TW200913765A - Organic light-emitting diode panel - Google Patents

Organic light-emitting diode panel Download PDF

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Publication number
TW200913765A
TW200913765A TW96134074A TW96134074A TW200913765A TW 200913765 A TW200913765 A TW 200913765A TW 96134074 A TW96134074 A TW 96134074A TW 96134074 A TW96134074 A TW 96134074A TW 200913765 A TW200913765 A TW 200913765A
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TW
Taiwan
Prior art keywords
emitting diode
organic light
diode panel
cover
substrate
Prior art date
Application number
TW96134074A
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Chinese (zh)
Inventor
Chih-Ying Huang
Sheng-Wei Chen
Original Assignee
Chi Mei El Corp
Chi Mei Optoelectronics Corp
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Application filed by Chi Mei El Corp, Chi Mei Optoelectronics Corp filed Critical Chi Mei El Corp
Priority to TW96134074A priority Critical patent/TW200913765A/en
Publication of TW200913765A publication Critical patent/TW200913765A/en

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Abstract

An organic light-emitting diode (OLED) panel includes a substrate, at least one OLED device, a cover and at least one cushion element. The OLED device is disposed on the substrate. The cover is connected with the substrate. The OLED device is located between the substrate and the cover. The cushion element is disposed on one side, which facing the OLED device, of the cover. The material of the cushion element is different from that of the cover.

Description

200913765 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種發光二極體面板,特別關於一種有 機發光二極體(Organic Light-Emitting Diode, OLED)面 板。 【先前技術】 近年來,有機發光二極體(0LED)因具有高亮度、 全彩化、廣視角、自發光、高應答速度、可撓曲、製程容 易及成本低之諸多優勢,使其具有極大的潛力,可望成為 新世代平面顯示裝置之主流。 有機發光二極體面板在封裝過程中,通常為蓋體直接 覆蓋有機發光二極體元件,而有機發光二極體元件之有機 材料對水氣及/或氧氣非常敏感,所以蓋體在設計上不僅只 有密封覆蓋之功能,對於水氣的防護也一併考慮於蓋體結 構。為確保有機發光二極體元件的使用壽命,蓋體形成凹 槽(cavity)以容置乾燥劑。然而,凹槽的形成會降低蓋 體的結構強度,故有強化蓋體結構的必要。 請參照圖1所示,一種習知之有機發光二極體面板1 包含一基板11、至少一有機發光二極體元件12以及一蓋 體13。蓋體13係具有一凹槽131及至少一加強結構132, 加強結構132係設置於凹槽131之中,通常為一凸塊並與 蓋體13 —體成型製成,以強化蓋體13在凹槽131區域的 結構強度,避免凹槽131面積過大而使蓋體13受外力作 200913765 用後產生變形。因有機發光二極體元件12容易與水氣及 氧氣產生氧化作用而導致有機材料劣化,故需設置一乾燥 劑15於凹槽131之中。基板11係為一玻璃基板,其上形 成有機發光二極體元件12後,再與蓋體13藉由膠體16 對向黏著密合,使有機發光二極體元件12介於基板11與 蓋體13之間。 然而,當有機發光二極體面板1於組裝時,因蓋體13 及其加強結構132皆為玻璃材質,受外力作用將使加強結 構132之高硬度材質壓傷有機發光二極體元件12,且因加 強結構132具有銳角,容易刮傷有機發光二極體元件12, 而影響有機發光二極體元件12的可靠度。 因此,如何提供一種有機發光二極體面板,避免有機 發光二極體元件直接承受經蓋體結構傳遞的外力而損 壞,提高有機發光二極體面板的可靠度與使用壽命,已成 為重要課題之一。 【發明内容】 有鑑於上述課題,本發明之目的為提供一種有機發光 二極體面板,藉由緩衝元件之設置強化蓋體之結構強度, 避免有機發光二極體元件直接承受經蓋體結構傳遞的外 力而損壞,提高有機發光二極體面板的可靠度與使用壽 命。 緣是,為達上述目的,依據本發明之一種有機發光二 極體面板包含一基板、至少一有機發光二極體元件、一蓋 200913765 體以及至少一缓衝元件。有機發光二極體元件係設置於基 板上,蓋體係連結於基板,有機發光二極體元件位於基板 與蓋體之間。缓衝元件係設置於蓋體面對有機發光二極體 元件之一側,緩衝元件之材質與蓋體之材質不相同。 承上所述,因依據本發明之一種有機發光二極體面板 係設置至少一缓衝元件於蓋體,藉由該等缓衝元件之材質 硬度小於蓋體之材質硬度,使該等緩衝元件可經由變形以 吸收外力,避免經蓋體結構傳遞的外力直接作用於有機發 光二極體元件。與習知技術相較,本發明之緩衝元件不僅 能夠強化蓋體的結構強度,且緩衝元件能夠作為蓋體碰觸 有機發光二極體元件之緩衝介面,吸收並缓衝外力之負 荷,避免外力損壞有機發光二極體元件,提高有機發光二 極體面板的可靠度與使用壽命。 【實施方式】 以下將參照相關圖式,說明依本發明較佳實施例之一 種有機發光二極體面板,其中相同的元件將以相同的參照 符號加以說明。 請參照圖2所示,本發明較佳實施例之一種有機發光 二極體面板2包含一基板21、至少一有機發光二極體元件 22、一蓋體23以及至少一缓衝元件24。有機發光二極體 元件22係設置於基板21上。緩衝元件24係設置於蓋體 23面對有機發光二極體元件22之一側,蓋體23係具有一 凹槽231以設置缓衝元件24。於本實施例中,缓衝元件 200913765 24係以黏合方式與凹槽231接合。另外,為防止水氣侵入 而損壞有機發光二極體元件22,有機發光二極體面板2更 包含一乾燥劑25設置於凹槽231,乾燥劑25更可鄰設於 緩衝元件24之周圍,需注意的是,乾燥劑25之厚度係小 於緩衝元件24之厚度。 緩衝元件24之材質與蓋體23之材質係不相同,且緩 衝元件24之硬度小於蓋體21之硬度。其中,基板21係 為一玻璃材質所構成,而緩衝元件24係由硬度小於玻璃 材質之彈性材質構成,例如但不限於橡膠、.塑膠、海綿、 發泡體、高分子及膠體所構成的群組。 當緩衝元件24黏合於蓋體23之内側的凹槽231後, 蓋體23係與基板21對向以膠體26黏合,使有機發光二 極體元件22位於基板21與蓋體23之間。其中,缓衝元 件24係與有機發光二極體元件22具有一間隙G,以作為 組裝公差之用,避免組裝後缓衝元件24接觸有機發光二 極體元件22。另外,可將缓衝元件24鄰近有機發光二極 體元件22之一端圓角化,以避免缓衝元件24因外力作用 接觸而刮傷或損壞有機發光二極體元件22。 當蓋體23受到外力產生變形時,緩衝元件24經由彈 性變形藉以吸收及緩衝外力,因缓衝元件24之硬度較低, 即使碰觸有機發光二極體元件22亦能夠避免有機發光二 極體元件22刮傷或損壞。 請參照圖3A與圖3B所示,缓衝元件24同時可作為 蓋體23之加強結構,依據實際需求而具有不同的變化態 200913765 樣。於本實施例中,緩衝元件24 設置,例如但不限於點狀、球狀=見則狀或不規則狀 並以連續設置或不連續設置。較 、條狀或區塊狀, 個緩衝元件^係呈長條狀交錯: 體23a,以強化蓋體23a之結構強丨^續方式故置於盍 複數個缓衝元件24b係呈球狀,二_示, 體23b,同樣能夠強化蓋體说之 連',方式設置於蓋 上述==係舉例說明,非用:限二Γ意的是’ 綜上所返,因依據本發明之 係設置至少-緩衝元件於蓋:有機發光二極體面板 硬度小於蓋體之材質硬户,:該等緩衝元件之材質 吸收外力,避免經蓋心可經由變形以 光二極體元件。與習知技術相較 直接作用於有機發 能夠強化蓋㈣結難度,且緩 2之緩衝元件不僅 有機發光二極體元件之緩衝介 U夠作為蓋體碰觸 荷’避免外力損壞有機發光二極體元,收並緩衝外力之負 極體面板的可靠度與使料命。f ’提*有機發光二 以上所述僅為舉例性,而非 本發明之精神與範4,而對性者。任何未脫離 應包含於後附之申請專利範圍中:之等效修改或變更,均 【圖式簡單說明】 圖1為-種習知之有機發光二極體面板之干 圖2為依據本發陳佳實關之—種有機發I二極體面板 200913765 之不意圖,以及 圖3A與圖3B為依據本發明較佳實施例之有機發光二 極體面板的緩衝元件具有不同變化態樣之示意圖。 【主要元件符號說明】 I、 2:有機發光二極體面板 II、 21 :基板 12、 22 :有機發光二極體元件 13、 23、23a、23b :蓋體 131、231 :凹槽 132 :加強結構 15、 25 :乾燥劑 16、 26 :膠體 24、24a、24b :缓衝元件 G :間隙 10BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode panel, and more particularly to an Organic Light-Emitting Diode (OLED) panel. [Prior Art] In recent years, organic light-emitting diodes (OLEDs) have many advantages such as high brightness, full color, wide viewing angle, self-luminous, high response speed, flexibility, easy process, and low cost. Great potential is expected to become the mainstream of the new generation of flat panel display devices. In the packaging process, the organic light-emitting diode panel usually covers the organic light-emitting diode component directly, and the organic material of the organic light-emitting diode component is very sensitive to moisture and/or oxygen, so the cover is designed. Not only the function of the seal cover, but also the protection of the moisture is also considered in the cover structure. To ensure the service life of the organic light-emitting diode element, the cover body forms a cavity to accommodate the desiccant. However, the formation of the grooves reduces the structural strength of the cover, so that it is necessary to strengthen the cover structure. Referring to FIG. 1, a conventional organic light emitting diode panel 1 includes a substrate 11, at least one organic light emitting diode element 12, and a cover 13. The cover 13 has a recess 131 and at least one reinforcing structure 132. The reinforcing structure 132 is disposed in the recess 131, and is usually a bump and is integrally formed with the cover 13 to strengthen the cover 13 The structural strength of the area of the groove 131 prevents the area of the groove 131 from being excessively large, so that the cover 13 is deformed by the external force for use in 200913765. Since the organic light-emitting diode element 12 is easily degraded by moisture and oxygen to cause deterioration of the organic material, a desiccant 15 is required to be disposed in the recess 131. The substrate 11 is a glass substrate, and after the organic light-emitting diode element 12 is formed thereon, the cover 13 is adhered to the cover 13 by the colloid 16 so that the organic light-emitting diode element 12 is interposed between the substrate 11 and the cover. Between 13 However, when the organic light-emitting diode panel 1 is assembled, since the cover 13 and the reinforcing structure 132 are both made of glass, the external force acts to cause the high-hardness material of the reinforcing structure 132 to crush the organic light-emitting diode element 12, Moreover, since the reinforcing structure 132 has an acute angle, the organic light emitting diode element 12 is easily scratched, and the reliability of the organic light emitting diode element 12 is affected. Therefore, how to provide an organic light-emitting diode panel to prevent the organic light-emitting diode component from directly being damaged by the external force transmitted through the cover structure, and improving the reliability and service life of the organic light-emitting diode panel has become an important issue. One. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide an organic light emitting diode panel, which is configured to strengthen the structural strength of the cover body by the provision of the buffering member, thereby preventing the organic light emitting diode component from directly transmitting through the cover structure. The external force is damaged, and the reliability and service life of the organic light emitting diode panel are improved. In order to achieve the above object, an organic light emitting diode panel according to the present invention comprises a substrate, at least one organic light emitting diode element, a cover 200913765 body and at least one buffer element. The organic light emitting diode element is disposed on the substrate, the cover system is coupled to the substrate, and the organic light emitting diode element is disposed between the substrate and the cover. The buffer component is disposed on one side of the cover body facing the organic light emitting diode element, and the material of the buffer component is different from the material of the cover body. According to the above aspect, an organic light-emitting diode panel according to the present invention is provided with at least one buffer component on the cover body, and the cushioning component has a material hardness lower than that of the cover body, so that the cushioning component is made. The external force can be absorbed by deformation to prevent the external force transmitted through the cover structure from directly acting on the organic light emitting diode element. Compared with the prior art, the cushioning component of the present invention can not only strengthen the structural strength of the cover body, but also the cushioning component can act as a buffering interface of the cover body of the organic light-emitting diode component, absorbing and buffering the load of the external force, and avoiding external force. Damage to the organic light-emitting diode component improves the reliability and service life of the organic light-emitting diode panel. [Embodiment] Hereinafter, an organic light-emitting diode panel according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals. Referring to FIG. 2, an organic light emitting diode panel 2 according to a preferred embodiment of the present invention includes a substrate 21, at least one organic light emitting diode element 22, a cover 23, and at least one buffering member 24. The organic light emitting diode element 22 is provided on the substrate 21. The cushioning member 24 is disposed on one side of the cover body 23 facing the organic light emitting diode element 22, and the cover body 23 has a recess 231 to provide the cushioning member 24. In the present embodiment, the cushioning member 200913765 24 is bonded to the recess 231 in an adhesive manner. In addition, the organic light-emitting diode panel 2 further includes a desiccant 25 disposed in the recess 231, and the desiccant 25 is disposed adjacent to the buffer member 24, in order to prevent the intrusion of moisture. It should be noted that the thickness of the desiccant 25 is less than the thickness of the cushioning member 24. The material of the cushioning member 24 is different from the material of the lid body 23, and the hardness of the cushioning member 24 is smaller than the hardness of the lid body 21. The substrate 21 is made of a glass material, and the cushioning member 24 is made of an elastic material having a hardness smaller than that of a glass material, such as, but not limited to, a group consisting of rubber, plastic, sponge, foam, polymer, and colloid. group. When the cushioning member 24 is adhered to the recess 231 on the inner side of the lid body 23, the lid body 23 is bonded to the substrate 21 by the colloid 26 so that the organic light emitting diode element 22 is positioned between the substrate 21 and the lid body 23. The buffer element 24 has a gap G with the organic light emitting diode element 22 for assembly tolerances, and prevents the buffer element 24 from contacting the organic light emitting diode element 22 after assembly. Alternatively, the cushioning member 24 may be rounded adjacent to one end of the organic light-emitting diode element 22 to prevent the cushioning member 24 from being scratched or damaged by the external force from contacting the organic light-emitting diode element 22. When the cover body 23 is deformed by an external force, the cushioning member 24 absorbs and buffers the external force via the elastic deformation. Since the hardness of the cushioning member 24 is low, the organic light-emitting diode can be avoided even if the organic light-emitting diode element 22 is touched. Element 22 is scratched or damaged. Referring to FIG. 3A and FIG. 3B, the cushioning member 24 can simultaneously serve as a reinforcing structure for the cover body 23, and has different states of change according to actual needs. In the present embodiment, the cushioning member 24 is provided, for example, but not limited to, a dot shape, a spherical shape, a shape or an irregular shape, and is disposed in a continuous manner or discontinuously. In the case of a strip, a strip, or a block, the buffer elements are elongated in a strip shape: the body 23a is placed in a sturdy manner, and the plurality of cushioning elements 24b are spherical. The second _ shows that the body 23b can also strengthen the cover body, and the method is set on the cover. The above == is an example, and the non-use: the limit is that it is returned, because the system is set according to the present invention. At least - the buffer element is in the cover: the organic light-emitting diode panel is harder than the material of the cover body, and the material of the buffer elements absorbs the external force, so that the light-diode element can be deformed via the cover core. Compared with the conventional technology, the direct action on the organic hair can strengthen the lid (four) knot difficulty, and the buffer element of the slow 2 is not only the buffer of the organic light-emitting diode element, but also the cover body is touched to avoid the external force from damaging the organic light-emitting diode. The voxel, the reliability and the life of the negative body panel that absorbs and buffers the external force. f ′** Organic Light Emitting Two The above description is for illustrative purposes only, and not for the spirit and scope of the present invention, but for the sex. Any equivalent modification or change that should be included in the scope of the appended patent application: [Simplified description of the drawings] Figure 1 is a dry view of a conventional organic light-emitting diode panel. Figure 2 is based on this report. The non-intention of the organic hair I diode panel 200913765, and FIG. 3A and FIG. 3B are schematic diagrams showing different variations of the buffer elements of the organic light emitting diode panel according to the preferred embodiment of the present invention. [Description of main component symbols] I, 2: Organic light-emitting diode panel II, 21: Substrate 12, 22: Organic light-emitting diode elements 13, 23, 23a, 23b: Cover bodies 131, 231: Groove 132: Strengthened Structure 15, 25: desiccant 16, 26: colloid 24, 24a, 24b: cushioning element G: gap 10

Claims (1)

200913765 十、申請專利範圍: 1、 一種有機發光二極體面板,包含: 一基板; 至少一有機發光二極體元件,係設置於該基板上; 一蓋體,係連結於該基板,該有機發光二極體元件位 於該基板與該蓋體之間;以及 至少一緩衝元件’係設置於該蓋體面對該有機發光二 極體元件之一側,該緩衝元件之材質與該蓋體之材 質不相同。 2、 如申請專利範圍第〗項所述之有機發光二極體面板, 其中該緩衝元件之硬度係小於該蓋體之硬度。 3如申請專利範圍第1項所述之有機發光二極體面板, 其中該緩衝元件係呈規則狀或不規則狀。 4、如申請專利範圍第1項所述之有機發光二極體面板, 其中該緩衝元件係呈點狀、球狀、柱狀、條狀或區塊 狀。 5 如申請專利範圍第1項所述之有機發光二極體面板, 其中該緩衝元件係為連續設置或不連續設置。 如申請專利範圍第1項所述之有機發光二極體面板, 200913765 其中该蓋體係具有至少一凹槽。 7、=申請專利範圍第6項所述之有機發光二極體面板 ”中§亥緩衝元件係設置於該凹槽。 如申明專利範圍第6項所述之有機發光二極體面板 更包含: 一乾燥劑,係設置於該凹槽。 9、:1請專利範圍第8項所述之有機發光二極體面板, /、中該乾燥劑係鄰設於該緩衝元件。 10'ΪΙ請專利範圍第8項所述之有機發光二極體面板, /、忒乾燥劑之厚度係小於該緩衝元件之厚度。200913765 X. Patent application scope: 1. An organic light emitting diode panel comprising: a substrate; at least one organic light emitting diode component disposed on the substrate; a cover body coupled to the substrate, the organic The light emitting diode element is located between the substrate and the cover body; and at least one buffering element is disposed on a side of the cover body facing the organic light emitting diode element, the material of the buffering element and the cover body The materials are different. 2. The organic light emitting diode panel of claim 1, wherein the cushioning element has a hardness less than a hardness of the cover. 3. The organic light-emitting diode panel of claim 1, wherein the buffer element is regular or irregular. 4. The organic light-emitting diode panel of claim 1, wherein the buffer element is in the form of a dot, a sphere, a column, a strip or a block. 5. The organic light-emitting diode panel of claim 1, wherein the buffer element is provided continuously or discontinuously. The organic light-emitting diode panel of claim 1, wherein the cover system has at least one groove. 7. The organic light-emitting diode panel of the organic light-emitting diode panel of the invention of claim 6 is disposed in the recess. The organic light-emitting diode panel according to claim 6 of the patent scope further comprises: A desiccant is disposed in the groove. 9., 1 Please select the organic light-emitting diode panel according to item 8 of the patent scope, and the desiccant is adjacent to the buffer element. In the organic light-emitting diode panel of the eighth aspect, the thickness of the /drying agent is less than the thickness of the buffering member. 11、 2請專利範圍第1項所述之有機發光二極體面板, /、中该緩衝元件之材質係為彈性材質。 12、 如申請專利範圍第u項所述之 ,雜編樹•、轉 两分子及膠體所構成的群組。 包體、 1211. The organic light-emitting diode panel according to the first aspect of the patent scope, wherein the material of the cushioning element is an elastic material. 12. As described in item u of the scope of patent application, a group consisting of a mixed tree, a two-molded body and a colloid. Envelope, 12
TW96134074A 2007-09-12 2007-09-12 Organic light-emitting diode panel TW200913765A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462634B (en) * 2009-04-24 2014-11-21 Chi Mei El Corp Organic light emitting diode (oled) cover substrate, display panel and manufacturing method
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
US9935289B2 (en) 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462634B (en) * 2009-04-24 2014-11-21 Chi Mei El Corp Organic light emitting diode (oled) cover substrate, display panel and manufacturing method
US9935289B2 (en) 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member

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