TWI503889B - - Google Patents
Info
- Publication number
- TWI503889B TWI503889B TW101110047A TW101110047A TWI503889B TW I503889 B TWI503889 B TW I503889B TW 101110047 A TW101110047 A TW 101110047A TW 101110047 A TW101110047 A TW 101110047A TW I503889 B TWI503889 B TW I503889B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210022073.1A CN103227109B (en) | 2012-01-31 | 2012-01-31 | A kind of organic matter layer lithographic method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201332018A TW201332018A (en) | 2013-08-01 |
| TWI503889B true TWI503889B (en) | 2015-10-11 |
Family
ID=48837506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101110047A TW201332018A (en) | 2012-01-31 | 2012-03-23 | Etching method for organic substance layer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103227109B (en) |
| TW (1) | TW201332018A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211866A (en) * | 2019-05-20 | 2019-09-06 | 深圳市华星光电半导体显示技术有限公司 | A kind of method for etching plasma |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200929363A (en) * | 2007-12-24 | 2009-07-01 | Hynix Semiconductor Inc | Method for fabricating semiconductor device |
| CN101615579A (en) * | 2009-07-29 | 2009-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of semiconductor plasma etching technology |
| CN101866848A (en) * | 2010-04-29 | 2010-10-20 | 中微半导体设备(上海)有限公司 | Plasma etching method for etching organic matter layer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100327413A1 (en) * | 2007-05-03 | 2010-12-30 | Lam Research Corporation | Hardmask open and etch profile control with hardmask open |
| US8394722B2 (en) * | 2008-11-03 | 2013-03-12 | Lam Research Corporation | Bi-layer, tri-layer mask CD control |
| US9373521B2 (en) * | 2010-02-24 | 2016-06-21 | Tokyo Electron Limited | Etching processing method |
-
2012
- 2012-01-31 CN CN201210022073.1A patent/CN103227109B/en active Active
- 2012-03-23 TW TW101110047A patent/TW201332018A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200929363A (en) * | 2007-12-24 | 2009-07-01 | Hynix Semiconductor Inc | Method for fabricating semiconductor device |
| CN101615579A (en) * | 2009-07-29 | 2009-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of semiconductor plasma etching technology |
| CN101866848A (en) * | 2010-04-29 | 2010-10-20 | 中微半导体设备(上海)有限公司 | Plasma etching method for etching organic matter layer |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201332018A (en) | 2013-08-01 |
| CN103227109A (en) | 2013-07-31 |
| CN103227109B (en) | 2015-11-25 |