TWI470464B - Circuit design simulation system and curcuit design method for pcb - Google Patents

Description

Circuit design simulation system of printed circuit board and circuit design method thereof

The present invention relates to a circuit design method, and more particularly to a circuit design method for a printed circuit board.

Among the development costs of electronic products, the price of printed circuit boards (PCBs) accounts for almost one-third to one-half of the total. Therefore, the price of the printed circuit board has a decisive influence on the overall price of the product. The price of a printed circuit board depends on the number of layout layers of the printed circuit board and the process of the printed circuit board. Traditionally, institutional engineers and electronic engineers must first prepare relevant materials for the layout engineer, and then the layout engineer actually places the parts and wiring through the layout tool/software, so it takes 2 to 3 days to know. Results such as the number of layout layers.

Therefore, there is a need for an automated simulation program that enables instant simulation analysis of printed circuit board levels and processes.

The present invention provides a circuit design method suitable for use in a printed circuit board. Through a user interface, a plurality of specifications of the integrated circuit to be disposed on one of the printed circuit boards are obtained. According to the above specification parameters, the integrated circuit is obtained from a fan-out position of the printed circuit board. A process type of the printed circuit board is determined according to the fan-out position and the above specification parameters. According to the above process type, a number of printed circuit board layers and a density value required for setting the integrated circuit on the printed circuit board are obtained.

Furthermore, the present invention provides a circuit design simulation system suitable for use in a printed circuit board. The above circuit design simulation system includes: a display, used To display a user interface; and a processor coupled to the display. The processor obtains a plurality of specification parameters to be provided on one of the integrated circuits of the printed circuit board via the user interface. The processor obtains the fan-out circuit of the integrated circuit on the printed circuit board according to the specification parameter to determine a process type of the printed circuit board. The processor obtains a number of printed circuit board layers and a density value required to set the integrated circuit on the printed circuit board according to the process type.

The above and other objects, features and advantages of the present invention will become more <RTIgt; A circuit design simulation system 100 suitable for use in a printed circuit board according to an embodiment of the invention. The circuit design simulation system 100 includes a processor 10, a display 20, and a storage device 30. Display 20 is used to display user interface 40. The processor 10 is coupled to the display 20, so that the user can input information about the integrated circuit to be simulated, such as the specification parameters, the product type of the integrated circuit, and the like through the user interface 40 on the display 20. After receiving the relevant information of the integrated circuit, the processor 10 executes an automated simulation program according to the relevant database stored in the storage device 30 to obtain the printing required for the integrated circuit to be set on the printed circuit board. Messages such as board count, density values, and manufacturing costs.

Figure 2 is a diagram showing a circuit design method suitable for a printed circuit board according to an embodiment of the present invention. Referring to FIG. 1 and FIG. 2 simultaneously, first, in step S202, the processor 10 can be obtained through the user interface 40. The product type of the integrated circuit to be disposed on the printed circuit board, for example, the integrated circuit is a central processing unit, a chipset, or a graphics processor. In this embodiment, the product type of the integrated circuit affects the number of layers of the printed circuit board as well as the density value. In addition, the integrated circuit is a ball grid array (BGA) wafer. Next, the processor 10 determines whether the user performs the circuit design method of the printed circuit board of this embodiment on the design layout software (for example, Allegro) (step S204). If not, the processor 10 determines that the user is performing the circuit design method of the printed circuit board of this embodiment on the interface of the World Wide Web (Web) (step S206). Next, the processor 10 starts the BGA simulator (step S208) to perform a fanout analysis to obtain a fan-out footprint of the integrated circuit (step S210). On the other hand, if the processor 10 determines that the user is performing the circuit design method of the printed circuit board of the embodiment on the design layout software (for example, Allegro), the processor 10 directly performs fan-out analysis to obtain the fan of the integrated circuit. The foot position (step S210). Next, in step S212, the processor 10 performs process analysis according to the fan-out pin of the integrated circuit to determine the process type of the printed circuit board, such as a high-density interconnect (HDI) process or a non- HDI process. Next, in step S214, the processor 10 performs density analysis according to the determined process type of the printed circuit board to obtain the number of circuit board layers and density values required to set the integrated circuit on the printed circuit board, wherein The density value indicates the space ratio of the copper foil used for the printed circuit board. Then, in step S216, the processor 10 discriminates the density value to further determine whether the layout of the integrated circuit actually on the printed circuit board is feasible. Next, in step S218, according to the discrimination result of the density value, the user can The user interface 40 is further used to further correct information about the integrated circuit (for example, the specification parameter, the product type of the integrated circuit), and the step S210 is re-executed. If the parameter is not required to be corrected, the processor 10 displays the detailed result on the user interface 40, and stores the fan-out pin, the process type, the number of printed circuit board layers, and the density value corresponding to the integrated circuit. In the storage device 30 (step S220).

Figure 3 is a flow chart showing the execution of a fan-out analysis (e.g., step S210 of Figure 2) in accordance with an embodiment of the present invention. Referring to FIG. 1 and FIG. 3 simultaneously, first, in step S302, the processor 10 obtains data of the integrated circuit, such as a product number. Next, the processor 10 determines whether the data of the integrated circuit is stored in the density simulation result database in the storage unit 30 (step S304). If so, the processor 10 obtains the density simulation result of the integrated circuit from the density simulation result database (step S306), for example, the number of printed circuit board layers to be used in the integrated circuit of the printed circuit board. The density value, the manufacturing cost, and the like, and the density simulation result is displayed on the user interface 40. If the data of the integrated circuit is not stored in the density simulation result database, the processor 10 determines whether the data of the integrated circuit is stored in the layout part database in the storage unit 30 (step S308). If so, the processor 10 obtains the fan-out pin of the integrated circuit from the layout component database (step S310), and proceeds to step 212 of FIG. If the data of the integrated circuit is not stored in the layout component database, the user can set the specification parameters of the integrated circuit through the user interface 40 (step S312). Next, the processor 10 can establish a fan-out pin according to the set specification parameters (step S314).

Figure 4 is a diagram showing a user interface according to an embodiment of the invention. 400, used to set the BGA Parameters of the integrated circuit. In the user interface 400, the user can input the product number of the integrated circuit through the field name. Therefore, in step S304 and step S308 of FIG. 3, the processor 10 can determine whether the product number BGA 645, is stored in the density simulation result database or the layout part database in the storage unit 30. If the product number BGA645 has been stored in the density simulation result database or the layout part database, it indicates that the integrated circuit has been analyzed before, and the processor 10 displays the relevant parameters and analysis results of the integrated circuit in use. Interface 40. If the product number BGA645 is not stored in the density simulation result database or the layout part database, the user can further set the specification parameters of the integrated circuit through the user interface 400. For example, the field Height is used to set the height of the integrated circuit. The field Pad is used to set the pin size of the integrated circuit. The pad to via field is used to set the pitch of the integrated circuit to the perforation. The field Need 9-Corner Padstack is used to set whether the pins of the four corners of the integrated circuit need to be increased in order to increase the weldability of the parts. In addition, the field PinCount is used to set the total number of pins of the integrated circuit. The field Pitch is used to set the pitch of the integrated circuit to the pin. The field Body is used to set the size of the integrated circuit. The field Fanout Via is used to set the perforation specification for fanout. Therefore, once the specification parameter setting of the integrated circuit is completed, the processor 10 can establish the fan-out pin of the integrated circuit according to the information of the specification parameter. Then, the processor 10 can analyze the printed circuit board process (for example, HDI or None HDI) according to the setting of the field Pitch and the field Fan out via, as shown in step S212 of FIG. In an embodiment, if analyzed according to basic design specification conditions The result is the HDI process, and the possible reason is that the value of the Pitch in the field is a little worse, resulting in the inability to place the perforation. At this time, the user can re-analyze the processor 10 by adjusting the setting of the field Pad, and then the HDI process may not be needed. Therefore, the user can adjust the set value of the parameter through the user interface 400 to obtain a combination of more analysis to ensure the lowest cost of the printed circuit board.

Figure 5 is a flow chart showing the execution of a density analysis (e.g., step S214 of Figure 2) in accordance with an embodiment of the present invention. Referring to FIG. 1 and FIG. 5 simultaneously, first, the user can set the process type printed circuit board parameters determined by step S212 of the previous FIG. 2 through the user interface 40 (step S502). Next, the processor 10 analyzes the number of board layers based on the set printed circuit board parameters (step S504). Next, the processor 10 performs density analysis according to the number of simulated circuit board layers (step S506), wherein the result obtained by the density analysis is the density value (ie, the copper foil use space ratio on the circuit board).

Figure 6 shows a user interface 600 for setting printed circuit board parameters of a printed circuit board in accordance with an embodiment of the present invention. In this embodiment, the user interface 600 displays printed circuit board parameters for non-HDI processes. In the user interface 600, the processor 10 displays the simulated number of board levels in the relevant fields. For example, the field Total Layer Count displays the total number of layers of the desired printed circuit board. The Routing Layer Count displays the number of routing layers in the printed circuit board, while the Plane Layer Count displays the number of planar layers in the printed circuit board. In addition, the field Trace Width displays the width of the traces on the printed circuit board. In this embodiment, the user can access the user interface. Face 600 adjusts the field Routing Layer Count, the field Plane Layer Count, and the field Trace Width. Processor 10 can then re-densitize the density based on the adjusted printed circuit board parameters.

Figure 7 is a diagram showing a user interface 700 for setting printed circuit board parameters of a printed circuit board in accordance with another embodiment of the present invention. In this embodiment, the user interface 700 displays printed circuit board parameters for the HDI process. Compared with the user interface 600 of FIG. 6, the user interface 700 further includes a field Laser Count and a field HDI Type. The field Laser Count is used to set the number of times the laser is performed, and the field HDI Type is used to set the type of the HDI process. Therefore, in addition to adjusting the parameter values of the field Routing Layer Count, the field Plane Layer Count and the field Trace Width, the user can select different types of HDI process for further analysis. Processor 10 can then re-densitize the density based on the adjusted printed circuit board parameters.

The density values obtained by the processor 10 and the number of printed circuit board layers are only references, and the results of this analysis do not represent that the actual layout is implementable. Therefore, in order to ensure that the results of the analysis can be applied to the actual circuit layout, the processor 10 performs density discrimination based on the layout database actually done in the past to classify the standard way of feasibility judgment. In order to retrieve the density value of the layout database actually done, the processor 10 can automatically retrieve the density value of the BGA part in the layout database. In addition, the user can also set the difficulty weight value of the layout of the BGA part. Therefore, the processor 10 can analyze and classify the data according to the density value and the difficulty weight value of the layout database actually performed, and store the result in the layout density extraction database of the storage unit 30 for density discrimination. .

Figure 8 is a flow chart showing the execution density discrimination (e.g., step S216 of Figure 2) in accordance with an embodiment of the present invention. First, the processor 10 determines whether the density value is greater than the first reference value (step S802). If so, the processor 10 determines that the density value is invalid (step S804), that is, the density value is very difficult or impossible to achieve in the actual layout. If the density value is less than or equal to the first reference value, the processor 10 further determines whether the density value is less than or equal to the second reference value (step S806), wherein the second reference value is smaller than the first reference value. If so, the processor 10 determines that the density value is valid, i.e., the density value is feasible in the actual layout (step S810). Conversely, if the density value is greater than the second reference value, the processor 10 determines that the density value is challenging in the actual layout (step S808). Thus, the user can adjust some of the parameters through the user interface 40 (step S218 of FIG. 2) so that a density value less than or equal to the second reference value can be obtained. In this embodiment, the first reference value and the second reference value are obtained from the layout density extraction database of the storage unit 30.

Referring back to FIG. 2, when the processor 10 determines that the density value is valid (step S216) and the user does not need to correct the parameters (step S218), the processor 10 according to the price of each manufacturer in the storage unit 30. The information is obtained separately for each manufacturer's manufacturing cost. Next, the processor 10 displays the detailed result on the user interface 40 (step S220). FIG. 9 is a diagram showing a user interface 900 for displaying a density data (Density Data) for performing the circuit design method of FIG. 2 according to an embodiment of the invention. In the user interface 900, the total area (Total Area) indicates the number of wiring layers in the printed circuit board and multiplied by the area of the integrated circuit. The top area indicates the body area of the integrated circuit. The Via Area indicates the total area of the perforations on the wiring layer. The Trace Area is the total area of all traces. Density is the ratio of the total area of the top layer, the area of the perforation and the area of the trace to the total area. The Cost Ratio is the lowest manufacturing cost based on the density value.

According to the circuit design method of the embodiment of the invention, the mechanism engineer and the electronic engineer are not required to provide the mechanism diagram and the circuit diagram for layout design, and the automatic simulation analysis and judgment can be performed at any time. As a result, the time-consuming and labor-intensive manual mode of operation is avoided, and an immediate and reliable price factor is provided, thereby improving the resilience of the product's real-time quote. Generally, the main factor affecting the number of printed circuit board layout layers and processes is the BGA parts selected. Once the number of layers and processes of the BGA parts are determined, the price of the entire printed circuit board is determined. Therefore, by executing the automated simulation analysis program through the processor 10, it is possible to instantly simulate and analyze various types of BGA parts used, and obtain an instant printed circuit board price. In addition, the automated simulation analysis program can be implemented in the existing layout tool or on the WEB, so it is more flexible in use.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and it is intended that the invention may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧ processor

20‧‧‧ display

30‧‧‧Storage device

40, 400, 600, 700, 900‧‧‧ user interface

100‧‧‧Circuit Design Simulation System

S202-S220, S302-S314, S502-S506, S802-S810‧‧‧ steps

1 is a circuit design simulation system suitable for a printed circuit board according to an embodiment of the invention; 2 is a circuit design method suitable for a printed circuit board according to an embodiment of the invention; FIG. 3 is a flow chart showing a fan-out analysis according to an embodiment of the invention; FIG. The user interface according to an embodiment of the invention is used to set the specification parameters of the integrated circuit; and FIG. 5 is a flow chart showing the execution density analysis according to an embodiment of the invention; A user interface according to an embodiment of the invention is used to set printed circuit board parameters of a printed circuit board; and FIG. 7 is a diagram showing a user interface for setting a printed circuit according to another embodiment of the invention. Printed circuit board parameters of the board; FIG. 8 is a flow chart showing the execution density discrimination according to an embodiment of the present invention; and FIG. 9 is a view showing a user interface according to an embodiment of the present invention for displaying Perform the density data for the circuit design method in Figure 2.

10‧‧‧ processor

20‧‧‧ display

30‧‧‧Storage device

40‧‧‧User interface

100‧‧‧Circuit Design Simulation System

Claims (16)

A circuit design method, applicable to a printed circuit board, comprising: obtaining a plurality of specification parameters of an integrated circuit to be disposed on one of the printed circuit boards via a user interface; and obtaining the integrated circuit according to the above specification parameters a fan-out board of the printed circuit board; determining a process type of the printed circuit board according to the fan-out pin position and the specification parameter; and obtaining, according to the process type, the required setting of the integrated circuit on the printed circuit board a printed circuit board layer number and a density value; determining whether the density value is valid; when the density value is valid, obtaining a density result; storing the density result, the density value, and the specification parameter to a density simulation result database And displaying the number of printed circuit board layers, the density value, and the density results described above in the user interface. The circuit design method of claim 1, wherein the step of obtaining the fan-out position includes: information on the number of pins in the specification parameter, information on the size of the chip, information on the size of the pin, and The pin-to-pitch spacing information is used to establish the above-mentioned fan-out position. The circuit design method of claim 2, wherein the step of establishing the fan-out position further comprises: determining whether the specification parameter is stored in the density simulation result database; When the specification parameter is not stored in the density simulation result database, it is determined whether the specification parameter exists in a layout part database; when the specification parameter is not stored in the layout part database, the user interface is used to set The above specification parameters; and the above fan-out pins are established according to the above-mentioned specification parameters that have been set. The circuit design method of claim 3, wherein the step of establishing the fan-out position further comprises: when the specification parameter is stored in the density simulation result database, from the density simulation result database Obtaining the above density value; and obtaining the fan-out pin from the layout part database when the specification parameter is stored in the layout part database. The circuit design method of claim 2, wherein the step of determining the type of the process further comprises: according to the fan-out pin and the pin-to-pin pitch information and the fan-out hole in the specification parameter. The information determines whether the process type of the printed circuit board is a high-density interconnect process. The circuit design method according to claim 2, wherein the step of obtaining the number of layers of the printed circuit board and the density value, further comprising: obtaining, by using the user interface, a printed circuit board corresponding to one of the process types a parameter; obtaining the number of layers of the printed circuit board according to the printed circuit board parameters; and obtaining the density value according to the number of the printed circuit board layers; wherein the density value indicates that the copper foil of the printed circuit board is empty Ratio between. The circuit design method of claim 6, wherein the printed circuit board parameters include information on the number of wiring layers, information on the number of planar layers, and information on the width of the traces. The circuit design method of claim 6, wherein the step of determining whether the density value is valid further comprises: determining that the density value is invalid when the density value is greater than a first reference value; When the value is less than a second reference value, determining that the density value is valid; and adjusting the printed circuit board parameter or the specification parameter when the density value is between the first reference value and the second reference value, In order to obtain a new density value; wherein the first reference value is greater than the second reference value. The circuit design method of claim 8, wherein the step of obtaining the density result comprises: corresponding to the number of layers of the printed circuit board, the density value, and the price information of the plurality of manufacturers, respectively The manufacturing cost of each of the above manufacturers; wherein the above density result indicates one of the above manufacturing costs, the lowest manufacturing cost. A circuit design simulation system, which is applicable to a printed circuit board, comprising: a display for displaying a user interface; and a processor coupled to the display for using the user And obtaining a plurality of specifications of the integrated circuit to be provided on one of the printed circuit boards, and obtaining the integrated circuit on one of the printed circuit boards according to the specification parameter to determine one of the printed circuit boards. a process type, and a number of printed circuit board layers and a density value required for setting the integrated circuit on the printed circuit board according to the process type; wherein when the density value is valid, the processor is based on the density value A density result is obtained and the number of printed circuit board layers, the density values, and the density results are displayed on the user interface. For example, the circuit design simulation system described in claim 10, wherein the specification parameters include information on the number of pins, information on the size of the chip, information on the size of the pins, information on the pitch of the pins to the perforations, and pin-to-connection Information on the spacing of the feet and information on the fan-outs. The circuit design simulation system of claim 11, wherein the processor determines whether the process type of the printed circuit board is based on the information of the distance between the pin and the pin and the information of the fan-out hole A high-density interconnect process. The circuit design simulation system of claim 12, wherein the processor further obtains a printed circuit board parameter corresponding to one of the process types via the user interface, and the processor is based on the printed circuit board. The number of layers of the printed circuit board and the density value are obtained by parameters, wherein the density value indicates a space ratio of copper foil used in the printed circuit board. The circuit design simulation system of claim 13, wherein the upper printed circuit board parameter includes information on the number of wiring layers, Information on the number of plane layers and information on the width of the traces. The circuit design simulation system of claim 13, wherein when the density value is greater than a first reference value, the processor determines that the density value is invalid, and when the density value is less than a second reference value, The processor determines that the density value is valid, and when the density value is between the first reference value and the second reference value, the processor obtains the adjusted printed circuit board parameter via the user interface or It is the above-mentioned specification parameter that has been adjusted to obtain a new density value, wherein the first reference value is greater than the second reference value. The circuit design simulation system of claim 15, wherein the processor is respectively corresponding to each of the above manufacturers according to the number of the printed circuit board layers, the density value, and the price information of the plurality of manufacturers. The manufacturing cost, as well as the above density results, indicates one of the above manufacturing costs, the lowest manufacturing cost.