TWI464342B - - Google Patents

Info

Publication number
TWI464342B
TWI464342B TW101120283A TW101120283A TWI464342B TW I464342 B TWI464342 B TW I464342B TW 101120283 A TW101120283 A TW 101120283A TW 101120283 A TW101120283 A TW 101120283A TW I464342 B TWI464342 B TW I464342B
Authority
TW
Taiwan
Application number
TW101120283A
Other languages
Chinese (zh)
Other versions
TW201350736A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101120283A priority Critical patent/TW201350736A/zh
Publication of TW201350736A publication Critical patent/TW201350736A/zh
Application granted granted Critical
Publication of TWI464342B publication Critical patent/TWI464342B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
TW101120283A 2012-06-06 2012-06-06 雙向發光器件 TW201350736A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101120283A TW201350736A (zh) 2012-06-06 2012-06-06 雙向發光器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101120283A TW201350736A (zh) 2012-06-06 2012-06-06 雙向發光器件

Publications (2)

Publication Number Publication Date
TW201350736A TW201350736A (zh) 2013-12-16
TWI464342B true TWI464342B (cg-RX-API-DMAC7.html) 2014-12-11

Family

ID=50157929

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101120283A TW201350736A (zh) 2012-06-06 2012-06-06 雙向發光器件

Country Status (1)

Country Link
TW (1) TW201350736A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11213937B1 (en) 2020-09-22 2022-01-04 Snap-On Incorporated Tool illumination source

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200800512A (en) * 2006-06-21 2008-01-01 Kabo Tool Co Hand tool warning device
TWM336121U (en) * 2007-12-28 2008-07-11 Eclatorq Technology Co Ltd Digital tool with light display
TWI303492B (cg-RX-API-DMAC7.html) * 2005-06-03 2008-11-21 Pai Ling Sung
TW200924232A (en) * 2007-11-26 2009-06-01 Lin Pin Ya Light emitting diode capable of radiating light and dissipating heat in dual directions
TW200941753A (en) * 2008-03-18 2009-10-01 Lin Pin Ya LED light panel structure having a patch bracket
TW201015696A (en) * 2008-10-09 2010-04-16 Helio Optoelectronics Corp Alternative-current (AC) lighting emitting diode (LED) structure
TWM405341U (en) * 2010-12-09 2011-06-11 Sunheng Technology Co Ltd Liquid crystal display module for digital torque wrench
TWM407463U (en) * 2010-10-01 2011-07-11 Cing-Syu Wu Multi-functional advertising LED light base and decoration device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI303492B (cg-RX-API-DMAC7.html) * 2005-06-03 2008-11-21 Pai Ling Sung
TW200800512A (en) * 2006-06-21 2008-01-01 Kabo Tool Co Hand tool warning device
TW200924232A (en) * 2007-11-26 2009-06-01 Lin Pin Ya Light emitting diode capable of radiating light and dissipating heat in dual directions
TWM336121U (en) * 2007-12-28 2008-07-11 Eclatorq Technology Co Ltd Digital tool with light display
TW200941753A (en) * 2008-03-18 2009-10-01 Lin Pin Ya LED light panel structure having a patch bracket
TW201015696A (en) * 2008-10-09 2010-04-16 Helio Optoelectronics Corp Alternative-current (AC) lighting emitting diode (LED) structure
TWM407463U (en) * 2010-10-01 2011-07-11 Cing-Syu Wu Multi-functional advertising LED light base and decoration device
TWM405341U (en) * 2010-12-09 2011-06-11 Sunheng Technology Co Ltd Liquid crystal display module for digital torque wrench

Also Published As

Publication number Publication date
TW201350736A (zh) 2013-12-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees