TWI475757B - Offset-type board-to-board connector - Google Patents

Description

Offset wire-to-board connector

The present invention relates to an offset type wire to board connector, and more particularly to a header assembly or assembly (splicing) housing, since it is horizontally The structure of the head assembly cover enables a biased wire-to-board connector such as a thinned electronic product such as a light-emitting diode television (LED TV).

A wire-to-board connector is generally used as a connector for connecting electric wires and printed circuit boards of electric and electronic devices, and is widely used as a desktop computer, a notebook, a television (TV), etc. as a liquid crystal display device. .

A conventional wire-to-board connector includes a head that is supported by being inserted into a through hole of a substrate, and is fixed by being soldered to the substrate by a fitting nail provided on both sides, and a cover insertion groove is formed at a lower portion; a connection terminal is provided to be inserted into the head portion, and is electrically connected to a pattern on the substrate; and a cover is coupled in a manner of inserting the cover into the groove from a lower portion of the substrate toward an upper portion a plurality of crimping terminal insertion slots are formed in the middle to form a tension lock on both sides; a crimp terminal (Crimp Terminal) is connected to the electric wire and inserted into the crimping terminal insertion slot to be electrically connected to the connecting terminal .

However, in the conventional wire-to-board connector, when the cover is assembled in the head, since the cover is combined with the head from the lower portion of the substrate toward the upper portion, the height of the cover and the height and assembly of the wires are considered. Since the space needs to be sufficiently assembled from the lower side of the substrate, it is limited in use in products such as a light-emitting diode television using an ultra-small, ultra-thin film panel.

In order to solve the above problems, it is an object of the present invention to provide an offset type wire-to-board connector in which, in the case of the above-described offset type wire-to-board connector, when the head is joined (spliced), it is horizontally Since the structure of the outer cover is assembled in the direction of the head, it is possible to very effectively apply a product which requires an ultra-small, ultra-thin film panel such as a light-emitting diode television set by securing an assembly space.

In order to achieve the above object, an offset type wire-to-board connector of the present invention includes a head portion that is supported in a through hole inserted into a substrate, and is soldered to the mounting tabs provided on both sides of the upper portion of the head portion. On the substrate, a front cover insertion groove is formed on a front surface of the head, and a locking locking portion is formed on an inner wall of both sides of the outer cover insertion groove; and a connection terminal is disposed on the substrate and inserted on the substrate The circuit pattern is electrically connected; the outer cover is moved along the front direction of the head to be inserted into the outer cover insertion groove, and a plurality of crimping terminal insertion grooves are formed in the middle of the outer cover, and are formed on both sides The tension lock combined with the lock lock portion and the tension arm formed with the unlocking protrusion; and the crimp terminal connected to the electric wire and inserted into the crimp terminal insertion groove to be The connection terminals are electrically connected.

A head diaphragm having a long hole is formed in the longitudinal direction of the outer cover insertion groove, and an insertion hole into which the head diaphragm is inserted and a rib inserted into the long hole are formed in the center of the front surface of the outer cover.

A mounting blade fixing groove for fixing the above-mentioned mounting tab is formed on both upper side surfaces of the head portion, and the mounting blade fixing groove is formed in a U-shape.

A protruding inclined surface is formed on both side surfaces of the front surface of the outer cover, and an inclined support locking portion that is in contact with the protruding inclined surface is formed on an inner wall surface of the outer cover insertion groove.

A projection portion and a vent hole for securing a maximum weld interval are formed on one side of the above-mentioned assembly tab, and an anti-warpage projection and a guide inclined surface are formed on the other side of the above-mentioned assembly tab.

As described above, when the head is joined (spliced) to the outer cover, since the assembly space is secured, it is possible to very effectively apply a product requiring an ultra-small, ultra-thin film panel such as a light-emitting diode television.

Further, the present invention can secure the maximum welding interval by assembling the protruding portion of the blade and the vent hole, and has an effect of preventing the tilting of the head and guiding by the anti-warping protrusion of the mounting tab and the guiding inclined surface.

Further, according to the present invention, since the inclined support locking portion formed on the inner wall surface of the outer cover insertion groove is in contact with the protruding inclined surface of the outer cover, the locking/unlocking can be performed in a compact size space, at the time of joining (splicing) The guiding effect, combined with the effect of minimizing movement (sloshing), enables a very stable bonding force to be maintained.

Further, the present invention forms the head diaphragm and inserts the rib of the outer cover into the long hole, thereby having the effect of ensuring the withstand voltage by the insulation distance, and has the effect of guiding stabilization at the time of joining (when splicing) and preventing shrinkage at the time of injection molding.

100‧‧‧Offset wire-to-board connector

110‧‧‧ head

110a‧‧‧Protruding

110b‧‧‧Protruding

111‧‧‧The cover is inserted into the slot

111a‧‧‧ head diaphragm

111b‧‧‧ long hole

111c‧‧‧Tilt support locking

112‧‧‧Locking the locking part

113‧‧‧Assembly insert fixing groove

120‧‧‧Connecting terminal

130‧‧‧ Cover

131‧‧‧Crimp terminal insertion slot

133‧‧‧ Tension lock

134‧‧‧ protruding slope

135‧‧‧Unlocking protrusions

136‧‧‧ insertion hole

137‧‧‧ stiffeners

138‧‧‧ Tension arm

140‧‧‧Crimping terminal

150‧‧‧Assembly inserts

150A‧‧‧Part 1

150B‧‧‧Part II

151‧‧‧Protruding

152‧‧‧ventilation holes

153‧‧‧Anti-warping protrusion

154‧‧‧Guided inclined surface

20‧‧‧Substrate

21‧‧‧through holes

22‧‧‧ circuit pattern

C‧‧‧ Chassis

S‧‧ slit

W‧‧‧Wire

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the combination of an offset type wire-to-board connector of a preferred embodiment of the present invention.

2 is an exploded perspective view showing a biased wire-to-board connector in accordance with a preferred embodiment of the present invention.

Figure 3 is a side view of Figure 1.

Fig. 4 is a cross-sectional view taken along line I-I of Fig. 3;

Fig. 5 is a sectional view taken along line II-II of Fig. 3;

Fig. 6 is a perspective view showing the head of the present invention.

Fig. 7 is a front view of Fig. 6.

Figure 8 is a rear elevational view of Figure 6.

Figure 9 is a plan view of Figure 6.

Figure 10 is a bottom view of Figure 6.

Fig. 11 is a perspective view showing the outer cover of the present invention.

Figure 12 is a front elevational view of Figure 11 .

Figure 13 is a rear elevational view of Figure 11.

Figure 14 is a plan view of Figure 11 .

Figure 15 is a bottom view of Figure 11 .

Figure 16 is a perspective view showing the mounting tab of the present invention.

Hereinafter, an offset type wire-to-board connector of a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a combination of a biased wire-to-board connector of a preferred embodiment of the present invention, and FIG. 2 is an exploded perspective view showing a biased wire-to-board connector of a preferred embodiment of the present invention, and FIG. 1 is a cross-sectional view taken along line II of FIG. 3, FIG. 5 is a cross-sectional view taken along line II-II of FIG. 3, FIG. 6 is a perspective view showing the head of the present invention, and FIG. 7 is a front view of FIG. 6 is a top view of FIG. 6, FIG. 10 is a bottom view of FIG. 6, FIG. 11 is a perspective view showing the outer cover of the present invention, FIG. 12 is a front view of FIG. 11, and FIG. FIG. 14 is a plan view of FIG. 11, FIG. 15 is a bottom view of FIG. 11, and FIG. 16 is a perspective view showing the mounting tab of the present invention.

Referring to FIGS. 1 through 16, a biased wire-to-board connector 100 of a preferred embodiment of the present invention includes a head 110 that is supported in a manner inserted into a through hole 21 of a substrate 20; a cover 130 along which The front head 110 is moved in the front direction and joined in such a manner as to be inserted into the outer cover insertion groove 111.

For reference, in the description of the present invention, the vertical and horizontal directions are described with reference to the drawings on the drawings, but it is a matter of course that they can be expressed differently depending on the direction of observation.

The head portion 110 is moved downward from the upper portion of the substrate 20 in the drawing to be inserted into the through hole 21, and is maintained in a biased state with respect to the plane of the substrate 20. Here, the end formed at the end of the head 110 is maintained. The protruding portions 110a and 110b are supported on the upper surface of the substrate 20.

In the drawing, the head portion 110 is formed with a cover insertion groove 111 on the front surface thereof. After the head portion 110 is attached to the substrate 20, the cover insertion groove 111 is maintained in a state in which the lower portion of the substrate 20 is opened. Further, a locking locking portion 112 is formed on the inner walls of both sides of the above-described outer cover insertion groove 111.

A head diaphragm 111a having a long hole 111b is formed in the longitudinal direction in the middle of the above-described outer cover insertion groove 111.

A connection terminal 120 is inserted into the slit S formed in the upper portion of the head portion 110, and one end of the connection terminal 120 is electrically connected to the circuit pattern 22 on the substrate 20, and the other end of the connection terminal 120 is crimped to be described later. The terminal 140 is electrically connected to the inside of the housing insertion groove 111.

The head portion 110 has, on both sides of the upper portion, a mounting tab fixing groove 113 for fixing the mounting tab 150, and the mounting tab fixing groove 113 is formed in a U-shape.

The mounting tab 150 is composed of a first portion 150A which is formed in a U-shape and is coupled to the mounting blade fixing groove 113, and a second portion 150B which is extended from the first portion 150A.

A protrusion 151 and a vent hole 152 for securing a maximum weld interval are formed on one side of the second portion 150B of the above-described assembly tab 150, and the above-described assembly plug is formed on the other side of the second portion 150B of the above-described assembly tab 150. The anti-warping protrusion 153 of the sheet 150 and the guiding inclined surface 154.

The guiding inclined surface 154 serves as a guiding action when the mounting tab 150 is inserted into the mounting blade fixing groove 113, and the above-mentioned anti-warpage prevention The 153 functions to firmly bond the above-described mounting tab 150 to the mounting tab fixing groove 113 to prevent the above-described mounting tab 150 from being shaken or lifted.

The outer cover 130 is moved in the front direction of the head portion 110 as shown by the arrow, and is coupled to be inserted into the outer cover insertion groove 111.

A plurality of crimp terminal insertion grooves 131 are formed in the middle of the outer cover 130 at predetermined intervals.

A crimp terminal 140 that is connected to the electric wire W and electrically connected to the connection terminal 120 can be inserted into the crimp terminal insertion groove 131.

An insertion hole 136 into which the head diaphragm 111a is inserted and a reinforcing rib 137 inserted into the long hole 111b are formed in the center of the front surface of the outer cover 130.

Tension arms 138 are formed on both sides of the outer cover 130, and the tension arms 138 have the tension locks 133 and the unlocking projections 135 coupled to the lock locking portions 112.

A protruding inclined surface 134 is formed on both side surfaces of the front surface of the outer cover 130, and a tilt supporting locking portion 111c that is in contact with the inner wall surface of the outer cover insertion groove 111 may be formed corresponding to the protruding inclined surface 134.

Reference numeral C, not shown in the same drawing, denotes a chassis on which the product of the offset wire-to-board connector is mounted.

The operation of the offset type wire-to-board connector 100 of the preferred embodiment of the present invention thus constructed will be described as follows.

As shown in FIG. 2, the head 110 is moved downward from above and inserted into the through hole 21 of the substrate 20.

The protruding portions 110a and 110b formed at the end of the head portion 110 are supported by the substrate 20 to maintain the head 110 in a biased state with respect to the plane of the substrate 20.

In the drawing, the head portion 110 is formed with a cover insertion groove 111 on the front surface thereof. After the head portion 110 is attached to the substrate 20, the cover insertion groove 111 is maintained in a state in which the lower portion of the substrate is opened.

A connection terminal 120 is inserted into the slit S of the head portion 110, and one end of the connection terminal 120 is electrically connected to the circuit pattern 22 on the substrate, and the other end of the connection terminal 120 is electrically connected to the crimp terminal 140.

The above-described mounting tab 150 is inserted into the mounting tab fixing groove 113 to be joined, and soldered to be fixed to the substrate 20. Here, the maximum weld interval can be ensured by the projection 151 and the vent hole 152 formed in the second portion 150B of the above-described assembly tab 150, through the above-described assembly tab 150 formed on the second portion 150A of the above-described assembly tab 150. The anti-warping protrusion 153 and the guiding inclined surface 154 prevent the above-described head 110 from being lifted and guided.

The crimp terminal insertion groove 131 formed in the middle of the outer cover 130 is maintained in a state in which the crimp terminal 140 connected to the electric wire is inserted and coupled.

Thereafter, the outer cover 130 is moved in the front direction of the head portion 110 to be inserted into and coupled to the outer cover insertion groove 111.

One end of the connection terminal 120 inserted into the slit S of the head portion 110 is electrically connected to the circuit pattern 22 on the substrate 20, and the connection end The other end of the sub-120 is electrically connected to the crimp terminal 140.

At the same time, the tension arm 138 of the outer cover 130 is elastically deformed, and the tension lock 133 is locked by the locking locking portion 112 formed on the inner walls of both sides of the outer cover insertion groove 111.

Further, since the inclined support locking portion 111c formed on the inner wall surface of the outer cover insertion groove 111 is in contact with the protruding inclined surface 134 of the outer cover 130, the locking/unlocking can be performed in a compact size space, when combined ( When splicing, it plays a guiding role, and after combining, it has the effect of minimizing movement (sloshing), thereby maintaining a very stable bonding force.

Further, since the ribs 137 of the outer cover 130 are inserted into the long hole 111b of the head diaphragm 111a and the head diaphragm 111a, the voltage reinforced effect by the insulation distance is ensured, and the bonding is performed at the time of bonding (splicing). Stabilization and shrinkage prevention during injection molding.

When the outer cover 130 is to be separated from the head portion 110, when the tension arm 138 is pressed, the tension arm 138 is elastically deformed. At this time, when the tension lock 133 is separated from the lock locking portion 112 and unlocked, the outer cover 130 is removed. Retreating, the outer cover 130 can be separated from the head 110.

As described above, in the present invention, when the head is joined (spliced) to the outer cover, since the assembly space is secured, it is possible to very usefully apply a product such as a light-emitting diode television or the like which requires an ultra-small, ultra-thin film panel.

Further, the present invention can secure the maximum welding interval by fitting the projections of the insert and the vent hole, and has an effect of preventing the tilting of the head and guiding by the anti-warping protrusion of the fitting tab and the guiding inclined surface.

Further, according to the present invention, since the inclined support locking portion formed on the inner wall surface of the outer cover insertion groove is in contact with the protruding inclined surface of the outer cover, the locking/unlocking can be performed in a compact size space, at the time of joining (splicing) The guiding effect, combined with the effect of minimizing movement (sloshing), enables a very stable bonding force to be maintained.

Further, the present invention forms the head diaphragm and inserts the rib of the outer cover into the long hole, thereby having the effect of ensuring the withstand voltage by the insulation distance, and has the effect of guiding stabilization at the time of joining (splicing) and preventing shrinkage during injection molding. .

100‧‧‧Offset wire-to-board connector

110‧‧‧ head

111‧‧‧The cover is inserted into the slot

113‧‧‧Assembly insert fixing groove

120‧‧‧Connecting terminal

130‧‧‧ Cover

138‧‧‧ Tension arm

140‧‧‧Crimping terminal

150‧‧‧Assembly inserts

20‧‧‧Substrate

21‧‧‧through holes

22‧‧‧ circuit pattern

W‧‧‧Wire

Claims (5)

An offset type wire-to-board connector comprising: a head portion supported by being inserted into a through hole of a substrate, and being mounted on the substrate by a mounting tab provided on both sides of an upper portion of the head portion, a cover insertion groove is formed on a front surface of the head, and a locking locking portion is formed on an inner wall of both sides of the cover insertion groove; a connection terminal is disposed to be inserted into the head and electrically connected to the circuit pattern on the substrate The outer cover is moved along the front direction of the head, and is coupled to be inserted into the inside of the outer cover insertion groove. A plurality of crimping terminal insertion grooves are formed in the middle of the outer cover, and the locking card is formed on both sides. a tension lock combined with a stopper and a tension arm formed with an unlocking projection; and a crimp terminal connected to the electric wire and inserted into the inside of the crimp terminal insertion groove to be electrically connected to the connection terminal. The offset type wire-to-board connector according to claim 1, wherein a head diaphragm having a long hole is formed in a longitudinal direction in the middle of the outer cover insertion groove; and a head diaphragm insertion is formed in a front center of the outer cover The insertion hole and the rib inserted into the long hole. The offset type wire-to-board connector of claim 1 or 2, wherein a mounting blade fixing groove for fixing the mounting blade is formed on an upper side of the head; the mounting blade fixing groove is U The glyph is curved. The offset type wire-to-board connector according to claim 1 or 2, wherein a protruding inclined surface is formed on both front sides of the outer cover, and an inclined surface is formed on the inner wall surface of the outer cover insertion groove. Correspondingly The inclined contact supports the locking portion. The offset type wire-to-board connector according to claim 1 or 2, wherein a protrusion and a vent hole for securing a maximum welding interval are formed on one side of the above-mentioned mounting tab, on the other side of the above-mentioned mounting tab An anti-warping protrusion and a guiding inclined surface are formed.