TWI573012B - Heat dissipation device - Google Patents

Description

Heat sink

A heat dissipating device, in particular, a heat dissipating device that utilizes a wave to push a gas flow and form a large air static pressure to transfer the airflow to a heat source to greatly improve heat dissipation efficiency.

In recent years, with the development of the electronics industry, the performance of electronic components has rapidly increased, the processing speed has become faster and faster, and the operation speed of the internal chipset has been continuously increased, and the number of wafers has also increased, while the aforementioned wafers are in operation. The amount of heat emitted is also increased accordingly. If these heat sources are not emitted immediately, the performance of the electronic components will be greatly affected, the processing speed of the electronic components will be reduced, and as the heat accumulates, the electronic components may be burnt, so the heat dissipation has been It is a common problem to become an important part of electronic components, and it is a common method to use a cooling fan as a heat sink.
Moreover, the development trend of electronic devices has gradually evolved toward miniaturization, such as notebook computers, tablet computers, mobile phones, etc., and in the case of miniaturization, the space inside the body of electronic devices has also been greatly reduced. In the case where the space is reduced and a large number of electronic components and circuit boards are required, there is no space in the electronic device for the cooling fan to be disposed, and the thickness of the electronic device is thinned, the fan of the cooling fan The height of the blade and the bearing must not be set in the electronic device. Therefore, in the case where the cooling fan cannot be installed in the electronic device body, the heat source generated by the electronic component can easily affect the normal operation of the electronic device. The maintenance cost of its electronic equipment has also increased relatively.
Therefore, some manufacturers have developed a piezoelectric wafer with a small external appearance and placed it in an electronic device body with limited space, and dissipates the piezoelectric wafer to the heat source in the electronic device body, but the static electricity generated by the piezoelectric wafer can be generated. Insufficient pressure can not effectively transfer air energy to a distant place, so that cold air can not produce convection and thus achieve the effect of cooling the heat source. Therefore, the heat dissipation effect on the front heat source is not good, and the heat dissipation effect of the electronic device body is poor or not. Under the circumstance, the heat source generated by the electronic components is very likely to affect the normal operation of the electronic device, and the maintenance cost of the electronic device is relatively increased.

The purpose of this creation is to provide a heat sink that can generate fluctuations to push the airflow and form a large air static pressure to transfer the airflow to the heat source to greatly improve the heat dissipation efficiency.
Another object of the present invention is to provide a heat sink that can effectively improve heat dissipation efficiency in a space-limited body.
In order to achieve the above object, the present invention provides a heat dissipating device comprising a swinging member and an orbiting member and at least one fixing seat, the swinging member having a base and a swinging member, wherein the swinging member is disposed on the a rotator is disposed on the oscillating member, and the circumscribing member has a first end and a second end and the oscillating member is assembled by the first end, and the circumscribing The piece is connected to the fixing base via the second end, whereby the swinging member can be used to drive the orbiting member to swing up and down, and when the orbiting member swings up and down, airflow fluctuation is generated and the airflow is fluctuated to the heat source. Greatly improve the efficiency of heat dissipation.

1‧‧‧heating device

2‧‧‧Wobble member

21‧‧‧Base

22‧‧‧Swinging parts

23‧‧‧Wire

3‧‧‧around parts

31‧‧‧ first end

32‧‧‧second end

4‧‧‧ Fixed seat

41‧‧‧Docking Department

5‧‧‧Components

6‧‧‧ body shell

61‧‧‧ accommodating space

62‧‧‧first opening

63‧‧‧second opening

Figure 1 is a perspective assembled view of the first preferred embodiment of the present invention;
Figure 2 is a side elevational view of the first preferred embodiment of the present invention;
Figure 3 is a schematic view showing the implementation of the first preferred embodiment of the present invention;
Figure 4 is a perspective assembled view of the second preferred embodiment of the present invention;
Figure 5 is a side elevational view of the second preferred embodiment of the present invention;
Figure 6 is a schematic view showing the implementation of the second preferred embodiment of the present invention;
Figure 7 is a schematic view showing the implementation of the third preferred embodiment of the present invention;
Figure 8A is a perspective view of the fourth preferred embodiment of the present invention;
8B is a perspective view 2 of the fourth preferred embodiment of the present invention;
Figure 9A is a top plan view of the fifth preferred embodiment of the creation;
9B is a top view of the sixth preferred embodiment of the present invention;
Figure 9C is a top plan view of the seventh preferred embodiment of the creation;
9D is a top view of the eighth preferred embodiment of the present invention;
Figure 9E is a top plan view of the ninth preferred embodiment of the present invention;
Figure 9F is a top view of the tenth preferred embodiment of the creation;
Figure 9G is a top plan view of the eleventh preferred embodiment of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
1 and 2 are a perspective view and a side view of a first preferred embodiment of the heat sink according to the present invention. As shown in the figure, the heat sink 1 of the present invention includes a swinging member 2 and an orbiting device. Piece 3 and at least one fixing seat 4;
The swinging member 2 has a base 21 and a swinging member 22, wherein the swinging member 22 is disposed on the base 21, and the swinging member 2 is a member capable of generating a regular frequency swing, and in the present embodiment In the example, the swinging member 2 is selected as a piezoelectric wafer member, and the base 21 is a piezoelectric wafer conductive seat and the swinging member 22 is a piezoelectric wafer, and the swinging member 2 has a wire 23 via the wire 23 thereof. Conductively drives its piezoelectric wafer conductive holder and causes its piezoelectric wafer to oscillate up and down.
The winding member 3 has a first end 31 and a second end 32. The first end 31 is assembled with the swinging member 22, and the second end 32 is away from the swinging member 22. The fixing member 4 is connected to the fixing base 4 via the second end 32. The fixing base 4 has a pair of connecting portions 41 and a second end 32 of the winding member 3, and the second of the winding members 3 The end 32 and the abutting portion 41 may be coupled to each other via one of an adhesive assembly, a locking assembly or a fusion assembly.
2 and 3 are a side view and a schematic diagram of a first preferred embodiment of the heat sink according to the present invention. As shown in the figure, the heat sink 1 is disposed in one of the body casings 6 The housing body 6 has at least one first opening 62 and at least one second opening 63, and at least one heat source 64 is disposed in the accommodating space 61, and the swinging member of the heat dissipating device 1 is disposed. 2 is oppositely disposed at the position of the first opening 62, so that when the wire 23 conducts power to the base 21, a resonant frequency is generated to cause the swinging member 22 to swing up and down, and the swinging member 22 is oscillated up and down. The oscillating member 3 simultaneously drives the orbiting member 3, and the circumscribing member 3 can be an elastic material (body) or a flexible member. In the present embodiment, an elastic fiber cloth is used, but it is not limited thereto. Therefore, when the swinging member 22 generates the up and down swinging swing, the first end 31 of the orbiting member 3 generates an upper and lower regular frequency swing, and the orbiting member 3 simultaneously forms an up and down swing between the segments and generates a continuous fluctuation to promote the capacity thereof. Set the airflow in the space 61 and form a larger air The pressure is sent to the fixed seat 4 and a heat source 64, and then sent from the second opening 63 and the first opening 62 into the accommodating space 61, thereby generating air inside and outside the body casing 6. The convection effect can dissipate heat for the heat source 64, thereby achieving the effect of effectively improving air convection and greatly improving heat dissipation efficiency in a space-limited body.
Please refer to FIG. 4, FIG. 5 and FIG. 6 , which are a perspective view and a side view and a schematic diagram of a second preferred embodiment of the heat sink according to the present invention. The structure is the same as that of the first embodiment described above, and therefore will not be described again here, but the difference between the embodiment and the first embodiment is that there is a set of connectors between the swinging member 2 and the orbiting member 3. 5, the first end 31 of the wrap 3 is assembled to the assembly and the other end of the set 5 is assembled to the swinging member 22 of the swinging member 2, and the set of 5 can be The winding member 3 or the swinging member 22 is assembled in any one of the bonding group, the locking grouping or the melting group, and generates a resonant frequency to cause the wire 23 to conduct power when the wire 23 conducts power to the base 21. When the member 22 generates the upper and lower oscillating oscillations, the assembly member 5 is driven at the same time and the winding member 3 is driven by the assembly member 5. Therefore, when the oscillating member 22 generates the up and down oscillating oscillation, the circumscribing member 3 simultaneously forms the upper and lower portions between the segments. Swinging and generating continuous fluctuations to push the airflow in the accommodation space 61 and forming a larger air static pressure, and The airflow is forcibly sent to the fixed seat 4 and the heat source 64, and then sent to the accommodating space 61 by the second opening 63 and the first opening 62, thereby achieving air convection effect inside and outside the body casing 6. The heat source 64 is dissipated for heat dissipation, thereby achieving the effect of effectively improving air convection and greatly improving heat dissipation efficiency in a space-limited body.
Please refer to FIG. 7 , which is a schematic diagram of the implementation of the third preferred embodiment of the heat sink device. The structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the implementation is not described herein. The difference from the first embodiment is that the swinging member 2 is a spring member, and the base 21 is a spring positioning seat and the swinging member 22 is a spring element, and the swinging member 22 generates an up and down swing swing. The winding member 3 simultaneously forms up and down swing between the segments and generates continuous fluctuations to push the airflow in the accommodation space 61 and form a large air static pressure, and forcibly flow the airflow to the fixed seat 4 and the heat source. The 64-direction is sent out, and then the second opening 63 is sent out and enters the accommodating space 61 with the first opening 62, thereby achieving air convection effect inside and outside the body casing 6 and dissipating heat to the heat source 64 thereof, thereby achieving The body with limited space can effectively improve the air convection and greatly improve the efficiency of heat dissipation.
Please refer to FIGS. 8a-8b, which are schematic diagrams of the fourth preferred embodiment of the heat dissipation device of the present invention. The number of the heat dissipating device 1 can be set according to the size of the housing space 61 of the body casing 6 and the heat source. The setting of the condition of the 64 is determined. If the device for accommodating the space 61 is large and needs to be reinforced, the plurality of heat dissipating devices 1 may be disposed in the accommodating space 61, and the heat dissipating devices 1 may be vertically or horizontally disposed. Or increase the width of the swinging member 2 and the winding member 3 and the fixing base 4 of the heat dissipating device 1 to increase the air flow rate thereof, as shown in the figure, four sets of heat dissipating devices 1 are disposed in the body casing 6 to correspond to The condition of the use of the body casing 6. Please refer to the figures 9a-9g for a top view of the fifth to tenth preferred embodiment of the heat sink of the present invention, wherein the winding member 3 can be adjusted according to requirements, such as trapezoidal, circular, or elliptical. The shape of the polygon, the irregular shape, or the shape of the umbrella can correspond to a plurality of fixing seats 4, and the applications of the shapes can be achieved by the air convection inside and outside the body casing 6 (see FIG. 3). The effect can be used to dissipate heat from the heat source, thereby achieving the effect of effectively improving air convection and greatly improving heat dissipation efficiency in a space-limited body.
In summary, the heat sink of this creation can achieve its efficacy and purpose when it is used. Therefore, this creation is a practical and excellent creation, which is in line with the application requirements for the creation of patents. The Commission will grant this case as soon as possible to protect the hard work of the creators. If there is any doubt in the arbitral tribunal, please do not hesitate to give instructions to the creators, and the creators will try their best to cooperate with them.

1‧‧‧heating device

2‧‧‧Wobble member

21‧‧‧Base

22‧‧‧Swinging parts

23‧‧‧Wire

3‧‧‧around parts

31‧‧‧ first end

32‧‧‧second end

4‧‧‧ Fixed seat

41‧‧‧Docking Department

Claims (7)

A heat dissipating device includes: a swinging member having a base and a swinging member, the swinging member is connected to the base at one end; and an orbiting member having a first end and a second end, The first end is connected to the other end of the swinging member; and at least one fixing seat is provided for the second end of the bypass member; wherein the heat dissipating device is disposed in one of the body casings In the space, the body casing has at least one first opening and at least one second opening, at least one heat source is disposed at the second opening, and the swinging member drives the winding member to the volume via the swinging member The swing in the space creates a flow fluctuation and vortexes its flow toward the heat source and convects the air between the first opening and the second opening. The heat dissipating device of claim 1, wherein the swinging member and the orbiting member further have a set of joints, and the first end of the orbiting member is assembled with the joint member and is The other end of the assembly is assembled with the swinging member of the swinging member. The heat sink of claim 1, wherein the fixing seat has a pair of joints and a second end of the bypass member. The heat sink according to claim 1, wherein the swinging member is a piezoelectric wafer member, and the base is a piezoelectric wafer conductive seat and the swinging member is a piezoelectric wafer. The heat sink of claim 4, wherein the swinging member has at least one wire. The heat dissipating device of claim 1, wherein the swinging member is a member that can swing at a regular frequency. The heat dissipating device of claim 1, wherein the orbiting member is an elastic fiber cloth.