TWI499479B - Polishing device - Google Patents

Description

Grinding device

The present invention relates to a polishing head that presses a polishing tape against an object to be polished, and a polishing apparatus including the polishing head.

Conventionally, as a device for removing minute protrusion defects of a few micrometers which are generated when a color filter substrate is manufactured, a polishing apparatus using a polishing tape has been put into practical use.

In the above-mentioned polishing apparatus, there is known a device for measuring the protrusion height of an object to be polished by a height sensor, and determining the amount of the polishing tape to be lowered toward the protrusion (amount of polishing) based on the measurement data, and performing the protrusion on the protrusion In the state of being pressed, the polishing tape is continuously transferred to grind the fine projections (refer to Japanese Laid-Open Patent Publication No. Hei 10-217089, No. 2003-266293).

Further, the present inventors have previously proposed a device in which the polishing tape used in the present invention has a smooth surface (resin surface) holding the polishing surface at both ends in the width direction (refer to Japanese special). May 2009-009259).

In the above-described apparatus using a polishing belt having a polished surface and a smooth surface, high-precision polishing can be realized without performing height measurement, and it is desirable to prevent shoulder contact of the polishing tape. The polishing head that presses the minute projections of the object to be polished is mounted with high precision.

However, in order to mount the polishing head with high precision, it takes a lot of time and labor. When the high-precision mounting adjustment cannot be performed, the polishing tape will remain in contact with the end, and the micro protrusions may not be ground to the location. The height is required, or the polishing tape may be damaged. This is the problem.

Therefore, an object of the present invention is to provide a polishing head capable of polishing an object to be polished to a desired height even when the adjustment of the polishing head cannot be performed with high precision, and preventing damage of the polishing tape; A polishing apparatus including the polishing head is provided.

Therefore, the polishing head of the present invention is characterized in that the polishing tape is pressed against the object to be polished; and the lower portion of the base member is axially aligned with the direction orthogonal to the width direction of the polishing tape. Shake and install.

In such a configuration, since the polishing head can be oscillated about the direction orthogonal to the width direction of the polishing tape, even if the base member is obliquely mounted, the polishing head and the polishing belt pressed by the polishing head are borrowed. When the inclination is changed by the object to be polished (protrusion) and the periphery of the object to be polished (projection surface), the inclination of the object to be polished (protrusion) is reduced, and the edge is in contact with the edge. Will be lifted.

Therefore, according to the polishing head of the present invention, even if the adjustment of the polishing head cannot be performed with high precision, the object to be polished can be polished to a desired height, and the polishing tape can be prevented from being damaged.

Here, the pressing portion of the polishing tape that presses the polishing head is formed in a semi-cylindrical shape with the width direction of the polishing tape as an axis, or is divided into a plurality of divisions in the width direction of the polishing tape, even in the case of The plurality of hemispherical protrusions arranged in the width direction of the polishing tape are formed. Further, at least one of the plurality of pressing portions is supported by the polishing head so as to be movable in a separation direction with respect to the polishing tape, and the movably supported pressing portion is provided to the polishing belt Elastic components that are tightened.

As described above, by providing the plurality of pressing portions, the contact area between the polishing tape and the polishing head can be reduced, whereby the frictional resistance between the two can be reduced, and the pressing portion can be set as a hemispherical projection. The pressing area can be minimized, and the polishing rate can be maintained to accurately grind the minute protrusions.

Further, since the pressing portion is configured to be movable, the polishing head does not need to precisely adjust the height of the pressing portion with respect to the substrate, and the pressing belt can be pressed, and the pressing force and the grinding of the smooth surface can be individually adjusted. The pressing force of the surface prevents excessive polishing. Further, by adjusting the pressing force (elastic tightening force) generated by the elastic member, the polishing speed can be adjusted and the defect height of the polishing can be adjusted.

On the other hand, the polishing apparatus of the present invention includes: the polishing head of the present invention; and a tape transfer mechanism for transferring the polishing tape wound around the polishing head. The polishing tape has a smooth surface that holds the polishing surface at both ends in the width direction, and the polishing surface and the smooth surface are the same surface or are recessed compared to the smooth surface.

According to this configuration, since the polishing surface and the smooth surface of the polishing tape are the same surface or are recessed compared to the smooth surface, when the smooth surfaces of the both ends are brought into contact with the object to be polished (fine projections), The grinding action of the grinding surface can be stopped. Further, since the polishing head can be supported by being rocked orthogonally to the direction of the width direction of the polishing tape, even if the base member is obliquely mounted, the polishing head and the polishing tape against which the polishing head is pressed are abutted The object to be polished (protrusion) and the periphery of the object to be polished (projection surface) are inclined, and the inclination of the object to be polished (protrusion) is reduced, and the edge contact state is released.

Therefore, according to the polishing apparatus of the present invention, the smooth surface of the polishing tape functions as a stopper, and it is possible to prevent the polishing object such as the microprotrusion from being subjected to polishing more than necessary, and even if the polishing head cannot be mounted with high precision. In this case, the object to be polished can still be ground to a desired height, and the damage of the polishing tape can be prevented.

Fig. 1 is a perspective view showing a substrate correction device 100 including a polishing head and a polishing apparatus of the present invention.

The substrate correction device 100 shown in FIG. 1 includes a table 200 for mounting a flat substrate BS (for example, a color filter substrate), and an X-axis housing 300 having a gate shape spanning the substrate BS. The support table 200 is supported in the Y-axis direction and supported; the X-axis slide 400 is supported in the X-axis direction with respect to the X-axis housing 300; the polishing apparatus 500 is mounted on the The X-axis slide 400; and the control device 600 control the devices.

Further, in the present embodiment, the X-axis and the Y-axis constitute a horizontal plane, and the Z-axis system coincides with the vertical direction.

The X-axis housing 300 includes a pair of leg portions 301 and 301 and a beam portion 302 that spans between the leg portions 301 and 301. The X-axis slider 400 is supported by the beam portion 302 so as to be movable in the X-axis direction.

Further, at both ends in the X-axis direction of the table 200, the guide rails 201 and 201 are arranged in the Y-axis direction, and the guide rails 201 and 201 move the leg portions 301 and 301 of the X-axis housing 300 in the Y-axis direction. stand by. Further, the X-axis housing 300 is moved in the Y-axis direction by a Y-axis moving device (Y-axis moving mechanism) such as a feed screw mechanism that is operated by rotation of a drive motor (not shown).

Further, a pair of guide rails 401, 401 are disposed along the X-axis direction with respect to the beam portion 302, and the guide rails 401, 401 support the X-axis slide 400 so as to be movable in the X-axis direction.

Further, a ball screw 402 is disposed between the guide rails 401 and 401 of the beam portion 302 along the X-axis direction, so that the first ball nut (not shown) fixed to the rear surface (back surface) of the X-axis slide 400 is screwed. In the ball screw 402, when the ball screw 402 is rotationally driven by an X-axis drive motor (X-axis drive unit) 403 coupled to one end portion (the right end portion of FIG. 1) of the ball screw 402, the X-axis slide 400 is directed toward Move in the X-axis direction.

As shown in FIG. 2, the polishing apparatus 500 includes a base plate 501 which is attached to the X-axis slide 400, and a pressing mechanism 520 which is a micro protrusion on the substrate BS. The object to be polished is pressed; the observation mechanism (image pickup mechanism) 540 images the projections on the substrate BS, and the tape transfer mechanism 560 is used to transfer the polishing tape 510 wound around the polishing head described later.

The pressing mechanism 520 includes a pressing shaft 521 and a moving mechanism 522.

The moving mechanism 522 includes a slider 523 to which a pressing shaft 521 is attached, a pair of rails 524 and 524 attached to the seat plate 501 in the Z-axis direction, and a second ball nut (not shown). And being assembled to the slider 523; the ball screw 525 is screwed to the second ball nut; the driving motor 526 is coupled to one end of the ball screw 525; and the encoder 527 is provided to the driving motor 526; wherein the slider 523 is mounted relative to the guide rails 524, 524 for movement in the Z-axis direction.

Further, the ball screw 525 is rotated by the aforementioned drive motor 526 so that the slider 523 moves in the Z-axis direction (in other words, in the direction orthogonal to the substrate BS).

The drive motor 526 and the encoder 527 are connected to the control device 600, and the control unit 600 including the microprocessor measures the position of the slider 523 in the Z-axis direction from the output signal of the encoder 527, and drives based on the measurement data. The aforementioned drive motor 526 is controlled such that the slider 523 (the pressing shaft 521) is moved toward the target position.

The pressing shaft 521 is slidably held in the Z-axis direction by a sliding holding portion (not shown) fixed in the guide 528 of the slider 523, and the upper end of the pressing shaft 521 is passed through the strain gauge 529. And connected to a stay 530 integrally provided with the slider 523.

In the control device 600, the polishing surface of the polishing tape 510 is brought into contact with the minute projections α of the substrate BS by the pressing shaft 521, and the driving motor 526 is controlled so that the strain amount detected by the strain gauge 529 is a predetermined value. The pressing pressure of 510 pairs of tiny protrusions is controlled to be constant.

Further, the control device 600 determines whether or not the polishing tape 510 abuts against the surface of the substrate BS and whether the pressing shaft 521 is in a state where it is not lowered, based on the detection output of the strain gauge 529.

In other words, when the output of the strain gauge 529 is higher than the rise at the start of the polishing, it is determined that the polishing tape 510 abuts against the surface of the substrate BS and the pressing shaft 521 is not lowered.

3 is a detailed configuration of the polishing tape 510 used in the polishing apparatus 500 described above.

As shown in FIG. 3(b), the polishing tape 510 includes a polishing layer 510b containing bismuth grains on one surface of the strip-shaped base material 510a, and a width W1 at both ends in the width direction of the surface of the polishing layer 510b. Resin layers 510c, 510c having a thickness H1.

Thereby, the polishing layer 510b is exposed to the width W2 (W2=W-2×W1) of the width W of the strip-shaped base material 510a to form the polishing surface 510d, and the polishing surface 510d and the polishing surface 510d The polished surface 510d and the smooth surfaces (hereinafter referred to as smooth surfaces) 510e, 510e of the resin layers 510c, 510c provided at both ends by the width W1 constitute the surface of the polishing tape 510 on the polishing side.

Further, the polished surface 510d is recessed corresponding to the thickness H1 of the resin layer 510c as compared with the smooth surface 510e.

Further, the polishing tape 510 may have a smooth surface 510e, 510e that holds the polishing surface 510d in the width direction, and may subtract the width W of the tape-shaped substrate 510a from the resin as shown in Fig. 3(c). The polishing layer 510b having the width W2 of the width W1 × 2 of the layers 510c, 510c is laminated on the central portion in the width direction of one side of the strip substrate 510a, and has a width W1 on the strip substrate 510a on both sides of the polishing layer 510b. The resin layer 510c, 510c is laminated to a thickness H3.

Here, in the configuration shown in FIG. 3(c), the thickness H2 of the polishing layer 510b and the thickness H3 of the resin layers 510c, 510c exhibit H3≧H2, the surface of the polishing layer 510b (the abrasive surface 510d) and the resin layer 510c. The surface of the 510c (smooth surface 510e) forms the same surface, or the surface of the polishing layer 510b (the abrasive surface 510d) is smaller than the thickness of the resin layer 510c, 510c (smooth surface 510e) by the thickness H2, H3 (Δh = H3-H2) is sunken. In other words, the polishing tape 510 is not limited to the smooth surface 510e, 510e that holds the polishing surface 510d in the width direction, and the surface of the polishing surface 510d and the smooth surface 510e, 510e are the same surface or are recessed. The laminated structure shown in Fig. 3 (b) or (c).

Further, the height h from the polished surface 510d to the smooth surface 510e (in other words, the thickness H1 in FIG. 3(b) or the Δh=H3-H2 in FIG. 3(c)), the maximum height allowed for the minute protrusions is defined as In the case of hmax (for example, hmax = 4 μm), it is set to 0 ≦ h ≦ hmax.

The material of the resin layer 510c is preferably a low coefficient of friction when the surface of the resin layer 510c (smooth surface 510e) is slid on the substrate BS, such as a fluororesin such as perfluoroethylene or a ruthenium resin.

Further, the correlation between the width W2 of the polished surface 510d and the width W1 of the smooth surface 510e is preferably set to W2: W1 = 1: 0.5, in which case W1 × 4 = W.

The fine protrusions are polished by transferring the polishing tape 510 in a state where the polishing surface 510d of the polishing tape 510 is pressed against the top of the minute projections on the substrate BS.

Thereafter, as the polishing progresses, the height of the minute projections decreases, and once the smooth surface 510e abuts against the substrate BS, the smooth surface 510e becomes a stopper, causing the lowering of the polishing tape 510 to stop, and more polishing cannot be performed.

For example, when the surface (polishing surface 510d) of the polishing layer 510b is recessed with respect to the surface (smooth surface 510e) of the resin layers 510c, 510c, on the surface of the substrate BS in a state where the smooth surfaces 510e, 510e abut on the substrate BS There is a space corresponding to the recess between the polishing surface 510d, and no more polishing can be performed on the protrusions accommodated in the recess (in other words, the height is polished to a lower depth than the depth of the recess).

Further, when the surface (polishing surface 510d) of the polishing layer 510b and the surface (smooth surface 510e) of the resin layers 510c, 510c are flush with each other, the smooth surface 510e, 510e abuts on the substrate BS, the polishing surface 510d cannot be further Further, the micro protrusions α or the substrate BS are pressed, and the minute protrusions are polished to the vicinity of the substrate BS surface or the substrate BS surface, but the polishing does not occur further.

As described above, the resin layer 510c (smooth surface 510e) provided in the polishing tape 510 functions as a stopper for the polishing operation, whereby the micro protrusions can be polished to an allowable maximum height hmax or less, thereby avoiding unnecessary Grinding.

As shown in FIG. 4, the pressing shaft 521 includes a base member 521a that is held relative to the guide 528, and a polishing head 521b that is rockable within a predetermined angle range for the lower portion of the base member 521a. The land is supported by supporters.

A groove 521e is formed on a lower surface of the base member 521a along a width direction (Y-axis direction) of the polishing tape 510, and a substantially central position in the width direction (Y-axis direction) so as to straddle the groove 521e. The mode supports the rocking shaft 521c along the X-axis direction (the direction orthogonal to the width direction of the polishing tape 510).

Further, the grinding head 521b can be inserted into the upper end of the polishing head 521b at substantially the center in the Y-axis direction, and the bearing (not shown) provided in the X-axis direction in the axial direction is inserted into the rocking shaft 521c. The rocking shaft 521c is rocked at the center.

The polishing head 521b is formed in a plate shape having a thickness narrower than the groove width Wd of the groove 521e, and the length LY in the Y-axis direction is substantially the same as the width W of the polishing tape 510 or slightly longer than the tape width W. The lower surface 521f (the pressing portion) is formed in a semi-cylindrical shape with the width direction (Y-axis direction) of the polishing tape 510 as an axis.

Here, it is preferable to set the position of the rocking shaft 521c and the center of gravity of the polishing head 521b such that the lower surface 521f of the polishing head 521b is rocked at a substantially horizontal position by the weight of the polishing head 521b.

As shown in FIG. 2, the observation mechanism 540 includes an observation optical system 541 and a moving mechanism 542 that advances and retreats the observation optical system 541 toward the substrate BS in the Z-axis direction.

Further, as shown in FIG. 5, the observation optical system 541 includes an object lens 541a that faces the substrate BS, and a half mirror 541b that is disposed on the optical axis L of the object lens 541a above the object lens 541a; an imaging lens 541c and CCD camera 541d; and mirror 541e, which deflects optical axis L1 on optical axis L1 branched from optical axis L by half mirror 541b; and illumination light source 541f is biased by mirror 541e On the optical axis L2.

The illumination light source 541f irradiates the substrate BS with the observation light via the mirror 541e, the half mirror 541b, and the object lens 541a, and the reflected light (optical image) of the substrate BS passes through the objective lens 541a, the half mirror 541b, and the imaging lens 541c. It is imaged on the CCD camera 541d.

Next, the CCD camera 541d converts the optical image into an electrical image signal, and transmits the electrical image signal to the control device 600. The control device 600 that receives the electrical image signal displays an image of the substrate BS on the display device 600a (for example, a liquid crystal screen).

As shown in FIG. 2, the moving mechanism 542 of the observation mechanism 540 is composed of a slider 542a (fixing the observation mechanism 540) and a pair of guide rails 542b and 542b (installed on the seat plate 501 along the Z-axis direction), The third ball nut (assembled to the slider 542a) (not shown), the camera ball screw (screwed to the third ball nut) (not shown), and the drive motor 542c (connected to the camera ball) One end of the screw) and an encoder 542d (provided in the drive motor 542c) are provided, and the slider 542a is mounted to be movable in the Z-axis direction with respect to the guide rails 542b and 542b.

Further, the camera ball is rotated by the drive motor 542c, whereby the slider 542a and the observation mechanism 540 are advanced and retracted toward the substrate BS in the Z-axis direction.

The control device 600 inputs the output signal of the encoder 542d, measures the position of the slider 542a in the Z-axis direction from the output signal of the encoder 542d, and drives and controls the driving motor 542c based on the measurement data so that the slider 542a (Observation mechanism 540) moves toward the target position.

As shown in FIG. 2, the tape transfer mechanism 560 includes rotating shafts 561a, 561b, 561c, and 561d which are mounted on the seat plate 501 in the Y-axis direction (the direction orthogonal to the front surface of the seat plate 501). a winding motor 562 for winding up; a timing pulley 563 fitted to the rotating shaft 562a of the winding motor 562; and a timing pulley 564 fitted to the rotating shaft 561b; and the timing pulley 563 A timing belt 565 is provided across the timing pulley 564.

Further, the tape reel R1 is fitted to the rotating shaft 561a (the polishing tape 510 is wound in advance), and the tape reel R2 is fitted to the rotating shaft 561b (for pulling out the reel R1 from the reel R1). The abrasive tape 510 is wound).

Further, a guide groove (not shown) for the polishing tape 510 is formed on the periphery of the rotating shafts 561c and 561d, and the polishing tape 510 is guided to the guide groove, and is transferred while the rotating shafts 561c and 561d are rotated. .

Further, by driving the aforementioned take-up motor 562, the take-up reel R2 is rotated in the clockwise direction in FIG. 2 to wind up the polishing tape 510, thereby pulling out the polishing tape 510 wound around the tape reel R1. The force of this force causes the belt reel R1 to rotate, and the polishing belt 510 traverses the axis of the pressing shaft 521 via the rotating shaft 561c, and is further transferred to the take-up reel R2 via the rotating shaft 561d, in order Winding onto the belt reel R2.

The operation sequence of polishing the microprotrusions α on the substrate BS by using the substrate correction device 100 having the above configuration will be described below.

First, the tape reel R1 around which the polishing tape 510 is wound and the empty reel R2 are fitted to the rotary shafts 561a and 561b, respectively, and then the end of the polishing tape 510 is pulled out from the reel R1, and the pull-out is pulled out. The polishing tape 510 is fastened to the boss portion of the tape reel R2 via the rotating shafts 561c, 561d.

In this state, the take-up motor 562 is driven to apply tension to the polishing tape 510, and the polishing tape 510 is wound around the front end of the polishing head 521b, and further, the center of the polishing head 521b in the Y-axis direction and the polishing tape 510 are performed. The adjustment of the width center is consistent.

Thereafter, the substrate BS is placed on the stage 200, and the Y-axis moving mechanism and the X-axis driving motor 403 are driven based on the defect position data of the substrate BS measured in advance so that the optical axis L of the object lens 541a of the observation optical system 541 is substantially The illumination light source 541f and the CCD camera 541d are operated in accordance with the defect portion position of the substrate BS. Next, the driving motor 542c is operated to move the slider 542a to the substrate BS side so that the focus of the object lens 541a is aligned with the defective portion on the substrate BS.

Then, the optical image of the defective portion is imaged by the CCD camera 541d via the objective lens 541a, the half mirror 541b, and the imaging lens 541c, and the defective portion is displayed on the display device 600a based on the electrical image signal output from the CCD camera 541d. image.

The operator observes whether or not the defective portion is the minute projection α of the polishing target based on the defective portion image displayed on the display device 600a, and observes whether or not the center of the optical axis L of the objective lens 541a and the minute projection α are deviated in the XY plane. .

Once it is judged that the defective portion is the minute protrusion α, and the center of the minute protrusion α is inconsistent with the optical axis L of the object lens 541a in the XY plane, the Y-axis moving mechanism and the X-axis driving motor 403 are driven to cause minute protrusions. The center of α coincides with the optical axis L of the objective lens 541a.

Thereafter, the X-axis drive motor 403 is driven such that the center of the pressing shaft 521 is located directly above the minute protrusions α in the center of the XY direction (see FIG. 6( a )). This is performed by moving the X-axis slider 400 in the X-axis direction by a distance DL between the center of the pressing shaft 521 and the optical axis L of the object lens 541a.

Then, the driving motor 526 is driven so that the polishing head 521b wound around the tip end portion of the polishing tape 510 is lowered in the Z-axis direction, and the polishing surface 510d of the polishing tape 510 is brought into contact with the microprotrusions α (see FIG. 6(b)). The driving force of the driving motor 526 output based on the strain gauge 529 is used to maintain the pressing force of the polishing tape 510 against the minute projections α constant.

The optimum value of the above-mentioned pressing force differs depending on the hardness of the minute projections α of the substrate BS, the grain size of the abrasive grains of the polished surface 510d, and the like.

When the polishing surface 510d of the polishing tape 510 is brought into contact with the microprotrusions α, the winding motor 562 is driven to continue the pressing of the pressing shaft 521 (the polishing head 521b) while the polishing tape 510 is traveling, and the smooth surface of the polishing tape 510 is smoothed. 510e, 510e abuts on the surface of the substrate BS and before the lowering of the pressing shaft 521 (the polishing head 521b) in the Z-axis direction (refer to FIG. 6(c)), the walking of the polishing tape 510 and the pressing shaft 521 (the polishing head 521b) The decline continues.

Whether or not the lowering of the pressing shaft 521 (the polishing head 521b) in the Z-axis direction is determined based on the increase in the output of the strain gauge 529, and the critical value of the output change used in the stop determination is the resin layer 510c of the polishing tape 510. The materials are different and have different optimum values.

When it is determined that the pressing shaft 521 is stopped, the winding motor 562 is stopped. Next, the driving motor 526 is used in the reverse direction, and the pressing shaft 521 (the polishing head 521b) is separated from the substrate BS, and the polishing removal operation of the minute projections α is completed.

Thereafter, each of the defective portions is repeatedly subjected to a series of operations of imaging, minute protrusion discrimination, and polishing, and after the polishing of all the minute protrusions α is completed, the correction of the substrate BS is completed.

Here, the polishing tape 510 of the present embodiment has smooth surfaces 510e and 510e that sandwich the polishing surface 510d at both ends in the width direction as described above, and smooth surfaces when the smooth surfaces 510e and 510e abut against the surface of the substrate BS. 510e, 510e become a stopper, and no more polishing is performed, so that the polishing surface 510d does not contact the surface of the substrate BS other than the minute protrusions α, and unnecessary polishing is not performed.

In other words, since the smooth surface 510e, the 510e and the polishing surface 510d are the same surface or protrude from the substrate BS side than the polishing surface 510d, even if the polishing head 521b is lowered to the smooth surface 510e, the 510e abuts against the substrate BS. Until the surface, the surface of the substrate BS can be prevented from being polished, and the smooth surfaces 510e, 510e abut against the surface of the substrate BS, meaning that the minute protrusions α have been reduced to the height set by the thickness of the resin layer 510c, so that the polishing is performed. It is not necessary to measure the height of the microprotrusions α to judge whether the grinding result is appropriate or not.

Therefore, the time required for the height measurement of the minute protrusions α can be omitted, and the polishing operation can be performed efficiently.

Further, in the present embodiment, since the pressing shaft 521 is constituted by the base member 521a and the polishing head 521b (supported so as to be rockable in the lower portion of the base member 521a), even if the mounting error of the pressing shaft 521 is received As a result, the base member 521a is not vertically mounted but is slightly inclined, and the minute protrusions α can be ground to a desired height while preventing the polishing tape 510 from being damaged by the end edge contact.

Fig. 6 is a view showing a grinding operation process in the case where the base member 521a is attached with a slight inclination from the vertical direction.

As shown in Fig. 6(a), when the central axis of the base member 521a is attached at an angle of 0 with respect to the vertical axis VE, the polishing head 521b is supported in a swingable manner with respect to the base member 521a. Therefore, the polishing head 521b is shaken by its own weight until the axis passing through the vertical direction of the rocking shaft 521c passes through the center of gravity of the polishing head 521b, and this state is maintained until the start of the grinding.

In order to start the polishing, even when the polishing head 521b is lowered, it is desirable that the polishing head 521b maintains the rocking position due to its own weight, and the smooth surfaces 510e and 510e of both sides are pressed against the surface of the substrate BS, and the polishing is finished ( Figure 6 (c)). However, the polishing head 521b may be deviated from the ideal state due to the machining accuracy or the like, and as shown in Fig. 6(b), slight tilting of the polishing head 521b may occur.

At this time, as shown in FIG. 6(b), once the polishing surface 510d of the polishing tape 510 wound around the tip end of the polishing head 521b abuts against the minute projections α of the substrate BS, the polishing head 521b has the microprotrusions α as a fulcrum. When the tilt is shaken, one of the minute projections α and the smooth surfaces 510e, 510e is subjected to the pressing force.

Further, when the range of the rocking angle of the polishing head 521b is narrow, the smooth surfaces 510e and 510e may not be in contact with the substrate BS, and the fine protrusions α may be in contact with the polishing surface 510d.

When the micro-protrusions α are in contact with the polishing surface 510d, the polishing tape 510 is caused to travel, and the micro-protrusions α are removed and gradually lowered in height. Accordingly, the polishing head 521b is shaken, and the underside of the polishing head 521b is formed by the substrate BS. The angle (the inclination of the polishing head 521b with respect to the substrate BS) gradually decreases, and finally the smooth surfaces 510e and 510e of both sides are pressed against the surface of the substrate BS, and the polishing is completed (see Fig. 6(c)).

Therefore, even if the base member 521a is attached with a slight inclination from the vertical direction, the microprotrusions α can be polished to a predetermined height, and the excessive application of the polishing tape 510 (resin layers 510c and 510c) can be prevented from being damaged. Further, by amplifying the allowable range of the mounting error of the base member 521a, the mounting adjustment operation of the pressing shaft 521 can be simplified.

On the other hand, when the base member 521a is integrated with the polishing head 521b, the polishing head 521b is pressed against the shaft 521 without shaking, and polishing is performed as shown in Fig. 7, and as a result, the micro protrusions α cannot be obtained. The possibility of grinding to a predetermined height or the abrasion of the polishing tape 510 (resin layers 510c, 510c) becomes high.

That is, as shown in FIG. 7(a), when the central axis of the pressing shaft 521 is inclined by an angle θ with respect to the vertical axis VE, as shown in FIG. 7(b), while the angle θ is maintained, Since the minute protrusions α of the substrate BS abut against the polishing surface 510d of the polishing tape 510, the polishing tape 510 is brought into end contact, and the angle between the polishing tape 510 and the substrate BS becomes the angle θ, which is the maximum height that can be polished. It is larger than the thickness of the resin layer 510c, and the minute protrusions α cannot be polished to a desired height.

In addition, if the pressing shaft 521 is lowered to further the polishing, an excessive load is applied to the end portion (resin layer 510c) of the polishing tape 510, and as shown in Fig. 7(c), peeling of the resin layer 510C is caused. damaged.

Further, in the above embodiment, the micro protrusion polishing apparatus 500 that supports the polishing head 521b in a lower portion of the base member 521a is formed on the both sides, and the polishing tape 510 having the smooth surfaces 510e, 510e holding the polishing surface 510d on both sides is used. However, those which do not have smooth surfaces 510e, 510e (resin layers 510c, 510c) can be used as the polishing tape.

Further, in the above-described embodiment, the base end portion of the pressing shaft 521 is fixed to the slider 523 via the strain gauge 529, but the biasing shaft may be replaced by an elastic material such as a compression coil spring or a ring spring instead of the strain gauge 529. The base end of the 521 is fixed to the slider 523. In this case, the amount of compression is detected by a detecting means such as an limit sensor such that the amount of compression of the elastic member is constant, and the driving motor 526 is controlled based on the amount of compression.

On the other hand, in the polishing head 521b, the end portion (the pressing portion) of the polishing tape 510 is formed in a semi-cylindrical shape with the width direction (Y-axis direction) of the polishing tape 510 as an axis, but the pressing portion is also formed. The plurality of divided portions may be formed in a plurality of divisions in the width direction (Y-axis direction) of the polishing tape 510. Further, the pressing portions provided in the plurality of divisions may be formed in a hemispherical shape.

Fig. 8 shows an example in which the lower end pressing portion of the polishing tape 510 against the polishing head 521b is constituted by a plurality of hemispherical projections.

The polishing head 521b shown in FIG. 8 is formed into a flat surface on the lower surface 521e of the base 521d which is supported by the rocking portion under the base member 521a. On the lower surface 521e, the three hemispherical projections 521f are along the polishing tape 510. The width direction (Y-axis direction) is integrally formed at equal intervals, and two of the three hemispherical protrusions 521f are pressed against the smooth surfaces 510e and 510e of the polishing tape 510, and the central hemispherical protrusions 521f are The portion of the abrasive surface 510d is pressed.

As described above, by adopting the configuration in which the hemispherical projections 521f are pressed against the polishing tape 510, the contact area with the polishing tape 510 can be minimized, and the polishing head 521b and the polishing tape 510 which are caused by the transfer of the polishing tape 510 can be slowed down. The frictional resistance between the polishing belts 510 can be stably carried out to improve the polishing performance.

In the embodiment shown in Fig. 8, the three hemispherical projections 521f are height-adjusted and fixed to the lower surface 521e of the base 521d, but the front end can be formed into a hemispherical axis so as to be movable in the Z-axis direction with respect to the base 521d. .

Fig. 9 is a view showing an embodiment in which the above-described pressing portion is movable in the Z-axis direction, and is fixed at both ends of the lower surface 521e of the base 521d in the Y-axis direction and at portions opposite to the smooth surfaces 510e, 510e of the polishing tape 510. A hemispherical protrusion 521f is formed.

On the other hand, in the central portion of the lower surface 521e of the base 521d in the Y-axis direction, the portion facing the polishing surface 510d of the polishing tape 510 is hollowed out to form a cylindrical space 521g in the Z-axis direction. The space 521g is composed of a reduced diameter portion 521g1 on the lower side and an enlarged diameter portion 521g2 having an inner diameter larger than the upper side of the reduced diameter portion 521g1.

Further, a cylindrical shaft 521h having a diameter slightly smaller than the inner diameter of the reduced diameter portion 521g1 of the cylindrical space 521g is inserted into the reduced diameter portion 521g1, and a diameter larger than the inner diameter of the reduced diameter portion 521g1 is integrally provided on the proximal end side of the shaft 521h. The flange portion 521j having an inner diameter smaller than the diameter-enlarged portion 521g2 is disposed in the enlarged diameter portion 521g2.

Thereby, the shaft 521h can be supported to move relative to the base 521d in a direction away from the polishing tape 510 in a range in which the flange portion 521j is axially movable in the enlarged diameter portion 521g2.

The front end of the shaft 521h is formed in a hemispherical shape, and a coil spring 521i (elastic material) that presses the shaft 521h toward the polishing tape 510 is interposed between the bottom surface of the cylindrical space 521g and the end surface of the shaft 521h. .

According to the above configuration, the height of the three projections does not need to be finely adjusted with respect to the base 521d, and the central shaft 521h can be opposed to the microprotrusions α (protrusion defects) and the hemispherical projections 521f at both ends. The regions around the microprotrusions α are simultaneously pressed at the same time.

Further, as shown in FIG. 10, by adjusting the pressing force of the entire pressing shaft 521 and the pressing force of the shaft 521h by the coil spring 521i, the smoothing of the substrate BS by the smooth surface 510e of the polishing tape 510 can be individually adjusted. The force F1 and the pressing force F2 of the polishing surface 510d of the polishing tape 510 against the substrate BS can prevent the micro-protrusions α from being polished while preventing excessive polishing. Further, the pressing force (elastic tightening force) generated by the coil spring 521i is adjusted, and the polishing speed can be adjusted and the defect height of the polishing can be adjusted.

The manner in which the pressing force (elastic tightening force) generated by the coil spring 521i (elastic member) is adjusted is different from the manner in which the coil spring 521i is replaced with a plurality of types, and a mechanism for adjusting the contraction length of the spring is provided. the way.

For the mechanism for adjusting the length of the spring contraction, for example, the mechanism shown in Fig. 11 can be employed. In the example shown in FIG. 11, the disk-shaped spring pressure plate 531 having the same diameter as the flange portion 521j is provided in the enlarged diameter portion 521g2 so as to hold the coil spring 521i between the flange portions 521j. Further, the bolt 533 is fastened to the female screw portion 532 of the base 521d coaxially with the shaft 521h, and the front end of the bolt 533 abuts against the spring pressing plate 531.

According to the above configuration, as long as the bolt 533 is tightened so that the front end of the bolt 533 is lowered, the spring pressure plate 531 is lowered against the elastic force of the coil spring 521i, and the contraction length of the spring is shortened, and the flange portion 521j is pressed downward. Become stronger. On the other hand, as long as the bolt 533 is loosened so that the front end of the bolt 533 is raised, the spring pressure plate 531 is integrally raised with the bolt 533 due to the elastic force of the coil spring 521i, and the contraction length of the spring becomes long, and the flange portion 521j is relatively downward. The force of resistance weakens. Therefore, by adjusting the fastening position of the bolt 533, the pressing force of the shaft 521h generated by the coil spring 521i can be continuously changed.

Further, the bolt 533 may be manually fastened, or an actuator such as a motor may be used to fasten the bolt. By using the actuator, the pressing force of the shaft 521h can be automatically adjusted.

As a mechanism for adjusting the contraction length of the spring, the mechanism shown in Figs. 12(A) and (B) can be employed. In the example shown in Figs. 12(A) and (B), the lifting and lowering of the spring pressure plate 531 is performed by the cam 534.

That is, the cam 534 is rotatable in a direction orthogonal to the axial direction of the shaft 521h to be internally provided in the enlarged diameter portion 521g2, and the spring pressure plate 531 abuts against the cam surface of the cam 534 by the elastic force of the coil spring 521i ( Outside surface).

Here, by changing the rotation axis of the cam 534 to the spring pressure plate 531 by rotating the cam 534, the spring pressure plate 531 is changed in the axial direction of the shaft 521h, and the contraction length of the spring is changed, and the flange portion is oppositely The 521j's downward pressing force will change.

The rotation of the cam 534 can be performed manually by using a screw mechanism or the like, and an actuator such as a motor can be used, and the pressing force of the shaft 521h can be automatically adjusted by using the actuator.

Further, in order to prevent the polishing surface 510d from abutting on the substrate BS in the region where the micro protrusions α are not present on the substrate BS, the pressing force of the coil spring 521i is set to be pressed against the shaft 521h with a strength that is balanced with the tension of the polishing tape 510.

Further, the material of the shaft 521h is preferably the same as the material of the base 521d, and may be other materials than metals or metals. For example, the material of the shaft 521h may be stainless steel or quartz.

In addition, in order to reduce the frictional resistance between the shaft 521h and the inner peripheral surface (sliding surface) of the cylindrical space 521g, a material such as a fluororesin or a lanthanum resin having high slidability may be applied to the outer surface of the shaft 521h. .

In addition, when the pressing portion is provided in plural in the width direction (Y-axis direction) of the polishing tape 510, the shape of each pressing portion can be set such that the width direction (Y-axis direction) of the polishing tape 510 is the axis. The semi-cylindrical shape is not limited to the hemispherical portion, and the number of divisions is not limited to three. Therefore, two or more pressing portions (shafts 521h) that can be supported in the direction of being separated from the polishing tape 510 can be provided.

In addition, in order to further reduce the frictional resistance, for example, a material having high slidability such as a fluorine resin or a lanthanum resin may be applied to the end portion (the pressing portion) of the polishing head 521b formed of a metal material such as stainless steel or quartz.

100. . . Substrate correction device

200. . . Workbench

201. . . guide

300. . . X-axis frame

301. . . Foot

302. . . Beam

400. . . X-axis slide

401. . . guide

402. . . Ball screw

403. . . X-axis drive motor

500. . . Grinding device

501. . . Base plate

510. . . Grinding tape

510a. . . Ribbon substrate

510b. . . Abrasive layer

510c. . . Resin layer

510d. . . Grinding surface

510e. . . Smooth surface

520. . . Compressing mechanism

521. . . Abutment shaft

521a. . . Base member

521b. . . Grinding head

521c. . . Shake shaft

521d. . . Matrix

521e. . . Trench

521f. . . below

521g. . . Cylindrical space

521g1. . . Reduced diameter

521g2. . . Expansion section

521h. . . Cylindrical shaft

521i. . . Coil spring

521j. . . Flange

522. . . Mobile agency

523. . . Slide

524. . . guide

525. . . Ball screw

526. . . Drive motor

527. . . Encoder

528. . . Guide

529. . . Strain gage

530. . . Support

531. . . Spring plate

532. . . Female spiral

533. . . bolt

534. . . Cam

540. . . Observation mechanism (camera)

541. . . Observation optical system

541a. . . Object lens

541b. . . Half mirror

541c. . . Imaging lens

541d. . . CCD camera

541e. . . mirror

541f. . . Lighting source

542. . . Mobile agency

542a. . . Slide

542b. . . guide

542c. . . Drive motor

542d. . . Encoder

560. . . Belt transfer mechanism

561a, 561b, 561c, 561d. . . Rotary axis

562. . . Winding motor with take-up

562a. . . Rotary axis

563,564. . . Timing pulley

565. . . Timing belt

600. . . Control device

600a. . . Display device

BS. . . Substrate

R1, R2. . . Belt reel

α. . . Tiny protrusion

Fig. 1 is a perspective view showing a substrate correction device according to an embodiment of the present invention.

Fig. 2 is a front view showing a polishing apparatus according to an embodiment of the present invention.

Fig. 3 is a view showing a polishing tape according to an embodiment of the present invention, wherein (a) is a plan view, (b) is a cross-sectional view, and (c) is a cross-sectional view of another example.

Fig. 4 is a view showing a polishing head according to an embodiment of the present invention, wherein (a) is a front view and (b) is a side view.

Fig. 5 is a front view showing an observation optical system of an embodiment of the present invention.

Fig. 6 is a view for explaining a polishing operation according to an embodiment of the present invention, wherein (a) is before the start of polishing, (b) is the start of polishing, and (c) is a correlation diagram between the polishing head and the substrate at the end of polishing.

Fig. 7 is a view for explaining the polishing operation in the case where the polishing head is not shaken, (a) before the start of the polishing, (b) when the polishing is started, and (c) the polishing head and the substrate at the end of the polishing. Related diagrams.

Fig. 8 is a view showing an example in which the pressing portion of the polishing head is set to a hemispherical projection in the embodiment of the present invention, wherein (a) is a front view and (b) is a side view.

Fig. 9 is a side view showing an example in which the pressing portion of the polishing head is configured to be movable in the embodiment of the present invention.

Fig. 10 is a view for explaining an effect of an example in which the pressing portion of the polishing head is configured to be movable in the embodiment of the present invention.

Fig. 11 is a view showing an adjustment mechanism for a pressing force of a movable pressing portion in the embodiment of the present invention.

Figs. 12(A) and (B) are views showing an adjustment mechanism of a pressing force of a movable pressing portion in the embodiment of the present invention.

500‧‧‧ grinding device

501‧‧‧ seat board

510‧‧‧grinding tape

520‧‧‧Resistance mechanism

521‧‧‧Resistance shaft

522‧‧‧Mobile agencies

523‧‧‧Sliding parts

524‧‧‧rails

525‧‧‧Rolling screw

526‧‧‧Drive motor

527‧‧‧Encoder

528‧‧‧Guide

529‧‧‧ strain gauge

530‧‧‧Support

540‧‧‧observation agency (camera)

541‧‧‧Observation optical system

541a‧‧‧ object lens

541d‧‧‧CCD camera

541f‧‧‧Light source for illumination

542‧‧‧Mobile agencies

542a‧‧‧Sliding parts

542b. . . guide

542c. . . Drive motor

542d. . . Encoder

560. . . Belt transfer mechanism

561a, 561b, 561c, 561d. . . Rotary axis

562. . . Winding motor with take-up

562a. . . Rotary axis

563,564. . . Timing pulley

565. . . Timing belt

R1, R2. . . Belt reel

Claims (5)

A polishing apparatus comprising: a polishing head, wherein the polishing tape is pressed against the object to be polished, and the lower portion of the base member is swayed in an axis orthogonal to a width direction of the polishing tape; and a belt transfer mechanism for transferring a polishing tape wound around the polishing head; wherein the polishing tape is provided with smooth surfaces holding the polishing surface at both ends in the width direction, and the polishing surface and the smooth surface are The same surface or the smooth surface is recessed; the pressing portion of the polishing head that presses the polishing tape presses the smooth surface at both ends in the width direction of the polishing tape and the polishing surface against the object to be polished . The polishing apparatus according to claim 1, wherein the pressing portion of the polishing tape that presses the polishing head is formed in a semi-cylindrical shape with the width direction of the polishing tape as an axis. The polishing apparatus according to claim 1, wherein the pressing portion of the polishing tape that presses the polishing head is provided in plural in the width direction of the polishing tape. The polishing apparatus according to claim 1, wherein the pressing portion of the polishing tape that presses the polishing head is formed by a plurality of hemispherical projections arranged in the width direction of the polishing tape. The polishing apparatus of claim 3, wherein the at least one of the plurality of pressing portions is relative to the polishing belt The polishing head is supported by being movable in the separating direction, and the movably supported pressing portion is provided with an elastic member that is tightened toward the polishing tape.