TWI462634B - Organic light emitting diode (oled) cover substrate, display panel and manufacturing method - Google Patents

Description

Cover substrate and display panel of organic light-emitting diode and manufacturing method thereof

The invention relates to a cover substrate and a display panel and a manufacturing method thereof for an Organic Light-Emitting Diode (OLED), and in particular to a cover substrate of an organic light-emitting diode with a desiccant And display panel and manufacturing method.

The development of science and technology is one thousand miles. In today's electronic devices, display panels are almost indispensable to expand the functions of electronic devices. Among them, the display panel of the Organic Light-Emitting Diode (OLED) has a development potential in various types of display panels due to its self-luminous characteristics.

An OLED display panel generally includes an OLED substrate and a cover substrate. The cover substrate has a recess for receiving the OLED stack structure of the OLED substrate and a desiccant. The desiccant is disposed on the groove and used to absorb moisture of the OLED display panel. However, in an OLED display panel, the desiccant easily contacts the OLED stack structure and breaks the OLED stack structure. One solution currently used in the industry is to increase the depth of the groove to prevent the desiccant from contacting the OLED stack structure. This method causes the thickness of the cover substrate to become thin, resulting in a decrease in the strength of the OLED display panel. Further, when the OLED display panel is developed toward a large size, the thin cover substrate is easily broken by the deformation of the desiccant.

Another conventional solution is to form a protective layer on the OLED stack structure. This method is time consuming and increases the manufacturing time and cost of the OLED display panel.

Therefore, how to economically and effectively prevent the desiccant from damaging the OLED stack structure is one of the problems that the current OLED display panel technology needs to overcome.

The invention relates to a cover substrate, a display panel and a manufacturing method of an Organic Light-Emitting Diode (OLED), which utilize a buffer element to avoid physical damage or chemical damage of the OLED stack structure. The OLED display panel is provided to provide the best quality.

According to the present invention, a capping substrate for an OLED is provided for forming an OLED display panel with an OLED substrate. The cover substrate includes a bottom plate, a desiccant and a cushioning member. The bottom plate has a recess. The desiccant is disposed on one of the bottom surfaces of the recess. The desiccant has a first thickness. The cushioning member is disposed on the bottom surface of the recess in a manner that does not contact the desiccant, and the cushioning member has a second thickness which is greater than the first thickness.

According to the present invention, an OLED display panel is further provided, comprising an OLED substrate and a cover substrate. The cover substrate is used to align with the OLED substrate. The cover substrate includes a bottom plate, a desiccant and a cushioning member. The bottom plate of the cover substrate has a recess. The desiccant is disposed on one of the bottom surfaces of the recess. The desiccant has a first thickness. The cushioning member is disposed on the bottom surface of the recess in a manner that does not contact the desiccant, and the cushioning member has a second thickness which is greater than the first thickness.

According to the present invention, a method of manufacturing an OLED display panel is further proposed. First, a capping substrate of an OLED is provided, and a bottom plate of the capping substrate has a groove. Next, a desiccant is disposed on one of the bottom surfaces of the recess, and the desiccant has a first thickness. Next, a buffer member is formed on the bottom surface without contacting the desiccant, and the buffer member has a second thickness, and the second thickness is greater than the first thickness. Then, the cap substrate and an OLED substrate are assembled to form an OLED display panel, wherein the OLED substrate has an OLED stack structure.

According to the present invention, a method of fabricating an OLED display panel is further proposed. First, a capping substrate of an OLED is provided, and a bottom plate of the capping substrate has a groove. Next, a desiccant is disposed on one of the bottom surfaces of the recess, and the desiccant has a first thickness. Furthermore, a gel material is provided on the bottom plate of the capping substrate in a manner that does not contact the desiccant, and the gel material is located on the bottom surface and outside the groove. Then, the OLED substrate and the capping substrate are paired and bonded by a part of the gel material outside the groove. Thereafter, the gelatinous material is cured, and a portion of the gelatinous material on the bottom surface forms a cushioning member having a second thickness, the second thickness being greater than the first thickness.

In order to make the above-mentioned contents of the present invention more comprehensible, the preferred embodiments are described below, and the detailed description is as follows:

The invention relates to an organic light-emitting diode (OLED) display panel, comprising an OLED capping substrate and an OLED substrate. The OLED display panel is formed by a pair of two substrates. The cover substrate includes a bottom plate, a desiccant and a cushioning member. Wherein, the bottom plate has a groove. The desiccant is disposed on one of the bottom surfaces of the recess. The desiccant has a first thickness. The cushioning member is disposed on the bottom surface of the groove in a manner not contacting the desiccant, and the cushioning member has a second thickness, and the second thickness is greater than the first thickness. According to the above manner, the OLED display panel can prevent the desiccant from contacting and destroying the OLED stack structure of one of the OLED substrates.

The following is a description of the specific embodiments of the OLED display panel and the method of manufacturing the same according to the present invention. The contents of the embodiments are merely illustrative of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention is based on the scope of the patent application. Furthermore, the illustrations of the embodiments are drawn to clearly illustrate the features of the present invention, and the shapes and sizes of the various elements are not limited to the aspects disclosed. In addition, the illustration of the embodiments also omits unnecessary elements to clearly show the technical features of the present invention.

First embodiment

Referring to FIG. 1, a cross-sectional view of an OLED display panel in accordance with a first embodiment of the present invention is shown. The OLED display panel 10 includes a capping substrate 100 and an OLED substrate 200. The OLED substrate 200 includes a transparent substrate 210 and an OLED stack structure 230. The cover substrate 100 includes a bottom plate 110, a desiccant 130, and a cushioning member 150. The bottom plate 110 has a recess 111. The desiccant 130 is disposed on one of the bottom surfaces 111a of the recess 111. The desiccant 130 has a first thickness D10. The buffering element 150 is disposed on the bottom surface 111a of the groove 111 without contacting the desiccant 130. The buffering element 150 has a second thickness D30, and the second thickness D30 is greater than the first thickness D10, wherein D30 is greater than the better gap of D10. It is 0.01mm or more.

In this embodiment, the OLED stack structure 230 of the OLED substrate 200 is disposed on the transparent substrate 210. In general, the OLED stack structure 230 includes a hole-injection layer (HIL) 231, a hole-transport layer (HTL) 233, an emissive layer 235, and an electron transport layer. (electron-transport layer, ETL) 237 and conductive layer 239. In addition, the transparent substrate 210 may further have a transparent conductive layer, such as an Indium Tin Oxide (ITO) layer. A ray 90 is produced by the OLED stack structure 230 exiting the OLED display panel 10 via the transparent substrate 210.

Please refer to FIG. 2 at the same time. FIG. 2 is a perspective view of the cover substrate of the OLED display panel of FIG. 1 . The cover substrate 100 further includes a sealant 170. The sealant 170 is disposed on the outer edge 110A of the bottom plate 110 and is on the same side as the groove 111, and the sealant 170 is wrapped around the groove 111. The cover substrate 100 and the OLED substrate 200 are hermetically bonded by the sealant 170. After the capping substrate 100 and the OLED substrate 200 are hermetically bonded through the sealant 170, the bottom surface 111a of the recess 111 to the OLED stack structure 230 of the OLED substrate 200 has a distance D50. Preferably, the second thickness D30 of the cushioning member 150 is substantially smaller than the distance D50.

Further, the cushioning member 150 is an elastic material such as an elastic plastic which absorbs impact force by deformation. When the OLED display panel 10 is subjected to an external force to deform the groove 111, since the second thickness D30 of the cushioning member 150 is greater than the first thickness D10 of the desiccant 130, the cushioning member 150 is the most in all the components of the capping substrate 100. The OLED stack structure 230 is first contacted. Since the cushioning element 150 can absorb the impact force, it does not damage the OLED stack structure 230. According to the above manner, the OLED display panel 10 can be protected by the cushioning member 150 when subjected to physical deformation due to an external force. In addition, the material of the conductive layer 239 at the top of the OLED stack structure 230 is usually aluminum metal (Al), which is easily deteriorated by chemical reaction with moisture. The desiccant 130 is used to absorb water vapor in a space S10 (shown in FIG. 1 ) defined between the recess 111 of the cover substrate 100 and the OLED substrate 200 to prevent moisture from adhering to the conductive layer 239 . . Therefore, the desiccant 130 itself has a higher humidity than the other elements of the space S10. The buffering member 150 having the second second thickness D30 prevents the desiccant 130 having the smaller first thickness D10 from contacting the OLED stack structure 230, avoiding the moisture on the conductive layer 239 and the desiccant 130, or The desiccant 130 itself produces a chemical change. The OLED stack structure 230 is allowed to maintain the original excellent electrical properties. Therefore, the cushioning member 150 can also prevent the OLED display panel 10 from being subjected to chemical damage.

Regarding the material of the cushioning member 150, it may include epoxy resin or rubber or UV glue. Of course, the material of the cushioning member 150 also includes an epoxy resin and a copolymer or mixture of rubber and other components. As long as it has elasticity, smooth surface, no volatility, neutral pH value, preferably the viscosity before colloid hardening is 250pa‧s~500pa‧s and does not chemically change with the OLED stack structure 230, It can be used as the cushioning element 150 of the embodiment of the present invention. In addition to the above conditions, preferably, the buffering member 150 may further include a material for hermetically bonding the capping substrate 100 and the OLED substrate 200, and the material may be used for both the buffering member 150 and the sealant 170. When both the cushioning member 150 and the sealant 170 are substantially disposed in the same material as described above, the complexity of the preparation of the OLED display panel 10 is increased, and the manufacturing of the OLED display panel 10 can be facilitated. . A method of manufacturing the OLED display panel of the present invention will be described later in detail.

Please refer to FIG. 3A , which is a schematic diagram of a cover substrate of the OLED display panel of FIG. 1 . The desiccant 130 is disposed at a substantially central position P0 of the bottom surface 111a of the recess 111 to absorb moisture in the space S10 (shown in FIG. 1). The cushioning element 150 then surrounds the desiccant 130. In detail, the cushioning member 150 is here a strip-shaped cushion that surrounds the desiccant 130 in a manner that does not contact the desiccant 130. Regarding the arrangement of the cushioning member and the desiccant on the bottom surface of the groove, a plurality of examples will be further described below.

In addition, please refer to FIG. 3B, which shows a schematic view of the cushioning element disposed on the adjacent side of the desiccant portion. The cushioning members 150a and 150b are respectively disposed on the upper and lower sides (and also on the left and right sides) of the desiccant 130, and the same function as the cushioning member 150 of the third embodiment can be provided.

Please refer to FIG. 4A to FIG. 4F , which respectively show schematic diagrams of other configurations of the buffer element and the desiccant. As shown in FIG. 4A, the desiccant 130 is disposed on one side of the bottom surface 111a of the groove 111 with respect to the center position P0. The cushioning member 151 is, for example, three strip-shaped cushions 151a, 151b, and 151c. The cushions 151a, 151b, and 151c are disposed on the other side of the bottom surface 111a corresponding to the center position P0 on the desiccant 130. The cushion pads 151a, 151b, and 151c are sequentially connected to form a U-shaped frame. Preferably, the U-shaped frame and the desiccant 130 are disposed on the bottom surface 111a with the position P0 as a symmetry center, and the opening of the U-shaped frame is, for example, opposite (or facing away) the desiccant 130.

Further, as shown in Fig. 4B, the desiccant 130 is provided on one side of the bottom surface 111a. Among them, the cushioning member 153 has a better effect by the center position P0 of the bottom surface 111a, but it is not necessary to define the passing center position, and both the cushioning member 153 and one of the long sides 130a of the desiccant 130 are disposed at an angle θ0.

Further, as shown in Fig. 4C, the desiccant 130 is provided on one side of the bottom surface 111a, and the cushioning member 154 is, for example, two strip-shaped cushions 154a and 154b provided on both sides of the center position P0 of the bottom surface 111a. The cushions 154a and 154b are perpendicular to the long sides 130a of the desiccant 130.

Further, as shown in Fig. 4D, the desiccant 130 is provided on one side of the bottom surface 111a. Since the desiccant 130 has a weight, it is easy to cause the center position P0 of the groove 111 to be curved to be close to the OLED stack structure 230 (shown in FIG. 1). Therefore, the cushioning member 157 is disposed between the desiccant 130 and the substantially central position P0 of the bottom surface 111a. The cushioning element 157 is caused to protect the OLED stack structure 230 from being destroyed by the desiccant 130.

Further, as shown in Fig. 4E, the desiccant 130 is disposed on one side of the bottom surface 111a, and the cushioning member 159 is, for example, three strip-shaped cushions 159a, 159b, and 159c. The cushion 159a is provided between the desiccant 130 and the substantially central position P0 of the bottom surface 111a. The cushions 159b and 159c are disposed at the center position P0 of the bottom surface 111a with respect to the other side of the desiccant 130.

In addition to the strip cushion, the cushion may have other shapes. As shown in FIG. 4F, the desiccant 130 is disposed on one side of the bottom surface 111a, and the cushioning member 350 is, for example, a plurality of dot-shaped cushions 351, 353, 355, 357, and 359. These dot-shaped cushions 351, 353, 355, 357 and 359 are interspersed on the bottom surface 111a to protect the OLED stack structure 230 from being destroyed by the desiccant 130.

In summary, the arrangement of the desiccant and the cushioning member is suitable for the present invention as long as the cushioning member is disposed in the groove so as not to contact the desiccant, and the cushioning member is not allowed to contact the desiccant to the OLED stack. . The present invention is not limited to the arrangement of the cushioning element and the desiccant and the appearance of the cushioning element, and any configuration that meets the above conditions can be applied to the embodiment of the present invention.

The following describes a method of manufacturing an OLED display panel. Referring to FIG. 5, a flow chart of a method for fabricating an OLED display panel according to a first embodiment of the present invention is shown. The manufacturing method of the OLED display panel 10 mainly includes the following steps. First, in step S110, a capping substrate 100 of the OLED is provided, and the bottom plate 110 of the capping substrate 100 has a groove 111. Next, in step S130, a desiccant 130 is disposed on the bottom surface 111a of the recess 111, and the desiccant 130 has a first thickness D10. Next, as shown in step S150, the buffer member 150 is formed on the bottom surface 111a without contacting the desiccant 130, and the second thickness D50 of the buffer member 150 is greater than the first thickness D10. Then, in step S170, the capping substrate 100 and the OLED substrate 200 are assembled to form the OLED display panel 10, wherein the OLED substrate 200 has an OLED stack structure 230 thereon.

The following is a schematic view of the OLED display panel manufacturing method according to the first embodiment of the present invention, which is shown in FIG. 5 and FIG. 6A to FIG. 6G respectively.

In step S110 and as shown in FIG. 6A, a cover substrate 100 is provided, and the bottom plate 110 of the cover substrate 100 has a groove 111. The groove 111 is formed, for example, by milling using a milling machine to mill a pocket on the bottom plate 110.

Next, in step S130, a desiccant 130 is disposed on the bottom surface 111a of the recess 111. The desiccant 130 has a first thickness D10 (shown in FIG. 1), and the first thickness 10 is smaller than the recess 111. depth. As shown in Fig. 6B, the desiccant 130 is disposed at a substantially central position P0 of the bottom surface 111a.

Further, a step of forming a cushioning member is performed, and the cushioning member is formed on the bottom surface so as not to contact the desiccant. In step S151, as shown in Fig. 6C, a cushioning material 150' is provided in the recess 111. The cushioning material 150' surrounds the outside of the desiccant 130 along the periphery of the desiccant 130 in a manner that does not contact the desiccant 130.

Next, step S153 is performed to cure the buffer material 150' to form the cushioning member 150 as shown in Fig. 6D. The cured cushioning material 150 has a second thickness D30 (shown in FIG. 1), and the second thickness D30 is greater than the first thickness D10 of the desiccant 130. The buffer material 150 ′ can be cured into the buffer element 150 , for example, ultraviolet curing (UV Curing) or heat curing, as long as it is a curing method that does not damage the other components of the cover substrate 100, and can be used in the present invention. invention.

Next, the manufacturing method of the present embodiment is followed by the steps of assembling the capping substrate and the OLED substrate. First, as shown in steps S171 and 6E, a sealant material 170' is provided on the bottom plate 110 of the cover substrate 100. The sealant material 170' is located on the same side of the bottom plate 110 as the groove 111, and the sealant material 170' is along the outer edge 111' of the groove 111 to continuously form a closed outer frame around the groove 111.

Next, as shown in steps S173 and 6F, the OLED substrate 200 is aligned with the capping substrate 100 having the sealant material 170'. The OLED substrate 200 and the capping substrate 100 are assembled and bonded by the sealant material 170' so that the sealant material 170' simultaneously contacts the OLED substrate 200 and the capping substrate 100. The OLED substrate 200 has an OLED stack structure 230 (as shown in FIG. 1).

Then, in step S175, as shown in FIG. 6G, the sealant material 170' (shown in FIG. 6F) is cured to form a sealant 170 for hermetically bonding the OLED substrate 200 (shown in FIG. FIG. 6F) and the capping substrate 100 (shown in FIG. 6F) to form the OLED display panel 10. In the 6Gth diagram, the OLED stack structure 230 is omitted to clearly illustrate the present embodiment.

A first embodiment of the present invention discloses a cover substrate, a display panel and a manufacturing method of the OLED. The OLED display panel 10 is provided with a buffer member 150 in the recess 111 of the cover substrate 100. The cushioning element 150 is formed by, for example, providing a cushioning material 150' in the recess 111 and curing the cushioning material 150' to form the cushioning member 150. The second thickness D30 of the cushioning element 150 is greater than the first thickness D10 of the desiccant 130. The cushioning element 150 serves to provide resilience to protect the OLED structure 230 from damage by the desiccant 130.

Second embodiment

A second embodiment of the present invention discloses another method of fabricating an OLED display panel. The difference between the second embodiment and the manufacturing method disclosed in the first embodiment lies in the order in which the cushioning member and the sealant are formed. The cushioning member and the sealant of the present embodiment are simultaneously formed in the manufacturing process. The second embodiment is based on the arrangement of the elements of the display panel of the first embodiment, and the same reference numerals are used to denote the same elements. However, it is well known to those skilled in the art that the relative relationship of the components of the display panel is not limited to the contents disclosed in the second embodiment.

Please refer to FIG. 7 and FIG. 8A to FIG. 8E simultaneously. FIG. 7 is a flow chart showing a method for fabricating an OLED display panel according to a second embodiment of the present invention, and FIG. 8A to FIG. 8E are respectively illustrated according to the first embodiment. 7 is a schematic diagram of a method for fabricating an OLED display panel.

First, as shown in steps S310 and 8A, a capping substrate 500 of an OLED is provided, and the bottom plate 110 of the capping substrate 500 has a groove 111.

Next, step S330 is performed. As shown in FIG. 8B, a desiccant 130 is disposed on the bottom surface 111a of the recess 111. The desiccant 130 has a first thickness D10 (shown in FIG. 1).

Next, step S350 is performed. As shown in FIG. 8C, a gel material 550' is provided on the bottom plate 110 of the cover substrate 500 without contacting the desiccant 130. The gel material 550' is disposed on the bottom surface 511a and concave. Outside the slot 511.

Next, in step S370, as shown in Fig. 8D, the OLED substrate 200 and the capping substrate 500 are paired and bonded by a portion of the colloidal material 550' outside the recess 111. The OLED substrate 200 has an OLED stack structure 230 (shown in FIG. 1 ).

Then, in step S390, as shown in FIG. 8E, the cured colloidal material 550' (shown in FIG. 8D), a portion of the colloidal material 550' on the bottom surface 111a forms a cushioning member 550, and the cushioning member 550 has A second thickness is greater than the first thickness D10 of the desiccant 130. The manner in which the gel material 550' is cured may include ultraviolet light curing or heat curing, as long as it is a curing method that does not damage the other components of the capping substrate 500, and can be used in the present invention.

In addition, as shown in FIG. 8E, the colloidal material 550' located outside the recess 111 is cured to form a sealant 570 for hermetically bonding the OLED substrate 200 and the cover substrate 500 to form an OLED display. Panel 50.

A method of manufacturing an OLED display panel according to a second embodiment of the present invention provides a colloidal material 550' inside and outside the recess 111. Since the materials for forming the cushioning member 550 and the sealant 570 are all of the same colloidal material 550', the colloidal material 550' is simultaneously formed inside and outside the recess 111. Thereafter, the gel material 550' is cured to form a portion of the gel material in the recess 111 to form the cushioning member 550 for protecting the OLED display panel 70 from damage. The portion of the colloidal material 550' outside the recess 111 is cured to form a sealant 570 for forming the cover substrate 500 and the OLED substrate 200 to form a display panel 50 of the airtight OLED. According to the above manner, the second embodiment of the present invention can use the same material and form the frame glue 570 and the buffer member 550 at the same time, thereby saving the cost and time of the manufacture of the OLED display panel 50.

In the OLED cap substrate and the display panel and the method of manufacturing the same according to the preferred embodiment of the present invention, the OLED display panel is provided with a buffering member having a thickness greater than that of the desiccant in the recess of the capping substrate, and the OLED display panel is subjected to an external force. The buffer element protects the OLED stack structure from damage. In addition, the buffer element can also protect the OLED stack structure from chemical changes with the desiccant, thereby maintaining the characteristics of the OLED display panel. Furthermore, the cushioning element can be made of the same material as the sealant and can be formed on the cover substrate at the same time, which does not increase the difficulty of the OLED display panel manufacturing method. The OLED cover substrate and the display panel of the present invention and the manufacturing method thereof are economical and effective for protecting the OLED stack structure in the OLED display panel, so that the OLED display panel can stably exhibit its optimum characteristics. When the OLED display panel faces a large size, or the cover substrate is thinned, the cushioning member of the present invention can exert its function to protect the OLED stack structure, so that the OLED display panel can increase its tolerance.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10, 50. . . OLED display panel

90. . . Light

100, 500. . . Cover substrate

110. . . Bottom plate

110A. . . Outer edge

111. . . Groove

111’. . . Outer edge of the groove

111a. . . Bottom

130. . . Desiccant

130a. . . The long side

150, 150a, 150b, 151, 153, 154, 157, 159, 350, 550. . . Cushioning element

150’. . . Cushioning material

151a, 151b, 151c, 154a, 154b, 159a, 159b, 159c, 351, 353, 355, 357, 359. . . Cushion

170,570. . . Frame glue

170’. . . Frame material

200. . . OLED substrate

210. . . Transparent bottom plate

230. . . OLED stack structure

231. . . Hole injection layer

233. . . Hole transport layer

235. . . Organic light emitting layer

237. . . Electronic transport layer

239. . . Conductive layer

550’. . . Colloidal material

D10. . . First thickness

D30. . . Second thickness

D50. . . distance

P0. . . Central location

S10. . . space

Θ0. . . Angle

1 is a cross-sectional view showing an OLED display panel in accordance with a first embodiment of the present invention.

2 is a perspective view of a cover substrate of the OLED display panel of FIG. 1 .

FIG. 3A is a schematic view showing a cover substrate of the OLED display panel of FIG. 1 .

Figure 3B is a schematic view showing the cushioning member disposed on the adjacent side of the desiccant portion.

4A to 4F are schematic views showing the relationship between the cushioning member and other desiccant configurations, respectively.

FIG. 5 is a flow chart showing a method of fabricating an OLED display panel according to a first embodiment of the present invention.

6A to 6G are schematic views respectively showing a method of fabricating an OLED display panel according to a first embodiment of the present invention.

FIG. 7 is a flow chart showing a method of fabricating an OLED display panel according to a second embodiment of the present invention.

8A to 8E are schematic views respectively showing a method of fabricating an OLED display panel according to FIG. 7.

10. . . OLED display panel

90. . . Light

100. . . Cover substrate

110. . . Bottom plate

111. . . Groove

111a. . . Bottom

130. . . Desiccant

150. . . Cushioning element

170. . . Frame glue

200. . . OLED substrate

210. . . Transparent bottom plate

230. . . OLED stack structure

231. . . Hole injection layer

233. . . Hole transport layer

235. . . Organic light emitting layer

237. . . Electronic transport layer

239. . . Conductive layer

D10. . . First thickness

D30. . . Second thickness

D50. . . distance

S10. . . space

Claims (18)

A method for manufacturing an organic light emitting diode display panel, comprising: (a) providing a cover substrate of an OLED, wherein a bottom plate of the cover substrate has a groove; and (b) providing a desiccant in the groove a desiccant having a first thickness on a bottom surface; (c) forming a buffer member on the bottom surface in a manner not contacting the desiccant, the buffer member having a second thickness, the second thickness being greater than the a first thickness; and (d) assembling the capping substrate and an OLED substrate to form the OLED display panel, wherein the OLED substrate has an OLED stack structure thereon. The manufacturing method of claim 1, wherein (d) comprises: (d1) providing a sealant material on the cover substrate, wherein the sealant material is located on the same side of the bottom plate as the recess And surrounding the groove; (d2) aligning and bonding the OLED substrate and the cover substrate by the sealant material; and (d3) curing the sealant material to form a sealant, the sealant is used for The OLED substrate and the capping substrate are hermetically bonded. The manufacturing method according to claim 2, wherein the sealant in (d3) has substantially the same material as the cushioning member. The manufacturing method of claim 3, wherein (c) comprises: (c1) providing a buffer material in the recess; (c2) curing the cushioning material to form the cushioning member. The manufacturing method according to claim 4, wherein in (c2), the buffer material is formed by ultraviolet curing (UV Curing). The manufacturing method according to claim 4, wherein in (c2), the buffer material is formed by heat curing. The manufacturing method according to claim 4, wherein (d1) and the step (c1) are simultaneously performed. The manufacturing method according to claim 4, wherein (d3) and the step (c2) are simultaneously performed. The manufacturing method of claim 4, wherein in (c1), the cushioning material surrounds the desiccant. The manufacturing method of claim 4, wherein in (c1), the desiccant is disposed on the bottom surface adjacent to a side of the cover substrate, and the buffer material is disposed on the desiccant. And between the substantially central positions of the bottom surface. The manufacturing method according to claim 4, wherein in (c1), the cushioning material is formed into at least one cushion or a plurality of dot cushions. A method for manufacturing an organic light emitting diode display panel, comprising: (a) providing a cover substrate of an OLED, wherein a bottom plate of the cover substrate has a groove; and (b) providing a desiccant in the groove On a bottom surface, the drying The agent has a first thickness; (c) providing a gelatinous material on the bottom plate of the cover substrate in a manner not contacting the desiccant, the gel material being located on the bottom surface and outside the groove; (d) The OLED substrate and the capping substrate are paired and bonded by a portion of the gel material outside the groove; and (e) curing the gel material, a portion of the gel material on the bottom surface forming a cushioning member. The cushioning element has a second thickness that is greater than the first thickness. The manufacturing method of claim 12, wherein in (e), the portion of the gel material that is located outside the recess is cured to form a sealant for hermetically bonding the OLED substrate and The cover substrate. The manufacturing method according to claim 12, wherein in (e), the gel material is formed by ultraviolet curing (UV Curing). The manufacturing method according to claim 12, wherein in (e), the gel material is formed by heat curing. The manufacturing method of claim 12, wherein in (c), the gelatinous material surrounds the desiccant. The manufacturing method of claim 12, wherein in (c), the desiccant is disposed on the bottom surface adjacent to a side of the cover substrate, and the gel material is disposed on the desiccant And between the substantially central positions of the bottom surface. The manufacturing method according to claim 12, wherein in (c), the colloidal material is formed into at least one strip structure or a plurality of dot structures.