TWI634336B - Floating temperature sensor and semiconductor element test module using the same - Google Patents

Abstract

The floating temperature sensing device of the present invention comprises: a hollow sleeve, a floating head, A temperature sensor, a guard ring, a snap fastener and an elastic member. The hollow sleeve has a first end and a second end, the first end has a stop portion; the floating head has a circular convex portion corresponding to the stop portion, and the floating head is engaged with The hollow sleeve is partially protruded from the first end; the temperature sensor comprises a temperature sensor body connected to the signal line, and the temperature sensor body is disposed in the floating head; the protection ring is disposed in the hollow sleeve The latching member is fastened to the second end of the hollow sleeve; the elastic member is disposed in the hollow sleeve and is sandwiched between the guard ring and the latching member. The floating temperature sensing device of the present invention provides a pre-stress against the floating head by the elastic member, and the circular convex portion of the floating head ensures that the floating head can closely abut the base of the semiconductor component to be tested, which can be accurately Measure the ambient temperature change of the pedestal.

Description

Floating temperature sensing device and semiconductor component test module using the same

The invention relates to a floating temperature sensing device and a semiconductor component testing module using the same, in particular to a floating temperature sensing device suitable for accurately measuring the temperature of the base position and a semiconductor component testing module using the same.

At present, some semiconductor components such as electronic components or chip packages are often mounted in a circuit composed of a plurality of main circuit components to form a continuous and complete circuit. Among them, in order to ensure the reliability of the semiconductor component when it is used, high and low temperature tests are performed before it is installed or used. That is, the long-term high and low temperature operation of the semiconductor element can accelerate the failure of the semiconductor component which is already defective, and the defective semiconductor element can be screened and eliminated.

At present, in the temperature sensing device for high and low temperature testing of semiconductor components, if there is a tilt phenomenon between the temperature sensor that measures the temperature and the pedestal on which the semiconductor component to be tested is placed, an accurate measurement base may be generated. The temperature of the seat is missing. In addition, the temperature sensing device of the existing temperature sensing device that measures the temperature is directly attached to the semiconductor component to be tested. The pedestal placed on the pedestal does not closely abut the pedestal, which is also difficult to accurately measure the lack of temperature of the susceptor, which is not ideal and there is room for improvement.

Moreover, the semiconductor component test module for measuring the temperature of the semiconductor component to be tested is provided with a plurality of temperature sensing devices, and if the temperature sensing device is to be replaced, the base, the carrier, and the needle are removed one by one. The seat, the needle measuring board, the needle measuring board fixing seat and other components can only replace the temperature sensing device set up on it, and the maintenance and replacement time steps are very lengthy, resulting in an increase in personnel time and cost, and it is not very satisfactory, and there is still improvement. Space.

In view of this, in the spirit of active invention and creation, the present invention considers a "floating temperature sensing device and a semiconductor component testing module using the same" which can solve the above problems, and has completed the present invention after several research experiments.

To achieve the above objective, the floating temperature sensing device of the present invention comprises: a hollow sleeve, a floating head, a temperature sensor, a guard ring, a snap member and an elastic member. The hollow sleeve has a first end and a second end, the first end has a stop portion; the floating head has a circular convex portion corresponding to the stop portion, and the floating head is engaged with The hollow sleeve is partially protruded from the first end; the temperature sensor comprises a temperature sensor body connected to the signal line, and the temperature sensor body is disposed in the floating head; the protection ring is disposed in the hollow sleeve And being located on the floating head; the fastening member is fastened to the second end of the hollow sleeve; and the elastic member is disposed in the hollow sleeve and is sandwiched between the protection ring and the buckle member, the elastic member provides a top In response to the pre-load of the floating head, the signal line is accommodated in the protective ring and the elastic member, and passes through the second end.

Thereby, the floating temperature sensing device of the present invention can provide a pre-stress against the floating head by the elastic member, and has a vertical buffering stroke of 3.0 mm on the longitudinal axis, and the circular convex portion of the floating head can make the floating head conform The phenomenon of insufficient level and tilt of the semiconductor component is measured to ensure that the floating head can closely abut the pedestal on which the semiconductor component to be tested is placed, so as to accurately measure the ambient temperature change of the susceptor. In addition, it also has the advantages of easy manufacture, small size, easy installation in a small space, and low manufacturing cost.

The transverse section of the hollow sleeve and the floating head may both be circular, and the hollow sleeve may intersect the longitudinal central axis of the floating head by between ±5°, thereby allowing the floating head to be tightly pressed against the top to be tested. A susceptor on which the semiconductor component is placed.

A fixing glue may be disposed in the protection ring to fix the signal line of the temperature sensor.

The second end of the hollow sleeve may have a positioning rib, and the latching member has a positioning groove corresponding to the positioning rib, and the hollow sleeve and the snap member can be positioned by the rib. Engaged with the positioning groove to fix each other.

In addition, the semiconductor component testing module of the present invention comprises: a base, a carrier, a needle measuring socket, a needle measuring board, a needle measuring board fixing seat and a plurality of floating temperature sensing devices, the bearing seat is disposed on the base a plurality of test slots and a plurality of receiving holes are recessed in the seat, and the plurality of test slots are used for accommodating a plurality of semiconductor components to be tested, and the needle measuring socket, the needle measuring board and the needle measuring board fixing seat are sequentially disposed on the bearing seat; A floating temperature sensing device has a hollow sleeve, a floating head, a temperature sensor, a guard ring, a snap member and an elastic member, the hollow sleeve has a first end and a second end, and the first One end has a stop portion, and the floating head has a circular convex portion corresponding to the stop portion, and the floating head is engaged in the hollow sleeve and partially protrudes The first end of the temperature sensing device includes a temperature sensing device body and a signal line. The temperature sensor body is disposed in the floating head, and the protection ring is disposed in the hollow sleeve and located on the floating head. The elastic member is disposed in the hollow sleeve and is disposed between the protection ring and the buckle member, and the signal wire is received in the protection ring and the elastic member, and is worn The second end; wherein each floating temperature sensing device passes through the needle measuring plate and the needle measuring seat, and each floating head penetrates the receiving hole of the bearing seat and abuts against the base.

Therefore, the semiconductor component test module of the present invention can provide a pre-stress against the floating head by the elastic member, and the circular convex portion of the floating head can make the floating head conform to the level of the semiconductor component to be tested. Uncertainty such as tilting, ensuring that the bottom of the floating head can closely abut the pedestal on which the semiconductor component to be tested is placed, in addition to measuring the ambient temperature change of the semiconductor component placement pedestal, and feeding back the measurement signal to The related heating control module provides a more accurate ambient temperature. The floating head of the floating temperature sensing device can also be used as a positioning member, which is fastened to the receiving hole of the bearing seat to provide a probe for the needle measuring head and accurately positioned to the test slot. Semiconductor components inside. And only need to disassemble the needle measuring board and the needle measuring board fixing seat, the floating temperature sensing device disposed thereon can be replaced, the replacement step is simple, the replacement time can be saved, and the personnel time and cost can be reduced.

The second end of the hollow sleeve of the floating temperature sensing device of the semiconductor component test module may have a positioning rib, and the latching member of the floating temperature sensing device has a positioning groove corresponding to the positioning rib The hollow sleeve and the snap member can be engaged with each other by the positioning rib and the positioning groove.

The latching member of the floating temperature sensing device of the semiconductor component test module may further have a ring flange, and the ring flange is fastened to the upper surface of the needle measuring plate, so that the whole floating temperature sensing device can be engaged with the needle measuring plate on.

The elastic member of the floating temperature sensing device may be a spring.

1‧‧‧Floating temperature sensing device

10‧‧‧ hollow casing

101‧‧‧ first end

102‧‧‧ second end

103‧‧‧stop

104‧‧‧ positioning ribs

11‧‧‧Floating head

111‧‧‧Circular convex

12‧‧‧Temperature Sensor

121‧‧‧Temperature Sensor Body

122‧‧‧Signal line

13‧‧‧Protection ring

131‧‧‧Fixed adhesive

14‧‧‧Card fasteners

141‧‧‧ positioning groove

142‧‧‧ ring flange

15‧‧‧Flexible parts

20‧‧‧ Pedestal

30‧‧‧Hosting

31‧‧‧ accommodating holes

32‧‧‧Test slot

36‧‧‧Semiconductor components

40‧‧‧ needle tester

42‧‧‧Probe

50‧‧‧needle test board

60‧‧‧Needle plate holder

1 is an exploded view of a floating temperature sensing device in accordance with a preferred embodiment of the present invention.

2 is a combination diagram of a floating temperature sensing device in accordance with a preferred embodiment of the present invention.

3 is a cross-sectional view of a floating temperature sensing device in accordance with a preferred embodiment of the present invention.

4 is a cross-sectional view showing a semiconductor component test module in accordance with a preferred embodiment of the present invention.

Figure 5 is a partial enlarged view of Figure 4.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are respectively an exploded view, a combined view and a cross-sectional view of a floating temperature sensing device according to a preferred embodiment of the present invention. The floating temperature sensing device 1 of the present embodiment includes a hollow sleeve 10, a floating head 11, a temperature sensor 12, a guard ring 13, a latching member 14, and an elastic member 15. The hollow sleeve 10 has a first end 101 and a second end 102, and the first end 101 has a stop portion 103 therein; the floating head 11 has a corresponding position with the stop portion 103 of the hollow sleeve 10. The circular protrusion 111 is engaged, and the floating head 11 is engaged in the hollow sleeve 10 and partially protrudes from the first end 101.

As shown in FIG. 3, the temperature sensor 12 has a temperature sensor body 121 and a signal line 122 connected thereto. The temperature sensor body 121 is disposed in the floating head 11. The protection ring 13 is disposed in the hollow sleeve 10 and located at The latching member 14 is fastened to the second end 102 of the hollow sleeve 10 . In addition, the elastic member 15 is disposed in the hollow sleeve 10 and clamped Provided between the guard ring 13 and the latching member 14, the elastic member 15 can provide a pre-stress against the floating head 11, and has a vertical buffering stroke of 3.0 mm on the longitudinal axis. In the present embodiment, the elastic member 15 is a spring.

In addition, the signal line 122 of the temperature sensor 12 is received in the guard ring 13 and the elastic member 15 and passes through the second end 102 of the hollow sleeve 10. A fixing glue 131 is disposed in the protection ring 13 , and the fixing glue 131 can fix the signal line 122 without shaking. The second end 102 of the hollow sleeve 10 has a positioning rib 104, and the latching member 14 has a positioning groove 141 corresponding to the positioning rib 104. In this embodiment, the latching member 14 has two positioning grooves 141, and the second end 102 of the hollow sleeve 10 has two positioning ribs 104 corresponding to each other. Thereby, both the hollow sleeve 10 and the snap member 14 can be engaged with each other by the positioning rib 104 and the positioning groove 141.

In the floating temperature sensing device 1 of the embodiment, the transverse section of the hollow sleeve 10 and the floating head 11 are both circular, and by interlocking with each other, the hollow sleeve 10 intersects with the longitudinal central axis of the floating head 11 Between ±5°, a pre-stress against the floating head 11 is provided by the elastic member 15, and the circular convex portion 111 of the floating head 11 can make the floating head 11 conform to the level of the semiconductor component to be tested. The phenomenon of tilting and the like ensures that the bottom of the floating head 11 can closely abut the pedestal on which the semiconductor component to be tested is placed, so as to accurately measure the ambient temperature change of the susceptor. In addition, the floating temperature sensing device 1 of the present embodiment also has the advantages of easy manufacture, small size, easy installation in a small space, and low manufacturing cost.

Please refer to FIG. 4 and FIG. 5 , which are respectively a cross-sectional view of a semiconductor component test module according to a preferred embodiment of the present invention and a partial enlarged view thereof. Please refer to FIG. 1 and FIG. 3 together. The semiconductor component testing module of the embodiment includes: a base 20, a carrier 30, a needle measuring block 40, A needle measuring plate 50, a plurality of probes 42, a needle measuring plate holder 60 and a plurality of floating temperature sensing devices 1. The carrier 30 is disposed on the pedestal 20 and is recessed with a plurality of test slots 32 and a plurality of accommodating holes 31. The plurality of test slots 32 can be used to accommodate a plurality of semiconductor components 36 to be tested; The seat 40, the needle measuring block 40, the needle measuring plate 50 and the needle measuring plate fixing seat 60 are sequentially disposed on the carrier 30.

Each floating temperature sensing device 1 has a hollow sleeve 10, a floating head 11, a temperature sensor 12, a guard ring 13, a snap member 14, and an elastic member 15. The hollow sleeve 10 has a first end 101 and a second end 102, and the first end 101 has a stop portion 103. The floating head 11 has a circular convex shape corresponding to the stop portion 103. The floating head 11 is engaged with the hollow sleeve 10 and partially protrudes from the first end 101; the temperature sensor 12 includes a temperature sensor body 121 and a signal line 122 connected thereto, and the temperature sensor body 121 is disposed in the floating head 11; the protection ring 13 is disposed in the hollow sleeve 10 and located on the floating head 11; the fastening member 14 is fastened to the second end 102 of the hollow sleeve 10; the elastic member 15 is disposed on the hollow sleeve The tube 10 is disposed between the guard ring 13 and the latching member 14; the signal line 122 is received in the guard ring 13 and the elastic member 15 and passes through the second end 102; The temperature sensing device 1 is provided with a needle measuring plate 50 and a needle measuring block 40 , and each floating head 11 penetrates the receiving hole 31 of the carrier 30 and abuts against the base 20 .

In this embodiment, the latching member 14 has a ring flange 142 that is fastened to the upper surface of the needle measuring plate 50, whereby the floating temperature sensing device 1 can be fastened and fixed to the needle measuring plate 50. .

The semiconductor component test module of the embodiment has a circular cross section of the hollow sleeve 10 and the floating head 11 of the floating temperature sensing device 1 thereon, and the hollow sleeve 10 and the float The longitudinal center axis of the moving head 11 intersects between ±5°, and the elastic member 15 provides a pre-stress against the floating head 11 to ensure that the floating head 11 can closely abut the base 20 for accurate measurement The ambient temperature of the susceptor 20 is changed, and the actual temperature to which the semiconductor component 36 to be tested is subjected can be accurately measured. On the other hand, the floating head 11 of the floating temperature sensing device 1 can also be used as a positioning member to be fastened to the receiving hole 31 of the carrier 30 to provide the probe 42 of the needle measuring device 40 for precise positioning into the test slot 32. Semiconductor component 36. In addition, the floating temperature sensing device 1 disposed thereon can be replaced only by disassembling the needle measuring plate 50 and the needle measuring plate fixing seat 60, and the replacement step is simple, which can save replacement time and reduce personnel time and cost.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

Claims (7)

A semiconductor component testing module includes: a base, a carrier, a needle measuring socket, a needle measuring board, a plurality of probes, a needle measuring board fixing seat and a plurality of floating temperature sensing devices, wherein the bearing seat is disposed at the a plurality of test slots and a plurality of accommodating holes are recessed on the pedestal, the plurality of test slots are for accommodating a plurality of semiconductor components to be tested, and the plurality of probes are disposed on the needle pedestal, the needle pedestal, the needle The measuring board and the measuring board fixing seat are sequentially disposed on the carrying seat; each floating temperature sensing device has a hollow sleeve, a floating head, a temperature sensor, a protection ring, a fastening component and an elastic The hollow sleeve has a first end and a second end, and the first end has a stop portion, and the floating head has a circular convex portion corresponding to the stop portion, and the floating portion The temperature sensor includes a temperature sensor body and a signal line, and the temperature sensor body is disposed in the floating head, and the temperature sensor is disposed in the hollow sleeve. a guard ring is disposed in the hollow sleeve and located on the floating head The latching member is fastened to the second end of the hollow sleeve, and the elastic member is disposed in the hollow sleeve and is disposed between the protection ring and the latching member, wherein the signal line is received in the The protective ring and the elastic member are passed through the second end; wherein each floating temperature sensing device passes through the needle measuring plate and the needle measuring seat, and the floating head penetrates the bearing seat The hole is received and abuts against the base. The semiconductor component test module of claim 1, wherein the hollow sleeve and the floating head have a circular cross section, and the hollow sleeve intersects with a longitudinal central axis of the floating head. Between ±5°, the resilient member provides a pre-stress against the floating head to ensure that the floating head can abut against the base. The semiconductor component test module of claim 1, wherein the second end has a positioning rib, and the latching member has a positioning groove corresponding to the positioning rib. The semiconductor component test module of claim 1, wherein the snap member has a ring flange that is engageable with an upper surface of the needle test panel. The semiconductor component test module of claim 1, wherein the protection ring is provided with a fixing glue for positioning the signal line. The semiconductor component test module of claim 1, wherein the elastic component is a spring. The semiconductor component test module of claim 1, wherein the floating head has a function of a positioning member for accurately positioning the plurality of semiconductor components in the test slot.