TW201500897A - Heat dissipating module - Google Patents

Abstract

A heat dissipating module disposing on at least two fix parts and a disposed part in a electrical device includes a actuator, a oscillation element, and a oscillation driver. The actuator has a first end and a second end. The first end disposes on the disposed part. The oscillation element has a third end, a forth end, and connected part locating between the third end and the forth end. The third end of the oscillation element connects one of the two fix parts. The forth end of the oscillation element connects another of the two fix parts. The second end of the actuator connects the connected part of the oscillation element. The oscillation driver electrically connects the actuator and drives the actuator to have the oscillation element oscillate.

Description

Thermal module

The invention relates to a heat dissipation module, in particular to a fanless heat dissipation module.

Computer systems (such as personal computers, portable computers, notebook computers, server hosts, etc.) will generate waste heat when they are running. These waste heat will increase or decrease with the running time and running efficiency of the computer system. When these waste heats are gradually accumulated in the computer system, it will cause the internal temperature of the computer system to rise and affect the performance of the computer system, and may even cause the computer system to crash. Therefore, a heat sink is generally disposed in the computer system to remove waste heat generated when the computer system is in operation.

The heat sink is generally classified into air-cooled or liquid-cooled. The air-cooled heat sink is, for example, an axial fan. The liquid-cooled heat sink includes, for example, a liquid flow tube and a pump. The cost of the liquid-cooled heat sink is generally higher than the cost of the air-cooled heat sink. Therefore, based on cost considerations, the computer system is generally equipped with a lower cost air-cooled heat sink. Although the cost of the axial fan is low, if the fan is old or not designed properly, the fan will run and cause friction and sway between the shaft and the sleeve. The aforementioned friction and sloshing phenomenon not only causes noise of the axial flow fan, but also accelerates the shaft shaft fatigue of the axial flow fan and shortens the service life of the axial flow fan.

The invention provides a heat dissipation module for improving an axial flow fan due to a rotating shaft Friction and sloshing with the bushing creates noise and shortens the service life of the axial fan.

The heat dissipation module disclosed in the present invention is configured to be disposed in at least two fixing portions and an installation portion of an electronic device, and includes an actuator, a swinging member and an amplitude driver. The actuator has a first end and a second end. The first end is provided at the installation portion. The swinging member has a third end, a fourth end and a main body portion between the third end and the fourth end. The third end of the swinging member is connected to one of the two fixing portions. The fourth end of the swinging member is connected to the other of the two fixing portions. The second end of the actuator is coupled to the body portion of the oscillating member. The amplitude driver is electrically connected to the actuator, and is configured to drive the actuator to drive the swinging member to swing back relative to the two fixing portions to generate an air flow.

According to the heat dissipating module disclosed in the present invention, the actuating member is used to drive the swinging member to swing and swing to generate airflow. Since the fan blade and the rotating shaft need not be transmitted, the friction between the rotating shaft and the bushing can be improved by the conventional axial fan. The problem of noise and shaking and shortening the service life of the axial fan.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

10‧‧‧ Thermal Module

20‧‧‧Electronic devices

21‧‧‧ Fixed Department

22‧‧‧First Fixed Department

24‧‧‧Second fixed department

25‧‧‧Installation Department

26‧‧‧heat source

100‧‧‧Acoustic Department

110‧‧‧ first end

120‧‧‧second end

130‧‧‧Flexible metal parts

140‧‧‧Electromagnetic components

150‧‧‧stator

160‧‧‧Rotor

200‧‧‧Swinger

210‧‧‧ third end

220‧‧‧ fourth end

230‧‧‧ Main body

300‧‧‧Amplitude driver

400‧‧‧Amplitude Modulator

500‧‧‧heatsink

510‧‧‧heat fins

600‧‧‧Connecting line

FIG. 1 is a schematic plan view showing a heat dissipating module according to a first embodiment of the present invention disposed in an electronic device.

Figure 2 is a plan view of the heat dissipation module of Figure 1.

FIG. 3 is a schematic view showing the use of the heat dissipation module of FIG. 1 in an electronic device.

4 is a schematic view showing the use of a heat dissipation module according to a second embodiment of the present invention.

FIG. 5 is a schematic view showing the use of a heat dissipation module according to a third embodiment of the present invention.

Fig. 6 is a top plan view showing an actuator and a swinging member according to a fourth embodiment of the present invention.

Fig. 7 is a top plan view showing an actuator and a swinging member according to a fifth embodiment of the present invention.

Fig. 8 is a top plan view showing an actuator and a swinging member according to a sixth embodiment of the present invention.

9 is a schematic plan view of a heat dissipation module according to a seventh embodiment of the present invention.

10 is a schematic plan view of a heat dissipation module according to an eighth embodiment of the present invention.

Please refer to FIG. 1 to FIG. 2 . FIG. 1 is a schematic plan view showing a heat dissipating module according to a first embodiment of the present invention, and FIG. 2 is a plan view of the heat dissipating module of FIG. 1 . The electronic device 20 described above is, for example, a notebook computer, a desktop computer, or a tablet computer, and is not limited thereto. The electronic device 20 has a first fixing portion 22 , a second fixing portion 24 , and a mounting portion 25 . The first fixing portion 22, the second fixing portion 24, and the mounting portion 25 of the embodiment are all located on the outer casing of the electronic device 20, but are not limited thereto.

The heat dissipation module 10 of the embodiment includes an actuator 100, a swinging member 200, an amplitude driver 300, and a connecting line 600.

The actuator 100 has a first end 110 and a second end 120 opposite to each other. The first end 110 of the actuator 100 is disposed at the mounting portion 25. The actuator 100 of this embodiment is exemplified by a piezoelectric sheet, that is, the first end 110 and the second end 120 are respectively located at opposite ends of the piezoelectric sheet.

The swinging member 200 has a third end 210, a fourth end 220 and a third end A body portion 230 between the 210 and the fourth end 220. The third end 210 of the swinging member 200 is coupled to the first fixing portion 22. The fourth end 220 of the swinging member 200 is coupled to the second fixing portion 24. The second end 120 of the actuator 100 is coupled to the body portion 230 of the swinging member 200. In detail, the second end 120 of the actuator 100 is coupled to the body portion 230 of the swinging member 200 by a connecting wire 600. The swinging member 200 of the embodiment is a wire, but is not limited thereto.

The amplitude driver 300 is electrically connected to the actuator 100. The amplitude driver 300 of this embodiment is a power supply. The amplitude driver 300 (power supply) is used for outputting a voltage or current to the swinging member 200 (piezoelectric sheet). After the piezoelectric sheet is driven by the voltage, the second end 120 of the piezoelectric sheet is repeatedly oscillated, so that the middle portion of the swinging member 200 starts to oscillate. In turn, the entire swinging member 200 is oscillated against the first fixing portion 22 and the second fixing portion 24.

In this embodiment and other embodiments, the heat dissipation module 10 further includes an amplitude modulator 400. The amplitude modulator 400 is electrically connected to the amplitude driver 300. The amplitude modulator 400 is used to adjust the amplitude frequency or amplitude intensity of the amplitude driver 300.

Please refer to FIG. 3, which is a schematic diagram of the use of the heat dissipation module of FIG. 1 in an electronic device.

As shown in FIG. 3, when the amplitude driver 300 is operated, since the amplitude driver 300 drives the actuator 100 to start swinging, the actuator 100 drives the swinging member 200 to overlap the first fixing portion 22 and the second fixing portion 24. Swing to generate a flow F. The airflow F is used to guide the external cold air to flow into the electronic device 20, and after being heat-exchanged with the heat source 26 inside the electronic device 20, it is discharged to the outside of the electronic device 20 to achieve the purpose of heat dissipation.

However, since the heat dissipation module 10 of the present embodiment uses the actuator 100 to drive the swinging member 200 to swing and generate airflow without passing through the blade and the rotating shaft, the conventional method can be improved. The axial fan generates noise due to friction and sway between the rotating shaft and the sleeve, and shortens the service life of the axial fan.

Please refer to Figure 4. 4 is a schematic view showing the use of a heat dissipation module according to a second embodiment of the present invention. In this embodiment, the heat dissipation module 10 further includes a heat sink 500. The heat sink 500 is a heat conducting plate that is in thermal contact with the heat source 26 in the electronic device 10 to increase the heat dissipation area of the heat source 26. The swinging member 200 is located on one side of the heat sink 500. An air flow is generated when the swinging member 200 swings to take away heat on the heat sink 500.

The heat sink is a heat conducting plate, but is not limited thereto. Referring to FIG. 5, FIG. 5 is a schematic view showing the use of the heat dissipating module according to the third embodiment of the present invention. In this embodiment, the heat dissipation module 10 further includes a heat sink 500. The heat sink 500 further includes at least two heat dissipation fins 510. The heat sink 500 is in thermal contact with the heat source 26 in the electronic device 10 to increase the heat dissipation area of the heat source 26. The swinging member 200 is located between the two heat radiating fins 510. An air flow is generated when the swinging member 200 swings to take away heat on the heat sink 500.

The oscillating member 200 is in the form of a wire, but is not limited thereto. In other embodiments, the oscillating member 200 may also be in the form of a surface such as a cloth, a mesh plate or a flat plate. Please refer to Figures 6 to 8. Fig. 6 is a top plan view showing an actuator and a swinging member according to a fourth embodiment of the present invention. Fig. 7 is a top plan view showing an actuator and a swinging member according to a fifth embodiment of the present invention. Fig. 8 is a top plan view showing an actuator and a swinging member according to a sixth embodiment of the present invention.

As shown in FIG. 6, the shape of the oscillating member 200 is quadrangular, and the four end angles thereof are respectively disposed on the four fixing portions 21 of the electronic device 20, and the main body portion 230 of the oscillating member 200 is kept at a distance from the four fixing portions 21. As shown in FIG. 7, the shape of the oscillating member 200 is a pentagon, and the five end angles thereof are respectively disposed on the five fixing portions 21 of the electronic device 20, and the main body portion 230 of the oscillating member 200 is fixed with five. The portion 21 maintains a distance. As shown in FIG. 8, the swinging member 200 has a circular outer shape, and its respective edges are respectively disposed on the plurality of fixing portions 21 of the electronic device 20, and the main body portion 230 of the swinging member 200 is kept at a distance from each of the fixing portions 21. The number of the fixing portions 21 in this embodiment is 8, but is not limited thereto.

The actuator 100 is a piezoelectric piece, but is not limited thereto. Please refer to Figure 9 and Figure 10. 9 is a schematic plan view of a heat dissipation module according to a seventh embodiment of the present invention. 10 is a schematic plan view of a heat dissipation module according to an eighth embodiment of the present invention. This embodiment is similar to the above embodiment, and therefore only the differences will be described.

As shown in FIG. 9, the actuator 100 of the present embodiment includes a flexible metal member 130 and an electromagnetic member 140. The first end 110 and the second end 120 are located at opposite ends of the flexible metal member 130. The electromagnetic component 140 is adjacent to the flexible metal member 130, and the amplitude driver 300 is electrically connected to the electromagnetic component 140. The amplitude driver 300 can output a voltage or current to the electromagnetic component 140, cause the electromagnetic component 140 to generate magnetism, or stop outputting the voltage to the electromagnetic component 140, demagnetize the electromagnetic component 140, and then magnetically drive the flexible metal member 130 to swing repeatedly to drive The swinging member 200 swings. In the present embodiment, the electromagnetic element 140 is an electromagnet or an electric induction coil.

As shown in Fig. 10, the actuator 100 of this embodiment is a motor. In detail, the actuator 100 includes a stator 150 and a rotor 160. Here, the stator 150 is an element in which the motor does not rotate, and includes a housing and a magnet provided in the housing, and the rotor 160 is a rotating shaft and a magnet provided on the rotating shaft. The rotor 160 is rotatably disposed on the stator 150. The first end 110 is located in the housing of the stator 150 and is disposed on the first fixing portion 22 . The second end 120 is located on the rotating shaft of the rotor 160, and the middle portion of the swinging member 200 is coupled to the rotating shaft of the rotor 160, and is rotated by the rotor 160 to drive the swinging member 200 for simple harmonic motion to generate airflow.

According to the heat dissipation module disclosed in the above invention, the actuator is used to drive the pendulum The moving member repeatedly swings to generate airflow, and since it is not necessary to transmit the fan blade and the rotating shaft, the problem that the conventional axial fan generates noise due to friction and sway between the rotating shaft and the bushing and shortens the service life of the axial flow fan can be improved.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

10‧‧‧ Thermal Module

20‧‧‧Electronic devices

22‧‧‧First Fixed Department

24‧‧‧Second fixed department

25‧‧‧Installation Department

26‧‧‧heat source

100‧‧‧Acoustic Department

200‧‧‧Swinger

230‧‧‧ Main body

Claims (10)

The heat dissipation module is configured to be disposed in at least two fixing portions and an installation portion of an electronic device, and includes: an actuator having a first end and a second end, wherein the first end is connected to the device a swinging member having a third end, a fourth end, and a main body portion between the third end and the fourth end, the third end of the swinging member being connected to the two fixing portions The fourth end of the swinging member is connected to the other of the two fixing portions, and the second end of the actuator is connected to the main body portion of the swinging member; and an amplitude driver electrically connected to the And an actuator for driving the actuator to swing the swinging member against the two fixing portions to generate an air flow. The heat dissipation module of claim 1, wherein the actuator comprises a flexible metal member and an electromagnetic component, the first end and the second end being located at opposite ends of the flexible metal member, the electromagnetic component Adjacent to the flexible metal member, the amplitude driver is electrically connected to the electromagnetic component to drive the flexible metal member to swing back. The heat dissipation module of claim 1, wherein the electromagnetic component is an electromagnet or an electric induction coil. The heat dissipation module of claim 1, wherein the actuator is a piezoelectric piece, and the first end and the second end are located at opposite ends of the piezoelectric piece. The heat dissipation module of claim 1, wherein the actuator is a motor, the actuator includes a stator and a rotor, the rotor is rotatably disposed on the stator, and the first end is located at the stator, The second end is located at the rotor. The heat dissipation module of claim 1, further comprising an amplitude modulator electrically connected to the amplitude driver, wherein the amplitude modulator is configured to adjust an amplitude frequency or an amplitude intensity of the amplitude driver. The heat dissipation module of claim 1, wherein the swinging member is a wire, a cloth, a mesh plate or a flat plate. The heat dissipation module of claim 1, further comprising a heat sink for thermally contacting a heat source, the swinging member being located on one side of the heat sink. The heat dissipation module of claim 8, wherein the heat sink further comprises two heat dissipation fins, the swinging member being located between the two heat dissipation fins. The heat dissipation module of claim 1, further comprising a connecting wire, the second end of the actuator being connected to the main body portion of the swinging member through the connecting wire.