TWI471255B - A plastic composition for a wafer / mask carrier and a mask structure for applying the mask - Google Patents

Description

Plastic composition applied to wafer/mask carrier and application of reticle transfer box structure

The invention belongs to the technical field of a plastic composition, in particular to a wafer/mask carrier using the plastic composition, to meet the special antistatic and low vulcanization of the semiconductor industry for use in a clean room. Demand for materials, wear resistance and high cleanliness.

According to the continuous innovation and miniaturization of semiconductor technology, wafers made using semiconductor technology are widely used in various fields. Due to the miniaturization of the integrated circuit and the low cost, the size of the wafer is getting larger and larger, but the number of wafers per wafer is increasing, so that the value of the wafer is continuously increased, so the wafer is processed on the wafer. Any problem can cause great losses. And the yellow light process in the general integrated circuit process is an important process related to the overall yield, which is usually coated with an opaque or translucent desired pattern on the surface of the reticle for projecting the desired pattern onto the wafer light. On the barrier layer. Therefore, any defects attached to the surface of the reticle may be projected onto the photoresist layer of the wafer, resulting in a proper rate of the finished circuit component or even being unusable. However, in the process of wafers and reticle, or due to process materials, or process gases, or the peeling of particles and oil due to parts, or due to the environment of the clean room, there is a presence in the adjacent environment of the wafer/mask. Numerous particles and gas free molecules and other contaminants, and these contaminants are accumulated or chemically changed, it is very easy to produce defects such as particles or haze during storage and transportation of the wafer/mask.

In the semiconductor process, the use of automated material handling system [Automated Material Handling System, AMHS], and Standard mechanical interface (SMIF) equipment for the maintenance and transportation of wafers and reticle during non-use, which can replace traditional manual handling and reduce the cost of installation and maintenance of clean room equipment. It can also improve the cleanliness of wafers and reticle to achieve high production yield. In recent years, AMHS and SMIF have been listed as standard equipment specifications for international semiconductor factories.

According to the above technical concept, in addition to the exposure, the wafer and the reticle must be placed in a high cleanliness, air tightness, low gas escape [Outgassing] and antistatic protection [ESD during transportation or storage). 】In the vehicle, such as the Cassette, the wafer transfer box [FOUP], the wafer transport box [FOSB], the mask storage box [Mask Package], the reticle transfer box [Reticle SMIF Pod, RSP] It effectively prevents contamination of wafers and reticle, ensuring high wafer and reticle cleanliness and high production yield.

Furthermore, due to advances in the process, when semiconductor plants enter higher-order processes, in addition to electrostatic effects, electromagnetic pulse (EMI) in semiconductor factories can also cause damage to wafers and reticle, especially in wafers and reticle. When stored, it is even more difficult to anticipate changes in the surrounding environment, so it is also an important issue to prevent electrostatic effects (ESD) and electromagnetic pulse (EMI) damage to the wafer and the mask.

The early wafer and reticle carriers were mainly made of plastic materials, the most commonly used of which was PP plastic. However, wafers and reticle carriers made of PP materials were the most susceptible to harmful Gas ion release [Outgassing], and haze on the surface of the wafer and the mask [Haze], even the adhesion of dust particles [particles] due to friction or collision.

In other words, how to provide a wafer/mask carrier with good antistatic effect, low ion release, wear resistance and high cleanliness is a very important issue.

The inventor of the present invention has been engaged in research and development and production experience of related industries for many years, and has in-depth discussions on the problems faced by the aforementioned wafer and reticle carriers, and has been continuously improving and testing, and successfully developed. A plastic composition applied to a wafer/mask carrier, which can solve the inconvenience and trouble caused by the existing wafer/mask carrier which cannot effectively reduce the release of harmful ions and poor wear resistance.

Accordingly, it is a primary object of the present invention to provide a plastic composition that can be applied to a wafer/mask carrier to reduce the release of harmful gas ions from the wafer/mask carrier to reduce the wafer/mask surface. The haze [Haze] is produced.

Moreover, a second primary object of the present invention is to provide a plastic composition for a wafer/mask carrier that can improve the hardness of the wafer/mask carrier to improve its wear resistance and impact resistance. To meet the high cleanliness requirements of the vehicle, to avoid contamination of the wafer/mask.

In addition, another main object of the present invention is to provide a reticle transfer box structure, which can have a better antistatic effect and avoid the adhesion of harmful substances.

Furthermore, another main object of the present invention is to provide a plastic composition for a wafer/mask carrier that can meet the requirements of special antistatic, low harmful gas release, wear resistance and high cleanliness, and avoid The mask is contaminated.

To this end, the present invention mainly implements the objects and effects of the present invention through the following technical means: The plastic material part of the wafer/mask carrier is made of polyetheretherketone [PEEK], and the host material contains 1%~15% carbon nanotubes.

Thereby, through the above-mentioned technical means, the present invention can utilize the plastic composition of the polyether ether ketone [PEEK] containing carbon nanotubes to form the plastic part of the carrier of the wafer/mask, so that The carrier can greatly improve its hardness, and its wear resistance and scratch resistance are greatly improved, and the dust or particles of the material are reduced to reduce the chance of damaging the surface of the wafer or the mask, and the antistatic effect is better. At the same time, it can further reduce the release of harmful gas ions such as sulfur ions, chloride ions, sodium ions, ammonium ions and potassium ions, so as to prevent the phenomenon of haze on the surface of the wafer/mask, and avoid the occurrence in subsequent processes. Defective products can reduce the number of cleanings and reduce the cost of the process.

The following is a description of the preferred embodiments of the present invention, and is described in detail with reference to the drawings, and the .

The present invention relates to a plastic composition and a wafer/mask carrier using the same, and in the specific embodiments of the carrier of the invention and the components thereof as illustrated in the accompanying drawings, all of which relate to front and rear, left and right, Top and bottom, upper and lower, and horizontal and vertical references are for convenience of description only, are not limiting of the invention, and are not intended to limit their components to any position. Or spatial direction. The drawings and the dimensions specified in the specification may be varied in accordance with the design and needs of the specific embodiments of the present invention without departing from the scope of the invention.

In order to make the wafer/mask carrier of the present invention have the functions described in the above embodiments, the present invention utilizes a plastic composition to fabricate the wafer/mask carrier, and the plastic composition of the present invention comprises a host material. The host material comprises polyetheretherketone [PEEK] and 1% to 15% carbon nanotubes. In a preferred embodiment of the present invention, the proportion of the carbon nanotubes is 2% to 5%, and the ratio The carbon nanotubes may be selected from one of a multilayered carbon nanotube or a single layer of carbon nanotubes or a combination thereof.

The plastic material portion of the carrier is designed to pass through the above design. Since the present invention can utilize the polyether ether ketone [PEEK] containing a carbon nanotube to form the plastic portion of the carrier, according to the experimental results, the present invention can be substantially Improve the hardness and anti-static effect, greatly improve the wear resistance and scratch resistance of the plastic part of the carrier, reduce the dust or particle peeling of the material, reduce the chance of destroying the surface of the wafer or the mask, and further reduce sulfur Release of harmful gases such as ions, chloride ions, sodium ions, ammonium ions and potassium ions [Table 1] to prevent haze on the wafer/mask surface and avoid defective products in subsequent processes At the same time, the number of cleanings can be reduced, thereby reducing the process cost.

As can be seen from the above Table 1, the plastic component of the wafer/mask of the present invention has a much lower release amount of chloride ion, sodium ion, ammonium ion and potassium ion than the pure polyetheretherketone [PEEK] plastic. The material prevents these harmful gases from being synthesized during storage to avoid haze on the surface of the wafer/mask.

Further, the plastic composition of the present invention can be practically applied to a Reticle SMIF Pod (RSP). For the detailed configuration of the reticle transfer case, please refer to the first, second, third and fourth figures. The cover 10 and the cover 10 can be oppositely closed to form a storage space for accommodating the reticle 50. At least one of the base 10 and the cover 30 is provided. Corresponding to the pressure guiding group 40 of the limiting mask 50. In the embodiment of the present invention, the base 10 is provided with a support group 20 for supporting the reticle 50, and the pressure guiding group 40 for limiting the light guide cover 50 is disposed on the inner surface of the cover 30, and the base is 10, at least one of the support group 20, the cover 30 and the pressure guiding group 40 is made of a main material, which is composed of a polyether ether ketone [PEEK] containing a carbon nanotube, and The host material contains 1% to 15% of nano carbon Tubes [Carbon nanotubes], and the preferred composition ratio of the present invention is 2% to 5%, and the carbon nanotubes may be selected from one of a plurality of layers of carbon nanotubes or a single layer of carbon nanotubes or a combination thereof, The plastic parts of the base 10, the cover 30, the support group 20 and the pressure guiding group 40 have good antistatic, high hardness, low sulfide, wear resistance and high cleanliness.

The base 10 is formed with a plurality of upper and lower communicating receiving holes 11 , and the base 10 is covered with a metal backing 15 . The metal backing 15 is formed with a plurality of corresponding receiving holes 11 and a peripheral seat having a through hole. 16. The base 10 receiving hole 11 and the metal back piece 15 are respectively provided with an air valve 18 for inlet and outlet. The support group 20 includes two supporting members 21 and an abutting member 25, and two supporting portions. The top surface of the component 21 is provided with two supporting blocks 22 for supporting the bottom surface of the reticle 50. The supporting block 22 can be a pyramidal shape for reducing the contact area of the reticle 50, and the two supporting blocks 22 have a lower height. The tabs 220 are arranged to prevent the reticle 50 from directly sliding off, and the two supporting members 21 are respectively formed with a plurality of side panels 23 for the edges of the reticle 50 on opposite sides, and the inner side of the side panels 23 are formed with corresponding lights. The side abutting member 24 at the edge of the cover 50 and the side abutting members 24 of the side supporting members 21 are spaced apart from each other to reduce the slip amount before the photomask 50 is restrained, and the supporting block 22 and the side are abutted. The member 24 can be integrated with the support member 21 or have a separate structure. To reduce the cost, the separate support block 22 and the side contact member 24 are further integrated. Selected from the wear resistance, high hardness of the carbon nanotube-containing material body, to reduce flaking particles. Furthermore, the abutment element 25 has at least one upwardly projecting backrest 26 which can be placed against the back edge of the reticle 50.

The top surface of the cover 30 is provided with a handle 31, and the cover 30 is covered. The 30-peripheral edge is provided with a plurality of locking members 32 of the buckle base 10, so that the cover 30 and the base 10 can be selectively covered, and the metal cover 35 is locked in the cover 30, and the periphery of the metal inner cover 35 The bottom end can be in contact with the metal backing 15 of the base 10 to form a conductive receiving space for eliminating static electricity. Further, the inside of the cover 30 is inside the metal inner cover and is synchronously locked with a pressure guiding group 40. The pressure guiding group 40 made of the material substantially comprises a plurality of symmetrical elements 43 and a guiding element 47. The pressing element 43 and the guiding element 47 are disposed on a base 41 corresponding to the reticle 50. The side of the base 41 is embedded with a stud 42 for locking the lock member 33. The pressing member 43 can correspond to the peripheral edge of the surface of the photoreceptor cover 50, and the pressing member 43 is attached to the base 41. A through hole 44 is formed, and the pressing member 43 is suspended in the through hole 44, and a pressing member 45 for pressing the mask 50 is mounted. The pressing member 45 has an inverted tapered cone 450. To reduce the contact area with the reticle 50. Further, the guiding member 47 is disposed on the side of the base 41 different from the edge of the back side abutting member 26 of the supporting group 20 and adjacent to the edge, so that the guiding element 47 corresponding to the opening of the supporting group 20 can be used to light the light. The cover 50 is pushed back to the backrest panel 26 of the abutting member 25, and the guiding members 47 on both sides can directly clamp the sides of the mask 50 to prevent the mask 50 from slipping during the transport of the reticle transport box structure. As shown in the above, the guiding element 47 is formed by an arc-shaped positive guiding arc piece 48 extending downward from the base 41, and the guiding arc piece 48 corresponds to the side surface of the reticle 50 and is formed with an arc pressing edge 480. The grading pressure taper 450 of the pressing member 45 may be in an integrated structure or a separate structure, and the convex pressing cone 450 may further be selected from the foregoing wear resistance and high hardness. The main material of the carbon nanotube is made to reduce the spalling of the particles, and can be lowered The amount of deformation of the finished product.

Through the foregoing design, the group constitutes a reticle transfer box structure having high heat resistance, good processability, low coefficient of thermal expansion, and wear resistance and high hardness.

Through the foregoing structural design and description, since at least one of the base 10, the cover 30, the support group 20 and the pressure guiding group 40 of the reticle transfer case is made of a main material containing a carbon nanotube, The reticle transfer box can greatly improve the hardness and antistatic effect, and the wear resistance and scratch resistance of the plastic part of the reticle transfer box are greatly improved, and the dust or particles of the material are reduced to reduce the surface damage of the reticle. Opportunity, and further reduce the release of harmful gases such as sulfur, chloride, sodium, ammonium and potassium [as shown in Table 1] to prevent haze on the surface of the mask, avoiding subsequent processes Defective products are produced, and the number of cleanings can be reduced, thereby reducing the cost of the process.

In addition to the above embodiments, the plastic composition of the present invention can be applied to other wafer/mask carriers, such as a wafer cassette, a wafer transfer cassette, and a crystal. Round transport box, reticle storage box or reticle transfer box, but not limited to this. The main structure of the wafer/mask carrier is made of a plastic composition comprising polyetheretherketone and 1% to 15% carbon nanotubes. Therefore, the wafer/mask carrier to which the plastic composition of the present invention is applied will also have the above-described characteristic advantages, overcoming the problems described in the prior art.

In summary, the present invention has many of the above-mentioned practical values, and thus the present invention is indeed a novel and progressive creation, and the same or similar products are not disclosed in the same technical field, so the present invention has been in accordance with the invention. The requirements of the patent are to apply in accordance with the law, and pray for the early grant of the invention patent.

(10)‧‧‧Base

(11) ‧‧‧ accommodating holes

(15)‧‧‧Metal negatives

(16)‧‧‧ Seat

(18) ‧‧‧Valve Group

(20) ‧‧‧Support group

(21)‧‧‧Supporting components

(22) ‧‧‧Support block

(220)‧‧‧

(23) ‧‧‧ side films

(24) ‧‧‧Parts

(25) ‧‧‧Resist components

(26)‧‧‧ Backrest

(30)‧‧‧Shell cover

(31)‧‧‧Hands

(32)‧‧‧Locks

(35)‧‧‧Metal inner cover

(40)‧‧‧Guide pressure group

(41) ‧ ‧ pedestal

(42)‧‧‧ Studs

(43)‧‧‧掣掣 unit

(44) ‧‧‧through holes

(45) ‧‧‧Parts

(450)‧‧‧ convex pressure cone

(47) ‧ ‧ Alignment unit

(48) ‧ ‧ lead positive arc

(480)‧‧‧Arc edge

The first figure is a schematic view of the appearance of the structure of the reticle transfer box of the present invention, which illustrates the aspects of the components and their relative relationships.

The second figure is a schematic view of the appearance of the pressure guiding group device of the reticle transfer box structure of the present invention.

The third figure is a schematic cross-sectional view of the reticle transfer box structure of the present invention before the capping.

The fourth figure is a schematic cross-sectional view of the reticle transfer box structure of the present invention after being covered.

(10)‧‧‧Base

(11) ‧‧‧ accommodating holes

(15)‧‧‧Metal negatives

(16)‧‧‧ Seat

(18) ‧‧‧Valve Group

(20) ‧‧‧Support group

(21)‧‧‧Supporting components

(22) ‧‧‧Support block

(220)‧‧‧

(23) ‧‧‧ side films

(24) ‧‧‧Parts

(25) ‧‧‧Resist components

(26)‧‧‧ Backrest

(30)‧‧‧Shell cover

(31)‧‧‧Hands

(32)‧‧‧Locks

(35)‧‧‧Metal inner cover

(40)‧‧‧Guide pressure group

(41) ‧ ‧ pedestal

(42)‧‧‧ Studs

(43)‧‧‧掣掣 unit

(45) ‧‧‧Parts

(47) ‧ ‧ Alignment unit

(48) ‧ ‧ lead positive arc

Claims (8)

A plastic composition for a wafer/mask carrier, wherein the plastic composition comprises a host material, and the host material comprises polyetheretherketone and 1% to 15% carbon nanotubes. The plastic composition according to claim 1, wherein the host material comprises 2% to 5% of carbon nanotubes. The plastic composition according to claim 1 or 2, wherein the carbon nanotubes are selected from one of a single-layer carbon nanotube, a multi-layered carbon nanotube, or a combination thereof. A reticle transfer box structure comprises: a base and a cover, the cover can be closed with respect to the base to form a reticle storage space, the base has a support set for supporting the reticle, and the cover The utility model has a pressure guiding group for limiting the light guiding mask; wherein the base, the supporting group, the shell cover and the pressure guiding group are made of a plastic composition, the plastic composition comprises a main body material, the main body The material comprises polyetheretherketone and 1%~15% carbon nanotubes. The reticle transfer box structure according to claim 4, wherein the main body material comprises 2% to 5% of carbon nanotubes. The reticle transfer box structure of claim 4 or 5, wherein the carbon nanotubes are selected from one of a single layer of carbon nanotubes, a plurality of layers of carbon nanotubes, or a combination thereof. A wafer/mask carrier, wherein the wafer/mask carrier is made of a plastic composition comprising polyetheretherketone and 1% to 15% carbon nanotubes. The wafer/mask carrier according to claim 7 of the patent application scope, wherein the wafer/mask carrier can be a wafer boat box, a wafer cassette, a wafer transport box, a reticle storage box or a reticle One of the transfer boxes.