JP2009167353A - Resin composition for optical material, resin film for optical material, and optical waveguide path using them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition for optical materials, excellent in transparency and heat resistance, to provide a resin film for optical materials, using the resin composition for the optical materials, and to provide an optical waveguide using them and excellent in transparency, reliability, and resin resistance. <P>SOLUTION: Provided are the resin composition for the optical materials, comprising (A) a (meth)acrylic polymer having a maleimide skeleton as a main chain, (B) a polymerizable compound, and (C) a polymerization initiator; the resin film for the optical materials, using the resin composition for the optical materials; and the optical waveguide using them. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to a resin composition for optical materials, a resin film for optical materials, and an optical waveguide using these, and in particular, a resin composition for optical materials excellent in transparency and heat resistance, and the resin composition for optical materials. The present invention relates to a resin film for an optical material using, and an optical waveguide excellent in transparency, reliability, and heat resistance using the same.

In recent years, in high-speed and high-density signal transmission between electronic devices and between wiring boards, signal transmission interference and attenuation become barriers in conventional transmission using electric wiring, and the limits of high-speed and high-density are beginning to appear. In order to overcome this problem, a technique for optically connecting electronic elements and wiring boards, so-called optical interconnection, has been studied. As an optical transmission line, polymer optical waveguides are attracting attention because of their ease of processing, low cost, high flexibility in wiring, and high density.
As a form of the polymer optical waveguide, a type prepared on a glass epoxy resin substrate assumed to be applied to an opto-electric hybrid board, or a flexible type not having a hard support substrate assuming connection between boards is considered suitable.

Polymer optical waveguides are required to have transparency (low light propagation loss) as well as reliability and heat resistance from the viewpoint of the usage environment and component mounting of the applied equipment. A (meth) acrylic polymer (for example, see Patent Documents 1 to 4) is known.
However, although the (meth) acrylic polymers described in Patent Documents 1 to 3 have transparency at a wavelength of 850 nm, reliability evaluation such as light propagation loss after a high-temperature and high-humidity test or a temperature cycle test is specific. There is no description of the actual test results and it is not clear. Similarly, there is no description regarding specific test results such as evaluation of heat resistance, for example, light propagation loss after a solder reflow test, and it is not clear.
The (meth) acrylic polymer described in Patent Document 4 is transparent at a wavelength of 850 nm and has good light propagation loss after a high-temperature and high-humidity storage test, but evaluation of heat resistance, for example, solder reflow There is no description about specific test results such as optical propagation loss after the test, and it is not clear.

JP-A-63-81301 Japanese Patent Laid-Open No. 06-258537 JP 2003-195079 A JP 2006-146162 A

  The present invention has been made to solve the above-described problems, and has excellent transparency and heat resistance, a resin composition for optical materials, a resin film for optical materials using the resin composition for optical materials, and these An object of the present invention is to provide an optical waveguide excellent in transparency, reliability, and heat resistance.

As a result of extensive studies, the present inventors have (A) an optical material containing a (meth) acrylic polymer having a maleimide skeleton in the main chain, (B) a polymerizable compound, and (C) a polymerization initiator. It has been found that the above problem can be solved by producing an optical waveguide using a resin composition.
That is, the present invention provides (A) a resin composition for optical materials comprising (A) a (meth) acrylic polymer having a maleimide skeleton in the main chain, (B) a polymerizable compound, and (C) a polymerization initiator. An optical material in which at least one of a resin film for optical material, a lower cladding layer, a core portion, and an upper cladding layer using the resin composition for material is formed using the resin composition for optical material or the resin film for optical material A waveguide is provided.

  The resin composition for optical material of the present invention and the resin film for optical material using the resin composition for optical material are excellent in transparency and heat resistance, and the optical waveguide produced using these is transparent and reliable. Excellent in heat resistance and heat resistance.

  The resin composition for optical materials of the present invention contains (A) a (meth) acrylic polymer having a maleimide skeleton in the main chain, (B) a polymerizable compound, and (C) a polymerization initiator, and is irradiated with actinic rays. It is preferable that the resin composition be cured by heating or by heating.

Hereinafter, the component (A) used in the present invention will be described.
The (meth) acrylic polymer in the component (A) of the present invention refers to a polymer obtained by polymerizing acrylic acid, acrylic acid ester, methacrylic acid, methacrylic acid ester, and derivatives thereof as monomers. The (meth) acrylic polymer may be a homopolymer of the above monomer, or may be a copolymer obtained by polymerizing two or more of these monomers. Furthermore, the copolymer containing said monomer and monomers other than the above may be used in the range which does not inhibit the effect of this invention. Further, it may be a mixture of a plurality of (meth) acrylic polymers.
The component (A) of the present invention is characterized by having a maleimide skeleton in the main chain and includes various compounds. From the viewpoint of transparency and heat resistance, the component (A) is represented by the following general formulas (1) and (2). It is preferable to use a (meth) acrylic polymer having a repeating unit.

In the formula, R ¹ represents a hydrogen atom or an organic group having 1 to 20 carbon atoms.

In the formula, R ² represents a hydrogen atom or a methyl group, and R ³ represents an organic group having 1 to 20 carbon atoms.

The organic groups (R ¹ and R ³ ) in the general formulas (1) and (2) are not particularly limited as long as they are organic groups having 1 to 20 carbon atoms. For example, alkyl groups, cycloalkyl groups, and aryl groups Monovalent organic groups such as an aralkyl group, a carbonyl group, an ester group, and a carbamoyl group, and further include a hydroxyl group, a halogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a carbonyl group, It may be substituted with a formyl group, ester group, carbamoyl group, alkoxy group, aryloxy group, alkylthio group, arylthio group, amino group, silyl group, silyloxy group and the like.

  In the (meth) acrylic polymer having a maleimide skeleton in the main chain of the component (A), there are no particular limitations on the compound used as a raw material for the repeating unit represented by the general formula (1). For example, N-methylmaleimide, N -Ethylmaleimide, N-propylmaleimide, N-isopropylmaleimide, N-2,2-dimethylpropylmaleimide, N-butylmaleimide, N-isobutylmaleimide, N-sec-butylmaleimide, N-tert-butylmaleimide, N- 2-methyl-2-butylmaleimide, N-pentylmaleimide, N-2-pentylmaleimide, N-3-pentylmaleimide, N-hexylmaleimide, N-2-hexylmaleimide, N-3-hexylmaleimide, N-2 -Ethylhexylmaleimide, N-heptylmaleimide, N-oct Alkyl maleimides such as tilmaleimide, N-nonylmaleimide, N-decylmaleimide, N-hydroxymethylmaleimide, N-2-hydroxyethylmaleimide, N-2-hydroxypropylmaleimide; N-cyclopentylmaleimide, N-cyclohexylmaleimide, N Cycloalkylmaleimides such as cycloheptylmaleimide, N-cyclooctylmaleimide, N-2-methylcyclohexylmaleimide, N-2-ethylcyclohexylmaleimide, N-2-chlorocyclohexylmaleimide; N-phenylmaleimide, N-2-methyl Examples thereof include arylmaleimides such as phenylmaleimide, N-2-ethylphenylmaleimide, and N-2-chlorophenylmaleimide.

Among these, from the viewpoints of transparency and heat resistance, N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-isopropylmaleimide, N-butylmaleimide, N-isobutylmaleimide, N-sec-butylmaleimide, Alkyl maleimides such as N-tert-butylmaleimide; the above cycloalkyl maleimides; the above arylmaleimides are preferably used, and N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-2-methylcyclohexylmaleimide, N-phenylmaleimide are used. Is more preferable.
These compounds can be used alone or in combination of two or more.

  In the (meth) acrylic polymer of the component (A), the content of the repeating unit represented by the general formula (1) is preferably 1 to 70 mol%. If it is 1 mol% or more, heat resistance derived from the maleimide skeleton is obtained, and if it is 70 mol% or less, the transparency is sufficient and the obtained cured product does not become brittle. From the above viewpoint, the content of the repeating unit represented by the general formula (1) is more preferably 3 to 60 mol%, and particularly preferably 5 to 50 mol%.

  In the (meth) acrylic polymer of the component (A), there is no particular limitation as a compound that is a raw material of the repeating unit represented by the general formula (2). For example, methyl (meth) acrylate, ethyl (meth) acrylate, Propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate, pentyl (meth ) Acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octyl heptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) a Relate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, behenyl (meth) acrylate, 2-hydroxyethyl (meth) ) Acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol (meth) acrylate, Aliphatic (meth) acrylates such as methoxypolypropylene glycol (meth) acrylate and ethoxypolypropylene glycol (meth) acrylate; Cycloaliphatic (meth) acrylates such as clopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate; Phenyl (meth) acrylate, benzyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, phenoxyethyl (meth) acrylate, p-cumylphenoxyethyl ( (Meth) acrylate, o-phenylphenoxyethyl (meth) acrylate, 1-naphthoxyethyl (meth) acrylate, 2-naphthoxyethyl (meth) acrylate, phenoxypolyethyleneglycol (Meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, phenoxypolypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydroxy-3- (o-phenylphenoxy) propyl ( Aromatic (meth) acrylates such as (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy-3- (2-naphthoxy) propyl (meth) acrylate; 2-tetrahydrofur Heterocyclic (meth) acrylates such as furyl (meth) acrylate, N- (meth) acryloyloxyethyl hexahydrophthalimide, 2- (meth) acryloyloxyethyl-N-carbazole, and caprolactone thereof Such as gender body and the like.

Among these, from the viewpoint of transparency and heat resistance, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate And aliphatic (meth) acrylates such as 2-hydroxyethyl (meth) acrylate; the alicyclic (meth) acrylate; the aromatic (meth) acrylate; and the heterocyclic (meth) acrylate.
These compounds can be used alone or in combination of two or more.

  In the (meth) acrylic polymer of the component (A), the content of the repeating unit represented by the general formula (2) is preferably 20 to 90 mol%. If it is 20 mol% or more, transparency derived from (meth) acrylate is obtained, and if it is 90 mol% or less, the heat resistance is sufficient. From the above viewpoint, the content of the repeating unit represented by the general formula (2) is more preferably 25 to 85 mol%, and particularly preferably 30 to 80 mol%.

  The (meth) acrylic polymer of the component (A) has a repeating unit represented by the following general formula (3) as necessary from the viewpoints of curability, strength of the resulting cured product, and heat resistance. May be.

In the formula, R ^{4 to} R ⁶ each independently represent a hydrogen atom or an organic group having 1 to 20 carbon atoms, and X ¹ represents a single bond or a divalent organic group having 1 to 20 carbon atoms.

  In the (meth) acrylic polymer of the component (A), various methods can be used for introducing the repeating unit represented by the general formula (3), and there is no particular limitation. For example, a conjugated diene is copolymerized. And ethylenically unsaturated epoxide, ethylenically unsaturated oxetane, ethylenically unsaturated isocyanate, ethylenically unsaturated carboxylic acid, ethylenically unsaturated phenol, ethylenically unsaturated alcohol, and ethylenically unsaturated amine. After polymerization, ethylenically unsaturated epoxide, ethylenically unsaturated oxetane, ethylenically unsaturated isocyanate, ethylenically unsaturated carboxylic acid, ethylenically unsaturated phenol, ethylenically unsaturated alcohol, ethylenically unsaturated amine, etc. Examples thereof include an addition reaction method.

  When the repeating unit represented by the general formula (3) is introduced by the above-described method, examples of the compound specifically used include butadiene, 2,3-dimethyl-1,3-butadiene, isoprene, 1, Conjugated dienes such as 3-pentadiene and chloroprene; glycidyl (meth) acrylate, α-ethylglycidyl (meth) acrylate, α-propylglycidyl (meth) acrylate, α-butylglycidyl (meth) acrylate, 2-methylglycidyl (meth) Acrylate, 2-ethylglycidyl (meth) acrylate, 2-propylglycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate, α-ethyl-6,7- Epoxy heptyl (meth) acrylate, o- Nylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, 3,4-epoxycyclohexylmethyl (meth) acrylate, 3,4-epoxycyclohexylethyl (meth) acrylate, 3,4-epoxycyclohexylpropyl Ethylenically unsaturated epoxides such as (meth) acrylate and 3,4-epoxycyclohexylbutyl (meth) acrylate; (2-methyl-2-oxetanyl) methyl (meth) acrylate, (2-ethyl-2-oxetanyl) methyl ( (Meth) acrylate, 2- (2-methyl-2-oxetanyl) ethyl (meth) acrylate, 2- (2-ethyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2-methyl-2-oxetanyl) propyl Ethylenically unsaturated oxetanes such as (meth) acrylate and 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate; N- (meth) acryloyl isocyanate, (meth) acryloyloxymethyl isocyanate, 2- (meth) Ethylenically unsaturated isocyanates such as acryloyloxyethyl isocyanate, 2- (meth) acryloyloxyethoxyethyl isocyanate, 1,1-bis ((meth) acryloyloxymethyl) ethyl isocyanate; (meth) acrylic acid, crotonic acid, cinnamon Acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, mono (2- (meth) acryloyloxyethyl) succinate, mono (2- (meth) acryloyloxyethyl) phthalate, mono (2- (meth) Acry Yloxyethyl) isophthalate, mono (2- (meth) acryloyloxyethyl) terephthalate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, mono (2- (meth) acryloyloxyethyl) hexahydrophthalate, mono (2- (meth) acryloyloxyethyl) hexahydroisophthalate, mono (2- (meth) acryloyloxyethyl) hexahydroterephthalate, ω-carboxy-polycaprolactone mono (meth) acrylate, o-vinylbenzoic acid, m- Ethylenically unsaturated carboxylic acids such as vinyl benzoic acid and p-vinyl benzoic acid; o-vinyl phenol, m-vinyl phenol, p-vinyl phenol, o-hydroxyphenyl (meth) acrylate, m-hydroxyphenyl (meth) Ethylenically unsaturated phenols such as acrylate, p-hydroxyphenyl (meth) acrylate, o-hydroxybenzyl (meth) acrylate, m-hydroxybenzyl (meth) acrylate, p-hydroxybenzyl (meth) acrylate; 2-hydroxyethyl ( Ethylenically unsaturated alcohols such as (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate; 2-aminoethyl (meth) acrylate 2-N-methylaminoethyl (meth) acrylate, 2-N-ethylaminoethyl (meth) acrylate, 2-aminopropyl (meth) acrylate, 2-N-methylaminopropyl (meth) acrylate, 2- -Ethylenically unsaturated amines such as ethylaminopropyl (meth) acrylate, 2-aminobutyl (meth) acrylate, 2-N-methylaminobutyl (meth) acrylate, 2-N-ethylaminobutyl (meth) acrylate, etc. Can be mentioned.

Among these, from the viewpoint of transparency, heat resistance, and reactivity, conjugated dienes such as butadiene and isoprene; ethylenically unsaturated epoxides such as glycidyl (meth) acrylate and 3,4-epoxycyclohexylmethyl (meth) acrylate; The ethylenically unsaturated oxetane; the ethylenically unsaturated isocyanate; the ethylenically unsaturated carboxylic acid such as (meth) acrylic acid, crotonic acid, 2-hexahydrophthaloylethyl (meth) acrylate; the ethylenically unsaturated alcohol Preferably there is.
These compounds can be used alone or in combination of two or more.

  (A) When the (meth) acrylic polymer of a component has a repeating unit represented by General formula (3), it is preferable that the content rate is 1-60 mol%. If it is 1 mol% or more, the curability, the strength of the resulting cured product, and the heat resistance are sufficient, and if it is 60 mol% or less, the resulting cured product will not become brittle. From the above viewpoint, the content of the repeating unit represented by the general formula (3) is more preferably 3 to 50 mol%, and particularly preferably 5 to 40 mol%.

  The (meth) acrylic polymer of component (A) is a repeating represented by the following general formula (4) as necessary from the viewpoint of adjusting the glass transition temperature (Tg) and improving adhesion. You may have a unit.

In the formula, R ⁷ and R ⁸ each independently represent a hydrogen atom or an organic group having 1 to 20 carbon atoms, and X ² represents a single bond or a divalent organic group having 1 to 20 carbon atoms.

In the (meth) acrylic polymer of the component (A), there is no particular limitation as a compound that is a raw material of the repeating unit represented by the general formula (4). For example, (meth) acrylic acid, crotonic acid, cinnamic acid , Maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, mono (2- (meth) acryloyloxyethyl) succinate, mono (2- (meth) acryloyloxyethyl) phthalate, mono (2- (meth) acryloyl) Oxyethyl) isophthalate, mono (2- (meth) acryloyloxyethyl) terephthalate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, mono (2- (meth) acryloyloxyethyl) hexahydrophthalate, mono ( 2- (Meth) acryloyloxyethyl) hexahydroisof Rate, mono (2- (meth) acryloyloxyethyl) hexahydroterephthalate, ω-carboxy-polycaprolactone mono (meth) acrylate, o-vinylbenzoic acid, m-vinylbenzoic acid, p-vinylbenzoic acid and the like. .
Among these, (meth) acrylic acid, crotonic acid, maleic acid, fumaric acid, mono (2- (meth) acryloyloxyethyl) succinate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate from the viewpoint of transparency Mono (2- (meth) acryloyloxyethyl) hexahydrophthalate, mono (2- (meth) acryloyloxyethyl) hexahydroisophthalate, mono (2- (meth) acryloyloxyethyl) hexahydroterephthalate preferable.
In addition, maleic anhydride, citraconic anhydride, and itaconic anhydride are used as raw materials, and after the copolymerization, they are ring-opened with an appropriate alcohol such as methanol, ethanol, propanol, etc., and converted into a repeating unit represented by the general formula (4) May be.
These compounds can be used alone or in combination of two or more.

  When the (meth) acrylic polymer of the component (A) has a repeating unit represented by the general formula (4), the content is preferably 3 to 60 mol%. When it is 3 mol% or more, the glass transition temperature (Tg) can be sufficiently adjusted and the adhesion can be improved. On the other hand, when it is 60 mol% or less, the moisture resistance is good. From the above viewpoint, the content of the repeating unit represented by the general formula (4) is more preferably 5 to 50 mol%, and particularly preferably 7 to 40 mol%.

  In addition, the (meth) acrylic polymer of the component (A) is further represented by the following general formulas (5) to (7) as necessary from the viewpoints of curability, strength of the obtained cured product, and heat resistance. It may have a repeating unit.

In the formula, R ⁹ , R ¹⁰ , R ¹¹ and R ¹² represent a hydrogen atom or an organic group having 1 to 20 carbon atoms, and X ³ , X ⁴ and X ⁵ are a single bond or a divalent group having 1 to 20 carbon atoms. An organic group of
As the organic group R ^9, R ^10, R ¹¹ and carbon atoms for R ¹² 1 to 20, are exemplified the same ones as described as the organic group in the above general formula (1) and (2) .

There is no restriction | limiting in particular as a compound used as the raw material of the repeating unit represented by the said General formula (5), For example, glycidyl (meth) acrylate, (alpha) -ethyl glycidyl (meth) acrylate, (alpha) -propyl glycidyl (meth) acrylate , Α-butylglycidyl (meth) acrylate, 2-methylglycidyl (meth) acrylate, 2-ethylglycidyl (meth) acrylate, 2-propylglycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3, Examples include 4-epoxyheptyl (meth) acrylate, α-ethyl-6,7-epoxyheptyl (meth) acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, and p-vinylbenzyl glycidyl ether.
Among these, glycidyl (meth) acrylate is preferable from the viewpoints of transparency, heat resistance, and reactivity.
These compounds can be used alone or in combination of two or more.

There is no restriction | limiting in particular as a compound used as the raw material of the repeating unit represented by the said General formula (6), For example, 3, 4- epoxy cyclohexyl methyl (meth) acrylate, 3, 4- epoxy cyclohexyl ethyl (meth) acrylate 3,4-epoxycyclohexylpropyl (meth) acrylate, 3,4-epoxycyclohexylbutyl (meth) acrylate, and the like.
Among these, 3,4-epoxycyclohexylmethyl (meth) acrylate is preferable from the viewpoint of transparency, heat resistance, and reactivity.
These compounds can be used alone or in combination of two or more.

There is no restriction | limiting in particular as a compound used as the raw material of the repeating unit represented by the said General formula (7), For example, (2-methyl-2-oxetanyl) methyl (meth) acrylate, (2-ethyl-2-oxetanyl) Methyl (meth) acrylate, 2- (2-methyl-2-oxetanyl) ethyl (meth) acrylate, 2- (2-ethyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2-methyl-2-oxetanyl) ) Propyl (meth) acrylate, 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate, and the like.
Among these, (2-methyl-2-oxetanyl) methyl (meth) acrylate and (2-ethyl-2-oxetanyl) methyl (meth) acrylate may be used from the viewpoints of transparency, heat resistance, and reactivity. preferable.
These compounds can be used alone or in combination of two or more.

  When it has a repeating unit represented by the above general formulas (5), (6) and (7), the content is preferably 1 to 60 mol%. If it is 1 mol% or more, the curability, strength of the resulting cured product, and heat resistance are sufficient, and if it is 60 mol% or less, the resulting cured product will not become brittle. From the above viewpoint, the content of the repeating unit represented by the general formulas (5), (6) and (7) is more preferably 3 to 50 mol%, particularly preferably 5 to 40 mol%. In addition, the repeating units represented by the general formulas (5), (6), and (7) may be introduced singly or in combination.

The (meth) acrylic polymer of component (A) may further have other repeating units other than the repeating units represented by the general formulas (1) to (7) as necessary.
Examples of the raw material used for constituting such other repeating units include compounds having an ethylenically unsaturated group, and specifically include styrene, α-methylstyrene, β-methylstyrene, 3-methyl. Styrene, 4-methylstyrene, α, 2-dimethylstyrene, 2,4-dimethylstyrene, 2,5-dimethylstyrene, (meth) acrylonitrile, vinyl cyclohexyl ether, vinyl phenyl ether, vinyl benzyl ether, vinyl acetate, N- Examples include vinyl pyrrolidone, N-vinyl carbazole, vinyl pyridine, vinyl chloride, and vinylidene chloride.
Among these, from the viewpoints of transparency and heat resistance, styrene, α-methylstyrene, β-methylstyrene, 3-methylstyrene, 4-methylstyrene, α, 2-dimethylstyrene, 2,4-dimethylstyrene, 2, 5-dimethylstyrene, (meth) acrylonitrile, vinyl acetate, and N-vinylcarbazole are preferred.
These compounds can be used alone or in combination of two or more.

  The (A) component (meth) acrylic polymer is not particularly limited in its synthesis method. For example, the compound used as a raw material of the repeating unit represented by the general formulas (1) and (2), and further if necessary A compound that is a raw material of the repeating unit represented by the general formulas (3) to (7), and a compound that is a raw material of another repeating unit other than the repeating units represented by the general formulas (1) to (7); It can be obtained by copolymerization with heating using a suitable thermal radical polymerization initiator. At this time, if necessary, an organic solvent and / or water can be used as a reaction solvent. Further, if necessary, a suitable chain transfer agent, dispersant, surfactant, emulsifier and the like can be used in combination.

  The thermal radical polymerization initiator is not particularly limited, and examples thereof include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis (t-butylperoxy) cyclohexane, 1,1- Bis (t-butylperoxy) -2-methylcyclohexane, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, Peroxyketals such as 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane; hydroperoxides such as p-menthane hydroperoxide; α, α′-bis (t-butylperoxide Oxy) diisopropylbenzene, dicumyl peroxide, t-butyl Dialkyl peroxides such as tilcumyl peroxide and di-t-butyl peroxide; diacyl peroxides such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide and benzoyl peroxide; bis (4-t-butylcyclohexyl) peroxide Peroxycarbonates such as oxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-3-methoxybutyl peroxycarbonate; t-butyl peroxypivalate, t- Hexyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t -Hexilper Xyl-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, t-hexylperoxyisopropylmonocarbonate, t-butylperoxy-3,5 5-trimethylhexanoate, t-butyl peroxylaurate, t-butyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-butyl peroxybenzoate, t-hexyl peroxybenzoate, Peroxyesters such as 2,5-dimethyl-2,5-bis (benzoylperoxy) hexane and t-butylperoxyacetate; 2,2′-azobisisobutyronitrile, 2,2′-azobis (2 , 4-Dimethylvaleronitrile), 2,2′-a Azo compounds such as bis (4-methoxy-2'-dimethylvaleronitrile) and the like.

The organic solvent used as the reaction solvent is not particularly limited as long as it can dissolve the (meth) acrylic polymer of component (A). For example, aromatic carbonization such as toluene, xylene, mesitylene, cumene, p-cymene, etc. Hydrogen; chain ether such as diethyl ether, tert-butyl methyl ether, cyclopentyl methyl ether, dibutyl ether; cyclic ether such as tetrahydrofuran, 1,4-dioxane; methanol, ethanol, isopropanol, butanol, ethylene glycol, propylene glycol, etc. Alcohol: Acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone and other ketones; methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate Esters such as γ-butyrolactone; carbonates such as ethylene carbonate and propylene carbonate; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol mono Polyhydric alcohol alkyl ethers such as ethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, and diethylene glycol diethyl ether Ter; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, etc. Ether acetate; amides such as N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and the like.
These organic solvents can be used alone or in combination of two or more.

The weight average molecular weight of the component (A) (meth) acrylic polymer is preferably 1,000 to 3,000,000. If the molecular weight is 1,000 or more, the strength of the cured product is sufficient when the resin composition is used, and if it is 3,000,000 or less, the solubility in the developer and (B) the polymerizable compound Good compatibility. From the above viewpoint, the weight average molecular weight of the component (A) is more preferably 3,000 to 2,000,000, and particularly preferably 5,000 to 1,000,000.
The weight average molecular weight in the present invention is a value measured by gel permeation chromatography (GPC) and converted to standard polystyrene.

  (A) It is preferable that the compounding quantity of the (meth) acrylic polymer of a component is 10-85 mass% with respect to the total amount of (A) component and (B) component. If it is 10% by mass or more, the strength and flexibility of the cured product of the resin composition for optical materials is sufficient, and if it is 85% by mass or less, it is easily entangled by the component (B) during curing. The developer resistance is not insufficient. From the above viewpoint, the blending amount of the component (A) is more preferably 20 to 80% by mass, and particularly preferably 25 to 75% by mass.

Hereinafter, the component (B) used in the present invention will be described.
The polymerizable compound of component (B) is not particularly limited, but for example, ethylenically unsaturated such as (meth) acrylate, vinyl ether, vinyl ester, vinyl amide, arylated vinyl, vinyl pyridine, vinyl halide, vinylidene halide, etc. And compounds having a polymerizable substituent such as a group.
Among these, (meth) acrylate and arylated vinyl are mentioned from the viewpoint of transparency and heat resistance.
As the (meth) acrylate, any of monofunctional, bifunctional, or trifunctional or more polyfunctional ones can be used.

As monofunctional (meth) acrylate, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl ( (Meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octylheptyl (meth) Acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) ) Acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, behenyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2 -Hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, mono Aliphatic (meth) acrylates such as (2- (meth) acryloyloxyethyl) succinate; cyclopentyl (meth) acrylate Cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, mono (2- (meth) acryloyloxyethyl) hexahydrophthalate and other alicyclic (meth) acrylates; phenyl (meth) acrylate, benzyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate 2-naphthyl (meth) acrylate, phenoxyethyl (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, o-phenylphenoxyethyl (meth) acrylate, 1-naphthoxy Ethyl (meth) acrylate, 2-naphthoxyethyl (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, phenoxypolypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) Acrylate, 2-hydroxy-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy-3- (2-naphthoxy) propyl ( Aromatic (meth) acrylates such as meth) acrylate; 2-tetrahydrofurfuryl (meth) acrylate, N- (meth) acryloyloxyethyl hexahydrophthalimide, 2- (meth) Heterocyclic (meth) acrylates such as methacryloyloxyethyl -N- carbazole, and these caprolactone modified products thereof.
Among these, from the viewpoints of transparency and heat resistance, the alicyclic (meth) acrylate; the aromatic (meth) acrylate; and the heterocyclic (meth) acrylate are preferable.

Examples of bifunctional (meth) acrylates include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and polyethylene glycol di (meth) acrylate. , Propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, ethoxylated polypropylene glycol di ( (Meth) acrylate, 1,3-butanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, neopentyl Recall di (meth) acrylate, 3-methyl-1,5-pentanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 2-butyl-2-ethyl-1,3-propanediol di ( (Meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, glycerin di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, ethoxylated 2-methyl Aliphatic (meth) acrylates such as 1,3-propanediol di (meth) acrylate; cyclohexanedimethanol (meth) acrylate, ethoxylated cyclohexanedimethanol (meth) acrylate, propoxylated cyclohexanedimethanol (meth) acrylate, etoxy Propoxylated cyclohexanedimethanol (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, ethoxylated tricyclodecane dimethanol (meth) acrylate, propoxylated tricyclodecane dimethanol (meth) acrylate, ethoxylated propoxylated tri Cyclodecane dimethanol (meth) acrylate, ethoxylated hydrogenated bisphenol A di (meth) acrylate, propoxylated hydrogenated bisphenol A di (meth) acrylate, ethoxylated propoxylated hydrogenated bisphenol A di (meth) acrylate, ethoxylated water Alicyclic rings such as hydrogenated bisphenol F di (meth) acrylate, propoxylated hydrogenated bisphenol F di (meth) acrylate and ethoxylated propoxylated hydrogenated bisphenol F di (meth) acrylate Formula (meth) acrylate; ethoxylated bisphenol A di (meth) acrylate, propoxylated bisphenol A di (meth) acrylate, ethoxylated propoxylated bisphenol A di (meth) acrylate, ethoxylated bisphenol F di (meth) acrylate, propoxylated Bisphenol F di (meth) acrylate, ethoxylated propoxylated bisphenol F di (meth) acrylate, ethoxylated bisphenol AF di (meth) acrylate, propoxylated bisphenol AF di (meth) acrylate, ethoxylated propoxylated bisphenol AF di (meth) Acrylate, ethoxylated fluorene-type di (meth) acrylate, propoxylated fluorene-type di (meth) acrylate, ethoxylated propoxylated fluorene-type di (meth) acrylate Heterocyclic (meth) acrylates such as ethoxylated isocyanuric acid di (meth) acrylate, propoxylated isocyanuric acid di (meth) acrylate, ethoxylated propoxylated isocyanuric acid di (meth) acrylate, etc. Acrylates; these caprolactone modified products; aliphatic epoxy (meth) acrylates such as neopentyl glycol type epoxy (meth) acrylate; cyclohexanedimethanol type epoxy (meth) acrylate, hydrogenated bisphenol A type epoxy (meth) acrylate, hydrogenated Alicyclic epoxy (meth) acrylates such as bisphenol F type epoxy (meth) acrylate; resorcinol type epoxy (meth) acrylate, bisphenol A type epoxy (meth) acrylate, bisphenol -Type epoxy (meth) acrylate, bisphenol AF type epoxy the (meth) acrylate, aromatic epoxy (meth) acrylates such as fluorene epoxy (meth) acrylates.
Among these, from the viewpoint of transparency and heat resistance, the alicyclic (meth) acrylate; the aromatic (meth) acrylate; the heterocyclic (meth) acrylate; the alicyclic epoxy (meth) acrylate; Aromatic epoxy (meth) acrylate is preferred.

Examples of trifunctional or higher polyfunctional (meth) acrylates include trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, and ethoxylated propoxylated trimethylol. Propane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated pentaerythritol tri (meth) acrylate, propoxylated pentaerythritol tri (meth) acrylate, ethoxylated propoxylated pentaerythritol tri (meth) acrylate, pentaerythritol tetra (Meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, propoxylated pentaerythritol tetra (meth) Aliphatic (meth) acrylates such as acrylate, ethoxylated propoxylated pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetraacrylate, dipentaerythritol hexa (meth) acrylate; ethoxylated isocyanuric acid tri (meth) acrylate, propoxylated isocyanuric Heterocyclic (meth) acrylates such as acid tri (meth) acrylate and ethoxylated propoxylated isocyanuric acid tri (meth) acrylate; modified caprolactone thereof; phenol novolac type epoxy (meth) acrylate, cresol novolac type epoxy (meth) Aromatic epoxy (meth) acrylates such as acrylate may be mentioned.
Among these, from the viewpoints of transparency and heat resistance, heterocyclic (meth) acrylates; aromatic epoxy (meth) acrylates are preferable.
These compounds can be used individually or in combination of 2 or more types, and also can be used in combination with other polymerizable compounds.

  From the viewpoint of compatibility with the (meth) acrylic polymer of the component (A), a compound having a cyclic ether group in the molecule can also be mentioned as a preferred polymerizable compound of the component (B) other than the (meth) acrylate. There is no restriction | limiting in particular as a cyclic ether group, For example, an epoxy group, an oxetanyl group, etc. are mentioned.

The compound having an epoxy group in the molecule is not particularly limited. For example, hydroquinone type epoxy resin, resorcinol type epoxy resin, catechol type epoxy resin, bisphenol A type epoxy resin, tetrabromobisphenol A type epoxy resin, bisphenol F type Bifunctional phenol glycidyl ether type such as epoxy resin, bisphenol AF type epoxy resin, bisphenol AD type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin; hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F Type epoxy resin, hydrogenated 2,2′-biphenol type epoxy resin, hydrogenated bifunctional phenol glycidyl ether type such as hydrogenated 4,4′-biphenol type epoxy resin; phenol novolac Polyfunctional glycol glycidyl ether type with 3 or more functions such as epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene-phenol type epoxy resin, dicyclopentadiene-cresol type epoxy resin, tetraphenylolethane type epoxy resin, etc .; polyethylene glycol type Bifunctional aliphatic alcohol glycidyl ether type such as epoxy resin, polypropylene glycol type epoxy resin, neopentyl glycol type epoxy resin, 1,6-hexanediol type epoxy resin; cyclohexanediol type epoxy resin, cyclohexanedimethanol type epoxy resin, tri Bifunctional cycloaliphatic alcohol glycidyl ether type such as cyclodecane dimethanol type epoxy resin; trimethylolpropane type epoxy resin, sorbitol Type polyfunctional aliphatic alcohol glycidyl ether type such as glyceryl type epoxy resin, glycerin type epoxy resin; bifunctional aromatic glycidyl ester such as diglycidyl phthalate; tetrahydrophthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl Bifunctional alicyclic glycidyl esters such as esters; bifunctional aromatic glycidyl amines such as N, N-diglycidylaniline and N, N-diglycidyltrifluoromethylaniline; N, N, N ′, N′-tetraglycidyl Trifunctional or more polyfunctional aromatic glycidylamines such as -4,4-diaminodiphenylmethane, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, N, N, o-triglycidyl-p-aminophenol; Alicyclic diepoxy acetal, Bifunctional cycloaliphatic epoxy resins such as cyclic diepoxy adipate, alicyclic diepoxycarboxylate, vinylcyclohexene dioxide; 1,2-epoxy-4- of 2,2-bis (hydroxymethyl) -1-butanol Trifunctional or higher polyfunctional alicyclic epoxy resin such as (2-oxiranyl) cyclohexane adduct; Trifunctional or higher functional heterocyclic epoxy resin such as triglycidyl isocyanurate; Silicon-containing organopolysiloxane type epoxy resin A bifunctional or trifunctional or higher polyfunctional epoxy resin is exemplified.
Among these, from the viewpoint of transparency and heat resistance, hydroquinone type epoxy resin, resorcinol type epoxy resin, catechol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, bisphenol AD type epoxy Resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, etc. bifunctional phenol glycidyl ether type epoxy resin; the above various hydrogenated bifunctional phenol glycidyl ether type epoxy resins; the above various polyfunctional phenol glycidyl ether type Epoxy resin; various bifunctional alicyclic alcohol glycidyl ether type epoxy resins; bifunctional aromatic glycidyl ester; bifunctional alicyclic glycidyl ester; bifunctional fat It is preferable that the above-mentioned silicon-containing bifunctional or trifunctional or higher polyfunctional epoxy resin; Formula epoxy resin; the trifunctional or higher polyfunctional alicyclic epoxy resin; the trifunctional or higher polyfunctional heterocyclic epoxy resins.

The compound having an oxetanyl group in the molecule is not particularly limited. For example, hydroquinone type oxetane resin, resorcinol type oxetane resin, catechol type oxetane resin, bisphenol A type oxetane resin, tetrabromobisphenol A type oxetane resin, bisphenol F type Bifunctional phenol oxetanyl ether type such as oxetane resin, bisphenol AF type oxetane resin, bisphenol AD type oxetane resin, biphenyl type oxetane resin, naphthalene type oxetane resin, fluorene type oxetane resin; hydrogenated bisphenol A type oxetane resin, hydrogenated bisphenol F Bifunctional phenol oxet such as hydrogenated oxetane resin, hydrogenated 2,2'-biphenol type oxetane resin, hydrogenated 4,4'-biphenol type oxetane resin Nyl ether type; polyfunctional phenol oxetanyl having three or more functionalities such as phenol novolac type oxetane resin, cresol novolac type oxetane resin, dicyclopentadiene-phenol type oxetane resin, dicyclopentadiene-cresol type oxetane resin, tetraphenylolethane type oxetane resin Ether type; polyethylene glycol type oxetane resin, polypropylene glycol type oxetane resin, neopentyl glycol type oxetane resin, bifunctional aliphatic alcohol oxetanyl ether type such as 1,6-hexanediol type oxetane resin; cyclohexanediol type oxetane resin, cyclohexanedi Bifunctional alicyclic alcohol oxet such as methanol type oxetane resin and tricyclodecane dimethanol type oxetane resin Tanyl ether type; trifunctional or higher polyfunctional aliphatic alcohol oxetanyl ether type such as trimethylolpropane type oxetane resin, sorbitol type oxetane resin, glycerin type oxetane resin; bifunctional aromatic oxetanyl ester such as dioxetanyl phthalate; tetrahydro Bifunctional alicyclic oxetanyl esters such as dioxetanyl phthalate and dioxetanyl hexahydrophthalate; bifunctional aromatic oxetanylamines such as N, N-dioxetanylaniline and N, N-dioxetanyltrifluoromethylaniline; N, N, N ′, N′-tetraoxetanyl-4,4-diaminodiphenylmethane, 1,3-bis (N, N-oxetanylaminomethyl) cyclohexane, N, N, o-triglycidyl-p-amino Trifunctional or higher polyfunctional aromatic oxetanylamine such as enol; Trifunctional or higher functional heterocyclic oxetane resin such as trioxetanyl isocyanurate; Silicon-containing bifunctional or trifunctional or higher polyfunctional polyfunctional heterocyclic oxetane resin such as organopolysiloxane type oxetanyl resin Examples thereof include functional oxetane resins.
Among these, from the viewpoint of transparency and heat resistance, hydroquinone type oxetane resin, resorcinol type oxetane resin, catechol type oxetane resin, bisphenol A type oxetane resin, bisphenol F type oxetane resin, bisphenol AF type oxetane resin, bisphenol AD type oxetane Resin, biphenyl type oxetane resin, naphthalene type oxetane resin, fluorene type oxetane resin and other bifunctional phenol oxetanyl ether type oxetane resins; the above various hydrogenated bifunctional phenol oxetanyl ether type oxetane resins; the above various polyfunctional phenol oxetanyl ether types Oxetane resin; various bifunctional alicyclic alcohol oxetanyl ether type oxetane resins; bifunctional aromatic oxetanyl ester; bifunctional It is preferable that the above-mentioned silicon-containing bifunctional or trifunctional or higher polyfunctional oxetane resin; cyclic oxetanyl ester; the trifunctional or higher polyfunctional heterocyclic oxetane resin.
These compounds can be used alone or in combination of two or more, and can also be used in combination with other polymerizable compounds.

  It is preferable that the compounding quantity of the polymeric compound of (B) component is 15-90 mass% with respect to the total amount of (A) component and (B) component. If it is 15% by mass or more, it is easy to entangle the (meth) acrylic polymer of the component (A), and the developer resistance is not insufficient. If it is 90% by mass or less, a cured film Film strength and flexibility are sufficient. From the above viewpoint, the blending amount of the component (B) is more preferably 20 to 80% by mass, and particularly preferably 25 to 75% by mass.

Hereinafter, the component (C) used in the present invention will be described.
The polymerization initiator for component (C) is not particularly limited as long as the polymerization is initiated by heating or irradiation with actinic rays such as ultraviolet rays and visible rays. When using a compound having a saturated group, examples include a thermal radical polymerization initiator and a photo radical polymerization initiator. When using a compound having a cyclic ether group in the molecule as the polymerizable compound of the component (B), thermal cationic polymerization An initiator, a photocationic polymerization initiator, etc. are mentioned.

There is no restriction | limiting in particular as a thermal radical polymerization initiator, The thing similar to the thermal radical polymerization initiator used when synthesize | combining the (meth) acrylic polymer of the above-mentioned (A) component can be used.
Among them, diacyl peroxide, peroxy ester, and azo compound are preferable from the viewpoints of curability, transparency, and heat resistance.

There is no restriction | limiting in particular as radical photopolymerization initiator, For example, benzoinketals, such as 2, 2- dimethoxy- 1, 2- diphenyl ethane- 1-one; 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl -1-phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- {4 [4 Α-hydroxy ketones such as-(2-hydroxy-2-methylpropionyl) benzyl] phenyl} -2-methylpropan-1-one; methyl phenylglyoxylate, ethyl phenylglyoxylate, 2- (2-hydroxyoxyphenylacetate) Ethoxy) ethyl, oxyphenylacetic acid 2- (2-oxo-2-phenylacetoxyate) G) Glyoxyesters such as ethyl; 2-benzyl-2-dimethylamino-1- (4-morpholin-4-ylphenyl) -butan-1-one, 2-dimethylamino-2- (4-methylbenzyl) ) -1- (4-Morpholin-4-ylphenyl) -butan-1-one, 1,2-methyl-1- [4- (methylthio) phenyl]-(4-morpholin) -2-ylpropane Α-amino ketones such as -1-one; 1,2-octanedione, 1- [4- (phenylthio), 2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2- Oxime esters such as methylbenzoyl) -9H-carbazol-3-yl], 1- (O-acetyloxime); bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, bis Phosphine oxides such as 2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 2- (o-chlorophenyl) -4,5-diphenylimidazole 2-mer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxy) 2,4,5-triarylimidazole dimers such as phenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer; benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone, N, N′-tetraethyl-4,4 ′ Benzophenone compounds such as diaminobenzophenone and 4-methoxy-4'-dimethylaminobenzophenone; 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2, Quinone compounds such as 3-dimethylanthraquinone; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; benzoin, methyl benzoin and ethylben Benzoin compounds such as indium; benzyl compounds such as benzyldimethyl ketal; acridine compounds such as 9-phenylacridine and 1,7-bis (9,9′-acridinylheptane): N-phenylglycine, coumarin and the like .
In the 2,4,5-triarylimidazole dimer, the substituents of the aryl groups at the two triarylimidazole sites may give the same and symmetric compounds, but give differently asymmetric compounds. May be.
Among these, from the viewpoint of curability and transparency, the α-hydroxyketone; the glyoxyester; the oxime ester; and the phosphine oxide are preferable.
The above heat and photo radical polymerization initiators can be used alone or in combination of two or more. Furthermore, it can also be used in combination with an appropriate sensitizer.

The thermal cationic polymerization initiator is not particularly limited, and examples thereof include benzylsulfonium salts such as p-alkoxyphenylbenzylmethylsulfonium hexafluoroantimonate; benzyl-p-cyanopyridinium hexafluoroantimonate, 1-naphthylmethyl-o- Examples thereof include pyridinium salts such as cyanopyridinium hexafluoroantimonate and cinnamyl-o-cyanopyridinium hexafluoroantimonate; and benzylammonium salts such as benzyldimethylphenylammonium hexafluoroantimonate.
Among these, the benzylsulfonium salt is preferable from the viewpoints of curability, transparency, and heat resistance.

The photocationic polymerization initiator is not particularly limited, and examples thereof include aryldiazonium salts such as p-methoxybenzenediazonium hexafluorophosphate, diaryliodonium salts such as diphenyliodonium hexafluorophosphate and diphenyliodonium hexafluoroantimonate; Fluorophosphate, triphenylsulfonium hexafluoroantimonate, diphenyl-4-thiophenoxyphenylsulfonium hexafluorophosphate, diphenyl-4-thiophenoxyphenylsulfonium hexafluoroantimonate, diphenyl-4-thiophenoxyphenylsulfonium pentafluorohydroxyantimonate, etc. Triarylsulfonium salts of Triselselenonium salts such as ruselenonium hexafluorophosphate, triphenylselenonium tetrafluoroborate, triphenylselenonium hexafluoroantimonate; dimethylphenacylsulfonium hexafluoroantimonate, diethylphenacylsulfonium hexafluoroantimonate, etc. Dialkylphenacylsulfonium salts; dialkyl-4-hydroxy salts such as 4-hydroxyphenyldimethylsulfonium hexafluoroantimonate, 4-hydroxyphenylbenzylmethylsulfonium hexafluoroantimonate; α-hydroxymethylbenzoin sulfonate, N-hydroxyimide Sulfonate, α-sulfonyloxyketone, β-sulfonyloxyketone, etc. An acid ester.
Among these, from the viewpoint of curability, transparency, and heat resistance, the triarylsulfonium salt is preferable.
These thermal and photocationic polymerization initiators can be used alone or in combination of two or more. Furthermore, it can also be used in combination with an appropriate sensitizer.

  (C) It is preferable that the compounding quantity of the polymerization initiator of a component is 0.01-10 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component. If it is 0.01 mass part or more, hardening will be enough, and if it is 10 mass parts or less, sufficient light transmittance will be obtained. From the above viewpoint, the amount is more preferably 0.05 to 7 parts by mass, and particularly preferably 0.1 to 5 parts by mass.

  Further, in the resin composition for an optical material of the present invention, an antioxidant, an anti-yellowing agent, an ultraviolet absorber, a visible light absorber, a colorant, a plasticizer, a stabilizer, a filler, etc., as necessary. You may add what is called an additive in the ratio which does not have a bad influence on the effect of this invention.

  The resin composition for optical materials comprising (A) a (meth) acrylic polymer having a maleimide skeleton in the main chain, (B) a polymerizable compound, and (C) a polymerization initiator in the present invention. The refractive index at a wavelength of 830 nm at a temperature of 25 ° C. of a cured film obtained by polymerizing and curing the resin composition is preferably 1.400 to 1.700. If the refractive index is 1.400 to 1.700, the refractive index is not significantly different from that of a normal optical resin, so that versatility as an optical material is not impaired. From the above viewpoint, the refractive index of the cured film is more preferably 1.425 to 1.675, and particularly preferably 1.450 to 1.650.

  Further, the resin composition for an optical material comprising (A) a (meth) acrylic polymer having a maleimide skeleton in the main chain, (B) a polymerizable compound, and (C) a polymerization initiator is polymerized and cured. The transmittance of a cured film having a thickness of 50 μm at a wavelength of 400 nm is preferably 80% or more. If the transmittance is 80% or more, the amount of transmitted light is sufficient. From the above viewpoint, the transmittance is more preferably 85% or more. Note that the upper limit of the transmittance is not particularly limited.

The resin composition for optical materials of the present invention may be diluted with a suitable organic solvent and used as a resin varnish for optical materials. The organic solvent used here is not particularly limited as long as it can dissolve the resin composition, and is the same as the organic solvent used as a reaction solvent capable of dissolving the (meth) acrylic polymer of component (A) described above. Can be used.
These organic solvents can be used alone or in combination of two or more. Moreover, it is preferable that the solid content density | concentration in a resin varnish is 10-80 mass% normally.

  When preparing the resin composition for an optical material of the present invention, it is preferable to mix by stirring. Although there is no restriction | limiting in particular in the stirring method, From the viewpoint of stirring efficiency, stirring using a propeller is preferable. Although there is no restriction | limiting in particular in the rotational speed of the propeller at the time of stirring, It is preferable that it is 10-1,000 rpm. If it is 10 rpm or more, each component will be sufficiently mixed, and if it is 1,000 rpm or less, entrainment of bubbles due to rotation of the propeller will be reduced. From the above viewpoint, it is more preferable that it is 50-800 rpm, and it is especially preferable that it is 100-500 rpm. Although there is no restriction | limiting in particular in stirring time, It is preferable that it is 1 to 24 hours. If it is 1 hour or more, each component will be fully mixed, and if it is 24 hours or less, the varnish preparation time can be shortened and productivity can be improved.

  The prepared resin composition for an optical material is preferably filtered using a filter having a pore diameter of 50 μm or less. If the pore diameter is 50 μm or less, large foreign matters are removed and no repellency or the like occurs at the time of application, light scattering is suppressed, and transparency is not impaired. From the above viewpoint, it is more preferable to filter using a filter having a pore diameter of 30 μm or less, and it is particularly preferable to filter using a filter having a pore diameter of 10 μm or less.

  The prepared resin composition for optical material or resin varnish is preferably degassed under reduced pressure. Although there is no restriction | limiting in particular in the defoaming method, For example, the method of using a vacuum pump, a bell jar, and the defoaming apparatus with a vacuum apparatus is mentioned. Although there is no restriction | limiting in particular in the pressure at the time of pressure reduction, The pressure in which the low boiling point component contained in a resin composition does not boil is preferable. Although there is no restriction | limiting in particular in vacuum degassing time, It is preferable that it is 3 to 60 minutes. If it is 3 minutes or more, bubbles dissolved in the resin composition can be removed, and if it is 60 minutes or less, the organic solvent contained in the resin composition does not volatilize and the defoaming time is shortened. And productivity can be improved.

  The resin composition for an optical material of the present invention is excellent in transparency and heat resistance, and is suitable as a resin composition for forming an optical waveguide.

Hereinafter, the resin film for optical materials of the present invention will be described.
The resin film for optical materials of the present invention uses the resin composition for optical materials, and the resin composition for optical materials containing the components (A) to (C) is applied to a suitable support film. It can be manufactured easily. Moreover, when the said resin composition for optical materials is diluted with the said organic solvent, it can manufacture by apply | coating a resin composition to a support film and removing an organic solvent.

There is no restriction | limiting in particular as a support film, For example, Polyesters, such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate; Polyolefins, such as polyethylene and a polypropylene; Polycarbonate, polyamide, a polyimide, Polyamideimide, Polyetherimide, Polyether sulfide, Poly Examples include ether sulfone, polyether ketone, polyphenylene ether, polyphenylene sulfide, polyarylate, polysulfone, and liquid crystal polymer. Among these, from the viewpoint of flexibility and toughness, it may be polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polypropylene, polycarbonate, polyamide, polyimide, polyamideimide, polyphenylene ether, polyphenylene sulfide, polyarylate, polysulfone. preferable.
In addition, from the viewpoint of improving releasability from the resin layer, a film that has been subjected to release treatment with a silicone compound, a fluorine-containing compound, or the like may be used as necessary.

  The thickness of the support film may be appropriately changed depending on the intended flexibility, but is preferably 3 to 250 μm. When it is 3 μm or more, the film strength is sufficient, and when it is 250 μm or less, sufficient flexibility is obtained. From the above viewpoint, the thickness of the support film is more preferably 5 to 200 μm, and particularly preferably 7 to 150 μm.

  A resin film for an optical material produced by applying a resin composition for an optical material on a support film, a protective film is attached on the resin layer as necessary, and the three layers comprising the support film, the resin layer, and the protective film It is good also as a structure.

  The protective film is not particularly limited, but from the viewpoint of flexibility and toughness, polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyolefins such as polyethylene and polypropylene are preferably used. In addition, you may use the film in which the mold release process was given with the silicone type compound, the fluorine-containing compound, etc. from a viewpoint of peelability improvement with a resin layer as needed.

  The thickness of the protective film may be appropriately changed depending on the intended flexibility, but is preferably 10 to 250 μm. When it is 10 μm or more, the film strength is sufficient, and when it is 250 μm or less, sufficient flexibility is obtained. From the above viewpoint, the thickness of the protective film is more preferably 15 to 200 μm, and particularly preferably 20 to 150 μm.

  Although it does not specifically limit about the thickness of the resin layer of the resin film for optical materials of this invention, It is preferable that it is 5-500 micrometers normally by the thickness after drying. If the thickness is 5 μm or more, the strength of the resin film or the cured product of the resin film is sufficient because the thickness is sufficient, and if it is 500 μm or less, the drying can be performed sufficiently so that the amount of residual solvent in the resin film does not increase. When the cured resin film is heated, it does not foam.

  The resin film for optical material thus obtained can be easily stored, for example, by winding it into a roll. Moreover, a roll-shaped film can be cut out into a suitable size and stored in a sheet shape.

  The resin film for optical materials of the present invention is excellent in transparency and heat resistance, and is suitable as a resin film for forming an optical waveguide.

Hereinafter, application examples when the resin film for optical material of the present invention is used as a resin film for forming an optical waveguide, which is the most suitable application, will be described.
The resin film for forming an optical waveguide can also be produced by the same method as the resin film for optical material.
The support film used in the production process of the core portion forming resin film is not particularly limited as long as it can transmit the actinic ray for exposure used for core pattern formation. For example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate. Polyester such as phthalate; Polyolefin such as polyethylene and polypropylene; Polycarbonate, Polyamide, Polyimide, Polyamideimide, Polyetherimide, Polyethersulfide, Polyethersulfone, Polyetherketone, Polyphenylenesulfide, Polyarylate, Polysulfone, Liquid crystal polymer Etc.
Among these, the polyester and the polyolefin are preferable from the viewpoints of the transmittance of exposure actinic rays, flexibility, and toughness. Furthermore, it is more preferable to use a highly transparent support film from the viewpoint of improving the transmittance of exposure actinic rays and reducing the side wall roughness of the core pattern. Examples of such highly transparent support films include Cosmo Shine A1517 and Cosmo Shine A4100 manufactured by Toyobo Co., Ltd.
In addition, from the viewpoint of improving releasability from the resin layer, a film that has been subjected to release treatment with a silicone compound, a fluorine-containing compound, or the like may be used as necessary.

  The thickness of the support film of the core portion forming resin film is preferably 5 to 50 μm. If it is 5 μm or more, the strength as a support is sufficient, and if it is 50 μm or less, the gap between the photomask and the core portion forming resin layer is not increased during the formation of the core pattern, and the pattern resolution is good. From the above viewpoint, the thickness of the support film is more preferably 10 to 40 μm, and particularly preferably 15 to 30 μm.

  The resin film for forming an optical waveguide produced by applying the resin composition for forming an optical waveguide on the support film, the protective film is attached on the resin layer as necessary, the support film, the resin layer, and the protective film It is good also as a 3 layer structure which consists of.

  The resin film for forming an optical waveguide thus obtained can be easily stored, for example, by winding it into a roll. Moreover, a roll-shaped film can be cut out into a suitable size and stored in a sheet shape.

Hereinafter, the optical waveguide of the present invention will be described.
A sectional view of the optical waveguide is shown in FIG. The optical waveguide 1 is formed on a substrate 5 and has a core part 2 made of a core part-forming resin composition having a high refractive index, a lower clad layer 4 made of a resin composition for forming a clad layer having a low refractive index, and An upper cladding layer 3 is used.
The resin composition for forming an optical waveguide and the resin film for forming an optical waveguide of the present invention are preferably used for at least one of the lower cladding layer 4, the core portion 2, and the upper cladding layer 3 of the optical waveguide 1.

  By using the optical waveguide forming resin film, the flatness of each layer, the interlayer adhesion between the clad and the core, and the resolution (correspondence between thin lines or narrow lines) at the time of forming the optical waveguide core pattern can be further improved. It is excellent in flatness, and it is possible to form a fine pattern with a small line width and line spacing.

  In the optical waveguide 1, the material of the base material 5 is not particularly limited. For example, a glass epoxy resin substrate, a ceramic substrate, a glass substrate, a silicon substrate, a plastic substrate, a metal substrate, a substrate with a resin layer, a substrate with a metal layer, Examples thereof include a plastic film, a plastic film with a resin layer, and a plastic film with a metal layer.

The optical waveguide 1 may be a flexible optical waveguide by using a flexible and tough substrate as the substrate 5, for example, a support film of the resin film for forming an optical waveguide as a substrate. Moreover, you may make the base material 5 function as a protective film of the optical waveguide 1 at this time. By using a support film substrate as the substrate 5, flexibility and toughness can be imparted to the optical waveguide 1. Furthermore, by making the base material 5 function as a protective film, the optical waveguide 1 is not subjected to dirt or scratches, so that the ease of handling is improved.
From the above viewpoint, the base material 5 having a function as a protective film is disposed outside the upper cladding layer 3 as shown in FIG. 1B, or the lower cladding layer 4 as shown in FIG. And the base material 5 which has a function as a protective film may be arrange | positioned on the outer side of both of the upper clad layers 3.
If the optical waveguide 1 has sufficient flexibility and toughness, the substrate 5 having a function as a protective film may not be disposed as shown in FIG.

The thickness of the lower clad layer 4 is not particularly limited, but is preferably 2 to 200 μm. If it is 2 μm or more, it becomes easy to confine the propagating light inside the core, and if it is 200 μm or less, the entire thickness of the optical waveguide 1 is not too large. The thickness of the lower cladding layer 4 is a value from the boundary between the core portion 2 and the lower cladding layer 4 to the lower surface of the lower cladding layer 4.
Although there is no restriction | limiting in particular about the thickness of the resin film for lower clad layer formation, Thickness is adjusted so that the thickness of the lower clad layer 4 after hardening may become said range.

  Although there is no restriction | limiting in particular about the height of the core part 2, It is preferable that it is 10-150 micrometers. When the height of the core is 10 μm or more, the alignment tolerance is not reduced in coupling with the light emitting / receiving element or the optical fiber after the optical waveguide is formed, and when the core portion is 150 μm or less, the light is received and emitted after the optical waveguide is formed. In coupling with an element or an optical fiber, coupling efficiency is not reduced. From the above viewpoint, the height of the core part is more preferably 15 to 130 μm, and particularly preferably 20 to 120 μm. In addition, there is no restriction | limiting in particular about the thickness of the resin film for core part formation, but thickness is adjusted so that the height of the core part after hardening may become said range.

  The thickness of the upper clad layer 3 is not particularly limited as long as the core portion 2 can be embedded, but the thickness after drying is preferably 12 to 500 μm. The thickness of the upper clad layer 3 may be the same as or different from the thickness of the lower clad layer 4 that is formed first, but is thicker than the thickness of the lower clad layer 4 from the viewpoint of embedding the core portion 2. It is preferable. The thickness of the upper cladding layer 3 is a value from the boundary between the core portion 2 and the lower cladding layer 4 to the upper surface of the upper cladding layer 3.

  In the optical waveguide of the present invention, the light propagation loss is preferably 0.3 dB / cm or less. If it is 0.3 dB / cm or less, the loss of light becomes small and the intensity of the transmission signal is sufficient. From the above viewpoint, it is more preferably 0.2 dB / cm or less.

In the optical waveguide of the present invention, it is preferable that the light propagation loss after conducting a high-temperature and high-humidity test at a temperature of 85 ° C. and a humidity of 85% for 1000 hours is 0.3 dB / cm or less. If it is 0.3 dB / cm or less, the loss of light becomes small and the intensity of the transmission signal is sufficient. From the above viewpoint, it is more preferably 0.2 dB / cm or less. Since the optical waveguide of the present invention that provides such a high heat-and-moisture resistance is used for the connection between electronic devices and between wiring boards, the optical loss does not increase in the usage environment, so the reliability point Is advantageous.
The high-temperature and high-humidity storage test at a temperature of 85 ° C. and a humidity of 85% means a high-temperature and high-humidity storage test performed under conditions in accordance with the JPCA standard (JPCA-PE02-05-01S).

In the optical waveguide of the present invention, the light propagation loss after 1000 cycles of the temperature cycle test between −55 ° C. and 125 ° C. is preferably 0.3 dB / cm or less. If it is 0.3 dB / cm or less, the loss of light becomes small and the intensity of the transmission signal is sufficient. From the above viewpoint, it is more preferably 0.2 dB / cm or less. Since the optical waveguide of the present invention, which is highly resistant to heat shock, is used for connection between electronic elements and between wiring boards, optical loss does not increase in the usage environment. This is advantageous in terms of reliability.
In addition, the temperature cycle test between temperature -55 degreeC and 125 degreeC means the temperature cycle test implemented on the conditions according to a JPCA standard (JPCA-PE02-05-01S).

In the optical waveguide of the present invention, it is preferable that the light propagation loss after performing the reflow test at the maximum temperature of 265 ° C. three times is 0.3 dB / cm or less. If it is 0.3 dB / cm or less, the loss of light becomes small, and if the intensity of the transmission signal is sufficient, component mounting by the reflow process can be performed at the same time, so the applicable range is widened. From the above viewpoint, it is more preferably 0.2 dB / cm or less.
The reflow test at the maximum temperature of 265 ° C. means a lead-free solder reflow test that is performed under conditions in accordance with the JEDEC standard (JEDEC JESD22A113E).

The optical waveguide of the present invention is excellent in transparency, reliability, and heat resistance, and can also be used as an optical transmission path of an optical module. As the form of the optical module, for example, an optical waveguide with an optical fiber in which optical fibers are connected to both ends of the optical waveguide, an optical waveguide with a connector in which connectors are connected to both ends of the optical waveguide, and an optical waveguide and a printed wiring board are combined. Examples include an opto-electric composite substrate, an opto-electric conversion module that combines an optical waveguide, an optical / electric conversion element that converts an optical signal and an electrical signal, and a wavelength multiplexer / demultiplexer that combines an optical waveguide and a wavelength division filter.
In the photoelectric composite substrate, the printed wiring board to be combined is not particularly limited, and examples thereof include a rigid substrate such as a glass epoxy substrate and a ceramic substrate, a flexible substrate such as a polyimide substrate and a polyethylene terephthalate substrate.

Hereinafter, the manufacturing method for forming the optical waveguide 1 using the resin composition for forming an optical waveguide and / or the resin composition for forming an optical waveguide of the present invention will be described.
There is no restriction | limiting in particular as a method of manufacturing the optical waveguide 1 of this invention, For example, the resin layer for optical waveguide formation is formed on a base material using the resin composition for optical waveguide formation, or the resin film for optical waveguide formation. For example.

  The substrate used in the present invention is not particularly limited, but is a glass epoxy resin substrate, ceramic substrate, glass substrate, silicon substrate, plastic substrate, metal substrate, substrate with resin layer, substrate with metal layer, plastic film, resin Examples thereof include a plastic film with a layer and a plastic film with a metal layer.

The method for forming the optical waveguide forming resin layer is not particularly limited. For example, using the optical waveguide forming resin composition, spin coating, dip coating, spraying, bar coating, roll coating, Examples of the coating method include a curtain coating method, a gravure coating method, a screen coating method, and an inkjet coating method.
When the resin composition for forming an optical waveguide is diluted with a suitable organic solvent, a step of drying may be added after forming the resin layer as necessary. Examples of the drying method include heat drying and reduced pressure drying. Moreover, you may use these together as needed.

As another method of forming the optical waveguide forming resin layer, there is a method of forming by an lamination method using an optical waveguide forming resin film using the optical waveguide forming resin composition.
Among these, from the viewpoint of excellent ability to form an optical waveguide having excellent flatness and a line width and a small fine pattern between the lines, a method of manufacturing by an optical waveguide forming resin film is preferable.

Hereinafter, although the manufacturing method for forming the optical waveguide 1 using the resin film for optical waveguide formation for a lower clad layer, a core part, and an upper clad layer is demonstrated, this invention is not restrict | limited to this.
First, as a first step, a resin film for forming a lower cladding layer is laminated on the substrate 5. There is no restriction | limiting in particular as a lamination | stacking method in a 1st process, For example, the method of laminating | stacking by crimping, heating using a roll laminator or a flat plate laminator etc. is mentioned. The flat plate laminator in the present invention refers to a laminator in which a laminated material is sandwiched between a pair of flat plates and pressed by pressing the flat plate. For example, a vacuum pressurizing laminator can be suitably used. The heating temperature here is preferably 20 to 130 ° C., and the pressure bonding pressure is preferably 0.1 to 1.0 MPa, but these conditions are not particularly limited. When a protective film exists in the resin film for lower clad layer formation, it laminates | stacks, after removing a protective film.

  When laminating using a vacuum pressurizing laminator, a lower clad layer forming resin film may be temporarily pasted onto the substrate 5 in advance using a roll laminator. Here, from the viewpoint of improving adhesion and followability, it is preferable to perform temporary bonding while pressing, and when pressing, a laminator having a heat roll may be used while heating. The laminating temperature is preferably 20 to 130 ° C. When it is 20 ° C. or higher, the adhesion between the resin film for forming the lower clad layer and the substrate 5 is improved, and when it is 130 ° C. or lower, the resin layer does not flow too much at the time of roll lamination, and the required film Thickness is obtained. From the above viewpoint, the laminating temperature is more preferably 40 to 100 ° C. The pressure during lamination is preferably 0.2 to 0.9 MPa, and the lamination speed is preferably 0.1 to 3 m / min, but these conditions are not particularly limited.

The lower clad layer forming resin layer laminated on the substrate 5 is cured by light and / or heat to form the lower clad layer 4. The removal of the support film of the lower clad layer forming resin film may be performed either before or after curing.
The irradiation amount of actinic rays when the lower clad layer-forming resin layer is cured with light is preferably 0.1 to 5 J / cm ² , but there is no particular limitation on this condition. Moreover, when actinic rays permeate | transmit a base material, in order to make it harden | cure efficiently, the double-sided exposure machine which can irradiate actinic rays simultaneously from both surfaces can be used. Moreover, you may irradiate actinic light, heating. In addition, as a process after photocuring, you may perform a 50-200 degreeC heat processing as needed.
The heating temperature when the lower clad layer forming resin layer is cured by heat is preferably 50 to 200 ° C., but this condition is not particularly limited.

When the support film for the resin film for forming the lower clad layer functions as the protective film 5 for the optical waveguide 1, it is cured under the same conditions as described above by light and / or heat without laminating the resin film for forming the lower clad layer. Then, the lower cladding layer 4 may be formed.
The protective film for the resin film for forming the lower cladding layer may be removed before curing or after curing.

  As the second step, a core part-forming resin film is laminated on the lower cladding layer 4 by the same method as in the first step. Here, the core part forming resin layer is preferably made of a photosensitive resin composition that is designed to have a higher refractive index than the lower clad layer forming resin layer and can form a core pattern with actinic rays.

As a third step, the core portion 2 (core pattern) is exposed. The method for exposing the core 2 is not particularly limited. For example, a method of irradiating actinic rays in an image form through a negative mask pattern called artwork, a direct actinic ray without passing through a photomask using laser direct drawing And the like.
Examples of the active light source include a light source that effectively emits ultraviolet light, such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a mercury vapor arc lamp, a metal halide lamp, a xenon lamp, and a carbon arc lamp. Other examples include light sources that effectively emit visible light, such as photographic flood bulbs and solar lamps.

It is preferable that the irradiation amount of the actinic ray at the time of exposing the core part 2 is 0.01-10 J / cm < ² >. When it is 0.01 J / cm ² or more, the curing reaction proceeds sufficiently, the core portion 2 is not washed away by development, and when it is 10 J / cm ² or less, the core portion 2 becomes thick due to excessive exposure. This is preferable because a fine pattern can be formed. From these viewpoints, the dose of active ray is more preferably from 0.03~5J / cm ^2, and particularly preferably 0.05~3J / cm ^2.
The exposure of the core part 2 may be performed through the support film of the core part forming resin film, or may be performed after removing the support film.

  Moreover, you may perform post-exposure heating as needed from a viewpoint of the resolution of the core part 2 and adhesive improvement after exposure. The time from ultraviolet irradiation to post-exposure heating is preferably within 10 minutes, but this condition is not particularly limited. The post-exposure heating temperature is preferably 40 to 160 ° C., and the time is preferably 30 seconds to 10 minutes, but these conditions are not particularly limited.

As a 4th process, when exposed through the support film of the resin film for core part formation, this is removed and it develops using the developing solution suitable for the composition of the resin layer for core part formation.
The development method is not particularly limited, and examples thereof include a spray method, a dip method, a paddle method, a spin method, a brushing method, and a scraping method. Moreover, you may use these image development methods together as needed.
There is no restriction | limiting in particular as a developing solution, Organic solvent type developers, such as a semi-aqueous type developer which consists of an organic solvent or an organic solvent, and water, etc. can be used. The development temperature is adjusted according to the developability of the core layer forming resin layer.

The organic solvent is not particularly limited, and examples thereof include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene, and p-cymene; chain ethers such as diethyl ether, tert-butyl methyl ether, cyclopentyl methyl ether, and dibutyl ether. Cyclic ethers such as tetrahydrofuran and 1,4-dioxane; alcohols such as methanol, ethanol, isopropanol, butanol, ethylene glycol, and propylene glycol; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2- Ketones such as pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, and γ-butyrolactone; ethylene carbonate, propylene carbonate Which carbonic acid ester; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol Polyhydric alcohol alkyl ethers such as monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl Polyether alcohol acetate such as ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate; N, N-dimethylformamide, N, Examples include amides such as N-dimethylacetamide and N-methylpyrrolidone.
These organic solvents can be used alone or in combination of two or more. Further, a surface active agent, an antifoaming agent or the like may be mixed in the organic solvent.

The semi-aqueous developer is not particularly limited as long as it is composed of one or more organic solvents and water.
The concentration of the organic solvent is usually preferably 2 to 90% by mass. Further, a small amount of a surfactant, an antifoaming agent or the like may be mixed in the semi-aqueous developer.

As a treatment after development, the organic solvent, a semi-aqueous cleaning solution composed of the organic solvent and water, or water may be used as necessary.
The cleaning method is not particularly limited, and examples thereof include a spray method, a dip method, a paddle method, a spin method, a brushing method, and a scraping method. Moreover, you may use these washing | cleaning methods together as needed.
The said organic solvent can be used individually or in combination of 2 or more types. In the semi-aqueous cleaning liquid, the concentration of the organic solvent is usually preferably 2 to 90% by mass. The washing temperature is adjusted in accordance with the developability of the core portion forming resin layer.

As processing after development or washing, exposure and / or heating may be performed as necessary from the viewpoint of improving curability and adhesion of the core portion 2. The heating temperature is preferably 40 to 200 ° C., and the irradiation amount of active light is preferably 0.01 to 10 J / cm ² , but these conditions are not particularly limited.

  As a fifth step, an upper clad layer forming resin film is laminated on the lower clad layer 4 and the core portion 2 by the same method as the first and second steps. Here, the upper clad layer forming resin layer is designed to have a lower refractive index than the core portion forming resin layer. The thickness of the upper clad forming resin layer is preferably larger than the height of the core portion 2.

Next, the upper clad layer forming resin layer is cured by light and / or heat to form the upper clad layer 3 in the same manner as in the first step.
The irradiation amount of actinic rays when the upper clad layer-forming resin layer is cured by light is preferably 0.1 to 30 J / cm ² , but this condition is not particularly limited. Moreover, when actinic rays permeate | transmit a base material, in order to make it harden | cure efficiently, the double-sided exposure machine which can irradiate actinic rays simultaneously from both surfaces can be used. Moreover, you may irradiate actinic light, heating as needed, and you may heat-process as a process after photocuring. The heating temperature during and / or after irradiation with actinic rays is preferably 50 to 200 ° C., but these conditions are not particularly limited.
The heating temperature when the upper clad layer forming resin layer is cured by heat is preferably 50 to 200 ° C., but this condition is not particularly limited.
In addition, when the removal of the support film of the resin film for upper clad layer formation is required, you may remove before hardening or after hardening.
The optical waveguide 1 can be manufactured through the above steps.

Examples of the present invention will be described more specifically below, but the present invention is not limited to these examples.
Production Example 1
[Preparation of (meth) acrylic polymer A-1 having maleimide skeleton in main chain]
In a flask equipped with a stirrer, a cooling pipe, a gas introduction pipe, a dropping funnel and a thermometer, 94 parts by mass of methyl ethyl ketone was weighed and stirred while introducing nitrogen gas. The liquid temperature was raised to 55 ° C., 15 parts by mass of N-cyclohexylmaleimide, 62 parts by mass of benzyl methacrylate, 17 parts by mass of methyl methacrylate, 10 parts by mass of methacrylic acid, 2,2′-azobis (2,4-dimethylvaleronitrile) A mixture of 0.9 part by mass and 63 parts by mass of methyl ethyl ketone was added dropwise over 3 hours, followed by stirring at 55 ° C. for 5 hours and further stirring at 80 ° C. for 2 hours to cool to room temperature.
Subsequently, 0.06 parts by mass of dibutyltin dilaurate was added and stirred. The liquid temperature was raised to 50 ° C., a mixture of 16 parts by mass of 2-methacryloyloxyethyl isocyanate and 10 parts by mass of methyl ethyl ketone was added dropwise over 30 minutes, and then stirring was continued at 50 ° C. for 3 hours to obtain (meth) acrylic polymer A- 1 solution (solid content 42 mass%) was obtained.

[Measurement of weight average molecular weight]
It was 46,000 as a result of measuring the weight average molecular weight (standard polystyrene conversion) of A-1 using GPC (Tosoh Corporation SD-8022 / DP-8020 / RI-8020). In addition, Hitachi Chemical Co., Ltd. Gelpack GL-A150-S / GL-A160-S was used for the column.

Production Example 2
[Preparation of (meth) acrylic polymer A-2 having maleimide skeleton in main chain]
In a flask equipped with a stirrer, a cooling pipe, a gas introduction pipe, a dropping funnel and a thermometer, 94 parts by mass of methyl ethyl ketone was weighed and stirred while introducing nitrogen gas. The liquid temperature was raised to 55 ° C., 15 parts by mass of N-cyclohexylmaleimide, 30 parts by mass of dicyclopentanyl acrylate, 47 parts by mass of butyl acrylate, 12 parts by mass of acrylic acid, 2,2′-azobis (2,4-dimethyl A mixture of 0.9 parts by weight of valeronitrile) and 63 parts by weight of methyl ethyl ketone was added dropwise over 3 hours, followed by stirring at 55 ° C. for 5 hours and further stirring at 80 ° C. for 2 hours to cool to room temperature.
Subsequently, 0.06 parts by mass of dibutyltin dilaurate was added and stirred. The liquid temperature was raised to 50 ° C., a mixture of 24 parts by weight of 2-methacryloyloxyethyl isocyanate and 14 parts by weight of methyl ethyl ketone was added dropwise over 30 minutes, and then stirring was continued at 50 ° C. for 3 hours to obtain (meth) acrylic polymer A- Two solutions (43 mass% solid content) were obtained.
It was 76,000 as a result of measuring a weight average molecular weight by the method similar to manufacture example 1.

Production Example 3
[Production of (Meth) acrylic polymer A-3]
In a flask equipped with a stirrer, a cooling pipe, a gas introduction pipe, a dropping funnel and a thermometer, 94 parts by mass of methyl ethyl ketone was weighed and stirred while introducing nitrogen gas. The liquid temperature was raised to 55 ° C., 15 parts by weight of dicyclopentanyl methacrylate, 62 parts by weight of benzyl methacrylate, 12 parts by weight of methyl methacrylate, 14 parts by weight of 2-hydroxyethyl methacrylate, 2,2′-azobis (2,4- A mixture of 0.8 part by mass of dimethylvaleronitrile) and 63 parts by mass of methyl ethyl ketone was added dropwise over 3 hours, followed by stirring at 55 ° C. for 5 hours, further stirring at 80 ° C. for 2 hours, and cooling to room temperature.
Subsequently, 0.06 parts by mass of dibutyltin dilaurate was added and stirred. The liquid temperature was raised to 50 ° C., a mixture of 16 parts by mass of 2-methacryloyloxyethyl isocyanate and 10 parts by mass of methyl ethyl ketone was added dropwise over 30 minutes, and then stirring was continued at 50 ° C. for 3 hours to obtain (meth) acrylic polymer A- Three solutions (solid content 42 mass%) were obtained.
As a result of measuring the weight average molecular weight by the same method as in Production Example 1, it was 54,000.

Production Example 4
[Production of (Meth) acrylic polymer A-4]
In a flask equipped with a stirrer, a cooling pipe, a gas introduction pipe, a dropping funnel and a thermometer, 94 parts by mass of methyl ethyl ketone was weighed and stirred while introducing nitrogen gas. The liquid temperature was raised to 55 ° C., 10 parts by mass of cyclohexyl methacrylate, 28 parts by mass of dicyclopentanyl acrylate, 43 parts by mass of butyl acrylate, 22 parts by mass of 2-hydroxyethyl acrylate, 2,2′-azobis (2,4- A mixture of 0.9 part by weight of dimethylvaleronitrile) and 62 parts by weight of methyl ethyl ketone was added dropwise over 3 hours, followed by stirring at 55 ° C. for 5 hours and further stirring at 80 ° C. for 2 hours to cool to room temperature.
Subsequently, 0.06 parts by mass of dibutyltin dilaurate was added and stirred. The liquid temperature was raised to 50 ° C., a mixture of 24 parts by weight of 2-methacryloyloxyethyl isocyanate and 14 parts by weight of methyl ethyl ketone was added dropwise over 30 minutes, and then stirring was continued at 50 ° C. for 3 hours to obtain (meth) acrylic polymer A- Four solutions (solid content 43 mass%) were obtained.
As a result of measuring the weight average molecular weight by the same method as in Production Example 1, it was 85,000.

Example 1
[Preparation of resin varnish COV-1 for core formation]
(A) As a (meth) acrylic polymer containing a maleimide skeleton in the main chain, 143 parts by mass (solid content: 60% by mass) of the A-1 solution (solid content: 42% by mass), (B) ethoxylation as a polymerizable compound 20 parts by mass of bisphenol A diacrylate (A-BPE-6, Shin-Nakamura Chemical Co., Ltd.), 20 parts by mass of p-cumylphenoxyethyl acrylate (A-CMP-1E, Shin-Nakamura Chemical Co., Ltd.) and (C) As a polymerization initiator, 1 part by mass of 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one (Irgacure 2959 manufactured by Ciba Specialty Chemicals Co., Ltd.), Bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (Irgakyu manufactured by Ciba Specialty Chemicals Co., Ltd.) 819) was weighed and 1 part by mass to wide mouth plastic bottle, using a stirrer, temperature 25 ° C., at a rotation speed 400rpm conditions, and stirred for 6 hours to prepare a resin varnish for forming a core part. Then, pressure filtration was performed using a polyfluorone filter with a pore size of 2 μm (PF020 manufactured by Advantech Toyo Co., Ltd.) and a membrane filter with a pore size of 0.5 μm (J050A manufactured by Advantech Toyo Co., Ltd.) at a temperature of 25 ° C. and a pressure of 0.4 MPa. did. Subsequently, using a vacuum pump and a bell jar, vacuum degassing was performed for 15 minutes under the condition of a degree of vacuum of 200 mmHg to obtain a resin varnish COV-1 for forming a core part.

[Preparation of Core Part Forming Resin Film COF-1]
The core part-forming resin varnish COV-1 is applied on a non-treated surface of a PET film (A1517 manufactured by Toyobo Co., Ltd., thickness 16 μm) using a coating machine (Multicoater TM-MC manufactured by Hirano Techseed Co., Ltd.). , Dried at 80 ° C. for 10 minutes and 100 ° C. for 10 minutes, and then a release PET film (A31 manufactured by Teijin DuPont Films Co., Ltd., thickness 25 μm) was pasted as a protective film to obtain a core part-forming resin film COF-1. . At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coating machine, but in this example, the thickness after curing was adjusted to 50 μm.

[Preparation of Clad Layer Forming Resin Varnish CLV-1]
(A) As a (meth) acrylic polymer containing a maleimide skeleton in the main chain, 140 parts by mass (solid content: 60% by mass) of the A-2 solution (solid content: 43% by mass), and (B) ethoxylation as a polymerizable compound. 20 parts by mass of isocyanuric acid triacrylate (A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd.), 20 parts by mass of ethoxylated cyclohexanedimethanol diacrylate (A-CHD-4E manufactured by Shin-Nakamura Chemical Co., Ltd.) and (C) polymerization initiation As an agent, 1 part by weight of 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one (Irgacure 2959 manufactured by Ciba Specialty Chemicals Co., Ltd.), 2,4,6-Trimethylbenzoyl) phenylphosphine oxide (Ciba Specialty Chemicals) Rugakyua 819) was weighed and 1 part by mass to wide mouth plastic bottle, using a stirrer, temperature 25 ° C., at a rotation speed 400rpm conditions, and stirred for 6 hours to prepare a resin varnish for forming a core part. Then, pressure filtration was performed using a polyfluorone filter with a pore size of 2 μm (PF020 manufactured by Advantech Toyo Co., Ltd.) and a membrane filter with a pore size of 0.5 μm (J050A manufactured by Advantech Toyo Co., Ltd.) at a temperature of 25 ° C. and a pressure of 0.4 MPa. did. Subsequently, vacuum degassing was performed for 15 minutes using a vacuum pump and a bell jar under a reduced pressure of 200 mmHg to obtain a clad layer forming resin varnish CLV-1.

[Preparation of Clad Layer Forming Resin Film CLF-1]
The clad layer forming resin varnish CLV-1 is coated and dried on the non-treated surface of a PET film (A4100 manufactured by Toyobo Co., Ltd., thickness 50 μm) in the same manner as the core layer forming resin film. Resin film CLF-1 was obtained. At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coating machine. In this example, the thickness after curing is 25 μm for the resin film for forming the lower cladding layer, and the upper cladding is formed. The resin film was adjusted to 75 μm, and the cured film for refractive index and transmittance measurement was adjusted to 50 μm.

[Preparation of cured film for measuring refractive index and transmittance]
An ultraviolet exposure machine (MAP-1200-L manufactured by Dainippon Screen Co., Ltd.) is used for the core portion forming resin film COF-1 and the cladding layer forming resin film CLF-1, and ultraviolet rays (wavelength 365 nm) are 2000 mJ / cm. ² irradiated. Subsequently, after removing the protective film (A31) and drying at 130 ° C. for 1 hour, the support film (A1517 or A4100) was removed to obtain a cured film having a thickness of 50 μm.

[Measurement of refractive index]
The refractive index at a wavelength of 830 nm at a temperature of 25 ° C. of the obtained cured film was measured using a prism coupler (manufactured by SAIRON TECHNOLOGY, SPA-4000).

[Measurement of transmittance]
The transmittance of the obtained cured film at a wavelength of 400 nm at a temperature of 25 ° C. was measured using a spectrophotometer (U-3410 Spectrophotometer manufactured by Hitachi, Ltd.). Evaluation was made according to the following criteria.
○: 80% or more ×: less than 80%

[Fabrication of optical waveguide]
Using a roll laminator (HLM-1500, manufactured by Hitachi Chemical Technoplant Co., Ltd.), the lower clad layer forming resin film CLF-1 from which the protective film (A31) has been removed is used as a glass epoxy resin substrate (E-, manufactured by Hitachi Chemical Co., Ltd.). 679FB) was laminated under conditions of a pressure of 0.4 MPa, a temperature of 80 ° C., and a speed of 0.4 m / min. Furthermore, using a vacuum pressurization type laminator (MVLP-500 / 600 manufactured by Meiki Seisakusho Co., Ltd.), pressure bonding was performed under the conditions of a pressure of 0.4 MPa, a temperature of 80 ° C., and a pressurization time of 30 seconds.
Next, the lower cladding layer 4 is removed by removing the support film (A4100) after irradiating the ultraviolet ray (wavelength 365 nm) with 2000 mJ / cm ² using an ultraviolet exposure machine (Dai Nippon Screen Co., Ltd. MAP-1200-L). Formed.

Subsequently, using the roll laminator, the core portion-forming resin film COF-1 from which the protective film (A31) has been removed is placed on the lower cladding layer 4 at a pressure of 0.4 MPa, a temperature of 80 ° C., and a speed of 0.4 m / min. It laminated | stacked on the conditions of. Further, the above-described vacuum pressure laminator was used for pressure bonding under conditions of a pressure of 0.4 MPa, a temperature of 80 ° C., and a pressurization time of 30 seconds.
Next, the film was irradiated with ultraviolet rays (wavelength 365 nm) of 500 mJ / cm ² through the negative photomask having a width of 50 μm with the above-described ultraviolet exposure machine, and then heated after exposure at 80 ° C. for 5 minutes. After removing the supporting film (A1517) and developing the core part 2 using a developer (propylene glycol monomethyl ether acetate / N, N-dimethylacetamide = 80/20 mass ratio), propylene glycol monomethyl ether and then isopropanol were added. And then dried by heating at 100 ° C. for 1 hour.

Next, the upper clad layer-forming resin film CLF-1 from which the protective film (A31) has been removed using the vacuum pressure laminator is applied to the core 2 and the lower clad layer 4 at a pressure of 0.4 MPa and a temperature of 80 ° C. And it laminated | stacked on the conditions of pressurization time 30 second. After irradiating ultraviolet rays (wavelength 365 nm) at 2000 mJ / cm ² and removing the support film (A4100), the upper cladding layer 3 is formed by heat treatment at 130 ° C. for 1 hour, and the light shown in FIG. A waveguide 1 was obtained. Thereafter, an optical waveguide having a waveguide length of 10 cm was cut out using a dicing saw (DAD-341 manufactured by DISCO Corporation).

Examples 2 to 5 and Comparative Example 1
According to the blending ratio shown in Table 1, core-forming photosensitive resin varnish COV-2 to 4 were prepared. Similarly, the photosensitive resin varnish CLV-2-4 for clad layer formation were prepared according to the compounding ratio shown in Table 2. In the same manner as in Example 1, core-forming photosensitive resin films COF-2 to 4 and clad layer-forming photosensitive resin films CLF-2 to 4 were produced. The results of measuring the refractive index and transmittance of these cured films are shown in Tables 1 and 2.
Then, the optical waveguide was produced by the method similar to Example 1 using these resin films for optical waveguide formation. Table 3 shows combinations of the resin film for forming the core part and the resin film for forming the cladding layer used for the production of the optical waveguide.

* 1: (Meth) acrylic polymer solution produced in Production Example 1 * 2: (Meth) acrylic polymer solution produced in Production Example 3 * 3: Ethoxylated bisphenol A diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)
* 4: Ethoxylated fluorene diacrylate (Osaka Gas Chemical Co., Ltd.)
* 5: p-cumylphenoxyethyl acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)
* 6: 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one (manufactured by Ciba Specialty Chemicals)
* 7: Bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (manufactured by Ciba Specialty Chemicals)
* 8: Measured under the conditions of a wavelength of 830 nm, 25 ° C., and a film thickness of 50 μm. * 9: Measured under conditions of ○ ... 80% or more, x ... less than 80%, wavelength of 400 nm, 25 ° C., film thickness of 50 μm.

* 10: (Meth) acrylic polymer solution prepared in Production Example 2 * 11: (Meth) acrylic polymer solution prepared in Production Example 4 * 12: Ethoxylated isocyanuric acid triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)
* 13: Hydrogenated bisphenol A type epoxy acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)
* 14: Ethoxylated cyclohexanedimethanol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.)
* 15: Ethoxylated isocyanuric acid diacrylate (Toagosei Co., Ltd.)
* 6: 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one (manufactured by Ciba Specialty Chemicals)
* 7: Bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (manufactured by Ciba Specialty Chemicals)
* 8: Measured under the conditions of a wavelength of 830 nm, 25 ° C., and a film thickness of 50 μm. * 9: Measured under conditions of ○ ... 80% or more, x ... less than 80%, wavelength of 400 nm, 25 ° C., film thickness of 50 μm.

[Measurement of optical propagation loss]
The optical propagation loss of the optical waveguide (waveguide length 10 cm) obtained in Examples 1 to 5 and Comparative Example 1 is a VCSEL (FLS-300-01-VCL manufactured by EXFO) having a light source having a wavelength of 850 nm as a central wavelength. ), A light receiving sensor (Q82214 manufactured by Advantest Corporation), an incident fiber (GI-50 / 125 multimode fiber, NA = 0.20) and an outgoing fiber (SI-114 / 125, NA = 0.22), Measurements were made by the cutback method (measurement waveguide lengths 10, 5, 3, 2 cm) and evaluated according to the following criteria.
○: 0.3 dB / cm or less ×: larger than 0.3 dB / cm

[High temperature and high humidity test]
The optical waveguides (waveguide length 10 cm) obtained in Examples 1 to 5 and Comparative Example 1 were subjected to the JPCA standard (JPCA-PE02-05-) using a high-temperature and high-humidity tester (PL-2KT manufactured by ESPEC Corporation). 01S), a high-temperature and high-humidity test at a temperature of 85 ° C. and a humidity of 85% was conducted for 1000 hours.
The light propagation loss of the optical waveguide after the high-temperature and high-humidity leaving test was measured using the same light source, light receiving element, incident fiber and outgoing fiber as described above, and evaluated according to the following criteria.
○: 0.3 dB / cm or less ×: larger than 0.3 dB / cm

[Temperature cycle test]
The optical waveguides (waveguide length 10 cm) obtained in Examples 1 to 5 and Comparative Example 1 were subjected to the JPCA standard (JPCA-PE02-05-) using a temperature cycle tester (ETAC WINTECH NT1010 manufactured by Enomoto Kasei Co., Ltd.). The temperature cycle test between −55 ° C. and 125 ° C. was performed 1000 cycles under the conditions in accordance with 01S). Detailed temperature cycle test conditions are shown in Table 4.

The light propagation loss of the optical waveguide after the temperature cycle test was measured using the same light source, light receiving element, incident fiber and output fiber as described above, and evaluated according to the following criteria.
○: 0.3 dB / cm or less ×: larger than 0.3 dB / cm

[Reflow test]
The optical waveguides (waveguide length 10 cm) obtained in Examples 1 to 5 and Comparative Example 1 were subjected to IPC / JEDEC J-STD-020B using a reflow tester (Furukawa Electric Co., Ltd. Salamanda XNA-645PC). The reflow test at the maximum temperature of 265 ° C. was performed three times under the conditions according to the above. Detailed reflow conditions are shown in Table 5, and the temperature profile in the reflow furnace is shown in FIG.

The light propagation loss of the optical waveguide after the reflow test was measured using the same light source, light receiving element, incident fiber and output fiber as described above, and evaluated according to the following criteria.
○: 0.3 dB / cm or less x: Greater than 0.3 dB / cm Table 6 shows the measurement results of the above optical propagation loss.

* 16: ○ ... 0.3 dB / cm or less, x ... greater than 0.3 dB / cm

  From Table 1, Table 2, and Table 6, the resin composition for optical materials of the present invention is excellent in transparency and heat resistance, and an optical waveguide produced using these has transparency, reliability, and heat resistance. It turns out that it is excellent. On the other hand, it turns out that the optical waveguide manufactured using the resin composition for optical materials which does not belong to this invention is inferior to reliability and heat resistance.

  The resin composition for optical materials and the resin film for optical materials using the resin composition for optical materials of the present invention are extremely excellent in transparency and heat resistance. Therefore, the optical waveguide manufactured using these optical material resin compositions or optical material resin films is excellent in transparency, reliability, and heat resistance.

It is sectional drawing explaining the form of the optical waveguide of this invention. It is a graph which shows the temperature profile in the reflow furnace in the reflow test implemented by this invention.

Explanation of symbols

1. 1. Optical waveguide 2. Core part 3. Upper clad layer 4. Lower clad layer Base material

Claims (17)

  (A) A resin composition for an optical material comprising a (meth) acrylic polymer having a maleimide skeleton in the main chain, (B) a polymerizable compound, and (C) a polymerization initiator. (A) The resin composition for optical materials according to claim 1, wherein the (meth) acrylic polymer has repeating units represented by the following general formulas (1) and (2) in the main chain.

(In the formula, R ¹ represents a hydrogen atom or an organic group having 1 to 20 carbon atoms.)

(In the formula, R ² represents a hydrogen atom or a methyl group, and R ³ represents an organic group having 1 to 20 carbon atoms.) (A) The resin composition for optical materials according to claim 2, wherein the (meth) acrylic polymer further has a repeating unit represented by the following general formula (3) in the main chain.

(In the formula, R ^{4 to} R ⁶ each independently represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, and X ¹ represents a single bond or a divalent organic group having 1 to 20 carbon atoms.) (A) The resin composition for optical materials according to claim 2 or 3, wherein the (meth) acrylic polymer further has a repeating unit represented by the following general formula (4) in the main chain.

(In the formula, R ⁷ and R ⁸ each independently represent a hydrogen atom or an organic group having 1 to 20 carbon atoms, and X ² represents a single bond or a divalent organic group having 1 to 20 carbon atoms.)   (B) The resin composition for optical materials in any one of Claims 1-4 in which a polymeric compound contains the compound which has an ethylenically unsaturated group in the molecule | numerator.   (B) The resin composition for optical materials in any one of Claims 1-5 in which a polymeric compound contains the compound which has a cyclic ether group in the molecule | numerator.   (A) The compounding quantity of (meth) acrylic polymer is 10-85 mass% with respect to the total amount of (A) component and (B) component, and the compounding quantity of (B) polymeric compound is (A) component and ( It is 15-90 mass% with respect to the total amount of B) component, and the compounding quantity of (C) polymerization initiator is 0.01-10 mass with respect to 100 mass parts of total amounts of (A) component and (B) component. The resin composition for optical materials according to any one of claims 1 to 6.   8. The refractive index at a wavelength of 830 nm at a temperature of 25 ° C. of a cured film obtained by polymerizing and curing the resin composition for an optical material is 1.400 to 1.700. A resin composition for optical materials.   The optical property according to any one of claims 1 to 8, wherein the transmittance at a wavelength of 400 nm at a temperature of 25 ° C of a cured film having a thickness of 50 µm obtained by polymerizing and curing the resin composition for an optical material is 80% or more. Resin composition for materials.   The resin composition for optical materials according to any one of claims 1 to 9, which is used for forming an optical waveguide.   The resin film for optical materials using the resin composition for optical materials in any one of Claims 1-9.   An optical waveguide in which at least one of a lower clad layer, a core portion, and an upper clad layer is formed using the resin composition for optical materials according to claim 10.   An optical waveguide in which at least one of a lower clad layer, a core portion, and an upper clad layer is formed using the resin film for optical materials according to claim 11.   The optical waveguide according to claim 12 or 13, wherein the light propagation loss is 0.3 dB / cm or less.   The optical waveguide according to any one of claims 12 to 14, wherein a light propagation loss after performing a high-temperature and high-humidity test at a temperature of 85 ° C and a humidity of 85% for 1000 hours is 0.3 dB / cm or less.   The optical waveguide according to any one of claims 12 to 15, wherein a light propagation loss after 1000 cycles of a temperature cycle test between a temperature of -55 ° C and 125 ° C is 0.3 dB / cm or less.   The optical waveguide according to any one of claims 12 to 16, wherein a light propagation loss after performing a reflow test at a maximum temperature of 265 ° C three times is 0.3 dB / cm or less.

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