CN112208173A - Thermal interface material and preparation method thereof - Google Patents

Thermal interface material and preparation method thereof Download PDF

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Publication number
CN112208173A
CN112208173A CN202011083769.6A CN202011083769A CN112208173A CN 112208173 A CN112208173 A CN 112208173A CN 202011083769 A CN202011083769 A CN 202011083769A CN 112208173 A CN112208173 A CN 112208173A
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thermal interface
interface material
release film
graphite
micro powder
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Inventor
曾小亮
孙蓉
许建斌
邓飞
辛陪陪
任琳琳
张晨旭
叶振强
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Shenzhen Cone Technology Co ltd
Shenzhen Institute of Advanced Electronic Materials
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Shenzhen Cone Technology Co ltd
Shenzhen Institute of Advanced Electronic Materials
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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    • B32B38/00—Ancillary operations in connection with laminating processes
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
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    • B32B2307/00—Properties of the layers or laminate
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Abstract

The invention belongs to the technical field of polymer composite materials, and discloses a preparation method of a thermal interface material, which comprises the following steps of firstly, dipping graphite micro powder in an acidic aqueous solution, washing and drying; step two, uniformly stirring thermosetting resin, an organic solvent, a coupling agent, a heat-conducting filler and the graphite micro powder obtained in the step one to obtain a mixture; step three, coating the mixture on a release film and drying; peeling off the release film, stacking the release film in multiple layers, and pressing to obtain a laminated composite; step five, cutting the laminated composite along the laminating direction; and step six, obtaining the thermal interface material after curing. According to the invention, a coating mode is adopted to realize the horizontal orientation of the graphite micropowder in the thermosetting resin, the horizontally oriented graphite micropowder/thermosetting resin is laminated layer by layer, the compression molding is carried out, a cutting mode is adopted to realize the orientation of the graphite micropowder in the thickness direction, and the thermal interface material with high thermal conductivity coefficient is prepared.

Description

Thermal interface material and preparation method thereof
Technical Field
The invention belongs to the technical field of polymer composite materials, and particularly relates to a thermal interface material and a preparation method thereof.
Background
With the coming of the 5G era, the problem of heat accumulation of electronic devices becomes more serious due to factors such as the increase of frequency bands and bandwidths, the multiplication of the number of networking equipment and antennas, the enhancement of folding screens and full-face screens, and the enhancement of wireless charging functions, and effective heat dissipation becomes a key problem restricting the development of modern electronic devices. The thermal interface material is widely applied to heat dissipation management of electronic devices, and is mainly used for filling gaps between the electronic devices and a radiator, reducing contact thermal resistance between the electronic devices and the radiator, and directly influencing the performance and the service life of the electronic devices. In a high-power chip packaging structure, a thermal interface material is mainly used for filling up micro gaps generated when a chip is contacted with a vapor chamber and the vapor chamber is contacted with a heat sink. The thermal interface material has several materials: heat-conducting adhesive, heat-conducting gel, high thermal grease and heat-conducting phase-change material. The basic composition of the material is a polymer matrix, such as epoxy resin or organic silicon resin, and a heat-conducting filler, such as aluminum, aluminum oxide, zinc oxide or metallic copper and silver. The existing commercial thermal interface material has the advantages of high elongation, high strain, good processability and large processing range. However, these materials have the disadvantage that the thermal conductivity is less than 10W/mK, and the requirement of high performance chip heat dissipation can not be met.
Carbon fiber is considered one of the fillers that are expected to produce high thermal conductivity thermal interface materials. Kojiro Uetani and the like adopt an electrostatic flocking technology to realize carbon fiber orientation, a carbon fiber/rubber ordered polymer composite material is prepared after rubber elastomer is injected, and when the content of the carbon fiber is 13.2 wt%, the thermal conductivity coefficient reaches 23.3W/mK (Advanced Materials,2014,26, 5857-. If the content of the carbon fiber can be further increased, the polymer composite material with higher thermal conductivity coefficient can be prepared very possibly. However, the orientation of higher carbon fiber content cannot be achieved by electrostatic flocking techniques. CN111500070A discloses a carbon fiber oriented thermal interface material and a preparation method thereof. The patent utilizes a vibration mode to ensure that one-dimensional linear chopped carbon fibers are directionally arranged along the thickness direction of the thermal interface material, so that the directional arrangement of the carbon fibers along the vibration direction is realized, the heat-conducting filler is directionally arranged in the material to form a longitudinal heat-conducting channel, the highest heat-conducting coefficient of the thermal interface material is 20.5W/mK, and the hardness (Shore C) is 40 +/-2. CN110229367A discloses an anisotropic insulating thermal conductive sheet, which comprises a thermal conductive sheet, wherein the raw materials for preparing the anisotropic insulating thermal conductive sheet at least comprise flexible polymer material, carbon fiber, spherical micro powder and flame retardant, and the carbon fiber is oriented in the thickness direction of the thermal conductive sheet. The highest thermal conductivity coefficient is 29.3W/mK, and the hardness (Shore C) is 42. However, the high thermal conductivity carbon fiber is expensive, and the prepared thermal conductivity coefficient still cannot break through 30.0W/mK. Graphene has a high thermal conductivity coefficient and is an excellent filler for preparing thermal interface materials. In recent years, researchers have achieved ordered arrangement of graphene in polymers by technical means. For example, researchers use high-quality graphene nanoplatelets and graphene oxide as raw Materials, prepare a high-orientation-degree graphene three-dimensional heat-conducting framework by adopting a hydrothermal reduction and directional freezing technology and combining a high-temperature graphitization process, and inject epoxy resin to prepare a thermal interface material (Acs Applied Materials & Interfaces,2018,10, 17383-. However, the preparation process is complex and the cost is high. Therefore, conventional thermal interface materials are rapidly reaching their limits in meeting the cooling requirements of high performance chips, such as artificial intelligence, 5G communications, machine learning, supercomputers, and the like. Therefore, the development of a thermal interface material with high thermal conductivity and good flexibility is a problem to be solved in the field.
Disclosure of Invention
In order to solve the problems of the background art, the present invention provides a thermal interface material and a method for preparing the same.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the first purpose of the invention is to provide a preparation method of a thermal interface material, which comprises the following steps:
step one, dipping graphite micro powder in an acidic aqueous solution to graft oxygen-containing groups on the surface of the graphite micro powder, washing the graphite micro powder to be neutral by using deionized water, and then drying the graphite micro powder for later use;
step two, uniformly stirring thermosetting resin, an organic solvent, a coupling agent, a heat-conducting filler and the graphite micro powder obtained in the step one to obtain a mixture;
step three, coating the mixture obtained in the step two on a release film in a coating mode, and then drying to remove the organic solvent to form a composite film on the release film;
step four, peeling the composite film obtained in the step three from the release film, then stacking the layers, and pressing to obtain a laminated composite;
step five, cutting the laminated composite obtained in the step four to a certain thickness along the laminating direction to obtain a composite;
and step six, curing the compound obtained by cutting in the step five at the temperature of 100 ℃ and 150 ℃ to obtain the thermal interface material.
In the technical scheme of the invention, the raw material components of the thermal interface material comprise, by weight, 1200 parts of graphite micropowder 100-.
In the technical scheme of the invention, the graphite micro powder is selected from at least one of natural graphite micro powder, crystalline flake graphite micro powder, expanded graphite micro powder and graphene micro powder; preferably, the particle size of the graphite micro powder is 5-200 μm, and the thickness is 50nm-30.0 μm.
In the technical scheme of the invention, the thermosetting resin is selected from at least one of epoxy resin, organic silicon resin, polyurethane, polyimide, polybutadiene resin, phenolic resin and unsaturated polyester resin; the coupling agent is at least one selected from gamma-aminopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, decyltrimethoxysilane, dodecyltrimethoxysilane and hexadecyltrimethoxysilane.
In the technical scheme of the invention, the organic solvent is at least one of acetone, butanone, toluene, xylene, N-dimethylformamide, tetrahydrofuran, N-hexane, cyclohexane and dimethyl sulfoxide.
In the technical scheme of the invention, the heat-conducting filler is selected from at least one of aluminum oxide, zinc oxide and aluminum powder; preferably, the heat conducting filler is spherical, and the particle size is 500nm-50.0 μm.
In the technical scheme of the invention, in the first step, the graphite micro powder is soaked in an acidic aqueous solution for 2-12 hours, the pH value of the acidic aqueous solution is 1.0-3.0, and the acidic aqueous solution is prepared by mixing at least one of sulfuric acid, hydrochloric acid, nitric acid and hydrogen peroxide with water; in the first step, the oxygen-containing group comprises hydroxyl, carboxyl and carbonyl, and the drying condition is that the drying is carried out for 6 to 12 hours at the temperature of between 50 and 100 ℃.
In the technical scheme of the invention, in the second step, the stirring condition is that the stirring is carried out for 2 to 8 hours at the temperature of between 25 and 70 ℃.
In the technical scheme of the invention, in the third step, the coating modes are bar coating and gravure coating.
In the technical scheme of the invention, in the third step, the release film is at least one of a PE release film, a PET release film, a PC release film, a PS isolation film, a PMMA release film, a BOPP release film and a TPX release film.
In the technical scheme of the invention, in the third step, the drying condition is to dry for 2-8 hours at 50-100 ℃.
In the technical scheme of the invention, in the fourth step, the multiple layers are overlapped until the thickness is 3cm-20cm, and the pressing condition is that the vacuum degree is 10-1-10-5Pa, the temperature of 100 ℃ and 150 ℃, and pressing for 30 minutes to 2 hours.
In the technical scheme of the invention, in the fifth step, at least one of a linear cutting mode, a band saw cutting mode and an ultrasonic cutting mode is adopted, and the cutting is carried out along the laminating direction until the thickness is 0.2mm-3.0 mm; preferably, in the sixth step, the curing time is 1 to 3 hours.
The second purpose of the invention is to provide a thermal interface material prepared by the preparation method.
Furthermore, the thermal interface material has a thermal conductivity of 10-50W/mK, a hardness of 40-80 (Shore 00) and a thickness of 0.2-3.0 mm.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, graphite micro powder and thermosetting resin are uniformly dispersed, then the horizontal orientation of the graphite micro powder in the thermosetting resin is realized by adopting a coating mode, the horizontally oriented graphite micro powder/thermosetting resin is further laminated layer by layer, then the pressing forming is carried out, the orientation of the graphite micro powder in the thickness direction is realized by adopting a cutting mode, and the thermal interface material with high heat conductivity coefficient is prepared. The preparation method is simple and easy to operate, and the obtained thermal interface material has the thermal conductivity coefficient of 10-50W/mK, the hardness of 40-80 (Shore 00) and the thickness of 0.2mm-3.0mm, and is a novel thermal interface material with large-scale industrial production prospect.
Drawings
FIG. 1 is a schematic view of a structural simulation of the thermal interface material of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings in the embodiments of the present invention, but it should be understood that the scope of the present invention is not limited by the specific embodiments.
Example 1
Step one, 100 parts of natural graphite micro powder with the size of 5.0 mu m and the thickness of 50nm are soaked in an acidic aqueous solution with the pH value of 1 prepared by concentrated sulfuric acid for 2 hours, so that hydroxyl and carboxyl are grafted on the surface of the natural graphite micro powder, and the natural graphite micro powder is washed to be neutral by deionized water and then is dried for 12 hours at the temperature of 50 ℃ for standby application.
And step two, adding 100 parts of the natural graphite micropowder obtained in the step one, 100 parts of epoxy resin, 100 parts of butanone organic solvent, 1 part of gamma-aminopropyltriethoxysilane and 50 parts of spherical alumina with the particle size of 20 microns into a stirring reaction kettle, and stirring for 8 hours at the temperature of 25 ℃.
And step three, coating the mixture obtained in the step two on a PE release film in a coating mode, and then drying for 2 hours at 100 ℃ to remove the butanone organic solvent to form a composite film on the release film.
Step four, stripping the composite film obtained in the step three from the release film, then stacking the composite film to the thickness of 3cm, and keeping the vacuum degree of 10-1Pa, at a temperature of 100 ℃ for 2 hours, to obtain a laminated composite.
And step five, cutting the laminated composite obtained in the step four to the thickness of 3.0mm along the laminating direction by adopting linear cutting.
And step six, curing the compound obtained by cutting in the step five at 150 ℃ for 3 hours to obtain the thermal interface material with the thickness of 3.0 mm.
Example 2
Step one, soaking 1200 parts of flake graphite micropowder with the size of 200 mu m and the thickness of 20.0 mu m in an acidic aqueous solution with the pH value of 2 prepared by concentrated nitric acid for 6 hours to graft hydroxyl and carboxyl on the surface of the graphite micropowder, washing the graphite micropowder to be neutral by adopting deionized water, and drying the graphite micropowder for 12 hours at the temperature of 100 ℃ for later use.
Step two, adding 1200 parts of the crystalline flake graphite micropowder obtained in the step one, 100 parts of organic silicon resin, 1200 parts of n-hexane, 5 parts of decyl trimethoxy silane and 50 parts of spherical alumina with the particle size of 500nm into a stirring reaction kettle, and stirring at the temperature of 70 ℃ for 8 hours.
Step three, coating the mixture obtained in the step two on a PET release film in a coating mode, and then drying for 2 hours at 50 ℃ to remove the n-hexane organic solvent and form a composite film on the release film;
step four, stripping the composite film obtained in the step three from the release film, then stacking the composite film to the thickness of 20cm, and keeping the vacuum degree of 10-5Pa, at a temperature of 150 ℃ for 30 minutes, to obtain a laminated composite.
And step five, cutting the laminated composite obtained in the step four to the thickness of 0.2mm by adopting an ultrasonic cutting mode along the laminating direction of a cutting machine.
And step six, curing the compound obtained by cutting in the step five at 100 ℃ for 1 hour to obtain the thermal interface material with the thickness of 0.2 mm.
Example 3
Step one, soaking 600 parts of expanded graphite micro powder with the size of 100 mu m and the thickness of 5.0 mu m in an acidic aqueous solution with the pH value of 2 prepared by concentrated hydrochloric acid for 6 hours to graft hydroxyl and carboxyl on the surface of the graphite micro powder, washing the graphite micro powder to be neutral by adopting deionized water, and drying the graphite micro powder for 4 hours at 100 ℃ for later use.
Step two, adding 600 parts of the crystalline flake graphite micropowder obtained in the step one, 100 parts of organic silicon resin, 600 parts of n-hexane, 3 parts of hexadecyl trimethoxy silane and 100 parts of spherical alumina with the particle size of 10 mu m into a stirring reaction kettle, and stirring for 4 hours at the temperature of 70 ℃.
Step three, coating the mixture obtained in the step two on a PET release film in a coating mode, and then drying for 6 hours at 50 ℃ to remove the n-hexane organic solvent to form a composite film on the release film;
step four, stripping the composite film obtained in the step three from the release film, then stacking the composite film to the thickness of 20cm, and keeping the vacuum degree of 10-5Pa, at a temperature of 120 ℃ for 1 hour, to obtain a laminated composite.
And step five, cutting the compound obtained in the step four to the thickness of 1.0mm by adopting an ultrasonic cutting mode along the lamination direction of a cutting machine.
And step six, curing the compound obtained by cutting in the step five at 120 ℃ for 1 hour to obtain the thermal interface material with the thickness of 1.0 mm.
Example 4
Step one, soaking 600 parts of flake graphite micropowder with the size of 100 microns and the thickness of 30.0 microns in acidic aqueous solution with the pH value of 3 prepared by hydrogen peroxide for 12 hours to graft hydroxyl and carboxyl on the surface of the graphite micropowder, washing the graphite micropowder to be neutral by adopting deionized water, and drying the graphite micropowder for 4 hours at 40 ℃ for later use.
Step two, adding 600 parts of the crystalline flake graphite micropowder obtained in the step one, 100 parts of thermosetting polyurethane, 600 parts of toluene, 2.5 parts of dodecyl trimethoxy silane and 40 parts of spherical alumina with the particle size of 50.0 mu m into a stirring reaction kettle, and stirring for 8 hours at the temperature of 70 ℃.
Step three, coating the mixture obtained in the step two on a PC release film in a coating mode, and then drying for 8 hours at 70 ℃ to remove the toluene organic solvent and form a composite film on the release film;
step four, stripping the composite film obtained in the step three from the release film, then stacking the composite film to a thickness of 10cm in a multilayer manner, and keeping the vacuum degree of 10-3Pa, at a temperature of 120 ℃ for 1 hour, to obtain a laminated composite.
And step five, cutting the compound obtained in the step four to a thickness of 1.0mm by adopting a band saw cutting mode along the laminating direction of the cutting machine.
And step six, curing the compound obtained by cutting in the step five at 100 ℃ for 1 hour to obtain the thermal interface material with the thickness of 1.0 mm.
Example 5
Step one, soaking 1200 parts of flake graphite micropowder with the size of 200 mu m and the thickness of 10.0 mu m in acidic aqueous solution with the pH value of 3 prepared by hydrogen peroxide for 12 hours to graft hydroxyl and carboxyl on the surface of the graphite micropowder, washing the graphite micropowder to be neutral by adopting deionized water, and drying the graphite micropowder for 4 hours at the temperature of 40 ℃ for later use.
Step two, adding 1200 parts of the crystalline flake graphite micropowder obtained in the step one, 100 parts of thermosetting polyurethane, 600 parts of toluene, 2.5 parts of dodecyl trimethoxy silane and 40 parts of spherical alumina with the particle size of 50.0 mu m into a stirring reaction kettle, and stirring for 8 hours at the temperature of 70 ℃.
Step three, coating the mixture obtained in the step two on a PET release film in a coating mode, and then drying for 8 hours at 70 ℃ to remove the toluene organic solvent and form a composite film on the release film;
step four, stripping the composite film obtained in the step three from the release film, then stacking the composite film to a thickness of 10cm in a multilayer manner, and keeping the vacuum degree of 10-3Pa, at a temperature of 120 ℃ for 1 hour, to obtain a laminated composite.
And step five, cutting the compound obtained in the step four to a thickness of 1.0mm by adopting a band saw cutting mode along the laminating direction of the cutting machine.
And step six, curing the compound obtained by cutting in the step five at 100 ℃ for 1 hour to obtain the thermal interface material with the thickness of 1.0 mm.
Comparative example 1
Comparative example 1 the same procedure as in example 1 was followed except that step five, i.e., the lamination cutting step was omitted, and the orientation of the graphite fine powder in the thickness direction could not be achieved, as in the formulation of the thermal interface material of example 1.
Taking example 1 as an example, the structural schematic diagram of the thermal interface material of the present invention is shown in fig. 1, the vertical black lines refer to the graphite micro powder, the gray areas refer to the thermosetting resin, and the prepared thermal interface material has a high thermal conductivity because the graphite micro powder is oriented and arranged in the thickness direction in the thermosetting resin.
First, experiment test
(1) And (3) testing the heat conductivity coefficient:
a standard test method for measuring heat conduction in a vertical direction by a steady state method is provided, wherein a test instrument is an LW-9389TIM resistance and conductivity measuring instrument, and the method comprises the following specific steps: placing the thermal interface composite material between the instrument bars, and establishing stable heat flow through the assembly; then monitoring the temperature in the strip at two or more points along its length; the temperature difference across the interface is calculated from the temperature readings obtained and used to determine the thermal conductivity of the interface.
(2) Hardness measurement
The hardness of the thermal interface material was measured using a shore 00 hardness meter.
(3) Thickness measurement
The thickness of the thermal interface material was measured using a micrometer screw.
The thermal conductivity and shore 00 hardness of the thermal interface materials provided in examples 1 to 5 and comparative example 1 were tested according to the above methods, and the thickness test results are shown in table 1:
Figure BDA0002719606390000101
Figure BDA0002719606390000111
finally, the present invention is illustrated by the above examples to describe the preparation method of the thermal interface material provided by the present invention, but the present invention is not limited to the above process steps, i.e. the present invention does not mean that the present invention must rely on the above process steps to be implemented. It will be apparent to those skilled in the art that any modification of the present invention, equivalent substitutions of selected materials and additions of auxiliary components, selection of specific modes and the like, which are within the scope and disclosure of the present invention, are contemplated by the present invention.
The above disclosure is only one specific embodiment of the present invention, which is provided for the purpose of illustrating the technical solutions of the present invention and not for limiting the same, and it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solutions of the present invention, and all of which are intended to be covered by the claims of the present invention.

Claims (10)

1. A preparation method of a thermal interface material is characterized by comprising the following steps:
step one, dipping graphite micro powder in an acidic aqueous solution to graft oxygen-containing groups on the surface of the graphite micro powder, washing the graphite micro powder to be neutral by using deionized water, and then drying the graphite micro powder for later use;
step two, uniformly stirring thermosetting resin, an organic solvent, a coupling agent, a heat-conducting filler and the graphite micro powder obtained in the step one to obtain a mixture;
step three, coating the mixture obtained in the step two on a release film in a coating mode, and then drying to remove the organic solvent to form a composite film on the release film;
step four, peeling the composite film obtained in the step three from the release film, then stacking the layers, and pressing to obtain a laminated composite;
step five, cutting the laminated composite obtained in the step four to a certain thickness along the laminating direction to obtain a composite;
and step six, curing the compound obtained by cutting in the step five at the temperature of 100 ℃ and 150 ℃ to obtain the thermal interface material.
2. The method for preparing a thermal interface material as claimed in claim 1, wherein the raw materials of the thermal interface material comprise, by weight, 1200 parts of graphite micropowder 100-.
3. The method for preparing a thermal interface material according to claim 2, wherein the graphite micropowder is at least one selected from the group consisting of natural graphite micropowder, flake graphite micropowder, expanded graphite micropowder, and graphene micropowder; preferably, the particle size of the graphite micro powder is 5-200 μm, and the thickness is 50nm-30.0 μm.
4. The method for preparing a thermal interface material according to claim 2, wherein the thermosetting resin is at least one selected from the group consisting of epoxy resin, silicone resin, polyurethane, polyimide, polybutadiene resin, phenol resin, and unsaturated polyester resin; the coupling agent is selected from at least one of gamma-aminopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, decyltrimethoxysilane, dodecyltrimethoxysilane and hexadecyltrimethoxysilane; the organic solvent is at least one of acetone, butanone, toluene, xylene, N-dimethylformamide, tetrahydrofuran, N-hexane, cyclohexane and dimethyl sulfoxide.
5. The method for preparing a thermal interface material according to claim 2, wherein the thermally conductive filler is at least one selected from the group consisting of alumina, zinc oxide, and aluminum powder; preferably, the heat conducting filler is spherical, and the particle size is 500nm-50.0 μm.
6. The method for preparing a thermal interface material according to claim 1, wherein in the first step, the graphite micro powder is immersed in the acidic aqueous solution for 2 to 12 hours, the pH value of the acidic aqueous solution is 1.0 to 3.0, and the acidic aqueous solution is prepared by mixing at least one of sulfuric acid, hydrochloric acid, nitric acid and hydrogen peroxide with water; in the first step, the oxygen-containing group comprises hydroxyl, carboxyl and carbonyl, and the drying condition is that the drying is carried out for 6 to 12 hours at the temperature of between 50 and 100 ℃.
7. A method for preparing a thermal interface material according to claim 1, wherein in the second step, the stirring is performed at a temperature of 25 to 70 ℃ for 2 to 8 hours; in the third step, the coating mode is bar coating and gravure coating; in the third step, the release film is at least one of a PE release film, a PET release film, a PC release film, a PS isolation film, a PMMA release film, a BOPP release film and a TPX release film; in the third step, the drying condition is that the drying is carried out for 2 to 8 hours at the temperature of between 50 and 100 ℃.
8. The method for producing a thermal interface material according to claim 1, wherein in the fourth step, the plurality of layers are stacked to a thickness of 3cm to 20cm, and the pressing is performed under a vacuum of 10 degrees-1-10-5Pa, the temperature of 100 ℃ and 150 ℃, and pressing for 30 minutes to 2 hours.
9. The method for preparing a thermal interface material according to claim 1, wherein in the fifth step, at least one of a linear cutting, a band saw cutting and an ultrasonic cutting is adopted to cut the thermal interface material to a thickness of 0.2mm to 3.0mm along the laminating direction; preferably, in the sixth step, the curing time is 1 to 3 hours.
10. A thermal interface material produced by the production method according to any one of claims 1 to 9.
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