TWI499876B - Method for monitoring semiconductor device - Google Patents

Description

Semiconductor component monitoring method

The present invention relates to a method of monitoring a semiconductor device, and more particularly to a method of monitoring the number of semiconductor devices using a charge coupled device (CCD).

In the manufacturing process of semiconductor devices such as integrated circuits (ICs), display elements, or photovoltaic elements, it is necessary to go through a lot of processes, such as lithography, etching, ion implantation (Ion Implantion), etc. Wait. In some process steps, such as a development process in a lithography process, a wet etching step, a photoresist stripping process, etc., a batch of components consisting of a plurality of fabricated semiconductor components are typically mounted on a carrier. In the rack, carry out these processing procedures together.

When performing the wet processing of the entire batch of semiconductor components, a batch of semiconductor components are carried by the carrier and placed in the wet processing tank for processing. After the processing procedure is completed, the semiconductor component is placed on the carrier. The loaded semiconductor component is removed from the wet processing bath. However, during these wet processing, the semiconductor component may fall out of the carrier in the wet processing tank, or may fall off due to fragmentation. In this way, when the next batch of semiconductor components are processed in the same wet processing tank, the semiconductor element that was previously dropped in the wet processing tank when the negative semiconductor component carried by the carrier enters the wet processing tank The component or the ruptured semiconductor component may cause damage to the batch of semiconductor components to be processed. Seriously, it may even cause the entire batch of semiconductor components to be processed to be destroyed, which not only greatly reduces the process yield, but also reduces the efficiency of the wet processing tank.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of monitoring a semiconductor device that monitors the number of semiconductor components carried by a carrier during the semiconductor component on the process line.

Another object of the present invention is to provide a monitoring method for a semiconductor component, which can monitor the number of semiconductor components before and after a processing procedure, and can instantly monitor the change of the number of semiconductor components before and after processing, so that the online staff can monitor As a result, the semiconductor element dropped in the reaction tank is immediately removed, and the semiconductor element which is dropped can be effectively prevented from damaging the semiconductor element which is subsequently processed in the same reaction tank, and the process yield can be greatly improved.

In accordance with the above objects of the present invention, a method of monitoring a semiconductor device is disclosed for monitoring the number of semiconductor components to be processed in a reaction chamber and carried by a carrier. The monitoring method of the semiconductor component includes at least: providing a monitoring device, wherein the monitoring device includes at least one charge coupled component electrically connected to a processor and the charge coupled component to receive the image signal emitted by the charge coupled component; Before loading the reaction chamber, the monitoring device performs a first monitoring step on the carrier to obtain a quantity of the first semiconductor component stored in the processor; after the carrier is carried out from the reaction chamber, the bearing device is used by the monitoring device The second monitoring step is performed to obtain a second number of semiconductor components stored in the processor; and an alignment step is performed to compare the number of the first semiconductor components with the number of the second semiconductor components.

According to a preferred embodiment of the present invention, the monitoring device further includes at least one alarm coupled to the processor to issue an alarm when the number of the first semiconductor components is different from the number of the second semiconductor components in the comparing step.

The invention discloses a method for monitoring a semiconductor component, which can instantly monitor the number of semiconductor components on a carrier. In order to make the description of the present invention more detailed and complete, reference is made to the following description in conjunction with the drawings of Figures 1 through 3.

The monitoring method of the semiconductor component disclosed by the present invention is mainly for monitoring the change in the number of semiconductor components mounted on a carrier. Please refer to FIG. 1 and FIG. 2 simultaneously. FIG. 1 is a schematic diagram showing a monitoring device for a semiconductor device according to a preferred embodiment of the present invention, and FIG. 2 is a schematic view of a preferred embodiment of the present invention. A flow chart of a method of monitoring a semiconductor component. In an exemplary embodiment, the monitoring of the semiconductor component 106 is performed by monitoring a plurality of semiconductor components 106 carried by a carrier 104, and performing a change in the number of pre-reaction and post-reaction reactions in a process chamber to monitor the load immediately. The number of semiconductor components 106 on the shelf 104, and the status of the process chamber is immediately removed based on the monitoring data. In an embodiment, the semiconductor component 106 can be a generally common wafer or display glass substrate or the like.

When monitoring the number of semiconductor components 106 on the carrier 104, first, as shown in step 200 of FIG. 2, the monitoring device 100 is provided and the monitoring device 100 is disposed adjacent to the reaction chamber 108 of the processing machine 102. The reaction chamber 108 can be, for example, a wet etching bath for wet etching, a photoresist stripping chamber for photoresist removal, a developing tank for developing, or a wet cleaning tank, and thus stored in the reaction chamber 108. The treatment liquid 110 may correspond to an etching solution, a photoresist removal solution, a developing solution, and a cleaning liquid such as deionized water and diluted hydrofluoric acid. In an exemplary embodiment, monitoring device 100 includes at least charge coupled component 112 and processor 114. The charge-coupled component 112 and the processor 114 can be electrically connected through a wire. Thus, the processor 114 can receive the image signal transmitted by the charge-coupled component 112 through the wire and process the image signal. . As shown in FIG. 1, the lens of the charge coupled device 112 faces the vicinity of the reaction chamber 108 to facilitate obtaining images of all of the semiconductor components 106 on the carrier 104 before and after entering the reaction chamber 108.

In an embodiment, the monitoring device 100 can be selectively provided with the sensor 120 according to process requirements, wherein the sensor 120 can be directly disposed on the charge coupling element 112 or disposed near the charge coupled element 112, and The detector 120 can be electrically connected to the charge coupled component 112. The sensor 120 can be used to sense the message before and after the carrier 104 carrying the semiconductor component 106 enters the reaction chamber 108, and transmits the sensed signal to the charge coupled component 112. The charge coupled device 112 is notified to monitor the carrier 104 carrying the semiconductor device 106 to obtain image signals of all the semiconductor devices 106 on the carrier 104 at this time. In another embodiment, the monitoring device 100 can be selectively provided with an alarm 116 according to actual needs, wherein the alarm 116 can be electrically connected to the processor 114 through a wire to receive the warning signal transmitted by the processor 114. . The alarm 116 can be, for example, an element that can emit sound, bright light, or both sound and light to alert when the number of semiconductor components 106 loaded by the carrier 104 differs from before entering the reaction chamber 108, To warn the online staff that there may be abnormal conditions. In another preferred embodiment, the monitoring device 100 can also be selectively provided with a display 118 according to actual needs, wherein the display 118 can also be electrically connected to the processor 114 through a wire to receive and display the slave processor 114. The transmitted information, such as the number of semiconductor components 106 on the carrier 104 before entering the reaction chamber 108, the number of semiconductor components 106 on the carrier 104 after being loaded from the reaction chamber 108, or the subsequent number alignment steps are obtained. The result of the comparison.

Next, before loading the carrier 104 with the semiconductor component 106 loaded thereon into the reaction chamber 108, a first monitoring step is performed, as described in step 202 of FIG. 2, to obtain the number of semiconductor components 106 at this time. Preferably, in the first monitoring step, the obtained information of the number of semiconductor components is further stored in the processor 114 for subsequent comparison. In step 202, when the monitoring device 100 performs the first monitoring step on the carrier 104, the sensor 120 first senses that the carrier 104 will enter the reaction room 108, and transmits the message to the charge coupled device 112. The image signal of all the semiconductor elements 106 on the carrier 104 at this time is obtained by the charge coupled device 112. Then, the image signal is transmitted to the processor 114. After the processor 114 receives the image signal, the processor 114 can convert the image signal into a digital signal, wherein the obtained digital signal can represent the carrier 104 The number of all semiconductor components 106 loaded on the carrier 104 prior to entering the reaction chamber 108. At this time, the number of semiconductor elements 106 that are monitored is referred to herein simply as the number of first semiconductor elements. In an embodiment, the number of first semiconductor components obtained by monitoring can be displayed in display 118 for reading.

Then, the carrier 104, together with the semiconductor component 106 loaded thereon, is placed in the reaction chamber 108, and the semiconductor component 106 is processed by the processing liquid 110 stored therein, such as etching, photoresist stripping, and development. Or wet cleaning and so on. After the processing of the semiconductor component 106 is completed, the carrier 104 and the semiconductor component 106 thereon are taken out of the reaction chamber 108. After the carrier 104 is loaded from the reaction chamber 108, the monitoring method continues to perform the second monitoring step, as described in step 204 of FIG. 2, to obtain the number of semiconductor components 106 after completion of processing, wherein Preferably, in the second monitoring step, the obtained information of the number of semiconductor components is further stored in the processor 114 for subsequent comparison. In step 204, when the monitoring device 100 performs the second monitoring step on the carrier 104, the sensor 120 first senses the message carried in the sub-chamber 108 of the carrier 104, and transmits the message to the charge coupling. The component 112, and then the charge coupled component 112, acquires the image signal of all of the semiconductor components 106 on the carrier 104 at this time. Then, the image signal is transmitted to the processor 114. After the processor 114 receives the image signal, the processor 114 can also convert the image signal into a digital signal, wherein the obtained digital signal can represent the carrier 104. The number of all semiconductor components 106 still loaded on the carrier 104 after being carried out in the reaction chamber 108. At this time, the number of semiconductor elements 106 that are monitored is simply referred to herein as the number of second semiconductor elements. In one embodiment, the number of second semiconductor components obtained by monitoring can also be displayed in display 118 for reading.

Next, as described in step 206 of FIG. 2, a comparison step is performed to compare the number of first semiconductor components and the number of second semiconductor components respectively obtained in the previous two monitoring steps. In an embodiment, when the information of the number of the first semiconductor component and the number of the second semiconductor component is displayed on the display 118 of the monitoring device 100, the number of the first semiconductor component and the second semiconductor component can be directly compared by the line worker. To check if there is a difference between the number of first semiconductor components and the number of second semiconductor components. However, in a preferred embodiment, the processor 114 can be used to perform the comparison step, and the information of the comparison result can be transmitted to the display 118, and the display result can be displayed on the screen of the display 118 by using the display 118. . In a preferred embodiment, when the comparison result is that the number of the first semiconductor components is different from the number of the second semiconductor components, usually the number of the first semiconductor components is greater than the number of the second semiconductor components, and the processor 114 can transmit a warning signal to the alarm. The 116 can be alerted by an alarm to alert the line staff to perform an abnormal condition, such as removing the semiconductor component 106 or semiconductor component 106 that has fallen into the reaction chamber 108 from the reaction chamber 108.

Referring to FIG. 3, in another exemplary embodiment of the present invention, a plurality of processing devices 100 can be simultaneously monitored by using a plurality of monitoring devices 100, wherein the number of monitoring devices 100 is preferably related to the processing machine 102. The monitoring devices 100 are correspondingly disposed adjacent to the processing machine 102, so as to monitor the wet processing of the reaction chambers 108 carried by the carrier 104 and entering the processing stations 102 by using the monitoring devices 100. The number of semiconductor elements 106 varies. In this embodiment, each monitoring device 100 monitors the corresponding processing machine 102 in the same manner as the above embodiment, and therefore will not be described again.

In one embodiment, the process stations 102 can be machines that perform different wet processing on the semiconductor components 106, such as an etching machine, a photoresist stripper, a developing machine, and a wet cleaning machine. In another embodiment, the process stations 102 can be the same wet processing of the semiconductor components 106 carried by the different carriers 104 to simultaneously perform the same wet processing on the different batches of semiconductor components 106. In the exemplary embodiment, each monitoring device 100 includes a display 118 and a processor 114. In another embodiment, a plurality of monitoring devices 100 can share a display 118 and a processor 114.

It is apparent from the above embodiments of the present invention that one of the advantages of the present invention is that the semiconductor component monitoring method of the present invention can monitor the number of semiconductor components carried by a carrier during the semiconductor component on the process line.

It can be seen from the above embodiments of the present invention that another advantage of the present invention is that the monitoring method of the semiconductor device of the present invention can monitor the number of semiconductor components before and after a processing procedure, and can immediately monitor the number of semiconductor components before and after processing. Change, so the online staff can immediately eliminate the semiconductor components dropped in the reaction tank according to the monitoring results, and can effectively prevent the dropped semiconductor components from damaging the semiconductor components that are subsequently processed in the same reaction tank, thereby greatly improving the process. rate.

While the present invention has been described above by way of example, it is not intended to be construed as a limitation of the scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100. . . Monitoring equipment

102. . . Process machine

104. . . Carrier

106. . . Semiconductor component

108. . . Reaction chamber

110. . . Treatment fluid

112. . . Charge coupled device

114. . . processor

116. . . Alarm

118. . . monitor

120. . . Sensor

200. . . step

202. . . step

204. . . step

206. . . step

1 is a schematic view of a monitoring device for a semiconductor device in accordance with a preferred embodiment of the present invention.

2 is a flow chart showing a method of monitoring a semiconductor device in accordance with a preferred embodiment of the present invention.

3 is a top plan view showing a monitoring device for a semiconductor device in accordance with another preferred embodiment of the present invention.

200. . . step

202. . . step

204. . . step

206. . . step

Claims (21)

A method of monitoring a semiconductor component for monitoring a quantity of a plurality of semiconductor components to be processed in a reaction chamber and carried by a carrier, the method of monitoring the semiconductor component comprising at least: providing a monitoring device, wherein the monitoring device Having at least one charge-coupled component electrically coupled to a processor and the charge-coupled component to receive an image signal from the charge-coupled component; before the carrier is loaded into the reaction chamber, the load-bearing device is used The semiconductor components carried by the rack perform a first monitoring step to obtain a first quantity of the semiconductor components stored in the processor; after the carrier is loaded from the reaction chamber, the monitoring device is used The semiconductor components carried by the carrier perform a second monitoring step to obtain a second quantity of the semiconductor components stored in the processor; performing an alignment step to compare the first quantity with the a second quantity; and when the first quantity compared to the second quantity in the comparison step is different, indicating the semiconductor elements At least one fall in the reaction chamber, some of the semiconductor element and the at least one of which is removed from the reaction chamber. The method for monitoring a semiconductor device according to the first aspect of the invention, wherein the first monitoring step comprises: obtaining, by the charge-coupled component, a first image signal of the semiconductor components on the carrier; Receiving the first image signal; and converting the first image signal into a first digital signal by using the processor Number, wherein the first digital signal indicates the first quantity. The method for monitoring a semiconductor device according to the first aspect of the invention, wherein the second monitoring step comprises: obtaining, by the charge-coupled component, a second image signal of the semiconductor components on the carrier; Receiving the second image signal; and converting the second image signal into a second digital signal by using the processor, wherein the second digital signal indicates the second quantity. The method for monitoring a semiconductor device according to claim 1, wherein the reaction chamber is a wet etching bath. The method for monitoring a semiconductor device according to claim 1, wherein the reaction chamber is a photoresist stripping groove. The method of monitoring a semiconductor device according to claim 1, wherein the reaction chamber is a developing tank. The method for monitoring a semiconductor device according to claim 1, wherein the reaction chamber is a cleaning tank. The method for monitoring a semiconductor device according to claim 1, wherein the monitoring device further comprises at least one alarm and the processor. Connecting, in the comparing step, issuing an alert when the first amount is different from the second amount. The method of monitoring a semiconductor device according to claim 1, wherein the comparing step is performed by using the processor. The method for monitoring a semiconductor device according to claim 9, wherein the monitoring device further comprises at least one display for displaying the first quantity, the second quantity, and the comparison result with the comparing step. The method for monitoring a semiconductor device according to claim 1, wherein the monitoring device further comprises at least one sensor electrically connected to the charge coupled device to sense loading and unloading the carrier Message and inform the charge coupled component. A method of monitoring a semiconductor component for monitoring a quantity of a plurality of semiconductor components to be processed in a reaction chamber and carried by a carrier, the method for monitoring the semiconductor component includes at least: providing a monitoring device adjacent to the a reaction chamber, wherein the monitoring device comprises at least one charge-coupled component, and is electrically connected to a processor and the charge-coupled component; before the carrier is loaded into the reaction chamber, the carrier is carried by the charge-coupled component a first image signal of the semiconductor components; processing, by the processor, the first image signal to obtain a first quantity of the semiconductor components; After the carrier is carried out from the reaction chamber, the second image signal of the semiconductor components carried by the carrier is obtained by using the charge-coupled component; the second image signal is processed by the processor to obtain a second quantity of the plurality of semiconductor elements; performing a comparison step using the processor to compare the first quantity with the second quantity; and comparing the first quantity to the first quantity in the comparison step When the second number is different, it indicates that at least one of the semiconductor elements is dropped into the reaction chamber, and at least one of the semiconductor elements is removed from the reaction chamber. The method for monitoring a semiconductor device according to claim 12, wherein the step of processing the first image signal by using the processor includes at least converting the first image signal into a first digital signal to indicate the first Quantity. The method for monitoring a semiconductor device according to claim 12, wherein the step of processing the second image signal by using the processor includes at least converting the second image signal into a second digital signal to indicate the second Quantity. The method of monitoring a semiconductor device according to claim 12, wherein the reaction chamber is a wet etching bath. Monitoring of semiconductor components as described in claim 12 The method wherein the reaction chamber is a photoresist stripping tank. The method of monitoring a semiconductor device according to claim 12, wherein the reaction chamber is a developing tank. The method of monitoring a semiconductor device according to claim 12, wherein the reaction chamber is a cleaning tank. The method for monitoring a semiconductor device according to claim 12, wherein the monitoring device further comprises at least one alarm electrically connected to the processor, wherein in the comparing step, the first quantity and the first An alarm is issued when the number is different. The method for monitoring a semiconductor device according to claim 12, wherein the monitoring device further comprises at least one display for displaying the first quantity, the second quantity, and the comparison result with the comparing step. The method for monitoring a semiconductor device according to claim 12, wherein the monitoring device further comprises at least one sensor electrically connected to the charge coupled device to sense loading and unloading the carrier Message and inform the charge coupled component.