WO2018133460A1

WO2018133460A1 - Heat dissipation device, heat dissipation unit, and electronic apparatus

Info

Publication number: WO2018133460A1
Application number: PCT/CN2017/106015
Authority: WO
Inventors: 李亮; 李建光; 胡志锋
Original assignee: 华为技术有限公司
Priority date: 2017-01-19
Filing date: 2017-10-13
Publication date: 2018-07-26
Also published as: CN106783771B; CN106783771A

Abstract

Provided are a heat dissipation device, a heat dissipation unit, and an electronic apparatus. The heat dissipation device comprises a base (110), a blade-shaped oscillating heat dissipation assembly (120), a driving assembly (130), and a magnetic assembly (140). The driving assembly is fixed to the base. One end of the blade-shaped oscillating heat dissipation assembly is fixed to the base and located in the same plane as the base. There is an included angle between the blade-shaped oscillating heat dissipation assembly and a vertical plane of the base. The magnetic assembly is provided at the blade-shaped oscillating heat dissipation assembly. The magnetic assembly is arranged in a position corresponding to the driving assembly. A force acting between the magnetic assembly and the driving assembly drives the blade-shaped oscillating heat dissipation assembly to oscillate. An oscillation area of the blade-shaped oscillating heat dissipation assembly constitutes a large fan-shaped area, such that an air volume generated by the blade-shaped oscillating heat dissipation assembly is significantly increased, thereby expanding a heat dissipation area.

Description

Heat sink, heat sink and electronic device

The present application claims priority to Chinese Patent Application No. JP-A No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. In this application.

Technical field

The present invention relates to the field of electronic devices, and in particular, to a heat sink, a heat sink, and an electronic device having the heat sink or the heat sink.

Background technique

With the development of integration technology and microelectronic technology, the total power density of electronic components is increasing, while the physical dimensions of electronic components and electronic devices are gradually becoming smaller and miniaturized, and the generated heat is rapidly accumulated, resulting in integrated devices. The surrounding heat flux density is also increasing. The high temperature environment will definitely affect the performance of electronic components and equipment. How to effectively dissipate the heat generated by microelectronic devices has become a hot spot of current research.

In the conventional method, the forced cooling of the electromagnetic rotary fan is used to improve the heat dissipation capability of the electronic device. The conventional electromagnetic rotary fan generates a rotating magnetic field at the stator coil and the electromagnet through the control circuit, and pushes the magnet on the rotor to rotate in a specific direction. Therefore, the entire blade is driven to rotate at a high speed, and the air is quickly pushed through the blade to reach a specific air volume and wind pressure, thereby improving the heat dissipation capability of the electronic device for the electronic device.

However, the conventional electromagnetic rotary fan has inherent disadvantages such as large size, large power consumption, and short service life, and is not suitable for heat dissipation of micro-electronic devices.

Summary of the invention

Embodiments of the present invention provide a heat dissipating device, a heat sink, and an electronic device for increasing air volume and expanding a heat dissipating area. The heat sink can be used to provide a heat dissipation function for an electronic device, which can be a small electronic device, a miniature electronic device, a heat sensitive component, or the like. For example, the electronic device can be a radio frequency module, a processor, or the like. In practical applications, the electronic device to which the heat sink is applied is not limited.

In a first aspect, an embodiment of the present invention provides a heat dissipation device including: a base, a heat sinking assembly, a driving component, and a magnetic component; the driving component is fixed on the base, and one end of the heat sinking assembly is fixed on the base, and The base is in the same plane; the heat sinking whip assembly has an angle with the vertical surface of the base; the heat sinking wrap assembly includes at least two heat dissipating fins, and each of the heat dissipating fins has a space therebetween, the spacing is used to make When the heat sinking pendulum swings, the swing of each heat sinking pendulum does not affect each other; the heat radiating pendulum assembly is provided with a magnetic component, and the magnetic component corresponds to the position of the driving component, and the driving component is used for generating magnetic force, the magnetic component and The force between the drive components drives the heat sink assembly to swing. The heat dissipating device in the embodiment of the invention has a compact structure, and the heat dissipating pendulum assembly swings adopts a magnetic swing bearingless design, which prolongs the service life of the device; the swinging web surface formed by the heat dissipating pendulum assembly constitutes a large fan-shaped region, so that the swing heat dissipating device is generated. The air volume has increased significantly, expanding the heat dissipation area.

In a possible implementation manner, the heat sinking pen assembly includes a first heat sink pendulum and a second heat sink pendulum, and the driving component includes a first electromagnet and a second electromagnet, and the position of the first electromagnet and the first heat sink pendulum Corresponding to the first magnetic component disposed on the chip, the position of the second electromagnet corresponds to the second magnetic component disposed on the second heat sinking pendulum. The first heat sink swing is driven by the magnetic force generated by the first electromagnet, and the second heat sink swing is driven by the magnetic force generated by the second electromagnet. In the embodiment of the invention, the attraction or repulsive force between the electromagnet and the magnetic component is adopted. The driving heat sink swings, and the two heat sinks are respectively driven by two electromagnets, and each electromagnet drives a heat sink to work. That is to say, each heat sinking pendulum can work independently, so that the work of the two heat sinking pendulums does not affect each other.

In a possible implementation, the driving component is disposed between the first heat sinking pendulum and the second heat sinking pendulum.

In a possible implementation, the heat sinking flap assembly is disposed between the first electromagnet and the second electromagnet. In the embodiment of the present invention, the space requirement reserved for the heat dissipating device in different electronic devices can be satisfied, and the applicability of the heat dissipating device applied to different electronic devices is enhanced, and the positions of the driving component and the heat dissipating component can be set differently. .

In one possible implementation, the angle of the included angle ranges from 5° to 25°. The angular extent of the included angles allows the drive assembly to properly apply force to the heat sink assembly. The power consumption of the drive component itself is reduced.

In a possible implementation, the base includes a first side and a second side, the first side and the second side corresponding to each other, and having a first end surface on the first side, the first end surface is provided with a first a screw hole, and the first end surface has an angle with the vertical surface of the base, the first heat sinking piece is fixed to the first end surface by the fastening screw and the first screw hole; and the second side surface has a a second end surface, the second end surface is provided with a second screw hole, and the two end surfaces have an angle with the vertical surface of the base, and the second heat sinking piece is fixed to the second screw hole by the fastening screw Two end faces.

In a possible implementation manner, the fastening screw is fixed to the end surface of the base through the mounting hole of the mounting baffle, the mounting baffle has a certain thickness, and the mounting baffle can be fast in the heat dissipating plate In the case of swinging, the shock is prevented. During the long-term use, the fastening screw is prevented from loosening, and the fixing effect of the heat sinking pendulum is enhanced; the length of the mounting baffle can be the same as the width of the heat sinking pendulum. It is also possible to increase the contact area of the fastening screw with the heat sinking piece, so that the fixing effect of the heat sinking piece is better and more stable.

In a possible implementation manner, the first heat sinking piece is located on the left side of the second heat sinking piece, and the angle between the first heat sinking piece and the vertical surface of the base is the first angle, and the first angle is the first angle. An angle between a heat sink and a counterclockwise direction of the vertical surface; an angle between the second heat sink and the vertical surface of the base is a second angle, and the second angle is a second heat sink with respect to the vertical The angle in the clockwise direction. The first heat sinking pendulum and the second heat sinking pendulum have a third angle in the direction of extension of each of the fixed ends, and the angle of the third angle ranges from 10° to 50°.

In a possible implementation manner, when the first angle is an angle between the first heat sink and the counterclockwise direction of the vertical surface, the second angle is also an angle in a counterclockwise direction with respect to the vertical surface. Or, when the first angle is the angle between the first heat sink and the vertical surface in the clockwise direction, the second angle is also an angle with respect to the vertical direction of the vertical surface, the first heat sink Parallel to the second heat sink.

In a possible implementation, the interval between the first electromagnet and the second electromagnet acts as an airflow path for the airflow to the heat sinking yoke assembly. The air flow channel is used to carry away the heat generated by the coil and reduce the temperature of the electromagnetic coil.

In a possible implementation manner, each of the heat sinking pendulum assemblies is provided with a magnetic component, wherein the magnetic component comprises a first permanent magnet, a second permanent magnet and a magnetic connecting body; the first permanent magnet and the second The permanent magnets are connected and fixed to both sides of the heat sinking piece by a magnetic connecting body, and the magnetic connecting body is a permanent magnet or an iron core.

In a second aspect, an embodiment of the present invention provides a heat sink including a housing and a heat dissipating device provided by the above first aspect. The heat dissipating device is disposed on the housing, and the housing surface is provided with a plurality of heat dissipating teeth, and a plurality of The heat dissipating fins are radially distributed around the position of the heat sink. The heat sink provided in the embodiment of the invention reorganizes the irregular airflow formed during the swinging process of the heat sinking pendulum and transmits it to a farther area; the airflow is distributed in multiple directions to enhance the heat dissipation capability.

In a third aspect, an embodiment of the present invention provides an electronic device, including the heat sink provided by the above third aspect.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. Other figures can also be obtained from those skilled in the art from these figures.

1 is a schematic perspective view of a heat dissipation device according to an embodiment of the present invention;

2 is a top plan view of a heat dissipation device according to an embodiment of the present invention;

3 is a schematic diagram of an explosion structure of a heat dissipation device according to an embodiment of the present invention;

4 is a side view showing a driving assembly of a heat dissipating device according to an embodiment of the present invention;

5 is a cross-sectional view showing a magnetic component of a heat dissipating device according to an embodiment of the present invention;

6 is a schematic diagram of an air flow passage of a heat dissipation device according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of another embodiment of a heat dissipation device according to an embodiment of the present invention; FIG.

FIG. 8 is a schematic structural view of an embodiment of a heat sink according to an embodiment of the present invention.

detailed description

Embodiments of the present invention provide a heat dissipating device, a heat sink, and an electronic device for increasing the amount of air generated by the oscillating heat sink and enlarging the heat dissipating area.

The terms "first", "second", "third", "fourth", etc. (if present) in the specification and claims of the present invention and the above figures are used to distinguish similar objects without being used for Describe a specific order or order. It is to be understood that the data so used may be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than what is illustrated or described herein. In addition, the terms "comprises" and "comprises" and "the" and "the" are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to Those steps or units may include other steps or units not explicitly listed or inherent to such processes, methods, products or devices.

Embodiments of the present invention provide a heat dissipating device that can be used to provide a heat dissipating function for an electronic device, which can be a small electronic device, a micro electronic device, a heat sensitive component, or the like. For example, the electronic device can be a radio frequency module, a processor, or the like. In practical applications, the electronic device to which the heat sink is applied is not limited. Referring to FIG. 1 , FIG. 1 is a schematic perspective structural view of a heat dissipation device according to an embodiment of the present invention. The heat sink includes a base 110, a heat sink assembly 120, a drive assembly 130, and a magnetic assembly 140. The driving assembly 130 is fixed on the base 110. One end of the heat sinking assembly 120 is fixed on the base and is in the same plane as the base; the heat sinking assembly 120 has an angle with the vertical surface of the base; and the heat sinking assembly The magnetic component 140 is disposed on the 120. The magnetic component 140 corresponds to the position of the driving component 130. The force between the magnetic component 140 and the driving component 130 drives the heat sinking assembly 120 to swing. The heat sinking piece has the action of the force. A fan-shaped oscillating web 11. The heat sinking pen assembly 120 includes at least two independent heat sinking pendulums, and each of the heat radiating pendulums has a space therebetween. When the heat radiating pendulums are swung, the swinging of the heat radiating pendulums does not affect each other.

In the embodiment of the present invention, the heat sinking splicing assembly 120 is oscillated by a magnetic swing bearingless design, which prolongs the service life of the device; the oscillating web formed by the heat sinking splicing assembly 120 constitutes a large fan-shaped area, so that the air volume generated by the oscillating heat sink is significantly improved. , expanding the heat dissipation area.

2 and FIG. 3, FIG. 2 is a schematic top view of the heat dissipation device according to an embodiment of the present invention. FIG. 3 is a schematic diagram of an explosion structure of the heat dissipation device according to an embodiment of the present invention.

The driving component 130 is fixed on the base, and the heat sinking pen assembly 120 includes at least two heat sinking pendulums. The number of the sheets may also be three or the like, and the number of heat sinking fins included in the heat sinking pen assembly 120 is not limited in practical applications.

In this embodiment, the structure in which the heat sinking pen assembly 120 includes two heat sinking pendulums is taken as an example for description. The heat sinking pen assembly 120 includes a first heat sink pendulum 1201 and a first heat sink pendulum 1202.

For example, the heat sinking sheet may be a rectangular sheet having a thickness of 1 mm, and the heat sinking sheet may be a sheet of stainless steel, a sheet of iron, a sheet of resin, etc., which has an elastic sheet in the case of rapid swinging. Thickness and material of the sheet This embodiment is merely illustrative and does not limit the invention. In practical applications, different materials may be selected according to different application electronic devices, and the thickness of the heat sinking fin is determined according to different materials.

The heat sinking piece includes two ends. For example, two corresponding short sides of the rectangular sheet are both ends, and one end of the heat sinking piece is fixed on the base. One end of the heat sinking piece may be referred to as a fixed in the embodiment of the present invention. And the heat sinking piece is in the same plane as the base. Among them, there are various fixing methods for fixing the fixed end of the heat sinking pen to the base. For example, the following description is made in two fixed ways.

In a possible implementation, the base includes a first side and a second side, and the first side and the second side correspond to each other. It can be understood that the first side is a left side, and the second side is Right side. The structure in which the first heat sinking piece 1202 is fixed on the first side will be described as an example. The first end surface 111 has a first screw hole, and the first end surface 111 has an angle with the vertical surface of the base (θ _{2 in} FIG. ₂ ). The first heat sinking piece 1202 is fixed to the first end surface 111 by the fastening screw 160 and the first screw hole.

Optionally, in order to increase the contact area between the fastening screw 160 and the first heat sinking piece 1201, the fastening screw 160 passes through a first mounting baffle 171, and the area of the first mounting baffle 171 and the first The area of the fixed end of a heat sinking piece 1201 is substantially the same. For example, the length of the first heat dissipating plate 1201 is 60 and the width is 10. The length of the first mounting baffle 171 can be 10 and the width is 6. That is, the length of the first mounting baffle 171 can be It is the same width as the first heat sinking piece 1201. Alternatively, the first mounting baffle 171 may also be a circular baffle having a diameter of 10, and the first mounting baffle 171 has a certain thickness.

In this embodiment, the first mounting baffle 171 is configured to increase the contact area between the fastening screw 160 and the first heat sinking piece 1201, so that the fixing effect of the first heat sinking piece 1201 is better and more stable; Moreover, the first mounting baffle 171 has a certain thickness, and can be damped under the condition that the first heat dissipating fin 1201 is swung rapidly, and the fastening screw 160 is prevented from loosening during a long period of use, thereby enhancing heat dissipation. The effect of the pendulum.

The first end surface 111 and the vertical surface of the base have an angle between the first heat sinking piece 1201 and the vertical surface of the base when the first heat sinking piece 1201 is fixed on the first end surface 111 With an angle.

Optionally, the angle of the included angle ranges from 5° to 25°. It should be noted that the above-mentioned fixing manner in which the first heat sinking piece 1201 is fixed on the first end surface 111 is described. It can be understood that the fixing manner and the second fixing manner of the first heat sinking piece 1201 on the first end surface 111 are The fixing manner of the heat sinking piece 1202 fixed on the second end surface 112 is the same, and is not described here.

The first heat sinking piece 1201 is located on the left side of the second heat sinking piece 1202, and the angle between the first heat sinking piece 1201 and the vertical surface of the base is a first angle, the first An angle is an angle between the first heat sinking piece 1201 and a counterclockwise direction of the vertical surface, and an angle between the second heat sinking piece 1202 and a vertical surface of the base is a second angle The second angle is an angle between the second heat sink pendulum in a clockwise direction with respect to the vertical surface. That is, the first heat sinking pendulum 1201 and the second heat sinking pendulum 1202 have a third angle (as θ ₁ shown in FIG. 2 ) in each extending direction along the fixed end, and optionally, the third The angle of the included angle ranges from 10° to 50°.

For example, as shown in FIG. 2, when the first angle between the first heat sinking piece 1201 and the vertical surface of the base is 5°, the first heat sinking piece 1201 and the second heat sinking piece 1202 are symmetrically disposed. When the first angle between the first heat sinking piece 1201 and the vertical surface of the base is 5°, the third angle between the first heat sinking piece 1201 and the second heat sinking piece 1202 is 10°. In the embodiment, the first heat sinking piece 1201 and the second heat sinking piece 1202 are symmetrically arranged for convenience of description. In practical applications, the first heat sinking piece 1201 and the second heat sinking piece 1202 are not necessarily symmetric. of. Understandably, each heat sink is independent. There is also a possible implementation manner, the third angle is 0°, and the first heat sinking piece 1201 is parallel to the second heat sinking piece 1202.

In another possible implementation, the base has two fixing slots, which are respectively a first fixing slot and a second fixing slot. The fixed end of the first heat sinking flap 1201 is directly inserted into the first fixing slot. The first fixing groove is used for fixing the first heat sinking piece 1201. Similarly, the second fixing groove is used for fixing the second heat sinking piece 1202. The fixing groove has an angle with the vertical surface of the base, so that the first heat sinking piece 1201 has a first angle with the vertical surface of the base. Therefore, the second heat sinking piece 1202 has a second angle with the vertical surface of the base. Optionally, the angle between the first angle and the second angle ranges from 5° to 25°.

It should be noted that the specific angles of the first angle and the second angle may be specifically considered according to the space size and spatial layout of the electronic device actually used by the heat sink device, and the present invention is implemented. The specific values for the angles of the first angle and the second angle are exemplified in the examples and do not constitute a limiting description of the invention.

In this embodiment, the first heat sinking piece 1201 and the second heat sinking piece 1202 and the vertical surface of the base have an angle, and the angle is used to increase the swinging area of the heat sinking piece. An angle makes each swaying piece form a fan-shaped area during the swinging process, so that the air volume generated by the heat dissipating device is significantly increased, the heat dissipating area is enlarged, and the risk of the heat dissipating pen striking the base is reduced.

The included angle also allows the drive assembly to properly apply force to the heat sink assembly. For example, if the distance between the heat sink and the driving component is small, the force between the heat sinking pendulum and the driving component is increased, and the power consumption of the driving component itself is increased, when the first heat sinking piece and the When there is an angle between the vertical faces of the base, the force between the heat sinking pendulum and the driving component is appropriate, and the power consumption of the driving component itself is reduced.

The first heat dissipating surface 1201 is provided with a first magnetic component 140. The first heat dissipating surface 1202 is provided with a second magnetic component 140. The driving component 130 includes a first electromagnet 1301 and a second electromagnet 1302. The position of the iron 1301 corresponds to the first magnetic component 1401 disposed on the first heat sinking pendulum 1201, and the position of the second electromagnet 1302 corresponds to the second magnetic component 1402 disposed on the first heat sinking pendulum 1202. The heat sinking pendulum is driven by the gravitational force or the repulsive force between the electromagnet and the magnetic component 140, and the two heat sinks are respectively driven by the two electromagnets, so that each electromagnet drives a heat sinking pendulum to work, that is, Each heat sink can work independently so that the work of the two heat sinks does not affect each other. The structure of the drive assembly 130 and the magnetic assembly 140 will be specifically described below.

3 and FIG. 4, FIG. 4 is a side view of the drive assembly.

Each of the electromagnets includes a core 1305 and a coil 1303. The coil 1303 is wound around the core 1305, and the core 1305 is located on the same axis as the coil 1303. The core 1305 is placed on the bobbin 1304. Two electromagnets can be placed on a bobbin 1304, or each electromagnet can be placed on a bobbin 1304.

When the coil is energized by the connector, the core is magnetized by the magnetic field of the energized coil, and the magnetized core becomes a magnet. The reason why the electromagnet is used as the driving assembly 130 is that the magnetic properties of the electromagnet can be turned on or off. Current control, And the magnetic size of the electromagnet can be controlled by the strength of the current or the number of turns of the coil; the magnitude of the magnetic can be controlled by changing the magnitude of the resistance; its magnetic pole can be controlled by changing the direction of the current, etc. . That is, the magnetic strength can be changed, the presence or absence of magnetism can be controlled, the direction of the magnetic pole can be changed, and the magnetic properties can disappear due to the disappearance of the current.

3 and FIG. 5, FIG. 5 is a schematic cross-sectional view of the magnetic component. The magnetic assembly 140 includes a first permanent magnet 1401, a second permanent magnet 1402, and a magnetic connector 1403. For example, the first permanent magnet 1401 and the second permanent magnet 1402 are both annular permanent magnets, and the magnetic connecting body 1403 is a cylindrical permanent magnet or iron core, and the first permanent magnet 1401 and the second permanent magnet 1402 pass. The magnetic connector 1403 is connected and fixed to both sides of the heat sinking piece, and the magnetic connecting body 1403 is a permanent magnet or a core.

The force between the magnetic component and the magnetic component is controlled by controlling the electromagnet, thereby controlling the direction of the swing of the heat sink, the amplitude of the swing, and controlling the operation and stopping of the heat sink.

In this embodiment, the magnetic component 140 on the heat sink is driven by the electromagnet to save power consumption. The working mode of driving the fan blade by the bearing in the traditional manner is changed, and the service life is prolonged; and in this embodiment, the corresponding heat sinking piece can be driven by each electromagnet, and each heat sinking piece works independently, one instant If there is a problem with the heat sink or an electromagnet, it will not affect the normal operation of the other heat sink and extend the life of the heat sink.

Optionally, in order to meet the space requirement reserved for the heat sink in different electronic devices, the applicability of the heat sink to different electronic devices is enhanced, and the positions of the drive assembly 130 and the heat sinking assembly 120 may be differently set. the way.

In one possible manner, referring to FIG. 2 , the driving component 130 is disposed between the first heat sinking fin 1201 and the first heat sinking fin 1202 . The first electromagnet 1301 is used to drive the first heat sinking piece 1201, and the second electromagnet 1302 is used to drive the first heat sinking piece 1202.

Optionally, as shown in FIG. 6, the interval between the first electromagnet and the second electromagnet is used as an airflow to the airflow passage 150 of the heat sinking wrap assembly 120, and the airflow passage 150 is used to take away the heat generated by the coil. , reduce the temperature of the electromagnetic coil.

In another possible implementation manner, referring to FIG. 7 , FIG. 7 is a structural schematic diagram of a positional relationship between the driving component 130 and the heat sinking splicing assembly 120 . The heat sinking yoke assembly 120 is disposed between the first electromagnet 1301 and the second electromagnet 1302.

It should be noted that the arrangement of the positional relationship between the above two types of driving components 130 and the heat dissipating pendulum is merely illustrative and does not result in a limited description of the present invention. Of course, the structure according to the present embodiment also has a deformed structure. For example, the position of the heat sinking assembly 120 and the driving assembly 130 are spaced apart. The first electromagnet 1301 is disposed between the first heat sinking spoke 1201 and the first heat sinking spoke 1202, and the second electromagnet 1302 is opposite to the first electromagnet. The 1301 is disposed on the other side of the first heat sink pendulum 1202.

It can be understood that each heat sinking piece is driven by an electromagnet to ensure that each heat sinking pendulum works independently, the number of heat sinking pendulums included in the heat sinking pendulum assembly 120, and the heat radiating pendulum and the electromagnet The positional relationship is not limited in the embodiment of the present invention.

The heat dissipating device provided in the embodiment of the invention has a compact structure, and the oscillating web of the heat dissipating oscillating plate assembly 120 forms a large fan-shaped area, so that the air volume generated by the oscillating heat dissipating device is significantly improved, and the heat dissipating area is enlarged. After testing, the fan heat device is completely The heat dissipation capacity of the machine reaches 65W, the natural heat dissipation capacity is doubled, and the noise sound pressure level is 26.5dB. The fan (noise sound pressure level 35dB) significantly reduces noise; the structure is simple, with good processability, and the material cost of the heat sink is 30% lower than that of the conventional fan.

As shown in FIG. 2 and FIG. 8 , an embodiment of the present invention further provides a heat sink including a housing 200 and a heat dissipation device 100 in the embodiment corresponding to FIG. 1 , the heat dissipation device being fixed to the housing The plurality of heat dissipating fins 300 are disposed on the surface of the housing. It can be understood that the plurality of radiating fins are disposed along the direction of the airflow generated by the swing of the heat dissipating swing assembly 120, and the airflow is along the direction of the radiating fins. The flow direction of the plurality of heat dissipating fins 300 and the plurality of heat dissipating fins 300 are radially distributed around the position of the heat dissipating device 100. The heat sink provided in the embodiment of the invention reorganizes the irregular airflow formed during the swinging process of the heat sinking pendulum and transmits it to a farther area; the airflow is distributed in multiple directions to enhance the heat dissipation capability.

The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the embodiments are modified, or the equivalents of the technical features are replaced by the equivalents of the technical solutions of the embodiments of the present invention.

Claims

A heat dissipating device, comprising: a base, a heat sinking pen assembly, a driving component and a magnetic component;

The driving assembly is fixed on the base, and one end of the heat sinking flap assembly is fixed on the base and is in the same plane as the base;

The heat sinking flap assembly has an angle with a vertical surface of the base;

The heat radiating pendulum assembly is provided with the magnetic component, the magnetic component corresponding to the position of the driving component, and the force between the magnetic component and the driving component drives the heat sinking pen assembly to swing .
The heat dissipation device according to claim 1, wherein the heat sinking pen assembly comprises a first heat sink pendulum and a second heat sink pendulum, the drive assembly comprising a first electromagnet and a second electromagnet, The position of the first electromagnet corresponds to the first magnetic component disposed on the first heat sinking pendulum, and the position of the second electromagnet corresponds to the second magnetic component disposed on the second heat sinking pendulum.
The heat dissipation device according to claim 2, wherein the driving component is disposed between the first heat sinking pendulum and the second heat sinking pendulum.
The heat dissipation device according to claim 2, wherein the heat sinking pen assembly is disposed between the first electromagnet and the second electromagnet.
A heat sink according to any one of claims 1 to 4, wherein the angle of the included angle ranges from 5° to 25°.
The heat dissipating device according to any one of claims 2 to 4, wherein the first heat dissipating fin is located on the left side of the second heat dissipating fin, the first heat dissipating fin and the base The angle between the vertical planes is a first angle, the first angle is an angle between the first heat sink and the counterclockwise direction of the vertical surface; the second heat sink and the angle The angle between the vertical surfaces of the base is a second angle, and the second angle is an angle between the second heat sink and the clockwise direction of the vertical surface.
The heat sink according to any one of claims 2 to 4, wherein the first heat sinking fin is parallel to the second heat sinking sheet.
The heat sink according to any one of claims 2 to 4, characterized in that the interval between the first electromagnet and the second electromagnet acts as an air flow path for the airflow to the heat sinking yoke assembly.
The heat dissipating device according to claim 1, wherein each of the heat dissipating fin assemblies is provided with the magnetic component, and the magnetic component comprises a first permanent magnet, a second permanent magnet and Magnetic connector

The first permanent magnet and the second permanent magnet are connected by the magnetic connecting body and fixed to two sides of the heat dissipating fin, and the magnetic connecting body is a permanent magnet or an iron core.
A heat sink comprising a housing and the heat dissipation device according to any one of claims 1 to 9, wherein the heat dissipation device is disposed on the housing, and the housing surface is provided with a plurality of heat dissipation The plurality of heat dissipating fins are radially distributed around the position of the heat dissipating device.
An electronic device comprising the heat sink of claim 10.