TWI501032B - Resin composition and resin film for formation of optical waveguide, and optical waveguide using the same - Google Patents

Description

a resin composition for forming an optical waveguide, a resin film for forming an optical waveguide, and Optical waveguides using them

The present invention relates to a resin composition for an optical waveguide, a resin film for forming an optical waveguide, and an optical waveguide using the same, and more particularly to an optical waveguide which is excellent in transparency (low light propagation loss) and soluble in an alkaline aqueous solution. A resin composition, a resin film for an optical waveguide containing the resin composition, and an optical waveguide using the same.

In recent years, high speed between electronic components or between wiring boards. In high-density signal transmission, when using existing electrical wiring to transmit, mutual interference or attenuation of signals becomes an obstacle and begins to show high speed. The limit of high density. In order to break this limit, a technique of connecting light between electronic components or between wiring substrates, that is, a so-called optical interconnection has been studied. As a light transmission path, a polymer optical waveguide is attracting attention in terms of ease of processing, low cost, high degree of freedom in wiring, and high density.

It is considered that the form of the polymer optical waveguide is preferably a type of flexibility which is not applied to the hard support substrate, which is assumed to be applied to the glass epoxy substrate applied to the opto-electric hybrid substrate or to which the panels are connected to each other.

From the viewpoints of the use environment of the machine to be applied or the mounting of parts, the polymer optical waveguide requires not only transparency (low light propagation loss) but also high heat resistance. In addition, according to the requirements of increased freedom of optical wiring design, high functionalization of components, simplification of steps, etc., it is desirable to expose by exposure. A material that develops to freely form a desired pattern. The development method is envisaged with a solvent development type and an alkali development type, but with an environmental load. From the viewpoint of safety, an alkali development type is desirable. A material using a (meth)acrylic polymer is known as an optical waveguide material (see, for example, Patent Document 1).

However, the resin composition for an optical waveguide using the (meth)acrylic polymer described in this patent document can be subjected to alkali development, and has a light propagation loss of 0.3 dB/cm at a wavelength of 850 nm, but the required light is used. High speed. In high-density signal transmission, this value is not necessarily sufficient.

[Patent Literature]

[Patent Document 1]

Japanese Patent No. 4241874

The present invention has been made to solve the above problems, and an object of the invention is to provide an optical waveguide which is soluble in an alkaline aqueous solution and can be subjected to desired patterning by alkali development, and which has excellent light propagation loss at a wavelength of from 830 nm to 850 nm. A resin composition, a resin film for an optical waveguide, and an optical waveguide using the same.

The inventors of the present invention have conducted active research and found that the resin composition for forming an optical waveguide contains (A) a polymer, (B) a polymerizable compound, and (C). A polymerization initiator, which satisfies the behavioral conditions of the refractive index under a specific measurement condition or uses a specific compound to obtain an optical waveguide resin having excellent transparency (low light propagation loss), preferably alkali development A composition, a resin film for an optical waveguide, and an optical waveguide using the same.

That is, the present invention relates to the following inventions.

(1) A resin composition for forming an optical waveguide comprising (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator, and the composition is in a range of from 830 nm to 850 nm. The relationship between the refractive index A at a predetermined wavelength (λ) and the refractive index B at the predetermined wavelength (λ) is A>B, and the refractive index A is formed into a film shape at 1000 mJ/cm ² . The predetermined irradiation amount (X) in the range of 4000 mJ/cm ² is irradiated with ultraviolet rays (wavelength: 365 nm), and then heated at a predetermined temperature (T1) in the range of 160 ° C to 180 ° C in the range of 0.5 hours to 3 hours. After the predetermined time (H1), the refractive index B is formed into a film shape, and the ultraviolet rays (wavelength: 365 nm) are irradiated with the predetermined irradiation amount (X), and then the content is 0.5% by mass to 5 The specified time (H2) in the range of 1 minute to 5 minutes is immersed in a potassium carbonate aqueous solution having a predetermined concentration (C1) in a mass concentration range at a predetermined temperature (T2) in a temperature range of 20 ° C to 40 ° C, and then The sample is heated at the predetermined temperature (T1) for the predetermined time (H1) and then measured.

(2) A resin composition for forming an optical waveguide comprising (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator, and the composition is in the range of 830 nm to 850 nm. The relationship between the refractive index A at a predetermined wavelength (λ) and the refractive index C at the predetermined wavelength (λ) is AC ≧ 0.003, and the refractive index A is formed into a film shape at 1000 mJ/cm ² ~ The predetermined irradiation amount (X) in the range of 4000 mJ/cm ² is irradiated with ultraviolet rays (wavelength: 365 nm), and then heated at a predetermined temperature (T1) in the range of 160 ° C to 180 ° C in the range of 0.5 hours to 3 hours. The measurement is performed after a predetermined time (H1), and the refractive index C is obtained by forming a composition into a film shape, and irradiating the ultraviolet rays (wavelength: 365 nm) with the predetermined irradiation amount (X).

(3) A resin composition for forming an optical waveguide comprising (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator, and the composition is in a range of 830 nm to 850 nm. The relationship between the refractive index A at a predetermined wavelength (λ), the refractive index C at the predetermined wavelength (λ), and the refractive index D at the predetermined wavelength (λ) is AC>DC, and the refractive index A is a composition. It is formed into a film shape, and is irradiated with ultraviolet rays (wavelength: 365 nm) at a predetermined irradiation amount (X) in the range of 1000 mJ/cm ² to 4000 mJ/cm ² , and then at a predetermined temperature in the range of 160 ° C to 180 ° C (T1). The lower heating is measured after a predetermined time (H1) in the range of 0.5 hours to 3 hours, and the refractive index C is formed into a film shape, and the ultraviolet light (wavelength is 365 nm) is irradiated with the predetermined irradiation amount (X). After the measurement, the refractive index D is formed into a film shape, and the ultraviolet rays (wavelength: 365 nm) are irradiated with the predetermined irradiation amount (X), and then, in the range of 0.5% by mass to 5% by mass. Dipping in a potassium carbonate aqueous solution having a predetermined concentration (C1) at a predetermined temperature (T2) in a temperature range of 20 ° C to 40 ° C Time is after (H2) in the range of 1 minute to 5 minutes of measurement obtained.

The resin composition for forming an optical waveguide according to any one of the above-mentioned items, wherein the composition has a refractive index C at a predetermined wavelength (λ) in a range of 830 nm to 850 nm, The relationship with the refractive index D at the predetermined wavelength (λ) is C < D, and the refractive index C is formed into a film shape by an ultraviolet exposure machine in the range of 1000 mJ/cm ² to 4000 mJ/cm ² . The predetermined irradiation amount (X) is measured by irradiating ultraviolet rays (wavelength: 365 nm), and the refractive index D is formed into a film shape by an ultraviolet irradiation machine, and ultraviolet rays are irradiated by the predetermined irradiation amount (X) (wavelength is 365 nm), and then immersed for 1 minute at a predetermined temperature (T2) in a temperature range of 20 ° C to 40 ° C in an aqueous potassium carbonate solution having a predetermined concentration (C1) in a range of 0.5% by mass to 5% by mass. It is measured after a predetermined time (H2) within a range of 5 minutes.

The resin composition for forming an optical waveguide according to any one of the above-mentioned (1), wherein (A) the polymer is an alkali-soluble polymer having a carboxyl group, and (B) the polymerizable compound is contained in A compound having an epoxy group and an ethylenically unsaturated group in one molecule.

(6) A resin composition for forming an optical waveguide comprising (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator, and (A) a polymer having an alkali solubility having a carboxyl group The polymer (B) polymerizable compound contains a compound having an epoxy group and an ethylenically unsaturated group in one molecule.

(7) The optical waveguide forming resin group according to (5) or (6) above A compound having an epoxy group and an ethylenically unsaturated group in the above one molecule is a compound containing an aliphatic ring or an aromatic ring in one molecule.

The resin composition for forming an optical waveguide according to any one of the above aspects, wherein the compound having an epoxy group and an ethylenically unsaturated group in the above molecule has at least 1 in the molecule. a compound having an epoxy group and at least one ethylenically unsaturated group.

The resin composition for forming an optical waveguide according to any one of the above aspects, wherein the compound having an epoxy group and an ethylenically unsaturated group in the above molecule has a double in its molecule A compound of the phenol skeleton.

The resin composition for forming an optical waveguide according to any one of the above (5), wherein the (B) polymerizable compound contains an epoxy group and an ethylenic unsaturated group in one molecule. In addition to the compound of the group, at least one of a compound containing two or more ethylenically unsaturated groups in one molecule and a compound containing two or more epoxy groups in one molecule is contained.

The resin composition for forming an optical waveguide according to any one of the above aspects, wherein the (A) polymer has a carboxyl group and has a weight average molecular weight of 1,000 to 3,000,000.

The resin composition for forming an optical waveguide according to any one of the above aspects, wherein the (A) polymer has a carboxyl group and has a maleimide in the main chain. The polymer of the skeleton.

(A) The resin composition for forming an optical waveguide according to any one of the above-mentioned (1), wherein the (A) polymer is formulated in an amount relative to the (A) polymer. And (B) the total amount of the polymerizable compound is 10% by mass to 85% by mass, and the amount of the (B) polymerizable compound is 15% by mass based on the total amount of the (A) polymer and (B) the polymerizable compound. The amount of the polymerization initiator to be added is 0.1 to 10 parts by mass based on 100 parts by mass of the total of the (A) polymer and the (B) polymerizable compound.

(A) The resin composition for forming an optical waveguide according to the above (13), wherein the amount of the (A) polymer is 10% by mass based on the total amount of the (A) polymer and the (B) polymerizable compound. The amount of the (B) polymerizable compound is from 35% by mass to 90% by mass based on the total amount of the (A) polymer and the (B) polymerizable compound.

(15) A resin film for forming an optical waveguide, comprising a resin layer obtained by using the resin composition for forming an optical waveguide according to any one of the above (1) to (14).

(16) The resin film for forming an optical waveguide according to the above (15), which is a three-layer structure including a base film, a resin layer, and a protective film.

(17) The optical waveguide forming resin composition according to any one of the above (1) to (14), or the optical waveguide forming resin according to the above (15) or (16) The film forms at least one of a lower cladding layer, a core portion, and an upper cladding layer.

(18) The optical waveguide according to the above (17), wherein the optical waveguide forming resin composition or the optical waveguide forming resin film is used as the core portion.

(19) The optical waveguide according to (18) above, wherein the light propagates mainly at a high refractive index portion formed inside the core portion.

(20) The optical waveguide according to any one of (17) to (19), wherein a light propagation loss at a wavelength of 850 nm is 0.15 dB/cm or less.

(21) A method of manufacturing an optical waveguide, comprising: stacking an optical waveguide according to any one of (1) to (14) above, at least one of a lower cladding layer, a core portion, and an upper cladding layer a step of forming a resin composition or a resin film for forming an optical waveguide as described in the above (15) or (16); a step of performing exposure; a step of developing with an alkali developer; and a step of performing thermal curing.

The resin composition for an optical waveguide of the present invention and the resin film for an optical waveguide obtained by using the same are soluble in an alkaline aqueous solution, and can be relatively freely formed into a pattern, and the optical waveguide manufactured using the same is excellent in transparency and pattern. The shape is also good and the light propagation loss is low.

1‧‧‧ optical waveguide

2‧‧‧ core (core pattern)

3‧‧‧ Central Department

4‧‧‧Low refractive index

5‧‧‧Upper cladding

6‧‧‧Lower coating

7‧‧‧Substrate

8‧‧‧ Cover film

9‧‧‧Resin film for core formation

10‧‧‧Photomask

FIG. 1 is a cross-sectional view showing an example of a waveguide produced by using the resin composition for forming an optical waveguide of the present invention.

Fig. 2 is a cross-sectional view showing a configuration example of an optical waveguide of the present invention.

3 is a cross-sectional view showing a method of manufacturing an optical waveguide in which a resin film for forming an optical waveguide is used for a lower cladding layer, a core portion, and an upper cladding layer.

The inventors of the present invention have found that the surface layer refractive index of the core pattern when the core portion is formed by the alkali development process in the resin composition for forming an optical waveguide used for alkali development is increased, and the light propagated in the core portion is increased. Leakage to the outside, so the total light transmittance is lowered, whereby the light loss is deteriorated. Moreover, the reason for the analysis is judged by the assumption that the refractive index of the polymer is Lorentz-Lorenz-like approximation.

[Formula 1] refractive index n ≒ constant a × polarization (α) × material density (V) + b (1), in which alkali cations (for example, potassium ions) during alkali development are immersed in the formed pattern surface layer Thereby, the polarization (α) increases. Further, in order to eliminate this phenomenon, attention is paid to the material density (V) of the above formula, and the effect of the increase in the refractive index due to the increase in the internal material density (V) when the polarization (α) of the surface layer is increased is increased. Large, it is envisaged whether or not the internal refractive index can be made higher than that of the surface layer, and the characteristics of the entire material or the composition of the material can be studied to complete the present invention.

In the resin composition for forming an optical waveguide of the present invention, the first embodiment is a resin composition for forming an optical waveguide, which comprises (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator. The relationship between the refractive index A at a predetermined wavelength (λ) in the range of 830 nm to 850 nm and the refractive index B at the predetermined wavelength (λ) of the composition is A>B, and the refractive index A is The composition is formed into a film shape, and is irradiated with ultraviolet rays (wavelength: 365 nm) at a predetermined irradiation amount (X) in the range of 1000 mJ/cm ² to 4000 mJ/cm ² by an ultraviolet exposure machine, and then at 160 ° C to 180 ° The measurement is carried out after a predetermined time (H1) in a range of 0.5 hours to 3 hours at a predetermined temperature (T1) in the range of °C, and the refractive index B is formed into a film shape by an ultraviolet exposure machine. The predetermined irradiation amount (X) is irradiated with ultraviolet rays (wavelength: 365 nm), and then, in a potassium carbonate aqueous solution having a predetermined concentration (C1) in a range of 0.5% by mass to 5% by mass, in a temperature range of 20° C. to 40° C. Immersion at a temperature (T2) for a specified time in the range of 1 minute to 5 minutes (H2), and then measured by heating at the predetermined temperature (T1) for the predetermined time (H1).

When the resin composition is used as the core layer forming resin to form the optical waveguide, the core pattern is usually exposed to an alkali solution such as an aqueous solution of potassium carbonate when the core pattern is formed, and thus the surrounding surface layer of the formed core pattern is formed. At least a portion of the portion has a low refractive index portion having a lower refractive index than the center of the core pattern. Thereby, the light propagating in the core pattern propagates mainly in the vicinity of the center of the core pattern, so that the light loss can be made low. Further, the core pattern can be sufficiently immersed in the alkali solution after etching, patterning, or patterning, for example, the cross-sectional shape of the core pattern is rectangular and formed on the core pattern. In the case of the lower cladding layer, the low refractive index portion can be formed on the two sides of the both side walls of the core pattern or the three sides including the upper side, so that the loss can be made lower. The light loss can be made lower by further including a lower cladding layer or/and an upper cladding layer having a lower refractive index than the low refractive index portion on the outer side of the low refractive index portion.

Further, in the composition of the first embodiment, for example, the relationship between the refractive index C at a wavelength of 830 nm and the refractive index D at a wavelength of 830 nm is preferably C < D, and the refractive index C is formed into a film shape. The ultraviolet light exposure machine is used, for example, to measure ultraviolet rays (wavelength: 365 nm) of 2,500 mJ/cm ² , and the refractive index D is formed into a film shape, and ultraviolet rays of 2,500 mJ/cm ² are irradiated by an ultraviolet exposure machine ( The wavelength is 365 nm), and then measured in a potassium carbonate aqueous solution (for example, a 1 mass% potassium carbonate aqueous solution) having a predetermined concentration (C1) in a range of 0.5% by mass to 5% by mass, for example, after immersing at a temperature of 30 ° C for 2 minutes. And got it. When such a characteristic is obtained, the cation is likely to intrude into the periphery of the pattern, and the effect of suppressing the thermal crosslinking reaction at the time of heat curing by the cation can suppress the increase in the crosslinking density in the vicinity of the surface layer more than the inside. Thereby, since light mainly propagates near the center of the pattern, light loss can be made low. This is also the same in the second embodiment and the third embodiment to be described later.

Further, it is expected that after the ultraviolet irradiation, the portion exposed to the aqueous alkali solution is somewhat dissolved in the aqueous alkali solution as compared with the central portion of the core which is not affected by the aqueous alkali solution. As a result, it is estimated that the portion exposed to the aqueous alkali solution suppresses an increase in the material density (V) in the above [Formula 1] and becomes a low refractive index. This phenomenon is also effective for the low loss of the above light propagation.

In the resin composition for forming an optical waveguide of the present invention, the second embodiment is a resin composition for forming an optical waveguide, which comprises (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator. The relationship between the refractive index A at a predetermined wavelength (λ) in the range of 830 nm to 850 nm and the refractive index C at the predetermined wavelength (λ) of the composition is AC ≧ 0.003, and the refractive index A is The composition is formed into a film shape, and is irradiated with ultraviolet rays (wavelength: 365 nm) at a predetermined irradiation amount (X) in the range of 1000 mJ/cm ² to 4000 mJ/cm ² , and then in the range of 160 ° C to 180 ° C. The heating is carried out at a temperature (T1) for a predetermined time (H1) in the range of 0.5 hours to 3 hours, and the refractive index C is formed into a film shape, and the ultraviolet rays are irradiated with the predetermined irradiation amount (X) ( The wavelength was 365 nm) and was measured.

When the above characteristics are satisfied, the increase in the refractive index after the thermosetting is large, and the refractive index increase in the vicinity of the center of the pattern can be made larger than the refractive index increase in the peripheral portion of the pattern, whereby the light mainly propagates in the center portion of the pattern, so that the light can be made. Low propagation loss.

In the resin composition for forming an optical waveguide of the present invention, the third embodiment is a resin composition for forming an optical waveguide having a relationship of refractive indices A to D of the composition of A-C>D-C. This means that the degree of refractive index fluctuation (rise) due to the increase in material density due to thermal hardening is greater than the refractive index variation (rise) due to the rise of polarization due to the inclusion of cations. As a result, the contribution to the decrease in the refractive index due to the decrease in the material density due to the thermal hardening can be increased as compared with the increase in the refractive index due to the cation, which becomes a refractive index difference which can exhibit the present invention. A necessary condition.

The specific A-C value is preferably 0.003 or more. Further, if the refractive index difference is remarkable, light propagation in a low refractive index portion where the total light transmittance is lowered can be avoided. From the above viewpoints, A-C is more preferably 0.005 or more, and particularly preferably 0.008 or more.

In the compositions of the first to third embodiments described above, the refractive index measured for the sample produced under each condition must be not affected by other factors than the physical properties of the material. Therefore, when the composition of the same embodiment is compared with the refractive index, The conditions for the irradiation amount of ultraviolet rays, the heating temperature and time, the temperature and time when immersed in the alkali developing solution, and the refractive index measurement wavelength are the same. Further, with respect to these conditions, the respective ranges specified above can be determined based on the conditions actually employed when the optical waveguide of the present invention is produced.

Among them, ultraviolet irradiation is usually carried out at a predetermined irradiation amount (X) in the range of 1000 mJ/cm ² to 4000 mJ/cm ² , preferably in the range of 2000 mJ/cm ² to 3500 mJ/cm ² which is frequently used in the production of optical waveguides. The prescribed amount of exposure within. Further, if used in the main manufacturing conditions used when the optical waveguide a predetermined amount of irradiation was studied in the range of ^{2500mJ / cm 2 ~ 3500mJ / cm} 2 , the refractive index contrast may be a standard, and therefore this range can be employed as a better By. In addition, if necessary, the range can also be specified for illuminance. In this case, the illuminance is based on 24 mW/cm ² and a predetermined illuminance in the range of ²⁰ mW/cm ² to 30 mW/cm ² is used. Each condition other than the ultraviolet irradiation amount is not problematic as long as it is a predetermined numerical value within the range described above. Further, in general, the range of the refractive index measurement wavelength is included in the wavelength region mainly used by the optical waveguide of the present invention. Further, since the measurement of the refractive index is also affected by the measurement temperature, the refractive index is compared at the same measurement temperature. The measurement is usually carried out at a predetermined temperature (for example, 25 ° C) in a room temperature region of 15 ° C to 30 ° C.

An example of an optical waveguide produced by using the resin composition for forming an optical waveguide of the present invention is shown in Fig. 1 based on the above principle. In Fig. 1, (a) of Fig. 1 is a view schematically showing a cross-sectional view of an optical waveguide, and (b) of Fig. 1 is an enlarged photograph of a cross section (a portion surrounded by a broken line) of a core portion formed in the optical waveguide. And got the photo. As shown in FIG. 1, the core portion 2 of the optical waveguide 1 forms a central portion 3 and a low refractive index portion 4. By disposing the upper cladding layer 5 having a lower refractive index and the lower cladding layer 6 disposed on the substrate 7 on the outer side of the low refractive index portion 4, the light propagating in the core pattern 2 can be leaked to a low level. The components outside the refractive index portion 4 are efficiently confined within the core pattern 2. In such an optical waveguide, for example, light propagating in the linear core pattern 2 easily propagates in the core pattern center portion 3, and light loss is low, and the core pattern 2 is bent to the outside of the core pattern 2 due to bending or the like. The light is totally reflected at the interface between the lower cladding layer 6 or the upper cladding layer 5 and the core pattern 2 having a larger refractive index difference, so that it is difficult to cause light loss.

The resin composition for forming an optical waveguide of the present invention, which is the first embodiment to the third embodiment, is a light containing (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator. The resin composition for forming a waveguide, and the component (A) is an alkali-soluble polymer having a carboxyl group, and the component (B) contains a compound having an epoxy group and an ethylenically unsaturated group in the molecule. By using such (A) component and (B) component, the above characteristics are exhibited, whereby light propagating in the pattern propagates mainly in the vicinity of the center of the pattern, and light loss can be made low.

Hereinafter, each component of the optical waveguide forming composition of the present invention will be described in detail.

About (A) ingredients

The polymer of the component (A) is usually preferably alkali-soluble, and the alkali-soluble polymer means a polymer having an alkali-soluble group (for example, a carboxyl group, a sulfonic acid group, a phenolic hydroxyl group, an alcoholic hydroxyl group, an amine group, etc.). As long as it is soluble in an aqueous alkali solution, can. The polymer is not particularly limited, and is preferably an alkali-soluble (meth)acrylic polymer. Further, the alkali-soluble group is preferably a carboxyl group.

Further, the term "(meth)acrylic acid" means acrylic acid and/or methacrylic acid.

(A) The alkali-soluble (meth)acrylic polymer is not particularly limited as long as it is dissolved in a developing solution containing an alkaline aqueous solution and has a solubility to the extent that the target development treatment is completed. For example, (meth)acrylic acid, various (meth)acrylate (alkyl (meth)acrylate, hydroxyalkyl (meth)acrylate), (meth)acrylamide, etc. (methyl) Acrylic monomers, and other monomers containing a polymerizable unsaturated group (styrene, α-methylstyrene, maleic anhydride, N-substituted or unsubstituted maleic acid) A polymer such as an imide monomer or the like is preferred.

Among these compounds, from the viewpoints of transparency, heat resistance, and solubility in an aqueous alkaline solution, it is preferred to have a maleimide skeleton using an N-substituted maleimide. More preferably, it is a copolymer with other (meth)acrylic groups. It is particularly preferable to use the structural unit (A-1) and the structural unit (A-2) represented by the following general formula (1) and (2) in the main chain, and further include the following general formula (3) An alkali-soluble (meth)acrylic polymer of at least one of the structural unit (A-3) and the structural unit (A-4) represented by the formula (4).

(wherein R ¹ to R ³ each independently represent a hydrogen atom or an organic group having 1 to 20 carbon atoms.)

(wherein R ⁴ to R ⁶ each independently represent a hydrogen atom or an organic group having 1 to 20 carbon atoms; and R ⁷ represents an organic group having 1 to 20 carbon atoms.)

(wherein R ⁷ to R ⁹ each independently represent a hydrogen atom or an organic group having 1 to 20 carbon atoms.)

(wherein R ¹⁰ to R ¹² and X ¹ each independently represent a hydrogen atom or an organic group having 1 to 20 carbon atoms.)

Examples of the organic group in the general formulae (1) to (4) include an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a carbonyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an amine methyl group, and the like. a monovalent or divalent group; the groups may further be via a hydroxyl group, a halogen atom, an alkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, a carbonyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an amine carbamoyl group Alkoxy, aryloxy, alkylthio, arylthio, amine, decyl, and the like are substituted.

In the alkali-soluble (meth)acrylic acid polymer (A), the content of the structural unit (A-1) derived from the maleimide skeleton is preferably from 3% by mass to 50% by mass. When it is 3% by mass or more, heat resistance derived from maleimide is obtained, and when it is 50% by mass or less, transparency is sufficient, and the obtained resin pattern does not become brittle. From the above viewpoints, it is particularly preferably from 5% by mass to 40% by mass, particularly preferably from 10% by mass to 30% by mass.

The structure of the structural unit (A-1) derived from maleimide is not particularly limited as long as it is represented by the general formula (1).

The maleimide which becomes a raw material of the structural unit (A-1) can be, for example Listed: N-methyl maleimide, N-ethyl maleimide, N-propyl maleimide, N-isopropyl maleimide , N-butyl maleimide, N-isobutyl maleimide, N-2-methyl-2-propyl maleimide, N-pentyl maleic acid Imine, N-2-pentyl maleimide, N-3-pentyl maleimide, N-2-methyl-1-butyl maleimide, N- 2-methyl-2-butyl maleimide, N-3-methyl-1-butyl maleimide, N-3-methyl-2-butyl maleimide, N -hexyl maleimide, N-2-hexyl maleimide, N-3-hexyl maleimide, N-2-methyl-1-pentylbutene Dimethyleneimine, N-2-methyl-2-pentylmethyleneimine, N-2-methyl-3-pentylmethyleneimine, N-3-methyl- 1-pentylmethyleneimine, N-3-methyl-2-pentylmethyleneimine, N-3-methyl-3-pentylmethyleneimine, N-4-methyl-1-pentylmethyleneimine, N-4-methyl-2-pentylmethyleneimine, N-2,2-dimethyl-1- Butyl cis-butene Yttrium, N-3,3-dimethyl-1-butyl maleimide, N-3,3-dimethyl-2-butyl maleimide, N-2,3- Dimethyl-1-butyl maleimide, N-2,3-dimethyl-2-butyl maleimide, N-hydroxymethyl maleimide, N-1 -hydroxyethyl maleimide, N-2-hydroxyethyl maleimide, N-1-hydroxy-1-propyl maleimide, N-2-hydroxyl -1-propyl maleimide, N-3-hydroxy-1-propyl maleimide, N-1-hydroxy-2-propyl maleimide, N -2-hydroxy-2-propyl maleimide, N-1-hydroxy-1-butyl maleimide, N-2-hydroxy-1-butyl maleimide, N -3-hydroxy-1-butyl maleimide, N-4-hydroxy-1-butyl maleimide, N-1-hydroxy-2-butyl maleimide, N-2 -hydroxy-2-butyl Maleimide, N-3-hydroxy-2-butyl maleimide, N-4-hydroxy-2-butyl maleimide, N-2-methyl-3-hydroxyl -1-propyl maleimide, N-2-methyl-3-hydroxy-2-propyl maleimide, N-2-methyl-2-hydroxy-1-propene Isobutyleneimine, N-1-hydroxy-1-pentylmethyleneimine, N-2-hydroxy-1-pentylmethyleneimine, N-3-hydroxyl 1-pentyl maleimide, N-4-hydroxy-1-pentyl maleimide, N-5-hydroxy-1-pentylmethyleneimine, N 1-hydroxy-2-pentylmethyleneimine, N-2-hydroxy-2-pentylmethyleneimine, N-3-hydroxy-2-pentylbutylene Imine, N-4-hydroxy-2-pentylmethyleneimine, N-5-hydroxy-2-pentylmethyleneimine, N-1-hydroxy-3-pentyl Butyleneimine, N-2-hydroxy-3-pentylmethyleneimine, N-3-hydroxy-3-pentylmethyleneimine, N-1-hydroxy-2 -methyl-1-butyl maleimide, N-1-hydroxy-2-methyl-2-butyl maleimide, N-1-hydroxy-2-methyl-3-butyl cis Equinone imine, N-1-hydroxy-2-methyl -4-butyl maleimide, N-2-hydroxy-2-methyl-1-butyl maleimide, N-2-hydroxy-2-methyl-3-butyl maleate Imine, N-2-hydroxy-2-methyl-4-butyl maleimide, N-2-hydroxy-3-methyl-1-butyl maleimide, N-2-hydroxyl -3-methyl-2-butyl maleimide, N-2-hydroxy-3-methyl-3-butyl maleimide, N-2-hydroxy-3-methyl-4- Butyl maleimide, N-4-hydroxy-2-methyl-1-butyl maleimide, N-4-hydroxy-2-methyl-2-butyl maleimide, N-1-hydroxy-3-methyl-2-butyl maleimide, N-1-hydroxy-3-methyl-1-butyl maleimide, N-1-hydroxy-2, 2-dimethyl-1-propyl maleimide, N-3-hydroxy-2,2-dimethyl-1-propyl maleimide, N-1-hydroxy- 1-hexylmethyleneimine, N-1-hydroxy-2- Hexyl maleimide, N-1-hydroxy-3-hexylmethyleneimine, N-1-hydroxy-4-hexylmethyleneimine, N-1-hydroxy-5 -hexyl maleimide, N-1-hydroxy-6-hexylmethyleneimine, N-2-hydroxy-1-hexylmethyleneimine, N-2-hydroxy- 2-hexylmethyleneimine, N-2-hydroxy-3-hexylmethyleneimine, N-2-hydroxy-4-hexylmethyleneimine, N-2-hydroxyl -5-hexylmethyleneimine, N-2-hydroxy-6-hexylmethyleneimine, N-3-hydroxy-1-hexylmethyleneimine, N-3- Hydroxy-2-hexylmethyleneimine, N-3-hydroxy-3-hexylmethyleneimine, N-3-hydroxy-4-hexylmethyleneimine, N-3 -hydroxy-5-hexylmethyleneimine, N-3-hydroxy-6-hexylmethyleneimine, N-1-hydroxy-2-methyl-1-pentylbutene Yttrium imine, N-1-hydroxy-2-methyl-2-pentylmethyleneimine, N-1-hydroxy-2-methyl-3-pentylmethyleneimine, N-1-hydroxy-2-methyl-4-pentylmethyleneimine, N-1-hydroxy-2-methyl-5-pentylmethyleneimine, N-2- Hydroxy-2-methyl-1- Pentyl maleimide, N-2-hydroxy-2-methyl-2-pentylmethyleneimine, N-2-hydroxy-2-methyl-3-pentyl cis Iridyl imine, N-2-hydroxy-2-methyl-4-pentylmethyleneimine, N-2-hydroxy-2-methyl-5-pentyl-butenylene Amine, N-2-hydroxy-3-methyl-1-pentylmethyleneimine, N-2-hydroxy-3-methyl-2-pentylmethyleneimine, N- 2-hydroxy-3-methyl-3-pentylmethyleneimine, N-2-hydroxy-3-methyl-4-pentylmethyleneimine, N-2-hydroxy- 3-methyl-5-pentylmethyleneimine, N-2-hydroxy-4-methyl-1-pentylmethyleneimine, N-2-hydroxy-4-methyl -2-pentyl maleimide, N-2-hydroxy-4-methyl-3-pentyl maleimide, N-2-hydroxy-4-methyl-4-pentyl Cis-butenylene imine, N-2-hydroxy-4-methyl-5-pentylmethyleneimine, N-3-hydroxy-2-methyl 1-ylpentyl maleimide, N-3-hydroxy-2-methyl-2-pentylmethyleneimine, N-3-hydroxy-2-methyl-3- Pentyl maleimide, N-3-hydroxy-2-methyl-4-pentylmethyleneimine, N-3-hydroxy-2-methyl-5-pentyl cis Iridyl imine, N-1-hydroxy-4-methyl-1-pentylmethyleneimine, N-1-hydroxy-4-methyl-2-pentylbutenyl Amine, N-1-hydroxy-4-methyl-3-pentylmethyleneimine, N-1-hydroxy-4-methyl, N-1-hydroxy-3-methyl-1-pentyl Isobutyleneimine, N-1-hydroxy-3-methyl-2-pentylmethyleneimine, N-1-hydroxy-3-methyl-3-pentylbutene Diimine, N-1-hydroxy-3-methyl-4-pentylmethyleneimine, N-1-hydroxy-3-methyl-5-pentylmethyleneimine , N-3-hydroxy-3-methyl-1-pentylmethyleneimine, N-3-hydroxy-3-methyl-2-pentylmethyleneimine, N-1 -hydroxy-3-ethyl-4-butyl maleimide, N-2-hydroxy-3-ethyl-4-butyl maleimide, N-2-hydroxy-2-ethyl- 1-butyl maleimide, N-4-hydroxy-3-ethyl-1-butyl maleimide, N-4- 3-ethyl-2-butyl maleimide, N-4-hydroxy-3-ethyl-3-butyl maleimide, N-4-hydroxy-3-ethyl-4 -butyl maleimide, N-1-hydroxy-2,3-dimethyl-1-butyl maleimide, N-1-hydroxy-2,3-dimethyl-2-butyl Butylene diimide, N-1-hydroxy-2,3-dimethyl-3-butyl maleimide, N-1-hydroxy-2,3-dimethyl-4-butyl-n-butene Diquinone imine, N-2-hydroxy-2,3-dimethyl-1-butyl maleimide, N-2-hydroxy-2,3-dimethyl-3-butyl-n-butylene Imine, N-2-hydroxy-2,3-dimethyl-4-butyl maleimide, N-1-hydroxy-2,2-dimethyl-1-butyl maleimide , N-1-hydroxy-2,2-dimethyl-3-butyl maleimide, N-1-hydroxy-2,2-dimethyl-4-butyl maleimide, N -2-hydroxy-3,3-dimethyl-1-butylsandene Amine, N-2-hydroxy-3,3-dimethyl-2-butyl maleimide, N-2-hydroxy-3,3-dimethyl-4-butyl maleimide, N-1-hydroxy-3,3-dimethyl-1-butyl maleimide, N-1-hydroxy-3,3-dimethyl-2-butyl maleimide, N- Alkyl maleimide, such as 1-hydroxy-3,3-dimethyl-4-butyl maleimide, N-cyclopropyl maleimide, N-cyclobutyl cis Equinone imine, N-cyclopentyl maleimide, N-cyclohexyl maleimide, N-cycloheptyl maleimide, N-cyclooctylbutene Dimethyleneimine, N-2-methylcyclohexylmethyleneimine, N-2-ethylcyclohexylmethyleneimine, N-2-chlorocyclohexylbutylene Cycloalkyl succinimide such as amine; N-phenyl maleimide, N-2-methylphenyl maleimide, N-2-ethylphenyl cis An aryl maleimide or the like such as butylene diimine or N-2-chlorophenyl maleimide.

Among these compounds, from the viewpoints of transparency and solubility, it is preferred to use a cycloalkyl maleimide, and particularly preferably N-cyclohexylmethyleneimine, N-2. -Methylcyclohexylm-butyleneimine.

These compounds may be used singly or in combination of two or more.

In the case of using an alkali-soluble (meth)acrylic polymer containing a maleimide skeleton in the main chain as the component (A), the structural unit derived from (meth)acrylate (A-2) The content ratio is preferably from 20% by mass to 90% by mass. When it is 20% by mass or more, transparency derived from (meth) acrylate is obtained, and when it is 90% by mass or less, heat resistance is sufficient. From the above viewpoints, it is particularly preferably from 25% by mass to 85% by mass, particularly preferably from 30% by mass to 80% by mass.

The structure of the structural unit (A-2) derived from (meth) acrylate is as long as it is The formula (2) is not particularly limited.

The (meth) acrylate used in the component (A) of the present invention (the raw material of the structural unit (A-2) in the preferred embodiment) may, for example, be methyl (meth)acrylate or ethyl (meth)acrylate. Ester, butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, butoxyethyl (meth)acrylate, isoamyl (meth)acrylate, ( Hexyl methacrylate, 2-ethylhexyl (meth)acrylate, heptyl (meth)acrylate, octylheptyl (meth)acrylate, decyl (meth)acrylate, decyl (meth)acrylate , undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate Base ester, cetyl (meth) acrylate, stearyl (meth) acrylate, behenyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-(meth) acrylate Hydroxypropyl ester, 3-chloro-2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxylated polyethylene Alcohol (meth) acrylate, methoxy polypropylene An aliphatic (meth) acrylate such as an alcohol (meth) acrylate, an ethoxypolypropylene glycol (meth) acrylate or a mono(2-(methyl) propylene oxyethyl) succinate; Cyclopentyl acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate, mono (2- (Methyl) propylene oxiranyl ethyl) tetrahydrophthalate, mono(2-(methyl) propylene oxyethyl) hexahydrophthalate, alicyclic (methyl) Acrylate; benzyl (meth) acrylate, phenyl (meth) acrylate, o-phenyl phenyl (meth) acrylate, 1-naphthyl (meth) acrylate, (meth) acrylate 2 -naphthyl ester, phenoxyethyl (meth)acrylate, p-cumylphenoxyethyl (meth)acrylate, o-phenylphenoxyethyl (meth)acrylate, (meth)acrylic acid 1-naphthyloxyethyl ester, 2-naphthyloxyethyl (meth)acrylate, phenoxy polyethylene glycol (meth) acrylate, nonyl phenoxy polyethylene glycol (meth) acrylate , phenoxy polypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydroxy-3-(o-phenylphenoxy) (meth) acrylate Aromatic (methyl) such as ester, 2-hydroxy-3-(1-naphthalenyloxy)propyl (meth)acrylate, 2-hydroxy-3-(2-naphthyloxy)propyl (meth)acrylate Acrylate; 2-tetrahydrofurfuryl (meth)acrylate, N-(methyl)propenyloxyethylhexahydrophthalamide, 2-(methyl)propenyloxyethyl- Heterocyclic (meth) acrylates such as N-carbazole, their caprolactone modified bodies, and the like.

Among these compounds, from the viewpoints of transparency and heat resistance, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and (meth)acrylic acid 2- are preferred. An aliphatic (meth) acrylate such as ethylhexyl acrylate; the above alicyclic (meth) acrylate; the above aromatic (meth) acrylate; and the above heterocyclic (meth) acrylate.

These compounds may be used singly or in combination of two or more.

In the alkali-soluble (meth)acrylic acid polymer, the content of the structural unit (A-3) and the structural unit (A-4) derived from a compound having a carboxyl group and an unsaturated ethylenic double bond is preferably 3 Mass%~60% by mass. When it is 3% by mass or more, it is easily dissolved in a developing solution containing an alkaline aqueous solution or the like, and when it is 60% by mass or less, a layer of a photosensitive resin composition is selectively removed by development to form a pattern. In the development step, the development liquid resistance (the property which is not removed by development and the portion which becomes a pattern is not invaded by the developer) is good. From the above viewpoints, it is particularly preferably from 5% by mass to 50% by mass, particularly preferably from 10% by mass to 40% by mass.

The structural unit (A-3) and the structural unit (A-4) derived from a compound having a carboxyl group and an ethylenically unsaturated group are as long as they are represented by the general formula (3) or the general formula (4). There are no special restrictions.

Examples of the compound having a carboxyl group and an ethylenically unsaturated group which are raw materials of the structural unit (A-3) include (meth)acrylic acid, maleic acid, fumaric acid, crotonic acid, and itaconic acid. And citraconic acid, mesaconic acid, cinnamic acid, etc., among these compounds, from the viewpoints of transparency and alkali solubility, (meth)acrylic acid, maleic acid, fumaric acid, Butenoic acid.

Further, maleic anhydride can be used as a raw material, and after polymerization, it can be converted into a structural unit (A-3) by ring opening with an appropriate alcohol such as methanol, ethanol or propanol. These compounds may be used singly or in combination of two or more.

Examples of the compound having a carboxyl group and an ethylenically unsaturated group which are raw materials of the structural unit (A-4) include succinic acid mono(2-(methyl)acryloxyethyl)ester and phthalic acid mono( 2-(Methyl)propenyloxyethyl)ester, mono(2-(methyl)propenyloxyethyl) isophthalate, mono(2-(methyl)propene phthalate Oxyethyl)ester, mono(2-(methyl)propenyloxyethyl)tetrahydrophthalate, mono(2-(methyl)propenyloxyethyl hexahydrophthalate ) ester, hexahydroisophthalic acid mono(2-(methyl) propylene methoxyethyl) ester, hexahydroterephthalic acid mono(2-(methyl) propylene methoxyethyl) ester, ω -carboxy-polycaprolactone mono(meth)acrylate, 3-vinylbenzoic acid, 4-vinylbenzoic acid, and the like.

Among these compounds, from the viewpoints of transparency and alkali solubility, preferred are: succinic acid mono(2-(methyl)acryloxyethyl)ester, tetrahydrophthalic acid single (2-(Methyl)propenyloxyethyl)ester, hexahydrophthalic acid mono(2-(methyl)propenyloxyethyl)ester, hexahydroisophthalic acid mono(2-( Methyl)propenyloxyethyl)ester, hexahydroterephthalic acid mono(2-(methyl)propenyloxyethyl)ester.

These compounds may be used singly or in combination of two or more.

Further, the (A) alkali-soluble (meth)acrylic polymer may optionally contain structural units other than the structural unit (A-1) to the structural unit (A-4).

The compound having an ethylenically unsaturated group which is a raw material of such a structural unit is not particularly limited, and examples thereof include styrene, α-methylstyrene, vinyltoluene, vinyl chloride, vinyl acetate, and vinylpyridine. N-vinylpyrrolidone, N-vinylcarbazole, butadiene, isoprene, chloroprene, and the like. Among these compounds, styrene, α-methylstyrene, vinyltoluene, and N-vinylcarbazole are particularly preferably used from the viewpoint of heat resistance and transparency.

These compounds may be used singly or in combination of two or more.

(A) The alkali-soluble (meth)acrylic polymer is not particularly limited in its synthesis, and for example, it can be a structural unit by using maleic imide which is a raw material of the structural unit (A-1). (2) a (meth) acrylate of a raw material, and a compound having a carboxyl group and an ethylenically unsaturated group which are a raw material of the structural unit (A-3) and/or the structural unit (A-4), and optionally Other compounds having an ethylenically unsaturated group and a suitable polymerization initiator (preferably a radical polymerization initiator) are obtained by copolymerization. At this time, an organic solvent may be used as a reaction solvent as needed.

The polymerization initiator used in the present invention is not particularly limited, and for example, it can be listed. A ketone peroxide such as methyl ethyl ketone peroxide, cyclohexanone peroxide or methyl cyclohexanone peroxide; 1,1-bis(t-butylperoxy)cyclohexane, 1 , 1-bis(t-butylperoxy)-2-methylcyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, 1, 1-bis(Third-hexylperoxy)cyclohexane, 1,1-bis(Third-hexylperoxy)-3,3,5-trimethylcyclohexane and other peroxy ketals; Hydroperoxides such as oxides; α,α'-bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, tert-butylcumyl peroxide, di-third Dialkyl peroxides such as cyano peroxides; bisinyl peroxides such as octyl sulfoxide, lauryl peroxide, stearyl peroxide, benzamidine peroxide; peroxydicarbonate Bis(4-tert-butylcyclohexyl) ester, di-2-ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-3-methoxycarbonate Peroxycarbonate such as butyl ester; third butyl peroxypivalate, third hexyl peroxypivalate, peroxy-2-ethylhexanoic acid 1,1 ,3,3-tetramethylbutyl ester, 2,5-dimethyl-2,5-bis(2-ethylhexylperoxy)hexane, peroxy-2-ethylhexanoic acid Ester, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxyisobutyrate, trihexyl isopropyl monocarbonate, peroxy-3,5,5-trimethyl Tert-butyl hexanoate, tert-butyl laurate, tert-butyl isopropyl monocarbonate, tert-butyl peroxy-2-ethylhexyl monocarbonate, third butyl peroxybenzoate a peroxy ester such as an ester, a third hexyl peroxybenzoate, a 2,5-dimethyl-2,5-bis(benzimidyl peroxy)hexane, a third butyl peroxyacetate; 2,2 '-Azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(4-methoxy-2'-dimethyl An azo compound or the like such as valeronitrile.

The organic solvent used as the above reaction solvent is soluble (A) The alkali-soluble polymer is not particularly limited, and examples thereof include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene, and cymene; tetrahydrofuran, 1 a cyclic ether such as 4-dioxane; an alcohol such as methanol, ethanol, isopropanol, butanol, ethylene glycol or propylene glycol; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4 Ketones such as -hydroxy-4-methyl-2-pentanone; esters of methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, γ-butyrolactone; ethylene carbonate, propylene carbonate Diester and other carbonates; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol Polyol alkyl ethers such as methyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether Ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether Polyol alkyl ether acetates such as acid esters, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate; N,N-dimethylformamide, N,N-dimethyl A decylamine such as acetamide or N-methylpyrrolidone.

These organic solvents may be used singly or in combination of two or more.

Further, the (A) alkali-soluble (meth)acrylic polymer may optionally contain an ethylenically unsaturated group in the side chain. The composition or synthesis method is not particularly limited, and for example, a compound having at least one ethylenically unsaturated group and one functional group such as an epoxy group, an oxetanyl group, an isocyanate group, a hydroxyl group or a carboxyl group can be used. The (A) (meth)acrylic polymer is subjected to an addition reaction, and an ethylenically unsaturated group is introduced into the side chain.

These compounds are not particularly limited, and examples thereof include glycidyl (meth)acrylate, α-ethyl glycidyl (meth)acrylate, α-propyl glycidyl (meth)acrylate, and (methyl). Α-butyl glycidyl acrylate, 2-methyl glycidyl (meth) acrylate, 2-ethyl glycidyl (meth) acrylate, 2-propyl glycidyl (meth) acrylate, (A) 3,4-epoxybutyl acrylate, 3,4-epoxyheptyl (meth)acrylate, α-ethyl-6,7-epoxyheptyl (meth)acrylate, (A) Ethylene acrylate, 3,4-epoxycyclohexyl acrylate, o-vinyl benzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, etc. having ethylenically unsaturated groups and rings a compound of an oxy group; (2-ethyl-2-oxetanyl)methyl (meth)acrylate, (2-methyl-2-oxetanyl)methyl (meth)acrylate, ( 2-(2-ethyl-2-oxetanyl)ethyl (meth)acrylate, 2-(2-methyl-2-oxetanyl)ethyl (meth)acrylate, (methyl) ) 3-(2-ethyl-2-oxetanyl)propyl acrylate, 3-(2-methyl-2-oxetanyl (meth)acrylate a compound having an ethylenically unsaturated group and an oxetanyl group such as propyl ester; a compound having an ethylenically unsaturated group and an isocyanate group such as 2-(meth)acryloxycarbonylethyl isocyanate; ) 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, etc., having ethylenic unsaturation And hydroxy-based compounds; (meth)acrylic acid, crotonic acid, cinnamic acid, succinic acid (2-(methyl) propylene methoxyethyl) ester, (meth)acrylic acid 2-phthalimyl Ethyl ester, 2-tetrahydrophthalic acid ethyl (meth)acrylate, 2-hexahydrophthalic acid ethyl (meth)acrylate, ω-carboxy-polycaprolactone single (A) A compound having an ethylenically unsaturated group and a carboxyl group, such as an acrylate, 3-vinylbenzoic acid or 4-vinylbenzoic acid.

Among these compounds, from the viewpoints of transparency and reactivity, glycidyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, and isocyanic acid (A) are preferred. Ethyl acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, (meth)acrylic acid, crotonic acid, ( 2-Hydroxyphthalic acid ethyl methacrylate. These compounds may be used singly or in combination of two or more.

The weight average molecular weight of the (A) alkali-soluble polymer is preferably from 1,000 to 3,000,000. When it is 1,000 or more, since the molecular weight is large, the strength of the cured product when the resin composition is formed is sufficient, and when it is 3,000,000 or less, the solubility in the developing solution containing the alkaline aqueous solution or (B) polymerization is satisfied. The compatibility of the compounds is good. From the above viewpoints, it is particularly preferable to set it as 3,000 to 2,000,000, and particularly preferably to set it as 5,000 to 1,000,000. Further, the weight average molecular weight in the present invention is a value measured by Gel Permeation Chromatography (GPC) and converted to standard polystyrene.

(A) The alkali-soluble (meth)acrylic acid polymer can be specified in a step of forming a pattern by selectively removing a layer of the photosensitive resin composition by development, which can be developed by using various known developing solutions. Acid value. For example, in the case of development using an aqueous alkaline solution such as sodium carbonate, potassium carbonate, tetramethylammonium hydroxide or triethanolamine, the acid value is preferably from 20 mgKOH/g to 300 mgKOH/g. When it is 20 mgKOH/g or more, development is easy, and when it is 300 mgKOH/g or less, development liquid resistance does not fall. From the above viewpoints, it is particularly preferably from 30 mgKOH/g to 250 mgKOH/g, particularly preferably from 40 mgKOH/g to 200 mgKOH/g.

When the development is carried out using an alkaline aqueous solution containing water or an aqueous alkaline solution and one or more kinds of surfactants, the acid value is preferably from 10 mgKOH/g to 260 mgKOH/g. When the acid value is 10 mgKOH/g or more, development is easy, and when it is 260 mgKOH/g or less, the development liquid resistance does not decrease. From the above viewpoints, it is particularly preferably from 20 mgKOH/g to 250 mgKOH/g, particularly preferably from 30 mgKOH/g to 200 mgKOH/g.

The compounding amount of the component (A) is preferably from 10% by mass to 85% by mass based on the total amount of the component (A) and the component (B). When the content is 10% by mass or more, the strength and flexibility of the cured product of the resin composition for forming an optical waveguide are sufficient, and when it is 85% by mass or less, it is easily incorporated by the component (B) during exposure, and is resistant. The developer properties are not insufficient. From the above viewpoints, it is particularly preferably 10% by mass or more, more preferably 15% by mass or more, and particularly preferably 20% by mass or more. Further, the upper limit is more preferably 75% by mass or less, and particularly preferably 65% by mass or less. Further, in particular, from the viewpoint of low light loss, 10% by mass to 65% by mass is also in an excellent range.

Hereinafter, the component (B) used in the present invention will be described.

The polymerizable compound of the component (B) preferably contains a compound having an epoxy group and an ethylenically unsaturated group in one molecule.

These compounds are, for example, epoxy (meth)acrylates obtained by reacting an epoxy resin having a glycidyl group in one molecule with a (meth)acrylic compound, preferably with respect to an epoxy group. The acrylic acid compound is reacted in an amount of from 0.1 equivalent to 0.9 equivalent, more preferably from 0.2 equivalent to 0.8 equivalent. It is particularly preferably from 0.4 equivalents to 0.6 equivalents.

Specific examples thereof include bisphenol A type epoxy (meth) acrylate, tetrabromo bisphenol A type epoxy (meth) acrylate, bisphenol F type epoxy (meth) acrylate, and bisphenol AF. Epoxy (meth) acrylate, bisphenol AD epoxy (meth) acrylate, biphenyl epoxy (meth) acrylate, naphthalene epoxy (meth) acrylate, fluorene epoxy Bifunctional phenol glycidyl ether such as (meth) acrylate; hydrogenated bisphenol A epoxy (meth) acrylate, hydrogenated bisphenol F epoxy (meth) acrylate, hydrogenated 2,2'-biphenol Type epoxy (meth) acrylate, hydrogenated 4,4'-biphenol type epoxy (meth) acrylate, etc. derived from hydrogenated bifunctional phenol glycidyl ether or phenol novolac type epoxy (meth) acrylate Ester, cresol novolak type epoxy (meth) acrylate, dicyclopentadiene-phenol type epoxy (meth) acrylate, tetraphenylol ethane type epoxy (meth) acrylate Ester and the like derived from polyfunctional phenol glycidyl ether; polyethylene glycol type epoxy (meth) acrylate, polypropylene glycol type epoxy (meth) acrylate, neopentyl glycol type epoxy (meth) acrylate Ester, 1,6-hexanediol type epoxy (meth) acrylate, etc. derived from a bifunctional aliphatic alcohol glycidyl ether; cyclohexane dimethanol type epoxy (meth) acrylate, tricyclodecane Dimethylol type epoxy (meth) acrylate derived from a bifunctional alicyclic olglycidyl ether; trimethylolpropane type epoxy (meth) acrylate, sorbitol type epoxy (methyl) Acrylate, glycerin type epoxy (meth) acrylate, etc. derived from polyfunctional aliphatic alcohol glycidyl ether; phthalic acid diglycidyl ester derived from bifunctional aromatic glycidyl ester; derived from tetrahydrogen An epoxy acrylate of a bifunctional alicyclic glycidyl ester such as diglycidyl phthalate or hexahydrophthalic acid diglycidyl ester.

Among these compounds, the viewpoint of transparency, high refractive index, and heat resistance Preferred are: bisphenol A epoxy (meth) acrylate, bisphenol F epoxy (meth) acrylate, bisphenol AF epoxy (meth) acrylate, bisphenol AD Epoxy (meth) acrylate, biphenyl type epoxy (meth) acrylate, naphthalene type epoxy (meth) acrylate, fluorene type epoxy (meth) acrylate, phenol novolac type epoxy ( Methyl) acrylate, cresol novolak type epoxy (meth) acrylate, cyclohexane dimethanol type epoxy (meth) acrylate, tricyclodecane dimethanol type epoxy (meth) acrylate An epoxy (meth) acrylate containing an aliphatic ring or an aromatic ring. Among them, a compound having a bisphenol skeleton in its molecule is preferred.

In addition to the compound having an epoxy group and an ethylenically unsaturated group in the above-mentioned one molecule, the polymerizable compound of the component (B) preferably contains two or more molecules in one molecule from the viewpoint of developability and heat resistance. At least one of a compound having an ethylenically unsaturated group and a compound containing two or more epoxy groups in one molecule.

Further, in the first embodiment of the composition of the present invention, a compound having an epoxy group and an ethylenically unsaturated group may not be contained.

Examples of the compound containing two or more ethylenically unsaturated groups in one molecule include (meth) acrylate, vinylidene halide, vinyl ether, vinyl ester, vinyl pyridine, vinyl decylamine, and arylated ethylene. From the viewpoint of transparency, these compounds are preferably a (meth) acrylate or an arylated vinyl group. As the (meth) acrylate, either a bifunctional or a polyfunctional one can be used.

Examples of the bifunctional (meth) acrylate include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, and tetraethylene. Alcohol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol Di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, ethoxy Polypropylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(methyl) Acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 2-butyl-2-ethyl-1 , 3-propanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-nonanediol di(meth)acrylate, glycerol di(meth)acrylate An aliphatic (meth) acrylate such as tricyclodecane dimethanol (meth) acrylate or ethoxylated 2-methyl-1,3-propanediol di(meth) acrylate; cyclohexane dimethanol (Meth) acrylate, ethoxylated cyclohexane dimethanol (meth) acrylate, propoxylated cyclohexane dimethanol (meth) acrylate, ethoxylated propoxylated cyclohexane Dimethanol (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, ethoxylate Tricyclodecane dimethanol (meth) acrylate, propoxylated tricyclodecane dimethanol (meth) acrylate, ethoxylated propoxylated tricyclodecane dimethanol (meth) acrylate Ester, ethoxylated hydrogenated bisphenol A di(meth) acrylate, propoxylated hydrogenated bisphenol A di(meth) acrylate, ethoxylated propoxylated hydrogenated bisphenol A di(methyl) Acrylate, ethoxylated hydrogenated bisphenol F di(meth) acrylate, propoxylated hydrogenated bisphenol F di(meth) acrylate, ethoxylated propoxylated hydrogenated bisphenol F II Alicyclic (meth) acrylate such as methyl acrylate; ethoxylated bisphenol A di(meth) acrylate, propoxylated bisphenol A di(meth) acrylate, ethoxylated Propoxylated bisphenol A di(meth) acrylate, ethoxylated bisphenol F di(meth) acrylate, propoxylated bisphenol F di(meth) acrylate, ethoxylated propyl Oxylated bisphenol F di(meth) acrylate, Ethoxylated bisphenol AF di(meth)acrylate, propoxylated bisphenol AF di(meth)acrylate, ethoxylated propoxylated bisphenol AF di(meth)acrylate, B Aromatic (methyl) acrylated di(meth) acrylate, propoxylated bismuth di(meth) acrylate, ethoxylated propoxylated bismuth di(meth) acrylate Acrylate; ethoxylated di(meth) acrylate, propoxylated di(meth) acrylate, ethoxylated propoxylated iso-cyanide Heterocyclic (meth) acrylates such as acid di(meth) acrylate; their caprolactone modified bodies; aliphatic epoxides such as neopentyl glycol type epoxy (meth) acrylate (methyl) Acrylate; cyclohexane dimethanol type epoxy (meth) acrylate, hydrogenated bisphenol A type epoxy (meth) acrylate, hydrogenated bisphenol F type epoxy (meth) acrylate, etc. Oxygen (meth) acrylate; resorcinol type epoxy (meth) acrylate, bisphenol A type epoxy (meth) acrylate, bisphenol F type epoxy (meth) acrylate , bisphenol AF type epoxy (meth) acrylate, 茀 type Oxygen (meth) acrylate of aromatic epoxy (meth) acrylate.

Among these compounds, from the viewpoints of transparency and heat resistance, the above-mentioned alicyclic (meth) acrylate, the above aromatic (meth) acrylate, and the above heterocyclic (meth) acrylate are preferable. An ester, the above alicyclic epoxy (meth) acrylate, and the above aromatic epoxy (meth) acrylate.

Examples of the trifunctional or higher polyfunctional (meth) acrylate include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, and propoxylation. Trimethylolpropane tri(meth)acrylate, ethoxylated propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethoxylated pentaerythritol III ( Methyl) acrylate, propoxylated pentaerythritol tris(methyl) Acrylate, ethoxylated propoxylated pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, propoxylated pentaerythritol tetra(a) Aliphatic (meth)acrylic acid such as acrylate, ethoxylated propoxylated pentaerythritol tetra(meth)acrylate, di-trimethylolpropane tetraacrylate, dipentaerythritol hexa(meth)acrylate Ester; ethoxylated tris(meth)acrylate, propoxylated isocyanuric acid tris(meth)acrylate, ethoxylated propoxylated isomeric cyanuric acid Heterocyclic (meth) acrylates such as (meth) acrylate; their caprolactone modified bodies; phenol novolak type epoxy (meth) acrylate, cresol novolak type epoxy (methyl) An aromatic epoxy (meth) acrylate such as acrylate.

Among these compounds, a heterocyclic (meth) acrylate or an aromatic epoxy (meth) acrylate is preferred from the viewpoint of transparency and heat resistance.

These compounds may be used singly or in combination of two or more kinds thereof, or may be used in combination with other polymerizable compounds.

In the case of using the above compound having an ethylenically unsaturated group, the content thereof is preferably 10 parts by mass to 90 parts by mass, more preferably 30% by mass based on 100 parts by mass of the total amount of the polymerizable compound of the component (B). ~80 parts by mass. Particularly preferred is 40 parts by mass to 70 parts by mass.

When the compound containing two or more epoxy groups in one molecule is contained, a so-called epoxy carboxylate is formed between the carboxyl group derived from the alkali-soluble (meth)acrylic polymer of the component (A). The reaction is crosslinked to improve heat resistance or strength. Any of a bifunctional or polyfunctional can be used.

Specific examples thereof include bisphenol A epoxy resin, tetrabromobisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AF epoxy resin, bisphenol AD epoxy resin, and biphenyl. Bifunctional phenol glycidyl ether such as epoxy resin, naphthalene epoxy resin or fluorene epoxy resin; hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, hydrogenated 2,2'-biphenol Hydrogenated bifunctional phenol glycidyl ether such as epoxy resin or hydrogenated 4,4'-biphenol epoxy resin; phenol novolac epoxy resin, cresol novolak epoxy resin, dicyclopentadiene-phenol Polyfunctional phenol glycidyl ether such as epoxy resin or tetraphenol ethane epoxy resin; polyethylene glycol epoxy resin, polypropylene glycol epoxy resin, neopentyl glycol epoxy resin, 1,6 a bifunctional aliphatic alcohol glycidyl ether such as a hexanediol type epoxy resin; a bifunctional alicyclic chloroglycidyl ether such as a cyclohexane dimethanol type epoxy resin or a tricyclodecane dimethanol type epoxy resin; Polyfunctional aliphatic alcohols such as hydroxymethylpropane type epoxy resin, sorbitol type epoxy resin, and glycerin type epoxy resin Oleic ether; bifunctional aromatic glycidyl ester such as diglycidyl phthalate; bifunctional alicyclic glycidyl ester such as tetrahydrophthalic acid diglycidyl ester or hexahydrophthalic acid diglycidyl ester a 2-functional aromatic glycidylamine such as N,N-diglycidylaniline or N,N-diglycidyltrifluoromethylaniline; N,N,N',N'-tetraglycidyl-4 , 4-diaminodiphenylmethane, 1,3-bis(N,N-glycidylaminomethyl)cyclohexane, N,N,O-triglycidyl-p-aminophenol, etc. Functional aromatic glycidylamine; alicyclic dicyclooxy acetal, alicyclic diepoxy adipate, alicyclic diepoxy carboxylic acid ester, vinyl cyclohexene 2-functional alicyclic epoxy resin such as oxide; 1,2-epoxy-4-(2-epoxyethyl)cyclohexane addition of 2,2-bis(hydroxymethyl)-1-butanol Polyfunctional alicyclic ring Oxygen resin; polyfunctional heterocyclic epoxy resin such as triglycidyl isocyanurate; bifunctional or polyfunctional fluorene-containing epoxy resin such as organic polyoxyalkylene type epoxy resin.

Among these compounds, from the viewpoints of transparency and heat resistance, preferred are: bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, bisphenol AD type epoxy resin. a bifunctional phenol glycidyl ether such as a resin, a biphenyl type epoxy resin, a naphthalene type epoxy resin or a fluorene type epoxy resin; the above hydrogenated bifunctional phenol glycidyl ether; the above polyfunctional phenol glycidyl ether; and the above 2-functional alicyclic ring Glycidyl ether; the above bifunctional aromatic glycidyl ester; the above bifunctional alicyclic glycidyl ester; the above bifunctional alicyclic epoxy resin; the above polyfunctional alicyclic epoxy resin; and the above polyfunctional heterocyclic ring Epoxy resin; the above-mentioned bifunctional or polyfunctional fluorene-containing epoxy resin.

These compounds may be used singly or in combination of two or more kinds thereof, or may be used in combination with other polymerizable compounds.

Further, from the viewpoint of heat resistance, the polymerizable compound of the component (B) preferably contains, in addition to the above, a molecule selected from the group consisting of an alicyclic structure, an aryl group, an aryloxy group, and an aralkyl group. One or more kinds of at least one compound having an ethylenically unsaturated group in the group. Specific examples thereof include at least one (meth) acrylate or N-vinyl carbazole selected from the group consisting of an alicyclic structure, an aryl group, an aryloxy group, and an aralkyl group. Further, the aryl group means, for example, an aromatic heterocyclic group such as an aromatic hydrocarbon group such as a phenyl group or a naphthyl group or an oxazolyl group.

Further, in the first embodiment or the second embodiment of the composition of the present invention, a compound having an epoxy group and an ethylenically unsaturated group may not be contained. However, the case of using the above compounds.

More specifically, at least one of the compounds represented by the following general formulae (5) to (8) is preferably used as the polymerizable compound of the component (B). Alternatively, it is preferred to use at least one of the compound containing an aryl group and an ethylenically unsaturated group represented by the following general formulae (5) to (8) as the polymerizable compound of the component (B). Implementation.

(where, Ar represents

Any of the groups; X ² represents O (oxygen atom), S (sulfur atom), OCH ₂ , SCH ₂ , O(CH ₂ CH ₂ O)a, O[CH ₂ CH(CH ₃ )O]b Any divalent group of OCH ₂ CH(OH)CH ₂ O; Y ¹ represents

Any of the divalent groups (the binding chain is in the vicinity of each structure); R ¹³ represents any of a hydrogen atom and a methyl group; and R ¹⁴ to R ³⁰ independently represent a hydrogen atom, a fluorine atom, and a carbon number of 1 to 20; Any one of an organic group and a fluorine-containing organic group having 1 to 20 carbon atoms; a and b each independently represent an integer of 1 to 20, and c represents an integer of 2 to 10. )

(where R ³¹ represents

Any of the groups; R ³² to R ³⁴ each independently represent a hydrogen atom or a methyl group; and d represents an integer of 1 to 10. )

(wherein X ³ and X ⁴ each independently represent any divalent group of O, S, O(CH ₂ CH ₂ O)e, O[CH ₂ CH(CH ₃ )O]f; Y2 represents

Any of the divalent groups (the binding chain is in the vicinity of each structure); R ³⁵ and R ⁴⁰ each independently represent a hydrogen atom or a methyl group; and R ³⁶ to R ³⁹ each independently represent a hydrogen atom or a fluorine atom; Any one of an organic group having 1 to 20 carbon atoms and a fluorine-containing organic group having 1 to 20 carbon atoms; e and f each independently represent an integer of 1 to 20, and g represents an integer of 2 to 10. )

(where Y ³ represents

Any of the divalent groups (the binding chain is in the vicinity of each structure); R ⁴¹ and R ⁴⁶ each independently represent a hydrogen atom or a methyl group; and R ⁴² to R ⁴⁵ each independently represent a hydrogen atom or a fluorine atom; Any one of an organic group having 1 to 20 carbon atoms and a fluorine-containing organic group having 1 to 20 carbon atoms; h is an integer of 1 to 5, and i is an integer of 2 to 10. )

Further, examples of the organic group in the general formulae (5) to (8) include the same examples as those described in the general formula (1) to the general formula (4).

The blending amount of the polymerizable compound of the component (B) is preferably 15% by mass to 90% by mass based on the total amount of the component (A) and the component (B). When it is 15% by mass or more, the (A) alkali-soluble (meth)acrylic polymer is easily incorporated and hardened, and the development liquid resistance is not insufficient. In addition, when it is 90% by mass or less, the film strength or flexibility of the cured film is sufficient. From the above viewpoints, it is particularly preferably from 30% by mass to 80% by mass.

Hereinafter, the component (C) used in the present invention will be described.

The polymerization initiator of the component (C) is not particularly limited as long as it is polymerized by irradiation with heat or ultraviolet rays, for example, a polymerizable compound using a compound having an ethylenically unsaturated group as the component (B). In case of The thermal radical polymerization initiator, the photoradical polymerization initiator, and the like are preferably a photoradical polymerization initiator in terms of a fast curing rate and room temperature curing.

Examples of the thermal radical polymerization initiator include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis (third butyl) Base peroxidation) cyclohexane, 1,1-bis(t-butylperoxy)-2-methylcyclohexane, 1,1-bis(t-butylperoxy)-3,3,5- Trimethylcyclohexane, 1,1-bis(Third-hexylperoxy)cyclohexane, 1,1-bis(Third-hexylperoxy)-3,3,5-trimethylcyclohexane, etc. Oxidized ketal; hydroperoxide such as p-menthan hydroperoxide; α,α'-bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, tert-butyl cumyl Dialkyl peroxides such as peroxides and di-tert-butyl peroxide; diterpene peroxide, lauryl peroxide, stearyl peroxide, benzamidine peroxide, etc. Base peroxide; bis(4-tert-butylcyclohexyl) peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, Peroxycarbonate such as di-3-methoxybutyl oxycarbonate; tert-butyl peroxypivalate, pivalic acid peroxidate Trihexyl ester, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis(2-ethylhexyl peroxide) Hexane, third hexyl peroxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxyisobutyrate, isopropyl monocarbonate Trihexyl ester, tert-butyl peroxy-3,5,5-trimethylhexanoate, tert-butyl peroxy laurate, tert-butyl peroxydicarbonate, peroxy-2-ethyl Tert-butyl monocarbonate, tert-butyl peroxybenzoate, third hexyl peroxybenzoate, 2,5-dimethyl-2,5-bis(benzimidyl peroxy)hexane Peroxyesters such as tributyl acrylate acetate; 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethyl An azo compound such as valeronitrile or 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile).

Among these compounds, from the viewpoint of curability, transparency, and heat resistance, the above-described dimercapto peroxide, the peroxyester, and the above azo compound are preferable.

The photoradical polymerization initiator may, for example, be a benzoin ketal such as 2,2-dimethoxy-1,2-diphenylethane-1-one; 1-hydroxycyclohexyl phenyl ketone; , 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propane- Α-hydroxyketone such as 1-ketone; 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butan-1-one, 1,2-methyl-1- Α-amino ketone such as [4-(methylthio)phenyl]-2-morpholinylpropan-1-one; 1-[(4-phenylthio)phenyl]-1,2-octyl An oxime ester such as diketone-2-(benzhydryl)fluorene; bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide, bis(2,6-dimethoxybenzamide) a phosphine oxide such as -2,4,4-trimethylpentylphosphine oxide or 2,4,6-trimethylbenzimidyldiphenylphosphine oxide; 2-(o-chlorophenyl)-4, 5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-di Phenyl imidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole 2,4,5-triaryl imidazole dimer such as polymer; diphenyl ketone, N, N'-tetramethyl-4, 4'- Diphenyl such as aminodiphenyl ketone, N,N'-tetraethyl-4,4'-diaminodiphenyl ketone, 4-methoxy-4'-dimethylaminodiphenyl ketone Ketone compound; 2-ethyl anthraquinone, phenanthrenequinone, 2-tert-butyl fluorene, octamethyl hydrazine, 1,2-benzopyrene, 2,3 -benzopyrene, 2-phenylindole, 2,3-diphenylanthracene, 1-chloroindole, 2-methylindole, 1,4-naphthoquinone, 9,10-Phoenix (9,10-phenanthraquinone), 2-methyl-1,4-naphthoquinone, 2,3-dimethylhydrazine and other hydrazine compounds; benzoin ether, benzoin ethyl ether, benzoin phenyl ether and other benzoin ether; benzoin, A benzoin compound such as methyl benzoin or ethyl benzoin; a benzoin compound such as benzoin dimethyl ketal; 9-phenyl acridine, 1,7-bis(9,9'-acridinylheptane), etc. Acridine compound; N-phenylglycine, coumarin, and the like.

Further, in the above 2,4,5-triarylimidazole dimer, the substituent of the aryl group of the two triarylimidazole sites may be the same to provide a symmetrical compound, or may provide an asymmetric compound. Alternatively, the thioxanthone compound may be combined with the tertiary amine as in the combination of diethyl thioxanthone and dimethylaminobenzoic acid.

Among these compounds, the above-mentioned α-hydroxyketone and the above-mentioned phosphine oxide are preferred from the viewpoints of hardenability, transparency, and heat resistance. These thermal and photoradical polymerization initiators may be used singly or in combination of two or more. Further, it can also be used in combination with a suitable sensitizer.

In the case of using a polymerizable compound which is an epoxy resin as the component (B), the polymerization initiator of the component (C) may, for example, be a thermal cationic polymerization initiator or a photocationic polymerization initiator, and the curing rate is fast. In terms of room temperature hardening, a photocationic polymerization initiator is preferred.

Examples of the thermal cationic polymerization initiator include a benzyl sulfonium salt such as p-alkoxyphenylbenzylmethyl hexafluoroantimonate; benzyl-p-cyanopyridinium hexafluoroantimonate, 1-naphthyl Pyridinium salts such as methyl-o-cyanopyridinium hexafluoroantimonate, cinnamonyl-o-cyanopyridinium hexafluoroantimonate; benzylammonium such as benzyldimethylphenylammonium hexafluoroantimonate Salt and so on.

Among these compounds, the benzyl sulfonium salt is preferred from the viewpoints of hardenability, transparency, and heat resistance.

The photocationic polymerization initiator may, for example, be an aryldiazonium salt such as p-methoxybenzenediazonium hexafluorophosphate, diphenylphosphonium hexafluorophosphate or diphenylphosphonium hexafluoroantimonate. Aryl sulfonium salt; triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, diphenyl-4-thiophenoxyphenylphosphonium hexafluorophosphate, diphenyl-4-sulfur Triarylsulfonium salt such as phenoxyphenylphosphonium hexafluoroantimonate or diphenyl-4-thiophenoxyphenylphosphonium pentafluorohydroxyphthalate; triphenylselenium hexafluorophosphate, triphenyl Triaryl selenium salt such as selenium tetrafluoroborate or triphenyl selenium hexafluoroantimonate; dimethyl benzamidine methyl hexafluoroantimonate, diethyl benzamidine methyl hexafluoroantimonate a dialkyl benzamidine methyl sulfonium salt such as a salt; a dialkyl-4-yl group such as 4-hydroxyphenyldimethyl hexafluoroantimonate or 4-hydroxyphenylbenzylmethyl hexafluoroantimonate; a hydroxy salt; a sulfonate such as an α-hydroxymethylbenzoin sulfonate, an N-hydroxy quinone sulfonate, an α-sulfonyloxy ketone or a β-sulfonyloxy ketone.

Among these compounds, the above triarylsulfonium salt is preferred from the viewpoints of hardenability, transparency, and heat resistance. These thermal and photocationic polymerization initiators may be used singly or in combination of two or more. Further, it can also be used in combination with a suitable sensitizer.

The amount of the polymerization initiator to be added to the component (C) is preferably from 0.1 part by mass to 10 parts by mass per 100 parts by mass of the total of the component (A) and the component (B). When it is 0.1 part by mass or more, the curing is sufficient, and when it is 10 parts by mass or less, sufficient light transmittance is obtained. From the above viewpoints, it is particularly preferably from 0.3 part by mass to 7 parts by mass, particularly preferably from 0.5 part by mass to 5 parts by mass.

In addition, the resin composition for forming an optical waveguide of the present invention may be added with an antioxidant, a yellowing inhibitor, an ultraviolet absorber, or a visible light absorber at a ratio that does not adversely affect the effects of the present invention. So-called additives such as colorants, plasticizers, stabilizers, and fillers.

Hereinafter, the resin composition for forming an optical waveguide of the present invention will be described.

The resin composition for forming an optical waveguide of the present invention can be used by being diluted with a suitable organic solvent to form a resin varnish for optical waveguide formation. The organic solvent to be used herein is not particularly limited as long as it can dissolve the resin composition, and examples thereof include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene, and p-isopropyltoluene; and tetrahydrofuran. a cyclic ether such as 1,4-dioxane; an alcohol such as methanol, ethanol, isopropanol, butanol, ethylene glycol or propylene glycol; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, Ketones such as 4-hydroxy-4-methyl-2-pentanone; methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, γ-butyrolactone, etc.; ethylene carbonate, carbonic acid Carbonate such as propylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol Polyol alkyl groups such as dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether Ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene Polyol alkyl ether acetate such as monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate; N,N-dimethylformamide, N,N - decylamine such as dimethylacetamide or N-methylpyrrolidone.

Among these compounds, from the viewpoints of solubility and boiling point, preferred are: toluene, methanol, ethanol, isopropanol, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and acetic acid Ester, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene Alcohol monomethyl ether acetate, propylene glycol monomethyl ether acetate, N,N-dimethylacetamide.

These organic solvents may be used singly or in combination of two or more. Further, the solid content concentration in the resin varnish is usually preferably 20% by mass to 80% by mass.

When the resin varnish for forming an optical waveguide is blended, it is preferred to mix by stirring. The stirring method is not particularly limited, and from the viewpoint of stirring efficiency, stirring is preferably carried out using a propeller. The rotation speed of the propeller during stirring is not particularly limited, but is preferably 10 rpm to 1,000 rpm. When it is 10 rpm or more, the components (A) to (C) and the components of the organic solvent are sufficiently mixed, and when it is 1,000 rpm or less, the entrapment of air bubbles by the rotation of the propeller is reduced. From the above point of view, it is more preferably 50 rpm to 800 rpm, and particularly preferably 100 rpm to 500 rpm. The stirring time is not particularly limited, and is preferably from 1 hour to 24 hours. When it is 1 hour, the components (A) to (C) and the components of the organic solvent are sufficiently mixed, and if it is 24 hours or shorter, the varnish preparation time can be shortened.

The resin varnish for forming an optical waveguide to be prepared is preferably filtered using a filter having a pore diameter of 50 μm or less. When the pore diameter is 50 μm or less, large foreign matter or the like is removed, and unevenness is not generated when the varnish is applied, and scattering of light propagating in the core portion is suppressed. From the above point of view, it is more preferable to use a pore diameter of 30 μm or less. The filter is filtered, and it is particularly preferable to filter using a filter having a pore diameter of 10 μm or less.

The resin varnish for forming an optical waveguide to be blended is preferably defoamed under reduced pressure. The defoaming method is not particularly limited, and a vacuum pump, a bell jar, and a defoaming device with a vacuum device can be used as a specific example. The pressure at the time of pressure reduction is not particularly limited, and a pressure at which the organic solvent contained in the resin varnish does not boil is preferred. The depressurization defoaming time is not particularly limited, and is preferably from 3 minutes to 60 minutes. If it is 3 minutes or more, the bubble dissolved in the resin varnish can be removed. When it is 60 minutes or less, the organic solvent contained in the resin varnish does not volatilize.

The cured film obtained by polymerizing and hardening the resin composition for forming an optical waveguide comprising the (A) polymer, the (B) polymerizable compound, and the (C) polymerization initiator of the present invention has a wavelength of 830 nm at a temperature of 25 ° C. The refractive index in the range of 850 nm is preferably 1.400 to 1.700. If it is 1.400 to 1.70, the difference in refractive index from the usual optical resin is not large, and therefore the versatility as an optical material is not impaired. From the above point of view, it is particularly preferred to be 1.425 to 1.675 or less, and particularly preferably 1.450 to 1.650.

A cured film having a thickness of 50 μm obtained by polymerizing and hardening a resin composition for forming an optical waveguide comprising the (A) polymer, the (B) polymerizable compound, and the (C) polymerization initiator of the present invention at a wavelength of 400 nm The lower transmittance is preferably 80% or more. If it is 80% or more, the amount of light penetration is sufficient. From the above point of view, it is particularly preferable to be 85% or more. Further, there is no particular limitation on the upper limit of the penetration rate.

Hereinafter, the resin film for forming an optical waveguide of the present invention will be described.

The resin film for forming an optical waveguide of the present invention includes the optical waveguide for forming The resin composition can be easily produced by applying a resin varnish for optical waveguide formation containing the component (A) to the component (C) to an appropriate base film and removing the solvent. Further, the optical waveguide forming resin composition may be directly applied onto a base film to be produced.

The base film is not particularly limited, and examples thereof include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; and polyolefins such as polyethylene and polypropylene; Polycarbonate, polyamine, polyimine, polyamidimide, polyether phthalimide, polyether thioether, polyether oxime, polyether ketone, polyphenylene ether, polyphenylene sulfide, polyaryl Ester, polyfluorene, liquid crystal polymer, and the like. Among these compounds, from the viewpoints of flexibility and toughness, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polypropylene, and poly are preferable. Carbonate, polyamine, polyimine, polyamidimide, polyphenylene ether, polyphenylene sulfide, polyarylate, polyfluorene.

The thickness of the substrate film can be appropriately changed depending on the intended flexibility, and is preferably 3 μm to 250 μm . When it is 3 μm or more, the film strength is sufficient, and when it is 250 μm or less, sufficient flexibility is obtained. From the above viewpoints, it is preferably from 5 μm to 200 μm , particularly preferably from 7 μm to 150 μm . In addition, from the viewpoint of improving the peeling property with the resin layer, a film which has been subjected to mold release treatment by an fluorenone compound or a fluorine-containing compound may be used as needed.

The resin film for forming an optical waveguide which is produced by coating a resin composition for forming an optical waveguide or a resin composition for forming an optical waveguide on a substrate film, if necessary, attaches a protective film to a resin layer to form a substrate film and a resin. The layer and the 3-layer structure of the protective film.

The protective film is not particularly limited, and examples thereof include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; and polyolefins such as polyethylene and polypropylene. Among these compounds, from the viewpoint of flexibility and toughness, a polyester such as polyethylene terephthalate or a polyolefin such as polyethylene or polypropylene is preferable. In addition, from the viewpoint of improving the peeling property with the resin layer, a film which has been subjected to mold release treatment by an fluorenone compound or a fluorine-containing compound may be used as needed. The thickness of the cover film can be appropriately changed depending on the intended flexibility, and is preferably 10 μm to 250 μm . When it is 10 μm or more, the film strength is sufficient, and when it is 250 μm or less, sufficient flexibility is obtained. From the above viewpoints, it is particularly preferably 15 μm to 200 μm , and particularly preferably 20 μm to 150 μm .

The thickness of the resin layer of the resin film for forming an optical waveguide of the present invention is not particularly limited, and is usually preferably 5 μm to 500 μm in terms of the thickness after drying. When the thickness is 5 μm or more, the thickness of the resin film or the cured product of the film is sufficient. When the thickness is 500 μm or less, the drying can be sufficiently performed, so that the amount of residual solvent in the resin film does not increase. The cured product of the film does not foam when heated.

The resin film for forming an optical waveguide obtained in the above manner can be easily stored, for example, by winding up into a roll shape. Alternatively, the reel-shaped film may be cut into an appropriate size to be stored in a sheet form.

The resin composition for forming an optical waveguide of the present invention is suitably used as a resin composition for forming an optical waveguide. Similarly, the resin film for forming an optical waveguide of the present invention is suitably used as a resin film for forming an optical waveguide.

Hereinafter, the optical waveguide of the present invention will be described. Figure 2 is a diagram showing the present invention A cross-sectional view of a configuration example of an optical waveguide.

As shown in FIG. 2(a), the optical waveguide 1 is formed on a substrate 7, and includes a core portion 2 containing a resin composition for forming a core having a high refractive index, and a resin for forming a coating layer having a low refractive index. The lower cladding layer 6 and the upper cladding layer 5 of the composition.

The resin composition for forming an optical waveguide and the resin film for forming an optical waveguide of the present invention are preferably used for at least one of the lower cladding layer 6, the core portion 2, and the upper cladding layer 5 of the optical waveguide 1. Among them, it is particularly preferable to use at least the core portion 2 from the viewpoint of forming a pattern using a developing solution containing an aqueous alkaline solution.

By using the resin film for forming an optical waveguide, it is possible to further improve the interlayer adhesion between the cladding layer and the core or the pattern formation property (fine line or small line pitch correspondence) when the optical waveguide core pattern is formed, and the line width or the line pitch can be formed. Small micro pattern. In addition, it is possible to provide a process which is excellent in productivity in manufacturing a large-area optical waveguide at a time.

In the optical waveguide 1, a hard substrate such as a tantalum substrate, a glass substrate, or a glass epoxy substrate such as FR-4 can be used as the substrate 7. The optical waveguide 1 may be formed of a flexible optical waveguide by using the above-described substrate film having flexibility and toughness instead of the above substrate.

Further, a base film having flexibility and toughness can function as the cover film 8 of the optical waveguide 1. By arranging the cover film 8, the optical waveguide 1 can be imparted with flexibility or toughness of the cover film 8. Further, since the optical waveguide 1 is not contaminated or damaged, the ease of operation is improved.

From the above point of view, the cover film 8 may be disposed on the outer side of the upper cladding layer 5 as shown in FIG. 2(b), or may be applied to the lower cladding layer 6 and the upper portion as shown in FIG. 2(c). The cover film 8 is disposed on the outer side of both of the cladding layers 5.

When the optical waveguide 1 has sufficient flexibility or toughness, the cover film 8 may not be disposed as shown in FIG. 2(d).

The thickness of the lower cladding layer 6 is not particularly limited, and is preferably 2 μm to 200 μm . When it is 2 μm or more, the propagation light is easily sealed inside the core, and if it is 200 μm or less, the thickness of the entire optical waveguide 1 is not excessively large. Further, the thickness of the lower cladding layer 6 means a value from the boundary between the core portion 2 and the lower cladding layer 6 to the lower surface of the lower cladding layer 6. The thickness of the resin film for forming the lower cladding layer is not particularly limited, and the thickness is adjusted such that the thickness of the lower cladding layer 6 after curing is within the above range.

The height of the core 2 is not particularly limited, and is preferably 10 μm to 100 μm . When the height of the core is 10 μm or more, the alignment tolerance does not become small in the combination with the light-receiving element or the optical fiber after the formation of the optical waveguide, and if it is 100 μm or less, the optical waveguide is formed after the optical waveguide is formed. In the combination of the light-emitting element or the optical fiber, the bonding efficiency does not become small. From the above point of view, the height of the core is particularly preferably 15 μm to 80 μm , and particularly preferably 20 μm to 70 μm . In addition, the thickness of the resin film for forming a core portion is not particularly limited, and the thickness is adjusted such that the height of the core portion after curing is within the above range.

The thickness of the upper cladding layer 5 is not particularly limited as long as it can be buried in the core portion 2, and is preferably 12 μm to 500 μm in terms of the thickness after drying. The thickness of the upper cladding layer 5 may be the same as or different from the thickness of the initially formed lower cladding layer 6, but from the viewpoint of embedding the core portion 2, it is preferably thicker than the thickness of the lower cladding layer 6. . Further, the thickness of the upper cladding layer 5 means a value from the boundary between the core portion 2 and the lower cladding layer 6 to the upper surface of the upper cladding layer 5.

The optical waveguide of the present invention can make the light propagation loss 0.25 dB/cm or less. Further, since it can be made 0.15 dB/cm or less, the loss of light is small, and the intensity of the transmission signal is sufficient. From the above viewpoints, 0.10 dB/cm or less can also be achieved.

Hereinafter, an example of manufacturing an optimum optical waveguide using the resin film for forming an optical waveguide of the present invention will be described.

The base material used in the production process of the resin film for forming a core is not particularly limited as long as it is an actinic ray that is used for the formation of a core pattern to be described later, and examples thereof include polyethylene terephthalate. Polyester such as diester, polybutylene terephthalate or polyethylene naphthalate; polyolefin such as polyethylene or polypropylene; polycarbonate, polyphenylene ether, polyarylate, and the like.

Among these compounds, polyesters such as polyethylene terephthalate and polybutylene terephthalate are preferred from the viewpoint of transmittance, flexibility, and toughness of actinic rays for exposure; Polyolefin such as polypropylene. Further, from the viewpoint of improving the transmittance of the actinic ray for exposure and reducing the roughness of the side wall of the core pattern, it is particularly preferable to use a substrate film of a highly transparent type. Such a highly transparent type substrate film includes Cosmoshine A1517 and Cosmoshine A4100 manufactured by Toyobo Co., Ltd. In addition, from the viewpoint of improving the releasability of the resin layer, a film which has been subjected to mold release treatment by an fluorenone compound or a fluorine-containing compound may be used as needed.

The thickness of the base film of the resin film for forming a core portion is preferably 5 μm to 50 μm . When the thickness is 5 μm or more, the strength of the support is sufficient. When the core pattern is 50 μm or less, the gap between the mask and the core-forming resin composition layer does not become large, and the pattern formation property is good. From the above viewpoints, the thickness of the base film is particularly preferably from 10 μm to 40 μm , particularly preferably from 15 μm to 30 μm .

The optical waveguide forming resin film produced by coating the optical waveguide forming resin varnish or the optical waveguide forming resin composition on the base film may be attached to the resin layer as needed to form a substrate. A three-layer structure of a film, a resin layer, and a protective film.

The resin film for forming an optical waveguide obtained in the above manner can be easily stored, for example, by winding up into a roll shape. Alternatively, the reel-shaped film may be cut into an appropriate size to be stored in a sheet form.

Hereinafter, a method of manufacturing the optical waveguide 1 using the resin composition for forming an optical waveguide and/or the resin film for forming an optical waveguide will be described.

The method of producing the optical waveguide 1 of the present invention is not particularly limited, and examples thereof include a resin composition for forming a core portion and a resin composition for forming a cladding layer, and a method of producing by using a spin coating method or the like; or using a core portion. A resin film and a resin film for forming a coating layer are produced by a laminate method. Alternatively, the methods may be combined to manufacture. Among these methods, from the viewpoint of providing an optical waveguide manufacturing process excellent in productivity, a method of producing a resin film for forming an optical waveguide by a build-up method is preferred.

Hereinafter, a method for producing the optical waveguide 1 by using the resin film for forming an optical waveguide for the lower cladding layer, the core portion, and the upper cladding layer will be described with reference to FIG.

First, as shown in FIG. 3( a ), as a first step, a resin film for forming a lower cladding layer is laminated on a substrate 7 to form a lower cladding layer 6 . The method of laminating in the first step is a method of laminating by heating while using a roll laminator or a flat laminator, and it is preferably used from the viewpoint of adhesion and followability. In the flat laminator, a resin film for forming a lower cladding layer is laminated under reduced pressure. Further, the flat laminating machine in the present invention refers to a laminating machine which is crimped by sandwiching a laminated material between a pair of flat plates and pressurizing the flat plate, and for example, vacuum pressurization can be suitably used. Laminator. The heating temperature here is preferably from 40 ° C to 130 ° C, and the pressure of the crimping is preferably from 0.1 MPa to 1.0 MPa, but the conditions are not particularly limited. When a protective film is present on the resin film for forming a lower cladding layer, the protective film is removed and then laminated.

In addition, before the lamination by a vacuum pressure laminator, the resin film for forming a lower cladding layer may be temporarily attached to the substrate 7 by a roll laminator. Here, from the viewpoint of improving the adhesion and the followability, it is preferable to temporarily attach it while being pressure-bonded, or to perform heating while using a laminator having a heating roll. The lamination temperature is preferably from 20 ° C to 130 ° C. When the temperature is 20° C. or more, the adhesion between the resin film for forming the lower cladding layer 6 and the substrate 7 is improved, and when the temperature is 130° C. or less, the resin layer does not excessively flow during roll lamination, and a necessary film is obtained. thick. From the above viewpoints, it is more preferably from 40 ° C to 100 ° C. The pressure is preferably 0.2 MPa to 0.9 MPa, and the laminating speed is preferably 0.1 m/min to 3 m/min, but the conditions are not particularly limited.

Then, the lower portion of the substrate 7 is covered by light and/or heat. The layer formation resin film is cured, and the base film of the resin film for forming a lower cladding layer is removed to form the lower cladding layer 6.

The irradiation amount of the actinic rays when forming the lower cladding layer 6 is preferably 0.1 J/cm ² to 5 J/cm ² , and the heating temperature is preferably 50 ° C to 200 ° C, but there are no such conditions. Special restrictions.

Then, as shown in FIG. 3(b), as a second step, the resin film 9 for forming a core portion is laminated in the same manner as in the first step. Here, the resin film 9 for forming a core portion is designed to have a higher refractive index than the resin film for forming a lower cladding layer, and preferably includes a photosensitive resin composition capable of forming a core pattern by using actinic rays.

Then, as shown in (c) of FIG. 3, as a third step, the core portion is exposed to form a core pattern (core portion 2) of the optical waveguide. Specifically, the actinic ray is irradiated in an image shape by the reticle 10 having a negative or positive mask pattern called an artwork. Alternatively, the laser can be directly drawn, and the actinic rays are directly irradiated onto the image without passing through the mask 10. Examples of the light source of the actinic ray include a known light source that emits ultraviolet rays, such as a carbon arc lamp, a mercury vapor arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, and a xenon lamp. Further, in addition to the above, a light source that emits visible light such as a flood bulb or a solar lamp can be cited.

The irradiation amount of the actinic rays here is preferably from 0.01 J/cm ² to 10 J/cm ² . When it is 0.01 J/cm ² or more, the hardening reaction proceeds sufficiently, and the core portion 2 is not lost by the development step described later. When the thickness is 10 J/cm ² or less, the core portion 2 is not thickened due to an excessive amount of exposure, and It is preferable to form a fine pattern. From the above viewpoints, it is more preferably from 0.05 J/cm ² to 5 J/cm ² , particularly preferably from 0.1 J/cm ² to 3 J/cm ² .

Further, after the exposure, the heating of the core 2 can be performed after the exposure from the viewpoint of improving the resolution and the adhesion. The time from the irradiation of ultraviolet rays to the heating after exposure is preferably within 10 minutes. If it is within 10 minutes, the active species produced by ultraviolet irradiation are not deactivated. The temperature for heating after exposure is preferably from 40 ° C to 160 ° C, and the time is preferably from 30 seconds to 10 minutes.

After the exposure, as shown in FIG. 3(d), the base film of the core-forming resin film 9 is removed, and a developer corresponding to the composition of the core-forming resin film such as an alkaline aqueous solution or an aqueous developing solution is used. For example, development is carried out by a known method such as spraying, shaking dipping, brushing, scrubbing, dipping, and stirring. Further, two or more development methods may be used in combination as needed.

The base of the alkaline aqueous solution is not particularly limited, and examples thereof include an alkali hydroxide such as a hydroxide of lithium, sodium or potassium; a carbonate such as lithium, sodium, potassium or ammonium carbonate or hydrogencarbonate; potassium phosphate; Alkali metal phosphate such as sodium phosphate; alkali metal pyrophosphate such as sodium pyrophosphate or potassium pyrophosphate; sodium salt such as borax or sodium metasilicate; tetramethylammonium hydroxide, triethanolamine, ethylenediamine and diamethylene An organic base such as an amine, 2-amino-2-hydroxymethyl-1,3-propanediol or 1,3-diaminopropanol-2-morpholine. The pH of the alkaline aqueous solution used for development is preferably from 9 to 11, and the temperature is adjusted in accordance with the developability of the resin composition layer for core formation. Further, a surfactant, an antifoaming agent, a small amount of an organic solvent for promoting development, and the like may be mixed in the alkaline aqueous solution.

The water-based developer is not particularly limited as long as it contains water or an alkaline aqueous solution and one or more organic solvents. The pH of the aqueous developing solution is preferably as small as possible within a range in which the development of the resin film for forming a core portion is sufficiently performed. Good pH is 8~12, especially pH is 9~10.

Examples of the organic solvent include alcohols such as methanol, ethanol, isopropanol, butanol, ethylene glycol, and propylene glycol; ketones such as acetone and 4-hydroxy-4-methyl-2-pentanone; and ethylene glycol monomethyl ether. Polyol alkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, and the like.

These solvents may be used singly or in combination of two or more. The concentration of the organic solvent is usually preferably from 2% by mass to 90% by mass, and the temperature is adjusted in accordance with the developability of the resin composition for forming a core. Further, a small amount of a surfactant, an antifoaming agent, or the like may be mixed into the aqueous developing solution.

As the treatment after development, the core portion 2 of the optical waveguide may be washed by using a cleaning liquid containing water and the above organic solvent. The organic solvents may be used singly or in combination of two or more. The concentration of the organic solvent is usually preferably from 2% by mass to 90% by mass, and the temperature is adjusted according to the developability of the resin composition for forming a core portion.

As a treatment after the development or washing, if necessary also by heating about 60 ℃ ~ 250 ℃ or 0.1mJ / cm ² ~ 1000mJ exposure of about ² / cm, and further harden the core portion 2 is used.

Then, as shown in FIG. 3(e), as a fourth step, the upper cladding layer 5 is formed by laminating a resin film for forming an upper cladding layer in the same manner as in the first step and the second step. Here, the resin film for forming an upper cladding layer is designed such that the refractive index is lower than that of the resin film for forming a core portion. Further, the thickness of the upper cladding layer 5 is preferably larger than the height of the core portion 2.

Then, in the same manner as in the first step, the light is applied by light and/or heat. The formation of the overcoat layer is cured with a resin film to form the upper cladding layer 5.

When the base film of the resin film for forming a coating layer is polyethylene terephthalate (PET), the irradiation amount of actinic rays is preferably from 0.1 J/cm ² to 5 J/cm. ² . On the other hand, the substrate film is polyethylene naphthalate, polyamidamine, polyimine, polyamidimide, polyether phthalimide, polyphenylene ether, polyether thioether, polyether case sulfone, polysulfone and the like, compared with PET, it is difficult by ultraviolet short-wavelength actinic rays, and therefore the amount of irradiated actinic rays is preferably ^{0.5J / cm 2 ~ 30J / cm} 2. If it is 0.5J / cm ² or more, the curing reaction sufficiently proceeds, if it is ² times or less, the light irradiated 30J / cm does not take too long. From the above viewpoints, it is more preferably from 3 J/cm ² to 27 J/cm ² , particularly preferably from 5 J/cm ² to 25 J/cm ² .

Further, in order to further harden, a double-sided exposure machine capable of simultaneously irradiating actinic rays from both sides can be used. Further, the actinic ray may be irradiated while being heated. The heating temperature during and/or after the actinic ray irradiation is preferably from 50 ° C to 200 ° C, but the conditions are not particularly limited.

After the upper cladding layer 5 is formed, if necessary, the substrate film can be removed to fabricate the optical waveguide 1.

Since the optical waveguide of the present invention is excellent in transparency and light transmittance, it can be used as an optical transmission path of an optical module. Examples of the form of the optical module include an optical waveguide with an optical fiber to which both ends of the optical waveguide are connected, and an optical waveguide with a connector, an optical waveguide, and a printed wiring to which connectors are connected at both ends of the optical waveguide. A photoelectric composite substrate in which a plate is composited, a photoelectric conversion module in which an optical waveguide and an optical/electrical conversion element that converts an optical signal and an electrical signal are combined, and the optical waveguide and the wavelength are divided. A wavelength multiplexer/demultiplexer composed of filters. Further, in the photoelectric composite substrate, the composite printed wiring board is not particularly limited, and any of a flexible substrate such as a glass epoxy substrate or a flexible substrate such as a polyimide substrate can be used.

[Examples]

Hereinafter, embodiments of the present invention will be more specifically described.

<Synthesis Example 1>

[Base polymer for forming a coating layer: production of (meth)acrylic polymer (P-1)]

In a flask equipped with a stirrer, a cooling tube, a gas introduction tube, a dropping funnel, and a thermometer, 46 parts by mass of propylene glycol monomethyl ether acetate and 23 parts by mass of methyl lactate were weighed and stirred while introducing nitrogen gas. The liquid temperature was raised to 65 ° C, and 47 parts by mass of methyl methacrylate, 33 parts by mass of butyl acrylate, 16 parts by mass of 2-hydroxyethyl methacrylate, and 14 parts by mass of methacrylic acid were added dropwise over 3 hours. 3 parts by mass of 2'-azobis(2,4-dimethylvaleronitrile), 46 parts by mass of propylene glycol monomethyl ether acetate, and 23 parts by mass of methyl lactate, and then stirred at 65 ° C for 3 hours. Further, stirring was continued at 95 ° C for 1 hour to obtain a (meth)acrylic polymer (P-1) solution (solid content: 45 mass%).

[Measurement of acid value]

The acid value of P-1 was measured and found to be 79 mgKOH/g. Further, the acid value was calculated from the amount of 0.1 mol/L potassium hydroxide aqueous solution required for neutralizing the P-1 solution. At this time, the phenolphthalein added as an indicator changes from colorless to colorless. The pink dot acts as a neutral point.

[Measurement of Weight Average Molecular Weight]

The weight average molecular weight of P-1 (standard polystyrene conversion) was measured using "SD-8022", "DP-8020", and "RI-8020" manufactured by Tosoh Co., Ltd., and the result was as follows. It is 3.9×104. In addition, the column is "Gelpack GL-A150-S" and "Gelpack GL-A160-S" manufactured by Hitachi Chemical Co., Ltd. The elution solution was measured by using tetrahydrofuran, setting the sample concentration to 0.5 mg/ml, and setting the dissolution rate to 1 ml/min.

<Synthesis Example 2>

[Base polymer for core layer formation: production of (meth)acrylic polymer (P-2)]

In a flask equipped with a stirrer, a cooling tube, a gas introduction tube, a dropping funnel, and a thermometer, 42 parts by mass of propylene glycol monomethyl ether acetate and 21 parts by mass of methyl lactate were weighed and stirred while introducing nitrogen gas. The liquid temperature was raised to 65 ° C, and 14.5 parts by mass of N-cyclohexylmethylene iodide, 20 parts by mass of benzyl acrylate, and 39 parts by mass of O-phenylphenol 1.5 EO acrylate were added dropwise for 3 hours. 14 parts by mass of 2-hydroxyethyl acrylate, 12.5 parts by mass of methacrylic acid, 4 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile), and 37 mass of propylene glycol monomethyl ether acetate After stirring a mixture of 21 parts by mass and methyl lactate, the mixture was stirred at 65 ° C for 3 hours, and further stirred at 95 ° C for 1 hour to obtain a (meth)acrylic polymer (P-1) solution (solid content was 45% by mass).

The acid value and weight average of P-2 were measured in the same manner as in Synthesis Example 1. The amount was as follows, and the results were 80 mgKOH/g and 32,000, respectively.

[Preparation of resin varnish CLV-1 for coating layer formation]

84 parts by mass of the above-mentioned P-1 solution (solid content: 45 mass%) as the base polymer (A) (the solid content is 38 parts by mass), and the amino group A having a polyester skeleton as the (B) photocurable component 33 parts by mass of ester (meth) acrylate ("U-200AX" manufactured by Shin-Nakamura Chemical Co., Ltd.) and urethane (meth) acrylate having a polypropylene glycol skeleton (Xin Nakamura Chemical Industry ( "UA-4200" manufactured by the company) 15 parts by mass of a polyfunctional block isocyanate solution protected by methyl ethyl ketoxime as a meta-isocyanate type terpolymer of hexamethylene diisocyanate 20 parts by mass of the component ("Sumidur BL3175" manufactured by Sumika Bayer Urethane Co., Ltd.) 20 parts by mass (solid content: 15 parts by mass), and 1 - (C) photopolymerization initiator [4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one ("Irgacure 2959" manufactured by Ciba Japan Co., Ltd.) 1 part by mass, double (2,4,6-trimethylbenzylidene) phenylphosphine oxide ("Irgacure 819" manufactured by Ciba Japan Co., Ltd.) 1 part by mass, and propylene glycol monomethyl ether acetate as an organic solvent for dilution 23 parts by mass of ester Mix with stirring. Pressure filtration was carried out using a Polyflon filter ("PF020" manufactured by Advantec Toyo Co., Ltd.) having a pore size of 2 μm , followed by defoaming under reduced pressure to obtain a resin varnish for forming a coating layer. .

[Production of resin film CLF-1 for forming a cladding layer]

The resin composition for forming a coating layer obtained above was applied to a non-treated surface of a PET film ("Cosmoshine A4100" manufactured by Toyobo Co., Ltd., thickness: 50 μm ) at 100 ° C by using the above-mentioned coater. After drying for 20 minutes, a PET film (Purex A31 manufactured by Teijin Dupont Films Co., Ltd., thickness: 25 μm ) was attached as a protective film to obtain a resin film for forming a coating layer. . In this case, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coater, and the thicknesses of the first lower cladding layer and the second lower cladding layer (adjacent layer) used in the present embodiment are described in the examples. . Further, the film thickness after curing of the first lower cladding layer and the second lower cladding layer is the same as the film thickness after coating. The film thickness of the resin film for forming an upper cladding layer used in the present embodiment is also described in the examples. The film thickness of the resin film for forming an upper cladding layer described in the examples is the film thickness after coating.

<Example 1>

[Preparation of resin varnish COV-1 for core formation]

In the plastic bottle (poly bottle) of the wide mouth, 60 parts by mass of the P-2 solution (solid content: 45 mass%) of the (A) alkali-soluble (meth)acrylic polymer was weighed, and (B) polymerizability was obtained. a bisphenol A type epoxy acrylate of the compound (EA-1010N manufactured by Shin-Nakamura Chemical Co., Ltd.) (epoxy equivalent: 518 g/eq) 40 parts by mass,

1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl as (C) polymerization initiator 1-propan-1-one (Irgacure 2959, manufactured by Ciba Specialty Chemicals Co., Ltd.) 1 part by mass of bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide (Ciba refined) 1 part by mass of Irgacure 819) manufactured by the company was stirred at a temperature of 25 ° C and a number of revolutions of 400 rpm for 6 hours using a stirrer to prepare a resin varnish for core formation. Then, a Polyflon filter having a pore size of 2 μm (PF020 manufactured by Ai Dangdenko Co., Ltd.) and a membrane filter having a pore size of 0.5 μm (J050A manufactured by Aiduobond Co., Ltd.) were used at the temperature. The pressure was filtered under conditions of 25 ° C and a pressure of 0.4 MPa. Then, using a vacuum pump and a bell jar, defoaming was performed under reduced pressure for 15 minutes under the conditions of a reduced pressure of 50 mmHg to obtain a resin varnish COV-1 for core formation.

[Production of Resin Film COF-1 for Core Formation]

The core-forming resin varnish COV-1 was applied to a PET film (A1517 manufactured by Toyobo Co., Ltd., thickness: 16 μm) using a coater (MultiCoater TM-MC manufactured by Hirano Tecseed Co., Ltd.). The non-treated surface was dried at 100 ° C for 20 minutes, and then a release PET film (A31 manufactured by Teijin DuPont Film Co., Ltd., thickness: 25 μm) was attached as a protective film to obtain a resin film COF- for core formation. 1. At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coater, and in the present embodiment, the film thickness after curing is adjusted to 50 μm.

<Example 2 to Example 6, and Comparative Example 1 and Comparative Example 2>

A core-forming resin film COF-2 was produced in the same manner as in Example 1 by blending the core-forming resin varnishes COV-2 to COV-8 according to the blending ratios shown in Table 1. ~COF-8.

[Determination of light transmittance at a wavelength of 850 nm]

The resin film for forming a core portion from which the protective film (Purex A31) was removed was laminated on a glass slide using a vacuum laminator at a pressure of 0.4 MPa, a temperature of 50 ° C, and a press time of 30 seconds. (Size: 76mm × 26mm, thickness: 1mm). Then, ultraviolet rays (wavelength: 365 nm) of 1000 mJ/cm ² were irradiated by the above-mentioned ultraviolet exposure machine, and further heated at 160 ° C for 1 hour to prepare a sample for measuring light transmittance. The light transmittance at a wavelength of 850 nm of the sample was measured using a spectrophotometer (manufactured by Hitachi High-technologies Co., Ltd., "U-3310").

[Measurement of refractive index]

On the substrate (size: 60 mm × 20 mm, thickness: 0.6 mm), a resin film for forming a core portion was laminated in the same manner as the sample for measuring the light transmittance, and the resin film was cured to prepare a sample for refractive index measurement. The refractive index at a wavelength of 830 nm of this sample was measured using a 稜鏡-coupled refractometer ("Model 2020" manufactured by Metricon Co., Ltd.).

[Method of making optical waveguide]

The vacuum pressure laminating machine ("MVLP-500/600" manufactured by Nihon Seisakusho Co., Ltd.) was removed under the conditions of a pressure of 0.4 MPa, a temperature of 80 ° C, and a pressurization time of 30 seconds. The resin film CLF-1 for forming the lower cladding layer of the protective film (Purex A31) is laminated on a glass epoxy substrate ("MCL-E-679FB" manufactured by Hitachi Chemical Co., Ltd.), and the thickness is 0.6 mm. On the copper foil) by etching. Next, using a UV exposure machine ("MAP-1200-L" manufactured by Dainippon Screen Co., Ltd.), after irradiating ultraviolet rays (wavelength: 365 nm) of 4000 mJ/cm ² , the support film (Cosmoshine A4100) was removed. The heat treatment was carried out at 120 ° C for 1 hour, whereby the lower cladding layer 6 was formed.

Then, using a roll laminator ("HLM-1500" manufactured by Hitachi Chemical Co., Ltd.), the protection was removed under the conditions of a pressure of 0.5 MPa, a temperature of 50 ° C, and a speed of 0.2 m/min. The core-forming resin film COF-1 of the film (Purex A31) is laminated on the lower cladding layer 6. Then, the negative-type photomask having a pattern for forming an optical waveguide having a width of 50 μm was irradiated with ultraviolet rays (wavelength: 365 nm) of 2,500 mJ/cm ² by the ultraviolet exposure machine, and the core portion 2 (core pattern) was exposed. After removing the support film (Cosmoshine A1517), a jet type developing device ("RX-40D" manufactured by Yamato Machinery Co., Ltd.) was used, and a 1% by mass aqueous sodium carbonate solution was used at a temperature of 30 ° C and a spray pressure of 0.15 MPa. Development was carried out under conditions of 105 seconds. Then, it was washed with pure water, and heat-dried and thermally hardened at 160 ° C for 1 hour.

Next, using the vacuum pressure laminator, the upper cladding layer was removed by removing the protective film (Purex A31) under the conditions of a pressure of 0.4 MPa, a temperature of 80 ° C, and a pressurization time of 30 seconds. The resin film CLF-1 is laminated on the core portion 2 and the lower cladding layer 6. After irradiating ultraviolet rays of 4000 mJ/cm ² (wavelength: 365 nm), the support film (Cosmoshine A4100) was removed, and then heat-hardening was performed at 160 ° C for 1 hour to form the upper cladding layer 5, and (a) shown in Fig. 1 was obtained. Optical waveguide 1. Then, using a dicing saw ("DAD-341" manufactured by DISCO), a rigid optical waveguide of 10 cm in length was cut.

[Measurement of optical loss]

A VCSEL ("FLS-300-01-VCL" manufactured by EXFO Co., Ltd.) having a wavelength of 850 nm as a light source was used as a light source, and a light-receiving sensor ("Q82214" manufactured by Advantest) was used. (GI-50/125 multimode fiber, NA = 0.20), and exit fiber (SI-114/125, NA = 0.22) were used to measure the light propagation loss of the obtained optical waveguide. The light propagation loss is calculated by dividing the optical loss measurement value (dB) by the optical waveguide length (10 cm).

The evaluation results of Examples 1 to 6 and Comparative Example 1 and Comparative Example 2 are shown in Table 1, and the optical waveguide cross section of Example 1 is shown in Fig. 1 .

1) A (meth)acrylic polymer solution prepared in Synthesis Example 2, (weight average molecular weight: 3.2 × 10 ⁴ , acid value: 80 mgKOH/g)

2) Bisphenol A type epoxy acrylate ("EA-1010N" manufactured by Shin-Nakamura Chemical Co., Ltd., epoxy equivalent: 518 g/eq)

3) Phenolic novolac type epoxy acrylate ("EA-6310" manufactured by Shin-Nakamura Chemical Co., Ltd., epoxy equivalent: 494 g/eq)

4) Ethoxylated bisphenol A diacrylate ("Fancryl FA-324A" manufactured by Hitachi Chemical Co., Ltd.)

5) Ethoxylated bisphenol A diacrylate ("Fancryl FA-321A" manufactured by Hitachi Chemical Co., Ltd.)

6) Phenol biphenyl type epoxy resin ("NC-3000" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent of 275g/eq)

7) 1-[4-(2-Hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one (Irgacure 2959, manufactured by BASF Japan) )

8) bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide ("Irgacure 819" manufactured by BASF Japan Co., Ltd.)

As shown in the first to sixth embodiments, the resin composition for forming an optical waveguide of the present invention is excellent in transparency, and an optical waveguide is produced by the above-described method for producing an optical waveguide, and the optical propagation loss is measured. As a result, low light propagation loss was observed in the resin composition for forming an optical waveguide containing EA-6310 and EA-1010N, and the optical propagation loss was 0.06 dB in an optical waveguide including 40 parts by mass of the resin. Cm, 0.07 In dB/cm, compared with 0.22 dB/cm and 0.25 dB/cm of Comparative Example 1 and Comparative Example 2, a large low-light propagation loss was confirmed.

[Measurement of refractive index before and after immersion]

In the optical waveguide produced by using the resin composition for forming an optical waveguide of the present invention, in order to confirm the change in the refractive index of the peripheral surface layer portion and the central portion of the core pattern, the resin for forming a core portion before and after immersion in the alkali developing solution The film was subjected to refractive index measurement in the following manner. The refractive index measurement is performed by setting a predetermined fixed temperature (for example, 25 ° C) in the range of 15 ° C to 30 ° C.

A resin film for forming a core portion was laminated on the substrate (size: 60 mm × 20 mm, thickness: 0.6 mm) in the same manner as the sample for measuring the light transmittance, and irradiated with 2500 mJ/cm ² by the ultraviolet exposure machine. Ultraviolet rays (wavelength: 365 nm) were used to prepare sample A and sample B under the following conditions.

. Sample A: heated at 160 ° C for 1 hour

. Sample B: immersed in a 1 mass% potassium carbonate aqueous solution at a temperature of 30 ° C for 2 minutes, and then heated at 160 ° C for 1 hour.

Further, a resin film for forming a core portion was laminated in the same manner as the sample for measuring the light transmittance, and Sample C and Sample D were produced under the following conditions.

. Sample C: obtained by irradiating ultraviolet rays (wavelength: 365 nm) of 2,500 mJ/cm ² using the above ultraviolet exposure machine

. Sample D: After irradiating ultraviolet rays (wavelength: 365 nm) of 2,500 mJ/cm ² with the above ultraviolet exposure machine, the film was immersed in a 1 mass% potassium carbonate aqueous solution at a temperature of 30 ° C for 2 minutes.

Next, the results of Example 7, Example 8, and Comparative Example 3 in which the refractive indices at the wavelength of 830 nm of the sample A, the sample B, the sample C, and the sample D described above were measured using the above-described 稜鏡-coupled refractometer were shown below. Table 2 below.

As shown in Table 2, it is understood that the films of Example 7 and Example 8 satisfy the relationship of A>B, A-C≧0.003, A-C>D-C, and C<D. On the other hand, the film of the comparative example 3 was A<B, A-C<0.003, and A-C<D-C. Therefore, it was confirmed that the optical waveguide of the present invention has low light propagation loss because, as clearly shown in Table 2, a surface portion having a lower refractive index than the central portion of the core pattern can be formed at the periphery of the core pattern forming the core.

[Industrial availability]

The resin composition for forming an optical waveguide of the present invention is excellent in transparency, and a portion immersed in an alkali developer has a low refractive index, and an optical waveguide produced using these is excellent in light propagation characteristics.

1‧‧‧ optical waveguide

2‧‧‧ core (core pattern)

3‧‧‧ Central Department

4‧‧‧Low refractive index

5‧‧‧Upper cladding

6‧‧‧Lower coating

7‧‧‧Substrate

Claims (30)

A resin composition for forming an optical waveguide comprising (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator, and the composition has a predetermined wavelength in a range of 830 nm to 850 nm ( The relationship between the refractive index A at λ) and the refractive index B at the predetermined wavelength (λ) is A>B, and the refractive index A is formed into a film shape to be 1000 mJ/cm ² to 4000 mJ/cm. The predetermined irradiation amount (X) in the range of ² is irradiated with ultraviolet rays (wavelength: 365 nm), and then heated at a predetermined temperature (T1) in the range of 160 ° C to 180 ° C for a predetermined time in the range of 0.5 hours to 3 hours ( After the measurement of H1), the refractive index B is formed into a film shape, and the ultraviolet rays (wavelength: 365 nm) are irradiated with the predetermined irradiation amount (X), and then are in the range of 0.5% by mass to 5% by mass. The predetermined time (H2) in the range of 1 minute to 5 minutes is immersed in a potassium carbonate aqueous solution having a predetermined concentration (C1) at a predetermined temperature (T2) in a temperature range of 20 ° C to 40 ° C, and then The predetermined time (H1) is heated at a predetermined temperature (T1) and measured. A resin composition for forming an optical waveguide comprising (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator, and the composition has a predetermined wavelength in a range of 830 nm to 850 nm ( The relationship between the refractive index A at λ) and the refractive index C at the predetermined wavelength (λ) is AC ≧ 0.003, and the refractive index A is formed into a film shape to be in the range of 1000 mJ/cm ² to 4000 mJ/cm. The predetermined irradiation amount (X) in the range of ² is irradiated with ultraviolet rays (wavelength: 365 nm), and then heated at a predetermined temperature (T1) in the range of 160 ° C to 180 ° C for a predetermined time in the range of 0.5 hours to 3 hours ( It is measured after H1), and the refractive index C is obtained by forming a composition into a film shape, and irradiating ultraviolet rays (wavelength: 365 nm) with the predetermined irradiation amount (X). A resin composition for forming an optical waveguide comprising (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator, and the composition has a predetermined wavelength in a range of 830 nm to 850 nm ( The relationship between the refractive index A at λ), the refractive index C at the predetermined wavelength (λ), and the refractive index D at the predetermined wavelength (λ) is AC>DC, and the refractive index A is a film formed into a film. In the form of a predetermined irradiation amount (X) in the range of 1000 mJ/cm ² to 4000 mJ/cm ² , ultraviolet rays (wavelength: 365 nm) are irradiated, and then heated at a predetermined temperature (T1) in the range of 160 ° C to 180 ° C. It is measured after a predetermined time (H1) in the range of 0.5 hours to 3 hours, and the refractive index C is formed by forming a composition into a film shape, and irradiating ultraviolet rays (wavelength: 365 nm) with the predetermined irradiation amount (X). In the refractive index D, the composition is formed into a film shape, and the ultraviolet rays (wavelength: 365 nm) are irradiated with the predetermined irradiation amount (X), and then the predetermined concentration (C1) is in the range of 0.5% by mass to 5% by mass. Immersed in a potassium carbonate aqueous solution at a predetermined temperature (T2) in the range of 20 ° C to 40 ° C ~ 1 minute after a predetermined time (H2) within the range of 5 minutes assay obtained. The resin composition for forming an optical waveguide according to any one of the first to third aspect, wherein the refractive index C of the composition at a predetermined wavelength (λ) in a range of 830 nm to 850 nm, The relationship with the refractive index D at the predetermined wavelength (λ) is C < D, and the refractive index C is formed into a film shape by an ultraviolet exposure machine at 1000 mJ/cm ² to 4000 mJ/cm ^{2 .} The predetermined irradiation amount (X) in the range is measured by irradiating ultraviolet rays (wavelength: 365 nm), and the refractive index D is formed into a film shape by the refractive index D, and ultraviolet rays are irradiated by the predetermined irradiation amount (X) by an ultraviolet exposure machine. (wavelength: 365 nm), and then, in the potassium carbonate aqueous solution having the predetermined concentration (C1) in the range of 0.5% by mass to 5% by mass, at the predetermined temperature (T2) in the range of 20 ° C to 40 ° C It is measured by immersing the above-mentioned predetermined time (H2) in the range of 1 minute - 5 minutes. The resin composition for forming an optical waveguide according to any one of the above aspects, wherein the (A) polymer is an alkali-soluble polymer having a carboxyl group, and the (B) polymerizable compound is contained. A compound having an epoxy group and an ethylenically unsaturated group in one molecule. The resin composition for forming an optical waveguide according to claim 4, wherein the (A) polymer is an alkali-soluble polymer having a carboxyl group, and the (B) polymerizable compound contains an epoxy group in one molecule. And a compound having an ethylenically unsaturated group. A resin composition for forming an optical waveguide comprising (A) a polymer, (B) a polymerizable compound, and (C) a polymerization initiator, and the (A) polymer is an alkali-soluble polymer having a carboxyl group And the above (B) polymerizable compound is contained in A compound having an epoxy group and an ethylenically unsaturated group in one molecule. The resin composition for forming an optical waveguide according to claim 5, wherein the compound having an epoxy group and an ethylenically unsaturated group in the above-mentioned one molecule is a compound containing an aliphatic ring or an aromatic ring in one molecule. . The resin composition for forming an optical waveguide according to the above-mentioned item, wherein the compound having an epoxy group and an ethylenically unsaturated group in the above-mentioned one molecule contains an aliphatic ring or a fragrance in one molecule. a compound of a family ring. The resin composition for forming an optical waveguide according to claim 5, wherein the compound having an epoxy group and an ethylenically unsaturated group in the above molecule has at least one epoxy group and at least one ethylene in the molecule. A compound that is unsaturated. The resin composition for forming an optical waveguide according to the above aspect of the invention, wherein the compound having an epoxy group and an ethylenically unsaturated group in the above molecule has at least one epoxy group in the molecule and At least one ethylenically unsaturated group of compounds. The resin composition for forming an optical waveguide according to claim 5, wherein the compound having an epoxy group and an ethylenically unsaturated group in the above molecule is a compound having a bisphenol skeleton in its molecule. The resin composition for forming an optical waveguide according to the above-mentioned item, wherein the compound having an epoxy group and an ethylenically unsaturated group in the above-mentioned one molecule is a compound having a bisphenol skeleton in its molecule. The resin composition for forming an optical waveguide according to claim 5, wherein the (B) polymerizable compound contains the above-mentioned one molecule. In addition to the epoxy group-containing and ethylenically unsaturated group-containing compound, at least one of a compound containing two or more ethylenically unsaturated groups in one molecule and a compound containing two or more epoxy groups in one molecule is contained. The resin composition for forming an optical waveguide according to the above-mentioned item (B), wherein the (B) polymerizable compound contains a compound containing an epoxy group and an ethylenically unsaturated group in one molecule. In addition, at least one of a compound containing two or more ethylenically unsaturated groups in one molecule and a compound containing two or more epoxy groups in one molecule is contained. The resin composition for forming an optical waveguide according to claim 5, wherein the (A) polymer has a carboxyl group and has a weight average molecular weight of 1,000 to 3,000,000. The resin composition for forming an optical waveguide according to claim 6 or 7, wherein the (A) polymer has a carboxyl group and has a weight average molecular weight of 1,000 to 3,000,000. The resin composition for forming an optical waveguide according to any one of claims 1 to 3, wherein the (A) polymer has a carboxyl group and has a maleimide in the main chain. The polymer of the skeleton. The resin composition for forming an optical waveguide according to claim 6 or 7, wherein the (A) polymer is a polymer having a carboxyl group and having a maleimide skeleton in the main chain. . The resin composition for forming an optical waveguide according to any one of the items 1 to 3, wherein the amount of the polymer (A) is relative to the above (A) The amount of the polymerizable compound (B) is 10% by mass to 85% by mass based on the total amount of the polymer (B), and the amount of the polymerizable compound (B) is based on the (A) polymer and the (B) polymerizable compound. The total amount of the polymerization initiator is from 15% by mass to 90% by mass, and the amount of the polymerization initiator (C) is 0.1% by mass based on 100 parts by mass of the total of the (A) polymer and the (B) polymerizable compound. ~10 parts by mass. The resin composition for forming an optical waveguide according to the above-mentioned item (6), wherein the amount of the (A) polymer to be added is relative to the total of the (A) polymer and the (B) polymerizable compound. The amount of the polymerizable compound (B) is 15% by mass to 90% by mass based on the total amount of the (A) polymer and the (B) polymerizable compound, and the amount is 10% by mass to 85% by mass. In addition, the amount of the polymerization initiator (C) is 0.1 parts by mass to 10 parts by mass based on 100 parts by mass of the total of the (A) polymer and the (B) polymerizable compound. The resin composition for forming an optical waveguide according to claim 20, wherein the amount of the polymer (A) is 10% based on the total amount of the (A) polymer and the (B) polymerizable compound. The amount of the polymerizable compound is from 35% by mass to 5% by mass based on the total amount of the polymer (A) and the (B) polymerizable compound. The resin composition for forming an optical waveguide according to claim 21, wherein the amount of the polymer (A) is 10% based on the total amount of the (A) polymer and the (B) polymerizable compound. % by mass to 65% by mass, (B) the amount of the polymerizable compound to be polymerized with respect to the above (A) polymer and the above (B) The total amount of the compound is from 35 to 90% by mass. A resin film for forming an optical waveguide, which comprises a resin layer obtained by using the resin composition for forming an optical waveguide according to any one of claims 1 to 23. The resin film for forming an optical waveguide according to claim 24, which is a three-layer structure including a base film, a resin layer, and a protective film. The optical waveguide forming resin composition according to any one of claims 1 to 23, or the optical waveguide forming method according to claim 24 or 25 The resin film forms at least one of a lower cladding layer, a core portion, and an upper cladding layer. The optical waveguide according to claim 26, wherein the optical waveguide forming resin composition or the optical waveguide forming resin film is used as the core portion. The optical waveguide according to claim 27, wherein the light propagates mainly at a high refractive index portion formed inside the core portion. The optical waveguide according to any one of claims 26 to 28, wherein a light propagation loss at a wavelength of 850 nm is 0.15 dB/cm or less. A method of manufacturing an optical waveguide, comprising: laminating at least one of a lower cladding layer, a core portion, and an upper cladding layer, wherein the optical waveguide is formed according to any one of claims 1 to 23 A resin composition or a resin film for forming an optical waveguide according to claim 24 or 25; a step of performing exposure; a step of developing with an alkali developer; and a step of performing thermal curing.