Fig. 3 is a timing chart showing the temperature change of CH1 to CH8 in the case where the first heat sink according to the embodiment of the present invention is used as the heat sink 44. The horizontal axis is expressed in minutes and the vertical axis is expressed in °C.

The first heat sink is a heat sink in which a copper thin film metal layer is formed on the main surface and the back surface of the sheet substrate, and the sheet substrate is impregnated with the sulfur-containing yellow polymerized by the aromatic sulfonic acid iron on the cellulose sheet. π conjugated conductive polymer. Here, the general-purpose printed circuit board as the electric wiring board 42 is directly in close contact with the heat sink 44, and the aluminum heat sink which is the heat sink 46 is in direct contact with the heat sink 44.

As shown in FIG. 3, the temperature of the temperature measurement point CH1 set immediately below the heat generating device 40 changes, and reaches 33.5 ° C 3 minutes after the start of energization of the light-emitting diode of the heat generating device. Finally, the thermal equilibrium state of 52.5 ° C is reached. Temperature measurement points CH2 to CH8 are about 13 ° C lower than CH1.

Table 1 shows a detailed list of the thermal resistances obtained by evaluating the thermal characteristics of a series of heat sinks. The column of I to IV is shown, and the magnitude of the thermal resistance of each of the first heat sink, the third heat sink, the heat sink of Comparative Example 1, and the heat sink of Comparative Example 2 is shown as the heat sink 44.

The courses of A to H shown in Table 1 show the thermal resistance values between the two places as shown below. A is the thermal resistance value between the heat generating device and the space adjacent to the heat generating device, column B is the thermal resistance value between the space adjacent to CH2 and CH2, and column C is the heat between the space adjacent to CH3 and CH3. The resistance value, the D column is the thermal resistance value between the space adjacent to CH4 and CH4, the E column is the thermal resistance value between the spaces adjacent to CH5 and CH5, and the F column is between the space adjacent to CH6 and CH6. The thermal resistance value, the G column is the thermal resistance value between the spaces adjacent to CH7 and CH7, and the H column is the thermal resistance value between the spaces adjacent to CH8 and CH8.

In the case where the first heat sink of the embodiment of the present invention is used as the heat sink 44, the thermal resistance value is about 19.1 ° C / W to 32.0 ° C / W.

Fig. 4 is a timing chart showing the temperature change of CH1 to CH8 in the case where the third heat sink according to the embodiment of the present invention is used as the heat sink 44. The horizontal axis is expressed in minutes and the vertical axis is expressed in °C.

The third heat sink is a heat sink in which a copper thin film metal layer is formed on the main surface and the back surface of the sheet substrate, and the sheet substrate is infiltrated into the cellulose sheet by pyrrole conductivity polymerized using an aromatic sulfonic acid iron. Made of polymer. Also in the same manner as in the case of the above-described first heat sink, the general printed circuit board as the electric wiring board 42 is directly in close contact with the heat sink 44, and the aluminum heat sink as the heat sink 46 is directly in close contact with the heat sink 44.

As shown in FIG. 4, the temperature of the temperature measurement point CH1 set directly below the heat generating device 40 changes, and reaches 33.7 ° C 3 minutes after the start of energization of the light-emitting diode of the heat generating device. Finally, it reached a thermal equilibrium of 51.6 °C. Temperature measurement points CH2 to CH8 are about 13 ° C lower than CH1.

As shown in Table 1, in the case where the third heat sink of the embodiment of the present invention is used as the heat sink 44, the thermal resistance value is about 19.1 ° C / W to 32.2 ° C / W.

In Fig. 5, in comparison with the case where the first and second heat sinks of the embodiment of the present invention are used as the heat sink 44, the temperature of CH1 to CH8 is used in the case where the heat sink of Comparative Example 1 is used as the heat sink 44. Change the display. The horizontal axis of Fig. 5 is represented by a time scale in minutes, and the vertical axis is represented by a temperature scale of °C.

As shown in FIG. 5, the temperature of the temperature measurement point CH1 set immediately below the heat generating device 40 changes, and reaches 37.1 ° C 3 minutes after the start of energization of the light-emitting diode of the heat generating device. Finally, the thermal equilibrium state of 54.8 ° C is reached. The temperature measurement points CH2 to CH8 are about 15 ° C lower than the temperature of CH1.

As shown in Table 1, in the case where the heat sink of Comparative Example 1 was used as the heat sink 44, the heat resistance value was about 20.2 ° C / W to 35.4 ° C / W.

In Fig. 6, in comparison with the case where the first and second heat sinks of the embodiment of the present invention are used as the heat sink 44, the temperature of CH1 to CH8 is used in the case where the heat sink of Comparative Example 2 is used as the heat sink 44. Change the display. The horizontal axis of Fig. 5 is represented by a time scale in minutes, and the vertical axis is represented by a temperature scale of °C.

As shown in FIG. 6, the temperature of the temperature measurement point CH1 set immediately below the heat generating device 40 changes, and reaches 35.1 ° C 3 minutes after the start of energization of the light-emitting diode of the heat generating device. Finally, it reached a thermal equilibrium of 52.3 °C. Temperature measurement points CH2 to CH8 are about 13 ° C lower than CH1.

As shown in Table 1, in the case where the heat sink of Comparative Example 2 was used as the heat sink 44, the thermal resistance value was about 19.2 ° C / W to 32.7 ° C / W.

As shown in the above-mentioned FIGS. 3 to 6, it can be seen that the heat characteristics of the first and second heat sinks of the embodiment of the present invention and the heat sinks of Comparative Examples 1 and 2 are not greatly different. Thus, it can be understood that the first and second heat sinks according to the embodiment of the present invention have a pyrrole polymer infiltrated with a pyrrole polymer polymerized using copper (II) chloride as a dopant oxidant. The sheet is infiltrated, and the excellent heat dissipation characteristics of the formed heat sink are utilized, and the conductive polymer is infiltrated into the sheet without the excellent characteristics of residual chlorine.

16, 20‧‧‧ metal layer

18,26‧‧‧ Conductive polymer infiltration sheet

18a, 26a‧‧‧ conductive polymer infiltrated into the main surface of the sheet

18b, 26b‧‧‧ conductive polymer penetrates the back of the sheet

22, 30‧‧‧metal pieces

24, 28‧‧‧bonding members

40‧‧‧heating device

42‧‧‧Electrical wiring board

44‧‧‧ Heat sink

46‧‧‧ radiator

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the structure of a heat sink according to an embodiment of the present invention, wherein (A) is a schematic cross-sectional composition diagram of a heat sink in which a main surface and a back surface of a conductive polymer infiltrated sheet are in close contact with a metal layer, (B) It is a schematic cross-sectional composition diagram of a heat sink in which both the main surface and the back surface of the conductive polymer infiltrated sheet are in close contact with the metal piece via the bonding member.

Figure 2 is a diagram showing an illustration of a test for verifying the thermal properties of a heat sink according to an embodiment of the present invention.

Fig. 3 is a timing chart showing the temperature change of the temperatures of CH1 to CH8 in the case where the first heat sink of the embodiment of the present invention is used as a heat sink.

Fig. 4 is a timing chart showing the temperature change of the temperatures of CH1 to CH8 in the case where the third heat sink according to the embodiment of the present invention is used as a heat sink.

Fig. 5 is a view showing the time change of the temperature of CH1 to CH8 in the case where the heat sink of Comparative Example 1 is used as the heat sink.

Fig. 6 is a view showing the time change of the temperature of CH1 to CH8 in the case where the heat sink of Comparative Example 2 is used as the heat sink.

16, 20. . . Metal layer

18. . . Conductive polymer infiltration sheet

18a. . . Conductive polymer penetrates into the main surface of the sheet

18b. . . Conductive polymer penetrates into the back of the sheet

22, 30. . . Metal sheets

24, 28. . . Adhesive member

26. . . Conductive polymer infiltration sheet

26a. . . Main face

26b. . . back

Claims (21)

A heat sink comprising: a conductive polymer infiltration sheet; and a metal layer in close contact with a surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet; wherein the heat sink is characterized by: The conductive polymer permeates into the sheet system, and the sulfur-containing yellow π conjugated conductive polymer polymerized by using the oxidizing agent aromatic iron sulfonate (III) is infiltrated into the sheet substrate, and the aromatic sulfonic acid iron of the oxidizing agent (III) is iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, iron (III) dodecylbenzenesulfonate, iron naphthalenesulfonate ( III) any one selected from the group consisting of iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalenesulfonate or iron (III) phenolsulfonate; The sulfur-containing π-conjugated conductive polymer is derived from 3,4-ethylenedioxythiophene, thiophene derivative, thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3,4-dialkylthiophene, A polymer obtained by polymerizing any of the monomers selected from the group of 3,4-dialkoxythiophenes. A heat sink comprising: a conductive polymer infiltration sheet; and a metal layer in close contact with a surface of either or both of the main surface and the back surface of the conductive polymer infiltrating sheet; wherein the heat sink is characterized by: The conductive polymer is infiltrated into the sheet system by infiltrating the sheet-like substrate with the sulfur-containing yellow π conjugated conductive polymer polymerized by the oxidizing agent aromatic copper sulfonate (II); and the aromatic sulfonate copper of the oxidizing agent (II) is copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, copper (II) dodecylbenzenesulfonate, copper naphthalenesulfonate ( II) any one selected from the group consisting of copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalenesulfonate or copper (II) phenolsulfonate; The sulfur-containing π-conjugated conductive polymer is derived from 3,4-ethylenedioxythiophene, thiophene derivative, thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3,4-dialkylthiophene, A polymer obtained by polymerizing any of the monomers selected from the group of 3,4-dialkoxythiophenes. A heat sink comprising: a conductive polymer infiltrated sheet; and a metal layer in close contact with a surface of either or both of the main surface and the back surface of the conductive polymer infiltrating sheet; wherein the heat sink is characterized by the conductive The infiltration of the polymer into the sheet is carried out by infiltrating the sheet-like substrate with a pyrrole conductive polymer polymerized with iron (III) sulfonate aromatic sulfonate; and the aromatic sulfonic acid iron (III) of the oxidizing agent is Iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, iron (III) dodecylbenzenesulfonate, iron (III) naphthalenesulfonate, sulfonate Any one selected from the group consisting of iron (III) hydride, iron (III) sulfonate, iron (III) tetrahydronaphthalenesulfonate or iron (III) phenolsulfonate. A heat sink comprising: a conductive polymer infiltration sheet; and a metal layer in close contact with a surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet; wherein the heat sink is characterized by The conductive polymer is infiltrated into the sheet system, and the pyrrole conductive polymer polymerized by using the oxidizing agent aromatic copper sulfonate (II) is infiltrated into the sheet substrate, and the aromatic sulfonate copper (II) of the oxidizing agent is , self-p-toluenesulfonate copper (II), copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, copper (II) dodecylbenzenesulfonate, copper (II) naphthalenesulfonate, Any one selected from the group consisting of copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalenesulfonate or copper (II) phenolsulfonate. A heat sink comprising: a conductive polymer infiltration sheet; and a metal layer in close contact with a surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet; wherein the heat sink is characterized by The conductive polymer is infiltrated into the sheet by using a conductive polymer solution and infiltrated into the sheet-like base material conductive polymer, and the conductive polymer solution is self-conductive poly(3,4-ethylenedioxythiophene). Polystyrenesulfonic acid aqueous dispersion, conductive poly(3,4-ethylenedioxythiophene) An organic solvent dispersion liquid, a conductive polyaniline aqueous dispersion, a highly conductive polyaniline organic solvent dispersion using methanol as a disperse medium, and a highly conductive polyaniline using methyl ethyl ketone as a dispersion medium Any one selected from the group consisting of an organic solvent dispersion and a highly conductive polypyrrole organic solvent dispersion containing methyl ethyl ketone as a dispersion medium. A heat sink comprising: a conductive polymer infiltration sheet; and a metal sheet which is in close contact with the surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet; wherein the heat dissipation The sheet is characterized in that the conductive polymer penetrates into the sheet system and is formed by infiltrating a sheet-like substrate with a sulfur-containing yellow conjugated conductive polymer polymerized with iron (III) oxidant aromatic sulfonate, and the oxidizing agent The iron (III) aromatic sulfonate is iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate and iron dodecylbenzenesulfonate (III). ), selected from the group consisting of iron (III) naphthalenesulfonate, iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalenesulfonate or iron (III) phenolsulfonate In any of the above, the sulfur-containing yellow π-conjugated conductive polymer is from 3,4-ethylenedioxythiophene, thiophene derivative, thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3, 4 a polymer obtained by polymerizing any of the monomers selected from the group consisting of dialkylthiophenes and 3,4-dialkoxythiophenes. A heat sink comprising: a conductive polymer infiltration sheet; and a metal sheet which is in close contact with the surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet; wherein the heat dissipation The sheet is characterized in that the conductive polymer penetrates into the sheet system and is formed by infiltrating a sheet-like substrate with a sulfur-containing yellow conjugated conductive polymer polymerized by using an oxidizing agent aromatic copper sulfonate (II), and the oxidizing agent The copper (II) aromatic sulfonate is copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate or copper dodecylbenzenesulfonate (II). ), copper naphthalene sulfonate (II), copper (II) sulfonate, copper (II) sulfonate, tetrahydronaphthalene Any one selected from the group consisting of copper (II) sulfonate or copper (II) phenolsulfonate, which is derived from 3,4-ethylenedioxythiophene and thiophene. Polymerization of any of the monomers selected from the group consisting of thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3,4-dialkylthiophene, and 3,4-dialkoxythiophene Made of polymer. A heat sink comprising: a conductive polymer infiltration sheet; and a metal sheet which is in close contact with the surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet; wherein the heat dissipation The sheet is characterized in that the conductive polymer penetrates into the sheet system and is formed by infiltrating a sheet-like substrate with a pyrrole conductive polymer polymerized with iron (III) sulfonate aromatic sulfonate, and the aromatic sulfonate of the oxidizing agent Iron (III) is iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, iron (III) dodecylbenzenesulfonate, naphthalenesulfonate Any one selected from the group consisting of iron (III), iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalenesulfonate or iron (III) phenolsulfonate . A heat sink comprising: a conductive polymer infiltration sheet; and a metal sheet which is in close contact with the surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet; wherein the heat dissipation The sheet is characterized in that the conductive polymer is infiltrated into the sheet system, and the pyrrole conductive polymer polymerized by using the oxidizing agent aromatic copper sulfonate (II) is infiltrated into the sheet substrate, and the aromatic sulfonate of the oxidizing agent Copper (II) acid is copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, copper (II) dodecylbenzenesulfonate, naphthalenesulfonate Any one selected from the group consisting of copper (II) acid, copper (II) sulfonate, copper (II) sulfonate, copper (II) tetrahydronaphthalenesulfonate or copper (II) phenolsulfonate . A heat sink comprising: a conductive polymer infiltrated sheet; a metal sheet which is in close contact with the surface of either or both of the main surface and the back surface of the conductive polymer infiltration sheet; the heat sink is characterized in that the conductive polymer penetrates into the sheet to use conductivity. The polymer solution is formed by infiltrating a conductive polymer of a sheet-like substrate, and the conductive polymer solution is a polystyrenesulfonic acid-based aqueous dispersion of self-conductive poly(3,4-ethylenedioxythiophene). An organic solvent dispersion of conductive poly(3,4-ethylenedioxythiophene), an electrically conductive polyaniline aqueous dispersion, and a highly conductive polyaniline organic solvent dispersion using methanol as a disperse medium. Any one selected from the group consisting of a highly conductive polyaniline organic solvent dispersion containing methyl ethyl ketone as a dispersion medium and a highly conductive polypyrrole organic solvent dispersion liquid containing methyl ethyl ketone as a dispersion medium. A method for producing a heat sink, comprising the steps of: an oxidizing agent infiltration step of infiltrating an oxidizing agent aromatic iron sulfonate (III) solution diluted with a first solvent into a first sheet-like substrate to form a second sheet-like substrate; and polymerizing In the reaction step, the first solvent is evaporated from the second sheet substrate, and the sulfur-containing yellow conjugated conductive polymer forming material solution diluted with the second solvent is infiltrated into the second sheet substrate. Polymerization reaction in a temperature range of ~80 ° C to form a third sheet substrate; solvent removal step, evaporating the second solvent from the third sheet substrate, and removing the third sheet from the second solvent The substrate is manufactured as a conductive polymer infiltration sheet; and the metal layer forming step is performed by infiltrating the conductive polymer into the surface of either or both of the main surface and the back surface of the sheet and the metal layer; wherein the heat dissipation sheet is manufactured The iron/(III) aromatic sulfonate of the oxidizing agent is derived from iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, and dodecane. Iron (III) benzenesulfonate, iron (III) naphthalene sulfonate, iron (III) sulfonate, iron bismuth sulfonate (II) I), any one selected from the group consisting of iron (III) tetrahydronaphthalenesulfonate or iron (III) phenolsulfonate, the sulfur-containing yellow π-conjugated conductive polymer is from 3,4-ethylene Dioxythiophene, thiophene derivative, thiophene, 3-alkylthiophene, a polymer obtained by polymerizing any one of selected monomers selected from the group consisting of 3-alkoxythiophene, 3,4-dialkylthiophene, and 3,4-dialkoxythiophene; the first solvent is The purity is 99.8% ethanol, and the second solvent is ethanol. A method for producing a heat sink, comprising the steps of: an oxidizing agent infiltration step of infiltrating a first sheet-shaped substrate with an oxidizing agent aromatic copper sulfonate (II) solution diluted with a first solvent to form a second sheet-like substrate; In the polymerization step, after evaporating the first solvent from the second sheet substrate, the sulfur-containing yellow conjugated conductive polymer forming material solution diluted with the second solvent is infiltrated into the second sheet substrate. Polymerization reaction in a temperature range of 0 to 80 ° C to form a third sheet substrate; solvent removal step, evaporating the second solvent from the third sheet substrate, and removing the third solvent from the second solvent The substrate is made of a conductive polymer infiltration sheet; and the metal layer forming step is performed by infiltrating the conductive polymer into the surface of either or both of the main surface and the back surface of the sheet and the metal layer; wherein the heat sink is manufactured The method is characterized in that the precursor copper (II) of the oxidizing agent is copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, twelve Copper (II) alkyl benzene sulfonate, copper (II) naphthalene sulfonate, copper (II) sulfonate, copper (II) sulfonate, Any one selected from the group consisting of copper (II) hydronaphthalenesulfonate or copper (II) phenolsulfonate, the sulfur-containing yellow π-conjugated conductive polymer is derived from 3,4-ethylenedioxythiophene Any one of the selected monomers of the group of thiophene derivatives, thiophene, 3-alkylthiophene, 3-alkoxythiophene, 3,4-dialkylthiophene, and 3,4-dialkoxythiophene The polymer obtained by polymerization; the first solvent is ethanol having a purity of 99.8%, and the second solvent is ethanol. A method for producing a heat sink, comprising the steps of: an oxidizing agent infiltration step of infiltrating an oxidizing agent aromatic iron sulfonate (III) solution diluted with a first solvent into a first sheet-like substrate to form a second sheet-like substrate; a polymerization reaction step of evaporating the first solvent from the second sheet substrate, and then infiltrating the second plate-like substrate with the pyrrole conductive polymer forming material solution diluted with the second solvent. Polymerization at a temperature of 80 ° C to form a third sheet a solvent removal step of evaporating the second solvent from the third sheet substrate, and manufacturing the third sheet substrate from which the second solvent has been removed into a conductive polymer infiltration sheet; and a metal layer forming step The conductive polymer is infiltrated into the surface of either or both of the main surface and the back surface of the sheet and is in close contact with the metal layer; wherein the method for manufacturing the heat sink is characterized in that the pre-recorded aromatic sulfonic acid iron (III) of the oxidizing agent ) is iron (III) p-toluenesulfonate, iron (III) benzenesulfonate, iron (III) methoxybenzenesulfonate, iron (III) dodecylbenzenesulfonate, iron (III) naphthalenesulfonate Any one selected from the group consisting of iron (III) sulfonate, iron (III) sulfonate, iron (III) tetrahydronaphthalenesulfonate or iron (III) phenolsulfonate; the first solvent It is an ethanol having a purity of 99.8%, and the second solvent is ethanol. A method for producing a heat sink, comprising the steps of: an oxidizing agent infiltration step of infiltrating a solution of an oxidizing agent aromatic copper sulfonate (II) diluted with a first solvent into a first sheet-like substrate to form a second sheet-like substrate; a polymerization reaction step of evaporating the first solvent from the second sheet substrate, and then infiltrating the second plate-like substrate with the pyrrole conductive polymer forming material solution diluted with the second solvent. Polymerization reaction at a temperature of 80 ° C to form a third sheet-like substrate; solvent removal step, evaporating the second solvent from the third sheet-like substrate, and removing the third sheet-like base of the second solvent The conductive material is formed into a conductive polymer infiltration sheet; and the metal layer forming step is performed by infiltrating the conductive polymer into the surface of either or both of the main surface and the back surface of the sheet and the metal layer; wherein the heat sink is manufactured by the method The copper sulfonate (II) of the oxidizing agent is characterized by copper (II) p-toluenesulfonate, copper (II) benzenesulfonate, copper (II) methoxybenzenesulfonate, and dodecyl group. Copper (II) benzenesulfonate, copper (II) naphthalenesulfonate, copper (II) sulfonate, copper (II) sulfonate, Any one selected from the group consisting of copper (II) tetrahydronaphthalenesulfonate or copper (II) phenolsulfonate; the first solvent is ethanol having a purity of 99.8%, and the second solvent is ethanol. The method for manufacturing a heat sink according to any one of claims 11 to 14, wherein after the solvent removing step, the method further comprises the following steps: a conductive polymer solution coating step, wherein the second solvent has been removed On the third sheet substrate, an aqueous dispersion of a conductive polymer or a solvent dispersion of a conductive polymer; and a dispersion removal step from the third sheet substrate coated with the conductive polymer solution The solvent of the aqueous dispersion of the conductive polymer or the solvent dispersion of the conductive polymer is evaporated. The method for producing a heat sink according to any one of claims 11 to 14, wherein after the solvent removal step, the method further comprises the step of: an electrolytic polymerization step in which the third solvent has been removed On a sheet substrate, from tetraethylammonium p-toluenesulfonic acid, trifluoromethanesulfonic acid, sodium trifluoromethanesulfonate, tetraalkylammonium trifluoromethanesulfonate, sodium alkylbenzenesulfonate, alkoxy Any one selected from the group consisting of sodium benzenesulfonate or sodium alkylbenzenesulfonate tetraalkylammonium salt as a supporting electrolyte, the supporting electrolyte is derived from propylene carbonate, acetonitrile, γ-butyrolactone, nitric acid, Any one selected from the group consisting of methyl benzoate, ethyl benzoate, butyl benzoate, ethylene carbonate, dimethyl carbonate, diethyl carbonate, ethyl methyl carbonate, ethylene glycol, or water Or a plurality of supporting electrolyte solutions as supporting electrolyte solvents, dissolved in 3,4-ethylenedioxythiophene, pyrrole, thiophene, thiophene derivative, 3-alkylthiophene, 3-alkoxythiophene, 3,4- Any one of the selected monomers in the group of dialkylthiophene or 3,4-dialkoxythiophene, Electrolytic polymerization thereof; and a cleaning step after the end of the electrolytic polymerization step of the third cleaning sheet substrate. A method for manufacturing a heat sink, comprising the steps of: infiltrating a conductive polymer, infiltrating a conductive polymer solution into a sheet substrate to form a conductive polymer solution to penetrate into a sheet substrate; and dispersing the medium removing step After the conductive polymer solution is infiltrated into the sheet-form substrate evaporation dispersion medium, the conductive polymer solution from which the dispersion medium has been removed is infiltrated into the sheet-like substrate to be a conductive polymer infiltration sheet; and the metal layer forming step And the conductive polymer is infiltrated into the surface of the main surface and the back surface of the sheet or the surface of the sheet is in close contact with the metal layer; The method for manufacturing the heat sink is characterized in that the conductive polymer solution is a polystyrene sulfonic acid aqueous dispersion of conductive poly(3,4-ethylenedioxythiophene) and a conductive poly(3). , an organic solvent dispersion of 4-vinyldioxythiophene), a conductive polyaniline aqueous dispersion, a highly conductive polyaniline organic solvent dispersion using methanol as a dispersion medium, and a high conductivity using methyl ethyl ketone as a dispersion medium Any one selected from the group consisting of a polyaniline organic solvent dispersion and a highly conductive polypyrrole organic solvent dispersion containing methyl ethyl ketone as a dispersion medium. The method for manufacturing a heat sink according to claim 17, wherein after the dispersing medium removing step, the method further comprises the step of: an electrolytic polymerization step of infiltrating the sheet-like substrate with the conductive polymer solution from which the dispersing medium has been removed; Above, from tetraethylammonium p-toluenesulfonic acid, trifluoromethanesulfonic acid, sodium trifluoromethanesulfonate, tetraalkylammonium trifluoromethanesulfonate, sodium alkylbenzenesulfonate, sodium alkoxybenzenesulfonate Or a selected one of the group of sodium alkylbenzenesulfonate tetraalkylammonium salts as a supporting electrolyte, the supporting electrolyte is derived from propylene carbonate, acetonitrile, γ-butyrolactone, nitric acid, methyl benzoate, Any one or more selected from the group consisting of ethyl benzoate, butyl benzoate, ethylene carbonate, dimethyl carbonate, diethyl carbonate, ethyl methyl carbonate, ethylene glycol, or water The supporting electrolyte solution of the electrolyte solvent is dissolved in 3,4-ethylenedioxythiophene, pyrrole, thiophene, thiophene derivative, 3-alkylthiophene, 3-alkoxythiophene, 3,4-dialkylthiophene, Or any one of the selected monomers in the group of 3,4-dialkoxythiophenes So that the electrolytic polymerization; and a cleaning step after the end of the step of cleaning the electrolytic polymerization of the conductive polymer solution penetrate the sheet substrate. The method for manufacturing a heat sink according to any one of claims 11 to 14, wherein the metal layer forming step is performed on both the main surface and the back surface of the conductive polymer infiltration sheet. Or the surface of either of them is adhered to the metal layer by physical vapor deposition (PVD: Physical Vapor Deposition), chemical vapor deposition (CVD: Chemical Vapor Deposition), electrolytic plating, or electroless plating. The steps. Such as applying for any of the scope of patents 11 to 14, or 17 or 18 The method for producing a heat sink according to the invention, wherein the metal layer forming step is performed by coating metal particles into a viscous substance on a surface of either or both of the main surface and the back surface of the conductive polymer-infiltrated sheet. The step of bonding the metal paste to the metal layer. The method for manufacturing a heat sink according to any one of claims 11 to 14, wherein the metal layer forming step is performed on both the main surface and the back surface of the conductive polymer infiltration sheet. Or on the surface of either of them, the step of printing the fixed metal particles to be in close contact with the metal layer.