CN113660840B - Heat conducting film, preparation method of heat conducting film and display panel - Google Patents
Heat conducting film, preparation method of heat conducting film and display panel Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The application provides a heat conducting film, a preparation method of the heat conducting film and a display panel. The heat conducting film comprises a layered graphene layer; the multidimensional reticular graphene layer is arranged on one side of the lamellar graphene layer; the high polymer layer is arranged on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer. The heat conduction film can realize bidirectional heat conduction in and out of the plane, and has good heat conduction effect.
Description
Technical Field
The application relates to the field of display, in particular to a heat conducting film, a preparation method of the heat conducting film and a display panel.
Background
For electronic devices, effective heat dissipation from the device can have an important impact on the lifetime and operating speed of the device.
Graphene is a novel nano material which is formed by arranging carbon atoms according to regular hexagons and connecting the carbon atoms with each other, has a very stable structure, and is thinnest, maximum in strength and strongest in electric conduction and heat conduction performance. The thermal conductivity of graphene is as high as 5000W/m.K. Therefore, preparing graphene heat conducting films with graphene as a main heat dissipation medium is a research hotspot.
Currently, heat conduction in the out-of-plane direction is achieved by using a metal layer by laminating a graphene sheet with a metal material such as copper, aluminum, or the like; however, this approach not only fails to achieve optimal heat dissipation in the out-of-plane direction, but also requires the introduction of adhesive glue due to poor adhesion of graphene to metal, and the introduction of glue causes a decrease in thermal conductivity. Accordingly, it is desirable to provide a heat conductive film having a good heat conductive effect.
Disclosure of Invention
The application provides a heat conduction film, a preparation method of the heat conduction film and a display panel, so as to obtain the heat conduction film with good heat conduction effect.
The application provides a heat conduction film, including:
a layered graphene layer;
the multidimensional reticular graphene layer is arranged on one side of the lamellar graphene layer;
the high polymer layer is arranged on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer.
In some embodiments, the multi-dimensional reticulated graphene layer has a thermal conductivity greater than a thermal conductivity of the layered graphene layer, which is greater than a thermal conductivity of the high molecular polymer layer.
In some embodiments, the material of the high molecular polymer layer includes one or more of polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polybutylene, polyvinyl chloride, polytetrafluoroethylene, polystyrene, polybutylene terephthalate, polypyrrole, polythiophene, epoxy, polyvinylpyrrolidone, polyvinyl alcohol, polyacrylic acid, phenolic resin, polymethyl methacrylate, polyamide, or polyethylene glycol.
The application also provides a preparation method of the heat conducting film, which comprises the following steps:
forming a multi-dimensional reticular graphene layer on one side of the layered graphene layer;
and forming a high-molecular polymer layer on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer.
In some embodiments, the forming a multi-dimensional mesh graphene layer on one side of the layered graphene layer comprises:
preparing a graphene solution;
coating the graphene solution on one side of the layered graphene layer;
and forming a multidimensional reticular graphene layer on one side of the layered graphene layer through freeze drying treatment.
In some embodiments, the graphene solution includes 30% -40% graphene by weight of the total graphene solution.
In some embodiments, the solvent from which the graphene solution is formulated comprises one or more of deionized water, polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polybutylene, polyvinyl chloride, polytetrafluoroethylene, polystyrene, polybutylene terephthalate, polypyrrole, polythiophene, epoxy, polyvinylpyrrolidone, polyvinyl alcohol, polyacrylic acid, phenolic resin, polymethyl methacrylate, polyamide, or polyethylene glycol.
In some embodiments, the freeze drying process includes a freeze treatment stage at a temperature of 0 degrees celsius to minus 50 degrees celsius, a time of the freeze treatment stage from 2 hours to 6 hours, a temperature of the drying treatment stage from 60 degrees celsius to 120 degrees celsius, and a time of the drying treatment stage from 1 hour to 2 hours.
In some embodiments, the forming a high molecular polymer layer on a side of the multi-dimensional mesh graphene layer remote from the layered graphene layer comprises:
coating a high molecular polymer solution on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer;
and curing the high molecular polymer solution to form a high molecular polymer layer.
The application also provides a display panel, the display panel includes array substrate and as aforementioned heat conduction membrane, the heat conduction membrane with array substrate laminating.
In some embodiments, the thermally conductive film comprises:
a layered graphene layer;
the multidimensional reticular graphene layer is arranged on one side of the lamellar graphene layer;
the high polymer layer is arranged on one side, far away from the layered graphene layer, of the multidimensional reticular graphene layer, and the layered graphene layer is attached to the array substrate.
The application provides a heat conducting film, a preparation method of the heat conducting film and a display panel. The heat conducting film comprises a layered graphene layer; the multidimensional reticular graphene layer is arranged on one side of the lamellar graphene layer; the high polymer layer is arranged on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer. The layered graphene layer can realize in-plane heat conduction of the heat conduction film, and the multidimensional reticular graphene layer can realize out-of-plane heat conduction of the heat conduction film because of various different graphene orientations in the multidimensional reticular graphene layer. Therefore, the heat conduction film provided by the application can realize bidirectional heat conduction in and out of the plane, and has good heat conduction effect.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat conductive film according to an embodiment of the present application.
Fig. 2 is a flowchart of a method for preparing a heat conductive film according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The embodiment of the application provides a heat conducting film, and the application will be described in detail with reference to specific embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat conducting film according to an embodiment of the present application.
The application provides a heat conduction film 10, which comprises a layered graphene layer 11, a multidimensional reticular graphene layer 12 and a high polymer layer 13. The multi-dimensional mesh graphene layer 12 is disposed on one side of the layered graphene layer 11. The high polymer layer 13 is disposed on a side of the multidimensional mesh graphene layer 12 away from the layered graphene layer 11. Wherein, because gaps exist in the formed multidimensional reticular graphene, the high polymer solution forming the high polymer can permeate into the gaps, and the high polymer-multidimensional reticular graphene interpenetrating network is formed. The high polymer can fix the structure of the multidimensional reticular graphene and prevent the graphene from aggregation.
The heat conductive film 10 can realize bidirectional heat conduction in and out of the plane. Wherein the layered graphene layer 11 can realize in-plane heat conduction of the heat conduction film 10. As there are a number of different graphene orientations in the multi-dimensional reticulated graphene layer 12. The multi-dimensional reticulated graphene layer 12 may thus enable out-of-plane thermal conduction of the thermally conductive film 10. Therefore, the heat conduction film 10 provided by the application can realize bidirectional heat conduction in and out of the plane, and has good heat conduction effect. In-plane thermal conduction refers to heat conduction in the extending direction of the layered graphene. Out-of-plane heat conduction means that heat can be conducted not only in the extending direction of the multi-dimensional mesh graphene but also in the thickness direction of the multi-dimensional mesh graphene.
In some embodiments, the thermal conductivity of the thermally conductive film 10 is 1500W/m.K-2000W/m.K.
Specifically, the thermal conductivity of the thermal conductive film 10 may be 1500W/m.K, 1600W/m.K, 1700W/m.K, 1800W/m.K, 1900W/m.K, or 2000W/m.K. Therefore, the heat conduction film 10 provided by the application is high in heat conduction coefficient and good in heat conduction effect.
The thermal conductivity is also known as thermal conductivity. The heat conductivity coefficient refers to the heat transferred through 1 square meter area in a certain time under the condition of stable heat transfer, wherein the temperature difference of the surfaces of two sides is 1 degree (K, DEG C) of a material with the thickness of 1 meter.
In some embodiments, the number of layers of layered graphene in layered graphene layer 11 is 1-5.
Specifically, the number of layers of the layered graphene in the layered graphene layer 11 may be 1, 2, 3, 4 or 5. The thermal conductivity of the layered graphene layer 11 decreases as the number of layered graphene layers increases. When the number of layers exceeds 5, the in-plane thermal conductivity of the multi-layer graphene approaches the corresponding value of the bulk graphite. In addition, when the number of layers of the layered graphene 11 is too large, peeling and falling off may also occur. Therefore, the number of layers of the layered graphene in the layered graphene layer 11 is controlled to be 1-5 layers, so that the heat conduction film is guaranteed to achieve good heat conduction effect.
In some embodiments, the thermal conductivity of the multi-dimensional graphene mesh layer 12 is greater than the thermal conductivity of the layered graphene layer 11. The thermal conductivity of the layered graphene layer 11 is greater than that of the high polymer layer 13.
The layered graphene layer 11 may transfer heat of the heat source to the multidimensional mesh graphene layer 12 after in-plane conduction. The multidimensional mesh graphene layer 12 can rapidly conduct heat of a heat source out of the plane. The heat which is conducted out by the multidimensional mesh graphene layer 12 is conducted out to the outside through the high polymer layer, so that heat dissipation of a heat source is realized.
The thermal conductivity of the multidimensional mesh-shaped graphene layer 12 is controlled to be larger than that of the lamellar graphene layer 11. The heat conductivity of the layered graphene layer 11 is larger than that of the high polymer layer 13, so that rapid heat dissipation of a heat source can be realized, and local overheating caused by heat dissipation can be avoided.
In some embodiments, the material of the high molecular polymer layer 13 includes one or more of polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polybutylene, polyvinyl chloride, polytetrafluoroethylene, polystyrene, polybutylene terephthalate, polypyrrole, polythiophene, epoxy, polyvinylpyrrolidone, polyvinyl alcohol, polyacrylic acid, phenolic resin, polymethyl methacrylate, polyamide, or polyethylene glycol.
The high polymer material provided by the application has good film forming property, and better laminating property with graphene, and can avoid falling off and stripping, so that the stability of the heat conducting film 10 is improved.
Referring to fig. 2, fig. 2 is a flowchart of a method for preparing a heat conductive film according to an embodiment of the present application.
Step B10: and forming a multidimensional reticular graphene layer on one side of the lamellar graphene layer.
A multi-dimensional mesh-like graphene layer 12 is formed on one side of the layered graphene layer 11.
In some embodiments, before forming the multi-dimensional mesh graphene layer on one side of the layered graphene layer, it may further include:
a layered graphene layer 11 is formed on a substrate.
The layered graphene layer 11 may be formed on the substrate by means of chemical deposition. Specifically, one of low pressure chemical vapor deposition or atmospheric pressure chemical vapor deposition may be employed. It will be appreciated that the substrate may be removed after the layered graphene layer 11 is formed on the substrate, or the substrate may be removed after the entire thermally conductive film 10 is manufactured, that is, the finally formed thermally conductive film 10 does not include the substrate.
Step B20: and forming a high-molecular polymer layer on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer.
A high molecular polymer layer 13 is formed on the side of the multidimensional mesh-like graphene layer 12 remote from the layered graphene layer 11.
The preparation method of the heat conducting film is simple in process.
In some embodiments, forming a multi-dimensional reticulated graphene layer on one side of the layered graphene layer includes:
step B11: preparing a graphene solution.
The graphene solution is prepared by a solution method and stirred. The stirring treatment is carried out for 1 to 2 hours, thereby promoting the dispersion and mixing of the graphene solution. Specifically, the stirring treatment time may be 1 hour, 1.5 hours, or 2 hours.
In some embodiments, the graphene solution includes 30% -40% graphene by weight of the total graphene solution.
Specifically, the mass percentage of graphene in the graphene solution may be arbitrarily selected from 30% -40%, and may be an integer, for example: 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39% or 40%. Non-integer values may also be taken, for example: 30.5%, 31.4%, 32.2%, 33.8%, 34.6%, 35.3%, 36.7%, 37.4%, 38.1% or 39.9%.
The mass percentage of graphene in the graphene solution is 30% -40%, and the balance is solvent and additive. The additive may be a surfactant and/or a pH regulator. The specific surfactant may be one or more of poly (sodium methacrylate), ammonium acrylate/acrylamide copolymers or acrylic acid (ester) copolymers. The pH regulator may be one or more of ammonium phosphate, potassium phosphate or sodium phosphate.
According to the method, the mass percentage of graphene in the graphene solution is controlled to be 30% -40%, and the multi-dimensional reticular graphene structure is obtained.
In some embodiments, the solvent from which the graphene solution is formulated comprises one or more of deionized water, polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polybutylene, polyvinyl chloride, polytetrafluoroethylene, polystyrene, polybutylene terephthalate, polypyrrole, polythiophene, epoxy, polyvinylpyrrolidone, polyvinyl alcohol, polyacrylic acid, phenolic resin, polymethyl methacrylate, polyamide, or polyethylene glycol.
The solvent for preparing the graphene solution can enable graphene to be dispersed in the solvent, and meanwhile the solvent is easy to volatilize and remove.
Step B12: and coating the graphene solution on one side of the layered graphene layer.
And uniformly coating the graphene solution on one side of the layered graphene layer, so as to ensure that the thickness of the obtained multidimensional reticular graphene is consistent.
Step B13: and forming a multidimensional reticular graphene layer on one side of the layered graphene layer through freeze drying treatment.
The graphene molecules can be dispersed in crystal gaps after freezing treatment and can be fixed in orientation after drying treatment, so that a multidimensional network structure is formed.
In some embodiments, the freeze-drying process includes a freezing process stage and a drying process stage. The temperature of the freezing treatment stage is 0 ℃ to minus 50 ℃. The time of the freezing treatment stage is 2 hours to 6 hours. The temperature of the drying treatment stage is 60 ℃ to 120 ℃. The drying treatment stage takes 1 to 2 hours.
Specifically, the temperature of the freezing treatment stage may be 0 degrees celsius, minus 10 degrees celsius, minus 20 degrees celsius, minus 30 degrees celsius, minus 40 degrees celsius, or minus 50 degrees celsius. The time of the freezing treatment stage may be 2 hours, 3 hours, 4 hours, 5 hours or 6 hours. The temperature of the drying process stage may be 60 degrees celsius, 70 degrees celsius, 80 degrees celsius, 90 degrees celsius, 100 degrees celsius, 110 degrees celsius, or 120 degrees celsius. The drying treatment stage may be 1 hour, 1.5 hours or 2 hours.
The temperature and time of the freezing process may control the structure of the formed graphene. According to the method, the temperature of the freezing treatment stage is controlled to be 0 ℃ to minus 50 ℃, the time of the freezing treatment stage is 2 hours to 6 hours, graphene molecules are dispersed in crystal gaps, and a multidimensional reticular graphene structure is easy to obtain. After freezing treatment, graphene molecules are dispersed in crystal gaps, and then drying treatment is carried out at the temperature of 60-120 ℃ for 1-2 hours, so that the solvent in the graphene solution is removed, and the graphene molecules are fixed, and finally the multidimensional netlike graphene is obtained.
In some embodiments, forming the high molecular polymer layer on a side of the multi-dimensional reticulated graphene layer remote from the layered graphene layer comprises:
step B21: and coating a high-molecular polymer solution on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer.
Because gaps exist in the multidimensional mesh graphene, the high polymer solution can permeate into the gaps to form a high polymer-multidimensional mesh graphene interpenetrating network. The high polymer can fix the structure of the multidimensional reticular graphene and prevent the graphene from aggregation.
In some embodiments, the high molecular polymer solution comprises one or more of polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polybutylene, polyvinyl chloride, polytetrafluoroethylene, polystyrene, polybutylene terephthalate, polypyrrole, polythiophene, epoxy, polyvinylpyrrolidone, polyvinyl alcohol, polyacrylic acid, phenolic resin, polymethyl methacrylate, polyamide, or polyethylene glycol.
The high polymer solution is cured to form the high polymer film, the high polymer film is good in film forming property, good in laminating property with graphene, not easy to fall off and peel off, and stability of the formed conductive film is improved.
Step B22: and curing the high molecular polymer solution to form a high molecular polymer layer.
According to the type of the material forming the high polymer solution, a corresponding curing mode is selected. For example, when the high molecular polymer solution is polyethylene terephthalate, a high temperature curing mode may be selected. The curing temperature is 100-200 deg.c and curing time is 20-50 min. Specifically, the curing temperature may be 100 degrees celsius, 120 degrees celsius, 140 degrees celsius, 160 degrees celsius, 180 degrees celsius, or 200 degrees celsius. The curing time may be 20 minutes, 30 minutes, 40 minutes or 50 minutes. When the high polymer solution is polyimide, an ultraviolet light curing mode can be selected. At this time, the energy of the ultraviolet light is 60 millijoules to 400 millijoules, and the ultraviolet light curing time is 1 minute to 5 minutes. Specifically, the energy of the ultraviolet light may be 60 mJ, 100 mJ, 150 mJ, 200 mJ, 250 mJ, 300 mJ, 350 mJ or 400 mJ. The time for uv curing may be 1 minute, 2 minutes, 3 minutes, 4 minutes, or 5 minutes.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the disclosure.
The present application provides a display panel 100 including an array substrate 20 and a heat conductive film 10 as described in any of the previous embodiments. The heat conductive film 10 is bonded to the array substrate 20. The display panel 100 further includes a light emitting function layer 30 and a thin film encapsulation layer 40. The light emitting functional layer 30 is disposed on a side of the array substrate 20 away from the heat conductive film 10. The thin film encapsulation layer 40 covers the light emitting function layer 30.
When the display panel 100 is in operation, a current flows through the array substrate 20 to generate heat, and a layer of heat sink is usually attached to the back surface of the array substrate 20 for heat dissipation. The conventional heat sink is generally formed by combining two or three of copper foil, graphite sheet and foam, which is not only unfavorable for the light and thin of the display panel 100, but also unfavorable for the realization of good heat dissipation of the display panel 100. The present application provides a display panel 100 including an array substrate 20 and a heat conductive film 10 as described in any of the previous embodiments. The heat conductive film 10 can realize in-plane and out-of-plane bidirectional heat conduction, thereby realizing rapid heat dissipation of the display panel 100.
In some embodiments, the thermally conductive film 10 includes a layered graphene layer 11, a multi-dimensional reticulated graphene layer 12, and a high molecular polymer layer 13. The multi-dimensional mesh graphene layer 12 is disposed on one side of the layered graphene layer. The high polymer layer 13 is disposed on a side of the multidimensional mesh graphene layer 12 away from the layered graphene layer 11. The layered graphene layer 11 is bonded to the array substrate 20.
The layered graphene layer 11 transfers heat of the display panel 100 to the multidimensional mesh graphene layer 12 after being guided out of the plane. The multidimensional mesh graphene layer 12 can rapidly conduct heat of the display panel 100 out of the plane. The heat conducted out by the multidimensional mesh graphene layer 12 is conducted out to the outside through the high polymer layer 13, so that the heat dissipation of the display panel 100 is realized.
In summary, although the detailed description of the embodiments of the present application is given above, the above embodiments are not intended to limit the present application, and those skilled in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (11)
1. A thermally conductive film, comprising:
the layered graphene layer for in-plane heat conduction of the heat conduction film comprises 1-5 layers of layered graphene;
the multidimensional reticular graphene layer is used for conducting heat outside the surface of the heat conducting film and is arranged on one side of the lamellar graphene layer;
the high polymer layer is arranged on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer;
gaps exist among the multidimensional reticular graphenes in the multidimensional reticular grapheme layer, and a high polymer solution forming the high polymer layer permeates into the gaps to form a high polymer-multidimensional reticular grapheme interpenetrating network; the in-plane heat conduction means that heat is conducted in the extending direction of the layered graphene layer; the out-of-plane heat conduction means that heat is conducted not only in the extending direction of the multi-dimensional mesh graphene but also in the thickness direction of the multi-dimensional mesh graphene layer.
2. The thermally conductive film of claim 1, wherein the multi-dimensional reticulated graphene layer has a thermal conductivity greater than a thermal conductivity of the layered graphene layer, the layered graphene layer having a thermal conductivity greater than a thermal conductivity of the high molecular polymer layer.
3. The thermally conductive film of claim 1, wherein the material of the high molecular polymer layer comprises one or more of polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polybutylene, polyvinyl chloride, polytetrafluoroethylene, polystyrene, polybutylene terephthalate, polypyrrole, polythiophene, epoxy, polyvinylpyrrolidone, polyvinyl alcohol, polyacrylic acid, phenolic resin, polymethyl methacrylate, polyamide, or polyethylene glycol.
4. A method of making a thermally conductive film, comprising:
forming a layered graphene layer comprising 1-5 layers of layered graphene for in-plane thermal conduction of the thermal conductive film;
forming a multidimensional reticular graphene layer for conducting heat outside the surface of the heat conducting film on one side of the lamellar graphene layer;
forming a high molecular polymer layer on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer;
gaps exist among the multidimensional reticular graphenes in the multidimensional reticular grapheme layer, and a high polymer solution forming the high polymer layer permeates into the gaps to form a high polymer-multidimensional reticular grapheme interpenetrating network;
the in-plane heat conduction means that heat is conducted in the extending direction of the layered graphene layer; the out-of-plane heat conduction means that heat is conducted not only in the extending direction of the multi-dimensional mesh graphene but also in the thickness direction of the multi-dimensional mesh graphene layer.
5. The method of preparing a thermally conductive film according to claim 4, wherein forming a multi-dimensional mesh-like graphene layer on one side of the layered graphene layer comprises:
preparing a graphene solution;
coating the graphene solution on one side of the layered graphene layer;
and forming a multidimensional reticular graphene layer on one side of the layered graphene layer through freeze drying treatment.
6. The method of claim 5, wherein the graphene solution comprises 30% -40% graphene by weight of the total graphene solution.
7. The method of claim 5, wherein the solvent used to prepare the graphene solution comprises one or more of deionized water, polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polybutylene, polyvinyl chloride, polytetrafluoroethylene, polystyrene, polybutylene terephthalate, polypyrrole, polythiophene, epoxy, polyvinylpyrrolidone, polyvinyl alcohol, polyacrylic acid, phenolic resin, polymethyl methacrylate, polyamide, and polyethylene glycol.
8. The method according to claim 5, wherein the freeze-drying process includes a freezing process stage and a drying process stage, the freezing process stage has a temperature of 0 ℃ to minus 50 ℃, the freezing process stage has a time of 2 hours to 6 hours, the drying process stage has a temperature of 60 ℃ to 120 ℃, and the drying process stage has a time of 1 hour to 2 hours.
9. The method of claim 4, wherein forming a high molecular polymer layer on a side of the multi-dimensional graphene layer away from the layered graphene layer comprises:
coating a high molecular polymer solution on one side of the multidimensional reticular graphene layer far away from the lamellar graphene layer;
and curing the high molecular polymer solution to form a high molecular polymer layer.
10. A display panel, characterized in that the display panel comprises an array substrate and the heat conducting film according to any one of claims 1-3, wherein the heat conducting film is attached to the array substrate.
11. The display panel of claim 10, wherein the layered graphene layer in the thermally conductive film is bonded to the array substrate.
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| CN108285547A (en) * | 2018-01-16 | 2018-07-17 | 湖南国盛石墨科技有限公司 | One kind is based on heat cure PET/ graphene heat conducting films and preparation method thereof |
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