TWI495062B - 將電子晶片連接到無線射頻辨識裝置上的方法 - Google Patents

將電子晶片連接到無線射頻辨識裝置上的方法 Download PDF

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Publication number
TWI495062B
TWI495062B TW097122373A TW97122373A TWI495062B TW I495062 B TWI495062 B TW I495062B TW 097122373 A TW097122373 A TW 097122373A TW 97122373 A TW97122373 A TW 97122373A TW I495062 B TWI495062 B TW I495062B
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Taiwan
Prior art keywords
wafer
circuit
antenna
conductive
contact points
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TW097122373A
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English (en)
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TW200910556A (en
Inventor
Yannick Grasset
Christophe Halope
Nicolas Pangaud
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Ask Sa
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    • G06—COMPUTING; CALCULATING OR COUNTING
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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Description

將電子晶片連接到無線射頻辨識裝置上的方法
本發明係關於一種連接積體電路至電路的裝置，以及更特別地係關於一種連接一電子晶片至一無線射頻辨識裝置的方法。
在半導體領域中，該積體電路或是非常小型電子晶片係被廣泛得使用在許多方面，其係包含智慧卡、一般上被稱為射頻辨識領域的無線射頻辨識標籤以及卡片。為被連接至該電路，該等積體電路係具有數個接觸點裝置，其係能夠被連接至該電路之一群接觸點，其中該等接觸點的數目係依據應用而變化。在射頻辨識領域中，該積體電路之接觸點的數目通常係在2、3以及4之間作變化。
一半導體之製造製程係基於一複雜照相方法的使用，以建立每一層的遮罩。取決於該積體電路之複雜度，係能有高達20至30層。被用來擱置鋁質或是銅質的金屬化層係被放置最後幾層上。位於該最後一層上該積體電路之周邊上以構成該晶片的最後金屬化係被建立在該積體電路之最後幾個製造步驟期間，並且係作為導電極板。該些導電極板接著係將被用來接收多個接觸點裝置，該等接觸點裝置係將被用來連接該積體電路至其之目的地電路。該積體電路之最後製造步驟係建立一鈍化層在該積體電路之面上，其中該等導電極板係為齊平的。此鈍化層係由數微米 恆定厚度之絕緣層的一層所組成，並且作為位在該等導電極板之對面的開口，以便致能與該等連接裝置之幾乎零電阻的歐姆接觸。
被用來製造被被插入在該電子晶片以及該電路之間的電氣連接之其中一種技術係在於使用銲線接合。參考圖1，該接線係簡單地將多條銲線(或是接合)14銲接至該兩個接觸點之間而被完成，其中該等接觸點係被設計為在要被一起連接之每個元件上的末端。該鋁質銲線、金質銲線或是銅質銲線通常係由超音波銲接技術而被銲接。該銲線之直徑係大約為25μm(微米)。為保護該等銲線，該晶片10通常係作用面朝上地被裝箱在一箱盒16中。該等銲線係被接線在與該晶片10之作用面齊平的該等導電極板12上。該等銲線之第二末端係被連接至多個剛性連接突出片18，該等突出片係與箱盒16整合在一起並且係以被銲接至該目的地電路而來設計。以此方式，在該晶片以及該目的地電路的接觸點之間的接觸手段一方面係包含位於該晶片之最後金屬化層上的導電極板以及箱盒16的剛性突出片18之間的銲線導電極板，而另一方面係包含在該等剛性突出片18以及該目的地電路的接觸點之間的銲接。此種接觸手段係具有提供針對由於該等突出片18以及該箱盒16的晶片之較大尺寸的優點。該箱盒16(通常係由塑膠材料所組成)係提供顯著地額外熱慣性，並且係致能限制該晶片之溫度變化。此一安裝的短處係存在於事實上該種安裝為太昂貴。再者，該種安裝之厚度係由於該等連接 銲線、該箱盒以及該等突出片而為大型的。以此方式，此一安裝的尺寸係使得對於智慧卡、無線射頻辨識標籤以及卡片來說為不理想的，其中該些標籤以及卡片係具有少於1毫米的一厚度。最後，該等銲線(大約為幾十微米)之尺寸在安裝期間係需要高精密性。
第二個安裝積體電路或是電子晶片的途徑係基於另一種組裝技術，其中該晶片係被傾覆，此係為「覆晶(Flip Chip)」技術。不同於該「銲線接合」類型之接線技術，此種覆晶技術之特徵係為該晶片之作用面在該目的電電路上的一直接連接，並且係以橫截面的方式而被顯示在圖2中。此技術係在於：將一導電材料球20(一般係被稱作為「凸塊(bump)」，並且通常係由金質所作成)放置在一電氣絕緣層34之開口裡的晶片10之導電極板12中每一者上，其中該電氣絕緣層34係代表位於該晶片之作用面上的鈍化層。該晶片接著係藉著其之作用面，並且透過在該目的地電路22之一群接觸點24上的導電材料球之接觸而被連接至該電路；該群接觸點係被放置以便複製該等導電材料球的位置。對於此一安裝技術來說，在該晶片以及該目的地電路的接觸點之間的接觸手段係由一導電材料球與該等兩個部件(該晶片以及該目的地電路)之間進行接觸所構成。此一安裝的不利因素係存在於定位的準確度，其中該等導電材料球之尺寸以及該等導電極板之尺寸係大約為100微米，使得該安裝很難處理。再者，在於放置該等導電材料球之步驟係代表在積體電路或是電子晶片之製 造製程中的一顯著成本。該等兩個被使用於連接多個電子晶片以及先前所敘述的傳統安裝技術因而係在於建立一歐姆鏈路，並且係需要額外的導電材料以用於該晶片以及於其上插入該導電材料的電路之間的接觸。
這就是為何本發明目的係要提供一種用於將該晶片安裝在一電路上的方法，該方法係不需要被附加至該晶片的接觸手段，以用於建立該晶片以及該電路之間的連接。
本發明目的因而係關於一種用於連接一電子晶片至一電路之接觸點的方法，並且該電路係被設計為容納該晶片；該晶片係設有兩個導電極板，其係位於最後層之上以構成該晶片、以及至少一層電磁屏蔽層；該等導電極板中至少一者係以一電氣絕緣層而整個地被覆蓋；該方法係包含下列步驟：-將一膠黏性介電材料放置在該等接觸點之間的電路上，以便將該電子晶片維持在一相對該電路的固定位置上；-將該電子晶片定位在該電路上，致使該等導電極板係在該電路之接觸點的對面，以便在該電子晶片以及該電路之間建立至少一條電容性鏈路，其中該電容性鏈路係由該等導電極板所組成，該電氣絕緣層係完全地覆蓋該等極板以及該等接觸點。
依據代表一橫截面之圖3，該晶片以及該積體電路10係以兩個金屬極板31以及32為特色，其中該等金屬極板係對應於該經晶片之最後一層處所作出的金屬化。在使用導電銲線或是導電材料球之安裝技術中，該些金屬極板係代表一群連接接觸裝置的接觸點，以為在該晶片以及於上安裝該晶片的電路之間建立一歐姆鏈路。於本發明之範疇中，該等金屬極板中至少一者在尺寸上係大於藉由傳統方法而被使用於連接積體電路的彼等板，因而藉由歐姆接觸。本發明之較佳實施例係敘述兩個相同的金屬極板，其係被設計為建立兩個依據本發明之連接。在此情形中，對於一晶片之尺寸係為1毫米×0.6毫米，而每個金屬極板之尺寸係大約為200微米×500微米。該最後被建立在該晶片之作用面上的電氣絕緣鈍化層(亦即；以該等金屬極板為特色之面)係不會包含任何開口，其係不同於該等被調適為藉由歐姆類型之接觸裝置而連接的電子晶片。該電氣絕緣層34係被製作在該晶片之整個作用表面上，以形成均勻厚度通常少於3微米的一絕緣層。
依據圖4，於上連接該晶片之支座46係以撗截面的方式來顯示。該支座46係可為一彈性材料支座，其諸如於上藉由網板印刷(screen printing)、彈性凸板印刷(flexography)、輪轉凹板印刷(rotogravure)、平板印刷(offset)或是噴墨印刷(ink jet)來印刷一天線的一紙張支座。要不然，該支座46係可為任何電路，例如，諸 如一電子卡片。由該等兩個跡線部件67以及67所代表之天線係以兩個接觸點47以及48為特色，其中該等接觸點47以及48係亦以相同該天線的方式來製作並且係亦後者延伸，以為連接該晶片以及該天線。所使用之導電鏈路係較佳為一聚合物鏈路，其係裝載著諸如銀質、銅質以及碳質的導電元素。一膠黏介電材料40係被放置在該支座46上並且係介於該等兩個接觸點47以及48。此膠黏材料係在將該晶片放置在該支座之前先被施加。
一旦施加該膠黏材料，該晶片係被定位在該支座46上，致使該晶片之金屬極板31以及32係在該天線之接觸點47以及48的對面。形成該等接觸點47以及48之鏈路是否為乾燥還是潮濕係無關緊要的。一壓力係被應用在該晶片上。由於該壓力之結果，該膠黏介電材料40係蔓延並且覆蓋在該等接觸點47以及48之間該晶片的整個表面。該膠黏介電材料40因而係使得能夠將該晶片10之組件保持在該支座46上，並且特別地能夠將該晶片10維持在該支座46上的一固定位置中。一電容性鏈路因而係被建立在該導電極板31以及該接觸點47之間。同樣地，一電容性鏈路因而係亦被建立在該導電極板32以及該接觸點48之間。所獲得之電容數值係與該等極板面對彼此之表面面積成比例，並且係與該絕緣層(其係分開該等極板)之介電係數數值成比例，而係與此絕緣層之厚度成反比。介電係數係以每公尺多少法拉(F/m)來表示之。該介電係數係亦被表示為一無量(dimensionless)數量：該相對 介電係數或是介電常數，被標準化為針對真空之介電係數係ε0 (Epsilon0)=8.854187×10-12 F/m。該材料之介電係數接著係等於ε=ε0 *εR (Epsilon=Epsilon0×Epsilon R)。不管已知為該鈍化層之電氣絕緣層的厚度，一般的相對介電係數數值對於在該等晶片之製造中所使用的材料係大約為4。一般來說，該電氣絕緣層之厚度係大約為3毫米。
圖6係顯示一無接觸可攜式物件60(諸如：一智慧卡或是一票卷)的一前視圖。該天線62係以由兩個連接銲墊做結束之導電跡線67以及68為特色，其係類似於先前述的兩個接觸點47以及48。依據本發明之方法，該晶片係被連接至該天線。
藉由一金屬極板、一絕緣層以及一接觸點所形成之每一個連接係形成一電容器。結果來說，一電容器或是一電容係由兩個被一電氣絕緣體所分開之導電極板來構成，由該連接(依據本發明方法所作出)所代表之電容性鏈路係藉由於該電子晶片10本身內的一接觸點或是導電極板31以及32而被構成為該等導電極板中一者、係藉由該電子晶片10之電氣絕緣層或是鈍化層而被構成為該絕緣體、以及係藉由該電路之接觸點47以及48而被構成為該第二導電極板，並且係被設計為容納該晶片。所需要的電容數值係將取決於要被連接之電路於該理想操作頻率下的阻抗，以為建立該晶片用於將其調適(一般被稱作為「匹配網路」)至該天線之阻抗的最佳阻抗。
本發明之目的係較佳地合適於一頻率範圍，該頻率範圍係自大約為IGHz的超高頻(UHF)以及特別地高於860MHz(依據ISO 18000-6的標準頻率IGHz與依據ISO 18000-4的標準頻率2.45GHz)。實際上，被使用於此等頻率的晶片係具有一大約為Z=20-j*100歐姆的複數輸出阻抗，其例如係對應於一含有串聯之一電阻器以及一電容器的電路，因而一RC電路係具有一大約為800fF (femto Farad)的電容數值。
當該晶片被增長一電路內並且在該晶片以及該電路之間進行交換的訊號為高頻訊號時，總是需要建立被附加在該晶片之輸出處或其它地方的一元件或是一應用網路。此調適係使得能夠最佳化該等所交換訊號之功率的轉移、或是能夠最佳化在雜訊方面的效能，也就是：以降低重疊該等有用訊號之隨機以及不必要的訊號。該調適係經由一構件網路(諸如電容或是電感)而被完成。依據本發明之裝置係致使能夠將扮演該調適元件的一串聯電容加入至該晶片之RC模型，以便致能在該晶片以及連接該晶片的電氣網路之間的最佳調適。在射頻辨識裝置的情形中，被連接至該晶片的網路係為一天線。如由本發明所定義，經建立在該晶片以及該天線之間的電容性鏈路之電容數值係被考慮在該天線至該晶片的調適中，並且係致使能更最佳化此調適。
因此，為將該晶片之輸入阻抗調適至該電路之阻抗，並且例如對於該晶片之輸入阻抗的一虛部對應於800fF(毫 微微法拉)、厚度為3微米之一介電質以及對應於相對介電係數εR (Epsilon R)大約為4的絕緣層，我們係依據該公式C=ε0 *εR *S/e (C=Epsilon0* Epsilon R*S/e)來推論該等相對面連接極板之所需要表面面積。所需要的表面面積係大約為6.8×10-6m2 ，其例如對應於200微米×340微米的一表面面積。為以該射頻辨識晶片在該UHF頻率範圍(亦即：大約為十意赫茲的頻率)中來實施本發明，該等導電極板係將必須被設置有至少200微米×340微米的一表面面積。對於該晶片之輸入阻抗的一虛部為遠大於800fF來說，表面面積少於200微米×340微米之導電極板係可被供應。依據本發明之方法所作出的電容性鏈路因而係促進該晶片以及插入該晶片之電路的調適調整、亦如此在該晶片至該天線之調適調整的本情況中，並且甚至係代表該調適網路之一基本元件。
當在應付操作於超高頻之一射頻辨識標籤類型的無接觸可攜式物件時，接著經建立在該晶片以及該天線之間的電容性鏈路以及如由本發明所定義係亦被考慮在調諧該天線至該晶片中。實際上，該天線係必須被調諧至該讀取器的操作頻率。
依據本發明之方法係具有使得將該晶片安裝在該目的地電路之多個接觸點上較為簡單的優點。實際上，該等金屬極板之尺寸相較於該晶片之尺寸來說係非常龐大，因此依據本發明發之安裝方法的準確度係遠低於依據如先前所述該「覆晶」類型組件技術之晶片安裝所需的準確度，並 且其中該連接係經由具有少於100毫米之一直徑的晶片凸塊所作出。以此方式，藉著一晶片係具有一長方形的作用面，並且其中該等金屬極板係針對平行該長方形之小側面的對稱軸而對稱地沿著該長方形的小側面被設置，所以該晶片之定位係將只要藉由識別出該晶片之作用面的大側面以及小側面而可行的。以此方式，在將該晶片安裝至該目的地電路上的期間，該作用面之長方形形狀以及該等導電極板之對稱布局係致使能夠屏除在兩個定向皆可行時該晶片沿著該較大側面的定向。再者，由於該等導電極板之大尺寸，此係致使能夠增加在安裝該晶片時的容忍度。以此方式，在該等晶片凸塊之識別階段上所節省的時間以及安裝容忍度之放寬係致使能夠增加對於安裝晶片至設計為容納該晶片的電路上之工作速率，並且因而能夠降低製造成本。
此外，由於事實上該絕緣材料層為完全地覆蓋該晶片之作用面，所以該等金屬極板係被保護以抵抗污染、擴散、遷移以及其它有可能影響該電子晶片之品質以及功能性的電氣現象。
該晶片或是積體電路的生產係基於一複雜攝影方法的使用，以建立含有所有該等電路之各種疊層。構成該晶片10之各種疊層係以此一方式而被製造：於該晶片之厚度內，位於該等導電極板31以及32之對面的部件係含有儘量可能少的金屬連接以形成該積體電路，其中該等導電極板31以及32係坐落於該晶片之周邊處。藉由水平地放置 該晶片，此部件係對應於坐落在該等導電極板31以及32之晶片的部分。再者，該晶片係亦能在一層或更多層上含有一層或更多額外金屬層，以為最小化在該電容器的導電極板31與32以及所有直接相對的金屬連接之間的寄生電容。此(或該些)疊層係扮演著對抗由該等晶片連接所發出之輻射的一屏蔽或是電磁屏幕，其中該等晶片連接在該晶片之規模上係建立對於該等導電極板31與32以及該等接觸點47與48之間所建立的電容性鏈路為有害的寄生電容。此一寄生電容之存在係傾向降低在該晶片以及該天線之間所建立的電容性鏈路之電容數值，並且係亦能將該電容數值降低至不足夠在該晶片以及該天線之間製造該電氣連接的數值。因此，此(或該些)額外電磁屏蔽層之存在係非常重要。此屏蔽因此係較佳地位於該等導電極板以及該等晶片連接之間，以便降低儘量可能多的寄生電容(其係能出現在該等導電極板以及該等晶片連接之間)，並且以便最佳化該電容性鏈路之電容數值。
10‧‧‧電子晶片
12‧‧‧導電極板
14‧‧‧銲線
16‧‧‧箱盒
18‧‧‧剛性連接突出片
20‧‧‧導電材料球
22‧‧‧目的地電路
24‧‧‧接觸點
31,32‧‧‧導電極板
34‧‧‧電氣絕緣層
40‧‧‧膠黏性介電材料
46‧‧‧支座
47,48‧‧‧接觸點
60‧‧‧無接觸可攜式物件
62‧‧‧天線
67,68‧‧‧導電跡線
由領悟上文說明時並配合著該等後附圖式，本發明之意圖、目的以及特徵係將變為更加顯明的，其中：圖1係代表一種用於使用導電銲線之晶片的安裝技術。
圖2係代表一種用於使用「凸塊(bump)」之晶片的安裝技術。
圖3係代表依據本發明之晶片的一橫截面圖。
圖4係代表在沉積該介電材料之後該電路支撐的一橫截面圖。
圖5係代表在該晶片定位步驟之後該電路支撐的一橫截面圖。
圖6係代表依據本發明俯視而下之一種連接一晶片的無接觸可攜式物件。
10‧‧‧電子晶片
31,32‧‧‧導電極板
34‧‧‧電氣絕緣層
40‧‧‧膠黏性介電材料
46‧‧‧支座
47,48‧‧‧接觸點
67,68‧‧‧導電跡線

Claims (13)

  1. 一種用於連接一電子晶片(10)至一電路之接觸點(47以及48)的方法，並且該電路係被設計為容納該晶片；該晶片係設有兩個導電極板(31以及32)，該導電極板係位於最後疊層之上以構成該晶片、以及至少一層電磁屏蔽層；該等導電極板(31或是32)中至少一者係藉由一電氣絕緣層(34)而整個地被覆蓋；該方法係包含下列步驟：-將一膠黏性介電材料(40)放置在該等接觸點(47、48)之間的該電路上，以便將該電子晶片(10)維持在一相對該電路的固定位置上；-將該電子晶片(10)定位在該電路上，致使該等導電極板(31以及32)係在該電路之接觸點(47以及48)的對面，以為在該晶片以及該電路之間建立至少一條電容性鏈路，其中該至少一條電容性鏈路係由該等導電極板(31或是32)所構成，該電氣絕緣層係完全地覆蓋該等極板以及該等接觸點(47以及48)。
  2. 如申請專利範圍第1項之方法，其中該電路係一無線射頻辨識裝置，該無線射頻辨識裝置係以被放置在一支座(46)上的天線(66、67、68)為特色，該天線係以兩個接觸點(47以及48)為特色。
  3. 如申請專利範圍第2項之方法，其中該天線係藉由將使用的導電鏈路印刷在該支座(46)上而被獲得。
  4. 如申請專利範圍第2項之方法，其中該無線射頻辨識裝置係操作在遠大於860MHz的頻率範圍中。
  5. 如申請專利範圍第3或4項之方法，其中與該電路一起形成一電容性鏈路之該等導電極板(31或是32)的尺寸係大約為200微米×500微米。
  6. 如申請專利範圍第3或4項之方法，其中該晶片為一長方形時，該等導電極板(31以及32)係針對對稱軸而對稱地坐落於該晶片(10)上，該對稱軸係平行該晶片之作用面的小側面。
  7. 如申請專利範圍第3或4項之方法，其中該電氣絕緣層(34)係為一熟知為一鈍化層的一疊層，該電氣絕緣層(34)係具有大約為3微米之一厚度。
  8. 如申請專利範圍第3或4項之方法，其中該支座(46)係由纖維材料所製造。
  9. 如申請專利範圍第8項之方法，其中該支座(46)係由紙張所製造。
  10. 如申請專利範圍第3或4項之方法，其中被用來建立該天線以及該等接觸點之鏈路係為一聚合型(polymerizable)產品，該產品係被摻雜銀質導電成分。
  11. 如申請專利範圍第3或4項之方法，其中被用來建立該天線之鏈路係為一聚合型產品，該產品係被摻雜碳質導電成分。
  12. 如申請專利範圍第3或4項之方法，其中該電容性鏈路之電容數值係被考慮在該天線至該晶片的調適中。
  13. 一種卡片或是標籤類型的無線射頻辨識裝置，該無線射頻辨識裝置係以一電子晶片(10)以及一天線為特色，其中該天線係被配備兩個接觸點(47、48)；該晶片係以兩個導電極板(31或是32)為特色，該等導電極板係位於最後疊層之上以構成該晶片；該等導電極板(31或是32)中至少一者係以一電氣絕緣層(34)而整個地被覆蓋；該方法係包含下列步驟；該電子係經由一膠黏性介電材料(40)而被維持在該等接觸點(47、48)之間的一固定位置上，並且係被定位在該裝置上，致使該等導電極板(31以及32)係在該等接觸點(47以及48)的對面，而且以便在該晶片以及該天線之間建立至少一條電容性鏈路，其中該至少一條電容性鏈路係由該等導電極板(31以及32)所構成，該電氣絕緣層係完全地覆蓋該等極板以及該等接觸點(47或是48)。
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