TWI492807B - 樹脂構件之雷射接合方法及樹脂構件之雷射接合體 - Google Patents

樹脂構件之雷射接合方法及樹脂構件之雷射接合體 Download PDF

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TWI492807B
TWI492807B TW099146085A TW99146085A TWI492807B TW I492807 B TWI492807 B TW I492807B TW 099146085 A TW099146085 A TW 099146085A TW 99146085 A TW99146085 A TW 99146085A TW I492807 B TWI492807 B TW I492807B
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laser
resin
resin member
light
absorbing agent
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TW201139026A (en
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Naoyuki Matsuo
Mayu Shimoda
ryuta Kibe
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Nitto Denko Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1619—Mid infrared radiation [MIR], e.g. by CO or CO2 lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/168—Laser beams making use of an absorber or impact modifier placed at the interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/1683—Laser beams making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/245—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool the heat transfer being achieved contactless, e.g. by radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5042—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like covering both elements to be joined
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B29C66/1142—Single butt to butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
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    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
    • B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311—Thermal properties
    • B29C66/73115—Melting point
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311—Thermal properties
    • B29C66/73117—Tg, i.e. glass transition temperature
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    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/735—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the extensive physical properties of the parts to be joined
    • B29C66/7352—Thickness, e.g. very thin
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    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8145—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
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  • Physics & Mathematics (AREA)
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  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
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  • Thermal Sciences (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
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Description

樹脂構件之雷射接合方法及樹脂構件之雷射接合體 技術領域
本發明係有關於一種可接合樹脂構件與樹脂構件之樹脂構件之接合方法及接合2個以上樹脂構件而成之樹脂構件之接合體。
 背景技術
迄今，接合樹脂構件與樹脂構件之方法已採用一種藉雷射光熔接樹脂構件彼此之方法。藉雷射光熔接上述樹脂構件彼此時，通常係採用在該等樹脂構件與樹脂構件之表面彼此接觸之狀態下予以重疊，並對其重疊部分照射雷射光而使構成樹脂構件表面之樹脂材料熔融以形成熔接部之方法，或對置樹脂構件之端部與端部，並橫跨兩者而加以重疊其它樹脂構件，再對其重疊部分照射雷射光而使構成樹脂構件表面之樹脂材料熔融以形成熔接部之方法等。
藉上述熔接進行樹脂構件之接合時，係採用先於欲熔接之部位配置光吸收劑，再朝配置有前述光吸收劑之部位照射雷射光，使所照射之雷射光自樹脂構件之背面側朝表面側穿透而照至光吸收劑，以藉前述光吸收劑吸收雷射光，而將雷射光之光能轉換為熱能以熔接前述樹脂構件之表面接觸部位之方法而進行。所照射之雷射光係使用諸如紅外線雷射或近紅外線雷射，配置於樹脂構件之表面接觸部位之光吸收劑則使用碳黑、紫質系吸收劑等吸收峰值在紅外領域或近紅外領域之物質(參照以下專利文獻1及2)。
採用使用了上述光吸收劑之雷射熔接方法，即便就對雷射光具有較高透明性之樹脂構件彼此之熔接，亦可僅使樹脂構件之界面發熱熔融而進行熔接。
然而，上述之使用光吸收劑之雷射熔接方法在發生雷射光源之雷射振盪器之輸出變動、被加工物之表面凹凸所致之聚光密度變動等製程中之預期外之變動時，雷射光所供給之熱能可能過多，結果將使被加工物之樹脂構件昇至預定加熱溫度以上之高溫而導致分解或碳化反應，造成發生產品瑕疵之問題。尤其，以玻璃轉化溫度Tg或熔點並不高之樹脂構件作為接合對象，並提高雷射輸出而欲快速進行雷射接合時，將特別突顯上述問題。
【先行技術文獻】 【專利文獻】
【專利文獻1】特表2002-526261號公報
【專利文獻2】特許3682620號公報
本發明係有鑑於上述習知技術之問題而設計者，目的在提供一種樹脂構件之雷射接合方法及樹脂構件之雷射接合體，而在藉光吸收劑進行樹脂構件之雷射接合時，即便發生雷射輸出變動或聚光密度變動等流程變動，亦可避免樹脂構件之分解及碳化等產品瑕疵之發生，而迅速實施雷射接合。
本發明係為解決上述習知技術之問題而設計，本發明之樹脂構件之雷射接合方法可使2個以上之樹脂構件接觸，並對其接觸面附近所配置之光吸收劑照射雷射光而熔接接合樹脂構件，前述樹脂構件之至少任一係具有300℃以下之玻璃轉化溫度(以下亦簡稱為Tg)或熔點之熱塑性樹脂，前述光吸收劑係使用示差熱天平(differential thermobalance)測定加熱至350℃之重量減少量為40%以上者。
又，本發明之樹脂構件之雷射接合體係由2個以上之樹脂構件相接觸，並對其接觸面附近所配置之光吸收劑照射雷射光而熔接接合樹脂構件彼此而成，前述樹脂構件之至少任一係具有300℃以下之玻璃轉化溫度或熔點之熱塑性樹脂，前述光吸收劑係使用示差熱天平測定加熱至350℃之重量減少量為40%以上者。
依據本發明之樹脂構件之雷射接合方法及接合體，接觸面附近所配置之光吸收劑係使用示差熱天平測定加熱至350℃之重量減少量為40%以上者，故即便雷射照射導致局部供給過多熱能，亦可藉上述過多之熱能使光吸收劑本身分解。因此，就雷射接合之樹脂構件之任一採用玻璃轉化溫度或熔點在300℃以下之熱塑性樹脂時，即便發生雷射光源之雷射振盪器之輸出變動或被加工物之表面凹凸所致之聚光密度變動等預期外之變動，雷射光所供給之熱能亦不致過多，而可抑制前述樹脂構件之分解或碳化反應，以避免產品瑕疵之發生。
圖式簡單說明
第1圖係顯示第1實施例之樹脂構件之雷射接合方法之側面圖。
第2圖係顯示第1實施例之雷射接合方法所接合之樹脂構件之接合體之側面圖。
第3圖係顯示第2實施例之樹脂構件之雷射接合方法之側面圖。
第4圖係顯示第2實施例之雷射接合方法所接合之樹脂構件之接合體之側面圖。
第5圖係顯示第3實施例之樹脂構件之雷射接合方法之側面圖。
第6圖係顯示第3實施例之雷射接合方法所接合之樹脂構件之接合體之側面圖。
第7圖係顯示就實施例及比較例所使用之光吸收劑使用示差熱天平而測得之重量減少量之測定結果之圖表。
 用以實施發明之形態
以下，就本發明之較佳實施例參照附圖加以說明。
第1圖係顯示本發明第1實施例之樹脂構件之雷射接合方法之側面圖，符號10a、10b代表片狀之樹脂構件，符號50代表雷射光。又，第2圖係顯示前述第1實施例之雷射接合方法所接合之樹脂構件之接合體之側面圖。
如第1圖所示，第1實施例之樹脂構件之雷射接合方法係使片狀之樹脂構件10a、10b個別之端部形成上下重疊之狀態，並使前述樹脂構件10a、10b之接觸面熔融而進行黏合。具體而言，係先對前述樹脂構件10a、10b之接觸面塗布光吸收劑20，再照射雷射光50，而使前述光吸收劑20發熱，藉其熱能使前述樹脂構件10a、10b之接觸面熔融，而實施該等樹脂構件10a、10b之接合。
作為接合對象之樹脂構件10a、10b之至少任一為其接合面上設有Tg或熔點在300℃以下之熱塑性樹脂之樹脂構件即可，材質並無特別之限制。
Tg或熔點在300℃以下之熱塑性樹脂則可例舉聚碳酸酯樹脂、聚乙烯醇樹脂、聚乙烯樹脂、聚丙烯樹脂、聚對苯二甲酸乙二酯樹脂、聚氯乙烯樹脂、三醋酸纖維素、聚甲基丙烯酸甲酯樹脂、環烯烴聚合物、冰片烯樹脂、聚縮醛樹脂、聚醚醚酮樹脂、聚醚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚丁二烯樹脂、聚氨酯樹脂、聚苯乙烯樹脂、聚甲基戊烯樹脂、聚醯胺樹脂、聚縮醛樹脂、聚對苯二甲酸二丁酯樹脂、乙烯醋酸乙烯酯樹脂等。
另，Tg係以JIS K7121(1987)為標準，並使用差異掃描量熱儀(Seiko Instruments株式會社出品，DSC6220)，按10℃/min之條件昇溫而求出DSC曲線，從而求出外插玻璃轉化開始溫度而求得者。
前述樹脂構件之厚度宜在1μm以上、10mm以下。前述樹脂構件之厚度若在1μm以下，則前述樹脂構件之處理將較為困難，若為10mm以上，則前述樹脂構件之吸光將使雷射光減弱而降低對光吸收劑之到達效果，而有降低生產性之虞。
又，雷射接合之層，即樹脂構件10a、10b中至少任一之接合面為前述熱塑性樹脂即可，故即便前述樹脂構件為單層或積層構造均可，所積層之其它層之材質並無特別之限制。又，接合面之熱塑性樹脂及所積層之其它層亦可包含抗氧化劑、阻燃劑、交聯劑、光安定劑、顏料、充填材等任意之添加劑。
惟，配置於雷射光之照射側之樹脂構件宜就樹脂構件整體具備30%以上之透光率，並以50%以上之透光率為更佳。
前述光吸收劑20可採用加熱至350℃而藉示差熱天平測得重量減少量為40%以上者，進而，採用加熱至400℃而測得重量減少量為60%以上者則更佳。
藉使用具上述物性之光吸收劑，則即便發生雷射振盪器之輸出變動、被加工物之表面凹凸所致之聚光密度變動等製程中預期外之變動，亦可避免光吸收劑受加熱至400℃以上，而避免樹脂構件之分解或碳化反應。
前述光吸收劑可採用顏料及染料等中符合上述條件之各種物質。又，前述光吸收劑之具體使用方法則可例舉於前述樹脂構件之接合面上形成含有前述光吸收劑之膜層之方法，或使前述樹脂構件之接合面含有前述光吸收劑之方法。於樹脂構件之接合面上形成膜層時，舉例言之，可採用以有機溶劑等稀釋光吸收劑，而以適當之塗布機構進行塗布之方法。又，乾燥後之前述膜層之厚度宜在1μm以下，而以0.5μm以下為更佳。含有光吸收劑之膜層之厚度若大於1μm，則有妨礙接合之2個樹脂構件之互溶之虞。又，含有前述光吸收劑之膜層之吸光性宜在20%以上，而以30%以上為更佳。含有光吸收劑之膜層之塗布寬度則可配合雷射照射領域而適當加以最佳化。
上述之光吸收劑則可例舉碳黑、紫質系吸收劑、鈦菁素系吸收劑、萘酞菁系吸收劑、聚次甲基系吸收劑、二苯甲烷系吸收劑、三苯甲烷系吸收劑、醌系吸收劑、偶氮系吸收劑、二銨鹽等。該等光吸收劑之具體例則可適當使用美國Gentex公司以商品名「Clearweld」發售之光吸收劑。該美國Gentex公司出品之「Clearweld」即加熱至350℃而以示差熱天平測得之重量減少量為60%者。
另，本發明中以示差熱天平測得之重量減少量更具體而言，係藉以下實施例所揭露之方法測得者。
又，吸收劑之塗布方式可採用諸如針頭分注、噴墨印刷、網印、2流體式、1流體式或超音波式噴霧、打印等一般方式。
重疊樹脂構件彼此之方法則如第1圖所示，宜在載台30上，配置作為接合對象之至少2片樹脂構件10a、10b呈重疊狀態，並由上以加壓機構40加以按壓，而在已固定前述樹脂構件之狀態下照射雷射光50。
前述加壓機構可適當使用設有對所採用之雷射光具較高之透明性之玻璃作為加壓構件者。加壓強度宜為0.5~100kgf/cm2 ，而以1~20kgf/cm2 為更佳。凡可對雷射照射部施加載重者即可，前述加壓構件之形狀並無特別之限制，可使用諸如平板、圓筒、球狀者。加壓構件之厚度雖無特別之限制，但過薄將因變形而無法正常加壓，過厚則將降低雷射光之利用效率，故宜為3mm以上、30mm以下，而以5mm以上、20mm以下為更佳。加壓構件之材質可使用諸如熔融石英、無鹼玻璃、TEMPAX、PYREX、VYCOR、D263、OA10、AF45等。為提高雷射光之利用效率，玻璃構件宜對所採用之雷射光波長具備較高之透明性，具體而言，透光率宜為50%以上，而以70%以上為更佳。
又，由可均一加壓大面積以就其全域進行良好接合之觀點而言，宜在加壓構件與樹脂構件之間插入透光性良好且具緩衝性之橡膠或樹脂材料等(以下稱為相間材料)。前述相間材料則可例舉矽氧橡膠、聚胺酯橡膠等橡膠系材料及聚乙烯等樹脂材料。相間材料之厚度宜在50μm以上、5mm以下，而以1mm以上、3mm以下為更佳。若在50μm以下，則缺乏緩衝性，5mm以上則可能因吸收、散射而降低雷射光之利用效率。相間材料宜對所採用之雷射光波長具備已達30%以上之透光率，而以50%以上之透光率為更佳。
又，前述載台30之材質可使用金屬、陶瓷、樹脂、橡膠等。為均一加壓較大面積以獲致良好之接合狀態，宜使用橡膠。進而，為達成提高接合後與薄片之剝離性之目的以及提昇耐熱性之目的，亦可就前述橡膠之表面進行表面處理，或於前述橡膠上配置其它樹脂構件等。
又，用於照射之雷射光50並無特別之限制，可例舉半導體雷射、光纖雷射、飛秒雷射、YAG雷射等固態雷射、CO2 雷射等氣體雷射。
其等中，就價廉且易獲致面內均一強度之雷射光方面，則宜採用半導體雷射或光纖雷射。
又，就可避免樹脂本身之分解且易於促進熔融方面，則以連續波之CW雷射(Continuous-Wave Laser)較可瞬間送入較高能量之脈衝雷射更為適用。
又，雷射之輸出、能量密度、光點大小、照射次數、掃瞄速度等，可依樹脂材料之種類、厚度、吸光率等而適當加以選擇。
又，在接觸面之面方向上移動照射雷射光50之位置，則可使大面積之接觸面彼此熔接。具體而言，舉例言之，可使藉聚光鏡而聚光成預期之光點大小之光點束掃瞄照射預期之熔接部位而進行大面積之熔接。又，亦可藉高速掃瞄電鏡在雷射頭已固定之狀態下僅使光束進行掃瞄，進而藉稱為繞射光學元件之光學元件之使用而將雷射光束整形為所需形狀，而藉非掃描方式實施大面積之概括熔接。
又，上述之樹脂構件之接合方法宜可調整雷射光50之照射條件及上述加壓條件，而在熔接部位之樹脂材料彼此之界面消失之狀態下進行熔接。界面消失即可進行充分之互溶化，並提昇黏合強度，且，亦可改善透光性等。
依據本第1實施例之樹脂構件之接合方法，樹脂構件10a及樹脂構件10b之接合面上配置有加熱至350℃而以示差熱天平測得重量減少量為40%以上之光吸收劑，故即便雷射振盪器之輸出有所變動，或雷射光之聚光密度有所變動而過度照射雷射光，亦可抑制前述光吸收劑之溫度過度上昇，而可避免樹脂構件之分解或碳化。
另，本發明之樹脂構件之雷射接合方法及雷射接合體不受限於上述第1實施例，而可就所接合之樹脂構件之位置關係及光吸收劑之配置部位等進行各種變形實施。以下，即以第2及第3實施例作為其它實施例加以說明。
第3圖係顯示本發明第2實施例之樹脂構件之接合方法之側面圖，第4圖係顯示第2實施例之接合方法所接合之樹脂構件之接合體之側面圖。
如第3圖所示，本第2實施例係將作為接合對象之片狀之樹脂構件10a、10b個別之端部配置成於同一平面上呈對置狀態，並對該等樹脂構件10a及10b雙方重疊另一樹脂構件(第3樹脂構件)10c，而使該第3樹脂構件10c與前述樹脂構件10a、10b之接觸面分別熔融，以進行黏合。具體而言，係在樹脂構件10a與第3樹脂構件10c之間及樹脂構件10a與第3樹脂構件10c間居中配置光吸收劑20，再對該等光吸收劑20照射雷射光50，而使各接合面上之樹脂構件熔接，以藉樹脂構件10c而接合樹脂構件10a與樹脂構件10b。
因此，本實施例中，配置成在同一平面上對置之樹脂構件10a及10b或配置於其等之上之第3樹脂構件10c中，至少任一於接合面上設有Tg或熔點在300℃以下之熱塑性樹脂即可。
另，本第2實施例中，光吸收劑20、雷射光50、載台30及加壓機構40可採用與前述第1實施例相同者。
又，第5圖係顯示本發明第3實施例之樹脂構件之雷射接合方法之側面圖，第6圖係顯示本第3實施例之雷射接合方法所接合之樹脂構件之接合體之側面圖。
如第5圖所示，本第3實施例係將作為接合對象之片狀之樹脂構件10a、10b個別之端部配置成在同一平面上對置，且對該等樹脂構件10a及10b雙方重疊發熱媒體11，而藉該發熱媒體11所供給之熱能使前述樹脂構件10a與樹脂構件10b之接觸面熔融以進行黏合，然後剝離發熱媒體11。樹脂構件10a、10b中至少任一係設有Tg或熔點在300℃以下之熱塑性樹脂者。
更具體而言，本第3實施例之雷射接合方法係於樹脂構件10a與發熱媒體11之間及樹脂構件10a與發熱媒體11之間居中配置光吸收劑20，而對前述光吸收劑20照射雷射光50，以使樹脂構件10a與樹脂構件10b之接合面上之樹脂構件熔接，而接合樹脂構件10a與樹脂構件10b。發熱媒體11於其表面塗布有光吸收劑20，而可藉光吸收劑20將所受照射之雷射光之能量轉換為熱能並加以傳導至樹脂構件，故熔接樹脂構件彼此後，將加以剝離去除。前述發熱媒體11一如第5圖所示，亦可配置成由表背兩面夾隔樹脂構件，或僅配置於表背之任一單面上。
【實施例】
以下，藉實施例進而詳細說明本發明，但本發明在不不逾越其要旨之範圍內，並不受限於以下之實施例。
(第1實施例)
第1實施例所採用之使用材料如下。
<使用材料>
‧樹脂構件A　材質　三醋酸纖維素(富士軟片公司出品，Tg170℃，熔點275℃)
厚度　80μm
形狀　10mm×50mm
‧光吸收劑A　Gentex公司出品，商品名「Clearweld LD120C」(加熱至350℃而以示差熱天平測得之重量減少量為60%)
‧雷射　波長　940nm
輸出　30W
光點　2mmψ
‧加壓構件　材質　熔融石英玻璃
厚度　10mm
‧載台　於矽氧橡膠(厚3mm)上積設聚醯亞胺(杜邦公司出品，商品名「Kapton」，厚125μm)而成
＜重量減少量之測定＞
採用示差熱天平(Thermo plus，Rigaku公司出品，TG8120系列高溫型)測定了重量減少量。測定條件如下。
‧昇溫比率　10℃/min
‧測定環境　N2
‧測定溫度　30~500℃
‧保持時間　0min
第7圖係顯示就以下實施例及比較例所使用之光吸收劑A使用上述示差熱天平而測得之重量減少量之測定結果之圖表。
<雷射接合測試>
就樹脂構件A之端部於寬10mm×長10mm之領域塗布光吸收劑A並予以乾燥，而形成厚100nm之塗布層。上述光吸收劑A之塗布層就波長940nm之雷射光之穿透率為40%。將形成有上述塗布層之樹脂構件A載置於載台上，加以重疊相同材質之其它樹脂構件A以覆蓋光吸收劑之塗布層，並由上藉加壓構件以15kgf/cm2 之壓力加以按壓。在已按壓上述加壓構件之狀態下，將上述條件之雷射光分別調節成30W與70W並以100mm/s之速度進行1線掃瞄照射，而進行樹脂構件A之雷射接合。
<測試結果>
目視觀察業經上述雷射接合測試之樹脂構件，已確認雷射光為30W及70W時均未發生樹脂之分解或碳化等，而已接合成良好狀態。
(第2實施例) <使用材料>
‧光吸收劑B　鈦菁素系染料(加熱至350℃而以示差熱天平測得重量減少量為42%)
其餘使用與第1實施例相同之材料。
＜雷射接合測試＞
對甲苯以1重量百分比之比例溶解上述光吸收劑B而製成光吸收劑溶液，並就樹脂構件A之端部於寬10mm×長10mm之領域以20mL/mm2 之塗布量塗布光吸收劑溶液，並使甲苯揮發、乾燥而形成光吸收劑之塗布層。然後，與上述第1實施例之雷射接合測試相同，進行了雷射輸出30W及70W之雷射接合。
<測試結果>
目視觀察業經上述雷射接合測試之樹脂構件，已確認雷射光為30W及70W時均未發生樹脂之分解或碳化等，而已接合成良好狀態。
(第3實施例) <使用材料>
‧樹脂構件B　材質　聚對苯二甲酸乙二酯(PET，Tg67℃，熔點243℃)
厚度　50μm
形狀　10mm×50mm
其餘使用與第1實施例相同之材料。
＜雷射接合測試＞
除使用樹脂構件B以外，其餘均同於上述第1實施例之雷射接合測試，而進行了雷射輸出30W及70W之雷射接合。
<測試結果>
目視觀察業經上述雷射接合測試之樹脂構件，已確認雷射光為30W及70W時均未發生樹脂之分解或碳化等，而已接合成良好狀態。
(第4實施例) <使用材料>
‧樹脂構件C　材質　聚碳酸酯(PC，Tg146℃，熔點253℃)
厚度　70μm
形狀　10mm×50mm
其餘使用與第1實施例相同之材料。
＜雷射接合測試＞
除使用樹脂構件C以外，其餘均同於上述第1實施例之雷射接合測試，而進行了雷射輸出30W及70W之雷射接合。
<測試結果>
目視觀察業經上述雷射接合測試之樹脂構件，已確認雷射光為30W及70W時均未發生樹脂之分解或碳化等，而已接合成良好狀態。
(第5實施例) <使用材料>
‧樹脂構件D　材質　聚乙烯醇(kuraray公司出品，無Tg，熔點210℃)
厚度　75μm
形狀　10mm×50mm
其餘使用與第1實施例相同之材料。
＜雷射接合測試＞
除使用樹脂構件D並將雷射輸出改為90W，其餘均同於上述第1實施例之雷射接合測試，而進行了雷射接合。
<測試結果>
目視觀察業經上述雷射接合測試之樹脂構件，已確認未發生樹脂之分解或碳化等，而已接合成良好狀態。
(第1比較例) <使用材料>
‧光吸收劑C　山本化成公司出品，商品名「YKR」(加熱至350℃而以示差熱天平測得重量減少量為30%)
除使用上述光吸收劑以外，其餘使用與第1實施例相同之材料。
＜雷射接合測試＞
除使用上述光吸收劑C作為光吸收劑以外，其餘均同於上述第1實施例，而實施了雷射輸出30W及70W之雷射接合測試。
<測試結果>
目視觀察業經上述雷射接合測試之樹脂構件，已確認雷射光為30W時，已達成樹脂構件未發生分解、碳化等之良好接合。然而，雷射光為70W時，於雷射照射部零星散存已變色成黑色之部分，且接合體發出燒焦之臭味。因此，已確認上述測試中，因雷射過度照射而發生了樹脂構件之碳化。
(第2比較例) <使用材料>
‧光吸收劑D　對樹脂混合含有次甲基系油溶性染料之著色劑而製成之墨水型(ORIENT化學工業公司出品，商品名「eBIND ink」，加熱至350℃而以示差熱天平測得重量減少量為37%)
除使用上述光吸收劑以外，其餘使用與第1實施例相同之材料。
＜雷射接合測試＞
除使用上述光吸收劑D作為光吸收劑以外，其餘均同於上述第1實施例，而實施了雷射輸出30W及70W之雷射接合測試。
<測試結果>
目視觀察業經上述雷射接合測試之樹脂構件，已確認雷射光為30W時，已達成樹脂構件未發生分解、碳化等之良好接合。然而，雷射光為70W時，於雷射照射部零星散存已變色成黑色之部分，且接合體發出燒焦之臭味。因此，已確認上述測試中，與第1比較例相同，因雷射過度照射而發生了樹脂構件之碳化。
(第3比較例) <使用材料>
‧樹脂構件E　材質　熱塑性聚醯亞胺(Tg：315℃)
厚度　50μm
形狀　10mm×50mm
除使用上述樹脂構件以外，其餘使用與第1實施例相同之材料。
＜雷射接合測試＞
除使用上述樹脂構件E作為樹脂構件，並將雷射輸出改為90W以外，其餘均同於上述第1實施例，而實施了雷射接合測試。
<測試結果>
上述雷射接合測試之結果乃無法接合樹脂構件。此可推論乃因樹脂構件E係高耐熱性之熱塑性聚醯亞胺，而無法獲致足以使其熔融之熱量之故。
(第4比較例) <使用材料>
‧樹脂構件E(同上)
‧光吸收劑D(同上)
除使用上述樹脂構件E及光吸收劑D以外，其餘使用與第1實施例相同之材料。
＜雷射接合測試＞
除使用上述樹脂構件E作為樹脂構件，並使用上述光吸收劑D作為光吸收劑，進而將雷射輸出改為70W以外，其餘均同於第1實施例，而實施了雷射接合測試。
<測試結果>
上述雷射接合測試之結果，已確認可接合高耐熱性之熱塑性聚醯亞胺。然而，目視觀察樹脂構件後，則確認於雷射照射部零星散存已變色成黑色之部分。因此，已確認上述測試中，因雷射過度照射而發生了樹脂構件之碳化。
10a、10b．．．樹脂構件
10c．．．第3樹脂構件
11．．．發熱媒體
20．．．光吸收劑
30．．．載台
40．．．加壓機構
50．．．雷射光
第1圖係顯示第1實施例之樹脂構件之雷射接合方法之側面圖。
第2圖係顯示第1實施例之雷射接合方法所接合之樹脂構件之接合體之側面圖。
第3圖係顯示第2實施例之樹脂構件之雷射接合方法之側面圖。
第4圖係顯示第2實施例之雷射接合方法所接合之樹脂構件之接合體之側面圖。
第5圖係顯示第3實施例之樹脂構件之雷射接合方法之側面圖。
第6圖係顯示第3實施例之雷射接合方法所接合之樹脂構件之接合體之側面圖。
第7圖係顯示就實施例及比較例所使用之光吸收劑使用示差熱天平而測得之重量減少量之測定結果之圖表。
10a、10b．．．樹脂構件
20．．．光吸收劑
30．．．載台
40．．．加壓機構
50．．．雷射光

Claims (2)

  1. 一種樹脂構件之雷射接合方法，係使2個以上之樹脂構件接觸，並對其接觸面附近所配置之光吸收劑照射雷射光而熔接接合樹脂構件，其特徵在於：前述樹脂構件之至少任一係具有300℃以下之玻璃轉化溫度或熔點之熱塑性樹脂，前述光吸收劑係使用示差熱天平(differential thermobalance)測定加熱至350℃之重量減少量為40%以上者；於前述接合，係將前述樹脂構件之端部彼此配置成在同一平面上對置，並以重疊該等樹脂構件雙方的方式疊合發熱媒體，且配置光吸收劑使其介於前述樹脂構件與前述發熱媒體之間，對該光吸收劑照射雷射光而使前述樹脂構件彼此熔接，並在該熔接後剝離去除前述發熱媒體。
  2. 一種樹脂構件之雷射接合體，係由2個以上之樹脂構件相接觸，並對其接觸面附近所配置之光吸收劑照射雷射光而熔接接合樹脂構件彼此而成，其特徵在於：前述樹脂構件之至少任一係具有300℃以下之玻璃轉化溫度或熔點之熱塑性樹脂，前述光吸收劑係使用示差熱天平測定加熱至350℃之重量減少量為40%以上者；於前述接合，係將前述樹脂構件之端部彼此配置成在同一平面上對置，並以重疊該等樹脂構件雙方的方式疊合發熱媒體，且配置光吸收劑使其介於前述樹脂構件與前述發熱媒體之間，對該光吸收劑照射雷射光而使前 述樹脂構件彼此熔接，並在該熔接後剝離去除前述發熱媒體。
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