TWI494389B - Electrically conductive paste and metal thin film - Google Patents

Electrically conductive paste and metal thin film Download PDF

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TWI494389B
TWI494389B TW100100461A TW100100461A TWI494389B TW I494389 B TWI494389 B TW I494389B TW 100100461 A TW100100461 A TW 100100461A TW 100100461 A TW100100461 A TW 100100461A TW I494389 B TWI494389 B TW I494389B
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conductive paste
branched polyester
fine particles
metal
parts
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TW201132720A (en
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Koji Shoki
Yoshitaka Ayuzawa
Takashi Kondo
Hirotoshi Kizumoto
Tuyoshi Yatsuka
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Toyo Boseki
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/0804Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/42Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C08G18/4211Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
    • C08G18/4213Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols from terephthalic acid and dialcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/74Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0033Apparatus or processes specially adapted for manufacturing conductors or cables by electrostatic coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Description

導電性糊及金屬薄膜Conductive paste and metal film

本發明係關於一種將特定之聚酯樹脂作為樹脂黏著劑使用的導電性糊,及使用它之金屬薄膜積層體之製造方法、金屬薄膜及其應用者。The present invention relates to a conductive paste which uses a specific polyester resin as a resin adhesive, a method for producing a metal thin film laminate using the same, a metal thin film, and an application thereof.

廣泛採用藉由使金屬微粒等之導電性微粒分散於介質中之導電性糊,使用網板印刷或分配器而描繪電路而形成導電電路之技術。於此所使用的導電性微粒一般係具有微粒數μm以上之片狀物,將電路之厚度作成10 μm以上而確保導電性。近年來,導電電路已急速朝向高密度化。為了能夠形成更緻密的電路而進行更微細之金屬微粒的開發。A technique of forming a conductive circuit by using a screen printing or a dispenser to draw a circuit by using a conductive paste in which conductive fine particles such as metal fine particles are dispersed in a medium is widely used. The conductive fine particles used herein generally have a sheet having a particle number of several μm or more, and the thickness of the circuit is made 10 μm or more to ensure conductivity. In recent years, conductive circuits have rapidly increased in density. The development of finer metal particles is carried out in order to form a denser circuit.

微粒之製造方法係根據所生成的相,分類為固相法、氣相法、液相法。於利用固相法之粉碎所進行的製程中,粒徑之界限係0.1 μm左右。於所謂奈米粒子之粒徑為數十nm以下之粒子的製造中,適合積累(buildup)製程之氣相法與液相法。氣相法之例子,可舉出:藉由高溫蒸氣之冷卻所導致的物理性冷凝法及藉由氣相化學反應所導致的粒子生成法。The method for producing fine particles is classified into a solid phase method, a gas phase method, and a liquid phase method depending on the phase to be formed. In the process of pulverization by the solid phase method, the particle size is about 0.1 μm. In the production of particles in which the particle diameter of the nano particles is several tens nm or less, a gas phase method and a liquid phase method which are suitable for the buildup process are suitable. Examples of the gas phase method include a physical condensation method by cooling of high-temperature steam and a particle formation method by gas phase chemical reaction.

另一方面,液相法係具有下列之優點:粒子之構造成分不僅適應於單一之情形,也能夠適應於多成分系;能夠多樣化製程、粒徑之控制較為容易、粒子之表面修飾可簡易地進行等,各種之方法已被探討。於液相法中,有人提案共沉澱法、溶膠-凝膠法、凝膠-溶膠法、逆微胞法、熱皂法、噴霧熱分解法等。金屬微粒也於保護聚合物之存在下,利用溶液中還原金屬鹽之方法而以凝膠狀態予以合成。例如,於專利文獻1中,已介紹含有直鏈狀脂肪族聚醚之金屬微粒分散體。另外,於專利文獻2中,已介紹藉由具有吡咯酮基之聚合物而予以安定化的金屬超微粒分散體。On the other hand, the liquid phase method has the following advantages: the structural components of the particles are not only suitable for a single case, but also can be adapted to a multi-component system; the process can be diversified, the control of the particle size is easy, and the surface modification of the particles can be simplified. Various methods have been explored. In the liquid phase method, a coprecipitation method, a sol-gel method, a gel-sol method, an inverse microcell method, a hot soap method, a spray pyrolysis method, and the like have been proposed. The metal fine particles are also synthesized in a gel state by a method of reducing a metal salt in a solution in the presence of a protective polymer. For example, in Patent Document 1, a metal fine particle dispersion containing a linear aliphatic polyether has been described. Further, in Patent Document 2, a metal ultrafine particle dispersion which is stabilized by a polymer having a pyrrolidone group has been described.

習知藉由減低金屬微粒之粒徑,能夠大幅降低金屬微粒間之燒製溫度。例如,於專利文獻3中,已介紹使用分散粒徑100 nm以下之金屬微粒的分散體而形成金屬薄膜的方法。藉由此方法而能夠形成電路或配線。但是,奈米粒子所代表之微粒係由於表面積非常地大,極容易凝聚。因此,黏著劑樹脂或分散劑係藉由吸附於金屬微粒而必須防止微粒之凝聚、且確保分散體流動性之達成使分散體安定化的功能。為了分散體之安定化,使金屬微粒越微細化,越大量之黏著劑樹脂或分散劑將成為必要。因此,原本即使使用由能夠低溫燒製之金屬微粒所構成的分散體,黏著劑樹脂或分散劑也將阻礙導電性之提高。藉由昇華或分解蒸發等而去除黏著劑樹脂或分散劑的操作成為必要。另外,也容易發生因為燒製而惡化與薄膜或玻璃等之基材的接著性。Conventionally, by reducing the particle size of the metal particles, the firing temperature between the metal particles can be greatly reduced. For example, Patent Document 3 describes a method of forming a metal thin film by using a dispersion of metal fine particles having a particle diameter of 100 nm or less. Circuits or wiring can be formed by this method. However, the particles represented by the nanoparticles are extremely large in surface area and are extremely easy to aggregate. Therefore, the adhesive resin or the dispersant is required to prevent the aggregation of the fine particles by the adsorption of the metal fine particles, and to ensure the fluidity of the dispersion to stabilize the dispersion. In order to stabilize the dispersion, the finer the metal particles are, the more a large amount of the adhesive resin or dispersant will become necessary. Therefore, even if a dispersion composed of metal fine particles which can be fired at a low temperature is used, the adhesive resin or the dispersant will impede the improvement in conductivity. It is necessary to remove the adhesive resin or the dispersant by sublimation or decomposition evaporation. Further, it is also likely to deteriorate the adhesion to a substrate such as a film or glass due to firing.

於經歷燒製步驟之後,也為了使金屬薄膜層與基材之接著性得以發現,認為使用含有不揮發性樹脂黏著劑之分散體為有利,相反地,於樹脂黏著劑經歷燒製步驟後,殘留於塗膜中且阻礙金屬微粒間的連接之傾向也強,獲得低體積電阻係數的金屬薄膜層實際上並不容易。或許因此,於金屬奈米粒子之分散體中使用樹脂系黏著劑,成為可以獲得高導電性之金屬薄膜的專利文獻4、專利文獻5等僅極少數存在。於專利文獻4中,雖然能夠使用不特定之樹脂,但於實施例中,已顯示有效性者係僅為特定之一商標的甲酚型酚樹脂之情形。於專利文獻5中,已介紹使用於分子中具有分枝單位與羥基之聚酯樹脂,但是於與基材之緊貼性及體積電阻係數中,迄今尚未達成充分之性能。After experiencing the firing step, and in order to find the adhesion of the metal thin film layer to the substrate, it is considered advantageous to use a dispersion containing a non-volatile resin adhesive, and conversely, after the resin adhesive is subjected to the firing step, The tendency to remain in the coating film and hinder the connection between the metal particles is also strong, and it is practically not easy to obtain a metal film layer having a low volume resistivity. For this reason, Patent Document 4, Patent Document 5, and the like which are used as a metal thin film which can obtain high conductivity are used in the dispersion of the metal nanoparticles. In Patent Document 4, although an unspecified resin can be used, in the examples, it has been shown that the effective one is only a specific one of the cresol type phenol resins. In Patent Document 5, a polyester resin having a branch unit and a hydroxyl group in a molecule has been described. However, in the adhesion to a substrate and the volume resistivity, sufficient performance has not been achieved so far.

[先前技術文獻][Previous Technical Literature] [專利文獻][Patent Literature]

專利文獻1:日本特開2006-9120號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-9120

專利文獻2:日本特開平5-224006號公報Patent Document 2: Japanese Patent Laid-Open No. Hei 5-224006

專利文獻3:日本特許第2561537號說明書Patent Document 3: Japanese Patent No. 2561537

專利文獻4:日本特許第4155821號說明書Patent Document 4: Japanese Patent No. 4155821

專利文獻5:日本特開2009-62523號公報Patent Document 5: Japanese Laid-Open Patent Publication No. 2009-62523

廣泛採行利用導電性糊或導電性墨水而形成金屬薄膜積層體,並藉此而形成導電電路之技術。為了達成導電電路之高密度化的手段之一係進行縮小電路寬度或電路厚度。為了一邊確保導電性且一邊實現如此之變更,所使用的金屬填料也加速微粒化。另一方面,為了確保關於導電電路形成之作業性,必須防止金屬微粒分散體之凝聚,保持適度之黏度,但是為了使分散之金屬微粒安定化,使有機物吸附於金屬微粒之表面為有效。然而,吸附的有機物係於成膜後而使導電性降低。一般而言,在分散體之安定性與成膜後之導電性係呈現相反。A technique of forming a conductive film by using a conductive paste or a conductive ink to form a metal thin film layered body is widely used. One of the means for achieving high density of the conductive circuit is to reduce the circuit width or the circuit thickness. In order to achieve such a change while ensuring electrical conductivity, the metal filler used is also accelerated to atomize. On the other hand, in order to ensure workability in forming a conductive circuit, it is necessary to prevent aggregation of the metal fine particle dispersion and maintain an appropriate viscosity. However, in order to stabilize the dispersed metal fine particles, it is effective to adsorb the organic substance on the surface of the metal fine particles. However, the adsorbed organic matter is reduced in electrical conductivity after film formation. In general, the stability of the dispersion is opposite to that of the film after film formation.

本發明之問題係提供一種導電性糊,其能夠使導電性糊之分散安定性與使用此導電性糊所形成的金屬薄膜積層體之金屬薄膜層的低體積電阻係數(高導電性、低電阻)、及對於基材之高緊貼性並存。還有,在本發明之所謂金屬薄膜,並非指僅由金屬所構成的薄膜,也指由金屬與其他之物質,由例如分枝型聚酯(B)、有機溶劑(C)、硬化劑(D)、分散劑(E)及此等之中任一種相互之反應生成物所選出的一種以上之物質的混合物所構成的薄膜。The problem of the present invention is to provide a conductive paste capable of imparting a dispersion stability of a conductive paste to a low volume resistivity (high conductivity, low resistance) of a metal thin film layer of a metal thin film laminate formed using the conductive paste. ) and the high adhesion to the substrate coexist. Further, the term "metal film" as used in the present invention does not mean a film composed only of a metal, but also a metal and other substances such as a branched polyester (B), an organic solvent (C), and a hardener (for example). D), a dispersant (E) and a film of a mixture of one or more selected from the mutual reaction products.

本發明人等係為了解決上述之問題而進行鑽研之結果,於是完成本發明。亦即,本發明之內容如下:The present inventors have conducted research in order to solve the above problems, and have completed the present invention. That is, the contents of the present invention are as follows:

(1)一種導電性糊,其係含有金屬微粒(A)、分枝型聚酯(B)與有機溶劑(C)的導電性糊,該金屬微粒(A)之平均粒徑為1×10-3 μm以上且5×10-1 μm以下,該分枝型聚酯(B)係具有起因於3官能以上之多元羧酸化合物與/或3官能以上之多元醇化合物的分枝點,該分枝型聚酯(B)之酸價為30當量/106 g以上且200當量/106 g以下,該分枝型聚酯(B)係含有將間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基之中的一種以上,與利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的化合物作為共聚合成分,於使構成該分枝型聚酯(B)之全部多元羧酸化合物殘基與全部多元醇化合物殘基的合計成為200莫耳%時,間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基之合計為70莫耳%以上,利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的化合物之殘基的合計為20莫耳%以上,該分枝型聚酯(B)之玻璃轉移溫度為低於40℃,相對於該分枝型聚酯(B)100重量份,該金屬微粒(A)為600至1500重量份。(1) A conductive paste comprising a conductive paste of metal fine particles (A), a branched polyester (B) and an organic solvent (C), wherein the metal fine particles (A) have an average particle diameter of 1 × 10 -3 μm or more and 5 × 10 -1 μm or less, the branched polyester (B) has a branching point derived from a trifunctional or higher polycarboxylic acid compound and/or a trifunctional or higher polyhydric alcohol compound. The branched polyester (B) has an acid value of 30 equivalents/10 6 g or more and 200 equivalents/10 6 g or less, and the branched polyester (B) contains an isophthalic acid residue and an phthalic acid. And at least one of a formate residue and a cyclohexanedicarboxylic acid residue, and at least a carbon atom having a carbon number of 1 to 4 substituted with a carbon atom of a linear alkanediol having 3 to 5 carbon atoms; When a compound of one hydrogen atom is used as a copolymerization component, when the total of the residues of all the polycarboxylic acid compounds constituting the branched polyester (B) and the total of the residues of all the polyol compounds is 200 mol%, isophthalic acid The total of the residue, the phthalic acid residue and the cyclohexanedicarboxylic acid residue is 70 mol% or more, and the linear alkyl group having a carbon number of 1 to 4 is substituted for the linear alkane bonded to the carbon number of 3 to 5. Glycol carbon The total of the residues of the compound of at least one hydrogen atom on the atom is 20 mol% or more, and the glass transition temperature of the branched polyester (B) is less than 40 ° C with respect to the branched polyester (B) 100 parts by weight, the metal fine particles (A) are from 600 to 1,500 parts by weight.

(2)如(1)記載之導電性糊,其係於使構成該分枝型聚酯(B)之全部多元羧酸化合物殘基與全部多元醇化合物殘基的合計成為200莫耳%時,鄰苯二甲酸殘基與環己二甲酸殘基之合計為20莫耳%以上且50莫耳%以下。(2) The conductive paste according to (1), wherein the total of the residues of all the polyvalent carboxylic acid compounds constituting the branched polyester (B) and the total of the residues of all the polyol compounds are 200 mol % The total of the phthalic acid residue and the cyclohexanedicarboxylic acid residue is 20 mol% or more and 50 mol% or less.

(3)如(1)或(2)記載之導電性糊,其中該金屬微粒(A)之含有率為導電性糊整體之20重量%以上且80重量%以下。(3) The conductive paste according to (1) or (2), wherein the content of the metal fine particles (A) is 20% by weight or more and 80% by weight or less based on the entire conductive paste.

(4)如(1)至(3)中任一項記載之導電性糊,其係進一步含有硬化劑(D)。(4) The conductive paste according to any one of (1) to (3) further comprising a curing agent (D).

(5)一種金屬薄膜積層體之製造方法,其係包含對於將如(1)至(4)中任一項記載之導電性糊塗布於基材而形成的塗膜,實施由加熱處理、壓延處理與燒製處理所選出的至少一種處理的步驟。(5) A method for producing a metal thin film laminated body, comprising applying a conductive paste according to any one of (1) to (4) to a substrate, and performing heat treatment and rolling The step of treating and selecting at least one of the selected treatments.

(6)如(5)記載之金屬薄膜積層體之製造方法,其中該基材為絕緣性薄膜。(6) The method for producing a metal thin film laminate according to (5), wherein the substrate is an insulating film.

(7)一種金屬薄膜積層體,其係利用如(5)或(6)記載之製造方法而製得。(7) A metal thin film layered product obtained by the production method as described in (5) or (6).

(8)一種裝置,其係含有將使用如(7)記載之金屬薄膜積層體的電配線作為構成要件。(8) A device comprising an electric wiring using the metal thin film laminate according to (7) as a constituent element.

本發明之導電性糊係藉由具有優異的分散安定性,且塗布於基材上而加熱乾燥處理,能夠形成具有體積電阻係數低的金屬薄膜層之金屬薄膜層體。另外,於本發明之較佳的實施形態中,藉由進行壓延處理及/或燒製處理,能夠獲得導電性更高的金屬薄膜層。於本發明之較佳的實施形態中,能夠獲得顯示體積電阻係數1×10-1 Ω‧cm以下之金屬薄膜層,更佳的實施形態中,顯示1×10-3 Ω‧cm以下,進一步較佳的實施形態中,顯示1×10-4 Ω‧cm以下,最好的實施形態中,顯示1×10-5 Ω‧cm以下之體積電阻係數的金屬薄膜層。另外,從本發明之導電性糊而使金屬薄膜層形成,能夠形成金屬薄膜積層體、電磁波屏蔽金屬薄膜、鍍敷用導電層、金屬配線、導電電路等之裝置。The conductive paste of the present invention can be formed into a metal thin film layer having a metal thin film layer having a low volume resistivity by being subjected to heat drying treatment by being applied to a substrate and having excellent dispersion stability. Further, in a preferred embodiment of the present invention, a metal thin film layer having higher conductivity can be obtained by performing a rolling treatment and/or a baking treatment. In a preferred embodiment of the present invention, a metal thin film layer having a volume resistivity of 1 × 10 -1 Ω ‧ cm or less can be obtained, and in a more preferred embodiment, 1 × 10 -3 Ω ‧ cm or less is displayed, and further In a preferred embodiment, 1 × 10 -4 Ω ‧ cm or less is displayed. In the preferred embodiment, a metal thin film layer having a volume resistivity of 1 × 10 -5 Ω ‧ cm or less is displayed. In addition, a metal thin film layer is formed from the conductive paste of the present invention, and a device such as a metal thin film laminated body, an electromagnetic wave shielding metal thin film, a plating conductive layer, a metal wiring, or a conductive circuit can be formed.

本發明之導電性糊之特徵係主要由金屬微粒(A)、分枝型聚酯(B)與有機溶劑(C)所構成的導電性糊,該金屬微粒(A)之平均粒徑為1×10-3 μm以上且5×10-1 μm以下,該分枝型聚酯(B)係具有起因於3官能以上之多元羧酸化合物與/或3官能以上之多元醇化合物的分枝點,該分枝型聚酯(B)係於分子中含有特定範圍濃度之羧基,於使構成該分枝型聚酯(B)之全部多元羧酸化合物殘基與全部多元醇化合物殘基的合計成為200莫耳%時,間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基之合計為70莫耳%以上,利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的化合物之殘基的合計為20莫耳%以上,該分枝型聚酯(B)之玻璃轉移溫度為低於40℃,相對於該分枝型聚酯(B)100重量份,含有該金屬微粒(A)為600至1500重量份。The conductive paste of the present invention is mainly characterized by a conductive paste composed mainly of metal fine particles (A), a branched polyester (B) and an organic solvent (C), and the average particle diameter of the metal fine particles (A) is 1. ×10 -3 μm or more and 5 × 10 -1 μm or less, the branched polyester (B) has a branching point derived from a trifunctional or higher polyvalent carboxylic acid compound and/or a trifunctional or higher polyhydric alcohol compound The branched polyester (B) is a carboxyl group having a specific range of carboxyl groups in the molecule, and is a total of residues of all the polycarboxylic acid compounds constituting the branched polyester (B) and all the polyol compound residues. When it is 200 mol%, the total of the isophthalic acid residue, the phthalic acid residue, and the cyclohexanedicarboxylic acid residue is 70 mol% or more, and the linear alkyl group having 1 to 4 carbon atoms is substituted for the bond. The total of the residues of the compound having at least one hydrogen atom on the carbon atom of the linear alkanediol having 3 to 5 carbon atoms is 20 mol% or more, and the glass transition temperature of the branched polyester (B) is Below 40 ° C, the metal fine particles (A) are contained in an amount of 600 to 1500 parts by weight based on 100 parts by weight of the branched polyester (B).

本發明所用之金屬微粒(A)之平均粒徑係藉由如下之方法而獲得:藉由電場放射型掃瞄電子顯微鏡而隨意所選出的5視野之金屬微粒,從各視野之中央而選擇最近的20個粒子,測定合計100個金屬微粒之直徑而彙整平均值的方法。還有,於各自的金屬微粒之直徑測定中,觀察形狀非圓形之情形下,將最長部長度與最短部長度之平均值設為其粒子之直徑。The average particle diameter of the metal fine particles (A) used in the present invention is obtained by a method of randomly selecting metal particles of five fields of view selected by an electric field radiation type scanning electron microscope, and selecting the nearest from the center of each field of view. 20 particles, a method of measuring the diameter of a total of 100 metal particles and collecting the average value. Further, in the measurement of the diameter of each of the metal fine particles, when the shape is not circular, the average of the longest portion length and the shortest portion length is defined as the diameter of the particles.

本發明所用之金屬微粒(A)之平均粒徑的上限係5×10-1 μm以下,較佳為2.5×10-1 μm以下,更佳為1×10-1 μm以下,進一步較佳為8×10-2 μm以下。若金屬微粒為過大時,具有金屬變得容易沉降且對導電性糊之分散安定性造成不良影響之情形,另外利用導電性糊而形成細線之情形下,具有細線再現性變差之情形。The upper limit of the average particle diameter of the metal fine particles (A) used in the present invention is 5 × 10 -1 μm or less, preferably 2.5 × 10 -1 μm or less, more preferably 1 × 10 -1 μm or less, further preferably 8 × 10 -2 μm or less. When the metal fine particles are excessively large, the metal tends to be easily deposited and adversely affects the dispersion stability of the conductive paste. In the case where the conductive paste is used to form a fine line, the fine line reproducibility may be deteriorated.

金屬微粒(A)之平均粒徑的下限並未予以特別限定,較佳為5×10-3 μm以上,更佳為1×10-2 μm以上,進一步較佳為4×10-2 μm以上。若金屬微粒之平均粒徑過小時,金屬微粒之分散將變得困難,為了保存安定之分散狀態,大量之樹脂黏著劑或其他之分散劑將成為必要,具有獲得高導電性之金屬薄膜將變得困難之情形。本發明所用之金屬微粒,若平均粒徑為5×10-1 μm以下的話,則混合不同的粒徑之物而使用也無妨。The lower limit of the average particle diameter of the metal fine particles (A) of not be particularly limited, but is preferably not less than 5 × 10 -3 μm, more preferably not less than 1 × 10 -2 μm, more preferably not less than 4 × 10 -2 μm . If the average particle diameter of the metal fine particles is too small, the dispersion of the metal fine particles becomes difficult, and in order to preserve the stable dispersion state, a large amount of a resin adhesive or other dispersant will become necessary, and a metal film having high conductivity will become a change. A difficult situation. When the metal fine particles used in the present invention have an average particle diameter of 5 × 10 -1 μm or less, it is also possible to use a mixture of particles having different particle diameters.

本發明所使用的金屬微粒(A),不論為藉由加熱處理而使微粒間進行熔融黏著者或不進行熔融黏著者皆為可能使用,更佳為進行熔融黏著者。金屬之種類可舉例:銅、鎳、鈷、銀、鉑、金、鉬、鈦等,特佳為銀、銅。此等之金屬微粒可以使用市售品,也能夠利用習知方法而調製。另外,也可以為積層異種金屬之構造者、對有機物或無機物實施金屬鍍敷者。The metal fine particles (A) used in the present invention may be used as long as they are melted or adhered to each other by heat treatment, and are preferably used for fusion bonding. The type of metal can be exemplified by copper, nickel, cobalt, silver, platinum, gold, molybdenum, titanium, etc., and particularly preferably silver or copper. These metal fine particles can be used as a commercially available product, and can be prepared by a known method. Further, it may be a structure in which a dissimilar metal is constructed, and a metal plating is applied to an organic or inorganic substance.

本發明所使用的金屬微粒(A)之形狀並未予以特別限定。可以為球狀、扁平狀、樹枝狀、棒狀等之形狀的粒子,或是混合此等中任一種或混合複數種者或凝聚之構造者。The shape of the metal fine particles (A) used in the present invention is not particularly limited. The particles may be in the form of a spherical shape, a flat shape, a dendritic shape, a rod shape, or the like, or may be a mixture of any one of them or a mixture of a plurality of species or agglomerates.

本發明之金屬微粒(A)的含有率較佳為導電性糊之20至80重量%,更佳為35至55重量%,進一步較佳為35至45重量%。若金屬微粒(A)佔導電性糊的含有率過低時,利用一次之塗布乾燥而獲致金屬薄膜層之厚度將變得困難。另外,為了使導電性糊之黏度變低,塗膜溢出將變得容易發生。樹脂黏著劑(B)與金屬微粒(A)之重量比係對導電性糊之分散安定性、塗膜與基材之緊貼性、塗膜之導電性等造成影響。相對於樹脂黏著劑(B)100重量份而言,此重量比較佳以600至1500重量份使用金屬微粒(A),特佳為800至1200重量份。藉由使用樹脂黏著劑(B),即使為能夠不損害塗膜之導電性的程度之少量使用,也能夠防止金屬微粒(A)之凝聚,具有優異的導電性糊之分散安定性、塗膜與基材之緊貼性。The content of the metal fine particles (A) of the present invention is preferably from 20 to 80% by weight, more preferably from 35 to 55% by weight, still more preferably from 35 to 45% by weight, based on the conductive paste. When the content of the metal fine particles (A) in the conductive paste is too low, it becomes difficult to obtain the thickness of the metal thin film layer by one application drying. Further, in order to lower the viscosity of the conductive paste, the coating film overflows easily. The weight ratio of the resin adhesive (B) to the metal fine particles (A) affects the dispersion stability of the conductive paste, the adhesion between the coating film and the substrate, and the conductivity of the coating film. The weight is preferably from 600 to 1500 parts by weight, based on 100 parts by weight of the resin adhesive (B), of the metal fine particles (A), particularly preferably from 800 to 1200 parts by weight. By using the resin adhesive (B), even if it can be used in a small amount without impairing the conductivity of the coating film, it is possible to prevent aggregation of the metal fine particles (A), and to have excellent dispersion stability of the conductive paste and coating film. Adhesion to the substrate.

本發明之分枝型聚酯(B)係含有作為共聚合成分的間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基之中的一種以上。環己二甲酸殘基更佳為環己烷-1,2-二甲酸殘基。藉由含有作為共聚合成分之此等二鹼氧化合物,發揮改良分枝型聚酯樹脂(B)之溶劑溶解性、有效地改善金屬微粒(A)之分散性與分散安定性的效果。The branched polyester (B) of the present invention contains one or more of an isophthalic acid residue, a phthalic acid residue and a cyclohexanedicarboxylic acid residue as a copolymerization component. The cyclohexanedicarboxylic acid residue is more preferably a cyclohexane-1,2-dicarboxylic acid residue. By containing these dibasic oxygen compounds as a copolymerization component, the solvent solubility of the branched polyester resin (B) is improved, and the dispersibility and dispersion stability of the metal fine particles (A) are effectively improved.

構成本發明之分枝型聚酯(B)之全部多元羧酸化合物殘基與全部多元醇化合物殘基的合計成為200莫耳%時,構成本發明之分枝型聚酯(B)之間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基的合計為70莫耳%以上。鄰苯二甲酸殘基與環己二甲酸殘基之合計更佳為20莫耳%以上且50莫耳%以下。藉由以如此之比率而共聚合二鹼氧化合物,發揮進一步改良所獲得之分枝型聚酯樹脂(B)之溶劑溶解性、有效地改善金屬微粒(A)之分散性與分散安定性的效果。構成本發明之分枝型聚酯(B)之間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基以外的多元羧酸化合物殘基也能夠使用對苯二甲酸、萘二甲酸等之芳香族二甲酸殘基;琥珀酸、己二酸、壬二酸、癸二酸、十二烷二酸、二聚物酸等之脂環族二甲酸等。When the total of the residue of the polyvalent carboxylic acid compound constituting the branched polyester (B) of the present invention and the total of the residues of all the polyol compounds is 200 mol%, it constitutes between the branched polyesters (B) of the present invention. The total of the phthalic acid residue, the phthalic acid residue and the cyclohexanedicarboxylic acid residue is 70 mol% or more. The total of the phthalic acid residue and the cyclohexanedicarboxylic acid residue is more preferably 20 mol% or more and 50 mol% or less. By copolymerizing the dibasic oxygen compound at such a ratio, the solvent solubility of the branched polyester resin (B) obtained is further improved, and the dispersibility and dispersion stability of the metal fine particles (A) are effectively improved. effect. The residue of the polycarboxylic acid compound other than the phthalic acid residue, the phthalic acid residue and the cyclohexanedicarboxylic acid residue constituting the branched polyester (B) of the present invention can also be used, and terephthalic acid or naphthalene can also be used. An aromatic dicarboxylic acid residue such as dicarboxylic acid; an alicyclic dicarboxylic acid such as succinic acid, adipic acid, sebacic acid, sebacic acid, dodecanedioic acid or dimer acid.

該分枝型聚酯(B)係含有作為共聚合成分之利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的化合物。藉由含有作為共聚合成分之此等二醇化合物而改良分枝型聚酯樹脂(B)之溶劑溶解性且有效地改善金屬微粒(A)之分散性與分散安定性。The branched polyester (B) contains at least one of a carbon atom having 1 to 4 carbon atoms as a copolymer component and a carbon atom bonded to a linear alkanediol having 3 to 5 carbon atoms. A compound of a hydrogen atom. By including these diol compounds as a copolymerization component, the solvent solubility of the branched polyester resin (B) is improved, and the dispersibility and dispersion stability of the metal fine particles (A) are effectively improved.

構成該分枝型聚酯(B)之全部多元羧酸化合物殘基與全部多元醇化合物殘基的合計成為200莫耳%時,構成本發明之分枝型聚酯(B)之利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的化合物之殘基的合計為20莫耳%以上,藉由共聚合此等之二醇化合物,發揮進一步改良分枝型聚酯樹脂(B)之溶劑溶解性、進一步有效地改善金屬微粒(A)之分散性與分散安定性的效果。利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的具體例,較佳為2-甲基-1,3-丙二醇、2,2-二甲基-1,3-丙二醇、2,2-二乙基-1,3-丙二醇、2-乙基-2-丁基-1,3-丙二醇、3-甲基-1,5-戊二醇、2,4-二乙基-1,5-戊二醇等,特佳為2-甲基-1,3-丙二醇、2,2-二甲基-1,3-丙二醇、2-乙基-2-丁基-1,3-丙二醇等之利用碳數1至4之直鏈烷基而取代鍵結於1,3-丙二醇之2位碳的氫之化合物殘基。利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的化合物以外的多元醇化合物殘基能夠使用乙二醇、1,3-丙二醇等之直鏈脂肪族二醇。When the total number of residues of all the polyvalent carboxylic acid compounds constituting the branched polyester (B) and the total number of residues of all the polyol compounds is 200 mol%, the carbon number of the branched polyester (B) constituting the present invention is used. The total of the residues of the linear alkyl group of 1 to 4 and the compound of at least one hydrogen atom bonded to the carbon atom of the linear alkanediol having 3 to 5 carbon atoms is 20 mol% or more, by a total of By polymerizing these diol compounds, the solvent solubility of the branched polyester resin (B) is further improved, and the dispersibility and dispersion stability of the metal fine particles (A) are further effectively improved. A specific example of replacing at least one hydrogen atom bonded to a carbon atom of a linear alkanediol having 3 to 5 carbon atoms by using a linear alkyl group having 1 to 4 carbon atoms is preferably 2-methyl-1. 3-propanediol, 2,2-dimethyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-ethyl-2-butyl-1,3-propanediol, 3- Methyl-1,5-pentanediol, 2,4-diethyl-1,5-pentanediol, etc., particularly preferably 2-methyl-1,3-propanediol, 2,2-dimethyl- a 1,3-propanediol, 2-ethyl-2-butyl-1,3-propanediol or the like which uses a linear alkyl group having 1 to 4 carbon atoms instead of hydrogen bonded to a 2-position carbon of 1,3-propanediol Compound residue. The residue of the polyol compound other than the compound having at least one hydrogen atom bonded to the carbon atom of the linear alkanediol having 3 to 5 carbon atoms by using a linear alkyl group having 1 to 4 carbon atoms can be used. a linear aliphatic diol such as 1,3-propanediol.

本發明之分枝型聚酯(B)係具有起因於3官能以上之多元羧酸化合物及/或3官能以上之多元醇化合物的分枝點。3官能以上之多元羧酸較佳為芳香族多元羧酸,具體例可舉例:偏苯三酸、均苯三酸、均苯四酸等之1分子中具有3個以上之羧基的化合物,也能夠併用複數種。另一方面,3官能以上之多元醇化合物較佳為脂肪族多元醇,可舉例:甘油、三羥基乙烷、三羥基丙烷、季戊四醇等之1分子中具有3個以上之羥基的化合物,也能夠併用複數種。另外,也能夠併用3官能以上之多元羧酸與3官能以上之多元醇化合物。The branched polyester (B) of the present invention has a branching point derived from a trifunctional or higher polycarboxylic acid compound and/or a trifunctional or higher polyhydric alcohol compound. The polyvalent carboxylic acid having a trifunctional or higher functional group is preferably an aromatic polybasic carboxylic acid, and specific examples thereof include compounds having three or more carboxyl groups in one molecule such as trimellitic acid, trimesic acid, and pyromellitic acid. Can use multiple kinds together. On the other hand, the trifunctional or higher polyhydric alcohol compound is preferably an aliphatic polyhydric alcohol, and examples thereof include compounds having three or more hydroxyl groups in one molecule such as glycerin, trihydroxyethane, trihydroxypropane or pentaerythritol. And use a variety of species. Further, a trifunctional or higher polyvalent carboxylic acid and a trifunctional or higher polyhydric alcohol compound can also be used in combination.

於使構成該分枝型聚酯(B)之全部多元羧酸化合物殘基與全部多元醇化合物殘基的合計成為200莫耳%時,3官能以上之多元羧酸化合物與3官能以上之多元醇化合物之合計的共聚合比率較佳為0.1莫耳%以上且10莫耳%以下,更佳為0.3至5莫耳%,進一步較佳為1至3莫耳%。若該分枝成分之共聚合比例過低時,所獲得之分枝型聚酯(B)的分子末端數將變少,便無法將充分量之極性基導入分子末端;若過高時,具有在分枝型聚酯(B)的聚合過程引起凝膠化之可能性高且生產安定性發生問題之傾向。When the total of all the polyvalent carboxylic acid compound residues and the total polyol compound residues constituting the branched polyester (B) is 200 mol%, the trifunctional or higher polycarboxylic acid compound and the trifunctional or higher polyhydric compound The total copolymerization ratio of the alcohol compound is preferably 0.1 mol% or more and 10 mol% or less, more preferably 0.3 to 5 mol%, still more preferably 1 to 3 mol%. If the copolymerization ratio of the branch component is too low, the number of molecular terminals of the branched polyester (B) obtained will be small, and a sufficient amount of polar groups cannot be introduced into the molecular terminal; if it is too high, The polymerization process of the branched polyester (B) tends to cause gelation and has a tendency to cause problems in production stability.

本發明之分枝型聚酯(B)係具有30.當量/106 g以上且200當量/106 g以下之酸價,更佳為40當量/106 g以上且180當量/106 g以下。將酸價賦予分枝型聚酯(B)之方法係藉由聚合使上述3官能以上之多元羧酸、多元醇化合物共聚合的分枝型聚酯後,於惰性氣體環境下使各種的多價羧酸酐熔融混合且藉由主要在分子末端使其開環加成而能夠獲得。具體之多價羧酸酐可舉例:偏苯三酸酐、均苯四酸酐、二苯甲酮四酸酐、3,3’,4,4’-雙(苯醯氧基)乙烯四酸酐、琥珀酸酐等,從反應性之觀點,最好為偏苯三酸酐。此等分子中所導入的羧基係具有使分枝型聚酯分子有效地吸附於金屬超微粒表面且提高糊狀態下之金屬微粒的分散性及分散安定性的效果。The branched polyester (B) of the present invention has an acid value of 30.sup./10 6 g or more and 200 equivalents/10 6 g or less, more preferably 40 equivalents/10 6 g or more and 180 equivalents/10 6 g. the following. The method of imparting an acid value to the branched polyester (B) is a branched polyester obtained by copolymerizing the above-mentioned trifunctional or higher polycarboxylic acid or a polyhydric alcohol compound, and then various kinds in an inert gas atmosphere. The valence carboxylic anhydride is melt mixed and can be obtained by subjecting it to ring-opening addition mainly at the molecular end. Specific polyvalent carboxylic acid anhydrides can be exemplified by trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, 3,3', 4,4'-bis(phenylhydroxy)ethylene tetracarboxylic anhydride, succinic anhydride, etc. The viewpoint of sex is preferably trimellitic anhydride. The carboxyl group introduced in these molecules has an effect of efficiently adsorbing the branched polyester molecules on the surface of the metal ultrafine particles and improving the dispersibility and dispersion stability of the metal fine particles in a paste state.

本發明之分枝型聚酯(B)係玻璃轉移溫度低於40℃。於40℃以上,將發生難以獲得塗布/乾燥聚醯亞胺薄膜等之基材表面與金屬微粒糊所獲得的微粒金屬分散層之界面緊貼性的弊害。將分枝型聚酯(B)之玻璃轉移溫度設定於低於40℃之方法,例如,可舉例:構成分枝型聚酯(B)之酸成分之間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基以外之多元羧酸化合物係於低於30莫耳%之範圍內使其共聚合碳數4以上之脂肪族系二鹼氧化合物的方法、或二醇成分係使碳數5以上之脂肪族二醇成分化合物共聚合的方法。碳數4以上之脂肪族系二鹼氧化合物可舉例:己二酸、壬二酸、癸二酸、十二烷二酸、二聚物酸等。另一方面,碳數5以上之脂環族系二醇化合物,可舉例:1,5-戊二醇、1,6-己二醇、2,2-二乙基-1,3-丙二醇、2-乙基-2-丁基-1,3-丙二醇、3-甲基-1,5-季戊四醇、2,4-二乙基-1,5-戊二醇等。The branched polyester (B) of the present invention has a glass transition temperature of less than 40 °C. At 40 ° C or higher, it is difficult to obtain the interface adhesion between the surface of the substrate coated with the coated/dried polyimide film and the fine metal dispersion layer obtained by the metal fine particle paste. The method for setting the glass transition temperature of the branched polyester (B) to less than 40 ° C, for example, exemplified by the phthalic acid residue between the acid components constituting the branched polyester (B), phthalic acid A method or a diol component in which a polycarboxylic acid compound other than a formic acid residue and a cyclohexanedicarboxylic acid residue is copolymerized in an amount of less than 30 mol% to copolymerize an aliphatic dibasic oxygen compound having 4 or more carbon atoms A method of copolymerizing an aliphatic diol component compound having 5 or more carbon atoms. Examples of the aliphatic dibasic oxygen compound having 4 or more carbon atoms include adipic acid, sebacic acid, sebacic acid, dodecanedioic acid, and dimer acid. On the other hand, examples of the alicyclic diol compound having 5 or more carbon atoms include 1,5-pentanediol, 1,6-hexanediol, and 2,2-diethyl-1,3-propanediol. 2-ethyl-2-butyl-1,3-propanediol, 3-methyl-1,5-pentaerythritol, 2,4-diethyl-1,5-pentanediol, and the like.

基於金屬微粒之分散性、與基材之接著性等,本發明之分枝型聚酯(B)之數量平均分子量較佳為4,000至100,000,特佳為8,000至50,000。The branched polyester (B) of the present invention preferably has a number average molecular weight of from 4,000 to 100,000, particularly preferably from 8,000 to 50,000, based on the dispersibility of the metal particles, the adhesion to the substrate, and the like.

本發明之導電性糊所使用的有機溶劑(C)係由溶解分枝型聚酯(B)者所選出。有機溶劑(C)係除了擔負於導電性糊中使金屬微粒(A)分散的功能以外,也具有調整導電性糊之黏度與流動性的功能。有機溶劑(C)之例子可舉例:醇、醚、酮、酯、芳香族烴、醯胺等。較佳的例子可舉例:乙基乙酸卡必醇酯、丁基溶纖劑乙酸酯、甲基乙基酮、環己酮、正丁基醇、第二丁醇、第三丁醇等。The organic solvent (C) used in the conductive paste of the present invention is selected from those in which the branched polyester (B) is dissolved. The organic solvent (C) has a function of adjusting the viscosity and fluidity of the conductive paste in addition to the function of dispersing the metal fine particles (A) in the conductive paste. Examples of the organic solvent (C) are exemplified by alcohols, ethers, ketones, esters, aromatic hydrocarbons, decylamines and the like. Preferable examples are acetoacetic acid carbitol ester, butyl cellosolve acetate, methyl ethyl ketone, cyclohexanone, n-butyl alcohol, second butanol, third butanol and the like.

本發明之導電性糊中,必要時也可以摻合硬化劑(D)。能夠使用於本發明之硬化劑(D)可舉例:酚樹脂、胺基樹脂、異氰酸酯化合物、環氧樹脂等。硬化劑之用量較佳為分枝型聚酯(B)之1至30重量%之範圍。藉由摻合硬化劑(D),具有發揮進一步使得由基材與本發明之導電性糊所形成的導電層界面之緊貼性提高的效果之情形。In the conductive paste of the present invention, the curing agent (D) may be blended if necessary. The hardener (D) which can be used in the present invention can be exemplified by a phenol resin, an amine resin, an isocyanate compound, an epoxy resin or the like. The amount of the hardener is preferably in the range of from 1 to 30% by weight of the branched polyester (B). By blending the curing agent (D), there is a case where the effect of further improving the adhesion between the substrate and the conductive layer formed by the conductive paste of the present invention is exhibited.

本發明之導電性糊係含有作為必要成分之對金屬微粒(A)具有分散機能的分枝型聚酯(B),也可以進一步摻合其他之分散劑。分散劑可舉例:硬脂酸、油酸、十四烷酸等之高級脂肪酸、脂肪酸醯胺、脂肪酸金屬鹽、磷酸酯、磺酸酯等。分散劑之用量較佳為分枝型聚酯(B)之0.1至10重量%的範圍。The conductive paste of the present invention contains, as an essential component, a branched polyester (B) having a dispersing function for the metal fine particles (A), and may further blend other dispersing agents. The dispersant may, for example, be a higher fatty acid such as stearic acid, oleic acid or myristic acid, a fatty acid guanamine, a fatty acid metal salt, a phosphate ester, a sulfonate or the like. The amount of the dispersant is preferably in the range of from 0.1 to 10% by weight based on the branched polyester (B).

製造本發明之導電性糊之方法能夠使用將粉體分散於液體中之一般性方法。例如,金屬微粒(A)與分枝型聚酯(B)之溶液,必要時最好混合由追加之溶劑所構成的混合物後,實施利用超音波法、混合機法、3輥法、球磨機法等分散。此等分散手段之際,也能夠組合複數種而進行分散。此等之分散處理可以在室溫下進行,也可以加熱而進行。The method of producing the conductive paste of the present invention can use a general method of dispersing a powder in a liquid. For example, a solution of the metal fine particles (A) and the branched polyester (B) is preferably mixed with a mixture of additional solvents as necessary, and then subjected to an ultrasonic method, a mixer method, a 3-roll method, and a ball mill method. Equal dispersion. When these dispersion means are used, it is also possible to combine a plurality of types and to perform dispersion. These dispersion treatments can be carried out at room temperature or by heating.

針對使用本發明之導電性糊而在基材上形成金屬薄膜層,能夠利用將液狀分散體塗布於基材之情形所用之一般方法。例如,可舉例:網板印刷法、浸漬塗布法、噴霧塗布法、旋轉塗布法、噴墨法、凸版印刷法、凹版印刷法等。從藉由印刷或塗布所形成的塗膜,藉由加熱、減壓、送風或此等之複合等之操作、或是藉由自然乾燥、藉由使溶劑之至少一部分蒸發而能夠形成金屬薄膜層。A general method for forming a metal thin film layer on a substrate by using the conductive paste of the present invention can be applied to a case where a liquid dispersion is applied to a substrate. For example, a screen printing method, a dip coating method, a spray coating method, a spin coating method, an inkjet method, a relief printing method, a gravure printing method, or the like can be exemplified. A metal thin film layer can be formed from a coating film formed by printing or coating by heat, decompression, air blowing, or the like, or by natural drying, by evaporating at least a portion of the solvent. .

藉由金屬薄膜層之形成方法係導電性糊之黏度將對塗布作業性或所獲得之金屬薄膜層的性能帶來大的影響之情形。一般而言,由於降低導電性糊之黏度而具有提高有機溶劑的摻合比例與容易引起金屬微粒的沉降之傾向,藉由於分散介質中含有分枝型聚酯(B),即使低黏度也具有能夠抑制金屬微粒的沉降之傾向。The method of forming the metal thin film layer is a case where the viscosity of the conductive paste greatly affects the coating workability or the performance of the obtained metal thin film layer. In general, since the viscosity of the conductive paste is lowered to increase the blending ratio of the organic solvent and tend to cause sedimentation of the metal fine particles, since the dispersion medium contains the branched polyester (B), even if the viscosity is low, It is possible to suppress the tendency of the metal particles to settle.

較佳為形成金屬薄膜層後,於金屬薄膜層未被破壞之範內進行壓延處理(加壓處理)。藉由壓延處理而具有提高金屬薄膜層的導電性之傾向。一般而言,所謂壓延處理係於金屬輥與彈性輥之間進行按照材料之線壓-例如1至100 kg/cm之加壓處理。壓延處理特佳為加熱至分枝型聚酯(B)之玻璃轉移溫度以上之溫度而進行。壓延處理也可以在將其他層積層於金屬薄膜層之狀態下進行。Preferably, after the metal thin film layer is formed, the metal thin film layer is subjected to a rolling treatment (pressure treatment) without being damaged. There is a tendency to increase the conductivity of the metal thin film layer by the rolling treatment. In general, the calendering treatment is carried out between a metal roll and an elastic roll under a line pressure of the material, for example, a press treatment of 1 to 100 kg/cm. The calendering treatment is particularly preferably carried out by heating to a temperature higher than the glass transition temperature of the branched polyester (B). The calendering treatment can also be carried out in a state in which other layers are laminated on the metal thin film layer.

於根據本發明所獲得之導電性之金屬薄膜層中,更佳為實施燒製處理。燒製處理係於金屬微粒之粒徑為100 nm以下之情形,具有發揮特別高的效果之傾向。根據金屬微粒之結晶化度或氧化度等之表面狀態而異,但在所謂的奈米粒子之情形,表面活性大,在遠較一般所習知的大量之熔點為低的溫度下開始熔融黏著。還有,於本發明中,所謂燒製處理係指在金屬微粒(A)之至少一部分產生熔融粘著的加熱處理,分枝型聚酯(B)之分解或逸散則無必要。In the conductive metal thin film layer obtained according to the present invention, it is more preferable to carry out a baking treatment. The firing treatment tends to exhibit a particularly high effect when the particle diameter of the metal fine particles is 100 nm or less. Depending on the surface state of the metal particles such as the degree of crystallization or the degree of oxidation, in the case of so-called nanoparticles, the surface activity is large, and melting is started at a temperature far lower than a conventionally known large melting point. . Further, in the present invention, the "burning treatment" refers to a heat treatment in which at least a part of the metal fine particles (A) is melted and adhered, and the decomposition or scattering of the branched polyester (B) is not necessary.

[實施例][Examples]

以下,列舉實施例而用以進一步詳細說明本發明,本發明並不受實施例所任何限定。還有,實施例中所記載的測定值係利用以下之方法所測出者。另外,只要無特別申明,份係表示重量份。The present invention is further illustrated by the following examples, which are not intended to limit the invention. Further, the measured values described in the examples were measured by the following methods. In addition, parts are parts by weight unless otherwise stated.

以下,在實施例中之本文及表中所示之化合物的簡稱分別表示以下之化合物:Hereinafter, the abbreviations of the compounds shown in the tables and tables in the examples respectively indicate the following compounds:

T:對苯二甲酸T: terephthalic acid

I:間苯二甲酸I: isophthalic acid

O:鄰苯二甲酸O: Phthalic acid

SIPA:間苯二甲酸-5-磺酸鈉SIPA: sodium isophthalate-5-sulfonate

HOPA:加氫鄰苯二甲酸HOPA: hydrogenated phthalic acid

AA:己二酸AA: adipic acid

SA:癸二酸SA: azelaic acid

TMA:偏苯三酸酐TMA: trimellitic anhydride

NPG:新戊二醇NPG: neopentyl glycol

EG:乙二醇EG: ethylene glycol

PD:1,5-戊二醇PD: 1,5-pentanediol

HD:1,6-己二醇HD: 1,6-hexanediol

2MD:2-甲基-1,3-丙二醇2MD: 2-methyl-1,3-propanediol

BEPD:2-丁基-2-乙基-1,3-丁二醇BEPD: 2-butyl-2-ethyl-1,3-butanediol

DEG:二乙二醇DEG: Diethylene glycol

樹脂組成:將試料溶解於重氯仿中,使用400 MHz之核磁共振(NMR)光譜裝置(Varian製),藉由1 H-NMR法而定量。測定條件係d1=26s。Resin composition: The sample was dissolved in heavy chloroform, and quantified by a 1 H-NMR method using a 400 MHz nuclear magnetic resonance (NMR) spectrometer (manufactured by Varian). The measurement conditions were d1 = 26 s.

數量平均分子量:使樹脂濃度成為0.5重量%左右的方式來將試料溶解於四氫呋喃中,利用孔徑0.5 μm之聚四氟乙烯製濾膜所過濾之物作為測定用試料,藉由將四氫呋喃作為移動相且將微差折射計作為檢測器之凝膠滲透層析儀而測定數量平均分子量。流速係設為1 mL/分鐘、溫度係設為30℃。將昭和電工製KF-802、804L、806L使用於管柱。於分子量標準中係使用單分散聚苯乙烯。The number average molecular weight is such that the sample is dissolved in tetrahydrofuran so that the resin concentration is about 0.5% by weight, and the material filtered by a polytetrafluoroethylene filter having a pore diameter of 0.5 μm is used as a sample for measurement, and tetrahydrofuran is used as a mobile phase. The number average molecular weight was measured by using a differential refractometer as a gel permeation chromatograph of the detector. The flow rate was set to 1 mL/min and the temperature system was set to 30 °C. KF-802, 804L, and 806L manufactured by Showa Denko are used in the column. Monodisperse polystyrene is used in the molecular weight standard.

比重:將試料約0.1 g置入水溫30℃之氯化鈣水溶液中,調整氯化鈣濃度且利用比重計而測定使樹脂成為不沉澱之際的氯化鈣水溶液之比重,根據此值而設為樹脂比重。Specific gravity: Approximately 0.1 g of the sample is placed in an aqueous solution of calcium chloride at a water temperature of 30 ° C, and the concentration of calcium chloride is adjusted, and the specific gravity of the calcium chloride aqueous solution at the time when the resin is not precipitated is measured by a hydrometer. Set to the specific gravity of the resin.

酸價:將樹脂0.2 g溶解於20 ml之四氫呋喃中之後,利用0.1 N NaOH乙醇溶液且以酚酞作為指示劑而測定。以樹脂固形物106 g中之當量表示測定值。Acid value: 0.2 g of the resin was dissolved in 20 ml of tetrahydrofuran, and then measured with a 0.1 N NaOH ethanol solution using phenolphthalein as an indicator. The measured value is represented by the equivalent of 10 6 g of the resin solid matter.

玻璃轉移溫度:將試料5 mg置入鋁盤內而密封,使用Seiko Instruments(股)製微掃瞄熱量分析計DSC-220,以升溫速度20℃/分鐘,直到200℃為止而測定,在玻璃轉移溫度以下之基線的延長線與顯示在轉變部之最大傾斜的連線交點之溫度而求得。Glass transition temperature: 5 mg of the sample was placed in an aluminum pan and sealed, and a micro-scanning calorimeter DSC-220 manufactured by Seiko Instruments was used, and the temperature was measured at a heating rate of 20 ° C / min until 200 ° C. The extension line of the baseline below the transfer temperature is determined from the temperature at the intersection of the line showing the maximum inclination of the transition portion.

導電性:使用橫河M & C公司製直流精密測定器Double Bridge 2769-10而測定。導電性係以體積電阻係數(單位:Ω‧cm)表示。Conductivity: Measured using a DC precision measuring device, Double Bridge 2769-10, manufactured by Yokogawa M & C. Conductivity is expressed by volume resistivity (unit: Ω ‧ cm).

分散安定性:觀察於30℃、24小時靜置導電性糊後之沉澱的有無。Dispersion stability: The presence or absence of precipitation after standing on a conductive paste at 30 ° C for 24 hours was observed.

○-無沉澱。○ - no precipitation.

△-確認少量沉澱,沉澱量係全部金屬微粒之20重量%以下。△ - A small amount of precipitate was confirmed, and the amount of precipitation was 20% by weight or less of all the metal fine particles.

╳-具有大量之沉澱。沉澱量係超過全部金屬微粒之20重量%。╳ - has a large amount of precipitation. The amount of precipitation exceeded 20% by weight of all metal particles.

基材緊貼性:藉由常溫下之膠帶剝離試驗而評估對基材之金屬薄膜層的緊貼性。剝離試驗係貼附住友3M製Scotch膠帶,觀察剝離此膠帶之際的金屬薄膜層之剝離狀態。Substrate adhesion: The adhesion to the metal film layer of the substrate was evaluated by a tape peeling test at room temperature. In the peeling test, a Scotch tape made of Sumitomo 3M was attached, and the peeling state of the metal thin film layer at the time of peeling off the tape was observed.

○-無剝離。○-No peeling.

△-一部分剝離。△ - Partial peeling.

╳-全面剝離。╳ - Fully stripped.

所用之金屬微粒Metal particles used 銀微粒(1):Silver particles (1):

藉由抗壞血酸與十二烷基胺,在己烷中還原硝酸銀而獲得。洗淨、乾燥後,藉由穿透型電子顯微鏡而觀察,為平均粒徑60 nm之球狀粒子。It is obtained by reducing silver nitrate in hexane by ascorbic acid and dodecylamine. After washing and drying, it was observed by a transmission electron microscope to be spherical particles having an average particle diameter of 60 nm.

銀微粒(2):Silver particles (2):

藉由氫硼化鈉與十二烷基胺,在己烷中還原硝酸銀而獲得。洗淨、乾燥後,藉由穿透型電子顯微鏡而觀察,為平均粒徑830 nm之球狀粒子。It is obtained by reducing silver nitrate in hexane by sodium borohydride and dodecylamine. After washing and drying, it was observed by a transmission electron microscope to be spherical particles having an average particle diameter of 830 nm.

銀微粒(3):Silver particles (3):

藉由抗壞血酸與辛胺,在己烷中還原硝酸銀而獲得。洗淨、乾燥後,藉由穿透型電子顯微鏡而觀察,為平均粒徑143 nm之球狀粒子。It is obtained by reducing silver nitrate in hexane by ascorbic acid and octylamine. After washing and drying, it was observed by a transmission electron microscope to be spherical particles having an average particle diameter of 143 nm.

合成例1含有羧基之分枝聚酯(b1)之合成Synthesis Example 1 Synthesis of Branched Polyester (b1) Containing Carboxyl Group

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯131.9份、新戊二醇48.0份、1,6-己二醇122.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加鄰苯二甲酸酐43.7份、偏苯三酸酐3.8份且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,在氮氣環境中,將反應系統回到常壓,並將系統之溫度設定為220℃。添加偏苯三酸酐1.9份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b1)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 131.9 parts of dimethyl isophthalate, 48.0 parts of neopentyl glycol, 122.0 parts of 1,6-hexanediol, and tetrabutoxy titanate were fed. 0.1 part was heated at 150 to 230 ° C for 180 minutes, and after transesterification, 43.7 parts of phthalic anhydride and 3.8 parts of trimellitic anhydride were added, and the esterification reaction was carried out at 200 to 250 ° C for 60 minutes. Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under this condition, the reaction system was returned to normal pressure in a nitrogen atmosphere, and the temperature of the system was set to 220 °C. 1.9 parts of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b1). The analysis results of the obtained resin are shown in Tables 1 and 2.

合成例2含有羧基之分枝聚酯(b2)之合成Synthesis Example 2 Synthesis of Branched Polyester (b2) Containing Carboxyl Group

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯131.9份、新戊二醇48.0份、1,6-己二醇122.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加鄰苯二甲酸酐42.9份、偏苯三酸酐3.8份且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,在氮氣環境中,將反應系統回到常壓,並將系統之溫度設定為220℃。添加偏苯三酸酐3.8份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b2)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 131.9 parts of dimethyl isophthalate, 48.0 parts of neopentyl glycol, 122.0 parts of 1,6-hexanediol, and tetrabutoxy titanate were fed. 0.1 part was heated at 150 to 230 ° C for 180 minutes, and after transesterification, 42.9 parts of phthalic anhydride and 3.8 parts of trimellitic anhydride were added, and the esterification reaction was carried out at 200 to 250 ° C for 60 minutes. Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under this condition, the reaction system was returned to normal pressure in a nitrogen atmosphere, and the temperature of the system was set to 220 °C. 3.8 parts of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b2). The analysis results of the obtained resin are shown in Tables 1 and 2.

合成例3含有羧基之分枝聚酯(b3)之合成Synthesis Example 3 Synthesis of Branched Polyester (b3) Containing Carboxyl Group

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯131.9份、新戊二醇48.0份、1,6-己二醇122.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加鄰苯二甲酸酐44.1份、偏苯三酸酐3.8份且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,在氮氣環境中,將反應系統回到常壓,並將系統之溫度設定為220℃。添加偏苯三酸酐1份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b3)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 131.9 parts of dimethyl isophthalate, 48.0 parts of neopentyl glycol, 122.0 parts of 1,6-hexanediol, and tetrabutoxy titanate were fed. 0.1 part was heated at 150 to 230 ° C for 180 minutes, and after transesterification, 44.1 parts of phthalic anhydride and 3.8 parts of trimellitic anhydride were added, and the esterification reaction was carried out at 200 to 250 ° C for 60 minutes. Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under this condition, the reaction system was returned to normal pressure in a nitrogen atmosphere, and the temperature of the system was set to 220 °C. 1 part of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b3). The analysis results of the obtained resin are shown in Tables 1 and 2.

合成例4含有羧基之分枝聚酯(b4)之合成Synthesis Example 4 Synthesis of Branched Polyester (b4) Containing Carboxyl Group

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯97.0份、2-甲基-1,3-丙二醇153.0份、2-丁基-2-乙基-1,3-丙二醇48.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加加氫鄰苯二甲酸45.4份、己二酸26.3份、偏苯三酸酐3.8份且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,在氮氣環境中,將反應系統回到常壓,並將系統之溫度設定為220℃。添加偏苯三酸酐1.9份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b4)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 97.0 parts of dimethyl isophthalate, 153.0 parts of 2-methyl-1,3-propanediol, and 2-butyl-2-ethyl-1 were fed. 48.0 parts of 3-propanediol and 0.1 part of tetrabutoxy titanate were heated at 150 to 230 ° C for 180 minutes, and after transesterification, 45.4 parts of hydrogenated phthalic acid, 26.3 parts of adipic acid, and 3.8 parts of trimellitic anhydride were added. And the esterification reaction was carried out at 200 to 250 ° C for 60 minutes. Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under this condition, the reaction system was returned to normal pressure in a nitrogen atmosphere, and the temperature of the system was set to 220 °C. 1.9 parts of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b4). The analysis results of the obtained resin are shown in Tables 1 and 2.

合成例5含有羧基之分枝聚酯(b5)之合成Synthesis Example 5 Synthesis of Branched Polyester (b5) Containing Carboxyl Group

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯131.9份、2-甲基-1,3-丙二醇99.0份、1,5-戊二醇94.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加加氫鄰苯二甲酸45.4份、偏苯三酸酐3.8份且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,在氮氣環境中,將反應系統回到常壓,並將系統之溫度設定為220℃。添加偏苯三酸酐1.9份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b5)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 131.9 parts of dimethyl isophthalate, 99.0 parts of 2-methyl-1,3-propanediol, 94.0 parts of 1,5-pentanediol, and 0.1 part of tetrabutyl titanate was heated at 150 to 230 ° C for 180 minutes, and after transesterification, 45.4 parts of hydrogenated phthalic acid and 3.8 parts of trimellitic anhydride were further added, and the esterification reaction was carried out at 200 to 250 ° C for 60 minutes. Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under this condition, the reaction system was returned to normal pressure in a nitrogen atmosphere, and the temperature of the system was set to 220 °C. 1.9 parts of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b5). The analysis results of the obtained resin are shown in Tables 1 and 2.

比較合成例6不加成羧基之分枝聚酯(b6)之合成Comparison of the synthesis of branched polyester (b6) without synthesis of carboxyl groups in Synthesis Example 6.

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯131.9份、新戊二醇48.0份、1,6-己二醇122.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加鄰苯二甲酸酐44.4份、偏苯三酸酐3.8份且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,不添加偏苯三酸酐而結束反應,獲得淡黃色透明之聚酯(b6)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 131.9 parts of dimethyl isophthalate, 48.0 parts of neopentyl glycol, 122.0 parts of 1,6-hexanediol, and tetrabutoxy titanate were fed. 0.1 part was heated at 150 to 230 ° C for 180 minutes, and after transesterification, 44.4 parts of phthalic anhydride and 3.8 parts of trimellitic anhydride were added, and the esterification reaction was carried out at 200 to 250 ° C for 60 minutes. Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under the above conditions, the reaction was terminated without adding trimellitic anhydride, and a pale yellow transparent polyester (b6) was obtained. The analysis results of the obtained resin are shown in Tables 1 and 2.

比較合成例7含有羧基之分枝聚酯(b7)之合成Comparative Synthesis Example 7 Synthesis of Branched Polyester (b7) Containing Carboxyl Group

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料對苯二甲酸二甲酯95.1份、間苯二甲酸二甲酯94.1份、偏苯三酸酐3.8份、2,2-二甲基-1,3-丙二醇73.0份、乙二醇81.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,於30分鐘而將反應系統升溫至250℃,接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,在氮氣環境中,將反應系統回到常壓,並將系統之溫度設定為220℃。添加偏苯三酸酐1.9份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b7)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 95.1 parts of dimethyl terephthalate, 94.1 parts of dimethyl isophthalate, 3.8 parts of trimellitic anhydride, and 2,2-dimethyl-1 were fed. 73.0 parts of 3-propanediol, 81.0 parts of ethylene glycol, and 0.1 part of tetrabutoxy titanate were heated at 150 to 230 ° C for 180 minutes, and after transesterification, the reaction system was heated to 250 ° C for 30 minutes, and then, The system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under this condition, the reaction system was returned to normal pressure in a nitrogen atmosphere, and the temperature of the system was set to 220 °C. 1.9 parts of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b7). The analysis results of the obtained resin are shown in Tables 1 and 2.

比較合成例8含有羧基之聚酯(b8)之合成Comparative Synthesis Example 8 Synthesis of a Carboxyl Group-Containing Polyester (b8)

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯135.8份、新戊二醇48.0份、1,6-己二醇122.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加鄰苯二甲酸酐43.7份、且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,在氮氣環境中,將反應系統回到常壓,並將系統之溫度設定為220℃。添加偏苯三酸酐1.9份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b8)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 135.8 parts of dimethyl isophthalate, 48.0 parts of neopentyl glycol, 122.0 parts of 1,6-hexanediol, and tetrabutoxy titanate were fed. 0.1 part was heated at 150 to 230 ° C for 180 minutes, and after transesterification, 43.7 parts of phthalic anhydride was added, and the esterification reaction was carried out at 200 to 250 ° C for 60 minutes. Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under this condition, the reaction system was returned to normal pressure in a nitrogen atmosphere, and the temperature of the system was set to 220 °C. 1.9 parts of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b8). The analysis results of the obtained resin are shown in Tables 1 and 2.

比較合成例9含有羧基之分枝聚酯(b9)之合成Comparative Synthesis Example 9 Synthesis of Branched Polyester (b9) Containing Carboxyl Group

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料對苯二甲酸二甲酯92.2份、間苯二甲酸二甲酯97.0份、偏苯三酸酐3.8份、乙二醇99.2份、二乙二醇42.4份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,於30分鐘而將反應系統升溫至250℃,接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,在氮氣環境中,將反應系統回到常壓,並將系統之溫度設定為220℃。添加偏苯三酸酐1.9份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b9)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 92.2 parts of dimethyl terephthalate, 97.0 parts of dimethyl isophthalate, 3.8 parts of trimellitic anhydride, 99.2 parts of ethylene glycol, and diethylene glycol were fed. 42.4 parts and 0.1 part of tetrabutoxy titanate were heated at 150 to 230 ° C for 180 minutes, and after transesterification, the reaction system was heated to 250 ° C for 30 minutes, and then the temperature was raised until 260 ° C and slowly The system was depressurized and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under this condition, the reaction system was returned to normal pressure in a nitrogen atmosphere, and the temperature of the system was set to 220 °C. 1.9 parts of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b9). The analysis results of the obtained resin are shown in Tables 1 and 2.

比較合成例10含有羧基之分枝聚酯(b10)之合成Comparative Synthesis Example 10 Synthesis of Branched Polyester (b10) Containing Carboxyl Group

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯131.9份、新戊二醇48.0份、1,6-己二醇122.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加鄰苯二甲酸酐42.2份、偏苯三酸酐3.8份且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,不添加偏苯三酸酐而結束反應,獲得淡黃色透明之聚酯(b10)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 131.9 parts of dimethyl isophthalate, 48.0 parts of neopentyl glycol, 122.0 parts of 1,6-hexanediol, and tetrabutoxy titanate were fed. 0.1 part was heated at 150 to 230 ° C for 180 minutes, and after transesterification, 42.2 parts of phthalic anhydride and 3.8 parts of trimellitic anhydride were added, and the esterification reaction was carried out at 200 to 250 ° C for 60 minutes. Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After the reaction for 60 minutes under the above conditions, the reaction was terminated without adding trimellitic anhydride, and a pale yellow transparent polyester (b10) was obtained. The analysis results of the obtained resin are shown in Tables 1 and 2.

比較合成例11含有磺酸金屬鹼之聚酯(b11)之合成Comparative Synthesis Example 11 Synthesis of Polyester (b11) Containing Metal Sulfate Base

於具備溫度計、攪拌機、李比希冷卻管之反應容器中,進料間苯二甲酸二甲酯126.1份、間苯二甲酸-5-磺酸鈉14.8份、新戊二醇48.0份、1,6-己二醇122.0份、及鈦酸四丁氧酯0.1份,於150至230℃加熱180分鐘,進行酯交換後,追加鄰苯二甲酸酐44.4份且於200至250℃進行60分鐘酯化反應。接著,一邊升溫直到260℃且一邊慢慢地將系統減壓,於10分鐘後成為0.3 mmHg以下。以此條件而於60分鐘反應後,添加偏苯三酸酐3.8份,在常壓氮氣環境中,於220℃攪拌45分鐘,獲得淡黃色透明之聚酯(b11)。將所獲得之樹脂的分析結果顯示於表1、2。In a reaction vessel equipped with a thermometer, a stirrer, and a Liebig cooling tube, 126.1 parts of dimethyl isophthalate, 14.8 parts of sodium isophthalate-5-sulfonate, 48.0 parts of neopentyl glycol, and 1,6- were fed. 122.0 parts of hexanediol and 0.1 part of tetrabutoxy titanate were heated at 150 to 230 ° C for 180 minutes, and after transesterification, 44.4 parts of phthalic anhydride was added and esterification was carried out at 200 to 250 ° C for 60 minutes. . Next, the system was gradually depressurized while raising the temperature to 260 ° C, and became 0.3 mmHg or less after 10 minutes. After reacting for 60 minutes under these conditions, 3.8 parts of trimellitic anhydride was added, and the mixture was stirred at 220 ° C for 45 minutes under a nitrogen atmosphere at normal pressure to obtain a pale yellow transparent polyester (b11). The analysis results of the obtained resin are shown in Tables 1 and 2.

實施例1Example 1

利用3輥而混攪下列摻合比例之組成物:The following blending ratios of the composition were mixed using 3 rolls:

聚酯(b1)之溶液 8.3份Polyester (b1) solution 8.3 parts

(乙基乙酸卡必醇酯/丁基溶纖劑乙酸酯=1/1(重量比)之24重量%溶液);(24% by weight solution of ethyl acetate carbitol ester / butyl cellosolve acetate = 1 / 1 (weight ratio));

銀微粒(1)(平均粒徑60 nm) 23.0份Silver particles (1) (average particle size 60 nm) 23.0 parts

所獲得之混攪物中分別添加9.3份之乙基乙酸卡必醇酯/丁基溶纖劑乙酸酯,利用行星式混合機而攪拌混合10分鐘,獲得固形物濃度50重量%之導電性糊。To the obtained kneader, 9.3 parts of ethyl carbitol ketone/butyl cellosolve acetate was added, and the mixture was stirred and mixed for 10 minutes by a planetary mixer to obtain a conductive paste having a solid concentration of 50% by weight.

於厚度25 μm之聚醯亞胺薄膜上,使乾燥後之厚度成膜2 μm的方式來塗布所獲得之導電性糊,於120℃乾燥10分鐘而獲得金屬薄膜層。接著,於100℃、以線壓50 kg/cm通過由鉻鍍敷輥與橡膠輥所構成的壓延輥。進一步於180℃熱處理1小時,進行銀微粒之燒製。將導電性糊之分散安定性與金屬薄膜層之基材緊貼性及導電性之測定結果顯示於表3。未進行壓延處理而實施燒製處理之情形的導電性也顯示於表3。The obtained conductive paste was applied to a polyimide film having a thickness of 25 μm so that the thickness after drying was 2 μm, and dried at 120 ° C for 10 minutes to obtain a metal thin film layer. Next, a calender roll composed of a chrome plating roll and a rubber roll was passed at 100 ° C at a line pressure of 50 kg/cm. Further, heat treatment was performed at 180 ° C for 1 hour to carry out firing of silver fine particles. The measurement results of the dispersion stability of the conductive paste and the substrate adhesion and conductivity of the metal thin film layer are shown in Table 3. The conductivity in the case where the calcination treatment was carried out without performing the calendering treatment is also shown in Table 3.

實施例2至5及比較例6至11Examples 2 to 5 and Comparative Examples 6 to 11

進行相同於實施例1之方式而獲得揭示於表3、表4之摻合比率的導電性糊。與實施例1同樣地評估。將結果顯示於表3、表4。Conductive pastes having the blend ratios disclosed in Tables 3 and 4 were obtained in the same manner as in Example 1. Evaluation was carried out in the same manner as in Example 1. The results are shown in Tables 3 and 4.

比較例12、13Comparative Examples 12, 13

金屬微粒係使用銀微粒(2)以取代銀微粒(1),利用實施例1同樣的方法而形成金屬薄膜層,與實施例1同樣地評估。將結果顯示於表4。The metal fine particles were replaced with silver fine particles (1) by using silver fine particles (2), and a metal thin film layer was formed in the same manner as in Example 1, and evaluated in the same manner as in Example 1. The results are shown in Table 4.

實施例14、15Examples 14, 15

金屬微粒係使用銀微粒(3)以取代銀微粒(1),利用實施例1同樣的方法而形成金屬薄膜層,與實施例1同樣地評估。將結果顯示於表4。In the metal fine particles, silver fine particles (3) were used instead of the silver fine particles (1), and a metal thin film layer was formed in the same manner as in Example 1, and evaluated in the same manner as in Example 1. The results are shown in Table 4.

實施例16、17及比較例18至20Examples 16, 17 and Comparative Examples 18 to 20

金屬微粒係使用銀微粒(1)或(3),如表4的方式來改變銀微粒與分枝型聚酯(b1)之摻合比率,利用實施例1同樣的方法而形成導電性薄膜,與實施例1同樣地評估。將結果顯示於表4。但是,於比較例19中,利用3輥所獲得之混攪物無法形成糊狀,無法薄薄地塗布於基材上。The metal fine particles were formed by using the silver fine particles (1) or (3), and the blend ratio of the silver fine particles and the branched polyester (b1) was changed as shown in Table 4, and a conductive film was formed in the same manner as in Example 1. Evaluation was carried out in the same manner as in Example 1. The results are shown in Table 4. However, in Comparative Example 19, the kneaded material obtained by the three rolls could not be formed into a paste, and it could not be thinly applied to the base material.

如表3、表4所示,本發明之金屬微粒分散體係具有優異的金屬微粒之分散安定性,由本導電性糊所形成的金屬薄膜層係與基材具有優異的緊貼性。此外也得知發揮優異的導電性能。比較例6係作為黏著劑所摻合的分枝型聚酯樹脂不具有酸價之情形,比較例7係分枝型聚酯樹脂之酸成分脫離本申請專利範圍,且玻璃轉移溫度也成為申請專利範外之情形,比較例8係聚酯樹脂不具有分枝構造之情形。另外,比較例9係酸成分、二醇成分皆脫離本申請專利範圍,且玻璃轉移溫度也成為申請專利範外之情形。再者,比較例10係本發明之分枝型聚酯樹脂之酸價脫離本申請專利範圍的例子,比較例11係將含有具有優異的磁性粒子之分散效果的磺酸金屬鹼之聚酯樹脂作為磁性膠帶用黏著劑使用之情形的例子,無分枝構造,且酸價也脫離本申請專利範圍的例子。比較例12、13係金屬微粒之粒徑不符合本發明之申請專利範圍之情形。另外比較例18至20係銀微粒與分枝型聚酯之摻合比例係脫離本申請專利範圍的例子。As shown in Tables 3 and 4, the metal fine particle dispersion system of the present invention has excellent dispersion stability of metal fine particles, and the metal thin film layer formed of the conductive paste has excellent adhesion to the substrate. In addition, it is also known to exhibit excellent electrical conductivity. Comparative Example 6 is a case where the branched polyester resin blended as an adhesive does not have an acid value, and the acid component of the branched polyester resin of Comparative Example 7 deviates from the scope of the present patent, and the glass transition temperature also becomes an application. In the case of the patent, Comparative Example 8 is a case where the polyester resin does not have a branched structure. Further, in Comparative Example 9, the acid component and the diol component were all out of the scope of the present patent, and the glass transition temperature also became the case of the patent application. Further, Comparative Example 10 is an example in which the acid value of the branched polyester resin of the present invention deviated from the scope of the present patent, and Comparative Example 11 was a polyester resin containing a metal sulfonate having excellent dispersion effect of magnetic particles. As an example of the case where the adhesive for magnetic tape is used, there is no branching structure, and the acid value is also out of the example of the scope of the patent application. The particle diameters of the comparative examples 12 and 13 are not in conformity with the scope of the patent application of the present invention. Further, the blending ratio of the silver particles to the branched polyester of Comparative Examples 18 to 20 is out of the scope of the patent application.

[產業上利用之可能性][Possibility of industrial use]

本發明之導電性糊係具有優異的分散安定性,且藉由塗布於基材上、進行加熱乾燥處理而能夠在基材上形成與基材具有優異的緊貼性之體積電阻係數低的金屬薄膜。所獲得之金屬薄膜能夠用於金屬/樹脂積層體、電磁波屏蔽金屬薄膜、鍍敷用導電層、金屬配線材料、導電材料等。The conductive paste of the present invention has excellent dispersion stability, and can be applied to a substrate and subjected to heat drying treatment to form a metal having a low volume resistivity which is excellent in adhesion to the substrate on the substrate. film. The obtained metal thin film can be used for a metal/resin laminate, an electromagnetic wave shield metal film, a plating conductive layer, a metal wiring material, a conductive material, or the like.

Claims (9)

一種導電性糊,其係含有金屬微粒(A)、分枝型聚酯(B)與有機溶劑(C)的導電性糊,該金屬微粒(A)之平均粒徑為1×10-3 μm以上且5×10-1 μm以下,該分枝型聚酯(B)係具有起因於3官能以上之多元羧酸化合物與/或3官能以上之多元醇化合物的分枝點,該分枝型聚酯(B)之酸價為30當量/106 g以上且200當量/106 g以下,該分枝型聚酯(B)係含有將間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基之中的一種以上,與利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的化合物作為共聚合成分,於使構成該分枝型聚酯(B)之全部多元羧酸化合物殘基與全部多元醇化合物殘基的合計成為200莫耳%時,間苯二甲酸殘基、鄰苯二甲酸殘基與環己二甲酸殘基之合計為70莫耳%以上,利用碳數1至4之直鏈烷基而取代鍵結於碳數3至5之直鏈烷二醇的碳原子上之至少一個氫原子的化合物之殘基的合計為20莫耳%以上,該分枝型聚酯(B)之玻璃轉移溫度為低於40℃,相對於該分枝型聚酯(B)100重量份,該金屬微粒(A)為600至1500重量份。A conductive paste comprising a conductive paste of metal fine particles (A), a branched polyester (B) and an organic solvent (C), the metal fine particles (A) having an average particle diameter of 1 × 10 -3 μm or more and 5 × 10 -1 μm or less, the branched polyester (B) due to the system having the above polybasic acid compound and / or more than trifunctional branching point of the polyol compound, the branching type The acid value of the polyester (B) is 30 equivalents/10 6 g or more and 200 equivalents/10 6 g or less, and the branched polyester (B) contains an isophthalic acid residue and a phthalic acid residue. And one or more of the cyclohexanedicarboxylic acid residues, and at least one hydrogen atom bonded to a carbon atom of a linear alkanediol having 3 to 5 carbon atoms by using a linear alkyl group having 1 to 4 carbon atoms; The compound is a copolymerization component, and when the total of the residues of all the polyvalent carboxylic acid compounds constituting the branched polyester (B) and the total of the residues of all the polyol compounds is 200 mol%, the isophthalic acid residue, The total of the phthalic acid residue and the cyclohexanedicarboxylic acid residue is 70 mol% or more, and the linear alkyl group having a carbon number of 1 to 4 is substituted for the linear alkanediol bonded to the carbon number of 3 to 5. Carbonogen The total of the residues of the compound of at least one hydrogen atom in the substrate is 20 mol% or more, and the glass transition temperature of the branched polyester (B) is less than 40 ° C with respect to the branched polyester (B) 100 parts by weight, the metal fine particles (A) are from 600 to 1,500 parts by weight. 如申請專利範圍第1項之導電性糊,其係於使構成該分枝型聚酯(B)之全部多元羧酸化合物殘基與全部多元醇化合物殘基的合計成為200莫耳%時,鄰苯二甲酸殘基與環己二甲酸殘基之合計為20莫耳%以上且50莫耳%以下。 The conductive paste according to claim 1 is characterized in that when the total of the residues of all the polyvalent carboxylic acid compounds constituting the branched polyester (B) and the total of the residues of all the polyol compounds is 200 mol%, The total of the phthalic acid residue and the cyclohexanedicarboxylic acid residue is 20 mol% or more and 50 mol% or less. 如申請專利範圍第1或2項之導電性糊,其中該金屬微粒(A)之含有率為導電性糊整體之20重量%以上且80重量%以下。 The conductive paste according to claim 1 or 2, wherein the content of the metal fine particles (A) is 20% by weight or more and 80% by weight or less based on the entire conductive paste. 如申請專利範圍第1或2項之導電性糊,其係進一步含有硬化劑(D)。 The conductive paste of claim 1 or 2 further contains a curing agent (D). 如申請專利範圍第3項之導電性糊,其係進一步含有硬化劑(D)。 The conductive paste according to item 3 of the patent application further contains a hardener (D). 一種金屬薄膜積層體之製造方法,其係包含對於將如申請專利範圍第1至5項中任一項之導電性糊塗布於基材而形成的塗膜,實施由加熱處理、壓延處理與燒製處理所選出的至少一種處理的步驟。 A method for producing a metal thin film laminate comprising a coating film formed by applying a conductive paste according to any one of claims 1 to 5 to a substrate, and performing heat treatment, rolling treatment, and firing The step of processing the selected at least one process. 如申請專利範圍第6項之金屬薄膜積層體之製造方法,其中該基材為絕緣性薄膜。 The method for producing a metal thin film laminate according to claim 6, wherein the substrate is an insulating film. 一種金屬薄膜積層體,其係利用如申請專利範圍第6或7項之製造方法而製得。 A metal thin film laminate produced by the production method of claim 6 or 7. 一種裝置,其係含有將使用如申請專利範圍第8項之金屬薄膜積層體的電配線作為構成要件。 A device comprising, as a constituent element, an electric wiring using a metal thin film laminate as in the eighth aspect of the patent application.
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