TW201344093A - 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置 - Google Patents
一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置 Download PDFInfo
- Publication number
- TW201344093A TW201344093A TW101113840A TW101113840A TW201344093A TW 201344093 A TW201344093 A TW 201344093A TW 101113840 A TW101113840 A TW 101113840A TW 101113840 A TW101113840 A TW 101113840A TW 201344093 A TW201344093 A TW 201344093A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- integrated multi
- layer
- light
- front surface
- Prior art date
Links
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 59
- 238000005286 illumination Methods 0.000 claims description 28
- 230000005540 biological transmission Effects 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101113840A TW201344093A (zh) | 2012-04-18 | 2012-04-18 | 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101113840A TW201344093A (zh) | 2012-04-18 | 2012-04-18 | 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201344093A true TW201344093A (zh) | 2013-11-01 |
| TWI477710B TWI477710B (enrdf_load_stackoverflow) | 2015-03-21 |
Family
ID=49990131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101113840A TW201344093A (zh) | 2012-04-18 | 2012-04-18 | 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201344093A (enrdf_load_stackoverflow) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0925510B1 (en) * | 1996-09-13 | 2007-04-11 | International Business Machines Corporation | Integrated compliant probe for wafer level test and burn-in |
| SG111069A1 (en) * | 2002-06-18 | 2005-05-30 | Micron Technology Inc | Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods |
| US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
| US7371676B2 (en) * | 2005-04-08 | 2008-05-13 | Micron Technology, Inc. | Method for fabricating semiconductor components with through wire interconnects |
| US7936062B2 (en) * | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
| TW200923262A (en) * | 2007-11-30 | 2009-06-01 | Tysun Inc | High heat dissipation optic module for light emitting diode and its manufacturing method |
| TW201037813A (en) * | 2009-04-08 | 2010-10-16 | Aussmak Optoelectronic Corp | Light emitting apparatus |
| CN102032475A (zh) * | 2009-08-23 | 2011-04-27 | 彭云滔 | 一种组合式大功率led灯 |
| TWM393807U (en) * | 2010-07-30 | 2010-12-01 | Hsin Sun Engineering Co Ltd | Light source module for direct heat conduction |
| CN102262844B (zh) * | 2011-08-03 | 2013-08-14 | 石家庄市京华电子实业有限公司 | 一种铝基集成式户外全彩三合一led显示屏及其制作方法 |
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2012
- 2012-04-18 TW TW101113840A patent/TW201344093A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI477710B (enrdf_load_stackoverflow) | 2015-03-21 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |