TWI464789B - Method for adjusting work function of metal oxide film - Google Patents

Method for adjusting work function of metal oxide film Download PDF

Info

Publication number
TWI464789B
TWI464789B TW100149092A TW100149092A TWI464789B TW I464789 B TWI464789 B TW I464789B TW 100149092 A TW100149092 A TW 100149092A TW 100149092 A TW100149092 A TW 100149092A TW I464789 B TWI464789 B TW I464789B
Authority
TW
Taiwan
Prior art keywords
oxide film
metal oxide
work function
adjusting
temperature
Prior art date
Application number
TW100149092A
Other languages
Chinese (zh)
Other versions
TW201327642A (en
Inventor
Ann Kuo Chu
Wei Chen Tien
Jian An Lu
mei ying Chang
Original Assignee
Univ Nat Sun Yat Sen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Sun Yat Sen filed Critical Univ Nat Sun Yat Sen
Priority to TW100149092A priority Critical patent/TWI464789B/en
Publication of TW201327642A publication Critical patent/TW201327642A/en
Application granted granted Critical
Publication of TWI464789B publication Critical patent/TWI464789B/en

Links

Description

調整金屬氧化物薄膜功函數之方法Method for adjusting the work function of metal oxide film

  本發明係有關於一種金屬氧化物薄膜,特別係有關於一種調整金屬氧化物薄膜功函數之方法。
The present invention relates to a metal oxide film, and more particularly to a method of adjusting the work function of a metal oxide film.

  一般而言,光電元件經常使用金屬氧化物作為電極,主要原因為這些金屬氧化物具有良好之導電性與透明度,例如氧化銦錫、氧化鋅等。因此,目前市場上大量使用金屬氧化膜於各類光電元件中,例如各式太陽電池、平面顯示器、發光二極體、有機發光二極體等。就有機發光二極體而言,陽極金屬氧化膜的表面功函數須與相鄰之電洞注入層的能階相近,這樣才能使界面的能障降低,電洞才容易由陽極注入電洞傳輸層。目前業界主要是採用氧電漿處理技術來增加金屬氧化膜的表面功函數,但是這種方法所需要的設備較為昂貴與複雜(例如真空系統),且樣品的大小亦受到設備尺寸的限制,使生產成本提高。
In general, photovoltaic elements often use metal oxides as electrodes, mainly because these metal oxides have good electrical conductivity and transparency, such as indium tin oxide, zinc oxide, and the like. Therefore, metal oxide films are widely used in various types of photovoltaic elements, such as various solar cells, flat panel displays, light-emitting diodes, organic light-emitting diodes, and the like. In the case of an organic light-emitting diode, the surface work function of the anode metal oxide film must be close to that of the adjacent hole injection layer, so that the energy barrier of the interface can be reduced, and the hole can be easily transported by the anode into the hole. Floor. At present, the industry mainly uses oxygen plasma processing technology to increase the surface work function of metal oxide film, but the equipment required for this method is expensive and complicated (such as vacuum system), and the size of the sample is also limited by the size of the device. Production costs increase.

  本發明之主要目的係在於提供一種調整金屬氧化物薄膜功函數之方法,其包含提供一金屬氧化物薄膜,該金屬氧化物薄膜係具有一表面且該表面係具有一第一功函數及複數個碳污染物;提供一密閉腔體,並將該金屬氧化物薄膜置入於該密閉腔體;注入一活化物於該密閉腔體;通入一二氧化碳氣體於該密閉腔體;以及調升該密閉腔體內之壓力及溫度以使該二氧化碳氣體進入超臨界狀態,以形成一超臨界流體,該密閉腔體內之壓力係介於2000至10000 psi,該密閉腔體內之溫度係介於30至300度,該超臨界流體係可移除該氧化物薄膜之該表面的該些碳污染物並使該金屬氧化物薄膜之該表面具有一第二功函數。由於該金屬氧化物薄膜之該表面的該些碳污染物係可藉由二氧化碳超臨界方法去除,因此該金屬氧化物薄膜之該表面的功函數明顯提高,且二氧化碳超臨界方法具有無毒、無色、無臭及不產生光化學反應之特性,其係具有對環境友善、不破壞臭氧層及可回收再使用之功效,因此是非常環保的綠色製程。
The main object of the present invention is to provide a method for adjusting the work function of a metal oxide film, comprising providing a metal oxide film having a surface and having a first work function and a plurality of a carbon contaminant; providing a closed cavity, and placing the metal oxide film in the closed cavity; injecting an activator into the sealed cavity; introducing a carbon dioxide gas into the sealed cavity; and raising the The pressure and temperature in the closed chamber are such that the carbon dioxide gas enters a supercritical state to form a supercritical fluid having a pressure in the closed chamber of 2000 to 10,000 psi and a temperature in the closed chamber of 30 to 300 And the supercritical flow system removes the carbon contaminants on the surface of the oxide film and has a second work function on the surface of the metal oxide film. Since the carbon contaminants on the surface of the metal oxide film can be removed by a carbon dioxide supercritical method, the work function of the surface of the metal oxide film is significantly improved, and the carbon dioxide supercritical method is non-toxic, colorless, It is odorless and does not produce photochemical reactions. It is environmentally friendly and green. It is environmentally friendly, does not destroy the ozone layer and is recyclable.

  請參閱第1圖及第2A至第2F圖,其係本發明之一較佳實施例,一種調整金屬氧化物薄膜功函數之方法係包含下列步驟:首先,請參閱第1圖之步驟10及2A圖,提供一金屬氧化物薄膜110,該金屬氧化物薄膜110係具有一表面111且該表面111係具有一第一功函數及複數個碳污染物111a,在本實施例中,該金屬氧化物薄膜110係設置於一基板S上,且該金屬氧化物薄膜110係可選自於銦錫氧化物(ITO)、氧化鍗錫(ATO)、氧化鋁鋅(AZO)、氧化錫SnO、氧化鋅(ZnO)其中之一;接著,請參閱第1圖之步驟11及2B圖,提供一密閉腔體A,並將該金屬氧化物薄膜110置入於該密閉腔體A;之後,請參閱第1圖之步驟12及2C圖,注入一活化物B於該密閉腔體A,該活化物B係可選自於乙醇、異丙醇、丙酮、丁酮等有機溶劑、雙氧水或酸鹼性水溶其中之一,在本實施例中,該活化物B係為雙氧水;接著,請參閱第1圖之步驟13及2D圖,通入一二氧化碳氣體C於該密閉腔體A;之後,請參閱第1圖之步驟14及2E圖,調升該密閉腔體A內之壓力及溫度以使該二氧化碳氣體C進入超臨界狀態,以形成一超臨界流體F,該密閉腔體A內之壓力係介於2000至10000 psi,該密閉腔體A內之溫度係介於30至300度,且調升該密閉腔體A內之溫度之時間係不小於15分鐘,較佳地,在本實施例中,該密閉腔體A內之壓力係為4000 psi,該密閉腔體A內之溫度係為85度,調升該密閉腔體A內之溫度之時間係為15分鐘,該超臨界流體F係可移除該氧化物薄膜之該表面111的該些碳污染物111a並使該金屬氧化物薄膜110之該表面111具有一第二功函數且該第二功函數係大於該第一功函數;最後,請參閱第1圖之步驟15及2F圖,調降該密閉腔體A內之壓力及溫度以使該超臨界流體F氣化而與該金屬氧化物薄膜110分離,且該超臨界流體F氣化時可同時帶走該些碳污染物111a。






  接著,請參閱表1、表2及附件1,由表1、表2及附件1可知,由於該金屬氧化物薄膜110之該表面111的該些碳污染物111a係可藉由二氧化碳超臨界方法去除,因此該金屬氧化物薄膜110之該表面111的功函數明顯提高,且二氧化碳超臨界方法具有無毒、無色、無臭及不產生光化學反應之特性,其係具有對環境友善、不破壞臭氧層及可回收再使用之功效,因此是非常環保的綠色製程,再者,本發明係利用二氧化碳超臨界方法去除該些碳污染物111a且該些碳污染物111a之去除效率和氧電漿處理技術之去除效率相當,但成本相對於氧電漿處理技術相對便宜,因此本發明更具有節省生產成本之功效。
  此外,請參閱第3圖,當該金屬氧化物薄膜110應用於一有機發光二極體元件(OrganicLight-Emitting Diode,OLED)上時(圖未繪出),其係為一陽極材料,且該有機發光二極體元件使用該金屬氧化物薄膜110當陽極材料時所測得之數據顯示(如第3圖所示),該金屬氧化物薄膜110經過二氧化碳超臨界方法處理後,測試使用經過二氧化碳超臨界方法處理之該金屬氧化物薄膜110的有機發光二極體元件之電流密度及亮度並不遜色於使用經過氧電漿處理之金屬氧化物薄膜的有機發光二極體元件,且經過二氧化碳超臨界方法處理之該金屬氧化物薄膜110的有機發光二極體元件之電流密度及亮度遠遠超越未處理之金屬氧化物薄膜的有機發光二極體元件之電流密度及亮度,因此可知二氧化碳超臨界方法不需複雜設備與真空系統,即可運用於大面積之光電元件製造,且可有效改善元件的特性,並降低元件之接面阻抗及有效降低元件之操作電壓,以達成省電、增加效率等功效。
  本發明之保護範圍當視後附之申請專利範圍所界定者為準,任何熟知此項技藝者,在不脫離本發明之精神和範圍內所作之任何變化與修改,均屬於本發明之保護範圍。
Referring to FIG. 1 and FIGS. 2A to 2F, which are a preferred embodiment of the present invention, a method for adjusting the work function of a metal oxide film includes the following steps: First, refer to step 10 of FIG. 1 and 2A, a metal oxide film 110 is provided, the metal oxide film 110 having a surface 111 having a first work function and a plurality of carbon contaminants 111a. In the present embodiment, the metal oxide is oxidized. The film 110 is disposed on a substrate S, and the metal oxide film 110 is selected from the group consisting of indium tin oxide (ITO), antimony tin oxide (ATO), aluminum zinc oxide (AZO), tin oxide SnO, and oxidation. One of zinc (ZnO); next, please refer to steps 11 and 2B of FIG. 1 to provide a closed cavity A, and the metal oxide film 110 is placed in the sealed cavity A; In steps 12 and 2C of Fig. 1, an activator B is injected into the closed chamber A. The activator B can be selected from organic solvents such as ethanol, isopropanol, acetone, methyl ethyl ketone, hydrogen peroxide or acidity. One of the water-soluble ones, in the present embodiment, the activator B is hydrogen peroxide; Referring to steps 13 and 2D of Fig. 1, a carbon dioxide gas C is introduced into the sealed chamber A; after that, please refer to steps 14 and 2E of Fig. 1 to raise the pressure and temperature in the closed chamber A. The carbon dioxide gas C is brought into a supercritical state to form a supercritical fluid F. The pressure in the closed chamber A is between 2000 and 10,000 psi, and the temperature in the closed chamber A is between 30 and 300 degrees. And the time for raising the temperature in the sealed cavity A is not less than 15 minutes. Preferably, in the embodiment, the pressure in the closed cavity A is 4000 psi, and the sealed cavity A is The temperature is 85 degrees, and the time for raising the temperature in the sealed chamber A is 15 minutes. The supercritical fluid F can remove the carbon contaminants 111a of the surface 111 of the oxide film and The surface 111 of the metal oxide film 110 has a second work function and the second work function is greater than the first work function; finally, please refer to steps 15 and 2F of FIG. 1 to lower the closed cavity A. The pressure and temperature therein are such that the supercritical fluid F is vaporized to be separated from the metal oxide film 110, and the super-impact The fluid F may simultaneously take away these contaminants carbon gasification 111a.






Next, please refer to Table 1, Table 2 and Annex 1. As can be seen from Table 1, Table 2 and Annex 1, the carbon contaminants 111a of the surface 111 of the metal oxide film 110 can be supercritical by carbon dioxide. Therefore, the work function of the surface 111 of the metal oxide film 110 is significantly improved, and the carbon dioxide supercritical method has the characteristics of being non-toxic, colorless, odorless, and non-photochemically reactive, and is environmentally friendly and does not destroy the ozone layer. The utility model can be recycled and reused, so it is a very environmentally friendly green process. Furthermore, the present invention utilizes a carbon dioxide supercritical method to remove the carbon pollutants 111a and the removal efficiency of the carbon pollutants 111a and the oxygen plasma treatment technology. The removal efficiency is comparable, but the cost is relatively cheap compared to the oxygen plasma treatment technology, so the present invention has the effect of saving production costs.
In addition, referring to FIG. 3, when the metal oxide film 110 is applied to an Organic Light-Emitting Diode (OLED) (not shown), it is an anode material, and the The organic light-emitting diode element is displayed using the metal oxide film 110 as an anode material (as shown in FIG. 3), and the metal oxide film 110 is subjected to a carbon dioxide supercritical method and then tested for carbon dioxide. The current density and brightness of the organic light-emitting diode element of the metal oxide film 110 processed by the supercritical method are not inferior to the organic light-emitting diode element using the oxygen plasma-treated metal oxide film, and the carbon dioxide is super The current density and brightness of the organic light-emitting diode element of the metal oxide film 110 processed by the critical method far exceed the current density and brightness of the organic light-emitting diode element of the untreated metal oxide film, so that the carbon dioxide supercritical is known The method can be applied to the manufacture of large-area photovoltaic components without complicated equipment and vacuum system, and can effectively improve the element. Characteristics, and reduce the surface impedance of the element and effectively reduce the operating voltage of the element, to achieve energy saving, increased efficiency and other effects.
The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. .

10...提供一金屬氧化物薄膜,該金屬氧化物薄膜係具有一表面且該表面係具有一第一功函數及複數個碳污染物10. . . Providing a metal oxide film having a surface and having a first work function and a plurality of carbon contaminants

11...提供一密閉腔體,並將該金屬氧化物薄膜置入於該密閉腔體11. . . Providing a sealed cavity and placing the metal oxide film in the closed cavity

12...注入一活化物於該密閉腔體12. . . Injecting an activator into the closed cavity

13...通入一二氧化碳氣體於該密閉腔體13. . . Passing a carbon dioxide gas into the closed cavity

14...調升該密閉腔體內之壓力及溫度以使該二氧化碳氣體進入超臨界狀態,以形成一超臨界流體,該密閉腔體內之壓力係介於2000至10000psi,該密閉腔體內之溫度係介於30至300度,該超臨界流體係可移除該氧化物薄膜之該表面的該些碳污染物並使該金屬氧化物薄膜之該表面具有一第二功函數14. . . Increasing the pressure and temperature in the closed chamber to cause the carbon dioxide gas to enter a supercritical state to form a supercritical fluid having a pressure in the closed chamber of 2000 to 10,000 psi and a temperature in the closed chamber of 30 Up to 300 degrees, the supercritical flow system can remove the carbon contaminants on the surface of the oxide film and have a second work function on the surface of the metal oxide film

15‧‧‧調降該密閉腔體內之壓力及溫度以使該超臨界流體氣化而與該金屬氧化物薄膜分離,且該超臨界流體氣化時可同時帶走該些碳污染物15‧‧‧Reducing the pressure and temperature in the closed chamber to vaporize the supercritical fluid to separate from the metal oxide film, and the supercritical fluid can simultaneously take away the carbon pollutants during gasification

110‧‧‧金屬氧化物薄膜110‧‧‧Metal oxide film

111‧‧‧表面111‧‧‧ surface

111a‧‧‧碳污染物111a‧‧‧Carbon pollutants

A‧‧‧密閉腔體A‧‧‧Closed cavity

B‧‧‧活化物B‧‧‧activator

C‧‧‧二氧化碳氣體C‧‧‧Carbon dioxide gas

F‧‧‧超臨界流體F‧‧‧Supercritical fluid

S‧‧‧基板S‧‧‧Substrate

第1圖:依據本發明之一較佳實施例,一種調整金屬氧化物薄膜功函數之方法流程圖。
第2A至第2F圖:依據本發明之一較佳實施例,該調整金屬氧化物薄膜功函數之方法截面示意圖。
第3圖:依據本發明之一較佳實施例,未處理之金屬氧化物薄膜、經由二氧化碳超臨界流體處理之金屬氧化物薄膜及經由氧電漿處理之金屬氧化物薄膜設置於有機發光二極體所測得之電流密度及亮度之示意圖。
附件1:依據本發明之一較佳實施例,未處理之金屬氧化物薄膜接觸角、經由二氧化碳超臨界流體處理之金屬氧化物薄膜接觸角及經由氧電漿處理之金屬氧化物薄膜接觸角之照片示意圖。
Figure 1 is a flow chart showing a method of adjusting the work function of a metal oxide film in accordance with a preferred embodiment of the present invention.
2A to 2F are schematic cross-sectional views showing a method of adjusting a work function of a metal oxide film according to a preferred embodiment of the present invention.
Figure 3: According to a preferred embodiment of the present invention, an untreated metal oxide film, a metal oxide film treated by a carbon dioxide supercritical fluid, and a metal oxide film treated via an oxygen plasma are disposed on the organic light emitting diode Schematic diagram of current density and brightness measured by the body.
Annex 1 : Contact angle of untreated metal oxide film, contact angle of metal oxide film treated by carbon dioxide supercritical fluid, and contact angle of metal oxide film treated by oxygen plasma according to a preferred embodiment of the present invention Photo illustration.

10...提供一金屬氧化物薄膜,該金屬氧化物薄膜係具有一表面且該表面係具有一第一功函數及複數個碳污染物10. . . Providing a metal oxide film having a surface and having a first work function and a plurality of carbon contaminants

11...提供一密閉腔體,並將該金屬氧化物薄膜置入於該密閉腔體11. . . Providing a sealed cavity and placing the metal oxide film in the closed cavity

12...注入一活化物於該密閉腔體12. . . Injecting an activator into the closed cavity

13...通入一二氧化碳氣體於該密閉腔體13. . . Passing a carbon dioxide gas into the closed cavity

14...調升該密閉腔體內之壓力及溫度以使該二氧化碳氣體進入超臨界狀態,以形成一超臨界流體,該密閉腔體內之壓力係介於2000至10000 psi,該密閉腔體內之溫度係介於30至300度,該超臨界流體係可移除該氧化物薄膜之該表面的該些碳污染物並使該金屬氧化物薄膜之該表面具有一第二功函數14. . . Increasing the pressure and temperature in the closed chamber to cause the carbon dioxide gas to enter a supercritical state to form a supercritical fluid having a pressure between 2000 and 10,000 psi, and the temperature in the closed chamber is between 30 to 300 degrees, the supercritical flow system can remove the carbon contaminants on the surface of the oxide film and have a second work function on the surface of the metal oxide film

15...調降該密閉腔體內之壓力及溫度以使該超臨界流體氣化而與該金屬氧化物薄膜分離,且該超臨界流體氣化時可同時帶走該些碳污染物15. . . Decreasing the pressure and temperature in the closed chamber to vaporize the supercritical fluid to separate from the metal oxide film, and simultaneously extracting the carbon pollutants when the supercritical fluid is vaporized

Claims (5)

一種調整金屬氧化物薄膜功函數之方法,其至少包含:提供一金屬氧化物薄膜,該金屬氧化物薄膜係具有一表面且該表面係具有一第一功函數及複數個碳污染物;提供一密閉腔體,並將該金屬氧化物薄膜置入於該密閉腔體;注入一活化物於該密閉腔體;通入一二氧化碳氣體於該密閉腔體;以及調升該密閉腔體內之壓力及溫度以使該二氧化碳氣體進入超臨界狀態,以形成一超臨界流體,該密閉腔體內之壓力係介於2000至10000psi,該密閉腔體內之溫度係介於30至300度,該超臨界流體係可移除該氧化物薄膜之該表面的該些碳污染物並使該金屬氧化物薄膜之該表面具有一第二功函數,該第二功函數係大於該第一功函數。 A method for adjusting a work function of a metal oxide film, comprising: providing a metal oxide film having a surface and having a first work function and a plurality of carbon contaminants; Sealing the cavity, and placing the metal oxide film in the sealed cavity; injecting an activator into the sealed cavity; introducing a carbon dioxide gas into the sealed cavity; and raising the pressure in the sealed cavity and The temperature is such that the carbon dioxide gas enters a supercritical state to form a supercritical fluid having a pressure in the closed chamber of 2000 to 10,000 psi and a temperature in the closed chamber of 30 to 300 degrees. The supercritical flow system The carbon contaminants of the surface of the oxide film may be removed and the surface of the metal oxide film has a second work function, the second work function being greater than the first work function. 如申請專利範圍第1項所述之調整金屬氧化物薄膜功函數之方法,其另包含有一調降該密閉腔體內之壓力及溫度以使該超臨界流體氣化而與該金屬氧化物薄膜分離之步驟,且該超臨界流體氣化時可同時帶走該些碳污染物。 The method for adjusting a work function of a metal oxide film according to claim 1, further comprising a step of reducing a pressure and a temperature in the sealed chamber to vaporize the supercritical fluid to separate from the metal oxide film. The step of, and the supercritical fluid can simultaneously take away the carbon contaminants when vaporizing. 如申請專利範圍第1項所述之調整金屬氧化物薄膜功函數之方法,其中該金屬氧化物薄膜係可選自於銦錫氧化物(ITO)、氧化鍗錫(ATO)、氧化鋁鋅(AZO)、氧化錫SnO、氧化鋅(ZnO)其中之一。 The method for adjusting a work function of a metal oxide film according to claim 1, wherein the metal oxide film is selected from the group consisting of indium tin oxide (ITO), antimony tin oxide (ATO), and aluminum zinc oxide ( One of AZO), tin oxide SnO, and zinc oxide (ZnO). 如申請專利範圍第1項所述之調整金屬氧化物薄膜功函數之方法,其中該活化物係可選自於乙醇、異丙醇、丙酮、丁酮等有機溶劑、雙氧水或酸鹼性水溶其中之一。 The method for adjusting the work function of a metal oxide film according to claim 1, wherein the activator is selected from the group consisting of organic solvents such as ethanol, isopropanol, acetone, methyl ethyl ketone, hydrogen peroxide or acid alkaline water. one. 如申請專利範圍第1項所述之調整金屬氧化物薄膜功函數之方法,其中調升該密閉腔體內之溫度之時間係不小於15分鐘。The method for adjusting the work function of a metal oxide film according to claim 1, wherein the time for raising the temperature in the sealed chamber is not less than 15 minutes.
TW100149092A 2011-12-28 2011-12-28 Method for adjusting work function of metal oxide film TWI464789B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100149092A TWI464789B (en) 2011-12-28 2011-12-28 Method for adjusting work function of metal oxide film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100149092A TWI464789B (en) 2011-12-28 2011-12-28 Method for adjusting work function of metal oxide film

Publications (2)

Publication Number Publication Date
TW201327642A TW201327642A (en) 2013-07-01
TWI464789B true TWI464789B (en) 2014-12-11

Family

ID=49225174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100149092A TWI464789B (en) 2011-12-28 2011-12-28 Method for adjusting work function of metal oxide film

Country Status (1)

Country Link
TW (1) TWI464789B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1329575A (en) * 1998-11-09 2002-01-02 美商纳克公司 Metal oxide particles
TW200718775A (en) * 2005-08-29 2007-05-16 Advanced Tech Materials Composition and method for removing thick film photoresist
US20090233398A1 (en) * 2008-03-13 2009-09-17 Battelle Energy Alliance, Llc Methods for forming particles from single source precursors, methods of forming semiconductor devices, and devices formed using such methods
TW201041040A (en) * 2009-05-01 2010-11-16 Univ Nat Sun Yat Sen Method for forming nano-pores on transparent conductive oxide film
TW201111273A (en) * 2009-09-28 2011-04-01 Univ Nat Sun Yat Sen Method to prepare nano-structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1329575A (en) * 1998-11-09 2002-01-02 美商纳克公司 Metal oxide particles
TW200718775A (en) * 2005-08-29 2007-05-16 Advanced Tech Materials Composition and method for removing thick film photoresist
US20090233398A1 (en) * 2008-03-13 2009-09-17 Battelle Energy Alliance, Llc Methods for forming particles from single source precursors, methods of forming semiconductor devices, and devices formed using such methods
TW201041040A (en) * 2009-05-01 2010-11-16 Univ Nat Sun Yat Sen Method for forming nano-pores on transparent conductive oxide film
TW201111273A (en) * 2009-09-28 2011-04-01 Univ Nat Sun Yat Sen Method to prepare nano-structure

Also Published As

Publication number Publication date
TW201327642A (en) 2013-07-01

Similar Documents

Publication Publication Date Title
US20080146011A1 (en) Method of forming self-assembled monolayer on ito film
JP2013157601A5 (en)
WO2006083778A3 (en) Selective plasma re-oxidation process using pulsed rf source power
JP2015528179A5 (en)
TW200715386A (en) Method for removing organic electroluminescent residues from a substrate
CN103594661A (en) Manufacturing method of positive electrode of organic light emitting diode
Zhang et al. Ultra-smooth and robust graphene-based hybrid anode for high-performance flexible organic light-emitting diodes
TWI464789B (en) Method for adjusting work function of metal oxide film
CN105489668B (en) A kind of solar cell and its amorphous silicon hydride i film surface processing methods
Kim et al. Work function modification of indium–tin oxide by surface plasma treatments using different gases
CN105355803B (en) A kind of modified ito anode and its preparation method and application
CN103824975A (en) Method for improving ITO layer hole injection efficiency and anode structure of display device
KR20150120837A (en) Method for manufacturing inverted oled
CN103730595A (en) Organic light-emitting device and preparation method thereof
CN101335204B (en) Surface processing method of p type gallium nitride
TW200731860A (en) Organic light emitting device having surface-treated bottom electrode
Kim et al. Simultaneous plasma and thermal treatments of ITO surfaces for organic solar cells
CN103730593A (en) Organic light-emitting device and preparation method thereof
CN103427035A (en) Organic electroluminescence device and method for manufacturing same
CN102709490A (en) Method for processing solution of transparent oxide electrode of organic optoelectronic device
CN103855316B (en) A kind of organic electroluminescence device and preparation method thereof
Kim et al. High-performance organic light emitting diodes fabricated with a ruthenium oxide hole injection layer
CN103801532A (en) Treatment process for ITO (indium tin oxid) thin film
CN113471368B (en) Transparent electrode with adjustable work function, preparation method and application thereof, and organic solar cell
WO2007023789A8 (en) Organic el device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees