TWI497170B - Light emitting device - Google Patents

Light emitting device Download PDF

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TWI497170B
TWI497170B TW102136250A TW102136250A TWI497170B TW I497170 B TWI497170 B TW I497170B TW 102136250 A TW102136250 A TW 102136250A TW 102136250 A TW102136250 A TW 102136250A TW I497170 B TWI497170 B TW I497170B
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light
disposed
illuminating
structures
illuminating device
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TW102136250A
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Chinese (zh)
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TW201514588A (en
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Cheng Yen Chen
Yun Li Li
Han Min Wu
Yi Ru Huang
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Genesis Photonics Inc
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Description

發光裝置Illuminating device

本發明關於一種發光裝置,尤指一種適用於微型化且高顯色能力設計之發光裝置。The invention relates to a light-emitting device, in particular to a light-emitting device suitable for miniaturization and high color rendering capability design.

由於現代科技的高速發展,在日常生活中,液晶顯示器(liquid crystal display,LCD)已經無所不在,從小尺寸的手機、數位相機,中尺寸的平板電腦、筆記型電腦,到大尺寸的液晶電視上,都可看到。一個液晶顯示器大體上可區分為兩部分,即較靠近使用者(或觀賞者)的液晶模組及後方的背光模組,背光模組的主要功能在於提供前方液晶模組一個高亮度及高均勻度的面光源。其中顯示器依畫面細緻程度不同,背光模組的光源部分可由數十萬至數百萬的畫素(pixel)所組成,而每一畫素又由三個次畫素組成,包含紅、綠、藍三個顏色。Due to the rapid development of modern technology, liquid crystal displays (LCDs) have become ubiquitous in daily life, from small-sized mobile phones, digital cameras, medium-sized tablets, notebook computers, to large-size LCD TVs. Can be seen. A liquid crystal display can be roughly divided into two parts, that is, a liquid crystal module closer to a user (or a viewer) and a backlight module at the rear. The main function of the backlight module is to provide a high brightness and high uniformity of the front liquid crystal module. Surface light source. The display is composed of hundreds of thousands to millions of pixels, and each pixel is composed of three sub-pixels, including red and green. Blue three colors.

目前較常使用作為背光模組的光源,有冷陰極管和發光二極體(light emitting diode,LED)。LED是一種利用磊晶成長技術及半導體材料製作的發光元件,具有體積小、壽命長、堅固耐用(不易摔破)、環保等諸多優點。一般而言,可直接配置紅、綠、藍三色的LED光源成一畫素,進而獲得較寬廣的色域,然而此種設計的尺寸無法微型化,因此將無法高密度的排列多個畫素以達到更為細膩的畫面;亦或者可直接將紅、綠、藍三色的螢光粉配置在可發出紫外光的LED上,再封裝成一個發光源,以發出白光。然而,當紅、綠、藍三色的LED配置在一個微小區域內時,鄰近的LED在激發螢光粉時便會相互干擾(crosstalk),而影響顯示器的顯色能力。At present, the light source used as a backlight module is often used, and there are a cold cathode tube and a light emitting diode (LED). LED is a kind of light-emitting element made by epitaxial growth technology and semiconductor material. It has many advantages such as small size, long life, sturdy and durable (not easy to break), and environmental protection. In general, LEDs of red, green, and blue colors can be directly configured into a single pixel to obtain a wider color gamut. However, the size of such a design cannot be miniaturized, so that multiple pixels cannot be arranged at a high density. In order to achieve a more delicate picture; or directly, the red, green and blue phosphors can be arranged on an LED that emits ultraviolet light, and then packaged into a light source to emit white light. However, when the red, green, and blue LEDs are disposed in a small area, adjacent LEDs will crosstalk when the phosphor is excited, which affects the color rendering capability of the display.

本發明提供一種適用於微型化設計且高顯色能力之發光裝置,以解決上述之問題。The present invention provides a light-emitting device suitable for miniaturization design and high color rendering capability to solve the above problems.

根據一實施例,本發明之發光裝置包括一發光模組、一光學模組、至少一第一波長轉換結構以及至少一第二波長轉換結構。發光模組包括一承載基板以及N個發光結構,其中N為一大於2之正整數。承載基板包括一第一表面以及一第二表面,第一表面與第二表面相對,且N個發光結構配置於第一表面上。光學模組包括一透明基板、N個透鏡結構以及N個透光開口。透明基板包括一第三表面以及一第四表面,第三表面與第四表面相對,N個透鏡結構配置於第三表面上,且N個透光開口分別對應N個透鏡結構配置於第四表面上。每一個發光結構對應N個透鏡結構的其中之一與N個透光開口的其中之一。光學模組與發光模組相對配置,使得第三表面面向第二表面,且第三表面與第二表面之間存在一間隙。至少一第一波長轉換結構配置於N個透光開口的其中至少之一上。至少一第二波長轉換結構配置於N個透光開口的其中至少另一上。According to an embodiment, a light emitting device of the present invention includes a light emitting module, an optical module, at least a first wavelength conversion structure, and at least a second wavelength conversion structure. The light emitting module includes a carrier substrate and N light emitting structures, wherein N is a positive integer greater than two. The carrier substrate includes a first surface and a second surface, the first surface is opposite to the second surface, and the N light emitting structures are disposed on the first surface. The optical module includes a transparent substrate, N lens structures, and N light transmissive openings. The transparent substrate includes a third surface and a fourth surface, the third surface is opposite to the fourth surface, the N lens structures are disposed on the third surface, and the N light transmissive openings are respectively disposed on the fourth surface corresponding to the N lens structures on. Each of the light emitting structures corresponds to one of the N lens structures and one of the N light transmissive openings. The optical module is disposed opposite the light emitting module such that the third surface faces the second surface, and a gap exists between the third surface and the second surface. The at least one first wavelength conversion structure is disposed on at least one of the N light transmissive openings. At least one second wavelength conversion structure is disposed on at least one of the N light transmissive openings.

較佳地,發光裝置更包括至少一第三波長轉換結構,配置於N個透光開口的其中至少另一上。Preferably, the light emitting device further comprises at least one third wavelength conversion structure disposed on at least one of the N light transmissive openings.

較佳地,N個發光結構發出紫外光,至少一第一波長轉換結構、至少一第二波長轉換結構及至少一第三波長轉換結構分別為至少一紅光轉換結構、至少一綠光轉換結構及至少一藍光轉換結構。Preferably, the N light emitting structures emit ultraviolet light, and the at least one first wavelength converting structure, the at least one second wavelength converting structure and the at least one third wavelength converting structure are respectively at least one red light converting structure and at least one green light converting structure. And at least one blue light conversion structure.

較佳地,N個發光結構發出藍光,N為一大於3之正整數,至少一第一波長轉換結構、至少一第二波長轉換結構及至少一第三波長轉換結構分別為至少一紅光轉換結構、至少一綠光轉換結構及至少一黃光轉換結構。Preferably, the N light emitting structures emit blue light, N is a positive integer greater than 3, and the at least one first wavelength converting structure, the at least one second wavelength converting structure, and the at least one third wavelength converting structure are respectively at least one red light converting a structure, at least one green light conversion structure, and at least one yellow light conversion structure.

較佳地,N個發光結構發出藍光,至少一第一波長轉換結構及至少一第二波長轉換結構分別為至少一紅光轉換結構及至少一綠光轉換結構,發光裝置更包括至少一散射結構,配置於N個透光開口的其中至少另一上。Preferably, the N light emitting structures emit blue light, and the at least one first wavelength converting structure and the at least one second wavelength converting structure are respectively at least one red light converting structure and at least one green light converting structure, and the light emitting device further comprises at least one scattering structure. And disposed on at least one of the N light-transmissive openings.

較佳地,光學模組更包括一吸光層,配置於透明基板上且覆蓋除 了N個透鏡結構與N個透光開口以外之區域。Preferably, the optical module further comprises a light absorbing layer disposed on the transparent substrate and covering N lens structures and regions other than N light transmissive openings.

綜上所述,本發明係將具有透鏡結構與透光開口之光學模組與發光模組相對配置,使光學模組與發光模組之間存在間隙,並且根據發光結構發出之光線類型於透光開口上配置對應的波長轉換結構。藉此,發光結構發出之光線可經由光學模組與發光模組之間的間隙進入透鏡結構,藉由透鏡結構將光線聚集至透光開口,光線再經由透光開口投射出,進而激發波長轉換結構,改變發光結構發出之光線的顏色。由於配置於透明基板上的吸光層覆蓋除了透鏡結構與透光開口以外之區域,可有效吸收鄰近的發光結構發出之雜散光,進而避免雜散光的相互干擾。由於波長轉換結構係配置於光學模組上,本發明可將多個發出同色光(例如,紫外光或藍光)的發光結構配置於同一個微小的承載基板上(例如,1mm*1mm),使得本發明之發光裝置適於微型化且高顯色能力之設計。In summary, the present invention is configured such that the optical module having the lens structure and the light-transmissive opening is disposed opposite to the light-emitting module, so that there is a gap between the optical module and the light-emitting module, and the type of light emitted according to the light-emitting structure is transparent. A corresponding wavelength conversion structure is disposed on the light opening. Thereby, the light emitted by the light emitting structure can enter the lens structure through the gap between the optical module and the light emitting module, and the light is collected by the lens structure to the light transmitting opening, and the light is projected through the light transmitting opening, thereby exciting the wavelength conversion. Structure that changes the color of the light emitted by the illuminating structure. Since the light absorbing layer disposed on the transparent substrate covers the area other than the lens structure and the light-transmissive opening, the stray light emitted by the adjacent light-emitting structure can be effectively absorbed, thereby preventing mutual interference of stray light. Since the wavelength conversion structure is disposed on the optical module, the present invention can arrange a plurality of light emitting structures emitting the same color light (for example, ultraviolet light or blue light) on the same tiny carrier substrate (for example, 1 mm*1 mm), so that The light-emitting device of the present invention is suitable for miniaturization and high color rendering capability.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

1、3、4、5、6、7‧‧‧發光裝置1, 3, 4, 5, 6, 7‧‧‧ illuminating devices

10‧‧‧發光模組10‧‧‧Lighting module

12‧‧‧光學模組12‧‧‧Optical module

14‧‧‧第一波長轉換結構14‧‧‧First wavelength conversion structure

16‧‧‧第二波長轉換結構16‧‧‧second wavelength conversion structure

18‧‧‧第三波長轉換結構18‧‧‧ Third wavelength conversion structure

20、20'‧‧‧底板20, 20'‧‧‧ bottom plate

22‧‧‧支撐件22‧‧‧Support

24‧‧‧保護層24‧‧‧Protective layer

40‧‧‧散射結構40‧‧‧scatter structure

100‧‧‧承載基板100‧‧‧bearing substrate

102、102'‧‧‧發光結構102, 102'‧‧‧Lighting structure

120‧‧‧透明基板120‧‧‧Transparent substrate

122‧‧‧透鏡結構122‧‧‧Lens structure

124‧‧‧透光開口124‧‧‧Light opening

126‧‧‧凹槽126‧‧‧ Groove

128‧‧‧吸光層128‧‧‧Light absorbing layer

130‧‧‧反射層130‧‧‧reflective layer

200‧‧‧電極墊對200‧‧‧electrode pad pair

202‧‧‧第一電極墊202‧‧‧First electrode pad

204‧‧‧第二電極墊204‧‧‧Second electrode pad

1020‧‧‧正極1020‧‧‧ positive

1020'‧‧‧第一電極1020'‧‧‧ first electrode

1022‧‧‧負極1022‧‧‧negative

1022'‧‧‧第二電極1022'‧‧‧second electrode

1024‧‧‧發光區1024‧‧‧Lighting area

2000‧‧‧正極電極墊2000‧‧‧positive electrode pad

2002‧‧‧負極電極墊2002‧‧‧Negative electrode pad

A‧‧‧光軸A‧‧‧ optical axis

D1‧‧‧開口面積D1‧‧‧opening area

D2‧‧‧底部面積D2‧‧‧ bottom area

G‧‧‧間隙G‧‧‧ gap

L‧‧‧光線L‧‧‧Light

S1‧‧‧第一表面S1‧‧‧ first surface

S2‧‧‧第二表面S2‧‧‧ second surface

S3‧‧‧第三表面S3‧‧‧ third surface

S4‧‧‧第四表面S4‧‧‧ fourth surface

第1圖為根據本發明第一實施例之發光裝置的示意圖。Fig. 1 is a schematic view of a light-emitting device according to a first embodiment of the present invention.

第2圖為第1圖中的發光結構配置於底板上的俯視圖。Fig. 2 is a plan view showing the light-emitting structure of Fig. 1 arranged on the bottom plate.

第3圖至第4圖為第1圖中的發光裝置的發光過程示意圖。3 to 4 are schematic views showing the light-emitting process of the light-emitting device of Fig. 1.

第5圖為根據本發明第二實施例之發光結構配置於底板上的俯視圖。Fig. 5 is a plan view showing a light-emitting structure disposed on a bottom plate according to a second embodiment of the present invention.

第6圖為根據本發明第三實施例之發光裝置的示意圖。Fig. 6 is a schematic view of a light-emitting device according to a third embodiment of the present invention.

第7圖為根據本發明第四實施例之發光裝置的示意圖。Figure 7 is a schematic view of a light-emitting device according to a fourth embodiment of the present invention.

第8圖為根據本發明第五實施例之發光裝置的示意圖。Figure 8 is a schematic view of a light-emitting device according to a fifth embodiment of the present invention.

第9圖為根據本發明第六實施例之發光裝置的示意圖。Figure 9 is a schematic view of a light-emitting device according to a sixth embodiment of the present invention.

第10圖為根據本發明第七實施例之發光裝置的示意圖。Figure 10 is a schematic view of a light-emitting device according to a seventh embodiment of the present invention.

第11圖為根據本發明第八實施例之多個發光模組以陣列形式配置於底 板上的俯視圖。Figure 11 is a diagram showing a plurality of light-emitting modules arranged in an array at the bottom according to the eighth embodiment of the present invention. Top view of the board.

請參閱第1圖以及第2圖,第1圖為根據本發明第一實施例之發光裝置1的示意圖,第2圖為第1圖中的發光結構102配置於底板20上的俯視圖。發光裝置1可作為顯示器之背光模組,但不以此為限。如第1圖所示,發光裝置1包括一發光模組10、一光學模組12、至少一第一波長轉換結構14、至少一第二波長轉換結構16、至少一第三波長轉換結構18、一底板20、複數個支撐件22以及一保護層24。1 and 2, FIG. 1 is a schematic view of a light-emitting device 1 according to a first embodiment of the present invention, and FIG. 2 is a plan view showing a light-emitting structure 102 of FIG. 1 disposed on a bottom plate 20. The illuminating device 1 can be used as a backlight module of the display, but is not limited thereto. As shown in FIG. 1 , the light-emitting device 1 includes a light-emitting module 10 , an optical module 12 , at least one first wavelength conversion structure 14 , at least one second wavelength conversion structure 16 , and at least a third wavelength conversion structure 18 . A bottom plate 20, a plurality of support members 22 and a protective layer 24.

發光模組10包括一承載基板100以及N個發光結構102,其中N為一大於2之正整數。承載基板100包括一第一表面S1以及一第二表面S2,其中第一表面S1與第二表面S2相對,且發光結構102配置於第一表面S1上。承載基板100可為藍寶石基板,但不以此為限。第1圖中繪示三個發光結構102(亦即,N=3)來說明本發明之技術特點,然而,本發明亦可以視實際需求於承載基板100上配置三個以上的發光結構102。此外,發光結構102可為發光二極體之磊晶結構。本發明可於一大片的承載基板上進行磊晶成長,以形成多個發光結構102,其中磊晶成長技術為習知技藝之人所熟知,在此不再贅述。接著,再以三個發光結構102為一個單位進行切割,而形成如第1圖所示之發光模組10。換言之,本發明可以不是將三個獨立的發光二極體晶片配置在承載基板100上,來形成發光模組10,將能達到發光模組10尺寸的微型化。The light emitting module 10 includes a carrier substrate 100 and N light emitting structures 102, wherein N is a positive integer greater than two. The carrier substrate 100 includes a first surface S1 and a second surface S2, wherein the first surface S1 is opposite to the second surface S2, and the light emitting structure 102 is disposed on the first surface S1. The carrier substrate 100 can be a sapphire substrate, but is not limited thereto. The three light-emitting structures 102 (that is, N=3) are illustrated in FIG. 1 to illustrate the technical features of the present invention. However, the present invention can also configure three or more light-emitting structures 102 on the carrier substrate 100 according to actual needs. In addition, the light emitting structure 102 can be an epitaxial structure of the light emitting diode. The present invention can perform epitaxial growth on a large number of carrier substrates to form a plurality of light emitting structures 102, wherein the epitaxial growth technique is well known to those skilled in the art and will not be described herein. Next, the three light-emitting structures 102 are cut in one unit to form the light-emitting module 10 as shown in FIG. In other words, the present invention can form the light-emitting module 10 instead of disposing three independent light-emitting diode wafers on the carrier substrate 100, and the miniaturization of the size of the light-emitting module 10 can be achieved.

光學模組12包括一透明基板120、N個透鏡結構122、N個透光開口124、N個凹槽126、一吸光層128以及一反射層130。於此實施例中,透鏡結構122、透光開口124與凹槽126的數量係與發光結構102的數量相對應,亦即N=3。透明基板120包括一第三表面S3以及一第四表面S4,其中第三表面S3與第四表面S4相對,透鏡結構122配置於第三表面S3上,且透光開口124分別對應透鏡結構122配置於第四表面S4上。於此實施例中, 凹槽126形成於第四表面S4上,且每一個透光開口124分別配置於對應的凹槽126中。透明基板120可由二氧化矽(SiO2 )、矽樹脂(silicone)、環氧樹脂(epoxy)或聚甲基丙烯酸甲酯(Polymethylmethacrylate,PMMA)製成,但不以此為限。因此,可藉由射出成型或壓模成型於透明基板120上一體成型上述之透鏡結構122與凹槽126。The optical module 12 includes a transparent substrate 120, N lens structures 122, N light transmissive openings 124, N grooves 126, a light absorbing layer 128, and a reflective layer 130. In this embodiment, the number of lens structures 122, light transmissive openings 124 and recesses 126 corresponds to the number of light emitting structures 102, that is, N=3. The transparent substrate 120 includes a third surface S3 and a fourth surface S4, wherein the third surface S3 is opposite to the fourth surface S4, the lens structure 122 is disposed on the third surface S3, and the light-transmitting openings 124 are respectively configured corresponding to the lens structure 122. On the fourth surface S4. In this embodiment, the grooves 126 are formed on the fourth surface S4, and each of the light-transmissive openings 124 is disposed in the corresponding groove 126. The transparent substrate 120 may be made of cerium oxide (SiO 2 ), silicone, epoxy or polymethylmethacrylate (PMMA), but is not limited thereto. Therefore, the lens structure 122 and the recess 126 can be integrally formed on the transparent substrate 120 by injection molding or compression molding.

光學模組12與發光模組10相對配置,使得第三表面S3面向第二表面S2,且第三表面S3與第二表面S2之間存在一間隙G。於此實施例中,發光模組10配置於底板20上且與底板20電連接。支撐件22連接透明基板120之第三表面S3與底板20,以將光學模組12支撐於發光模組10上方,使得第三表面S3與第二表面S2之間存在間隙G。在將光學模組12與發光模組10相對配置後,每一個發光結構102對應透鏡結構122的其中之一與透光開口124的其中之一。此外,每一個發光結構102配置於對應的透鏡結構122之光軸A上,使每一個發光結構102發出之光線L可沿光軸A進入對應的透鏡結構122。於此實施例中,三個透鏡結構122以非共平面的方式配置於透明基板120之第三表面S3上,使得三個透鏡結構122之光軸A相互不平行,藉此可以讓發光結構102更密集排列,使發光裝置1的尺寸可以再縮減。The optical module 12 is disposed opposite to the light emitting module 10 such that the third surface S3 faces the second surface S2, and a gap G exists between the third surface S3 and the second surface S2. In this embodiment, the light emitting module 10 is disposed on the bottom plate 20 and electrically connected to the bottom plate 20 . The support member 22 connects the third surface S3 of the transparent substrate 120 and the bottom plate 20 to support the optical module 12 above the light emitting module 10 such that a gap G exists between the third surface S3 and the second surface S2. After the optical module 12 and the light emitting module 10 are disposed opposite each other, each of the light emitting structures 102 corresponds to one of the lens structures 122 and one of the light transmitting openings 124. In addition, each of the light emitting structures 102 is disposed on the optical axis A of the corresponding lens structure 122 such that the light L emitted by each of the light emitting structures 102 can enter the corresponding lens structure 122 along the optical axis A. In this embodiment, the three lens structures 122 are disposed on the third surface S3 of the transparent substrate 120 in a non-coplanar manner such that the optical axes A of the three lens structures 122 are not parallel to each other, thereby allowing the light emitting structure 102 to be More densely arranged, the size of the light-emitting device 1 can be further reduced.

底板20可為電路板、鋁基板、FR4基板或其它基板。如第1圖所示,支撐件22與透明基板120可為一體成型,且支撐件22之一端可經由卡合、黏合、焊接、鉚接等固定方式連接底板20。需說明的是,支撐件22亦可為獨立元件,且支撐件22的兩端可分別經由卡合、黏合、焊接、鉚接等固定方式連接透明基板120之第三表面S3與底板20。The backplane 20 can be a circuit board, an aluminum substrate, an FR4 substrate, or other substrate. As shown in FIG. 1 , the support member 22 and the transparent substrate 120 may be integrally formed, and one end of the support member 22 may be connected to the bottom plate 20 by fastening, bonding, welding, riveting or the like. It should be noted that the support member 22 can also be a separate component, and the two ends of the support member 22 can be respectively connected to the third surface S3 and the bottom plate 20 of the transparent substrate 120 by means of snapping, bonding, soldering, riveting or the like.

如第2圖所示,每一個發光結構102均包括一正極1020及一負極1022,且底板20包括N對電極墊對200配置於上,其中每一電極墊對200包括一正極電極墊2000與一負極電極墊2002。於此實施例中,電極墊對200的數量係與發光結構102的數量相對應,亦即N=3。每一個發光結構102的正極1020和負極1022分別對應配置於底板20的正極電極墊2000及負極電 極墊2002上,使發光結構102與對應的電極墊對200形成電連接而發光。此外,每一發光結構102更包括一發光區1024,可以利用半導體製程如黃光、蝕刻等方式,將發光區1024以非共線的方式錯位配置於承載基板100之第一表面S1上,以降低鄰近的發光結構102發光時發生相互干擾(crosstalk)的現象。需說明的是,每一個發光結構102的正極1020、負極1022和發光區1024之間的位置關係為習知技藝之人所熟知,不以第2圖所繪示之實施例為限。As shown in FIG. 2, each of the light emitting structures 102 includes a positive electrode 1020 and a negative electrode 1022, and the bottom plate 20 includes an N-pair electrode pad pair 200 disposed thereon, wherein each of the electrode pad pairs 200 includes a positive electrode pad 2000 and A negative electrode pad 2002. In this embodiment, the number of electrode pad pairs 200 corresponds to the number of light emitting structures 102, that is, N=3. The positive electrode 1020 and the negative electrode 1022 of each of the light-emitting structures 102 respectively correspond to the positive electrode pad 2000 and the negative electrode disposed on the bottom plate 20 On the pole pad 2002, the light emitting structure 102 is electrically connected to the corresponding electrode pad pair 200 to emit light. In addition, each of the light-emitting structures 102 further includes a light-emitting region 1024. The light-emitting region 1024 can be dislocated in a non-collinear manner on the first surface S1 of the carrier substrate 100 by using a semiconductor process such as yellow light or etching. The phenomenon of crosstalk occurs when the adjacent light emitting structure 102 emits light. It should be noted that the positional relationship between the positive electrode 1020, the negative electrode 1022 and the light-emitting region 1024 of each of the light-emitting structures 102 is well known to those skilled in the art, and is not limited to the embodiment illustrated in FIG.

吸光層128配置於透明基板120上且覆蓋除了透鏡結構122、透光開口124與凹槽126以外之區域。反射層130配置於凹槽126上且覆蓋除了透光開口124以外之區域。吸光層128之吸收波段為可見光區或紫外光區,且材料可為深色的吸光塗料(例如,深色樹脂),而反射層130之材料可為反射率較佳之金屬(例如,銀)。保護層24配置於底板20與發光模組10上,以防止發光模組10之電極氧化及保護發光模組10。保護層24之材料可為矽樹脂或環氧樹脂等膠體,且藉由噴塗或壓模的方式形成於底板20與發光模組10上。The light absorbing layer 128 is disposed on the transparent substrate 120 and covers a region other than the lens structure 122, the light transmitting opening 124, and the groove 126. The reflective layer 130 is disposed on the recess 126 and covers a region other than the light-transmitting opening 124. The absorption band of the light absorbing layer 128 is a visible light region or an ultraviolet light region, and the material may be a dark light absorbing paint (for example, a dark resin), and the material of the reflective layer 130 may be a metal having a good reflectance (for example, silver). The protective layer 24 is disposed on the bottom plate 20 and the light emitting module 10 to prevent oxidation of the electrodes of the light emitting module 10 and protect the light emitting module 10. The material of the protective layer 24 may be a colloid such as a resin or an epoxy resin, and is formed on the bottom plate 20 and the light emitting module 10 by spraying or compression molding.

第一波長轉換結構14、第二波長轉換結構16及第三波長轉換結構18分別配置於三個凹槽126的其中之一內,且分別配置於三個透光開口124的其中之一上。於此實施例中,三個發光結構102皆可發出紫外光,因此,第一波長轉換結構14、第二波長轉換結構16及第三波長轉換結構18可分別為紅光轉換結構、綠光轉換結構及藍光轉換結構。第一波長轉換結構14、第二波長轉換結構16及第三波長轉換結構18可由透明膠體(例如,矽樹脂或環氧樹脂)分別與紅色螢光粉、綠色螢光粉及藍色螢光粉混合製成,並且以點膠或壓模的方式配置於對應的凹槽126內。此外,第一波長轉換結構14、第二波長轉換結構16及第三波長轉換結構18亦可為紅色螢光片、綠色螢光片及藍色螢光片,並且以黏貼的方式配置於對應的凹槽126內。The first wavelength conversion structure 14 , the second wavelength conversion structure 16 , and the third wavelength conversion structure 18 are respectively disposed in one of the three recesses 126 and are respectively disposed on one of the three light transmissive openings 124 . In this embodiment, the three light-emitting structures 102 can emit ultraviolet light. Therefore, the first wavelength conversion structure 14, the second wavelength conversion structure 16, and the third wavelength conversion structure 18 can respectively be a red light conversion structure and a green light conversion. Structure and blue light conversion structure. The first wavelength conversion structure 14, the second wavelength conversion structure 16, and the third wavelength conversion structure 18 may be made of a transparent colloid (for example, tantalum resin or epoxy resin) with red phosphor powder, green phosphor powder, and blue phosphor powder, respectively. It is made by mixing and is disposed in the corresponding groove 126 by dispensing or compression molding. In addition, the first wavelength conversion structure 14 , the second wavelength conversion structure 16 , and the third wavelength conversion structure 18 may also be red fluorescent patches, green fluorescent patches, and blue fluorescent patches, and are disposed in a corresponding manner in a corresponding manner. Inside the recess 126.

請參閱第3圖至第4圖,第3圖至第4圖為第1圖中的發光裝置 1的發光過程示意圖。如第1圖與第3圖所示,當發光結構102被驅動發光時,發光結構102發出之光線L可經由光學模組12與發光模組10之間的間隙G沿光軸A進入對應的透鏡結構122。接著,如第4圖所示,由於透鏡結構122具有光線匯集功能,因此透鏡結構122可將光線L各別聚集至對應的透光開口124。最後,光線L再經由透光開口124投射出,進而激發第一波長轉換結構14、第二波長轉換結構16及第三波長轉換結構18,而發出紅光、綠光及藍光,藉由複數光色來達到高出光效率的顯色能力。再者,由於光線L經由不同透光開口124發出複數光色,因此光色間的相互干擾將大幅減少。配置於透明基板120上的吸光層128覆蓋除了透鏡結構122、透光開口124與凹槽126以外之區域,吸光層128可有效吸收鄰近的發光結構102發出之雜散光,進而避免雜散光的相互干擾。此外,每一個透光開口124之開口面積D1可小於對應的透鏡結構122之底部面積D2,以避免雜散光的相互干擾。再者,配置於凹槽126上的反射層130可將部分打在凹槽126周圍的光線反射,進而增加發光裝置1的整體出光效率。由於第一波長轉換結構14、第二波長轉換結構16及第三波長轉換結構18係配置於光學模組12上,本發明可將多個發出同色光(例如,紫外光)的發光結構102配置於同一個微小的承載基板100上(例如,1mm*1mm),使得本發明之發光裝置1適於微型化且高顯色能力之設計。Please refer to FIG. 3 to FIG. 4 , and FIG. 3 to FIG. 4 are the light-emitting devices in FIG. 1 . A schematic diagram of the illuminating process of 1. As shown in FIG. 1 and FIG. 3 , when the light emitting structure 102 is driven to emit light, the light L emitted by the light emitting structure 102 can enter the corresponding optical axis A via the gap G between the optical module 12 and the light emitting module 10 . Lens structure 122. Next, as shown in FIG. 4, since the lens structure 122 has a light collecting function, the lens structure 122 can collect the light rays L to the corresponding light transmitting openings 124, respectively. Finally, the light L is further projected through the light-transmitting opening 124, thereby exciting the first wavelength conversion structure 14, the second wavelength conversion structure 16, and the third wavelength conversion structure 18, and emitting red light, green light, and blue light by using multiple light. Color to achieve high light-emitting efficiency. Moreover, since the light L emits a plurality of light colors through the different light-transmissive openings 124, the mutual interference between the light colors is greatly reduced. The light absorbing layer 128 disposed on the transparent substrate 120 covers the area other than the lens structure 122, the light transmitting opening 124 and the groove 126, and the light absorbing layer 128 can effectively absorb the stray light emitted by the adjacent light emitting structure 102, thereby preventing mutual stray light. interference. In addition, the opening area D1 of each of the light-transmitting openings 124 may be smaller than the bottom area D2 of the corresponding lens structure 122 to avoid mutual interference of stray light. Moreover, the reflective layer 130 disposed on the recess 126 can reflect a portion of the light that is struck around the recess 126, thereby increasing the overall light extraction efficiency of the light-emitting device 1. Since the first wavelength conversion structure 14 , the second wavelength conversion structure 16 , and the third wavelength conversion structure 18 are disposed on the optical module 12 , the present invention can configure a plurality of light emitting structures 102 that emit light of the same color (eg, ultraviolet light). On the same minute carrier substrate 100 (for example, 1 mm * 1 mm), the light-emitting device 1 of the present invention is suitable for miniaturization and high color rendering capability.

於此實施例中,三個發光結構102各自的發光區1024之發光面積可相同或相異,三個透光開口124之開口面積D1可相同或相異,且三個透鏡結構122之數值孔徑(numerical aperture,NA)可相同或相異。換言之,本發明可根據所需的出光效率及出光效果來調整發光結構102各自的發光區1024之發光面積、透光開口124之開口面積D1及/或透鏡結構122之數值孔徑。於此實施例中,三個發光結構102皆可發出紫外光,且紫外光對藍光轉換結構的激發效率最好,對綠光轉換結構的激發效率次之,對紅光轉換結構的激發效率最差。若三個發光結構102各自的發光區1024之發光面積相同, 則對應藍光轉換結構、綠光轉換結構及紅光轉換結構的三個透光開口124之開口面積D1的比例可為0.5:0.7:1。若三個透光開口124之開口面積D1相同,則對應藍光轉換結構、綠光轉換結構及紅光轉換結構的三個發光結構102各自的發光區1024之發光面積的比例可為0.5:0.7:1,藉此將可使光色更為均勻,不會偏重於某一出光色。In this embodiment, the light-emitting areas of the light-emitting regions 1024 of the three light-emitting structures 102 may be the same or different, and the open areas D1 of the three light-transmitting openings 124 may be the same or different, and the numerical apertures of the three lens structures 122. (numerical aperture, NA) may be the same or different. In other words, the present invention can adjust the light-emitting area of the light-emitting region 1024 of each of the light-emitting structures 102, the opening area D1 of the light-transmitting opening 124, and/or the numerical aperture of the lens structure 122 according to the required light-emitting efficiency and light-emitting effect. In this embodiment, all of the three light emitting structures 102 can emit ultraviolet light, and the ultraviolet light has the best excitation efficiency for the blue light conversion structure, the second is the excitation efficiency for the green light conversion structure, and the most efficient for the red light conversion structure. difference. If the light-emitting areas of the light-emitting regions 1024 of the three light-emitting structures 102 are the same, The ratio of the opening area D1 of the three light-transmissive openings 124 corresponding to the blue light conversion structure, the green light conversion structure and the red light conversion structure may be 0.5:0.7:1. If the opening areas D1 of the three light-transmitting openings 124 are the same, the ratio of the light-emitting areas of the light-emitting areas 1024 of the three light-emitting structures 102 corresponding to the blue light-converting structure, the green light-converting structure, and the red light-converting structure may be 0.5:0.7: 1, this will make the light color more uniform, and will not be biased towards a certain light color.

配合第2圖,請參閱第5圖,第5圖為根據本發明第二實施例之發光結構102'配置於底板20'上的俯視圖。發光結構120'與上述的發光結構120的主要不同之處在於,每一發光結構120'包括一個第一電極1020'及一個與第一電極1020'電性相反且與其他發光結構120'共用的第二電極1022',而底板20'與上述的底板20的主要不同之處在於,底板20'包括N個第一電極墊202和一個與N個第一電極墊202電性相反的第二電極墊204。於此實施例中,第一電極墊202的數量係與發光結構102的數量相對應,亦即N=3。如第5圖所示,該些發光結構102'的第一電極1020'和共用的第二電極1022'分別對應配置於底板20'的第一電極墊202及第二電極墊204上,使發光結構102'與第一、第二電極墊202、204形成電連接而發光。於此實施例中,第一電極1020'、第一電極墊202可為正極,且第二電極1022'、第二電極墊204可為負極。此種設計除了可以讓發光結構102'排列更密集,使得發光裝置1的尺寸可以再縮減外,還可以減少製程成本和避免複雜的電路設計。需說明的是,第5圖中與第2圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。此外,每一個發光結構102'的第一電極1020'、第二電極1022'和發光區1024之間的位置關係為習知技藝之人所熟知,不以第5圖所繪示之實施例為限。Referring to FIG. 2, please refer to FIG. 5. FIG. 5 is a plan view showing the light emitting structure 102' disposed on the bottom plate 20' according to the second embodiment of the present invention. The main difference between the light emitting structure 120 ′ and the light emitting structure 120 described above is that each of the light emitting structures 120 ′ includes a first electrode 1020 ′ and one electrically opposite to the first electrode 1020 ′ and shared with other light emitting structures 120 ′. The second electrode 1022' is different from the bottom plate 20 described above in that the bottom plate 20' includes N first electrode pads 202 and a second electrode electrically opposite to the N first electrode pads 202. Pad 204. In this embodiment, the number of first electrode pads 202 corresponds to the number of light emitting structures 102, that is, N=3. As shown in FIG. 5, the first electrode 1020' and the common second electrode 1022' of the light-emitting structure 102' are respectively disposed on the first electrode pad 202 and the second electrode pad 204 of the bottom plate 20' to cause light emission. The structure 102' is electrically connected to the first and second electrode pads 202, 204 to emit light. In this embodiment, the first electrode 1020 ′, the first electrode pad 202 can be a positive electrode, and the second electrode 1022 ′ and the second electrode pad 204 can be a negative electrode. In addition to allowing the light-emitting structure 102' to be more densely arranged, such a design allows the size of the light-emitting device 1 to be further reduced, and also reduces process cost and avoids complicated circuit design. It should be noted that the components of the same reference numerals as those shown in FIG. 2 are substantially the same, and will not be described again. In addition, the positional relationship between the first electrode 1020', the second electrode 1022' and the light-emitting region 1024 of each of the light-emitting structures 102' is well known to those skilled in the art, and the embodiment not shown in FIG. limit.

配合第1圖,請參閱第6圖,第6圖為根據本發明第三實施例之發光裝置3的示意圖。發光裝置3與上述的發光裝置1的主要不同之處在於,發光裝置3之支撐件22連接透明基板120之第三表面S3與承載基板100之第二表面S2,以將光學模組12支撐於發光模組10上方,使得第三表面S3 與第二表面S2之間存在間隙G。換言之,本發明可選擇性地將支撐件22連接於承載基板100之第二表面S2或將支撐件22連接於上述之底板20,視實際應用而定。需說明的是,第6圖中與第1圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。Referring to Fig. 1, reference is made to Fig. 6, which is a schematic view of a light-emitting device 3 according to a third embodiment of the present invention. The main difference between the illuminating device 3 and the illuminating device 1 is that the supporting member 22 of the illuminating device 3 connects the third surface S3 of the transparent substrate 120 and the second surface S2 of the carrying substrate 100 to support the optical module 12 Above the light emitting module 10, so that the third surface S3 There is a gap G between the second surface S2 and the second surface S2. In other words, the present invention can selectively connect the support member 22 to the second surface S2 of the carrier substrate 100 or connect the support member 22 to the bottom plate 20 as described above, depending on the application. It should be noted that the components of the same reference numerals as those shown in FIG. 1 are substantially the same, and will not be described again.

配合第1圖,請參閱第7圖,第7圖為根據本發明第四實施例之發光裝置4的示意圖。發光裝置4與上述的發光裝置1的主要不同之處在於,發光裝置4之發光結構102發出藍光。當發光結構102發出藍光時,便不需藉由藍光轉換結構來激發出藍光。而發光裝置4更可包括至少一散射結構40,配置於透光開口124的其中至少另一上,以取代上述之第三波長轉換結構18,但可選擇性配置,並不限於此。此時,可藉由散射結構40將發光結構102發出的藍光散射,以增大出光角度。散射結構40可由二氧化鈦(TiO2 )、矽樹脂或其它微細粒子構成。需說明的是,第7圖中與第1圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。Referring to Fig. 1, reference is made to Fig. 7, which is a schematic view of a light-emitting device 4 according to a fourth embodiment of the present invention. The main difference between the light-emitting device 4 and the above-described light-emitting device 1 is that the light-emitting structure 102 of the light-emitting device 4 emits blue light. When the light emitting structure 102 emits blue light, it is not necessary to excite blue light by the blue light converting structure. The light-emitting device 4 further includes at least one scattering structure 40 disposed on at least one of the light-transmitting openings 124 instead of the third wavelength-converting structure 18 described above, but is selectively configurable, and is not limited thereto. At this time, the blue light emitted by the light emitting structure 102 can be scattered by the scattering structure 40 to increase the light exit angle. The scattering structure 40 may be composed of titanium dioxide (TiO 2 ), ruthenium resin or other fine particles. It should be noted that the components of the same reference numerals as those shown in FIG. 1 have substantially the same operation principle, and are not described herein again.

配合第7圖,請參閱第8圖,第8圖為根據本發明第五實施例之發光裝置5的示意圖。發光裝置5與上述的發光裝置4的主要不同之處在於,發光裝置5包括四個發光結構102、第一波長轉換結構14、第二波長轉換結構16、及第三波長轉換結構18,其中發光結構102發出藍光,且第一波長轉換結構14、第二波長轉換結構16及第三波長轉換結構18分別為紅光轉換結構、綠光轉換結構及黃光轉換結構。換言之,此實施例係利用第一波長轉換結構14、第二波長轉換結構16及第三波長轉換結構18分別將發光結構102發出的藍光激發成紅光、綠光及黃光,再搭配發光結構102發出的藍光散射出,即可藉由紅光、綠光、藍光及黃光調配出所欲的光線顏色,將可使出光色更為飽和。其中發光裝置5更可包括一散射結構40,可搭配發光結構102發出的藍光,使藍光出光角度可以更大,但可選擇性配置,並不限於此。需說明的是,第8圖中與第7圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。Referring to Fig. 7, reference is made to Fig. 8, which is a schematic view of a light-emitting device 5 according to a fifth embodiment of the present invention. The main difference between the illuminating device 5 and the illuminating device 4 described above is that the illuminating device 5 includes four illuminating structures 102, a first wavelength converting structure 14, a second wavelength converting structure 16, and a third wavelength converting structure 18, wherein the illuminating device 5 The structure 102 emits blue light, and the first wavelength conversion structure 14, the second wavelength conversion structure 16, and the third wavelength conversion structure 18 are a red light conversion structure, a green light conversion structure, and a yellow light conversion structure, respectively. In other words, the first wavelength conversion structure 14 , the second wavelength conversion structure 16 , and the third wavelength conversion structure 18 respectively excite the blue light emitted by the light emitting structure 102 into red light, green light, and yellow light, and then cooperate with the light emitting structure. The blue light emitted by 102 is scattered, and the desired color of the light can be modulated by red, green, blue, and yellow light, which will make the light color more saturated. The light-emitting device 5 further includes a scattering structure 40, which can be matched with the blue light emitted by the light-emitting structure 102, so that the light-emitting angle of the blue light can be larger, but can be selectively configured, and is not limited thereto. It should be noted that the components of the same reference numerals as those shown in FIG. 8 have substantially the same operation principle, and are not described herein again.

配合第1圖,請參閱第9圖,第9圖為根據本發明第六實施例之發光裝置6的示意圖。發光裝置6與上述的發光裝置1的主要不同之處在於,發光裝置6之光學模組10不包括上述之凹槽126及反射層130。因此,透光開口124係直接配置於透明基板120之第四表面S4上,且吸光層128覆蓋除了透鏡結構122與透光開口124以外之區域。換言之,本發明可選擇性地將透光開口124直接配置於透明基板120之第四表面S4上,或於透明基板120之第四表面S4上形成上述之凹槽126,再將透光開口124配置於凹槽126中,視實際應用而定。需說明的是,第9圖中與第1圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。Referring to Fig. 1, reference is made to Fig. 9, which is a schematic view of a light-emitting device 6 according to a sixth embodiment of the present invention. The main difference between the illuminating device 6 and the above illuminating device 1 is that the optical module 10 of the illuminating device 6 does not include the above-mentioned groove 126 and reflective layer 130. Therefore, the light-transmitting opening 124 is directly disposed on the fourth surface S4 of the transparent substrate 120, and the light-absorbing layer 128 covers a region other than the lens structure 122 and the light-transmitting opening 124. In other words, the present invention can selectively dispose the light-transmissive opening 124 directly on the fourth surface S4 of the transparent substrate 120, or form the above-mentioned groove 126 on the fourth surface S4 of the transparent substrate 120, and then the transparent opening 124. It is disposed in the recess 126 depending on the actual application. It should be noted that the components of the same reference numerals as those shown in FIG. 1 in FIG. 9 have substantially the same principle of operation, and are not described herein again.

配合第1圖,請參閱第10圖,第10圖為根據本發明第七實施例之發光裝置7的示意圖。發光裝置7與上述的發光裝置1的主要不同之處在於,發光裝置7之三個透鏡結構122之光軸A相互平行,使得每一個發光結構102配置於對應的透鏡結構122的正下方,對於出光具有指向性的發光結構102,發光裝置7將會有較佳的亮度。換言之,本發明可根據發光結構102的配置位置調整每一個透鏡結構122之光軸A的傾斜角度,以使每一個發光結構102皆可配置於對應的透鏡結構122之光軸A上,使進入透鏡結構122的光線L入光效率高。需說明的是,第10圖中與第1圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。Referring to Fig. 1, reference is made to Fig. 10, which is a schematic view of a light-emitting device 7 according to a seventh embodiment of the present invention. The main difference between the illuminating device 7 and the illuminating device 1 described above is that the optical axes A of the three lens structures 122 of the illuminating device 7 are parallel to each other such that each of the illuminating structures 102 is disposed directly below the corresponding lens structure 122. The light-emitting structure 102 having the directivity of the light-emitting device 7 will have a better brightness. In other words, the present invention can adjust the tilt angle of the optical axis A of each lens structure 122 according to the arrangement position of the light emitting structure 102, so that each of the light emitting structures 102 can be disposed on the optical axis A of the corresponding lens structure 122, so as to enter The light L of the lens structure 122 has a high light-in efficiency. It should be noted that the components of the same reference numerals as those shown in FIG. 1 are substantially the same, and will not be described again.

配合第2圖,請參閱第11圖,第11圖為根據本發明第八實施例之多個發光模組10以陣列形式配置於底板20上的俯視圖。如第11圖所示,本發明可將多個發光模組10以陣列形式配置於單一的底板20上,以進行陣列式出光。需說明的是,本發明亦可將多個透鏡結構122以及多個透光開口124以陣列形式配置於單一的透明基板120上,再藉由多個支撐件22於適當位置處連接透明基板120與底板20,以增進組裝效率。Referring to FIG. 2, referring to FIG. 11, FIG. 11 is a plan view showing a plurality of light-emitting modules 10 arranged in an array on the bottom plate 20 according to the eighth embodiment of the present invention. As shown in FIG. 11, the present invention can arrange a plurality of light-emitting modules 10 in an array on a single bottom plate 20 for array light-emitting. It should be noted that, in the present invention, the plurality of lens structures 122 and the plurality of light-transmissive openings 124 may be arranged in an array on the single transparent substrate 120, and the transparent substrate 120 may be connected at an appropriate position by the plurality of support members 22. With the bottom plate 20 to improve assembly efficiency.

綜上所述,本發明係將具有透鏡結構與透光開口之光學模組與發光模組相對配置,使光學模組與發光模組之間存在間隙,並且根據發光結構 發出之光線類型於透光開口上配置對應的波長轉換結構。藉此,發光結構發出之光線可經由光學模組與發光模組之間的間隙進入透鏡結構,藉由透鏡結構將光線聚集至透光開口,光線再經由透光開口投射出,進而激發波長轉換結構,改變發光結構發出之光線的顏色。由於配置於透明基板上的吸光層覆蓋除了透鏡結構與透光開口以外之區域,可有效吸收鄰近的發光結構發出之雜散光,進而避免雜散光的相互干擾。由於波長轉換結構係配置於光學模組上,本發明可將多個發出同色光(例如,紫外光或藍光)的發光結構配置於同一個微小的承載基板上(例如,1mm*1mm),使得本發明之發光裝置適於微型化且高顯色能力之設計。In summary, the present invention is configured such that the optical module having the lens structure and the light-transmissive opening is disposed opposite to the light-emitting module, so that there is a gap between the optical module and the light-emitting module, and according to the light-emitting structure The emitted light type is configured with a corresponding wavelength conversion structure on the light-transmissive opening. Thereby, the light emitted by the light emitting structure can enter the lens structure through the gap between the optical module and the light emitting module, and the light is collected by the lens structure to the light transmitting opening, and the light is projected through the light transmitting opening, thereby exciting the wavelength conversion. Structure that changes the color of the light emitted by the illuminating structure. Since the light absorbing layer disposed on the transparent substrate covers the area other than the lens structure and the light-transmissive opening, the stray light emitted by the adjacent light-emitting structure can be effectively absorbed, thereby preventing mutual interference of stray light. Since the wavelength conversion structure is disposed on the optical module, the present invention can arrange a plurality of light emitting structures emitting the same color light (for example, ultraviolet light or blue light) on the same tiny carrier substrate (for example, 1 mm*1 mm), so that The light-emitting device of the present invention is suitable for miniaturization and high color rendering capability.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1‧‧‧發光裝置1‧‧‧Lighting device

10‧‧‧發光模組10‧‧‧Lighting module

12‧‧‧光學模組12‧‧‧Optical module

14‧‧‧第一波長轉換結構14‧‧‧First wavelength conversion structure

16‧‧‧第二波長轉換結構16‧‧‧second wavelength conversion structure

18‧‧‧第三波長轉換結構18‧‧‧ Third wavelength conversion structure

20‧‧‧底板20‧‧‧floor

22‧‧‧支撐件22‧‧‧Support

24‧‧‧保護層24‧‧‧Protective layer

100‧‧‧承載基板100‧‧‧bearing substrate

102‧‧‧發光結構102‧‧‧Lighting structure

120‧‧‧透明基板120‧‧‧Transparent substrate

122‧‧‧透鏡結構122‧‧‧Lens structure

124‧‧‧透光開口124‧‧‧Light opening

126‧‧‧凹槽126‧‧‧ Groove

128‧‧‧吸光層128‧‧‧Light absorbing layer

130‧‧‧反射層130‧‧‧reflective layer

A‧‧‧光軸A‧‧‧ optical axis

D1‧‧‧開口面積D1‧‧‧opening area

D2‧‧‧底部面積D2‧‧‧ bottom area

G‧‧‧間隙G‧‧‧ gap

L‧‧‧光線L‧‧‧Light

S1‧‧‧第一表面S1‧‧‧ first surface

S2‧‧‧第二表面S2‧‧‧ second surface

S3‧‧‧第三表面S3‧‧‧ third surface

S4‧‧‧第四表面S4‧‧‧ fourth surface

Claims (24)

一種發光裝置,包括:一發光模組,包括一承載基板以及N個發光結構,N為一大於2之正整數,該承載基板包括一第一表面以及一第二表面,該第一表面與該第二表面相對,該N個發光結構配置於該第一表面上;一光學模組,包括一透明基板、N個透鏡結構以及N個透光開口,該透明基板包括一第三表面以及一第四表面,該第三表面與該第四表面相對,該N個透鏡結構配置於該第三表面上,該N個透光開口分別對應該N個透鏡結構配置於該第四表面上,每一該發光結構對應該N個透鏡結構的其中之一與該N個透光開口的其中之一,該光學模組與該發光模組相對配置,使得該第三表面面向該第二表面,且該第三表面與該第二表面之間存在一間隙;至少一第一波長轉換結構,配置於該N個透光開口的其中至少之一上;以及至少一第二波長轉換結構,配置於該N個透光開口的其中至少另一上。A light-emitting device includes: a light-emitting module, comprising a carrier substrate and N light-emitting structures, wherein N is a positive integer greater than 2, the carrier substrate includes a first surface and a second surface, the first surface and the first surface Opposite the second surface, the N light emitting structures are disposed on the first surface; an optical module includes a transparent substrate, N lens structures, and N light transmissive openings, the transparent substrate including a third surface and a first surface a fourth surface, the third surface is opposite to the fourth surface, the N lens structures are disposed on the third surface, and the N light transmissive openings are respectively disposed on the fourth surface corresponding to the N lens structures, each The light emitting structure corresponds to one of the N lens structures and one of the N light transmissive openings, and the optical module is disposed opposite to the light emitting module such that the third surface faces the second surface, and the a gap exists between the third surface and the second surface; at least one first wavelength conversion structure is disposed on at least one of the N light-transmissive openings; and at least one second wavelength conversion structure is disposed on the N Light through At least one of the other ones. 如請求項1所述之發光裝置,其中該發光裝置更包括至少一第三波長轉換結構,配置於該N個透光開口的其中至少另一上。The illuminating device of claim 1, wherein the illuminating device further comprises at least one third wavelength converting structure disposed on at least one of the N light transmissive openings. 如請求項2所述之發光裝置,其中該N個發光結構發出紫外光,該至少一第一波長轉換結構、該至少一第二波長轉換結構及該至少一第三波長轉換結構分別為至少一紅光轉換結構、至少一綠光轉換結構及至少一藍光轉換結構。The illuminating device of claim 2, wherein the N illuminating structures emit ultraviolet light, and the at least one first wavelength converting structure, the at least one second wavelength converting structure, and the at least one third wavelength converting structure are respectively at least one a red light conversion structure, at least one green light conversion structure, and at least one blue light conversion structure. 如請求項2所述之發光裝置,其中該N個發光結構發出藍光,N為一大於3之正整數,該至少一第一波長轉換結構、該至少一第二波長轉換結構及該至少一第三波長轉換結構分別為至少一紅光轉換結構、至少一綠光轉換結構及至少一黃光轉換結構。The illuminating device of claim 2, wherein the N illuminating structures emit blue light, N is a positive integer greater than 3, the at least one first wavelength converting structure, the at least one second wavelength converting structure, and the at least one The three-wavelength conversion structure is respectively at least one red light conversion structure, at least one green light conversion structure, and at least one yellow light conversion structure. 如請求項1所述之發光裝置,其中該N個發光結構發出藍光,該至少一第一波長轉換結構及該至少一第二波長轉換結構分別為至少一紅光轉換結構及至少一綠光轉換結構,該發光裝置更包括至少一散射結構,配置於該N個透光開口的其中至少另一上。The illuminating device of claim 1, wherein the N illuminating structures emit blue light, and the at least one first wavelength converting structure and the at least one second wavelength converting structure are respectively at least one red light converting structure and at least one green light converting The light emitting device further includes at least one scattering structure disposed on at least one of the N light transmissive openings. 如請求項1所述之發光裝置,其中該N個發光結構各包括一發光區,各該發光區之發光面積相異。The illuminating device of claim 1, wherein the N illuminating structures each comprise a illuminating area, and the illuminating areas of the illuminating areas are different. 如請求項1所述之發光裝置,其中該N個透光開口之開口面積相異。The illuminating device of claim 1, wherein the opening areas of the N light-transmissive openings are different. 如請求項1所述之發光裝置,其中該N個透鏡結構之數值孔徑相異。The illuminating device of claim 1, wherein the numerical apertures of the N lens structures are different. 如請求項1所述之發光裝置,其中該N個發光結構各包括一發光區,各該發光區以非共線的方式配置於該第一表面上。The illuminating device of claim 1, wherein the N illuminating structures each comprise a illuminating region, and each of the illuminating regions is disposed on the first surface in a non-collinear manner. 如請求項1所述之發光裝置,其中該N個透鏡結構以非共平面的方式配置於該第三表面上。The illuminating device of claim 1, wherein the N lens structures are disposed on the third surface in a non-coplanar manner. 如請求項1所述之發光裝置,其中該光學模組更包括一吸光層,配置於該透明基板上且覆蓋除了該N個透鏡結構與該N個透光開口以外之區域。The illuminating device of claim 1, wherein the optical module further comprises a light absorbing layer disposed on the transparent substrate and covering an area other than the N lens structures and the N light transmissive openings. 如請求項1所述之發光裝置,其中該光學模組更包括N個凹槽,形成於該第四表面上,每一該透光開口分別配置於該N個凹槽中,該至少一第一波長轉換結構及該至少一第二波長轉換結構分別配置於該N個凹槽的其中至少之一內。The illuminating device of claim 1, wherein the optical module further comprises N grooves formed on the fourth surface, each of the transparent openings being respectively disposed in the N grooves, the at least one A wavelength conversion structure and the at least one second wavelength conversion structure are respectively disposed in at least one of the N grooves. 如請求項12所述之發光裝置,其中該光學模組更包括一吸光層以及一反射層,該吸光層配置於該透明基板上且覆蓋除了該N個透鏡結構與該N個凹槽以外之區域,該反射層配置於該N個凹槽上且覆蓋除了該N個透光開口以外之區域。The illuminating device of claim 12, wherein the optical module further comprises a light absorbing layer and a reflective layer disposed on the transparent substrate and covering the N lens structures and the N grooves The reflective layer is disposed on the N grooves and covers a region other than the N light-transmissive openings. 如請求項1所述之發光裝置,其中每一該透光開口之開口面積小於對應的該透鏡結構之底部面積。The illuminating device of claim 1, wherein an opening area of each of the light-transmitting openings is smaller than a bottom area of the corresponding lens structure. 如請求項1所述之發光裝置,其中每一該發光結構配置於對應的該透鏡 結構之光軸上。The illuminating device of claim 1, wherein each of the illuminating structures is disposed on the corresponding lens On the optical axis of the structure. 如請求項15所述之發光裝置,其中該N個透鏡結構之光軸相互不平行。The illuminating device of claim 15, wherein the optical axes of the N lens structures are not parallel to each other. 如請求項1所述之發光裝置,更包括一底板,該發光模組配置於該底板上且與該底板電連接。The illuminating device of claim 1, further comprising a bottom plate, wherein the light emitting module is disposed on the bottom plate and electrically connected to the bottom plate. 如請求項1所述之發光裝置,更包括複數個支撐件,該等支撐件連接該透明基板之該第三表面與該承載基板之該第二表面,以將該光學模組支撐於該發光模組上方,使得該第三表面與該第二表面之間存在該間隙。The illuminating device of claim 1, further comprising a plurality of supporting members, the supporting members connecting the third surface of the transparent substrate and the second surface of the carrying substrate to support the optical module to the illuminating Above the module, the gap exists between the third surface and the second surface. 如請求項17所述之發光裝置,更包括複數個支撐件,該等支撐件連接該透明基板之該第三表面與該底板,以將該光學模組支撐於該發光模組上方,使得該第三表面與該第二表面之間存在該間隙。The illuminating device of claim 17, further comprising a plurality of supporting members, the supporting members connecting the third surface of the transparent substrate and the bottom plate to support the optical module above the light emitting module, such that The gap exists between the third surface and the second surface. 如請求項18或請求項19所述之發光裝置,其中該等支撐件與該透明基板一體成型。The illuminating device of claim 18 or claim 19, wherein the support members are integrally formed with the transparent substrate. 如請求項17所述之發光裝置,更包括一保護層,配置於該底板與該發光模組上。The illuminating device of claim 17, further comprising a protective layer disposed on the bottom plate and the light emitting module. 如請求項1所述之發光裝置,其中該N個透鏡結構與該透明基板一體成型。The illuminating device of claim 1, wherein the N lens structures are integrally formed with the transparent substrate. 如請求項17所述之發光裝置,其中每一該發光結構均包括一正極及一負極,該底板包括N對電極墊對配置於上,每一該電極墊對包括一正極電極墊與一負極電極墊,每一該發光結構的該正極和該負極分別對應配置於該底板的該正極電極墊及該負極電極墊上,使該發光結構與該電極墊對形成電連接而發光。The illuminating device of claim 17, wherein each of the illuminating structures comprises a positive electrode and a negative electrode, the bottom plate comprising N pairs of electrode pads disposed thereon, each of the electrode pad pairs comprising a positive electrode pad and a negative electrode The electrode pad, the positive electrode and the negative electrode of each of the light-emitting structures are respectively disposed on the positive electrode pad and the negative electrode pad of the bottom plate, so that the light-emitting structure and the electrode pad pair are electrically connected to emit light. 如請求項17所述之發光裝置,其中每一該發光結構包括一個第一電極及一個與該第一電極電性相反且與其他各該發光結構共用的第二電極,該底板包括N個第一電極墊和一個與該N個第一電極墊電性相反的第二電極墊,該些發光結構的該第一電極和共用的該第二電極分別對應配置於該底板的該第一電極墊及該第二電極墊上,使該發光結構與該第一、第 二電極墊形成電連接而發光。The illuminating device of claim 17, wherein each of the illuminating structures comprises a first electrode and a second electrode electrically opposite to the first electrode and shared with each of the other illuminating structures, the bottom plate comprising N An electrode pad and a second electrode pad electrically opposite to the N first electrode pads, wherein the first electrode of the light emitting structure and the common second electrode respectively correspond to the first electrode pad disposed on the bottom plate And the second electrode pad, the light emitting structure and the first, the first The two electrode pads form an electrical connection to emit light.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101331357A (en) * 2005-12-27 2008-12-24 昭和电工株式会社 Light guide member, flat light source device, and display device
US20100117997A1 (en) * 2007-03-08 2010-05-13 Haase Michael A Array of luminescent elements
TW201205166A (en) * 2010-07-23 2012-02-01 Ulvac Inc Light irradiation apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101331357A (en) * 2005-12-27 2008-12-24 昭和电工株式会社 Light guide member, flat light source device, and display device
US20100117997A1 (en) * 2007-03-08 2010-05-13 Haase Michael A Array of luminescent elements
TW201205166A (en) * 2010-07-23 2012-02-01 Ulvac Inc Light irradiation apparatus

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