TWI477710B - - Google Patents

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Publication number
TWI477710B
TWI477710B TW101113840A TW101113840A TWI477710B TW I477710 B TWI477710 B TW I477710B TW 101113840 A TW101113840 A TW 101113840A TW 101113840 A TW101113840 A TW 101113840A TW I477710 B TWI477710 B TW I477710B
Authority
TW
Taiwan
Application number
TW101113840A
Other languages
Chinese (zh)
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TW201344093A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101113840A priority Critical patent/TW201344093A/zh
Publication of TW201344093A publication Critical patent/TW201344093A/zh
Application granted granted Critical
Publication of TWI477710B publication Critical patent/TWI477710B/zh

Links

TW101113840A 2012-04-18 2012-04-18 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置 TW201344093A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101113840A TW201344093A (zh) 2012-04-18 2012-04-18 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101113840A TW201344093A (zh) 2012-04-18 2012-04-18 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置

Publications (2)

Publication Number Publication Date
TW201344093A TW201344093A (zh) 2013-11-01
TWI477710B true TWI477710B (enrdf_load_stackoverflow) 2015-03-21

Family

ID=49990131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101113840A TW201344093A (zh) 2012-04-18 2012-04-18 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置

Country Status (1)

Country Link
TW (1) TW201344093A (enrdf_load_stackoverflow)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020130676A1 (en) * 1996-09-13 2002-09-19 Brian Samuel Beaman Integrated compliant probe for wafer level test and burn-in
US20030232460A1 (en) * 2002-06-18 2003-12-18 Poo Chia Yong Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
US20040222433A1 (en) * 2003-05-05 2004-11-11 Lamina Ceramics Light emitting diodes packaged for high temperature operation
TW200636966A (en) * 2005-04-08 2006-10-16 Micron Technology Inc Method and system for fabricating semiconductor components with through wire interconnects
TW200739838A (en) * 2006-01-23 2007-10-16 Tessera Tech Hungary Kft Wafer level chip packaging
JP2009135440A (ja) * 2007-11-30 2009-06-18 Tysun Inc 散熱機能を有する発光デバイスとそのようなデバイスを製造するプロセス
TW201037813A (en) * 2009-04-08 2010-10-16 Aussmak Optoelectronic Corp Light emitting apparatus
TWM393807U (en) * 2010-07-30 2010-12-01 Hsin Sun Engineering Co Ltd Light source module for direct heat conduction
CN102032475A (zh) * 2009-08-23 2011-04-27 彭云滔 一种组合式大功率led灯
CN102262844A (zh) * 2011-08-03 2011-11-30 石家庄市京华电子实业有限公司 一种铝基集成式户外全彩三合一led显示屏及其制作方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020130676A1 (en) * 1996-09-13 2002-09-19 Brian Samuel Beaman Integrated compliant probe for wafer level test and burn-in
US20030232460A1 (en) * 2002-06-18 2003-12-18 Poo Chia Yong Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
US20040222433A1 (en) * 2003-05-05 2004-11-11 Lamina Ceramics Light emitting diodes packaged for high temperature operation
TW200636966A (en) * 2005-04-08 2006-10-16 Micron Technology Inc Method and system for fabricating semiconductor components with through wire interconnects
TW200739838A (en) * 2006-01-23 2007-10-16 Tessera Tech Hungary Kft Wafer level chip packaging
JP2009135440A (ja) * 2007-11-30 2009-06-18 Tysun Inc 散熱機能を有する発光デバイスとそのようなデバイスを製造するプロセス
TW201037813A (en) * 2009-04-08 2010-10-16 Aussmak Optoelectronic Corp Light emitting apparatus
CN102032475A (zh) * 2009-08-23 2011-04-27 彭云滔 一种组合式大功率led灯
TWM393807U (en) * 2010-07-30 2010-12-01 Hsin Sun Engineering Co Ltd Light source module for direct heat conduction
CN102262844A (zh) * 2011-08-03 2011-11-30 石家庄市京华电子实业有限公司 一种铝基集成式户外全彩三合一led显示屏及其制作方法

Also Published As

Publication number Publication date
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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees