TWI460751B - - Google Patents

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Publication number
TWI460751B
TWI460751B TW102143405A TW102143405A TWI460751B TW I460751 B TWI460751 B TW I460751B TW 102143405 A TW102143405 A TW 102143405A TW 102143405 A TW102143405 A TW 102143405A TW I460751 B TWI460751 B TW I460751B
Authority
TW
Taiwan
Application number
TW102143405A
Other languages
Chinese (zh)
Other versions
TW201511055A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of TWI460751B publication Critical patent/TWI460751B/zh
Publication of TW201511055A publication Critical patent/TW201511055A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
TW102143405A 2013-09-02 2013-11-28 端子製作方法及端子與電子元器件芯體的製作方法 TW201511055A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310392036.4A CN103474859B (zh) 2013-09-02 2013-09-02 端子制作方法及端子与电子元器件芯体的制作方法

Publications (2)

Publication Number Publication Date
TWI460751B true TWI460751B (ja) 2014-11-11
TW201511055A TW201511055A (zh) 2015-03-16

Family

ID=49799606

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102143405A TW201511055A (zh) 2013-09-02 2013-11-28 端子製作方法及端子與電子元器件芯體的製作方法

Country Status (3)

Country Link
JP (1) JP5824495B2 (ja)
CN (1) CN103474859B (ja)
TW (1) TW201511055A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103746208B (zh) * 2014-01-09 2017-01-04 青岛钜祥精密模具有限公司 接触弹片及其高精度制造方法
JP6156350B2 (ja) * 2014-12-20 2017-07-05 株式会社村田製作所 表面実装インダクタおよびその製造方法
CN104753495B (zh) * 2015-03-28 2017-10-20 烟台明德亨电子科技有限公司 一种金属片接地三引线表面贴石英谐振器及其生产工艺
CN108989511B (zh) 2018-09-25 2023-05-12 苏州昀冢电子科技股份有限公司 一种具有电子元件的基座及音圈马达
CN109287074B (zh) * 2018-09-25 2023-03-24 苏州昀冢电子科技股份有限公司 一种具有电子元件的基座的生产工艺
CN113571992B (zh) * 2021-08-09 2024-01-12 东莞市彩历上自动化设备科技有限公司 一种端子贴合机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201042676A (en) * 2009-05-29 2010-12-01 Se-Jong Oh Novel process for molding composite inductors
TW201234395A (en) * 2011-02-11 2012-08-16 Superworld Electronics Co Ltd Injection molding shielding type inductor manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406338B1 (en) * 1999-07-08 2002-06-18 Yazaki Corporation Board terminal and method of producing same
CN1164015C (zh) * 2000-12-07 2004-08-25 富士康(昆山)电脑接插件有限公司 电连接器及其端子芯座之制造方法
CN101471525B (zh) * 2007-12-29 2011-03-23 富士康(昆山)电脑接插件有限公司 端子料带及其制造方法
JP5503991B2 (ja) * 2010-02-03 2014-05-28 矢崎総業株式会社 コネクタ端子の製造方法及び多段コネクタの組立方法
CN202585048U (zh) * 2011-12-14 2012-12-05 东莞大锋塑胶五金有限公司 一种改良网络变压器端子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201042676A (en) * 2009-05-29 2010-12-01 Se-Jong Oh Novel process for molding composite inductors
TW201234395A (en) * 2011-02-11 2012-08-16 Superworld Electronics Co Ltd Injection molding shielding type inductor manufacturing method

Also Published As

Publication number Publication date
TW201511055A (zh) 2015-03-16
CN103474859B (zh) 2015-11-25
JP2015050450A (ja) 2015-03-16
JP5824495B2 (ja) 2015-11-25
CN103474859A (zh) 2013-12-25

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees