TWI506286B - - Google Patents
Info
- Publication number
- TWI506286B TWI506286B TW103134598A TW103134598A TWI506286B TW I506286 B TWI506286 B TW I506286B TW 103134598 A TW103134598 A TW 103134598A TW 103134598 A TW103134598 A TW 103134598A TW I506286 B TWI506286 B TW I506286B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103134598A TW201614246A (en) | 2014-10-03 | 2014-10-03 | Temperature control device of crimping device of test equipment and temperature control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103134598A TW201614246A (en) | 2014-10-03 | 2014-10-03 | Temperature control device of crimping device of test equipment and temperature control method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI506286B true TWI506286B (en) | 2015-11-01 |
| TW201614246A TW201614246A (en) | 2016-04-16 |
Family
ID=55220065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103134598A TW201614246A (en) | 2014-10-03 | 2014-10-03 | Temperature control device of crimping device of test equipment and temperature control method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201614246A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI641842B (en) * | 2017-08-14 | 2018-11-21 | 鴻勁精密股份有限公司 | Crimp of electronic component crimping mechanism and test classification device |
| CN111583988A (en) * | 2019-02-15 | 2020-08-25 | 优匹益株式会社 | Apparatus for testing integrated circuit device and method thereof |
| TWI741491B (en) * | 2020-02-07 | 2021-10-01 | 孫偉志 | Processor heat dissipation module with 3-dimension heat dissipation, burning-in device, and method of using the same |
| TWI769627B (en) * | 2020-12-18 | 2022-07-01 | 鴻勁精密股份有限公司 | Temperature controlling unit and operating apparatus using the same |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI613448B (en) * | 2017-04-06 | 2018-02-01 | 致茂電子股份有限公司 | Device for pressing electronic component with different downward forces |
| TWI634336B (en) * | 2017-08-29 | 2018-09-01 | 京元電子股份有限公司 | Floating temperature sensor and semiconductor element test module using the same |
| TWI632843B (en) * | 2017-12-01 | 2018-08-11 | 微星科技股份有限公司 | Profile and identity recognizing device |
| TWI682270B (en) * | 2018-07-24 | 2020-01-11 | 致茂電子股份有限公司 | High/low-temperature testing apparatus and method |
| CN110749783B (en) * | 2018-07-24 | 2022-05-10 | 致茂电子股份有限公司 | High-low temperature test equipment and test method thereof |
| CN113447748B (en) * | 2021-06-29 | 2023-03-24 | 贵州航天电子科技有限公司 | Device for high and low temperature test of electronic product |
| TWI827473B (en) * | 2023-02-22 | 2023-12-21 | 鴻勁精密股份有限公司 | Processing machine of electronic component |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6034978A (en) * | 1999-05-12 | 2000-03-07 | Cymer, Inc. | Gas discharge laser with gas temperature control |
| TWI247399B (en) * | 2004-06-01 | 2006-01-11 | Via Tech Inc | Package and temperature-control method of electronic device with active temperature control |
| CN201152650Y (en) * | 2007-12-18 | 2008-11-19 | 华南理工大学 | Cold-hot transformation apparatus having solid multi-lattice |
| TWM376907U (en) * | 2009-09-29 | 2010-03-21 | Shen-Quan Zheng | LED lamp with ceramic thermoelectric heat-dissipation substrate |
| TWI368651B (en) * | 2008-10-24 | 2012-07-21 | Quanta Comp Inc | Temperature variation apparatus |
-
2014
- 2014-10-03 TW TW103134598A patent/TW201614246A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6034978A (en) * | 1999-05-12 | 2000-03-07 | Cymer, Inc. | Gas discharge laser with gas temperature control |
| TWI247399B (en) * | 2004-06-01 | 2006-01-11 | Via Tech Inc | Package and temperature-control method of electronic device with active temperature control |
| CN201152650Y (en) * | 2007-12-18 | 2008-11-19 | 华南理工大学 | Cold-hot transformation apparatus having solid multi-lattice |
| TWI368651B (en) * | 2008-10-24 | 2012-07-21 | Quanta Comp Inc | Temperature variation apparatus |
| TWM376907U (en) * | 2009-09-29 | 2010-03-21 | Shen-Quan Zheng | LED lamp with ceramic thermoelectric heat-dissipation substrate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI641842B (en) * | 2017-08-14 | 2018-11-21 | 鴻勁精密股份有限公司 | Crimp of electronic component crimping mechanism and test classification device |
| CN111583988A (en) * | 2019-02-15 | 2020-08-25 | 优匹益株式会社 | Apparatus for testing integrated circuit device and method thereof |
| TWI741491B (en) * | 2020-02-07 | 2021-10-01 | 孫偉志 | Processor heat dissipation module with 3-dimension heat dissipation, burning-in device, and method of using the same |
| TWI769627B (en) * | 2020-12-18 | 2022-07-01 | 鴻勁精密股份有限公司 | Temperature controlling unit and operating apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201614246A (en) | 2016-04-16 |