TWI501720B - Heat dissipating module - Google Patents

Heat dissipating module Download PDF

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Publication number
TWI501720B
TWI501720B TW102122797A TW102122797A TWI501720B TW I501720 B TWI501720 B TW I501720B TW 102122797 A TW102122797 A TW 102122797A TW 102122797 A TW102122797 A TW 102122797A TW I501720 B TWI501720 B TW I501720B
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Taiwan
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heat dissipation
swinging member
actuator
dissipation module
heat
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TW102122797A
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Chinese (zh)
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TW201501629A (en
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Yi Lun Cheng
Chih Kai Yang
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Inventec Corp
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Description

散熱模組Thermal module

本發明係關於一種散熱模組,特別是一種無扇葉的散熱模組。The invention relates to a heat dissipation module, in particular to a fanless heat dissipation module.

電腦系統(如個人電腦、可攜式電腦、筆記型電腦、伺服器主機等)運轉時會對應產生廢熱。這些廢熱會隨著電腦系統的運轉時間與運轉效能而增減。當這些廢熱逐漸累積於電腦系統內時,將會導致電腦系統的內部溫度升高而影響電腦系統的效能發揮,甚或會導致電腦系統當機。因此,電腦系統內一般會配置散熱裝置來移除電腦系統運轉時產生的廢熱。Computer systems (such as personal computers, portable computers, notebook computers, server hosts, etc.) will generate waste heat when they are running. These waste heat will increase or decrease with the running time and running efficiency of the computer system. When these waste heats are gradually accumulated in the computer system, it will cause the internal temperature of the computer system to rise and affect the performance of the computer system, and may even cause the computer system to crash. Therefore, a heat sink is generally disposed in the computer system to remove waste heat generated when the computer system is in operation.

散熱裝置一般分為氣冷式或液冷式。氣冷式散熱裝置例如為軸流風扇。液冷式散熱裝置例如包含液流管及幫浦。而液冷式散熱裝置的成本一般係高於氣冷式散熱裝置的成本,因此,基於成本考量,電腦系統一般係搭配成本較低的氣冷式散熱裝置。軸流風扇的成本雖然較低,但若風扇老舊或設計不當時,風扇運轉時將會導致風扇之轉軸與軸套之間發生摩擦與晃動。前述摩擦與晃動現象不僅使軸流風扇產生噪音,且會加速軸流風扇之轉軸疲勞而縮短軸流風扇的使用壽命。The heat sink is generally classified into air-cooled or liquid-cooled. The air-cooled heat sink is, for example, an axial fan. The liquid-cooled heat sink includes, for example, a liquid flow tube and a pump. The cost of the liquid-cooled heat sink is generally higher than the cost of the air-cooled heat sink. Therefore, based on cost considerations, the computer system is generally equipped with a lower cost air-cooled heat sink. Although the cost of the axial fan is low, if the fan is old or not designed properly, the fan will run and cause friction and sway between the shaft and the sleeve. The aforementioned friction and sloshing phenomenon not only causes noise of the axial flow fan, but also accelerates the shaft shaft fatigue of the axial flow fan and shortens the service life of the axial flow fan.

本發明在於提供一種散熱模組,藉以改善軸流風扇因轉軸 與軸套之間發生摩擦與晃動而產生噪音及縮短軸流風扇的使用壽命的問題。The invention provides a heat dissipation module for improving an axial flow fan due to a rotating shaft Friction and sloshing with the bushing creates noise and shortens the service life of the axial fan.

本發明所揭露的散熱模組,用以設於一電子裝置內之至少二固定部,包含一致動器、一擺動件及一振幅驅動器。致動器具有一第一端及一第二端。第一端連接於二固定部之一。擺動件具有一第三端及一第四端。擺動件之第三端連接於致動器之第二端。擺動件之第四端連接於二固定部之另一。振幅驅動器電性連接於致動器,並用以驅使致動器帶動擺動件相對二固定部反覆擺動而產生一氣流。The heat dissipation module disclosed in the present invention is configured to be disposed in at least two fixing portions of an electronic device, and includes an actuator, a swinging member and an amplitude driver. The actuator has a first end and a second end. The first end is connected to one of the two fixing portions. The swinging member has a third end and a fourth end. The third end of the oscillating member is coupled to the second end of the actuator. The fourth end of the swinging member is connected to the other of the two fixing portions. The amplitude driver is electrically connected to the actuator, and is configured to drive the actuator to drive the swinging member to swing back relative to the two fixing portions to generate an air flow.

根據上述本發明所揭露的散熱模組,利用致動件來帶動擺動件反覆擺動來產生氣流,因無需透過扇葉及轉軸,故能夠改善習知軸流風扇因轉軸與軸套之間的摩擦與晃動而產生噪音及縮短軸流風扇的使用壽命的問題。According to the heat dissipating module disclosed in the present invention, the actuating member is used to drive the swinging member to swing and swing to generate airflow. Since the fan blade and the rotating shaft need not be transmitted, the friction between the rotating shaft and the bushing can be improved by the conventional axial fan. The problem of noise and shaking and shortening the service life of the axial fan.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

10‧‧‧散熱模組10‧‧‧ Thermal Module

20‧‧‧電子裝置20‧‧‧Electronic devices

21‧‧‧固定部21‧‧‧ Fixed Department

22‧‧‧第一固定部22‧‧‧First Fixed Department

24‧‧‧第二固定部24‧‧‧Second fixed department

26‧‧‧熱源26‧‧‧heat source

100‧‧‧致動部100‧‧‧Acoustic Department

110‧‧‧第一端110‧‧‧ first end

120‧‧‧第二端120‧‧‧second end

130‧‧‧撓性金屬件130‧‧‧Flexible metal parts

140‧‧‧電磁元件140‧‧‧Electromagnetic components

150‧‧‧定子150‧‧‧stator

160‧‧‧轉子160‧‧‧Rotor

200‧‧‧擺動件200‧‧‧Swinger

210‧‧‧第三端210‧‧‧ third end

220‧‧‧第四端220‧‧‧ fourth end

300‧‧‧振幅驅動器300‧‧‧Amplitude driver

400‧‧‧振幅調變器400‧‧‧Amplitude Modulator

500‧‧‧散熱器500‧‧‧heatsink

510‧‧‧散熱鰭片510‧‧‧heat fins

600‧‧‧連接線600‧‧‧Connecting line

第1圖為根據本發明第一實施例的散熱模組設於電子裝置內的平面示意圖。FIG. 1 is a schematic plan view showing a heat dissipating module according to a first embodiment of the present invention disposed in an electronic device.

第2圖為第1圖之散熱模組的平面示意圖。Figure 2 is a plan view of the heat dissipation module of Figure 1.

第3圖為第1圖之散熱模組設於電子裝置內之使用示意圖。FIG. 3 is a schematic view showing the use of the heat dissipation module of FIG. 1 in an electronic device.

第4圖為根據本發明第二實施例的散熱模組的平面示意圖。4 is a plan view showing a heat dissipation module according to a second embodiment of the present invention.

第5圖為根據本發明第三實施例的散熱模組的平面示意圖。Fig. 5 is a plan view showing a heat dissipation module according to a third embodiment of the present invention.

第6圖為根據本發明第四實施例的致動器與擺動件的上視示意圖。Fig. 6 is a top plan view showing an actuator and a swinging member according to a fourth embodiment of the present invention.

第7圖為根據本發明第五實施例的致動器與擺動件的上視示意圖。Fig. 7 is a top plan view showing an actuator and a swinging member according to a fifth embodiment of the present invention.

第8圖為根據本發明第六實施例的致動器與擺動件的上視示意圖。Fig. 8 is a top plan view showing an actuator and a swinging member according to a sixth embodiment of the present invention.

第9為根據本發明第七實施例之散熱模組的平面示意圖。9 is a schematic plan view of a heat dissipation module according to a seventh embodiment of the present invention.

第10為根據本發明第八實施例之散熱模組的平面示意圖。10 is a schematic plan view of a heat dissipation module according to an eighth embodiment of the present invention.

第11為根據本發明第九實施例之散熱模組的平面示意圖。11 is a schematic plan view of a heat dissipation module according to a ninth embodiment of the present invention.

請參照第1圖至第2圖,第1圖為根據本發明第一實施例的散熱模組設於電子裝置內的平面示意圖,第2圖為第1圖之散熱模組的平面示意圖。上述之電子裝置20例如為筆記型電腦、桌上型電腦或平板電腦,並不以此為限。電子裝置20具有一第一固定部22及一第二固定部24。本實施例之第一固定部22及第二固定部24皆位於電子裝置20之外殼上,但並不以此為限。Please refer to FIG. 1 to FIG. 2 . FIG. 1 is a schematic plan view showing a heat dissipating module according to a first embodiment of the present invention, and FIG. 2 is a plan view of the heat dissipating module of FIG. 1 . The electronic device 20 described above is, for example, a notebook computer, a desktop computer, or a tablet computer, and is not limited thereto. The electronic device 20 has a first fixing portion 22 and a second fixing portion 24. The first fixing portion 22 and the second fixing portion 24 of the embodiment are all located on the outer casing of the electronic device 20, but are not limited thereto.

本實施例之散熱模組10包含一致動器100、一擺動件200及一振幅驅動器300。The heat dissipation module 10 of the embodiment includes an actuator 100, a swinging member 200, and an amplitude driver 300.

致動器100具有相對的一第一端110及一第二端120。致動器100之第一端110設於第一固定部22。本實施例之致動器100係以一壓電片為例,也就是說,第一端110及第二端120分別位於壓電片之相對兩端。The actuator 100 has a first end 110 and a second end 120 opposite to each other. The first end 110 of the actuator 100 is disposed on the first fixing portion 22. The actuator 100 of this embodiment is exemplified by a piezoelectric sheet, that is, the first end 110 and the second end 120 are respectively located at opposite ends of the piezoelectric sheet.

擺動件200具有一第三端210及一第四端220。擺動件200之第三端210連接於致動器100之第二端120。擺動件200之第四端220連接於第二固定部24。本實施例之擺動件200為線材,但並不以此為限。The swinging member 200 has a third end 210 and a fourth end 220. The third end 210 of the oscillating member 200 is coupled to the second end 120 of the actuator 100. The fourth end 220 of the swinging member 200 is coupled to the second fixing portion 24. The swinging member 200 of the embodiment is a wire, but is not limited thereto.

振幅驅動器300電性連接於致動器100。本實施例之振幅驅動器300為一電源供應器。振幅驅動器300(電源供應器)用以輸出電壓或電流至擺動件200(壓電片),壓電片受到電壓的驅動後,其第二端120會反覆擺動,以帶動擺動件200相對第一固定部22與第二固定部24反覆擺動。The amplitude driver 300 is electrically connected to the actuator 100. The amplitude driver 300 of this embodiment is a power supply. The amplitude driver 300 (power supply) is configured to output a voltage or current to the swinging member 200 (piezoelectric sheet). After the piezoelectric sheet is driven by the voltage, the second end 120 of the piezoelectric sheet is repeatedly oscillated to drive the swinging member 200 to be relatively first. The fixing portion 22 and the second fixing portion 24 swing back and forth.

在本實施例及其他實施例中,散熱模組10更包含一振幅調變器400。振幅調變器400電性連接於振幅驅動器300。振幅調變器400用以調整振幅驅動器300之振幅頻率或振幅強度。In this embodiment and other embodiments, the heat dissipation module 10 further includes an amplitude modulator 400. The amplitude modulator 400 is electrically connected to the amplitude driver 300. The amplitude modulator 400 is used to adjust the amplitude frequency or amplitude intensity of the amplitude driver 300.

請參閱第3圖,第3圖為第1圖之散熱模組設於電子裝置內之使用示意圖。Please refer to FIG. 3, which is a schematic diagram of the use of the heat dissipation module of FIG. 1 in an electronic device.

如第3圖所示,當振幅驅動器300運作時,振幅驅動器300會驅使致動器100帶動擺動件200相對第一固定部22與第二固定部24反覆擺動而產生一氣流F。此氣流F用以引導外部冷空氣流入電子裝置20,並在與電子裝置20內部熱源26進行熱交換後,再被排出電子裝置20外,進而達到散熱的目的。As shown in FIG. 3, when the amplitude driver 300 operates, the amplitude driver 300 drives the actuator 100 to oscillate the swinging member 200 against the first fixing portion 22 and the second fixing portion 24 to generate an air flow F. The airflow F is used to guide the external cold air to flow into the electronic device 20, and after being heat-exchanged with the heat source 26 inside the electronic device 20, it is discharged to the outside of the electronic device 20 to achieve the purpose of heat dissipation.

然而,因本實施例之散熱模組10係利用致動器100來帶動擺動件200反覆擺動而產生氣流,無需透過扇葉及轉軸,故能夠改善習知軸流風扇因轉軸與軸套之間的摩擦與晃動而產生噪音及縮短軸流風扇的使用壽命的問題。However, since the heat dissipation module 10 of the embodiment uses the actuator 100 to drive the swinging member 200 to swing and generate airflow without passing through the blade and the rotating shaft, the conventional axial fan can be improved between the rotating shaft and the sleeve. Friction and sloshing cause noise and shorten the life of the axial fan.

請參閱第4圖,第4圖為根據本發明第二實施例的散熱模組的平面示意圖,第5圖為根據本發明第三實施例的散熱模組的平面示意圖。如第4圖所示,在本實施例中,散熱模組10更包含一散熱器500。散熱器500為一導熱板,熱接觸於電子裝置10內之熱源26,以增加熱源26 之散熱面積。擺動件200位於散熱器500之一側。當擺動件200擺動時可產生氣流,以帶走散熱器500上的熱量。Please refer to FIG. 4, which is a plan view of a heat dissipation module according to a second embodiment of the present invention, and FIG. 5 is a plan view of a heat dissipation module according to a third embodiment of the present invention. As shown in FIG. 4, in the embodiment, the heat dissipation module 10 further includes a heat sink 500. The heat sink 500 is a heat conducting plate that is in thermal contact with the heat source 26 in the electronic device 10 to increase the heat source 26 . The heat dissipation area. The swinging member 200 is located on one side of the heat sink 500. An air flow is generated when the swinging member 200 swings to take away heat on the heat sink 500.

上述散熱器為一導熱板,但並不以此為限,請參閱第5圖,第5圖為根據本發明第三實施例的散熱模組的平面示意圖。如第5圖所示,在本實施例中,散熱模組10更包含一散熱器500。散熱器500更包含至少二散熱鰭片510。散熱器500熱接觸於電子裝置10內之熱源26,以增加熱源26之散熱面積。擺動件200位於二散熱鰭片510之間。當擺動件200擺動時可產生氣流,以帶走散熱器500上的熱量。The heat sink is a heat conducting plate, but is not limited thereto. Please refer to FIG. 5, which is a schematic plan view of a heat dissipating module according to a third embodiment of the present invention. As shown in FIG. 5, in the embodiment, the heat dissipation module 10 further includes a heat sink 500. The heat sink 500 further includes at least two heat dissipation fins 510. The heat sink 500 is in thermal contact with the heat source 26 in the electronic device 10 to increase the heat dissipation area of the heat source 26. The swinging member 200 is located between the two heat radiating fins 510. An air flow is generated when the swinging member 200 swings to take away heat on the heat sink 500.

上述擺動件200為線的形式,但並不以此為限,在其他實施例中,擺動件200也可以是布、網板或平板等面的形式。請參閱第6圖至第8圖。第6圖為根據本發明第四實施例的致動器與擺動件的上視示意圖。第7圖為根據本發明第五實施例的致動器與擺動件的上視示意圖。第8圖為根據本發明第六實施例的致動器與擺動件的上視示意圖。The oscillating member 200 is in the form of a wire, but is not limited thereto. In other embodiments, the oscillating member 200 may also be in the form of a surface such as a cloth, a mesh plate or a flat plate. Please refer to Figures 6 to 8. Fig. 6 is a top plan view showing an actuator and a swinging member according to a fourth embodiment of the present invention. Fig. 7 is a top plan view showing an actuator and a swinging member according to a fifth embodiment of the present invention. Fig. 8 is a top plan view showing an actuator and a swinging member according to a sixth embodiment of the present invention.

如第6圖所示,擺動件200的外形為四邊形,其四個端角分別設於電子裝置20之四固定部21。如第7圖所示,擺動件200的外形為五邊形,其五個端角分別設於電子裝置20之五固定部21。如第8圖所示,擺動件200的外形為圓形,其各邊緣分別設於電子裝置20之多個固定部21,本實施例之固定部21的數量為8,但並不以此為限。As shown in FIG. 6, the shape of the oscillating member 200 is a quadrangle, and the four end angles thereof are respectively disposed on the four fixing portions 21 of the electronic device 20. As shown in FIG. 7, the shape of the oscillating member 200 is a pentagon, and the five end angles thereof are respectively disposed on the five fixing portions 21 of the electronic device 20. As shown in FIG. 8 , the shape of the oscillating member 200 is circular, and the edges of the oscillating member 200 are respectively disposed on the plurality of fixing portions 21 of the electronic device 20 . The number of the fixing portions 21 in the embodiment is 8, but this is not limit.

上述致動器100之第二端120係直接連接於擺動件200之第三端210,但並不以此為限,在其他實施例中,致動器100之第二端120也可以間接連接於擺動件200之第三端210。請參閱第9圖,第9為根據本發明第七實施例之散熱模組的平面示意圖。本實施例之散熱模組10更包含一 連接線600。致動器100之第二端120透過連接線600連接於擺動件200之第三端210。The second end 120 of the actuator 100 is directly connected to the third end 210 of the swinging member 200, but not limited thereto. In other embodiments, the second end 120 of the actuator 100 can also be indirectly connected. At the third end 210 of the swinging member 200. Please refer to FIG. 9. FIG. 9 is a schematic plan view of a heat dissipation module according to a seventh embodiment of the present invention. The heat dissipation module 10 of the embodiment further includes a Connection line 600. The second end 120 of the actuator 100 is coupled to the third end 210 of the oscillating member 200 via a connecting wire 600.

上述致動器100為壓電片,但並不以此為限。請參閱第10圖及第11圖。第10為根據本發明第八實施例之散熱模組的平面示意圖。第11為根據本發明第九實施例之散熱模組的平面示意圖。本實施例與上述第1圖之實施例相似,故僅針對相異處進行說明。The actuator 100 is a piezoelectric piece, but is not limited thereto. Please refer to Figure 10 and Figure 11. 10 is a schematic plan view of a heat dissipation module according to an eighth embodiment of the present invention. 11 is a schematic plan view of a heat dissipation module according to a ninth embodiment of the present invention. This embodiment is similar to the embodiment of Fig. 1 described above, and therefore only the differences will be described.

如第10圖所示,本實施例之致動器100包含一撓性金屬件130及一電磁元件140。第一端110及第二端120位於撓性金屬件130之相對兩端。電磁元件140相鄰於撓性金屬件130,且振幅驅動器300電性連接電磁元件140。振幅驅動器300可輸出電壓或電流給電磁元件140,使電磁元件140產生磁性,或停止輸出電壓給電磁元件140,使電磁元件140消磁,進而以磁性控制來驅動撓性金屬件130反覆擺動以帶動擺動件200擺動。在本實施例中,電磁元件140為電磁鐵或電感應線圈。As shown in FIG. 10, the actuator 100 of the present embodiment includes a flexible metal member 130 and an electromagnetic member 140. The first end 110 and the second end 120 are located at opposite ends of the flexible metal member 130. The electromagnetic component 140 is adjacent to the flexible metal member 130, and the amplitude driver 300 is electrically connected to the electromagnetic component 140. The amplitude driver 300 can output a voltage or current to the electromagnetic component 140, cause the electromagnetic component 140 to generate magnetism, or stop outputting the voltage to the electromagnetic component 140, demagnetize the electromagnetic component 140, and then magnetically drive the flexible metal member 130 to swing repeatedly to drive The swinging member 200 swings. In the present embodiment, the electromagnetic element 140 is an electromagnet or an electric induction coil.

如第11圖所示,本實施例之致動器100為一馬達。詳細來說,致動器100包含一定子150及一轉子160。此處之定子150為馬達不轉動的元件,包含殼體及設置於殼體的磁鐵等,而轉子160為轉軸及設置於轉軸的磁鐵等。轉子160可轉動地設於定子150。第一端110位於定子150之殼體,設於第一固定部22。第二端120位於轉子160之轉軸,而擺動件200連接於轉子160之轉軸,透過轉子160反覆轉動,來帶動擺動件200作簡諧運動以產生氣流。As shown in Fig. 11, the actuator 100 of this embodiment is a motor. In detail, the actuator 100 includes a stator 150 and a rotor 160. Here, the stator 150 is an element in which the motor does not rotate, and includes a housing and a magnet provided in the housing, and the rotor 160 is a rotating shaft and a magnet provided on the rotating shaft. The rotor 160 is rotatably disposed on the stator 150. The first end 110 is located in the housing of the stator 150 and is disposed on the first fixing portion 22 . The second end 120 is located on the rotating shaft of the rotor 160, and the swinging member 200 is coupled to the rotating shaft of the rotor 160, and is rotated by the rotor 160 to drive the swinging member 200 to perform harmonic motion to generate airflow.

根據上述本發明所揭露的散熱模組,利用致動件來帶動擺動件反覆擺動來產生氣流,因無需透過扇葉及轉軸,故能夠改善習知軸流 風扇因轉軸與軸套之間的摩擦與晃動而產生噪音及縮短軸流風扇的使用壽命的問題。According to the heat dissipating module disclosed in the present invention, the actuating member is used to drive the swinging member to swing back and forth to generate airflow, so that the axial flow can be improved without passing through the fan blade and the rotating shaft. The fan generates noise due to friction and sway between the rotating shaft and the sleeve, and shortens the service life of the axial fan.

雖然本發明的實施例揭露如上所述,然並非用以限定本發明,任何熟習相關技藝者,在不脫離本發明的精神和範圍內,舉凡依本發明申請範圍所述的形狀、構造、特徵及數量當可做些許的變更,因此本發明的專利保護範圍須視本說明書所附的申請專利範圍所界定者為準。Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

10‧‧‧散熱模組10‧‧‧ Thermal Module

20‧‧‧電子裝置20‧‧‧Electronic devices

22‧‧‧第一固定部22‧‧‧First Fixed Department

24‧‧‧第二固定部24‧‧‧Second fixed department

26‧‧‧熱源26‧‧‧heat source

100‧‧‧致動部100‧‧‧Acoustic Department

200‧‧‧擺動件200‧‧‧Swinger

Claims (6)

一種散熱模組,用以設於一電子裝置內之至少二固定部,包含:一致動器,具有一第一端及一第二端,該致動器包含一撓性金屬件及一電磁元件,該第一端及該第二端位於該撓性金屬件之相對兩端,該第一端連接於該二固定部之一,該電磁元件相鄰於該撓性金屬件;一擺動件,具有一第三端及一第四端,該擺動件之該第三端連接於該致動器之該第二端,該擺動件之該第四端連接於該二固定部之另一;以及一振幅驅動器,該振幅驅動器電性連接該致動器之該電磁元件以驅動該撓性金屬件反覆擺動,並透過該撓性金屬件帶動該擺動件相對該二固定部反覆擺動而產生一氣流。 The heat dissipation module is configured to be disposed in at least two fixing portions of an electronic device, comprising: an actuator having a first end and a second end, the actuator comprising a flexible metal member and an electromagnetic component The first end and the second end are located at opposite ends of the flexible metal member, the first end is connected to one of the two fixing portions, the electromagnetic element is adjacent to the flexible metal member; a swinging member, a third end and a fourth end, the third end of the swinging member is connected to the second end of the actuator, and the fourth end of the swinging member is connected to the other of the two fixing portions; An amplitude driver electrically connecting the electromagnetic component of the actuator to drive the flexible metal member to oscillate repeatedly, and driving the swinging member to swing back relative to the two fixing portions to generate an air flow through the flexible metal member . 如請求項1所述之散熱模組,其中該電磁元件為電磁鐵或電感應線圈。 The heat dissipation module of claim 1, wherein the electromagnetic component is an electromagnet or an electric induction coil. 如請求項1所述之散熱模組,更包含一振幅調變器,電性連接於該振幅驅動器,該振幅調變器用以調整該振幅驅動器之振幅頻率或振幅強度。 The heat dissipation module of claim 1, further comprising an amplitude modulator electrically connected to the amplitude driver, wherein the amplitude modulator is configured to adjust an amplitude frequency or an amplitude intensity of the amplitude driver. 如請求項1所述之散熱模組,其中該擺動件為線材、布、網板或平板。 The heat dissipation module of claim 1, wherein the swinging member is a wire, a cloth, a mesh plate or a flat plate. 如請求項1所述之散熱模組,更包含一散熱器,用以熱接觸於一熱源,該擺動件位於該散熱器之一側。 The heat dissipation module of claim 1, further comprising a heat sink for thermally contacting a heat source, the swinging member being located on one side of the heat sink. 如請求項5所述之散熱模組,其中該散熱器更包含二散熱鰭片,該擺動件位於該二散熱鰭片之間。The heat dissipation module of claim 5, wherein the heat sink further comprises two heat dissipation fins, the swinging member being located between the two heat dissipation fins.
TW102122797A 2013-06-26 2013-06-26 Heat dissipating module TWI501720B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020175596A1 (en) * 2001-05-23 2002-11-28 Garimella Suresh V. Thin profile piezoelectric jet device
US20090219686A1 (en) * 2004-03-18 2009-09-03 Hiroichi Ishikawa Gas ejector, electronic device, and gas-ejecting method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020175596A1 (en) * 2001-05-23 2002-11-28 Garimella Suresh V. Thin profile piezoelectric jet device
US20090219686A1 (en) * 2004-03-18 2009-09-03 Hiroichi Ishikawa Gas ejector, electronic device, and gas-ejecting method

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