201039685 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種有機發光二極體（0rganic Light-Emitting Diode, OLED )之封蓋基板及顯示面板與製 造方法，且特別是有關於一種具有乾燥劑的有機發光二極 體之封蓋基板及顯示面板與製造方法。 【先前技術】 Λ 科技發展一日千里，在現今的電子裝置中’幾乎都少 Ό 不了顯示面板以擴充電子裝置的功能。其中，有機發光二 極體（Organic Light-Emitting Diode, OLED)之顯示面板 由於具有自體發光的特性，在各類型的顯示面板中，具有 不小的發展潛力。 OLED顯示面板通常包括一 OLED基板及一封蓋基 板。封蓋基板具有一凹槽，用以容置OLED基板之OLED 堆疊結構及一乾燥劑。乾燥劑設置於凹槽上並用以吸收 ❹ OLED顯示面板的水氣。然而’在〇LED顯示面板中，乾 燥劑容易與OLED堆疊結構接觸，並且破壞〇LED堆疊結 構。目前業界習用之一種解決方法，係將凹槽的深度加 大，以防止乾燥劑接觸0LED堆疊結構。此法係造成封蓋 ^板厚度㈣’而導致〇LED顯示面板強度下降。此外， 當OLED顯示面板朝向大尺寸發展時，薄型的封鋒板易 因乾燥劑產生變形而被破壞。 另外一種f用之解決方法，係在Q L E D堆料構上再 形成-保護層。此法係耗時且增加了 〇顯示面板的製 3 201039685 造時間與成本。 因此’如何經濟且有效地避免乾燥劑破壞〇Led堆疊 結構，乃當前OLED顯示面板技術所需克服的問題之一。 【發明内容】 本發明係有關於一種有機發光二極體（〇rganic Light-Emitting Diode，OLED )之封蓋基板及顯示面板與製 造方法，係利用一緩衝元件來避免OLED堆疊結構受到物 理破壞或是化學破壞。使OLED顯示面板得以提供最佳地 品質。 根據本發明，提出一種OLED之封蓋基板，用以與一 OLED基板對組形成一 OLED顯示面板。封蓋基板包括一 底板、一乾燥劑及一緩衝元件。底板具有一凹槽。乾燥劑 設置於凹槽内之一底面上。乾燥劑具有一第一厚度。緩衝 元件以不接觸乾燥劑之方式設置於凹槽之底面上，緩衝元 件具有一第二厚度，其係大於第一厚度。 根據本發明，另提出一種OLED顯示面板，包括一 OLED基板及一封蓋基板。封蓋基板用以與〇led基板對 組。封蓋基板包括一底板、一乾燥劑及一緩衝元件。封蓋 基板之底板具有一凹槽。乾燥劑設置於凹槽内之一底面 上。乾燥劑具有一第一厚度。緩衝元件以不接觸乾燥劑之 方式設置於凹槽之底面上，緩衝元件具有一第二厚度，其 係大於第一厚度。 根據本發明’又提出一種OLED顯示面板之製造方 法。首先，提供一 OLED之封蓋基板，封蓋基板之一底板 201039685 具有一凹槽。其次，設置一乾燥劑於凹槽内之一底面上， 乾燥劑具有一第一厚度。接著，以不接觸乾燥劑的方式， 形成一緩衝元件於底面上，缓衝元件具有一第二厚度，第The invention relates to a cover substrate, a display panel and a manufacturing method thereof, and in particular to a method for manufacturing an organic light-emitting diode (OLED) A cover substrate, a display panel and a manufacturing method of an organic light-emitting diode having a desiccant. [Prior Art] Λ Technology has developed rapidly, and in today's electronic devices, almost no display panels can be used to expand the functions of electronic devices. Among them, the display panel of the Organic Light-Emitting Diode (OLED) has a development potential in various types of display panels due to its self-luminous characteristics. An OLED display panel typically includes an OLED substrate and a cover substrate. The cover substrate has a recess for receiving the OLED stack structure of the OLED substrate and a desiccant. A desiccant is disposed on the recess and is used to absorb moisture from the OLED display panel. However, in the 〇LED display panel, the desiccant easily contacts the OLED stack structure and destroys the 〇LED stack structure. One solution currently used in the industry is to increase the depth of the grooves to prevent the desiccant from contacting the OLED stack structure. This method causes the thickness of the cover plate (four)' to cause the strength of the 〇LED display panel to decrease. Further, when the OLED display panel is developed toward a large size, the thin type of sealing plate is easily broken by the deformation of the desiccant. Another solution to f is to form a protective layer on the Q L E D stack. This method is time consuming and increases the manufacturing time and cost of the display panel. Therefore, how to economically and effectively prevent the desiccant from damaging the 〇Led stack structure is one of the problems that the current OLED display panel technology needs to overcome. SUMMARY OF THE INVENTION The present invention relates to a cover substrate, a display panel, and a manufacturing method of an organic light-emitting diode (OLED), which utilize a buffer element to prevent physical destruction of the OLED stack structure or It is chemical destruction. The OLED display panel is provided to provide the best quality. According to the present invention, a capping substrate for an OLED is provided for forming an OLED display panel with an OLED substrate. The cover substrate includes a bottom plate, a desiccant, and a cushioning member. The bottom plate has a recess. The desiccant is disposed on one of the bottom surfaces of the recess. The desiccant has a first thickness. The cushioning member is disposed on the bottom surface of the recess in a manner that does not contact the desiccant, and the buffer member has a second thickness which is greater than the first thickness. According to the present invention, an OLED display panel is further provided, comprising an OLED substrate and a cover substrate. The cover substrate is used to be paired with the 〇led substrate. The cover substrate includes a bottom plate, a desiccant and a cushioning member. The bottom plate of the cover substrate has a recess. The desiccant is disposed on one of the bottom surfaces of the recess. The desiccant has a first thickness. The cushioning member is disposed on the bottom surface of the recess in a manner that does not contact the desiccant, and the cushioning member has a second thickness which is greater than the first thickness. According to the present invention, a method of manufacturing an OLED display panel is proposed. First, an OLED capping substrate is provided, and a substrate of the capping substrate 201039685 has a recess. Next, a desiccant is disposed on one of the bottom surfaces of the recess, and the desiccant has a first thickness. Then, a buffer member is formed on the bottom surface without contacting the desiccant, and the buffer member has a second thickness.
二厚度係大於第一厚度。而後，組裝封蓋基板及一 〇LED 基板，以形成OLEO顯示面板，其中OLED基板上具有一 0LED堆疊結構。 根據本發明，再提出一種0LED顯示面板之製造方 法。首先，提供一0LED之封蓋基板，封蓋基板之一底板 ❹具有一凹槽。其次，設置一乾燥劑於凹槽内之一底面上， 乾燥劑具有一第一厚度。再者，以不接觸乾燥劑的方式， 提供一膠質材料於封蓋基板之底板上，膠質材料係位於底 面上及凹槽外。接著，藉由凹槽外之部分膠質材料，將 0LED基板及封蓋基板對組及貼合。而後，固化膠質材料， 底面上之部分膠質材料係形成一緩衝元件，緩衝元件具有 一第二厚度，第二厚度係大於第一厚度。 為讓本發明之上述内容能更明顯易懂，下文特舉較佳 ❹ 實施例’並配合所附圖式，作詳細說明如下： 【實施方式】 本發明關於一種有機發光二極體（〇rganicThe two thicknesses are greater than the first thickness. Then, the cap substrate and an LED substrate are assembled to form an OLEO display panel having an OLED stack structure on the OLED substrate. According to the present invention, a method of manufacturing an OLED display panel is further proposed. First, a cover substrate of 0 LED is provided, and one of the bottom plates of the cover substrate has a recess. Next, a desiccant is disposed on one of the bottom surfaces of the recess, and the desiccant has a first thickness. Further, a gel material is provided on the bottom plate of the capping substrate in a manner not contacting the desiccant, and the gel material is located on the bottom surface and outside the groove. Then, the 0 LED substrate and the cap substrate are paired and bonded by a part of the gel material outside the groove. Thereafter, the gelatinous material is cured, and a portion of the gelatinous material on the bottom surface forms a cushioning member having a second thickness, the second thickness being greater than the first thickness. In order to make the above-mentioned contents of the present invention more comprehensible, the following detailed description of the embodiments and the accompanying drawings will be described in detail as follows: [Embodiment] The present invention relates to an organic light-emitting diode (〇rganic)
Light-Emitting Diode, 0LED)顯示面板’包括一 0LED 之 封蓋基板及一 0LED基板。0LED顯示面板係由兩基板對 組形成。封蓋基板包括一底板、一乾燥劑及一緩衝元件。 其中’底板具有一凹槽。乾燥劑設置於凹槽内之一底面 上。乾燥劑具有一第一厚度。緩衝元件以不接觸乾燥劑之 5 201039685 方式設置於凹槽之底面上’緩衝元件具有一第二厚度，第 一厚度係大於第一厚度。根據上述方式，〇LED顯示面板 係可避免乾燥劑接觸並破壞0LED基板之一 0LED堆疊結 構。 以下内容將說明依照本發明之〇LED顯示面板及其 製造方法的具體實施方式’然實施例所提出的内容，僅為 本發明舉例說明之用，並非用以限縮本發明之保護範圍。 本發明所保護之範圍係以申請專利範圍為準。再者，實施 例之圖示以得以清楚表達本發明之特徵而繪製，各元件之 形狀與大小並非限於圖示所揭露之態樣。另外，實施例之 圖不亦省略不必要之元件，以利清楚顯示本發明之技術特 點。 第一實施例 請參照第1圖，其繪示依照本發明第一實施例之 OLED顯示面板的剖面圖。OLED顯示面板10包括封蓋基 板1〇〇及OLED基板200。OLED基板200包括一透明底 板210及_ 〇LED堆疊結構230。封蓋基板100包括一底 板110、一乾燥劑130及一緩衝元件150。其中，底板110 具有一凹槽111。乾燥劑130設置於凹槽111内之一底面 111a上。乾燥劑13〇具有一第一厚度D10。緩衝元件150 以不接觸乾燥劑130之方式設置於凹槽111之底面111a 上’緩衝元件150具有一第二厚度D30，第二厚度D30係 大於第一厚度D10，其中D30大於D10較佳的差距為 0.01mm 以上。 201039685 本實施例中，OLED基板200之OLED堆疊結構230 係設置於透明底板21〇上。一般而言OLED堆疊結構230 依序包括電洞注入層（hole-injection layer，HIL) 231、電 洞傳輸層（hole-transPort layer，HTL) 233、有機發光層 (emissive layer)235、電子傳輸層（electron-transport layer， ETL) 237以及導電層239。另外，透明底板210上更可具 有一透明之導電層，例如是一銦錫氧化物（Indium Tin Oxide，ITO)層。一光線90係由OLED堆疊結構230產生， _ 經由透明底板210離開OLED顯示面板10。 〇 請同時參照第2圖，第2圖繪示第1圖之OLED顯示 面板之封蓋基板的立體圖。封蓋基板100更包括一框膠 170。框膠170係設置於底板110之外緣110A上並與凹槽 111同側，且框膠170係環繞於凹槽ill之外。封蓋基板 100及OLED基板200係藉由框膠170，使兩基板得以氣 密接合。當封蓋基板100與OLED基板200透過框膠170 氣密接合後，凹槽111之底面111a至OLED基板200之 〇 OLED堆疊結構230具有一距離D50。其中較佳地，緩衝 元件150之第二厚度D30實質上小於距離D50。 進一步來說’緩衝元件150係為一彈性材料，例如是 彈性塑料’其係可藉由變形的方式吸收衝擊力。當〇LED 顯示面板10受到外力’使凹槽111變形時，由於緩衝元 件150之第二厚度D30大於乾燥劑130之第一厚度D10, 使得在封蓋基板1〇〇的所有元件中，緩衝元件15〇會最先 接觸到OLED堆疊結構230。由於緩衝元件15〇可吸收衝 擊力，因此其係不致損傷OLED堆疊結構230。根據上述 7 201039685 l 方式，OLED顯示面板10在遭受外力而發生物理形變時’ 係可受到緩衝元件150的保護。另外，OLED堆疊結構230 頂端之導電層239的材質通常是金屬鋁（A1)，其易與水 氣產生化學反應而變質。乾燥劑130用以將封蓋基板1〇〇 之凹槽111與OLED基板200之間所定義的一空間$ 1 〇(繪 示於第1圖中）之水氣加以吸收’避免水氣附著於導電層 239上。因此，乾燥劑130本身相較於空間Sl〇的其他元 件具有較高的濕度。具有較大之第二厚度D30的緩衝元件 150係使具有較小之第一厚度D10之乾燥劑13〇無法接觸 到OLED堆疊結構230 ’避免導電層239與乾燥劑130上 的水氣’或是與乾燥劑130本身產生化學變化。使得〇LED 堆疊結構230可維持原先優良的電性。因此，緩衝元件ι5〇 亦可避免OLED顯示面板10遭受化學破壞。 關於緩衝元件150的材質，其係可包括環氧樹脂或橡 膠或UV膠。當然’緩衝元件150之材質亦包括環氧樹脂 及橡膠與其他成分的共聚物或混合物。只要是具有彈性、 表面光滑、無揮發性、酸鹼值為中性、較佳為膠體硬化前 黏滞性在250pa. s〜500pa_ s且不與OLED堆疊結構230 產生化學變化的成分’皆可用以當作是本發明實施例的緩 衝元件150。除了上述條件外，較佳地，緩衝元件15〇可 選擇更包括得以氣密接合封蓋基板100及OLED基板200 之材質’且此材質可同時用於緩衝元件150及框膠170。 當緩衝元件150及框膠170兩者如前述實質上以具有相同 的材質的方式設置時，係避免在製造OLED顯示面板10 之前，增加備料時的複雜度，亦可便於OLED顯示面板10 201039685 的製造。有關本發明之〇LED顯示面板的製造方法，將在 之後詳加敘述。 請參照第3A圖，其繪示第1圖的OLED顯示面板之 封蓋基板的示意圖。乾燥劑130設置於凹槽111底面Ula 之實質上的中心位置P〇,以在空間Sl〇(繪示於第1圖中） 吸收水氣。緩衝元件150則圍繞乾燥劑130。詳細地說， 緩衝元件150在此係為一條狀之缓衝墊，以不接觸乾燥劑 130的方式，環繞在乾燥劑的四周。有關於緩衝元件 ❹ 與乾燥劑在凹槽之底面上的配置方式，以下另提供多個例 子加以說明。 另外’請參照第3B圖，其繪示缓衝元件設置在乾燥 劑部分鄰侧的示意圖。緩衝元件15〇a、150b分別設置在 乾燥劑130之上下兩侧（亦可為左右兩侧）’同樣可提供 與第3A圖緩衝元件150相同之功能。 請參照第4A至第4F圖，其分別繪示缓衝元件與乾 燥劑其他配置關係的示意圖。如第4A圖所示，乾燥劑130 ❹ 係設置於凹槽111之底面111a相對於中心位置P0的一 側。緩衝元件丨5丨例如是三個條狀之緩衝墊151a、151b 及151c。緩衝墊151a、151b及l5lc係設置於底面uu 相對於中心位置P0對應於乾燥劑13〇之另一侧。緩衝墊 151a、151b及151c依序連接以形成一 17字型框架。較佳 地，此U字型框架與乾燥劑13〇係以位置p〇為對稱中心 設置在底面Ilia上’而U字型框架之開口例如是相對（或 背對）乾燥劑130。 再者如第4B圖所示，乾燥劑13〇係設置於底面uia 9 201039685 的一侧。其中，緩衝元件153 is、a ^ 通過於底面111a之中心位置 P0上具有較佳之效果，然不必阳〜 ^ 祖α 卜义限定通過中心位置，且級衝 元件153與乾燥劑130之一^ ^ α & 長邊130a兩者以具有一夹角 Θ 〇的方式設置。 另外如第4C圖所示，乾燥劑13〇係設置於底面lUa 的一侧，緩衝兀件154例如是兩個條狀之緩衝墊154a及 154b設置於底面Hla之中心位置p〇兩側。其中，缓衡墊 154a及154b係與乾燥劑130之長邊i3〇a相互垂直。 又如第4D圖所示’乾燥劑13〇係設置於底面ilia 之一侧。由於乾燥劑130具有重量，其係易造成凹槽111 之中心位置P〇彎曲而貼近OLED堆疊結構230(繪示於第 1圖中）。因此緩衝元件157係設置乾燥劑130及底面llla 的實質上之中心位置之間。使得缓衝元件157得以保 護OLED堆疊結構230不被乾燥劑Π0破壞。 另如第4E圖所示，乾燥劑I30係設置於底面Hla之 一側，缓衝元件159例如是三個條狀之缓衝墊159a、159b 及159c。其中’緩衝塾159a係設置乾燥劑130及底面llla 的實質上之中心位置之間。緩衝墊15外及159c設置 於底面111 a之中心位置P〇相對於乾燥劑130之另一側。 又除了條狀之緩衝塾以外’緩衝墊亦可具有其他外 型。如第4F圖所示，乾燥劑130係設置於底面llla之一 側，緩衝元件350例如是多個點狀之緩衝墊351、353、355、 357及359。這些點狀之緩衝塾351、353、355、357及359 係散佈於底面llla上，以保護0LED堆疊結構230不被 乾燥劑130破壞。 201039685 口 &綜上所述’關於乾燥劑與缓衝元件的配置方式，只要 疋缓衝元件以不接觸乾燥劑的方式設置於凹槽内’且緩衝 元件得以不使乾燥劑接觸到OLED堆疊，皆適用於本發 曰月本發明對於緩衝元件及乾燥劑的配置方式以及緩衝元 件的外型並不乡做限制任何符合上述條件的配 置方式， 皆可應用於本發明實施例中。 ，下係針對0led顯示面板之製作方法進行說明。請 參照第5圖，其繪示依照本發明第一實施例的OLED顯示 ❹面板製作方法的流程圖。QLED顯示面板10的製作方法主 要包括下述步驟。首先於步驟S110中，提供OLED之封 蓋基板100 ’封蓋基板100之底板110具有凹槽111。其次 於步驟S13〇中’設置乾燥劑130於凹槽111内之底面iiia 上’乾燥劑130具有第一厚度D10。接著如步驟S150所 不’以不接觸乾燥劑130的方式，形成緩衝元件150於底 面llla上’緩衝元件150之第二厚度D50大於第一厚度 D10°而後’在步驟sn〇中，組裝封蓋基板1〇〇及〇led 〇 基板200 ’以形成OLED顯示面板10，其中0LED基板 200上具有OLED堆疊結構230。 以下’請同時參照第5圖及第6A至第6G圖，第6A 至第6G圖分別繪示本發明第一實施例之〇led顯示面板 製作方法的示意圖。 在步驟S110中並且如第6A圖所示，提供封蓋基板 1 00 ’封蓋基板1 00之底板1 1 0具有凹槽11 1。凹槽1 1 1例 如疋利用銑床加工，在底板110上銑出凹穴而形成。 接下來於步驟S130中’係設置乾燥劑130於凹槽m 11 201039685 内之底面llla上，乾燥劑丨3〇具有第—厚度D1〇(繪示於The Light-Emitting Diode, 0 LED) display panel includes a 0 LED cap substrate and an 0 LED substrate. The 0 LED display panel is formed by a pair of substrates. The cover substrate includes a bottom plate, a desiccant and a cushioning member. Where the 'backplane has a groove. The desiccant is disposed on one of the bottom surfaces of the recess. The desiccant has a first thickness. The cushioning member is disposed on the bottom surface of the recess in a manner that does not contact the desiccant 5 201039685. The cushioning member has a second thickness, the first thickness being greater than the first thickness. According to the above manner, the 〇LED display panel prevents the desiccant from contacting and destroying one of the OLED stacks. The following description of the specific embodiments of the LED display panel and the method of fabricating the same in accordance with the present invention will be described by way of example only, and is not intended to limit the scope of the invention. The scope of protection of the present invention is based on the scope of the patent application. Further, the illustrations of the embodiments are drawn to clearly illustrate the features of the present invention, and the shapes and sizes of the elements are not limited to the aspects disclosed. In addition, the drawings of the embodiments are not to be construed as unnecessary, so that the technical features of the present invention are clearly shown. First Embodiment Referring to Figure 1, there is shown a cross-sectional view of an OLED display panel in accordance with a first embodiment of the present invention. The OLED display panel 10 includes a cover substrate 1 and an OLED substrate 200. The OLED substrate 200 includes a transparent substrate 210 and a 堆叠 〇 LED stack structure 230. The cover substrate 100 includes a bottom plate 110, a desiccant 130, and a cushioning member 150. The bottom plate 110 has a recess 111. The desiccant 130 is disposed on one of the bottom surfaces 111a of the recess 111. The desiccant 13A has a first thickness D10. The buffering element 150 is disposed on the bottom surface 111a of the groove 111 without contacting the desiccant 130. The buffering element 150 has a second thickness D30, and the second thickness D30 is greater than the first thickness D10, wherein D30 is greater than the better gap of D10. It is 0.01mm or more. In this embodiment, the OLED stack structure 230 of the OLED substrate 200 is disposed on the transparent substrate 21〇. In general, the OLED stack structure 230 includes a hole-injection layer (HIL) 231, a hole-transport layer (HTL) 233, an emissive layer 235, and an electron transport layer. (electron-transport layer, ETL) 237 and conductive layer 239. In addition, the transparent substrate 210 may further have a transparent conductive layer, such as an Indium Tin Oxide (ITO) layer. A ray 90 is produced by the OLED stack structure 230, leaving the OLED display panel 10 via the transparent substrate 210. 〇 Please refer to FIG. 2 at the same time, and FIG. 2 is a perspective view of the cover substrate of the OLED display panel of FIG. 1 . The cover substrate 100 further includes a sealant 170. The sealant 170 is disposed on the outer edge 110A of the bottom plate 110 and is on the same side as the groove 111, and the sealant 170 is wrapped around the groove ill. The cover substrate 100 and the OLED substrate 200 are hermetically bonded by the sealant 170. After the cap substrate 100 and the OLED substrate 200 are hermetically bonded through the sealant 170, the bottom surface 111a of the recess 111 to the OLED stack structure 230 of the OLED substrate 200 has a distance D50. Preferably, the second thickness D30 of the cushioning member 150 is substantially smaller than the distance D50. Further, the cushioning member 150 is an elastic material such as an elastic plastic which absorbs an impact force by deformation. When the LED display panel 10 is subjected to an external force 'deformation of the groove 111, since the second thickness D30 of the cushioning member 150 is greater than the first thickness D10 of the desiccant 130, among all the components of the cover substrate 1〇〇, the cushioning member 15〇 will first contact the OLED stack structure 230. Since the cushioning member 15 is capable of absorbing the impact force, it does not damage the OLED stack structure 230. According to the above-mentioned 7 201039685 l mode, the OLED display panel 10 can be protected by the buffer member 150 when subjected to physical deformation due to an external force. In addition, the conductive layer 239 at the top of the OLED stack structure 230 is usually made of metallic aluminum (A1), which is easily deteriorated by chemical reaction with moisture. The desiccant 130 is used to absorb the moisture of a space $1 〇 (shown in FIG. 1) defined between the groove 111 of the cover substrate 1 and the OLED substrate 200 to avoid moisture adhesion. On the conductive layer 239. Therefore, the desiccant 130 itself has a higher humidity than the other elements of the space S1. The buffering member 150 having a larger second thickness D30 is such that the desiccant 13 having a smaller first thickness D10 cannot contact the OLED stack structure 230 'avoiding moisture on the conductive layer 239 and the desiccant 130' or A chemical change is produced with the desiccant 130 itself. The 〇LED stack structure 230 is maintained to maintain the original excellent electrical properties. Therefore, the buffer member ι5〇 can also prevent the OLED display panel 10 from being subjected to chemical damage. Regarding the material of the cushioning member 150, it may include epoxy resin or rubber or UV glue. Of course, the material of the cushioning member 150 also includes an epoxy resin and a copolymer or mixture of rubber and other components. As long as it is elastic, smooth, non-volatile, neutral in acidity, preferably the composition before the colloidal hardening is 250pa. s~500pa_ s and does not chemically change with the OLED stack structure 230. It is considered to be the cushioning member 150 of the embodiment of the present invention. In addition to the above conditions, preferably, the cushioning member 15A may further include a material for hermetically bonding the capping substrate 100 and the OLED substrate 200, and the material may be used for both the cushioning member 150 and the sealant 170. When the buffer element 150 and the sealant 170 are substantially disposed in the same material as described above, the complexity of the preparation of the OLED display panel 10 is increased, and the OLED display panel 10 201039685 is also convenient. Manufacturing. A method of manufacturing the 〇LED display panel of the present invention will be described later in detail. Please refer to FIG. 3A, which is a schematic diagram of a cover substrate of the OLED display panel of FIG. 1. The desiccant 130 is disposed at a substantially central position P〇 of the bottom surface U1 of the recess 111 to absorb moisture in the space S1 (shown in FIG. 1). The cushioning element 150 then surrounds the desiccant 130. In detail, the cushioning member 150 is here a strip of cushion which surrounds the desiccant in a manner that does not contact the desiccant 130. Regarding the arrangement of the cushioning member ❹ and the desiccant on the bottom surface of the groove, a number of examples are provided below. Further, please refer to Fig. 3B, which shows a schematic view of the cushioning member disposed on the adjacent side of the desiccant portion. The cushioning members 15a, 150b are respectively disposed on the upper and lower sides (and also the left and right sides) of the desiccant 130, and the same functions as those of the cushioning member 150 of the third embodiment are provided. Please refer to the 4A to 4F drawings, which respectively show the relationship between the buffer element and other arrangement of the desiccant. As shown in Fig. 4A, the desiccant 130 is disposed on one side of the bottom surface 111a of the recess 111 with respect to the center position P0. The cushioning member 丨5丨 is, for example, three strip-shaped cushions 151a, 151b, and 151c. The cushions 151a, 151b, and 15c are disposed on the other side of the bottom surface uu with respect to the center position P0 corresponding to the desiccant 13A. The cushions 151a, 151b, and 151c are sequentially connected to form a 17-shaped frame. Preferably, the U-shaped frame and the desiccant 13 are disposed on the bottom surface Ilia with the position p〇 as a symmetry center, and the opening of the U-shaped frame is, for example, opposite (or facing away) the desiccant 130. Further, as shown in Fig. 4B, the desiccant 13 is placed on one side of the bottom surface uia 9 201039685. Wherein, the cushioning elements 153 is, a ^ have a better effect by the central position P0 of the bottom surface 111a, but it is not necessary to have a central position, and the one of the leveling element 153 and the desiccant 130 ^ ^ Both α & long sides 130a are arranged in an angle Θ 。. Further, as shown in Fig. 4C, the desiccant 13 is disposed on one side of the bottom surface 1Ua, and the buffer member 154 is, for example, two strip-shaped cushions 154a and 154b provided on both sides of the center position p of the bottom surface H1a. Here, the balance pads 154a and 154b are perpendicular to the long side i3〇a of the desiccant 130. Further, as shown in Fig. 4D, the desiccant 13 is provided on one side of the bottom surface ilia. Since the desiccant 130 has a weight, it tends to cause the center position P of the groove 111 to be curved to be close to the OLED stack structure 230 (shown in Fig. 1). Therefore, the cushioning member 157 is disposed between the desiccant 130 and the substantially central position of the bottom surface 111a. The cushioning element 157 is allowed to protect the OLED stack structure 230 from damage by the desiccant Π0. Further, as shown in Fig. 4E, the desiccant I30 is disposed on one side of the bottom surface H1a, and the cushioning member 159 is, for example, three strip-shaped cushions 159a, 159b, and 159c. Wherein the buffer 塾 159a is disposed between the substantially central position of the desiccant 130 and the bottom surface 111a. The outer surface of the cushion 15 and the 159c are disposed at the center position P of the bottom surface 111a with respect to the other side of the desiccant 130. In addition to the strip-shaped cushions, the cushion can have other shapes. As shown in Fig. 4F, the desiccant 130 is disposed on one side of the bottom surface 111a, and the cushioning member 350 is, for example, a plurality of dot-shaped cushions 351, 353, 355, 357, and 359. These dot-like buffers 351, 353, 355, 357 and 359 are interspersed on the bottom surface 111a to protect the OLED stack structure 230 from being destroyed by the desiccant 130. 201039685 Mouth & In summary, 'the configuration of the desiccant and the cushioning element is as long as the buffering element is placed in the groove without contacting the desiccant' and the cushioning element is not allowed to contact the desiccant to the OLED stack The present invention is applicable to the present invention. The configuration of the cushioning element and the desiccant and the appearance of the cushioning member are not limited to any configuration that meets the above conditions, and can be applied to the embodiment of the present invention. The following is a description of the manufacturing method of the 0led display panel. Referring to FIG. 5, a flow chart of a method for fabricating an OLED display panel according to a first embodiment of the present invention is shown. The manufacturing method of the QLED display panel 10 mainly includes the following steps. First, in step S110, the cover substrate 100 of the OLED is provided. The bottom plate 110 of the cover substrate 100 has a recess 111. Next, in step S13, the desiccant 130 is disposed on the bottom surface iiia in the recess 111. The desiccant 130 has a first thickness D10. Then, as shown in step S150, the buffer member 150 is formed on the bottom surface 111a without the contact with the desiccant 130. The second thickness D50 of the cushioning member 150 is greater than the first thickness D10° and then 'in the step sn〇, the assembly cap is assembled. The substrate 1 〇〇 and the 〇 led 〇 substrate 200 ′ are formed to form an OLED display panel 10 having an OLED stack structure 230 thereon. Hereinafter, please refer to FIG. 5 and FIGS. 6A to 6G, respectively, and FIGS. 6A to 6G are schematic views respectively showing a method of fabricating the 〇led display panel according to the first embodiment of the present invention. In step S110 and as shown in Fig. 6A, the bottom plate 110 of the cover substrate 100 is provided with a recess 11 1 . The groove 1 1 1 is formed, for example, by machining with a milling machine and milling a pocket on the bottom plate 110. Next, in step S130, the desiccant 130 is disposed on the bottom surface 111a of the recess m 11 201039685, and the desiccant 丨3〇 has a first thickness D1〇 (shown in
第1圖中），第一厚度10係小於凹槽111之深度。如第6B 圖所示’乾燥劑130係設置於底面llla實質上中心位置 P0之處。 再來，進行形成緩衝元件之步驟，緩衝元件係以不接 觸乾燥劑之方式形成於底面上。在步驟S151中，如第6C 圖所示，提供一緩衝材料15〇,於凹槽Π1内。緩衝材料150， 係沿著乾燥劑130的周圍，以不接觸乾燥劑13〇的方式圍 繞在乾燥劑130的外侧。 从 ❹ 接著進行步驟S153 ’如第6D圖所示，固化緩衝材料 150’以形成緩衝元件15〇。固化後之緩衝材料15〇具有第 一厚度D30 (繪示於第丨圖中）’第二厚度D3〇大於乾燥 劑130之第一厚度D1〇。緩衝材料15〇，固化為緩衝元件15〇 的方式’係可例如是紫外光固化（ultra vi〇let curing，UV Curing)或加熱固化，只要是不破壞封蓋基板ι〇〇其他各 個元件的固化方式，皆可用於本發明。 接下來，本實施例之製造方法接著進行組裝封蓋基板 ◎ 及OLED基板之步驟。首先如步驟sm及第6e圖所示， 提供一框膠材料170,於封蓋基板1〇〇之底板u〇上。其中 框膠材料170’係與凹槽lu位於底板11〇之同側，且框膠 材料170’係沿著凹槽lu之外緣m，，連續地圍繞凹槽ln 形成一封閉外框。 接著如步驟S173及第6F圖所示，將OLED基板200 對準已具有框膠材料170,之封蓋基板1〇〇。藉由框膠材料 170’將OLED基板200及封蓋基板1〇〇對組及貼合，以使 12 201039685 框膠材料170’同時接觸〇leD基板200及封蓋基板100。 其中’ OLED基板200上具有OLED堆疊結構230 (如第 1圖所示）。 再來’進行步驟S175，如第6G圖所示，固化框膠材 料170’（繪示於第6F圖中）以形成框膠17〇，框膠170 用以氣密接合OLED基板200 (繪示於第6F圖中）及封蓋 . 基板100(繪示於第6F圖中），以形成OLED顯示面板10。 在第6G圖中’ OLED堆疊結構230係省略以清楚說明本 ❹ 實施例。 本發明第一實施例揭露一種OLED之封蓋基板及顯 示面板與製造方法。OLED顯示面板10係於封蓋基板1〇〇 的凹槽111内設置緩衝元件150 緩衝元件15〇形成的方 式’例如提供緩衝材料150,於凹槽111内，並將緩衝材料 150’固化以形成緩衝元件150。其中，緩衝元件15〇的第 二厚度D30大於乾燥劑130之第一厚度D10。緩衝元件ι5〇 用以提供彈性，保護OLED結構230不至被乾燥劑13〇破 〇 壞。 第二實施例 本發明第二實施例揭露另一種OLED顯示面板的製 造方法。第二實施例與第一實施例揭露的製造方法之不同 處在於緩衝元件與框膠之形成順序，本實施例之緩衝元件 與框膠係於製程中同時形成。第二實施例係沿用第一實施 例之顯示面板各元件的配置關係，相同的標號用以表示相 同的元件。然本發明技術領域，熟知此技藝者當可之，顯 13 201039685 示面板各元件的相對關係並不受限於第二實施例所揭露 的内容。 請同時參照第7圖及第8A圖至第8E圖，第7圖緣 示依照本發明第二實施例的OLED顯示面板之製作方法的 流程圖’第8A圖至第8E圖分別繪示依照第7圖之〇LEd 顯不面板製作方法的示意圖。 首先’如步驟S310及第8A圖所示，提供〇LED之 封蓋基板500 ’封蓋基板500之底板11〇具有凹槽ηι。 其次，進行步驟S330，如第8B圖所示，設置乾燥劑 130於凹槽111内之底面111&上，乾燥劑13〇具有第一厚 〇 度D10 (繪示於第1圖中）。 接著，進行步驟S350，如第8C圖所示’以不接觸乾 燦劑130的方式，提供一膠質材料55〇’於封蓋基板5〇〇之 底板110上，膠質材料550’係配置於底面511a上及凹槽 511 外。 接著’進行步驟S370，如第8D圖所示，藉由凹槽 Π1外之部分的膠質材料55〇,，將〇LED基板2〇〇及封蓋 ◎ 基板500對組及貼合。其中，OLED基板200上具有OLED 堆疊結構230 (繪示於第1圖中）。 而後於步驟S390中，如第8E圖所示，固化膠質材料 550’（綠示於第圖中），底面iiia上之部分的膠質材 料550’係形成一緩衝元件550，緩衝元件550具有之一第 二厚度係大於乾燥劑130之第一厚度D10。有關膠質材料 550’固化的方式，係可包括紫外光固化或加熱固化，只要 是不破壞封蓋基板500其他各個元件的固化方式，皆可用 14 201039685 於本發明。 另外如第8E圖所示’位於凹槽111外之部分的膠質 材料550’係固化形成一框膠570，框膠570係用以氣密接 合OLED基板200及封蓋基板500，以形成〇leD顯示面 板50。 ❹ 〇 本發明第二實施例之OLED顯示面板的製造方法，係 在凹槽111内外提供膠質材料550’。由於用以形成緩衝元 件550及框膠570的材料皆為同一種膠質材料550,，因 此’膠質材料550’係同時形成於凹槽ill内外。之後，再 將膠質材料550’固化，使凹槽in内之部分的膠質材料形 成緩衝元件550,用以保護0LED顯示面板7〇不被破壞。 凹槽hi外之部分的膠質材料550,固化形成框膠57〇，用 以使封蓋基板500及OLED基板2〇〇對組形成氣密之 OLED的顯示面板5G。根據上述方式，本發明第二實施例 係可將框膠570及緩衝元件55〇使用同一種材料，同時形 成，節省OLED顯示面板5〇製作的成本與時間。 上述依照本發明較佳實施例之OLED封蓋基板及顯 顯示聽係於封蓋= 板二於::劑:緩衝元件’當咖顯示面 被破壞。另外，緩衝=件係可保護0LED堆疊結構不 燥劑產生化學變化，保護0LED堆疊結構不與乾 者，緩衝元件可與框膠採=0LED顯示面板的特性。再 蓋基板上，係不會择^用相同材料，並可同時形成於封 本發明之GLED之面板製造枝的難度。 益丞板及顯示面板及其製造方法，係 15 201039685 經濟且有效地保護OLED顯示面板中之OLED堆疊結構， 使OLED顯示面板得以穩定地發揮其最佳的特性。當 OLED顯示面板朝向大尺寸，或是封蓋基板往薄型化發展 時，本發明之缓衝元件更能發揮其功效以保護OLED堆疊 結構，使OLED顯示面板得以增加其耐受性。 綜上所述，雖然本發明已以較佳實施例揭露如上，然 其並非用以限定本發明。本發明所屬技術領域117具有通常 知識者，在不脫離本發明之精神和範圍内，當可作各種之 更動與潤飾。因此，本發明之保護範圍當視後附之申請專 利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示依照本發明第一實施例之OLED顯示面板 的剖面圖。 第2圖繪示第1圖之OLED顯示面板之封蓋基板的立 體圖。 第3A圖繪示第1圖的OLED顯示面板之封蓋基板的 示意圖。 第3B圖繪示緩衝元件設置在乾燥劑部分鄰側的示 意圖。 第4A至第4F圖分別繪示緩衝元件與乾燥劑其他配 置關係的示意圖。 第5圖繪示依照本發明第一實施例的OLED顯示面板 製作方法的流程圖。In Fig. 1), the first thickness 10 is smaller than the depth of the groove 111. As shown in Fig. 6B, the desiccant 130 is disposed at a substantially central position P0 of the bottom surface 111a. Further, a step of forming a cushioning member is formed which is formed on the bottom surface so as not to contact the desiccant. In step S151, as shown in Fig. 6C, a cushioning material 15 is provided in the recess Π1. The cushioning material 150 is wound around the outside of the desiccant 130 so as not to contact the desiccant 13 around the desiccant 130. From ❹, then step S153' is performed as shown in Fig. 6D, and the buffer material 150' is cured to form the cushioning member 15''. The cured cushioning material 15A has a first thickness D30 (shown in the figure) "the second thickness D3" is greater than the first thickness D1 of the desiccant 130. The cushioning material 15〇, the manner of curing into the cushioning member 15〇 can be, for example, ultra-violet curing (UV Curing) or heat curing, as long as the curing of the other components of the sealing substrate ι is not broken. Means can be used in the present invention. Next, the manufacturing method of the present embodiment is followed by the steps of assembling the capping substrate ◎ and the OLED substrate. First, as shown in steps sm and 6e, a sealant material 170 is provided on the bottom plate u of the cover substrate. The sealant material 170' is located on the same side of the bottom plate 11b with the groove lu, and the sealant material 170' is along the outer edge m of the groove lu, and continuously forms a closed outer frame around the groove ln. Next, as shown in steps S173 and 6F, the OLED substrate 200 is aligned with the capping substrate 1 having the sealant material 170. The OLED substrate 200 and the capping substrate 1 are paired and bonded by the sealant material 170' so that the 12 201039685 sealant material 170' simultaneously contacts the 〇leD substrate 200 and the capping substrate 100. Wherein the OLED substrate 200 has an OLED stack structure 230 (as shown in Fig. 1). Then, step S175 is performed. As shown in FIG. 6G, the sealant material 170' (shown in FIG. 6F) is cured to form a sealant, and the sealant 170 is used to hermetically join the OLED substrate 200. In FIG. 6F and the cover. The substrate 100 (shown in FIG. 6F) is used to form the OLED display panel 10. The OLED stack structure 230 is omitted in Fig. 6G to clearly illustrate the present embodiment. A first embodiment of the present invention discloses a cover substrate, a display panel and a manufacturing method of the OLED. The OLED display panel 10 is provided in the recess 111 of the cover substrate 1 设置 in the manner that the cushioning member 150 is formed by the cushioning member 15 ' 'for example, providing the cushioning material 150 in the recess 111 and curing the cushioning material 150 ′ to form Buffer element 150. The second thickness D30 of the cushioning member 15A is greater than the first thickness D10 of the desiccant 130. The cushioning member ι5 is used to provide elasticity to protect the OLED structure 230 from being broken by the desiccant 13. Second Embodiment A second embodiment of the present invention discloses another method of fabricating an OLED display panel. The second embodiment differs from the manufacturing method disclosed in the first embodiment in the order in which the cushioning member and the sealant are formed. The cushioning member of the present embodiment is formed simultaneously with the sealant in the manufacturing process. The second embodiment is based on the arrangement of the elements of the display panel of the first embodiment, and the same reference numerals are used to denote the same elements. However, it is well known to those skilled in the art that the relative relationship of the various components of the panel is not limited to the contents disclosed in the second embodiment. Please refer to FIG. 7 and FIG. 8A to FIG. 8E simultaneously. FIG. 7 is a flow chart of the method for fabricating the OLED display panel according to the second embodiment of the present invention. FIG. 8A to FIG. 8E respectively illustrate 7 Figure 〇 LED shows a schematic diagram of the panel making method. First, as shown in steps S310 and 8A, the cover substrate 500 of the 〇LED is provided. The bottom plate 11 of the cover substrate 500 has a recess ηι. Next, step S330 is performed. As shown in Fig. 8B, the desiccant 130 is disposed on the bottom surface 111& in the recess 111, and the desiccant 13 has a first thickness D D10 (shown in Fig. 1). Then, in step S350, as shown in FIG. 8C, a gel material 55〇 is provided on the bottom plate 110 of the cover substrate 5 without contacting the dry paint 130, and the gel material 550' is disposed on the bottom surface. On the 511a and outside the groove 511. Next, step S370 is performed, and as shown in Fig. 8D, the 〇LED substrate 2 〇〇 and the cover ◎ substrate 500 are paired and bonded together by a portion of the colloidal material 55 外 outside the recess Π1. The OLED substrate 200 has an OLED stack structure 230 (shown in FIG. 1). Then, in step S390, as shown in FIG. 8E, the cured colloidal material 550' (green is shown in the figure), a portion of the colloidal material 550' on the bottom surface iiia forms a cushioning member 550, and the cushioning member 550 has one of them. The second thickness is greater than the first thickness D10 of the desiccant 130. The manner in which the gel material 550' is cured may include ultraviolet light curing or heat curing, as long as it does not destroy the curing means of the other components of the lidping substrate 500, and may be used in the present invention. In addition, as shown in FIG. 8E, the portion of the colloidal material 550' located outside the recess 111 is cured to form a sealant 570 for hermetically bonding the OLED substrate 200 and the cover substrate 500 to form a 〇leD. The display panel 50. ❹ 制造 The method of manufacturing the OLED display panel of the second embodiment of the present invention provides a colloidal material 550' inside and outside the recess 111. Since the materials for forming the buffer member 550 and the sealant 570 are all of the same colloidal material 550, the 'gel material 550' is simultaneously formed inside and outside the recess ill. Thereafter, the gel material 550' is cured, so that a portion of the gel material in the recess in is formed into the cushioning member 550 for protecting the OLED display panel 7 from damage. The portion of the colloidal material 550 outside the recess hi is cured to form a sealant 57 〇, so that the cover substrate 500 and the OLED substrate 2 are paired to form a display panel 5G of an airtight OLED. According to the above manner, in the second embodiment of the present invention, the same material can be used for the sealant 570 and the cushioning member 55, and the cost and time for manufacturing the OLED display panel 5 can be saved. The OLED cap substrate and the display system according to the preferred embodiment of the present invention are in the form of a cover = a plate member: a buffer member. In addition, the buffer = part can protect the OLED stack structure from chemical changes, and the OLED stack structure is not compatible with the dry, the buffer element can be combined with the characteristics of the LED display panel. On the other side of the substrate, the same material is not selected, and the difficulty in forming the panel of the GLED of the present invention can be simultaneously formed. The slab and the display panel and the method of manufacturing the same are used to economically and effectively protect the OLED stack structure in the OLED display panel, so that the OLED display panel can stably perform its optimum characteristics. When the OLED display panel is oriented toward a large size, or the cover substrate is thinned, the cushioning member of the present invention is more effective in protecting the OLED stack structure, so that the OLED display panel can increase its tolerance. In the above, the present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. The technical field of the present invention is well-known to those skilled in the art, and various modifications and refinements can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an OLED display panel in accordance with a first embodiment of the present invention. Fig. 2 is a perspective view showing a cover substrate of the OLED display panel of Fig. 1. Fig. 3A is a schematic view showing the cover substrate of the OLED display panel of Fig. 1. Fig. 3B is a view showing the arrangement of the cushioning member on the adjacent side of the desiccant portion. Figures 4A to 4F are schematic views showing other configurations of the cushioning member and the desiccant, respectively. FIG. 5 is a flow chart showing a method of fabricating an OLED display panel according to a first embodiment of the present invention.
第6A至第6G圖分別繪示本發明第一實施例之OLED 16 201039685 顯示面板製作方法的示意圖。 第7圖繪示依照本發明第二實施例的OLED顯示面板 之製作方法的流程圖。 第8A圖至第8E圖分別繪示依照第7圖之OLED顯 示面板製作方法的示意圖。 【主要元件符號說明】 ❹ 10、50 : OLED顯示面板 90 :光線 100、500 :封蓋基板 11〇 :底板 110A :外緣 111 :凹槽 ur :凹槽之外緣 111a :底面 130 :乾燥劑 130a :長邊 150、150a、150b、15卜 153、154、157、159、350、 550 :緩衝元件 150’ ：緩衝材料 151a、151b、151c、154a、154b、159a、159b、159c、 351、353、355、357、359 :緩衝整 170、570 :框膠 170’ ：框膠材料 200 : OLED 基板 17 201039685 210 ： 透明底板 230 ： OLED堆疊結構 231 : 電洞注入層 233 ： 電洞傳輸層 235 ： 有機發光層 237 ： 電子傳輸層 239 ： 導電層 550, :膠質材料 DIO 第一厚度 D30 第二厚度 D50 距離 PO ： 中心位置 S10 : 空間 Θ 0 ： 夾角6A to 6G are schematic views respectively showing a method of fabricating the display panel of the OLED 16 201039685 according to the first embodiment of the present invention. FIG. 7 is a flow chart showing a method of fabricating an OLED display panel in accordance with a second embodiment of the present invention. 8A to 8E are schematic views respectively showing a method of fabricating an OLED display panel according to Fig. 7. [Description of main component symbols] ❹ 10, 50: OLED display panel 90: light 100, 500: cover substrate 11: bottom plate 110A: outer edge 111: groove ur: groove outer edge 111a: bottom surface 130: desiccant 130a: long sides 150, 150a, 150b, 15b 153, 154, 157, 159, 350, 550: cushioning member 150': cushioning materials 151a, 151b, 151c, 154a, 154b, 159a, 159b, 159c, 351, 353 355, 357, 359: buffering 170, 570: sealant 170': sealant material 200: OLED substrate 17 201039685 210: transparent bottom plate 230: OLED stack structure 231: hole injection layer 233: hole transport layer 235: Organic light-emitting layer 237: Electron transport layer 239: Conductive layer 550, : Colloidal material DIO First thickness D30 Second thickness D50 Distance PO: Center position S10: Space Θ 0 : Angle