TWI474366B - - Google Patents

Info

Publication number
TWI474366B
TWI474366B TW101143729A TW101143729A TWI474366B TW I474366 B TWI474366 B TW I474366B TW 101143729 A TW101143729 A TW 101143729A TW 101143729 A TW101143729 A TW 101143729A TW I474366 B TWI474366 B TW I474366B
Authority
TW
Taiwan
Application number
TW101143729A
Other languages
Chinese (zh)
Other versions
TW201338012A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201338012A publication Critical patent/TW201338012A/en
Application granted granted Critical
Publication of TWI474366B publication Critical patent/TWI474366B/zh

Links

TW101143729A 2011-12-30 2012-11-22 Adjustable apparatus for use in plasma processing device TW201338012A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110457216.7A CN103187234B (en) 2011-12-30 2011-12-30 A kind of adjustable constraint device for plasma processing apparatus

Publications (2)

Publication Number Publication Date
TW201338012A TW201338012A (en) 2013-09-16
TWI474366B true TWI474366B (en) 2015-02-21

Family

ID=48678345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101143729A TW201338012A (en) 2011-12-30 2012-11-22 Adjustable apparatus for use in plasma processing device

Country Status (2)

Country Link
CN (1) CN103187234B (en)
TW (1) TW201338012A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111326391B (en) * 2018-12-17 2023-01-24 中微半导体设备(上海)股份有限公司 Plasma processing apparatus
CN111383893B (en) * 2018-12-29 2023-03-24 中微半导体设备(上海)股份有限公司 Plasma processor and plasma control method
CN112687510B (en) * 2019-10-18 2023-10-31 中微半导体设备(上海)股份有限公司 Plasma processor and method for preventing arc damage of confinement rings
CN112928007B (en) * 2019-12-06 2023-09-12 中微半导体设备(上海)股份有限公司 Plasma processing apparatus and lower electrode assembly for the same
CN113130282B (en) * 2019-12-31 2023-10-20 中微半导体设备(上海)股份有限公司 Plasma confinement structure, manufacturing method thereof and plasma processing device
CN113838730B (en) * 2020-06-08 2024-05-14 中微半导体设备(上海)股份有限公司 Gas shielding ring, plasma processing device and method for regulating and controlling polymer distribution
CN115050623A (en) * 2021-03-08 2022-09-13 中微半导体设备(上海)股份有限公司 Plasma processing device

Citations (5)

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Publication number Priority date Publication date Assignee Title
TWM370181U (en) * 2009-07-03 2009-12-01 Advanced Micro Fab Equip Inc A plasma processing apparatus
TWM377038U (en) * 2009-05-15 2010-03-21 Advanced Micro Fab Equip Inc Plasma confinement device and plasma processing device using the same
CN201503847U (en) * 2009-07-03 2010-06-09 中微半导体设备(上海)有限公司 Plasma processing device
US20100176085A1 (en) * 2007-08-21 2010-07-15 Panasonic Corporation Plasma processing device and method of monitoring plasma discharge state in plasma processing device
US20110115466A1 (en) * 2006-03-31 2011-05-19 Daihen Corporation Current detection printed board, voltage detection printed board, current/voltage detection printed board, current/voltage detector, current detector and voltage detector

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
US6896765B2 (en) * 2002-09-18 2005-05-24 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US7075771B2 (en) * 2003-05-21 2006-07-11 Tokyo Electron Limited Apparatus and methods for compensating plasma sheath non-uniformities at the substrate in a plasma processing system
US7632375B2 (en) * 2004-12-30 2009-12-15 Lam Research Corporation Electrically enhancing the confinement of plasma
CN1909760B (en) * 2005-08-05 2010-07-21 中微半导体设备(上海)有限公司 Vacuum reaction chamber and processing method
CN101150909B (en) * 2006-09-22 2010-05-12 中微半导体设备(上海)有限公司 Plasm restraint device
JP5350043B2 (en) * 2009-03-31 2013-11-27 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110115466A1 (en) * 2006-03-31 2011-05-19 Daihen Corporation Current detection printed board, voltage detection printed board, current/voltage detection printed board, current/voltage detector, current detector and voltage detector
US20100176085A1 (en) * 2007-08-21 2010-07-15 Panasonic Corporation Plasma processing device and method of monitoring plasma discharge state in plasma processing device
TWM377038U (en) * 2009-05-15 2010-03-21 Advanced Micro Fab Equip Inc Plasma confinement device and plasma processing device using the same
TWM370181U (en) * 2009-07-03 2009-12-01 Advanced Micro Fab Equip Inc A plasma processing apparatus
CN201503847U (en) * 2009-07-03 2010-06-09 中微半导体设备(上海)有限公司 Plasma processing device

Also Published As

Publication number Publication date
TW201338012A (en) 2013-09-16
CN103187234A (en) 2013-07-03
CN103187234B (en) 2016-03-16

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