TWI474502B - Light emitting diode package structure and method for manufacturing the same - Google Patents
Light emitting diode package structure and method for manufacturing the same Download PDFInfo
- Publication number
- TWI474502B TWI474502B TW98110471A TW98110471A TWI474502B TW I474502 B TWI474502 B TW I474502B TW 98110471 A TW98110471 A TW 98110471A TW 98110471 A TW98110471 A TW 98110471A TW I474502 B TWI474502 B TW I474502B
- Authority
- TW
- Taiwan
- Prior art keywords
- emitting diode
- light
- transparent body
- cup
- package structure
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 38
- 239000000843 powder Substances 0.000 claims description 37
- 238000006243 chemical reaction Methods 0.000 claims description 32
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 150000002736 metal compounds Chemical class 0.000 claims description 4
- 239000011368 organic material Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims 2
- 238000002834 transmittance Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 125000001475 halogen functional group Chemical group 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001652 electrophoretic deposition Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Led Device Packages (AREA)
Description
本發明係有關一種發光二極體封裝結構與其製作方法，尤其是一種使用一透明材料之發光二極體封裝結構與其製作方法，其藉由定義杯狀結構之透明體，可藉此改變螢光粉轉化層塗佈厚度，使螢光粉厚度有差異化，讓大角度出光減少經過的螢光粉轉化層，改善封裝體出光不均勻之問題。The invention relates to a light emitting diode package structure and a manufacturing method thereof, in particular to a light emitting diode package structure using a transparent material and a manufacturing method thereof, which can change the fluorescent light by defining a transparent body of a cup structure The thickness of the powder conversion layer is coated to make the thickness of the phosphor powder different, so that the large-angle light output reduces the passing phosphor powder conversion layer, and the problem of uneven light emission of the package is improved.
在二極體封裝的領域中，傳統封裝體(slurry package)1係將螢光粉與膠體依特定比例混合後所形成之混合物11直接塗佈於發光二極體晶片12上並填滿碗杯13，如第一圖所示。這種螢光粉塗佈方法簡單，因此有許多封裝體採用此種封裝結構。然而，在第一圖中，由於晶片發光後，出光路徑14不同，經由螢光粉轉化後，會有色溫高低分布不均勻的現象，形成黃光於碗杯外圍，造成所謂黃暈現象。因為黃暈現象會使得發光二極體出光顏色不均勻，尤其在需要光源均勻的應用產品上，如發光二極體手術燈，其均勻度需要考量，否則造成組織的判斷誤差，開刀時會造程無法評估的問題。目前使用傳統光源的醫療用手術燈因為使用鹵素燈而有紫外光波段的光及輻射熱，會對患者的患部產生不良的影響，因此醫療產業的廠商欲使用冷光的發光二極體作為燈具光源。但目前市售的發光二極體有嚴重的黃圈問題，應用於手術燈上會有顏色不均勻的情況。In the field of diode package, a conventional package 1 is a mixture 11 of a phosphor powder and a colloid mixed in a specific ratio, and is directly coated on the LED chip 12 and filled with a cup. 13, as shown in the first figure. This method of coating a phosphor powder is simple, and thus many packages have such a package structure. However, in the first figure, since the light-emitting path 14 is different after the light is emitted from the wafer, after the conversion of the phosphor powder, there is a phenomenon in which the color temperature is unevenly distributed, and yellow light is formed on the periphery of the cup, causing a so-called yellow halo phenomenon. Because the yellow halo phenomenon will make the color of the light emitting diodes uneven, especially in applications that require uniform light source, such as light-emitting diode surgical lamps, the uniformity needs to be considered, otherwise the judgment error of the tissue will be caused. The problem that the process cannot evaluate. At present, medical surgical lamps using conventional light sources have a light-wavelength and radiant heat in the ultraviolet light band, which adversely affects the affected part of the patient. Therefore, manufacturers in the medical industry want to use cold-lighted light-emitting diodes as light sources for lamps. However, currently available light-emitting diodes have serious yellow circle problems, and there are cases where the color is uneven on the surgical lamp.
因此，有人研發出保角塗佈(conformal coating)封裝技術，其在晶片22外圍製作等厚度之螢光粉轉化層21，讓藍光經過相同距離的螢光粉，如此即可得到同樣色溫的光線，如第二圖所示。但是保角塗佈技術在二次光學元件投射下有晶粒成像的問題，此問題於醫療照明用途時會不符合縱深之法規，其原因即在非成像平面之光型破碎。Therefore, a conformal coating packaging technology has been developed which produces a phosphor powder conversion layer 21 of the same thickness on the periphery of the wafer 22, allowing the blue light to pass through the same distance of phosphor powder, so that the same color temperature can be obtained. As shown in the second figure. However, conformal coating technology has the problem of grain imaging under the projection of secondary optical components. This problem does not comply with the regulations of depth in medical lighting applications, which is caused by light-type fracture in non-imaging planes.
HP於美國專利US5,959,316“Multiple encapsulation of phosphor-LED devices”中，提出在晶片32周圍製作出一層等厚度之螢光粉轉化層31，如第三圖所示。理論上讓晶片32所發出的光經過等厚度的螢光粉轉化層31，其出光均勻性會較第一圖所示之傳統封裝體為佳，但是其製程不容易，在實施上有一定的難度。In U.S. Patent No. 5,959,316, "Multiple encapsulation of phosphor-LED devices", it is proposed to produce a phosphor powder conversion layer 31 of equal thickness around the wafer 32, as shown in the third figure. Theoretically, the light emitted by the wafer 32 passes through the phosphor powder conversion layer 31 of equal thickness, and the uniformity of light emission is better than that of the conventional package shown in the first figure, but the process is not easy, and there is a certain implementation. Difficulty.
此外，雖然有許多方式改善均勻度，但考慮到光型及均勻度議題時，往往製程困難或光型達不到要求，如Lumileds於美國專利US6,650,040中使用網版印刷或電泳沉積，但光型不對；AVAGO Technologies於美國專利US7,129,638中利用螢光粉沉降關係，形成一均勻厚度的螢光粉轉化層，然而其製程相當困難。In addition, although there are many ways to improve the uniformity, in view of the problem of light type and uniformity, the process is difficult or the light type is not required. For example, Lumileds uses screen printing or electrophoretic deposition in US Pat. No. 6,650,040. The light type is not correct; AVAGO Technologies uses the phosphor powder deposition relationship in U.S. Patent No. 7,129,638 to form a phosphor powder conversion layer of uniform thickness, however, the process is quite difficult.
此外，Hsing Chen於美國專利公開申請案US20080121922中，在晶片周圍以鑄模方式製作一透明體，並且在該透明體中填充螢光粉，增加出光角度。GELcore於美國專利公開申請案US6,917,057中，在支架表面於晶片周圍製作不高於晶片高度之透明體。上述兩者提出之封裝架構皆沒辦法改善色溫均勻度。基於上述問題，本發明提出一種發光二極體封裝結構，以改善傳統封裝結構中色溫分布不均勻之現象，並解決保角塗佈技術之晶粒成像問題。In addition, in U.S. Patent Application Publication No. US20080121922, a transparent body is formed around the wafer by molding, and the transparent body is filled with phosphor powder to increase the light exit angle. In U.S. Patent No. 6,917,057, the disclosure of the entire disclosure of the entire disclosure of the entire disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the present disclosure. There is no way to improve the color temperature uniformity of the package architecture proposed by the above two. Based on the above problems, the present invention provides a light emitting diode package structure to improve the uneven color temperature distribution in the conventional package structure and solve the grain imaging problem of the conformal coating technology.
本發明之一目的在於提供一種發光二極體封裝結構與其製作方法，以改善傳統封裝結構中色溫分布不均勻之現象。An object of the present invention is to provide a light emitting diode package structure and a manufacturing method thereof to improve the uneven color temperature distribution in a conventional package structure.
本發明之另一目的在於提供一種發光二極體封裝結構與其製作方法，以解決保角塗佈技術之晶粒成像問題。Another object of the present invention is to provide a light emitting diode package structure and a manufacturing method thereof to solve the problem of grain imaging of the conformal coating technology.
為了達成上述之目的，本發明提供一種發光二極體封裝結構，其係包括：一杯狀支架；至少一發光二極體晶片，其係裝設於該杯狀支架內；至少一透明體，其係裝設於該杯狀支架之內壁上並且圍繞該發光二極體晶片；以及至少一螢光粉轉化層，其係填充於該杯狀支架內，以覆蓋該發光二極體晶片與該透明體；其中該透明體之高度大於該發光二極體晶片之高度，並且不大於該杯狀結構之深度，而且該透明體並未覆蓋該發光二極體晶片。In order to achieve the above object, the present invention provides a light emitting diode package structure comprising: a cup-shaped holder; at least one light emitting diode chip mounted in the cup holder; at least one transparent body, Mounting on the inner wall of the cup holder and surrounding the light emitting diode wafer; and at least one phosphor conversion layer filled in the cup holder to cover the light emitting diode wafer and the a transparent body; wherein the height of the transparent body is greater than a height of the light emitting diode chip and not greater than a depth of the cup structure, and the transparent body does not cover the light emitting diode chip.
在另一實施例中，本發明更提供一種發光二極體封裝結構之製作方法，包括以下步驟：提供一杯狀支架；裝設至少一發光二極體晶片於該杯狀支架內；形成至少一透明體，其係裝設於該杯狀支架之內壁上並且圍繞該發光二極體晶片；以及填充至少一螢光粉轉化層於該杯狀支架內，以覆蓋該發光二極體晶片與該透明體；其中該透明體之高度大於該發光二極體晶片之高度，並且不大於該杯狀結構之深度，而且該透明體並未覆蓋該發光二極體晶片。In another embodiment, the present invention further provides a method for fabricating a light emitting diode package structure, comprising the steps of: providing a cup-shaped support; mounting at least one light-emitting diode chip in the cup-shaped support; forming at least one a transparent body mounted on the inner wall of the cup holder and surrounding the light emitting diode wafer; and filling at least one phosphor powder conversion layer in the cup holder to cover the light emitting diode wafer and The transparent body; wherein the height of the transparent body is greater than the height of the light emitting diode chip and not greater than the depth of the cup structure, and the transparent body does not cover the light emitting diode chip.
為使 貴審查委員能對本發明之特徵、目的及功能有更進一步的認知與瞭解，下文特將本發明之裝置的相關細部結構以及設計的理念原由進行說明，以使得 審查委員可以了解本發明之特點，詳細說明陳述如下：In order to enable the reviewing committee to have a further understanding and understanding of the features, objects and functions of the present invention, the related detailed structure of the device of the present invention and the concept of the design are explained below so that the reviewing committee can understand the present invention. Features, detailed descriptions are as follows:
請參閱第四圖，其係為本發明第一具體實施例之發光二極體封裝結構橫截面示意圖。在第四圖中，本發明提供一種發光二極體封裝結構4，其係包括：一杯狀支架41；至少一發光二極體晶片42，其係裝設於該杯狀支架41內；至少一透明體43，其係裝設於該杯狀支架41之內壁上並且圍繞該發光二極體晶片42；以及至少一螢光粉轉化層44，其係填充於該杯狀支架41內，以覆蓋該發光二極體晶片42與該透明體43。其中該透明體43之高度大於該發光二極體晶片42之高度，並且不大於該杯狀結構41之深度而且該透明體43並未覆蓋該發光二極體晶片42。Please refer to the fourth figure, which is a schematic cross-sectional view of a light emitting diode package structure according to a first embodiment of the present invention. In the fourth embodiment, the present invention provides a light emitting diode package structure 4, which comprises: a cup-shaped holder 41; at least one light-emitting diode wafer 42 is mounted in the cup-shaped holder 41; at least one a transparent body 43 mounted on the inner wall of the cup holder 41 and surrounding the light emitting diode wafer 42; and at least one phosphor conversion layer 44 filled in the cup holder 41 to The light emitting diode chip 42 and the transparent body 43 are covered. The height of the transparent body 43 is greater than the height of the LED chip 42 and is not greater than the depth of the cup structure 41 and the transparent body 43 does not cover the LED chip 42.
在一具體實施例中，該透明體43與該發光二極體晶片間隔一距離，如第四圖所示。在一具體實施例中，透明體43在可見光範圍內(400至700nm)之穿透率大於80%。舉例來說，透明體43包含有機材料、無機材料、金屬化合物或上述之組合，而由模具鑄造或是射出成型所製成。In a specific embodiment, the transparent body 43 is spaced apart from the light emitting diode wafer by a distance as shown in the fourth figure. In a specific embodiment, the transparency of the transparent body 43 in the visible range (400 to 700 nm) is greater than 80%. For example, the transparent body 43 contains an organic material, an inorganic material, a metal compound, or a combination thereof, and is formed by die casting or injection molding.
在一具體實施例中，杯狀支架41包含金屬、陶瓷、塑料或上述之組合，而具有反射或散射性質。在一具體實施例中，發光二極體晶片42係為面射型、覆晶型或是垂直型，且發光波長可為紫外光區或可見光區。在一具體實施例中，螢光粉轉化層44包含螢光粉顆粒或由螢光粉和透光物質混合而成。In a specific embodiment, the cup holder 41 comprises metal, ceramic, plastic or a combination of the above, having reflective or scattering properties. In one embodiment, the LED array 42 is of a face-emitting type, a flip-chip type, or a vertical type, and the emission wavelength may be an ultraviolet region or a visible region. In a specific embodiment, the phosphor conversion layer 44 comprises phosphor powder particles or a mixture of phosphor powder and light transmissive material.
為了進一步說明本發明之特徵與精神，本發明更提供一種發光二極體封裝結構之製作方法，包括以下步驟，如第五A圖至第五D圖所示。首先，如第五A圖所示，提供一杯狀支架41。在一具體實施例中，杯狀支架41包含金屬、陶瓷、塑料或上述之組合，而具有反射或散射性質。In order to further illustrate the features and spirit of the present invention, the present invention further provides a method for fabricating a light emitting diode package structure, including the following steps, as shown in FIGS. 5A to 5D. First, as shown in FIG. A, a cup-shaped holder 41 is provided. In a specific embodiment, the cup holder 41 comprises metal, ceramic, plastic or a combination of the above, having reflective or scattering properties.
其次，如第五B圖所示，裝設至少一發光二極體晶片42於該杯狀支架41內。在一具體實施例中，發光二極體晶片42係為面射型、覆晶型或是垂直型，且發光波長可為紫外光區或可見光區。Next, as shown in FIG. B, at least one light-emitting diode wafer 42 is mounted in the cup holder 41. In one embodiment, the LED array 42 is of a face-emitting type, a flip-chip type, or a vertical type, and the emission wavelength may be an ultraviolet region or a visible region.
接著，如第五C圖所示，形成至少一透明體43，其係裝設於該杯狀支架41之內壁上並且圍繞該發光二極體晶片42。在一具體實施例中，透明體43在可見光範圍內(400至700nm)之穿透率大於80%。舉例來說，透明體43包含有機材料、無機材料、金屬化合物或上述之組合，而由模具鑄造或是射出成型所製成。Next, as shown in FIG. 5C, at least one transparent body 43 is formed on the inner wall of the cup holder 41 and surrounds the light emitting diode wafer 42. In a specific embodiment, the transparency of the transparent body 43 in the visible range (400 to 700 nm) is greater than 80%. For example, the transparent body 43 contains an organic material, an inorganic material, a metal compound, or a combination thereof, and is formed by die casting or injection molding.
值得注意的是，第五B圖與第五C圖之步驟並無先後之限制。亦即，可以先進行第五C圖之步驟，再進行第五B圖之步驟。It is worth noting that the steps of the fifth and fifth C diagrams are not limited. That is, the steps of the fifth C diagram can be performed first, and then the steps of the fifth panel B.
最後，如第五D圖所示，填充至少一螢光粉轉化層44於該杯狀支架41內，以覆蓋該發光二極體晶片42與該透明體43。在一具體實施例中，螢光粉轉化層44包含螢光粉顆粒或由螢光粉和透光物質混合而成。Finally, as shown in FIG. D, at least one phosphor conversion layer 44 is filled in the cup holder 41 to cover the LED wafer 42 and the transparent body 43. In a specific embodiment, the phosphor conversion layer 44 comprises phosphor powder particles or a mixture of phosphor powder and light transmissive material.
其中該透明體43之高度大於該發光二極體晶片42之高度，並且不大於該杯狀結構41之深度而且該透明體43並未覆蓋該發光二極體晶片42。The height of the transparent body 43 is greater than the height of the LED chip 42 and is not greater than the depth of the cup structure 41 and the transparent body 43 does not cover the LED chip 42.
在一具體實施例中，該透明體43與該發光二極體晶片42間隔一距離，如第四圖所示。在本具體實施例中，由於一般發光二極體晶片42中心發光強度強，而側向發光較弱，本發明在封裝體之杯狀結構41之內壁定義透明體43，可改變螢光粉轉化層44塗佈方式，使螢光粉44於杯狀結構41內厚度有差異，進而改善一般封裝體出光不均勻及光型之問題。In one embodiment, the transparent body 43 is spaced from the LED array 42 by a distance, as shown in the fourth figure. In the present embodiment, since the central illuminating diode 42 has a strong central illuminating intensity and a weak lateral illuminating light, the present invention defines a transparent body 43 on the inner wall of the cup-shaped structure 41 of the package, which can change the fluorescent powder. The conversion layer 44 is applied in such a manner that the thickness of the phosphor powder 44 in the cup structure 41 is different, thereby improving the problem of uneven light emission and light type of the general package.
然而，本發明之範圍並不侷限於此。任何具有本技術領域之一般技藝者，當可在了解本發明之要義之後，進行任何潤飾或修改。以下將例舉若干實施例，以作為說明。However, the scope of the invention is not limited thereto. Any person skilled in the art can make any retouching or modification after understanding the meaning of the invention. Several embodiments are exemplified below for illustration.
第六圖係為本發明第二具體實施例之發光二極體封裝結構橫截面示意圖。第六圖之發光二極體封裝結構6與第四圖之結構與製作方法大致相同，僅差別在於第六圖之透明體63與發光二極體晶片62相接觸。由於第六圖之發光二極體封裝結構6與製作方法與第四圖類似，在此不予贅述。Figure 6 is a schematic cross-sectional view showing a light emitting diode package structure according to a second embodiment of the present invention. The structure of the light-emitting diode package structure 6 of the sixth embodiment is substantially the same as that of the fourth embodiment, except that the transparent body 63 of the sixth figure is in contact with the light-emitting diode wafer 62. The light-emitting diode package structure 6 of the sixth embodiment is similar to the fourth method in the manufacturing method, and will not be described herein.
第七圖係為本發明第三具體實施例之發光二極體封裝結構橫截面示意圖。第七圖之發光二極體封裝結構7與第四圖之結構與製作方法大致相同，僅差別在於第七圖之杯狀結構71具有至少一凹槽，而使得該透明體73崁入該凹槽內。由於第七圖之結構與製作方法與第四圖類似，在此不予贅述。The seventh figure is a schematic cross-sectional view of a light emitting diode package structure according to a third embodiment of the present invention. The structure of the light-emitting diode package structure 7 of the seventh embodiment is substantially the same as that of the fourth figure, except that the cup-shaped structure 71 of the seventh figure has at least one groove, so that the transparent body 73 breaks into the concave shape. Inside the slot. Since the structure and manufacturing method of the seventh figure are similar to those of the fourth figure, they will not be described here.
第八圖係為本發明第四具體實施例之發光二極體封裝結構橫截面示意圖。第八圖之發光二極體封裝結構8與第四圖之結構與製作方法大致相同，僅差別在於第八圖之杯狀結構81內係形成至少一微結構85，以定義透明體83之區域。由於第八圖之結構與製作方法與第四圖類似，在此不予贅述。The eighth figure is a schematic cross-sectional view of a light emitting diode package structure according to a fourth embodiment of the present invention. The structure and manufacturing method of the LED package structure 8 of FIG. 8 are substantially the same as those of the fourth figure, except that the at least one microstructure 85 is formed in the cup structure 81 of the eighth figure to define the area of the transparent body 83. . Since the structure and manufacturing method of the eighth figure are similar to those of the fourth figure, they will not be described here.
第九圖係為本發明第五具體實施例之發光二極體封裝結構橫截面示意圖。第九圖之發光二極體封裝結構9與第四圖之結構與製作方法大致相同，僅差別在於第九圖之杯狀結構91之內壁係為一斜坡，以定義透明體93之結構。由於第九圖之結構與製作方法與第四圖類似，在此不予贅述。The ninth drawing is a schematic cross-sectional view of a light emitting diode package structure according to a fifth embodiment of the present invention. The structure of the light-emitting diode package structure 9 of the ninth embodiment is substantially the same as that of the fourth embodiment, except that the inner wall of the cup-shaped structure 91 of the ninth figure is a slope to define the structure of the transparent body 93. Since the structure and manufacturing method of the ninth figure are similar to those of the fourth figure, they will not be described here.
第十圖係為本發明第六具體實施例之發光二極體封裝結構橫截面示意圖。第十圖之發光二極體封裝結構10與第五圖之結構與製作方法大致相同，僅差別在於第十圖之杯狀結構101之內壁係為一斜坡，以定義透明體103之結構。由於第十圖之結構與製作方法與第五圖類似，在此不予贅述。Figure 11 is a cross-sectional view showing a light emitting diode package structure according to a sixth embodiment of the present invention. The structure and manufacturing method of the light-emitting diode package structure 10 of the tenth embodiment are substantially the same, except that the inner wall of the cup-shaped structure 101 of the tenth figure is a slope to define the structure of the transparent body 103. Since the structure and manufacturing method of the tenth figure are similar to those of the fifth figure, they will not be described here.
綜上所述，本發明之發光二極體封裝結構與其製作方法具有以下優點：In summary, the LED package structure of the present invention and the manufacturing method thereof have the following advantages:
1.可藉由反射杯內壁定義透明體的方式，並進行螢光轉化層塗佈，相較以往反射杯直接進行螢光轉化層塗佈，具不同封裝型態；1. The transparent body can be defined by the inner wall of the reflective cup, and the fluorescent conversion layer can be coated, and the fluorescent conversion layer can be directly coated compared with the conventional reflective cup, and has different package patterns;
2.利用透明體定義螢光粉轉化層的封裝體，相較於一般螢光轉化層塗佈封裝，可改善其出光均勻度，減少黃暈問題；2. The transparent body is used to define the package of the phosphor powder conversion layer, which can improve the uniformity of light emission and reduce the yellow halo problem compared with the general fluorescent conversion layer coating package;
3.利用透明體定義螢光粉轉化層的封裝體，可解決一般以往利用螢光轉化層均勻塗佈於晶片的方形光型，此發明，可得較佳圓形光形，更適用於照明應用；以及3. The transparent body defines the package of the phosphor powder conversion layer, and can solve the square light pattern which is generally uniformly applied to the wafer by the fluorescent conversion layer. The invention can obtain a better circular shape and is more suitable for illumination. Application;
4.可於封裝體先行製造透明體，再進行完成光元件組裝，其製程已證實可具生產性。4. The transparent body can be manufactured first in the package, and then the optical component assembly is completed, and the process has been confirmed to be productive.
綜上所述，當知本發明提供一種發光二極體封裝結構與其製作方法，藉由定義杯狀結構之透明體，可藉此改變螢光粉轉化層塗佈厚度，使螢光粉厚度有差異化，讓大角度出光減少經過的螢光粉轉化層，改善封裝體出光不均勻之問題。故本發明實為一富有新穎性、進步性，及可供產業利用功效者，應符合專利申請要件無疑，爰依法提請發明專利申請，懇請 貴審查委員早日賜予本發明專利，實感德便。In summary, the present invention provides a light emitting diode package structure and a manufacturing method thereof. By defining a transparent body of a cup structure, the thickness of the phosphor powder conversion layer can be changed to make the thickness of the phosphor powder Differentiating, allowing large-angle light to reduce the passing of the phosphor conversion layer, improving the problem of uneven light emission in the package. Therefore, the present invention is a novelty, progressive, and available for industrial use. It should be in accordance with the requirements of the patent application. The invention patent application is filed according to law, and the examination committee is invited to give the invention patent as soon as possible.
惟以上所述者，僅為本發明之較佳實施例而已，並非用來限定本發明實施之範圍，即凡依本發明申請專利範圍所述之形狀、構造、特徵、精神及方法所為之均等變化與修飾，均應包括於本發明之申請專利範圍內。The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the shapes, structures, features, spirits, and methods described in the claims are equally. Variations and modifications are intended to be included within the scope of the invention.
1．．．封裝體1. . . Package
11．．．螢光粉11. . . Fluorescent powder
12．．．發光二極體晶片12. . . Light-emitting diode chip
13．．．碗杯13. . . Bowl cup
14．．．出光路徑14. . . Light path
21．．．螢光粉轉化層twenty one. . . Fluorescent powder conversion layer
22．．．晶片twenty two. . . Wafer
31．．．螢光粉轉化層31. . . Fluorescent powder conversion layer
32．．．晶片32. . . Wafer
4．．．發光二極體封裝結構4. . . Light emitting diode package structure
41．．．杯狀支架41. . . Cup holder
42．．．發光二極體晶片42. . . Light-emitting diode chip
43．．．透明體43. . . Transparent body
44．．．螢光粉轉化層44. . . Fluorescent powder conversion layer
6．．．發光二極體封裝結構6. . . Light emitting diode package structure
62．．．發光二極體晶片62. . . Light-emitting diode chip
63．．．透明體63. . . Transparent body
7．．．發光二極體封裝結構7. . . Light emitting diode package structure
71．．．杯狀支架71. . . Cup holder
73．．．透明體73. . . Transparent body
8．．．發光二極體封裝結構8. . . Light emitting diode package structure
81．．．杯狀支架81. . . Cup holder
83．．．透明體83. . . Transparent body
85．．．微結構85. . . microstructure
9．．．發光二極體封裝結構9. . . Light emitting diode package structure
91．．．杯狀支架91. . . Cup holder
93．．．透明體93. . . Transparent body
10．．．發光二極體封裝結構10. . . Light emitting diode package structure
101．．．杯狀支架101. . . Cup holder
103．．．透明體103. . . Transparent body
第一圖係為一習知發光二極體封裝體橫截面示意圖；The first figure is a schematic cross-sectional view of a conventional light-emitting diode package;
第二圖係為另一習知發光二極體封裝體橫截面示意圖；The second figure is a schematic cross-sectional view of another conventional light-emitting diode package;
第三圖係為另一習知發光二極體封裝體橫截面示意圖；The third figure is a schematic cross-sectional view of another conventional light-emitting diode package;
第四圖係為本發明第一具體實施例之發光二極體封裝結構橫截面示意圖；The fourth figure is a schematic cross-sectional view of a light emitting diode package structure according to a first embodiment of the present invention;
第五A圖至第五D圖係為本發明第一具體實施例之發光二極體封裝結構之製作方法之示意圖；5A to 5D are schematic views showing a manufacturing method of a light emitting diode package structure according to a first embodiment of the present invention;
第六圖係為本發明第二具體實施例之發光二極體封裝結構橫截面示意圖；6 is a schematic cross-sectional view of a light emitting diode package structure according to a second embodiment of the present invention;
第七圖係為本發明第三具體實施例之發光二極體封裝結構橫截面示意圖；7 is a schematic cross-sectional view of a light emitting diode package structure according to a third embodiment of the present invention;
第八圖係為本發明第四具體實施例之發光二極體封裝結構橫截面示意圖；8 is a schematic cross-sectional view of a light emitting diode package structure according to a fourth embodiment of the present invention;
第九圖係為本發明第五具體實施例之發光二極體封裝結構橫截面示意圖；以及9 is a schematic cross-sectional view showing a light emitting diode package structure according to a fifth embodiment of the present invention;
第十圖係為本發明第六具體實施例之發光二極體封裝結構橫截面示意圖。Figure 11 is a cross-sectional view showing a light emitting diode package structure according to a sixth embodiment of the present invention.
4．．．發光二極體封裝結構4. . . Light emitting diode package structure
41．．．杯狀支架41. . . Cup holder
42．．．發光二極體晶片42. . . Light-emitting diode chip
43．．．透明體43. . . Transparent body
44．．．螢光粉轉化層44. . . Fluorescent powder conversion layer
Claims (24)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98110471A TWI474502B (en) | 2009-03-30 | 2009-03-30 | Light emitting diode package structure and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98110471A TWI474502B (en) | 2009-03-30 | 2009-03-30 | Light emitting diode package structure and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201036205A TW201036205A (en) | 2010-10-01 |
| TWI474502B true TWI474502B (en) | 2015-02-21 |
Family
ID=44856147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98110471A TWI474502B (en) | 2009-03-30 | 2009-03-30 | Light emitting diode package structure and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI474502B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI550913B (en) * | 2013-07-03 | 2016-09-21 | 光寶電子（廣州）有限公司 | Illumination device |
| TWI678003B (en) * | 2018-01-25 | 2019-11-21 | 致伸科技股份有限公司 | Light source module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6917057B2 (en) * | 2002-12-31 | 2005-07-12 | Gelcore Llc | Layered phosphor coatings for LED devices |
| TW200618326A (en) * | 2004-11-16 | 2006-06-01 | Lighthouse Technology Co Ltd | Package structure of a surface mount device light emitting diode |
| TW200725935A (en) * | 2005-12-23 | 2007-07-01 | High Power Lighting Corp | High brightness light-emitting diode chip |
| TW200807765A (en) * | 2006-05-31 | 2008-02-01 | Cree Inc | Packaged light emitting devices including multiple index lenses and methods of fabricating the same |
| TW200822398A (en) * | 2006-08-09 | 2008-05-16 | Matsushita Electric Ind Co Ltd | Light-emitting device |
-
2009
- 2009-03-30 TW TW98110471A patent/TWI474502B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6917057B2 (en) * | 2002-12-31 | 2005-07-12 | Gelcore Llc | Layered phosphor coatings for LED devices |
| TW200618326A (en) * | 2004-11-16 | 2006-06-01 | Lighthouse Technology Co Ltd | Package structure of a surface mount device light emitting diode |
| TW200725935A (en) * | 2005-12-23 | 2007-07-01 | High Power Lighting Corp | High brightness light-emitting diode chip |
| TW200807765A (en) * | 2006-05-31 | 2008-02-01 | Cree Inc | Packaged light emitting devices including multiple index lenses and methods of fabricating the same |
| TW200822398A (en) * | 2006-08-09 | 2008-05-16 | Matsushita Electric Ind Co Ltd | Light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201036205A (en) | 2010-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI518948B (en) | To enhance the luminous angle of the small size of the LED package to improve the structure | |
| TWI401820B (en) | A light emitting element and thereof method | |
| US20140369036A1 (en) | Led light and filament thereof | |
| TWI703743B (en) | Lighting device and lighting module | |
| EP2971935B1 (en) | A light emitting diode module with improved light characteristics | |
| US8035122B2 (en) | Light diffusion type light emitting diode | |
| US20130329429A1 (en) | Emitter package with integrated mixing chamber | |
| JP6979551B1 (en) | Filament lamp | |
| TWI384651B (en) | A light emitting diodes structure and a light emitting diodes structure forming method | |
| TWI583028B (en) | Light emitting device with beam shaping structure and manufacturing method of the same | |
| KR20100106297A (en) | Led leadframe package, led package using the same, and method of fabricating the led package | |
| CN104334959B (en) | Lighting device with remote wavelength conversion layer | |
| TW201142355A (en) | Composite film for light emitting apparatus, light emitting apparatus and method for fabricating the same | |
| JP2013084346A (en) | Lighting apparatus | |
| TW201348655A (en) | LED lamp | |
| KR101490065B1 (en) | Lighting apparatus | |
| TW201332156A (en) | Solid state lighting device | |
| WO2016056316A1 (en) | Illumination device | |
| TWI469383B (en) | A light emitting device and a manufacturing method thereof | |
| JP2013105942A (en) | Light distribution decentralization control type led lighting device, system and lighting method | |
| JP6979550B1 (en) | Lighting device with brilliant effect | |
| TWI474502B (en) | Light emitting diode package structure and method for manufacturing the same | |
| KR101641205B1 (en) | The manufacturing method for LED light module contained adjustable Emitting angle | |
| CN103000791B (en) | Light-emitting diode (LED) packaging structure of dispensing coating long-distance type fluorescent powder and manufacture method | |
| JP2011086515A (en) | Led lighting device and reflector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |