CN103678746A - Circuit design simulation system of printed circuit board and circuit design method thereof - Google Patents
Circuit design simulation system of printed circuit board and circuit design method thereof Download PDFInfo
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- CN103678746A CN103678746A CN201210351466.7A CN201210351466A CN103678746A CN 103678746 A CN103678746 A CN 103678746A CN 201210351466 A CN201210351466 A CN 201210351466A CN 103678746 A CN103678746 A CN 103678746A
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000004088 simulation Methods 0.000 title claims description 22
- 230000008569 process Effects 0.000 claims abstract description 14
- 238000005516 engineering process Methods 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000004458 analytical method Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 9
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- 230000007246 mechanism Effects 0.000 description 3
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Abstract
The invention provides a circuit design method which is suitable for a printed circuit board. A plurality of specification parameters of an integrated circuit to be installed on the printed circuit board are obtained through a user interface. And obtaining a fan-out pin of the integrated circuit on the printed circuit board according to the specification parameters. And determining a process type of the printed circuit board according to the fan-out pin positions and the specification parameters. According to the process type, the number of layers of the printed circuit board and the density value required by arranging the integrated circuit on the printed circuit board are obtained. The design method provided by the invention can be used for automatically simulating, analyzing and judging the layer number, density value and process type of the printed circuit board, thereby replacing a time-consuming and labor-consuming manual operation mode.
Description
Technical field
The invention relates to a kind of circuit design method, and particularly about a kind of circuit design method of printed circuit board (PCB).
Background technology
In the cost of development of electronic product, the price of printed circuit board (PCB) (Printed Circuit Board, PCB) has almost accounted for whole 1/3rd to 1/2nd ratio.Therefore, the price of printed circuit board (PCB) has conclusive impact to the price of product integral body.The price of printed circuit board (PCB) depends on the layout number of plies of printed circuit board (PCB) and the technique of printed circuit board (PCB).Traditionally, must the slip-stick artist of Xian Qing mechanism and Electronics Engineer prepare related data to layout (layout) slip-stick artist, by layout slip-stick artist, see through layout tool/software again and come actual put part and wiring, the time that therefore need to spend 2 ~ 3 days just can be learnt the results such as the layout number of plies.
Therefore, need a kind of automatization simulation program can immediately carry out the sunykatuib analysis of the printed circuit board (PCB) number of plies and technique.
Summary of the invention
The invention provides a kind of circuit design method, be applicable to a printed circuit board (PCB).Via user's interface, obtain wanting being arranged on the plural specifications parameter of an integrated circuit of above-mentioned printed circuit board (PCB).According to above-mentioned specifications parameter, obtain said integrated circuit in a fan-out pin position of above-mentioned printed circuit board (PCB).According to above-mentioned fan-out pin position and above-mentioned specifications parameter, determine a technology type of above-mentioned printed circuit board (PCB).According to above-mentioned technology type, obtain arranging said integrated circuit in above-mentioned printed circuit board (PCB) required a printed circuit board (PCB) number of plies and a density value.
Moreover, the invention provides a kind of circuit design simulation system, be applicable to a printed circuit board (PCB).Foregoing circuit design simulation system comprises: a display, in order to show user's interface; And a processor, be coupled to aforementioned display device.Above-mentioned processor obtains wanting being arranged on the plural specifications parameter of an integrated circuit of above-mentioned printed circuit board (PCB) via above-mentioned user's interface.Above-mentioned processor obtains said integrated circuit in a fan-out pin position of above-mentioned printed circuit board (PCB), to determine a technology type of above-mentioned printed circuit board (PCB) according to above-mentioned specifications parameter.Above-mentioned processor obtains arranging said integrated circuit in above-mentioned printed circuit board (PCB) required a printed circuit board (PCB) number of plies and a density value according to above-mentioned technology type.
By technique scheme one of at least, can carry out automatic imitation Analysis and judgments to the printed circuit board (PCB) number of plies, density value and technology type, thereby substitute the time-consuming manual work pattern of effort again.
Accompanying drawing explanation
Fig. 1 is according to the structured flowchart of the circuit design simulation system that is applicable to a printed circuit board (PCB) described in one embodiment of the invention;
Fig. 2 is according to the process flow diagram of the circuit design method that is applicable to a printed circuit board (PCB) described in one embodiment of the invention;
Fig. 3 is the process flow diagram of analyzing according to the execution fan-out described in one embodiment of the invention;
Fig. 4 is according to the user's interface described in one embodiment of the invention, in order to set the specifications parameter of integrated circuit;
Fig. 5 is according to the process flow diagram of the execution density analysis described in one embodiment of the invention;
Fig. 6 is according to the user's interface described in one embodiment of the invention, in order to set the P.e.c. board parameter of printed circuit board (PCB);
Fig. 7 is according to the user's interface described in another embodiment of the present invention, in order to set the P.e.c. board parameter of printed circuit board (PCB);
Fig. 8 is the process flow diagram of differentiating according to the execution density described in one embodiment of the invention; And
Fig. 9 is according to the user's interface described in one embodiment of the invention, in order to show the density data of the circuit design method of execution graph 2.
Reference numeral
10～processor;
20～display;
30～storage device;
40,400,600,700,900～user interface;
100～circuit design simulation system;
S202-S220, S302-S314, S502-S506, S802-S810～step.
Embodiment
For above and other object of the present invention, feature and advantage can be become apparent, cited below particularlyly go out preferred embodiment, and coordinate appended graphicly, be described in detail below:
Embodiment:
Fig. 1 is according to the structured flowchart of the circuit design simulation system 100 that is applicable to a printed circuit board (PCB) described in one embodiment of the invention.Circuit design simulation system 100 comprises processor 10, display 20 and storage device 30.Display 20 is in order to show user's interface 40.Processor 10 is coupled to display 20, so the relevant information of the integrated circuit of the user interface 40 input wishs simulations of user on can transmission display device 20, such as the product type of specifications parameter, integrated circuit etc.After receiving the relevant information of integrated circuit, processor 10 can be carried out automatization simulation program according to the Relational database that is stored in storage device 30, to obtain wanting to be arranged on the required messages such as the printed circuit board (PCB) number of plies, density value and manufacturing cost that use of this integrated circuit of printed circuit board (PCB).
Fig. 2 is according to the process flow diagram of the circuit design method that is applicable to a printed circuit board (PCB) described in one embodiment of the invention.Simultaneously with reference to figure 1 and Fig. 2, first, at step S202, processor 10 can see through the product type that user's interface 40 obtains wanting being arranged on the integrated circuit of printed circuit board (PCB), and for example this integrated circuit is central processing unit, chipset or graphic process unit etc.In this embodiment, the product type of integrated circuit can affect the number of plies and the density value of printed circuit board (PCB).In addition, this integrated circuit is the chip of BGA Package (ball grid array, BGA).Then, processor 10 can judge whether user for example, above carries out the circuit design method (step S204) of the printed circuit board (PCB) of this embodiment at layout's software (Allegro).If not, processor 10 can judge that user is the circuit design method (step S206) of carrying out the printed circuit board (PCB) of this embodiment on the interface of world wide web (Web).Then, processor 10 can start BGA simulator (step S208), obtains the fan-out pin position (footprint) (step S210) of this integrated circuit to carry out fan-out (fanout) to analyze.Otherwise, for example, if processor 10 is judged the circuit design method of the printed circuit board (PCB) of upper this embodiment of execution of user's Shi layout's softwares (Allegro), processor 10 can directly be carried out fan-out analyses and obtain the fan-out pin position (step S210) of this integrated circuit.Then, at step S212, processor 10 can carry out industrial analysis according to the fan-out pin position of this integrated circuit, to determine the technology type of printed circuit board (PCB), for example high density intraconnections (High density interconnection, HDI) technique or non-HDI technique.Then, at step S214, processor 10 can carry out density analysis according to the technology type of determined printed circuit board (PCB), to obtain wish, this integrated circuit is arranged on to the circuit board number of plies and density value required on printed circuit board (PCB), wherein density value is the Copper Foil usage space ratio of indication printed circuit board (PCB).Then, at step S216, processor 10 can be differentiated density value, and further to judge this integrated circuit, in fact whether the layout on printed circuit board (PCB) is feasible.Then, at step S218, can be according to the differentiation result of density value, user can see through user's interface 40 and further the relevant information of integrated circuit (for example product type of specifications parameter, integrated circuit) be revised, and again performs step S210.If do not need, parameter is not revised, processor 10 can be shown in detailed results on user's interface 40, and fan-out pin position, technology type, the printed circuit board (PCB) number of plies and density value corresponding to this integrated circuit are stored in to (step S220) in storage device 30.
Fig. 3 analyzes the process flow diagram of (for example step S210 of Fig. 2) according to the execution fan-out described in one embodiment of the invention.With reference to figure 1 and Fig. 3, first, at step S302, processor 10 can obtain the data of this integrated circuit, for example production code member simultaneously.Then, processor 10 can judge whether the data of this integrated circuit are stored in the density analog result database in storage device 30 (step S304).If, processor 10 can be from obtaining the density analog result (step S306) of this integrated circuit in density analog result database, such as the required printed circuit board (PCB) number of plies, density value and the manufacturing cost etc. that use of this integrated circuit of wanting to be arranged on printed circuit board (PCB), and density analog result is presented to user's interface 40.If the data of this integrated circuit are not stored in density analog result database, processor 10 can judge whether the data of this integrated circuit are stored in the layout components database in storage device 30 (step S308).If so, processor 10 can obtain the fan-out pin position (step S310) of this integrated circuit in layout components database, and carries out the step 212 of Fig. 2.If the data of this integrated circuit are not stored in layout components database, user can see through user's interface 40 specifications parameter of this integrated circuit is set to (step S312).Then, processor 10 just can be set up fan-out pin position (step S314) according to the specifications parameter setting.
Fig. 4 is according to the user's interface 400 described in one embodiment of the invention, in order to set the specifications parameter (BGA Parameters) of integrated circuit.In user's interface 400, user can see through the production code member that field title (Name) is inputted this integrated circuit.Therefore,, in the step S304 and step S308 of Fig. 3, processor 10 just can judge whether production code member BGA645 is stored in the density analog result database or layout components database in storage device 30.If production code member BGA645 has been stored in density analog result database or layout components database, represent that this integrated circuit previously analyzed, processor 10 can be presented at the correlation parameter of this integrated circuit and analysis result on user's interface 40.If production code member BGA645 is not stored in density analog result database or layout components database, user can further set the specifications parameter of this integrated circuit through user's interface 400.For instance, field height (Height) is used for setting the height of this integrated circuit.Field Pad is used for setting the pin size of this integrated circuit.Field pad to via is used for setting the pin of this integrated circuit to the spacing of perforation.Whether the pin that field Need 9-Corner Padstack is used for setting four corners of this integrated circuit needs to increase, to increase the weldability of part.In addition, field PinCount is used for setting the pin total quantity of this integrated circuit.Field Pitch is used for setting the pin of this integrated circuit to the spacing of pin.Field Body is used for setting the size of this integrated circuit.Field Fanout Via is used for setting the perforation specification of fan-out.Therefore, once after completing the specifications parameter setting of this integrated circuit, processor 10 just can be set up according to the information of specifications parameter the fan-out pin position of this integrated circuit.Then, for example, just processor 10 can be analyzed (HDI or None HDI) to printed circuit board technology according to the setting of field Pitch and field Fan out via, as shown in the step S212 of Fig. 2.In one embodiment, if the result analyzing according to basic design specifications condition is HDI technique, possible reason be because the value difference of field Pitch little by little, cause placing due to perforation.Now, user can reanalyse once processor 10 by the setting of adjusting field Pad again, does not likely just need HDI technique.Therefore, user can see through user's interface 400 and adjust the setting value of parameter, to obtain the combination of more analyses, to guarantee the cost of minimum printed circuit board (PCB).
Fig. 5 is for example, according to the process flow diagram of the execution density analysis described in one embodiment of the invention (the step S214 of Fig. 2).With reference to figure 1 and Fig. 5, first, user can see through user's interface 40 the P.e.c. board parameter of the determined technology type of step S212 of previous Fig. 2 is set to (step S502) simultaneously.Then, processor 10 can carry out the analysis (step S504) of the circuit board number of plies according to the P.e.c. board parameter setting.Then, processor 10 can carry out density analysis (step S506) according to the circuit board number of plies of simulation, and wherein the resulting result of density analysis is density value (being Copper Foil usage space ratio on circuit board).
Fig. 6 is according to the user's interface 600 described in one embodiment of the invention, in order to set the P.e.c. board parameter (Density Parameters) of printed circuit board (PCB).In this embodiment, user's interface 600 shows the P.e.c. board parameter of non-HDI technique.In user's interface 600, the board layer digital display that processor 10 can obtain simulation is shown in relevant field.For instance, field Total Layer Count shows total number of plies of required printed circuit board (PCB).Field Routing Layer Count shows the quantity of wiring layer in printed circuit board (PCB), and field Plane Layer Count shows the quantity of printed circuit board (PCB) midplane layer.In addition, field Trace Width shows the width of printed circuit board (PCB) upward wiring.In this embodiment, user can see through user's interface 600 and adjust field Routing Layer Count, field Plane Layer Count and field Trace Width.So processor 10 can re-start density analysis according to the P.e.c. board parameter after adjusting.
Fig. 7 is according to the user's interface 700 described in another embodiment of the present invention, in order to set the P.e.c. board parameter (Density Parameters) of printed circuit board (PCB).In this embodiment, user's interface 700 shows the P.e.c. board parameter of HDI technique.Compared to user's interface 600 of Fig. 6, user's interface 700 more comprises field Laser Count and field HDI Type.Field Laser Count is used for setting the number of times that carries out laser, and field HDI Type is used for setting the kenel of HDI technique.Therefore,, except the parameter value of capable of regulating field Routing Layer Count, field Plane Layer Count and field Trace Width, user more can select the HDI technology mode of different shaped state further to analyze.So processor 10 can re-start density analysis according to the P.e.c. board parameter after adjusting.
The resulting density value of processor 10 and the printed circuit board (PCB) number of plies are reference, and the result of this analysis does not represent that actual layout is enforceable.Therefore, in order to ensure the result of analyzing, can be applicable in actual circuit layout, processor 10 can carry out density differentiation according to the actual layout database of doing of past, to sort out the standard mode of feasibility judgement.In order to capture the density value of the actual layout database of doing, processor 10 can be in layout database the density value of automatic pick-up BGA part.In addition, user also can set the difficulty weighted value of the layout of BGA part.So processor 10 can carry out analysis and the classification of data according to the density value of the actual layout database of doing and difficulty weighted value, and result is stored in the layout density extraction database of storage device 30, to carry out density differentiation.
Fig. 8 differentiates the process flow diagram of (for example step S216 of Fig. 2) according to the execution density described in one embodiment of the invention.First, processor 10 can judge whether density value is greater than the first reference value (step S802).If so, processor 10 can judge that this density value is as invalid (step S804), and this density value layout is actually very difficult or cannot reaches.If density value is less than or equal to the first reference value, processor 10 can further judge whether density value is less than or equal to the second reference value (step S806), and wherein the second reference value is less than the first reference value.If so, processor 10 can judge that this density value is as effective, and this density value layout is actually feasible (step S810).Otherwise if density value is greater than the second reference value, processor 10 can judge that this density value layout is actually tool challenging (step S808).So user can see through user's interface 40 and carry out adjustment member parameter (the step S218 of Fig. 2), to can obtain being less than or equal to the density value of the second reference value.In this embodiment, the first reference value and the second reference value are resulting from the layout density extraction database of storage device 30.
Refer back to Fig. 2, when processor 10, judge that this density value is not when effectively (step S216) and user need parameter to revise (step S218), processor 10 can obtain respectively the manufacturing cost corresponding to each manufacturer according to the pricing information of each manufacturer in storage device 30.Then, processor 10 can be presented at (step S220) on user's interface 40 by detailed results.Fig. 9 is according to the user's interface 900 described in one embodiment of the invention, in order to show the density data (Density Data) of the circuit design method of execution graph 2.In user's interface 900, entire area (Total Area) represents that the quantity of wiring layer in printed circuit board (PCB) is multiplied by the area of this integrated circuit again.Top layer area (Top Area) represents this bulk area of this integrated circuit.Perforation field (Via Area) represents the total area of boring a hole on wiring layer.Cabling area (Trace Area) represents the total area of whole cablings.Density value (Density) represents top layer area, perforation field and the summation of cabling area and the ratio of entire area.Cost ratio (Cost Ratio) is according to the resulting minimum fabrication cost of density value.
According to the circuit design method of the embodiment of the present invention, do not need the slip-stick artist of mechanism and Electronics Engineer to provide mechanism map and wiring diagram to carry out topological design, and can carry out at any time automatic imitation Analysis and judgments.Therefore, avoided the time-consuming manual work pattern of effort again, instant and reliable Price factor also can be provided simultaneously, so adaptability to changes that can improving product Flash Quote.Conventionally, the Main Factors that affects the printed circuit board layout number of plies and technique is selected BGA part, once determine the circuit board number of plies and the technique of BGA part, the price of whole printed circuit board (PCB) has also just been determined.Therefore, see through processor 10 and carry out automatization simulation routine analyzer, the BGA part of each kenel that just sunykatuib analysis is immediately used, and obtain instant printed circuit board (PCB) price.In addition, automatization simulation routine analyzer can be carried out by framework in existing layout tool, also can framework on WEB, therefore use more flexible.
Although the present invention discloses as above with preferred embodiment; so it is not in order to limit the present invention; technical field those of ordinary skill under any; without departing from the spirit and scope of the present invention; when doing a little change and retouching, so the scope that protection scope of the present invention ought define depending on claims is as the criterion.
Claims (18)
1. a circuit design method, is applicable to a printed circuit board (PCB), it is characterized in that, described method comprises:
Via user's interface, obtain wanting being arranged on the plural specifications parameter of an integrated circuit of described printed circuit board (PCB);
According to described specifications parameter, obtain described integrated circuit in a fan-out pin position of described printed circuit board (PCB);
According to described fan-out pin position and described specifications parameter, determine a technology type of described printed circuit board (PCB); And
According to described technology type, obtain arranging described integrated circuit in described printed circuit board (PCB) required a printed circuit board (PCB) number of plies and a density value.
2. circuit design method according to claim 1, is characterized in that, described method also comprises:
Judge that whether described density value is effective;
When described density value is while being effective, obtain a density result;
Store described density result, described density value and described specifications parameter to density analog result database; And
Show that the described printed circuit board (PCB) number of plies, described density value and described density result are in described user's interface.
3. circuit design method according to claim 2, is characterized in that, the step that obtains described fan-out pin position comprises:
According to the information of pin count in described specifications parameter, the information of the information of chip size, pin size and pin, to the information of spacing of perforation, are set up described fan-out pin position.
4. circuit design method according to claim 3, is characterized in that, the described step of setting up described fan-out pin position comprises:
Judging whether described specifications parameter stores is in described density analog result database;
When described specifications parameter does not store while being described density analog result database, judge whether described specifications parameter is present in a layout components database;
When described specifications parameter does not store while being described layout components database, via described user's interface, set described specifications parameter; And
According to the described specifications parameter of having set, set up described fan-out pin position.
5. circuit design method according to claim 4, is characterized in that, the described step of setting up described fan-out pin position also comprises:
When described specifications parameter has stored while being described density analog result database, from described density analog result database, obtain described density value; And
When described specifications parameter has stored while being described layout components database, from described layout components database, obtain described fan-out pin position.
6. circuit design method according to claim 3, is characterized in that, determines that the step of described technology type comprises:
According to pin in described fan-out pin position and described specifications parameter, to the information of the spacing of pin and the information of fan-out perforation, judge whether the described technology type of described printed circuit board (PCB) is a high density interconnecting process.
7. circuit design method according to claim 3, is characterized in that, the step that obtains the described printed circuit board (PCB) number of plies and described density value comprises:
Via described user's interface, obtain the P.e.c. board parameter corresponding to described technology type;
According to described P.e.c. board parameter, obtain the described printed circuit board (PCB) number of plies; And
According to the described printed circuit board (PCB) number of plies, obtain described density value;
Wherein said density value is the Copper Foil usage space ratio of the described printed circuit board (PCB) of indication.
8. circuit design method according to claim 7, is characterized in that, described P.e.c. board parameter comprises information, the information of plane layer quantity and the information of trace width of wiring layer quantity.
9. circuit design method according to claim 7, is characterized in that, described judge described density value whether effectively step comprise:
When described density value is greater than first reference value, judge that described density value is invalid;
When described density value is less than second reference value, judge that described density value is for effective; And
When described density value is between described the first reference value and described the second reference value, adjust described P.e.c. board parameter or described specifications parameter, to obtain a new density value;
Wherein said the first reference value is greater than described the second reference value.
10. circuit design method according to claim 9, is characterized in that, the step that obtains described density result comprises:
Pricing information according to the described printed circuit board (PCB) number of plies, described density value and a plurality of manufacturers, obtains respectively the manufacturing cost corresponding to manufacturer described in each;
Wherein said density result is the minimum fabrication cost in the described manufacturing cost of indication.
11. 1 kinds of circuit design simulation systems, are applicable to a printed circuit board (PCB), it is characterized in that, described simulation system comprises:
One display, in order to show user's interface; And
One processor, be coupled to described display, in order to via described user's interface, obtain wanting being arranged on an integrated circuit of described printed circuit board (PCB) plural specifications parameter, according to described specifications parameter, obtain described integrated circuit in a fan-out pin position of described printed circuit board (PCB), to determine a technology type of described printed circuit board (PCB), and obtain arranging described integrated circuit in described printed circuit board (PCB) required a printed circuit board (PCB) number of plies and a density value according to described technology type.
12. circuit design simulation systems according to claim 11, it is characterized in that, when described density value is while being effective, described processor obtains a density result according to described density value, and shows that the described printed circuit board (PCB) number of plies, described density value and described density result are in described user's interface.
13. circuit design simulation systems according to claim 12, it is characterized in that, described specifications parameter comprises the information of pin count, the information of the information of chip size, pin size, pin to the information of the spacing of perforation, pin to the information of the spacing of pin and the information of fan-out perforation.
14. circuit design simulation systems according to claim 13, it is characterized in that, described processor to the information of the spacing of pin and the information of described fan-out perforation, judges whether the described technology type of described printed circuit board (PCB) is a high density interconnecting process according to described pin.
15. circuit design simulation systems according to claim 14, it is characterized in that, described processor is more via described user's interface, and obtain the P.e.c. board parameter corresponding to described technology type, and described processor obtains the described printed circuit board (PCB) number of plies and described density value according to described P.e.c. board parameter, wherein said density value is the Copper Foil usage space ratio of the described printed circuit board (PCB) of indication.
16. circuit design simulation systems according to claim 15, is characterized in that, described P.e.c. board parameter comprises information, the information of plane layer quantity and the information of trace width of wiring layer quantity.
17. circuit design simulation systems according to claim 15, it is characterized in that, when described density value is greater than first reference value, described processor judges that described density value is invalid, when described density value is less than second reference value, described processor judges that described density value is for effective, and when described density value is between described the first reference value and described the second reference value, described processor obtains adjusted described P.e.c. board parameter or adjusted described specifications parameter via described user's interface, to obtain a new density value, wherein said the first reference value is greater than described the second reference value.
18. circuit design simulation systems according to claim 17, it is characterized in that, described processor is according to the pricing information of the described printed circuit board (PCB) number of plies, described density value and a plurality of manufacturers, and obtain respectively the manufacturing cost corresponding to manufacturer described in each, and described density result is the minimum fabrication cost in the described manufacturing cost of indication.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101133247 | 2012-09-12 | ||
| TW101133247A TWI470464B (en) | 2012-09-12 | 2012-09-12 | Circuit design simulation system and curcuit design method for pcb |
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| CN103678746A true CN103678746A (en) | 2014-03-26 |
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| CN201210351466.7A Pending CN103678746A (en) | 2012-09-12 | 2012-09-20 | Circuit design simulation system of printed circuit board and circuit design method thereof |
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| TW (1) | TWI470464B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111191407A (en) * | 2018-10-29 | 2020-05-22 | 和硕联合科技股份有限公司 | Simulation automation method |
| CN111199131A (en) * | 2018-11-20 | 2020-05-26 | 财团法人工业技术研究院 | Stretchable circuit generating device and layout method thereof |
| CN116738898A (en) * | 2023-05-04 | 2023-09-12 | 合芯科技(苏州)有限公司 | Method, device, equipment and storage medium for rapidly checking mechanism diagram |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI663522B (en) * | 2018-11-20 | 2019-06-21 | 易華電子股份有限公司 | Printed circuit board calibrating system |
| TWI716183B (en) | 2018-11-20 | 2021-01-11 | 財團法人工業技術研究院 | Stress measuring device and stress measuring method |
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| JP2000261190A (en) * | 1999-03-08 | 2000-09-22 | Suzuki Co Ltd | Method of distributing part feeders in electronic component mounting machine |
| US20030196181A1 (en) * | 2002-04-11 | 2003-10-16 | Hitachi, Ltd., Tokyo, Japan | Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes |
| CN1987437A (en) * | 2006-12-07 | 2007-06-27 | 华南理工大学 | X-ray detecting method for printed circuit board defect |
| CN101373488A (en) * | 2007-08-21 | 2009-02-25 | 京元电子股份有限公司 | Stack designing system and method for printed circuit board |
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| CN111191407B (en) * | 2018-10-29 | 2023-03-28 | 和硕联合科技股份有限公司 | Simulation automation method |
| CN111199131A (en) * | 2018-11-20 | 2020-05-26 | 财团法人工业技术研究院 | Stretchable circuit generating device and layout method thereof |
| CN111199131B (en) * | 2018-11-20 | 2023-09-22 | 财团法人工业技术研究院 | Stretchable circuit generating device and layout method thereof |
| CN116738898A (en) * | 2023-05-04 | 2023-09-12 | 合芯科技(苏州)有限公司 | Method, device, equipment and storage medium for rapidly checking mechanism diagram |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI470464B (en) | 2015-01-21 |
| TW201411384A (en) | 2014-03-16 |
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