TWI352663B - Paste composition and dielectric composition - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric composition having suitable characteristics as a capacitor or an interlayer insulating material or an optical wiring material for a circuit material functioning as a capacitor. [Prior Art] In recent years, with the demand for miniaturization of electronic equipment, high-speed signals, and large capacity, the density of mounted circuit components has been increased. However, there is a problem that the electric nozzle is increased and data errors are generated. In order to control the generation of the electrical spray 4 and stabilize the operation of the semiconductor device, it is extremely important to supply a necessary amount of current to a position close to the semiconductor device. Therefore, it is extremely effective to dispose a large-capacity capacitor directly under the semiconductor device as a coupling-capacitor. Here, a method of arranging a capacitor on a printed wiring board is a method of arranging an external capacitor such as a chip capacitor on a printed wiring board. However, in terms of miniaturization, it is extremely advantageous to add an inorganic ruthenium to the inner layer of the printed wiring board, and to make the printed wiring board itself have a capacitor function, and a composite body in which an inorganic ruthenium and a resin are mixed is used as an interlayer insulating material. The method is known as a method (Japanese Laid-Open Patent Publication No. Hei 5-57852, No. Hei 6-854-3). However, by the above method, the specific dielectric ratio of the composite is as low as 1 〇 20 . The composite dielectric containing the inorganic ruthenium can increase the specific dielectric ratio by increasing the addition amount of the inorganic ruthenium, and even if the content of the inorganic ruthenium is more than 50% by volume, even if the inorganic ruthenium is added There is still a problem that the specific dielectric ratio cannot be increased. Moreover, since a high amount of high dielectric constant - Ί - 1352663 inorganic ruthenium is mixed in the resin to form a high viscosity, it is usually necessary to use a large amount of solvent. The high dielectric composition of the present invention is obtained by desolventizing and hardening a paste composition containing an inorganic chelating agent, a resin, and a solvent (Japanese Unexamined Patent Publication No. Hei No. Hei No. Hei. However, when the amount of the solvent to be used is too large, the heat resistance may be lowered by the residual solvent, or the voids may be formed on the surface layer. A method for producing a high specific dielectric ratio is a method of increasing the specific dielectric constant by adding a ruthenium having two or more kinds of particle diameters to increase the charge ratio of the ruthenium (Japanese Patent Laid-Open No. 5 3-88) Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. However, the ruthenium used in these is a large ruthenium having an average particle diameter of the ruthenium having a maximum average fj# diameter of 5 μχη or more, and the film thickness of the composite obtained by mixing the ruthenium and the resin is about 3 0 0μπα, the desired thickness cannot be obtained. Further, a method of increasing the dielectric constant is a method of using an inorganic ruthenium having a large particle diameter. The dielectric constant of the enthalpy is related to the crystalline structure of the entanglement. In general, inorganic crystals such as barium titanate have a large dielectric constant at the center of gravity away from the anions and cations. When the particle size is small, the size of the crystal particles is generally small, and the surface energy of the particle is increased, and the energy of the entire system is lowered. Therefore, the symmetry of the crystal structure is higher. When the symmetry of the crystal structure becomes high, the position of the center of gravity of the detached anion and the cation becomes small, so that the dielectric constant becomes small. Therefore, by using a ruthenium having a large particle diameter, the dielectric constant can be made large. In particular, this effect of barium titanate is remarkable. For example, an antimony barium titanate having an average particle diameter of 15 μm is used in the sputum, and ethyl carbitol (boiling point is 202. 〇 is used as an example (Japanese Laid-Open Patent Publication No. Hei 8-293429). However, due to the filling The particle size becomes larger, and the specific surface area of the ruthenium becomes smaller, that is, -8 - 1352663 enables the use of a solvent having a high boiling point, and the desolvation at the time of heating is carried out at a relatively low temperature and for a short time. Thus, the resin which is accompanied by the shrinkage of the entire system Or the sputum moves at a relatively fast rate to cause solvent removal, resulting in a lot of voids. The generation of voids is the cause of the decrease in dielectric constant. When the average particle size of the ruthenium is larger, the dielectric constant of the ruthenium is changed. In addition, it is not possible to suppress the generation of the above-mentioned voids even if a high-boiling solvent is used, and as a result, it is not possible to obtain a dielectric constant of 52. Further, since a large average particle diameter of 15 μm is used (Japanese Unexamined Patent Publication No. Hei No. 8-293429) When the thickness of the film is 25 μm, the capacitance density is 1.8 nF/cm2. In addition, the number of terminals and the number of terminals is rapidly developed to reduce the size and thickness of the system. LSI Density S i P (in-system package), but the capacitor built in the SiP is strongly required to be thinner, and the thickness of the interlayer insulating material for the capacitor must be 1 μm or less. Therefore, the current technology cannot satisfy the thin type below ΙΟμηη. In the high performance of portable devices such as portable telephones, there is no need to reduce the requirements for the emergency speed. In addition, the capacitance of the capacitor is inversely proportional to the film of the interlayer insulating material, and the capacitance of the capacitor is increased. It is preferable to make the film thickness of the interlayer insulating material thin. Moreover, important basic characteristics required for the interlayer insulating material such as a low coefficient of linear expansion, the linear expansion coefficient of the resin itself is 50 ppm/° C. or more, and a metal as a wiring layer. For example, the linear expansion coefficient of copper (1 7 ppm/°C) is extremely large. Therefore, when an interlayer insulating material made only of a resin is used, interlayer peeling due to stress is caused by a difference in linear expansion coefficient from the wiring layer. Or with the shortcomings of the -9- 1352663 wire breakage, etc., 彳 而, g, due to the composite of inorganic ruthenium in the resin can make the line expansion Since the coefficient is lowered, when the composite in which the inorganic cerium is mixed with the resin is used as the interlayer insulating material, it can be similar to the enthalpy of the linear expansion coefficient of the wiring layer. However, the conventional method cannot sufficiently increase the inorganic enthalpy. Moreover, the linear expansion coefficient of the wiring layer cannot be reduced to similar 値. SUMMARY OF THE INVENTION In view of the above circumstances, the present invention is directed to a high dielectric composition having a low coefficient of linear expansion, and provides a fully achievable A dielectric composition and an optical wiring material for an interlayer insulating material for a large-capacity capacitor having a high-density SiP. In other words, the present invention provides a paste composition containing an inorganic filler, a resin. And a paste composition obtained by using a solvent (a solvent having a boiling point of 160 kt or more), wherein the solvent is one having more than one solvent having a boiling point of 1 60 ° C or higher and having an average of the fillings. The inorganic cerium having a particle diameter of 5 μm or less, and the total amount of the solvent is 25 wt% or less of the total amount of the paste composition. Further, another aspect of the present invention is a dielectric composition, which is a dielectric composition having an inorganic ruthenium and a resin, characterized in that the inorganic ruthenium has at least two kinds of average particle diameters. The largest average particle diameter of the average particle diameter is 0.1 to 5 μm, and the maximum average particle diameter is 3 times or more for the minimum average particle diameter. According to the present invention, a composition of a high dielectric material having a dielectric constant of 50 or more can be easily produced. Further, since the composition of the present invention has a low linear expansion coefficient which approximates the linear expansion coefficient of the wiring metal, it is disadvantageous in that peeling or wiring breakage is unlikely to occur between the wiring layer and the wiring layer when the interlayer insulating material is used as the interlayer insulating material. A capacitor with high reliability is produced. Further, a film having uniform film thickness and uniform physical properties can be easily produced. This is suitable for a large electrostatic capacity and is extremely useful for an interlayer insulating material for a capacitor embedded in a high-density SiP or a circuit substrate material having a function as a capacitor. [Embodiment] In order to carry out the best mode of the invention, the paste composition of the present invention is in a paste composition composed of an inorganic filler, a resin, and a solvent (a solvent having a boiling point of 160 ° C or higher). The β sign is an inorganic ruthenium having an average particle diameter of 5 μmη or less, and contains a solvent (a solvent having a boiling point of 160 ° C or more), and the total amount of the solvent is 2 of the total amount of the paste composition. 5% by weight or less. Further, the dielectric composition of the present invention is in a dielectric composition having an inorganic ruthenium and a resin, and is characterized in that it contains at least two kinds of inorganic ruthenium having an average particle diameter, wherein the largest average granule is contained therein. The average particle diameter of the inorganic filler of the diameter is 〜. 1 to 5 μχη, and the maximum average particle diameter is 3 times or more for the minimum average particle diameter. The total solvent amount in the paste composition of the present invention must be 25% by weight or less based on the total amount of the paste composition. It is preferably 20% by weight or less, and more preferably 10% by weight or less. Further, it is preferably 1% by weight or more. The amount of solvent is 25 weight. When the temperature is below 〇, it is possible to control the voids generated by the evaporation of the solvent during drying, and the dielectric ratio of the dielectric composition is improved. Further, since the amount of voids due to moisture absorption is reduced, the physical property change due to moisture can be reduced. In addition, it has excellent preservation durability. When the amount of the solvent is more than 25 % by weight, there is a case where the solvent is removed, and the void portion is increased in the drying process and the heat hardening process, and the dielectric constant of the dielectric composition is lowered. When the amount of the solvent is less than 1% by weight, the viscosity or uniformity of the paste composition is impaired because the solvent is small. Further, the effect of the present invention is particularly large in that the increase in the charge ratio of the inorganic filler is increased by the influence of the amount of the solvent, and the inorganic filler is 85 wt% of the solid content contained in the paste composition. The solvent used in the present invention must have at least one boiling point of 1 60 ° C or higher. Preferably, it is 180 ° C or more, and more preferably 200 ° C or more. When the boiling point of the solvent is 160 ° C or more, the generation of voids can be suppressed and the dielectric composition of the dielectric composition can be improved. When the boiling point is less than 160 °C, the volatilization rate of the solvent is increased, and the densification due to the movement of the substance during the heat treatment cannot be caught up. In many cases, the void portion is increased and the dielectric constant of the dielectric composition is lowered. Further, the solvent used in the present invention has a boiling point of preferably 300 ° C or less, more preferably 280 ° C or less. When the boiling point is higher than 28 (TC), it is a high temperature during the treatment for solvent removal, and the resin is decomposed and deteriorates in dielectric properties due to high temperature. Moreover, when it is more than 30 (TC, the decomposition of the resin is intense, causing a decrease in mechanical strength. The solvent used in the paste composition of the present invention may be only one having a boiling point of 160 ° C or higher, and # may have a solvent other than a solvent having a boiling point of 1 60 ° C or higher. The boiling point is 160 ° C or higher. Solvents, including hydrazine, acetone acetone, methylcyclohexanone, diisobutyl ketone, methyl benzophenone, dimethyl arsenic, γ · butyl vinegar, isophorone, diethylformamide , dimethylacetamide, Ν-methylpyrrolidone, γ-butyrolactam, ethylene glycol acetate, 3-methoxy-3-methylbutanol and its acetate, 3-methoxy Butyl acetate, 2-ethylhexyl acetate, oxalate, diethyl malonate, maleate, propylene carbonate, butyl cellosolve-12-1352663 The specific dielectric constant is based on the specific dielectric ratio of the composite, that is, the logarithmic mixture described below (1). (Ceramic Material Science (Application), Uchida Heqi Xinshe, WDKingery, Komatsu and Tibetan, p912). The higher the content of inorganic fillers with high dielectric constant, the higher the specific dielectric ratio of the dielectric composition. ;乂_1〇8£| (1) ε: specific dielectric ratio of the composite εί: specific dielectric ratio of each component of the composite

Vi: Volume fraction of each component of the composite ί When the inorganic ruthenium is contained in the resin at a high enthalpy charge ratio, it is preferred to use two or more different average particle diameters in the mixture. When filling a sputum of a single granule ρ, especially when the sputum is spherical or slightly spheroidal, a ridge-shaped void is formed between the entangled material and the entangled material at the time of high-density charging, and in this gap, Invade other fillings. However, when it is a smear of a size below the void, the void can be invaded, and the charge rate can be easily increased. In the inorganic enthalpy contained in the present invention, the average particle diameter of the inorganic burial material having the largest average particle diameter and the average particle diameter difference of the inorganic cerium filling material 2 having the smallest average particle diameter are preferably as large as possible, and the maximum average granule When the diameter is the smallest average particle diameter and the difference is small, when the small enthalpy difference is large, the small sputum is more than 3 times, and more preferably 5 times or more. It is not easy to invade the gap between the large fillings. In addition, it is easy to aggregate and the dispersion stability is lowered. Preferably, it is 3 times or less, and more preferably 1 time or less.

The total volume Va of the inorganic filler having the largest average particle diameter and the total volume Vb of the inorganic ruthenium having at least -14-, 63 diameter with the smallest average particle satisfying 0.05 sVb / (Va + vb) < 〇 5 Preferably. In short, the amount of the small sputum filling is preferably 5% to 50% of the total amount of ruthenium in a volume ratio. When it is less than 5%, the effect of inflating the void is almost impossible to obtain, and when the right is more than 50%, the volume of the small sputum filling is larger than the gap of the produced large sputum, which invades and increases 塡. The effect of the charge is small. In addition to these large sputum fillings and small sputum fillings, other granules can be mixed, even if it is more than 3 types, the appropriate particle size and mixing ratio can be selected. By mixing the entangled material, the effect of increasing the charge rate can be obtained. The inorganic ruthenium used in the present invention contains an inorganic ruthenium having at least two different average particle diameters, and an inorganic ruthenium having a maximum average particle diameter preferably has an average particle diameter of 5 μm or less. More preferably, it is 2 μηη or less, and the most preferable one is Ιμπι or less. Further, it is 〇·1 μιη or more, preferably 〇 2 μπι or more, and more preferably 0·3 μηι or more. Here, when the average particle diameter of the inorganic ruthenium having the largest average particle diameter is more than 5 μm, when the capacitor having a film thickness of ι 〇 μη or less is formed, it is difficult to make the sputum easily protrude on the surface of the film, and it is difficult to obtain stability. Dielectric properties. Further, when the inorganic particle having the largest average particle diameter has an average particle diameter of 2 μm or less, the ruthenium of the ruthenium dispersion is less likely to precipitate. Further, when the average particle diameter of the inorganic ruthenium having the largest average particle diameter is ίμιη or less, the ruthenium is not easily precipitated during long-term storage, and the storage conditions are not limited. Further, in the case of a material having a larger dielectric constant, when the maximum average particle diameter is smaller than (Μ μηη, in order to increase the specific surface area of such a ruthenium, the symmetry of the crystal structure tends to become high, and it is difficult to obtain a high dielectric layer. The electric phase phase forms a reason for the decrease in the dielectric constant of the dielectric composition. Further, when the average particle size of the -15-1352663 is 0.2 gm or more, the surface area of the ruthenium becomes small, and the ruthenium-dispersed paste is difficult to be formed. Condensation, small change in viscosity, and incorporation, dispersion, or coating processing are not easily affected. Moreover, since the inorganic crucible having the largest average particle diameter has an average particle diameter of 0.3 μm or more, the inorganic crucible having the largest average particle diameter The ratio of the difference between the average particle diameter and the average particle diameter of the inorganic cerium having the smallest average particle diameter is sufficiently increased, so that the enthalpy ratio is not affected. Further, the inorganic enthalpy having the smallest average particle diameter in the present invention The average particle diameter is preferably 0.01 to 0.1 μηη, more preferably 〇.〇4 to 0.06 μιη. Moreover, when the difference ratio between the maximum average particle diameter and the minimum average particle diameter must be formed, the inorganic having the smallest average particle diameter塡 Filling visible most The average particle diameter is appropriately selected from the above range. When the ratio of the difference between the average particle diameter of the inorganic cerium having the smallest average particle diameter and the average particle diameter of the inorganic cerium having the largest average particle diameter is increased, the ratio can be increased. For this reason, the average particle diameter of the inorganic ruthenium having the smallest average particle diameter may be 0.1 μm or less in a preferable range of the average particle diameter of the inorganic ruthenium having the largest average particle diameter. Preferably, it is preferably 0.06 μm or less. When the average particle diameter of the inorganic cerium having the smallest average particle diameter is 0.04 μm or more, it is less likely to cause re-agglomeration after dispersion, and the dispersion stability of the paste is good. When the average particle diameter of the inorganic filler having the smallest average particle diameter is 0 · 0 1 μm or more, since the secondary aggregation is less likely to occur between the ruthenium, the aggregate is easily decomposed and dispersed. The measurement of the average particle diameter contained in the composition and the dielectric composition is performed by forming a thin film of a dielectric composition and measuring the ultrathin section of the film by cutting the film thickness direction of the film, and By The electron micrograph (ΤΕΜ) observation was used for the measurement. Since the inorganic sputum and the tree 1352663 are different in transmittance to the electron beam, the inorganic ruthenium and the resin can be distinguished by contrast in the TEM observation image. In the case of an inorganic ruthenium, the determination of the crystal structure is carried out by elemental analysis and electron beam scattering image observation based on the measurement of ruthenium. The area distribution of the thus obtained ruthenium and resin is analyzed by image analysis. The cross-section of the inorganic ruthenium is similar to a circular shape, and the particle size can be determined from the area. The particle size is evaluated by a magnification of 5000 times and 400 times the image of the 。. The obtained particle size distribution is at a magnification. In the 50〇〇倍ΤΕΜ image, the scale graph of Ο.ίμιη is shown, and the magnification is 4〇000 times. The image is represented by the Ο.ΟΙμιη scale graph, with the degree 彳·maximum 値 of the center of the series as the average Particle size. The "having at least two kinds of average particle diameters" in the present invention means that two or more of the maximum enthalpy are present, and two or more extremely large enthalpies exist in the particle size distribution of the inorganic cerium contained in the composition. Moreover, the evaluation of the particle size distribution can be carried out by using a scanning electron microscope (SEM) instead of the above method. In addition, other methods can be determined by measuring the dynamic light scattering method in which the entangled material is shaken by the scattered light of the Brownian motion, and by measuring the Doppler effect of the scattered light when the sputum is electrophoresed. Particle size. The laser Φ refracting and scattering type particle size distribution measuring apparatus is, for example, LA-920 manufactured by Horiba, or SALD-1 1 manufactured by Shimadzu Corporation, and MICROTRAC-UPA150 equipped with a Japanese machine. The dielectric properties of the inorganic ruthenium are preferably those having a specific dielectric ratio of 50 to 30,000. When an inorganic ruthenium having a specific dielectric constant of less than 50 is used, a dielectric composition having a sufficiently large dielectric constant cannot be obtained. Moreover, when the specific dielectric constant is more than 30,000, the temperature characteristic of the dielectric constant tends to deteriorate, so it is not for the enterprise 1352663

begging. The specific dielectric constant of the inorganic cerium referred to herein means the specific dielectric constant of the sintered body obtained by heating the inorganic filler as the raw material powder. The specific dielectric ratio of the sintered body is measured, for example, by the following procedure. The inorganic filler is mixed with a binder resin such as polyvinyl alcohol, an organic solvent or water to prepare a paste-like composition, which is then dried in a pellet former and dried to obtain a pellet-like solid. The pellet-like solid is obtained by firing at a temperature of, for example, 900 to 12 Torr (TC) to decompose and remove the binder resin, and sintering the inorganic ruthenium to obtain a sintered body composed only of an inorganic component. When the void of the sintered body is sufficiently determined from the theoretical density and the measured density, the void ratio must be i% or less. The upper and lower electrodes are formed on the sintered body pellet, and the specific dielectric constant can be calculated from the electrostatic capacity and the dimensional measurement result. The ruthenium is barium titanate, barium titanate, barium titanate, calcium titanate, barium titanate, magnesium titanate, barium titanate, strontium titanate, magnesium strontium Acid bismuth, lanthanum molybdate, lead titanate, lead citrate, lead phthalate lead, lead citrate, lead magnesium citrate, lead niobate, lead tungstate, tungsten Calcium acid, lead magnesium titanate, titanium dioxide, etc. Barium titanate is a part of the barium titanate crystal containing other elements, and invading other elements in the structure of the crystal, and barium titanate A general term for the solid solution of the base metal. It contains other barium titanate, titanic acid, lanthanum, calcium titanate, barium titanate. , magnesium titanate, barium titanate, barium tin titanate, barium magnesium strontium, barium magnesium molybdate, lead titanate, lead zirconate, lead titanate, tannic acid Lead-type 'lead magnesium niobate, lead niobate, lead tungstate, calcium tungstate, lead magnesium tungstate, and titania are the same as the solid solution of the base material. -18- 1352663 is particularly preferably a crucible having a calcium-titanium crystal structure or a composite calcium-titanium crystal structure. These may be used alone or in combination of two or more, and have at least two different average particle diameters. When the inorganic filler is of the same chemical composition, it is preferable in terms of dielectric properties. In particular, when a dielectric composition having a high specific dielectric ratio can be obtained, it is mainly used in connection with commercial convenience. A compound formed of barium titanate is preferred. For the purpose of improving dielectric properties or temperature stability, a small amount of a phase shifting agent, a flow-stopping agent, or the like may be added. Method, hydrothermal synthesis #, supercritical hydrothermal synthesis, sol-gel method, oxalate, etc. The method for producing an inorganic ruthenium having the largest average particle diameter is preferably a solid phase reaction method or an oxalate method for high specific dielectric ratio and quality stability. Further, inorganic having the smallest average particle diameter The method for producing the ruthenium is preferably a hydrothermal synthesis method, a supercritical hydrothermal synthesis method, or a sol-gel method for the reason that the particle size is easily reduced. The paste composition and the dielectric composition of the present invention The ratio of the inorganic ruthenium to the resin contained in the substance is preferably 50% to 95% or less, based on the total volume of the inorganic ruthenium and the total volume of the volume of the resin solid component. When the content of the inorganic ruthenium Vf is 5% or more, a sufficiently large specific dielectric ratio can be obtained, and a small thermal expansion rate can be obtained. Further, the inorganic swell can be obtained. When the content ratio Vf is 70% or more, the effect of using an inorganic ruthenium having at least two average fii diameters is remarkable, and a large specific dielectric ratio can be obtained. Further, when the content of the inorganic ruthenium is 95% or less, the effect can be suppressed. The voids in the composition are generated, and a sufficiently large specific dielectric ratio can be obtained, and the gap is caused by the suction 135266 3 The moisture rate is small, and the physical properties are not easily affected by moisture or humidity. Further, when the content Vf of the inorganic filler is 90% or less, the adhesion after the PCT (Bright Cook) test for the durability promotion test is not easily lowered. Further, the resin used in the present invention may be selected from any of thermoplastic and thermosetting resins. As the thermoplastic resin, for example, polyphenylene ether, polyphenylene sulfide, polyether oxime, polyether quinone, liquid crystal polymer, polystyrene, polyethylene, fluororesin or the like can be used. Further, as the thermosetting resin, for example, an epoxy resin, a phenol β-lipid, a polyoxyalkylene resin, a polyimine, an acrylic resin, a cyanate resin, a benzocyclobutene resin, or the like can be used. The resin used for the insulating layer of the printed wiring board is used. It is preferable to use a thermosetting resin in terms of solder heat resistance, and in particular, it is preferable to use an epoxy resin in terms of thermosetting shrinkage, viscosity, and the like. Here, the epoxy resin is a resin having a prepolymer having two or more epoxy groups (ethylene oxide rings) in a molecular structure. The prepolymer preferably has a biphenyl structure or a dicyclopentadiene structure in terms of dielectric properties. Further, it may have a hardener, and a hardener may be used as the hardener, such as a benzoquinone lacquer resin, a bisphenol oxime type phenol lacquer, a resin, an amine triterpenoid compound, or a naphthol compound. Further, a curing accelerator such as a metal chelate compound such as triphenylphosphine, a benzimidazoline compound or ginseng (2,4-pentanedione) cobalt may be added. The paste composition of the present invention can be obtained by dispersing an inorganic chelating agent into a resin. For example, a method of mixing and dispersing an inorganic cerium in a resin solution, or a deceleration method in which a dispersion of an inorganic cerium in a suitable solvent - 2 0 - 1352663 is prepared in advance and the dispersion is mixed with a resin solution Waiting for production. Further, the method of dispersing the inorganic cerium in the resin or the solvent is not particularly limited, and for example, a method such as ultrasonic dispersion, ball milling, roll milling, Crea mixer, homomixer 'media dispersion machine, or the like can be used. In particular, in terms of dispersibility, a ball mill or a homomixer is preferred. When the inorganic cerium is dispersed in the case of dispersibility, for example, surface treatment of an inorganic ruthenium, addition of a dispersant, addition of a surfactant, addition of a solvent, and the like are carried out. The surface treatment of the inorganic sputum is carried out by treatment with various coupling agents such as fascia, chin, and aluminum, such as fatty acid and phosphate, and has a loose treatment, an acidic treatment, and an alkaline treatment. Further, the dispersant is added, for example, a dispersant having an acid group such as phosphoric acid, a carboxylic acid, a fatty acid, or the like, and the like, and particularly a compound having a phosphate structure is preferable. Other examples include a non-ionic, cationic, anionic surfactant, a wetting agent such as a polyvalent residual acid, an amphiphilic substance, and a resin having a substituent having a high steric hindrance. Further, solvent control may be added during the dispersion or after dispersion.

Further, the paste composition may contain a stabilizer, a dispersant, a sinking agent, a plasticizer, an antioxidant, and the like as needed. 1 The content of the inorganic filler contained in the solid content contained in the paste composition of the present invention is preferably 85% by weight to 99% by weight, more preferably 90% by weight or more, and most preferably 94% by weight. the above. When the content of the inorganic filler is 85 wt% or more, the specific dielectric constant of the composition can be easily increased. The present invention can produce a dielectric composition having a high specific dielectric ratio with an increase in the content of the inorganic filler. When the content is 99% by weight or less, it is easy to form at the time of film formation, and it is easy to control the inorganic charge. Dispersion of things. Further, the solid component means a combination of inorganic -21 - 1352663 hydrazine and a resin and other additives. The dielectric composition of the present invention is a dielectric composition comprising an inorganic ruthenium and a resin, and the amount of the inorganic ruthenium is 8 5 to 9 9 of the total amount of solid components contained in the dielectric composition. % by weight and a void ratio of 30% by volume or less. The method for producing the dielectric composition of the present invention is, for example, first, preparing a paste composition in which an inorganic cerium is mixed in a resin, and applying the paste composition to an adherend (for example, a substrate). A method of desolventizing and hardening to obtain a dielectric composition. At this time, a hardening method such as heat, light, or the like is hardened. However, since the dielectric composition of the present invention is not a sintered body, it is not necessary to completely decompose and remove the resin, and it is preferable to heat it in a heat-resistant temperature range of the electronic component, for example, at a temperature of 500 ° C or lower. The porosity of the dielectric composition must be 30% by volume or less, preferably 20% by volume or less, and more preferably 丨〇% by volume or less. When the void ratio is more than 3 vol%, the ratio of the inorganic ruthenium occupied in the film volume becomes low, and it is difficult to obtain a dielectric composition having a specific dielectric ratio of 50 or more. Further, since the insulation resistance is lowered, the leakage current is increased, and the bending strength is lowered, it is not desirable. Here, the method of setting the void ratio to 30% by volume or less, for example, by appropriately selecting the inorganic chelating substance, the resin, and the solvent, is at least one boiling point of 16 〇 by the paste composition. (The above solvent is used, and the total solvent amount is 25% or less of the total amount of the paste composition, and can be easily achieved. Further, for example, when the void ratio is 20% by volume or less, the paste composition contains at least one having a lactone. When the solvent is constructed, the void ratio can be made 2% by volume or less. In the solvent having an internal wake structure, γ butyl vinegar is optimal. -22- 1352663. Organic substrate such as glass cloth, epoxy copper laminate Heat resistance of a composite copper laminate, a polyether phthalimide resin substrate, a polyether ketone resin substrate, a polycrystalline resin substrate, or the like, such as a glass substrate such as a sheet, a glass non-woven fabric, or an epoxy copper laminate. • A flexible substrate such as a thermoplastic substrate, a polyester ketone film substrate, or a polyimide film.

Further, the inorganic substrate includes, for example, a ceramic substrate such as an alumina substrate, an aluminum nitride substrate, or a tantalum carbide substrate, a metal substrate such as an aluminum base substrate or an iron base substrate. The constituent material of the circuit includes, for example, a conductor of a metal such as silver, gold or copper, a resistor including an inorganic oxide, a low dielectric containing a glass material 4 and/or a resin, a resin or an inorganic filler, and the like. A high dielectric material, an insulator containing a glass-based material, or the like.

The form of the composition of the present invention is not particularly limited, and a film shape, a rod shape, a spherical shape, or the like can be selected for the combined use, and a film shape is preferable. The film referred to herein includes a film, a sheet, a plate, pellets, and the like. Of course, it is used for pattern formation in order to form a hole during conduction, an adjustment of impedance or electrostatic capacity or internal stress, or an exothermic function. The film thickness when the dielectric composition is used as the film can be arbitrarily set within the range of the capacitance of the electrostatic charge, and is preferably 0.5 μm to 20 μm. More preferably, it is 2 μιη to 20 μιη. In order to secure a large electrostatic capacitance as a capacitor, it is preferable that the film thickness is small, and when it is less than 〇5*1m, pinholes or the like are likely to occur, and electrical insulation is not easily obtained. Further, when it is 2 μm or more, the dielectric tangent after the PCT (Bright Cock test) of the durability promotion test is not easily increased. Further, when the film thickness is more than 20 μm, it is necessary to have a large specific dielectric ratio when sufficient capacitor performance is obtained, and the mounting density cannot be improved. ~24~ 1352663 The use of the paste composition and the dielectric composition of the present invention is not particularly limited, and for example, in addition to the interlayer insulating material for a built-in capacitor used as a printed wiring board of a high dielectric constant layer, A variety of electronic components and devices can be used for the interlayer insulating film of the multilayer substrate, such as the circumferential wave number filter, the wireless antenna, the electromagnetic sealing material, and the optical wiring material. The dielectric composition of the present invention is preferably used as an interlayer insulating material for capacitors. The method of forming the interlayer insulating material for a capacitor using the dielectric composition is not particularly limited. For example, as described above, after forming a high dielectric on the substrate, an appropriate electrode is formed. The electrostatic capacitance corresponding to the area of the interlayer insulating material for a capacitor produced by using the dielectric composition of the present invention is preferably 5 nF/cm 2 or more. More preferably, it is l〇nF/cm2 or more. When the electrostatic capacitance of less than 5 nF/cm2 is used as the decoupling capacitor, the power supply of the entire system cannot be sufficiently separated, and the effect of the coupling capacitor cannot be achieved. The temperature change of the electrostatic capacitance and the in-plane irregularity are preferable in terms of circuit design. It is preferable that the temperature change is as small as possible, for example, to satisfy the X 7 R characteristic (the temperature change rate of the electrostatic capacity in -5 5 to 1 2 5 ° C is within ± 15 c/P). The in-plane irregularity of the electrostatic capacity is preferably 5% or less with respect to the average enthalpy (the average 値-5% of the electrostatic capacity S 5% + 5% of the electrostatic capacity S electrostatic capacity). Further, in order to reduce the power loss of the power source, the dielectric tangent of the capacitor is preferably in the range of 0.01 to 5%, more preferably in the range of 〜.〇1 to 1%. Here, the electrical characteristics such as electrostatic capacitance or dielectric tangent are measured by a cycle number of 20 k 1 1 GHz. -25-!352663 The dielectric composition of the present invention can be used as an optical wiring material. Preferably, the β-ray wiring material is used to transmit signals between LSI, a module, a ship, and the like without using a general electrical signal. The optical signal is wired in a way. When an optical wiring is formed on or in the mounted substrate, a high-refractive-index layer has a structure in which a sandwich layer is formed by a low refractive index layer. The layer with a low refractive index can be replaced by a space. When used as an optical wiring material, in order to reduce the light scattering for signal transmission in the optical wiring, it is important to use an inorganic entangled material that is sufficiently smaller than the wavelength of the light, and to have a light wavelength of 1 Μ or less. The particle size is preferred. Further, the selection of the inorganic ruthenium material, the content, and the selection of the resin material can control the refractive index, the temperature dependence of the refractive index, and the thermal expansion coefficient. The selection of the substrate material for forming the optical wiring layer is widened, and not only an inorganic material such as sand or ceramic which is conventionally used, but also a substrate made of an organic material can be used. The embodiments of the present invention are described below, but the present invention is not limited thereto. Example 1 323 parts by weight of barium titanate (manufactured by Seiko Chemical Co., Ltd., ΒΤ-05, ® average particle diameter: 0.5 μm), 18 parts by weight of γ-butyrolactone, using a homomixer, on ice The mixture was mixed and dispersed in water for 1 hour to obtain a dispersion A-1. 10 parts by weight of epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EPPN 5〇2H), 10 parts by weight of phenol novolac resin (manufactured by Dainippon Ink Co., Ltd., TD-2131), and 0.6 parts by weight of hardening promotion An agent (manufactured by Beixing Chemical Co., Ltd., triphenylphosphine) and 20 parts by weight of γ-butyrolactone were mixed to prepare an epoxy resin solution Β-1. The dispersion Α-1 and the epoxy resin solution Β-1 were mixed by ball milling to prepare a paste composition c_l. Γ-butyrolactone ~ 26 ~ 1352663 has a boiling point of 204 ° C. The paste composition C-1 was applied onto an aluminum substrate having a thickness of 3 μm using a mold coater, and dried in an oven at 80 ° C for 15 minutes and then hardened at 175 ° C for 1 hour. A high dielectric composition having a film thickness of ιμιη is obtained. Then, an aluminum electrode having a diameter of 11 mm was formed on the high dielectric composition by a vapor deposition method, and a dielectric analyzer of 1 MHz was used, and an impedance analyzer HP42 84 and a sample holder HP 1 645 1 B were used. The results of the measurement based on FIS K 6911 are shown in Table Paton (trans). Shown. The high dielectric composition has a specific dielectric constant of 82, a dielectric tangent of 2.8%, and an area of # | electrostatic capacity of 7.3 nF/cm 2 . The void ratio was 9% by volume. Example 2

The paste composition C-1 was produced in the same manner as in Example 1. Then, 22.6 parts by weight of γ-butyrolactone was further added, and the amount of the solvent in the paste composition was 15% by weight to prepare a paste composition C-2. Further, a high dielectric composition was prepared based on the method of Example 1, and the results of evaluation of dielectric properties are shown in Table 1. The high dielectric composition had a dielectric constant of 73, a dielectric tangent of 3.4%, and an electrostatic capacitance of 4.3 nF/cm 2 . The void ratio is 12 volumes. /. . <Examples 3 to 4 Further, γ-butyrolactone was added to the paste composition C-1, and the amount of the solvent in the paste composition was 20 and 25 wt%, and a paste having a different solvent amount was prepared. Paste composition C-3~C-4. Further, a high dielectric composition was prepared based on the method of Example 1, and the results of evaluation of dielectric characteristics are shown in Table 1. A high dielectric composition having a void ratio of 20% by volume or less and a specific dielectric constant of 50 or more can be obtained. -27- 1352663 Comparative Example 1 γ-butyrolactone was additionally added to the paste composition CN I to prepare a paste composition D-1 having a solvent amount of 4% by weight in the paste composition. Further, a high dielectric composition was prepared based on the method of Example 1, and the results of evaluating the dielectric characteristics are shown in Table 4. When the amount of the solvent contained in the paste composition was 40% of the total amount, the void ratio was 31% by volume and the specific dielectric ratio was 41. Example 5: 323 parts by weight of barium titanate (manufactured by Seiko Chemical Co., Ltd., BT-05, average particle diameter: 0.5 μm), and 0.2 parts by weight of a dispersing agent (manufactured by Biotech Co., Ltd.) Lu | BYK-W903), 18 parts by weight of γ-butyrolactone, and kneaded using a homomixer to prepare a dispersion Α-2. The dispersion Α-2 and the epoxy resin solution Β-1 were mixed by ball milling to prepare a paste composition C-5. Further, a high dielectric composition was prepared based on the method of Example 1, and the results of evaluation of dielectric properties are shown in Table 1. The specific dielectric constant was 102, the dielectric tangent was 3.6%, and the electrostatic capacitance of the area was 11.3 nF/cm2. The void ratio was 6% by volume. Example 6 Further, γ-butyrolactone was added to the paste composition C-5 to prepare a paste composition C-6 having a solvent amount of 15% by weight in the paste group j φ . Further, a high dielectric composition was prepared based on the method of Example 1, and the dielectric properties were evaluated as shown in Table 1. The specific dielectric constant is 9.5, the dielectric tangent is 3.1%, and the area has an electrostatic capacity of 8.4 nF/cm2. The void ratio was 7 vol%. Example 7 A paste composition was prepared in the same manner as the paste composition C-2 except that the solvent was N-methyl-2-pyrrolidone to prepare a paste composition C - *7. The boiling point of N-methyl-2-pyridin-28- 1352663 pyrrolidone is 2〇2°〇, and a high dielectric composition is prepared based on the method of Example 1, and the results of evaluating the dielectric properties are shown in the table. 1 is shown. The specific dielectric ratio was 58, the dielectric tangent was 4.6%, the electrostatic capacitance of the area was 5.3 nF/cm2, and the void ratio was 26% by volume. Example 8 A paste composition was prepared in the same manner as the paste composition C-2 except that the solvent was ethylene glycol diacetate, and a paste composition C-8 was produced. The boiling point of ethylene glycol diacetate is 1 90 °C. Further, a high dielectric composition was prepared on the basis of the method of Example 1, and the results of evaluation of dielectric characteristics are shown in Table 1. The specific dielectric 0 rate was 64, the dielectric tangent was 4.8%, the area electrostatic capacitance was 5.7 nF/cm 2 , and the void ratio was 21% by volume. Example 9 A paste composition was prepared in the same manner as the paste composition C-2 except that the solvent was ethyl carbitol, and a paste composition C-9 was produced. The boiling point of ethyl carbitol is 2 〇 2 ° C. Further, a high dielectric composition was produced on the basis of the method of Example 1, and the results of evaluation of dielectric properties are shown in Table 2. The specific dielectric constant was 50 and the dielectric tangent was 2.2%. The electrostatic capacitance of the area was 4.4 nF/cm2, and the porosity of the stomach was 30% by volume. Comparative Example 2 A paste composition was prepared in the same manner as the paste composition C-2 except that the solvent was morpholine, to prepare a paste composition D-2. The boiling point of morpholine is 1 2 8 °C. Further, a high dielectric composition was prepared on the basis of the method of Example 1, and the results of evaluation of dielectric characteristics are shown in Table 4. The specific dielectric constant is 35, the dielectric tangent is 5.8%, and the electrostatic capacitance of the area is 2.6 nF/cm2, and the electrical characteristics are not good. The void ratio was -29 - 1352663 32 2% by volume. Comparative Example 3 A paste composition was prepared in the same manner as the paste composition C·2 except that the solvent was propylene glycol monomethylacetic acid vinegar, to prepare a paste composition D·3. The boiling point of propylene glycol monomethyl acetate is 146. (: Moreover, a high dielectric composition was prepared based on the method of Example 1, and the dielectric properties were evaluated as shown in Table 4. The specific dielectric ratio was 46' dielectric tangent was 4.7%, and the area was The electrostatic capacity was 2.7 nF/cm 2 and the electrical properties were poor. The void ratio was 35 vol. Example 1 494 ^ 494 parts by weight of barium titanate (manufactured by Sigma Chemical Co., Ltd., BT-05, average particle diameter: 0.5 μm), 71 parts by weight of γ-butyrolactone was kneaded using a homomixer to obtain a dispersion Α-3. The dispersion Α-3 and the epoxy resin solution Β-1 were mixed by ball milling to prepare a paste composition C-10. Further, a high dielectric composition was prepared based on the method of Example 1, and the dielectric properties were evaluated as shown in Table 2. The specific dielectric constant was 79, the dielectric tangent was 3.4%, and the electrostatic capacitance of the area was 5.8 nF/cm2. The void ratio was 13% by volume. Example 1 1 (185 parts by weight of bismuth citrate (manufactured by Lin Chemical Co., Ltd., BT-05, average particle diameter: 0.5 μm), 16 parts by weight γ- Butyrolactone was mixed using a homomixer to prepare a dispersion Α-4. The dispersion Α-4 and the epoxy resin solution Β-1 were mixed by ball milling to prepare a paste composition C. -1 1 » In addition, a high dielectric composition was prepared based on the method of Example 1, and the dielectric properties were evaluated as shown in Table 2. The specific dielectric constant was 76' dielectric tangent of 32%. The electrostatic capacity of the area was 8.4 nF/cm2, and the void ratio was 5% by volume. -30- 1352663 Example 1 2 Except using barium titanate (made by Toho Titanium Co., Ltd., SB 05, average particle diameter: 0.5 μχη) as high A paste composition C-12 was produced in the same manner as in Example 2 except for the dielectric constant inorganic entangled material. Further, a high dielectric composition was prepared based on the method of Example 1, and the results of evaluating the dielectric characteristics were as follows. The specific dielectric ratio was 70, the dielectric tangent was 2.9%, and the electrostatic capacitance of the area was 6.2 nF/cm2. The void ratio was 14% by volume. Example 1 3 In addition to the use of barium titanate (manufacturing system), ST-03, average particle diameter: 0.3 μm·· As a high dielectric constant inorganic entangled material, a paste composition C-1 3 was produced in the same manner as in Example 2. Further, the method of Example 1 was used. For the reference, a high dielectric composition was prepared, and the results of evaluating the dielectric properties are shown in Table 2. The specific dielectric ratio was 65, and the dielectric tangent was 1.2%. The electrostatic capacity was 3.8 nF/cm 2 . The void ratio was 14% by volume ^ Example 1 4 to 1 6 A paste composition C was produced in the same manner as in Example 2 except that the resin 'hardener shown in Table 2 was used. 1 4 to C -1 6. A high dielectric composition was produced, and the dielectric properties were evaluated as shown in Table 2. A high dielectric composition having a specific dielectric constant of 50 or more was obtained. 1 8 Using a polyimine resin (manufactured by Toray Co., Ltd., "Simi Valley Faine" (Translated)" SP341), Polyether Mill (Sumitomo Chemical Co., Ltd., 5〇03P), a paste was prepared. Composition C-1 7~1 8. A high dielectric composition of the composition shown in Table 3 was fabricated, and the dielectric properties were evaluated. The results are shown in Table 3. The specific dielectric composition is 50 volts to a high dielectric composition of 3 1 - 1352663. Example 1 9 3W parts by weight of barium titanate (manufactured by Sigma Chemical Co., Ltd., BT-05, average particle diameter: 〇.5μηι), 36 parts by weight of γ-butyrolactone, using a homomixer, The mixture was dispersed and mixed in ice water for 1 hour to prepare a dispersion A-5. 1 2.8 parts by weight of epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EPPN5 02H), 7-8 parts by weight of phenolphthalal oxime resin (manufactured by Dainippon Ink Co., Ltd., TD-2131), 重量.2 parts by weight A hardening accelerator (manufactured by Beixing Chemical Co., Ltd., triphenylphosphine) and 24.8 parts by weight of γ-butyrolactone were mixed to prepare an epoxy resin solution Β-2. The dispersion Α-5 and the epoxy resin solution B-2 were mixed by a ball mill to prepare a paste composition C-1 9. Further, a high dielectric composition was prepared based on the method of Example 1, and the results of evaluating the dielectric characteristics are shown in Table 3. The high dielectric composition has a dielectric constant of 73, a dielectric tangent of 3.4%, and an area of electrostatic capacitance of 4.3 nF/cm2. The void ratio was 12% by volume. 323 parts by weight of barium titanate (manufactured by Sigma Chemical Co., Ltd., BT-05, average particle diameter: 〇·5 μm), 0.2 parts by weight of a dispersant (copolymer having an acid group having a phosphate structure: ratio Gukkenmi (BYK-W9010), 36 parts of γ-butyrolactone, mixed with a homomixer to obtain a dispersion of Α-6. The dispersion liquid Α-6 and the epoxy resin solution Β-2 were mixed by a ball mill to prepare a paste composition C-20. Further, a high dielectric composition was prepared based on the method of Example 1, and the results of evaluation of dielectric characteristics are shown in Table 3. The high dielectric composition has a dielectric constant of 95, a dielectric tangent of 3.1%, and an area of electrostatic capacitance of 8.4 nF/cm2. The void ratio was 7 vol%. Example 2 1 - 32 - 1352663 15.3 parts by weight of epoxy resin (manufactured by Nippon Kayaku Co., Ltd., nc3 〇〇〇), 5.3 parts by weight of phenol novolac lacquer resin (manufactured by Nippon Kayaku Co., Ltd., Kay Hatton" 新 (new name · ''Kayaharton KTG-105)), 0.2 parts by weight of hardening accelerator (Beixing Chemical Co., Ltd., triphenylphosphine) ' 24.7 parts by weight of vinegar mixture The epoxy resin solution Β-3 was obtained. The dispersion Α-2 and the epoxy resin solution Β-3 were mixed by ball milling to prepare a paste composition C-2 1. Also, by the embodiment! The method is based on a high dielectric composition, and the results of evaluating the dielectric properties are shown in Table 3. The high dielectric composition had a dielectric constant of 76, a dielectric tangent of 2.8%, and an area of electrostatic capacitance of 5.6 nF/cm2. The void ratio is 14% by volume. Example 22 62. 3 parts by weight of barium titanate (manufactured by Seiko Chemical Co., Ltd., BT-05, average particle diameter: 0·5 μηι), and 21.9 parts by weight of barium titanate (TPL, Inc., ΗΡΒ-Ι000) : average particle diameter 〇.〇59μπι), 15 parts by weight of γ-butyrolactone' 0.8 parts by weight of a dispersant (copolymer having an acid group having a phosphate structure, manufactured by Guckenmi Japan, BYC- W9010), using a homomixer to mix, to obtain a dispersion Α_7. 2.2 parts by weight of epoxy resin (manufactured by Nippon Kayaku Co., Ltd., ΕΡΡΝ 502 Η), 1 part by weight of phenol novolac lacquer resin (manufactured by Dainippon Ink Co., Ltd., TD-2 1 3 1 ), 0.04 parts by weight A hardening accelerator (manufactured by Behind Chemical Co., Ltd., triphenylphosphine)' 7.1 parts by weight of γ-butyrolactone was mixed to prepare an epoxy resin solution Β-4. The dispersion Α-7 and the epoxy resin solution Β-4 were mixed by ball milling to prepare a paste composition C-22. Further, a high dielectric composition was prepared based on the method of Example 1, and the results of evaluation of dielectric characteristics are shown in Table 6. The high dielectric composition had a specific dielectric constant of 123, a dielectric tangent of 3.1%, an area of electrostatic capacitance of 10.9 nF/cm2, and a dielectric porosity of 4,352,663. Example 23 2.6 parts by weight of epoxy resin (manufactured by Sakamoto Chemical Co., Ltd., NC-3000), 0.9 parts by weight of phenol novolac lacquer resin (manufactured by Nippon Kayaku Co., Ltd., 'Kaye Hatton' TPM) (New name: "Kayahton" KTG-105)), 0.04 parts by weight of hardening accelerator (Beixing Chemical Co., Ltd., triphenylphosphine)' 7.1 parts by weight of γ-butyrolactone mixed to obtain epoxy The resin solution Β-5. The dispersion Α-7 and the epoxy resin solution Β-5 were mixed by ball milling to prepare a paste composition C-23. Further, a high dielectric composition was prepared based on the method of Example 1. The material evaluation of dielectric properties is shown in Table 6. The high dielectric composition has a specific dielectric constant of 121, a dielectric tangent of 2.6%, and an area of electrostatic capacitance of 10.7 nF/cm2. 4% by volume. Example 2 4 A paste composition C-24 was produced in the same manner as in Example 23 except that ethylene glycol diacetate was used as a solvent. The boiling point of ethylene glycol diacetate was 190 °C. Further, a high dielectric composition was prepared based on the method of Example 1, and the dielectric properties were evaluated as shown in Table 6. The specific dielectric ratio was 9.5, and the dielectric #cut 3.1%, the electrostatic capacitance of the area was 8.4 nF/cm2, and the void ratio was 8 vol%. Example 25 A paste composition C-25 was produced in the same manner as in Example 23 except that diethyl malonate was used as a solvent. The boiling point of diethyl malonate was 199 ° C. Further, a high dielectric composition was prepared based on the method of Example 1, and the dielectric properties were evaluated. The specific dielectric ratio was 85 and the dielectric tangent was 2.7. %, area static _ 3 4 _ 1352663 The capacitance was 7.5 nF/cm 2 and the void ratio was 9% by volume. Example 2 6 A paste composition was prepared in the same manner as in Example 23 except that the solvent was ethyl carbitol. C - 2 6. The boiling point of carbitol is 2 0 2 ° C. Further, a high dielectric composition was prepared based on the method of Example 1, and the dielectric properties were evaluated. The specific dielectric ratio was 99, dielectric. The tangent was 2.9%, the electrostatic capacitance of the area was 8.81%/£; 1112, and the void ratio was 7 vol%. Example 2 7 A paste composition was prepared in the same manner as in Example 23 except that the solvent was 4-methylcyclohexanone. C-27. 4-methylcyclohexanone has a boiling point of 169 ° C. Moreover, a high dielectric composition was prepared based on the method of Example 1, and the dielectric was evaluated. The results of the characteristics are shown in Table 6. The specific dielectric constant was 79, the dielectric tangent was 2.1%, the electrostatic capacitance of the area was 7. OnF/cm2, and the void ratio was 12% by volume. Example 2 8 Solvent removal A paste composition C-28 was produced in the same manner as in Example 23 except that isophorone. The boiling point of isophorone was 215 ° C. Further, a high dielectric was produced based on the method of Example 1. The composition and the evaluation of the dielectric properties are shown in Table 6. The specific dielectric ratio was 76, the dielectric tangent was 2.2%, the electrostatic capacitance of the area was 6.7 nF/cm2, and the void ratio was 11% by volume. Example 2 9 A paste composition C-29 was produced in the same manner as in Example 23 except that the solvent was diethylformamide. The boiling point of diethylformamide is 177r. Further, a high dielectric composition was prepared based on the method of Example 1, and the dielectric properties were evaluated as shown in Table 6. The specific dielectric ratio is 70' dielectric tangent is 23% -35 - 1352663, the area has an electrostatic capacity of 6.2 nF/cm2, and the void ratio is 15% by volume. Example 3 A paste composition C-30 was produced in the same manner as in Example 23 except that the solvent was dimethylacetamide. The boiling point of dimethylacetamide is 165 °C. Further, a high dielectric composition was prepared based on the method of Example 1 to evaluate the dielectric properties. The specific dielectric constant was 79, the dielectric tangent was 2.3%, the electrostatic capacitance of the area was 7.0 nF/cm2, and the void ratio was 11% by volume. Synthesis Example 1; Dispersion X-1 5 3 28 parts by weight of barium titanate (manufactured by Seiko Chemical Industry Co., Ltd., BT·〇5, average particle diameter: 0.5 μm), and 1872 parts by weight of titanic acid Titium (TPB, Inc.'s 'HPB-1000, average particle size: 〇·〇59μιη), 928 parts by weight of γ-butyrolactone, 72 parts by weight of dispersant (having an acid group with a phosphate structure) Copolymer: Biko Chemical Co., Ltd., BYK-W9010, was mixed and dispersed in ice water for 1 hour using a homomixer to prepare a dispersion X-1. Synthesis Example 2; Dispersion Χ-2 To 5 32 8 parts by weight of barium titanate (manufactured by Sigma Chemical Industry Co., Ltd., ΒΤ-05, average particle diameter: 0.5 μm), and 1,872 parts by weight of barium titanate Filling (manufactured by Cabot Corpf, K-Plusl6, average particle diameter: 〇.〇6μιη), 928 parts by weight of γ-butyrolactone, 72 parts by weight of a dispersing agent (copolymer having an acid group having a phosphate structure: Chemicals • Japan (stock) system, BYK-W9010), using a homomixer and mixing and dispersing in ice water for 1 hour to obtain a dispersion Χ-2. Synthesis Example 3; Dispersion Χ _3 5 32 8 parts by weight of barium titanate (manufactured by Seiko Chemical Co., Ltd., ΒΤ-02, average particle diameter: 0,18 μm), and 1,872 parts by weight of barium titanate Filling (TPL, Inc. -36- 1352663 company, HPB-1000 'average particle size: 0_059μιη), 928 parts by weight γ-butyrolactone, 72 parts by weight of dispersant (copolymer having acid group with phosphate structure) : A mixture of GM-3, Japan, and BYK-W90 10) was mixed and mixed in ice water for 1 hour to obtain a dispersion Χ-3. Synthesis Example 4; Dispersion Χ-4 To 5 32 8 parts by weight of barium titanate (manufactured by Seiko Chemical Industry Co., Ltd., ΒΤ 03, average particle diameter: 〇.28 μιη), 1 872 parts by weight of barium titanate Filling (TPL, manufactured by Lnc., HPB-1000, average particle size: 0.059 μηι), 928 parts by weight of γ·butyrolactone, 72 parts by weight of dispersant (copolymerization with acid group with phosphate structure: ratio: Guji Chemical Co., Ltd. (BYK-W9010) was mixed and dispersed in ice water for 1 hour using a homomixer to prepare a dispersion liquid Χ-4. Synthesis Example 5; Dispersion Χ-5 to make 5 3 2 8 parts by weight of barium titanate filling (manufactured by Madhya Riyal, ΒΤ-ΗΡ3, average particle diameter: 1·2 μιη), 1 872 Parts by weight of barium titanate (TPL, Inc., ΗΡΒ-1000, average particle diameter: 0.059 μm), 928 parts by weight of γ-butyrolactone, 72 parts by weight of a dispersant (having a phosphate structure) The acid-based copolymer: Bikin Chemical Co., Ltd., BYK-W9010, was mixed and dispersed in ice water for 1 hour to obtain a dispersion Χ-5. Synthesis Example 6; Dispersion Χ-6 5 3 2 8 parts by weight of barium titanate filling (manufactured by Kyoridia, BT-SA, average particle size: 2·1 μιη), 1 872 a barium titanate filling (TPL, Inc., ΗΡΒ-1000, average particle diameter: 0.05 9 μm), 92 8 parts by weight of γ·butyrolactone, 72 parts by weight of a dispersant (having a phosphate structure) Acid-based copolymer: ICP: Japan (stock), BYK-W9010), using a homomixer 1352663 〇5, average particle size: 0.5 μιη), 928 parts by weight γ-butyrolactone '72 parts by weight dispersion Agent (copolymer with acid group of phosphate structure: BYK-W90 10), used in a homomixer, mixed in ice water for 1 hour to prepare a dispersion Χ- 10. Synthesis Example 11; Dispersion X-11 5 281 parts by weight of barium titanate filling (manufactured by Kyoridia), BTHP-8YF 'average particle diameter: 7 μηι), and 1872 parts by weight of titanic acid钡塡物 (Boundary Chemical Industry Co., Ltd., ΒΤ-05, average particle size: 0·5μιη), 928 parts by weight of γ-butyrolactone, 72 parts by weight of dispersant (having acid group copolymerization with phosphate structure) Substance: Biochemical • Japan (stock), BYK-W9010), using a homomixer and mixing and dispersing in ice water for 1 hour to obtain a dispersion X·1 1 . After the barium titanate filling (manufactured by Sigma-Aldrich Co., Ltd., BT-SA, average particle size: 2. ίμιη) is dispersed in an acrylic resin binder by a ball mill, the primary particles are coagulated and hardened using a spray dryer. Secondary particle granulation. Then, it was baked in the air at 1,200 ° C for 6 hours, and then pulverized in a mortar, and then classified by a 50-mesh sieve and a 300-mesh sieve to obtain a barium titanate-filled product having an average particle diameter of 40 μm. . For the measurement of the average particle size, a dynamic scattering type particle size distribution measurement device (LB-5〇0, manufactured by Horiba, Ltd.) was used. 5 3 2 8 parts by weight of the barium titanate filling A '1 8 7 2 parts by weight of barium titanate filling B (manufactured by Kyori·Madillaru Co., Ltd., BT-SA, average particle diameter: 2.1μη〇, 92 8 parts by weight of γ-butyrolactone, 72 parts by weight of a dispersant (copolymer having an acid group having a phosphate structure, · Guji Chemical Co., Ltd., BYK-W9010), use The mixture was mixed and dispersed in ice water for 1 hour to prepare a dispersion Χ-Ι2. Synthesis Example 13; dispersion X-13-39-1352663 6% by volume. Then, the paste composition was used in a spin coater. It was coated on an aluminum substrate and a copper substrate, dried in an oven at 120 ° C for 1 minute, and then cured at 175 ° C for 1 hour to prepare a dielectric composition. The stress change was measured using a Flexus device, Flexus, and the coefficient of linear expansion of the dielectric composition was determined from the change rate of the dielectric composition. The result was 18 ppm/° C., copper. (17ppm wide C) Maintaining approximately uniform enthalpy. In addition, an aluminum electrode is formed by vapor deposition on the surface of the dielectric composition on the aluminum substrate. The object and the aluminum of the substrate were used as electrodes, and an impedance analyzer (manufactured by Shuraton Pascal (HP), HP 4284A, HP 1 645 1 B) was used for the dielectric characteristics of 1 MHz, and was determined based on JIS K6911. As a result, the specific dielectric ratio was 55, the dielectric tangent was 3.3%, and the electrostatic capacitance of the area was 4.9 nF/cm 2 °. In addition, the dielectric composition on the copper substrate was subjected to the Blytheque test (PCT test, After 100% RH, 121 °c, 2 atmospheres, and 100 hours later, there was no abnormality observed by microscopy. With the checkerboard test method of the checkerboard method (JIS K5400), the evaluation points were 10 points, which was good. Moreover, in any measurement of the coefficient of linear expansion, dielectric properties, and PCT test, the film thickness of the dielectric composition is evaluated at a level of 5, 10, 20 μm, etc., since there is no difference in film thickness, In Table 9, all are ι〇μπι. Example 3 2 In a container equipped with a stirrer, 86 parts by weight of a dispersion Χ-1, Xu-41-!352663 was added, and 11 parts by weight of a resin solution Υ-1 and 3 amount were added. γ _ _ _ vinegar, mixed using a deceleration method, and stirred in the ball mill for 1 hour, prepared In this case, when the total amount of the inorganic chelating agent and the resin is 100% by volume, the content of the inorganic cerium is about 72% by volume. The same paste composition is used in the same manner as in Example 31. The dielectric composition, the coefficient of linear expansion, the dielectric properties, and the results of the PCT test are shown in Table 9. Example 3 3 In a container equipped with a stirrer, 88 parts by weight of a dispersion liquid χ;; ι , Xu Di was added to 7 The resin solution γ-1 and 5 parts by weight of γ-butane vinegar were mixed by a deceleration method, and further stirred in a ball mill for 1 hour to obtain a paste composition. At this time, when the total amount of the inorganic ruthenium and the resin is .100% by volume, the content of the inorganic ruthenium is about 79% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the results of measurement of linear expansion coefficient, dielectric property, and PCT test are shown in Table 9. Example 3 4 In a vessel equipped with a stirrer, 89 parts by weight of a dispersion Χ-1 was added, and Xu was added to 4 parts by weight of the resin solution yu and 7 parts by weight of butyrolactone, mixed by a deceleration method, and stirred in a ball mill. 1 hour, the composition of the paste was obtained. At this time, when the total amount of the inorganic filler and the resin is 100% by volume, the content of the inorganic ruthenium is about 86% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the results of measurement of linear expansion coefficient, dielectric property, and PCT test are shown in Table 9. Example 3 5 - 42- Ϊ 352663 In a container equipped with a stirrer, 90 parts by weight of a dispersion Χ-l was added, and 2 parts by weight of the resin solution Yd and 8 parts by weight of γ-butyrolactone were slowly added, and after mixing by a deceleration method, Further, the mixture was stirred for 1 hour in a ball mill to prepare a paste composition. At this time, when the total amount of the inorganic ruthenium and the resin is 1% by volume, the content of the inorganic ruthenium is about 91 ❶ /. . Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the results of measurement of linear expansion coefficient, dielectric property, and PCT test are shown in Table 9. Example 3 6 Into a vessel equipped with a stirrer, 91 parts by weight of a dispersion liquid Χ-1 was added, and 1 part by weight of a resin solution γ -1 and 8 parts by weight of γ-butyrolactone were added, mixed by a deceleration method, and further The mixture was stirred for 1 hour in a ball mill to prepare a paste composition. At this time, when the total amount of the inorganic filler and the resin is 1 〇 〇 by volume, the content of the inorganic ruthenium is about 93% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the results of measurement of linear expansion coefficient, dielectric properties, and PCT test are shown in Table 9. Example 3 7 to 4 3 88 parts by weight of the dispersion shown in Table 5 was placed in a container equipped with a stirrer, and 7 parts by weight of the resin solution shown in Table 5 and 5 parts by weight of γ-butyrolactone were added to the stomach. After the deceleration method was mixed, the mixture was stirred for 1 hour in a ball mill to obtain a paste composition. At this time, when the total amount of the inorganic filler and the resin is 100% by volume, the content of the inorganic filler is about 79% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the coefficient of linear expansion, dielectric properties, and PCT test were measured as shown in Tables 9 and 10 - 43 - 1352663. 44 93 parts by weight of the dispersion liquid X-7 was placed in a vessel equipped with a stirrer, and 7 parts by weight of the resin solution Y-1 was slowly added thereto, mixed by a deceleration method, and further stirred in a ball mill for 1 hour to obtain a paste composition. At this time, when the total amount of the inorganic filler and the resin is 100% by volume, the content of the inorganic filler is about 79% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the results of measurement of coefficient of linear expansion, dielectric properties, and PCT test are shown in Table 10. Example 4 5 ^ 93 parts by weight of a dispersion X-8 was placed in a vessel equipped with a stirrer, and 7 parts by weight of a resin solution Y-1 was slowly added thereto, mixed by a deceleration method, and further stirred in a ball mill for 1 hour to prepare a paste. Cream composition. In this case, when the total amount of the inorganic filler and the resin is 100% by volume, the content of the inorganic filler is about 81% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the results of measurement of coefficient of linear expansion, dielectric properties, and PCT test are shown in Table 10. x Example 4 6 Into a vessel equipped with a stirrer, _93 parts by weight of a dispersion χ_9 was added, and 7 parts by weight of a resin solution Y·1 was slowly added, and after mixing by a deceleration method, the mixture was further stirred in a ball mill for 1 hour to prepare a paste. Cream composition. At this time, when the total amount of the inorganic filler and the resin is 100% by volume, the content of the inorganic filler is about 86% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the coefficient of linear expansion, dielectric properties, and PCT test were measured as shown in Table 10. -44- 1352663 Comparative Example 4 A dielectric composition was obtained in the same manner as in Example 31 except that the epoxy resin solution of Synthesis Example 14 was used, and the inorganic enthalpy dispersion was not used, and the coefficient of linear expansion and dielectric properties were measured. The results of the PCT test are shown in Table 10. Comparative Example 5 88 parts by weight of a dispersion X-1 was added to a vessel equipped with a stirrer, and 7 parts by weight of a resin solution and 5 parts by weight of γ-butyrolactone were slowly added thereto, mixed by a deceleration method, and further stirred in a ball mill. One hour, a paste composition was obtained. At this time, when the total amount of the inorganic filler and the resin is 100% by volume, the content of the organic filler is about 79% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the results of measurement of linear expansion coefficient, dielectric property, and PCT test are shown in Table 10. Comparative Example 88 88 parts by weight of the dispersion Χ-11 was placed in a container equipped with a stirrer, and 7 parts by weight of the resin solution Υ-1 and 5 parts by weight of γ-butyrolactone were slowly added, mixed by a deceleration method, and further in a ball mill. The mixture was stirred for 1 hour to prepare a paste composition. The paste composition is allowed to stand to make the filling easy to precipitate. At this time, when the total amount of the inorganic chelating agent and the resin is 100% by volume, the content of the inorganic cerium is about 79% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and dielectric properties were measured by trial. However, the measurement was not stable and measurement was impossible. Comparative Example 7 88 parts by weight of a dispersion liquid Χ-12 was placed in a vessel equipped with a stirrer, and 7 parts by weight of a resin solution Υ-1 and 5 parts by weight of γ-butyrolactone were slowly added, and the -45-1352663 was mixed by a deceleration method. In addition, it was disturbed in the ball mill for 1 hour to prepare a paste and a composition. The paste composition is allowed to stand to make the filling easy to precipitate. At this time, when the total amount of the inorganic filler and the resin is 100% by volume, the content of the inorganic filler is about 79% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and the dielectric properties were measured by measurement. However, the measurement of & Comparative Example 8 93 parts by weight of a dispersion liquid χ13 was placed in a vessel equipped with a stirrer, and 7 parts by weight of a resin solution Υ-1 and 5 parts by weight of vinegar were gradually added, and φ was mixed by a deceleration method, and further stirred in a ball mill. In the hour, a paste composition was prepared. The paste composition is allowed to stand to make the filling easy to precipitate. In this case, when the total amount of the inorganic filler and the resin is 100% by volume, the content of the inorganic filler is about 79% by volume. Using the obtained paste composition, a dielectric composition was obtained in the same manner as in Example 31, and dielectric properties were measured by trial. However, the measurement was not stable and measurement was impossible. Comparative Example 9 In addition to changing the barium titanate filling (manufactured by 堺Chemical Industries Co., Ltd., ΒΤ-05, average particle size: 〇, 5 μιη) of large particle size enthalpy, it was changed to barium titanate filling (TPL). , Inc., HPB-1 000, average particle size: 〇·〇59μηι), and barium titanate filling using small particle size enthalpy (TPL, Inc., ΗΡΒ-1000, average particle size: In the same manner as in Synthesis Example 3, a dispersion liquid was prepared in the same manner as in Synthesis Example 3 except that it was changed to a titanate saw sputum filling (manufactured by TPL, Inc., HPS-2000, average particle diameter: 0·045 μm), but the condensate was aggregated and dispersed. The liquid is also unstable and cannot be made into a paste composition. Industrial Applicability 値 -46- 1352663 The paste composition and the dielectric composition of the present invention are suitably used for a capacitor or an interlayer insulating material or an optical wiring material for a circuit material functioning as a capacitor.

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1352663 e谳膜性卜卜ΓΝΪ Bu X dielectric tangent (%) 〇 〇<η Ο ΓΟ cn 〇〇(N _ PW 1 WS: n - 〇*〇CN — οο VO »n & Rate 00 V〇κη ON \〇 film thickness (μηι) 〇00 Ο (N The amount of solvent in the total composition of the paste composition (replacement %) in the inorganic component (% by weight) Additive 1 1 Triphenylphosphine triphenylphosphine / BYK- W9010 Triphenylphosphine m r-butyrolactone T-butyrolactone τ-butyrolactone τ-butyrolactone τ-butyrolactone hardener 1 1 am ^ tlK ··· msm f- m ϋ amm am ^ n-rn 癍s 璲H ss m 麄讲菡ra Μ -K SS骅 key purpose|ε 擀m η m tH3 m 0. C/0 E gg m狴米β Β crocodile κ κ κ polyether maple Sumitomo Chemical 5003P epoxy resin Japanese chemical EPPN502H epoxy resin Japanese chemical EPPN502H epoxy resin Japanese chemical NC3000 inorganic ruthenium titanate chemical ΒΤ-05 barium titanate Boundary Chemistry BT-05 Barium Titanate Boundary Chemistry BT-05 Barium Titanate Boundary Chemistry BT-05 Barium Titanate Boundary Chemistry ΒΤ-05 Example Buddhism

1352663 Membrane characteristic void ratio (% by volume) ίΝ cn κη Dielectric characteristics (1MHz) Dielectric tangent (%) σ\ oo <ή Bu static capacitance (nF/cm2) Inch cvi ν〇oi Bu oi Specific dielectric ratio U-> 菩膜厚(μηι) 1〇<Ν paste composition _ 松蘅 $ nm μ ϋ ^ 5 瑟 _ 〇ι/Ί m 揉_ $ •fr ^ ¢)] 1g· ^ S鹚§; S; additive triphenylphosphine triphenylphosphine triphenylphosphine solvent r-butyrolactone morpholine propylene glycol monomethyl ether acetate hardener 赃 axis 菡 菡 挎 挎 菡 擀璲Κ Θ Θ Goose HI 趟s _ sniper m pj It ^ -Κ Η 靼ϋ Zhao m „ ^ SS Ί4 ^ 浒璲K giant resin epoxy resin EP本本EPPN502H epoxy resin 曰本化药ΕΡΡΝ502Η Epoxy resin 曰本化Medicine EPPN502H Inorganic sulphate barium titanate chemical BT-05 Barium titanate chemical ΒΤ-05 Barium titanate chemistry BT-05 Comparative example 1 (Ν ΓΟ 1352663

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1352663 Γ-General paste composition Dispersion stability, stability, stability, stability, stability, stability, stability, stability, stability, stability, stability (precipitate precipitation) stability (filling sedimentation) /28 1_ 79/21 86/14 91/9 93/7 79/21 79/21 79/21 79/21 79/21 79/21 Resin solution epoxy resin Υ-1 Y-1 Y-1 • 1 Y -1 Y-1 Υ-2 Υ-2 1 1 Y-1 Y-1 Inorganic enthalpy maximum/minimum (ratio) yn 00 00 〇〇〇6 00 00 00 m 00 20.3 35.6 Average particle size (μηι) 0,059 0.059 0.059 0.059 0.059 0.059 0.059 0.060 0.059 0.059 0.059 0.059 Composition barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate Particle size (μηι) 〇dddd ό 〇〇0.18 0.28 CN • < CS composition barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate barium titanate titanate Barium strontium titanate dispersion X-1 X-1 X-1 X-1 X-1 Χ-1 Χ-1 X-2 X-3 X-4 X-5 X-6 Example 31 Example 32 Example 33 Example 34 Implementation Example 39 Example 35 Example 36 Example 37 38 Example 41 40 embodiment ___1 Example 42

1352663 High dielectric composition PCT test after checkerboard grid test evaluation points 〇o Ο 00 00 inch ο Ο Ο Ο Ο 介 Dielectric characteristics @1ΜΗζ Electrostatic capacity (nF/cm2) 〇\ oo oo Bu Bu 〇 - οο νο 〇 〇 \ 10.1 ' <Ν ΟΟ ο 〇\ 12.0 m Dielectric tangent (%) mm — — <Ν vd 〇6 ΟΝ CS <Ν CN οο οο <Ν Ο inch · Specific dielectric ratio 00 Os 110 109 00 〇\名114 Os <Ν Ο Ρ ^ 150 Linear expansion coefficient (ppm wide C) oo Ό Ό ν〇νο ψ νο ν〇VO ν〇\〇ν〇 film thickness (μπι) o ο ο实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施

1352663 0Ϊ漱High dielectric composition evaluation point of checkerboard grid test after PCT test 〇Ο Ο Ο Ο 00 νο VO Due to condensation, it is impossible to make paste ^ Dielectric property @1 MHz Electrostatic capacity (nF/cm2 10.2 οό CN γγ-^ m ο 守\ό Measurement 値 Unstable, unable to measure 値 Unstable, unable to measure. _ Determination 値 Unstable, unable to measure dielectric tangent (%) ON ΓΝ σ\ m CN ΙΟ 〇 〇CS ΟΟ 介 Specific dielectric ratio IT) <Ν Linear expansion coefficient (ppm/°C) VO CN CN Γ〇v〇•Ο Film thickness: (μπι) ο Ο Ο Ο ο Ο ο 〇〇 Example 43 Implementation Example 44 Example 45 Example 46 Comparative Example 4 Example 5 1 Example 6 Example 7 Example 8 Example 9

Claims (1)

1352669 Announcement 丨 觐 觐 觐 8. 31I Table., I Supplement 1 Amendment No. 093109156 "Mold composition and use of its composition of the body ^ Patent case (amended on August 31, 2011) : A paste composition characterized by comprising a solvent having a boiling point of 160 ° C or more and having an inorganic cerium in a paste composition comprising an inorganic cerium, a resin, and a solvent. The inorganic filler having an average particle diameter of 5 μm or less, and the total solvent amount is 25% by weight or less based on the total amount of the paste composition; in the solid content contained in the paste composition < possessed The content of the inorganic cerium is 85% by weight or more and 99% by weight or less, wherein the inorganic cerium is from barium titanate, barium titanate, barium titanate, titanic acid, barium titanate, Magnesium titanate, barium titanate, strontium titanate, barium magnesium strontium, barium magnesium molybdate, lead titanate, lead citrate, lead zirconate titanate, lead citrate , lead magnesium citrate, nickel bismuth At least one selected from the group consisting of a lead acid system, a lead tungstate system, a calcium tungstate system, a lead magnesium tungstate system, and a titanium dioxide system; (The resin contains a thermosetting resin. 2) A paste as claimed in claim 1 a composition, wherein the inorganic ruthenium comprises an inorganic ruthenium having at least two average particle diameters, and a maximum average particle diameter among the average particle diameters is 0.1 to 5 μm, and a maximum average particle diameter is a minimum average particle size 3. The paste composition of claim 1 which contains at least one solvent having an ester structure. 4 · The paste composition of claim 1 of the patent scope, which contains at least one 1352,663 A solvent having a lactone structure is modified. 5 - A paste composition according to the scope of the patent application, wherein the thermosetting resin is an epoxy resin. 6. A paste as claimed in claim i a composition comprising a compound having a phosphate structure as a dispersing agent. 7. A dielectric composition characterized by administering a paste composition according to any one of claims 1 to 6. Desolvent, hard In the obtained dielectric composition, the amount of the inorganic ruthenium is 85 to 99% by weight based on the total amount of the solid content contained in the dielectric composition, and the void ratio is 30% by volume or less. The dielectric composition of claim 7 is a film shape having a film thickness of 〇.5 μm to 20 μm. 9. A dielectric composition characterized by having an inorganic filler and a resin. In the electric composition, the inorganic ruthenium has at least two kinds of average particle diameters, and the largest average particle diameter among the average particle diameters is 〇·1 to 5 μmη, and the maximum average particle diameter is the smallest average particle diameter. 3 times or more; the content of the inorganic ruthenium contained in the solid content contained in the paste composition I· is 85% by weight or more and 99% by weight or less; wherein the inorganic ruthenium is from the titanium dioxide system or barium titanate , bismuth citrate zirconate, barium titanate, calcium titanate, barium titanate, magnesium titanate, silver phthalate, bismuth citrate, bismuth citrate, table full Acid bismuth, lead titanate, lead zirconate, lead zirconate titanate, lead citrate, magnesium bismuth, strontium silver Lead acid, hexanoic acid, hexanoic acid, magnesium oxalate 1352663, at least one selected from the group; the resin contains a thermosetting resin. 10. A dielectric according to claim 9 The bulk composition, wherein the total volume ratio Vf of the inorganic ruthenium satisfies 50% to 95% with respect to the total volume of the inorganic ruthenium and the total volume of the solid content of the resin. The dielectric composition of the present invention, wherein the resin is an epoxy resin. I2. The dielectric composition of claim 9 which contains a compound of an acid ester structure as a dispersing agent. It is characterized in that a paste composition or a dielectric composition as in the first or ninth aspect of the patent application is used. An optical wiring ' is characterized by using a paste composition or a dielectric composition as in the first or ninth aspect of the patent application. -3-