TWI460050B - Cutting device - Google Patents
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- TWI460050B TWI460050B TW098125193A TW98125193A TWI460050B TW I460050 B TWI460050 B TW I460050B TW 098125193 A TW098125193 A TW 098125193A TW 98125193 A TW98125193 A TW 98125193A TW I460050 B TWI460050 B TW I460050B
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Description
本發明是有關於一種具有可確認半導體晶圓等被加工物之切削溝狀態的拍攝單元的切削裝置。The present invention relates to a cutting apparatus having an imaging unit that can confirm a state of a cutting groove of a workpiece such as a semiconductor wafer.
IC、LSI等多數元件形成於藉由分割預定線所分隔出的區域上的半導體晶圓，是藉由裝設有可旋轉之切削刀片之切削裝置而被分割成各個元件，並且經分割的元件使用在手機、個人電腦等電子機器上。A plurality of elements such as an IC and an LSI are formed on a semiconductor wafer in a region partitioned by a predetermined dividing line, and are divided into individual elements by a cutting device equipped with a rotatable cutting insert, and the divided elements are divided. Used on electronic devices such as mobile phones and personal computers.
切削裝置具有：用於保持晶圓等被加工物的夾盤；可旋轉地支撐用於切削保持在該夾盤之被加工物之切削刀片的切削單元(切削設備)；用於拍攝保持在該夾盤上的被加工物並檢測應切削之分割預定線以完成校準的拍攝單元(拍攝設備)；及使該夾盤在X軸方向上對被加工物做相對移動而定位在該切削單元與拍攝單元，並且進行加工移送的X軸移送機構，並且可以高精確度將被加工物分割成各個元件。The cutting device has: a chuck for holding a workpiece such as a wafer; a cutting unit (cutting device) rotatably supporting a cutting insert for cutting a workpiece to be held on the chuck; a workpiece on the chuck and detecting a dividing line to be cut to complete the calibration of the photographing unit (photographing apparatus); and positioning the chuck in the X-axis direction relative to the workpiece to be positioned in the cutting unit and The unit is photographed, and the X-axis transfer mechanism for processing transfer is performed, and the workpiece can be divided into individual elements with high precision.
然而，由於切削刀片發生縫隙堵塞時，會在切削溝(carve)兩側產生比較大的缺損而導致元件品質降低，因此，在切削中會將在晶圓等被加工物上所形成的切削溝定位在拍攝單元正下方，以執行確認切削溝狀態(參照特許第2628256號公報及特開2008-4806號公報)。However, when a gap is blocked in the cutting insert, a large defect is generated on both sides of the cutting groove, and the quality of the component is lowered. Therefore, a cutting groove formed on a workpiece such as a wafer is cut during cutting. Positioned immediately below the imaging unit, the state of the cutting groove is confirmed (refer to Japanese Patent No. 2628256 and JP-A-2008-4806).
【專利文獻1】特許第2628256號公報[Patent Document 1] Patent No. 2628256
【專利文獻2】特開2008-4806號公報[Patent Document 2] JP-A-2008-4806
以往的切削裝置，為了使用拍攝單元檢測應切削之分割預定線以完成校準，需停止夾盤以讀取拍攝單元所拍攝到的影像。因此，在完成校準上較花費時間，而有生產性差的問題。In the conventional cutting device, in order to detect the division line to be cut using the photographing unit to complete the calibration, the chuck needs to be stopped to read the image captured by the photographing unit. Therefore, it takes time to complete the calibration, and there is a problem of poor productivity.
又，由於確認切削溝的狀態時會暫時中止切削作業並使夾盤定位且停止在拍攝單元正下方，使用拍攝單元讀取影像，因此，有生產性差的問題。Further, when the state of the cutting groove is confirmed, the cutting operation is temporarily stopped, the chuck is positioned and stopped immediately below the imaging unit, and the image is read by the imaging unit, so that there is a problem of poor productivity.
而本發明係有鑑於如此之問題點而作成者，其目的在於提供一種可使用拍攝單元迅速進行影像讀取的切削裝置。The present invention has been made in view of such a problem, and an object thereof is to provide a cutting apparatus that can quickly perform image reading using an imaging unit.
藉由本發明，可提供一種切削裝置，其包含有：用以保持被加工物的夾盤；可轉動地支撐用於切削保持在該夾盤上之被加工物之切削刀片的切削設備、用於拍攝保持在該夾盤上之被加工物的拍攝設備；及使該夾盤對被加工物在X軸方向上作相對移動，進而使該夾盤定位於該切削設備與該拍攝設備，並且進行加工移送的X軸移送機構，又，切削裝置之特徵在於：前述拍攝設備包括：與拍攝區域相對面之接物鏡、配設在該接物鏡之光軸上的拍攝相機、對該拍攝區域照射閃光燈光之閃光燈光源、及處理該拍攝相機所拍攝之影像的影像處理部。According to the present invention, there can be provided a cutting apparatus comprising: a chuck for holding a workpiece; a cutting device for rotatably supporting a cutting insert for cutting a workpiece held on the chuck, for a photographing apparatus for photographing a workpiece held on the chuck; and relatively moving the chuck to the workpiece in the X-axis direction, thereby positioning the chuck on the cutting device and the photographing apparatus, and performing The X-axis transfer mechanism for processing the transfer, and the cutting device is characterized in that the photographing device includes: an objective lens opposite to the photographing area, a photographing camera disposed on the optical axis of the objective lens, and a flashing light to the photographing area a light source of light and an image processing unit that processes the image captured by the camera.
較佳的是，X軸移送機構包含用於檢測X座標值之X座標檢測設備，且該X座標檢測設備與閃光燈光源的閃光燈信號同步，記憶閃光燈光所照射之拍攝區域之X座標值。Preferably, the X-axis transfer mechanism includes an X coordinate detecting device for detecting the X coordinate value, and the X coordinate detecting device synchronizes with the flash signal of the flash light source to memorize the X coordinate value of the shooting region illuminated by the flash light.
較佳的是，拍攝設備包含：收容拍攝設備的框體、及設置在該框體之前端部附近並具有透光窗的間隔壁等。切削裝置更具有用於供水至由該框體、該間隔壁及保持在該夾盤的晶圓所區隔出之空間內的供水單元。Preferably, the photographing apparatus includes: a housing that houses the photographing device, and a partition wall that is disposed near the front end portion of the frame and has a light transmission window. The cutting device further has a water supply unit for supplying water to the space partitioned by the frame, the partition wall, and the wafer held by the chuck.
藉由本發明，由於構成可在拍攝區域照射閃光燈光以讀取影像的切削裝置，因此在被加工物的校準時或在切削溝的確認時，不必為了讀取影像而停止夾盤，故能達到提高生產性。According to the present invention, since the cutting device that can illuminate the flash light in the imaging region to read the image is formed, it is not necessary to stop the chuck for reading the image during the calibration of the workpiece or when the cutting groove is confirmed. Improve productivity.
又，由於能與閃光燈光之照射同步記錄夾盤之X座標值，因此能確認已讀取之影像的位置。進而，配設供水設備以使接物鏡與拍攝區域之間充滿水時，即使被加工物被切削水所濡濕，也不會受到水以及/或切削屑的影響，仍然能夠讀取切削溝的影像。Further, since the X coordinate value of the chuck can be recorded in synchronization with the illumination of the flash light, the position of the read image can be confirmed. Further, when the water supply device is provided so that the water between the objective lens and the imaging area is filled with water, even if the workpiece is wetted by the cutting water, it is not affected by water and/or chips, and the image of the cutting groove can still be read. .
以下，參照圖式詳細說明本發明實施形態之切削裝置2。第1圖係表示切削裝置2之概要構造圖。切削裝置2包含搭載於靜止基台4上並沿X軸方向伸長的一對導軌6。Hereinafter, the cutting device 2 according to the embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic structural view showing the cutting device 2. The cutting device 2 includes a pair of guide rails 6 that are mounted on the stationary base 4 and elongated in the X-axis direction.
X軸移動滑塊8是藉由滾珠螺桿10以及脈衝馬達12所構成的X軸移送機構(X軸移送設備)14朝加工移送方向，也就是朝X軸方向移動。夾盤20經由圓筒狀支持構件22裝載於X軸移動滑塊8上。The X-axis moving slider 8 is moved in the machining transfer direction, that is, in the X-axis direction by the X-axis transfer mechanism (X-axis transfer device) 14 constituted by the ball screw 10 and the pulse motor 12. The chuck 20 is mounted on the X-axis moving slider 8 via a cylindrical support member 22.
夾盤20具有由多孔性陶瓷等所形成的吸著部(吸著夾頭)24。夾盤20上配設有如第2圖所示之用於夾持環形框架F之複數個(在本實施形態中為4個)夾子26。The chuck 20 has a absorbing portion (suction chuck) 24 formed of a porous ceramic or the like. A plurality of (four in the present embodiment) clips 26 for holding the annular frame F as shown in Fig. 2 are disposed on the chuck 20.
如第2圖所示，作為切削裝置2之加工對象的半導體晶圓W之表面上形成有相直交的第1溝道S1及第2溝道S2，並於由第1溝道S1及第2溝道S2所分隔出的區域形成多數的元件D。As shown in FIG. 2, the first channel S1 and the second channel S2 which are orthogonal to each other are formed on the surface of the semiconductor wafer W to be processed by the cutting device 2, and are formed by the first channel S1 and the second channel. The region separated by the channel S2 forms a plurality of elements D.
晶圓W貼著在作為黏著膠帶的切割膠帶T，切割膠帶T的外周部則貼設在環形框架F上。藉此，晶圓W形成經由切割膠帶T而被環形框架F支撐的狀態，並且藉由如第1圖所示之夾子26夾住環形框架F，支撐固定在夾盤20上。The wafer W is attached to the dicing tape T as an adhesive tape, and the outer peripheral portion of the dicing tape T is attached to the annular frame F. Thereby, the wafer W is formed in a state of being supported by the annular frame F via the dicing tape T, and the ring frame F is sandwiched by the clip 26 as shown in FIG. 1, and is supported and fixed to the chuck 20.
X軸移送機構14包含沿著導軌6配設在靜止基台4上的刻度16，及配設在讀取刻度16的X座標值之X軸移動滑塊8之下面的讀取頭18。讀取頭18與切削裝置2之控制器相連接。The X-axis transfer mechanism 14 includes a scale 16 disposed on the stationary base 4 along the guide rail 6, and a read head 18 disposed below the X-axis moving slider 8 of the X coordinate value of the reading scale 16. The read head 18 is coupled to a controller of the cutting device 2.
靜止基台4上還固定有沿Y軸方向伸長的一對導軌28。Y軸移動滑塊30是藉由滾珠螺桿32以及脈衝馬達34所構成之Y軸移送機構(分割移送機構)36而朝Y軸方向移動。A pair of guide rails 28 elongated in the Y-axis direction are also fixed to the stationary base 4. The Y-axis moving slider 30 is moved in the Y-axis direction by a Y-axis transfer mechanism (divided transfer mechanism) 36 composed of a ball screw 32 and a pulse motor 34.
在Y軸移動滑塊30上形成有朝Z軸方向伸長之一對(僅圖示一支)導軌38。Z軸移動滑塊40是藉由未圖示之滾珠螺桿以及脈衝馬達42所構成的Z軸移送機構44而朝Z軸方向移動。One pair (only one illustrated) guide rail 38 that is elongated in the Z-axis direction is formed on the Y-axis moving slider 30. The Z-axis moving slider 40 is moved in the Z-axis direction by a Z-axis transfer mechanism 44 including a ball screw (not shown) and a pulse motor 42.
46為切削單元(切削設備)，切削單元46之主軸殼體48是插入Z軸移動滑塊40中而受到支撐。在主軸殼體48中收容有主軸，並受空氣軸承可轉動地支撐。主軸是藉由收容在主軸殼體48中且未圖示之馬達驅動旋轉，在主軸的前端部裝設有可拆裝的切削刀片50。46 is a cutting unit (cutting device), and the spindle housing 48 of the cutting unit 46 is inserted into the Z-axis moving slider 40 to be supported. A spindle is housed in the spindle housing 48 and rotatably supported by the air bearing. The main shaft is driven to rotate by a motor (not shown) housed in the spindle housing 48, and a detachable cutting insert 50 is attached to the front end portion of the main shaft.
主軸殼體48上裝載有校準單元(校準設備)52。校準單元52具有用於拍攝保持在夾盤20之晶圓W的拍攝單元(拍攝設備)54。切削刀片50與拍攝單元54是朝X軸方向對齊排列配置。A calibration unit (calibration device) 52 is mounted on the spindle housing 48. The calibration unit 52 has a photographing unit (photographing device) 54 for photographing the wafer W held on the chuck 20. The cutting insert 50 and the imaging unit 54 are arranged in alignment in the X-axis direction.
接著，參照第3圖，針對與本發明實施形態有關之拍攝單元54的構成作詳細說明。拍攝單元54具有用於收納與拍攝區域相對面之接物鏡68的框體56，在該框體56之前端部附近安裝有具有透光窗59的間隔壁58。Next, the configuration of the imaging unit 54 according to the embodiment of the present invention will be described in detail with reference to Fig. 3. The imaging unit 54 has a housing 56 for housing the objective lens 68 on the surface opposite to the imaging area, and a partition wall 58 having a light transmission window 59 is attached near the front end of the housing 56.
在框體56之前端部、間隔壁58、及保持在夾盤20上的晶圓W所區隔出的空間內區劃形成水充填室60。框體56之前端56a與保持在夾盤20上之晶圓W之間的間距以約0.5~1mm左右為佳。在晶圓W之切削加工中，自水源64之水係經由開關閥66以及供水口62而供給填充至水充填室60內。A water filling chamber 60 is formed in a space partitioned by the end portion of the frame 56, the partition wall 58, and the wafer W held on the chuck 20. The spacing between the front end 56a of the frame 56 and the wafer W held on the chuck 20 is preferably about 0.5 to 1 mm. In the cutting process of the wafer W, the water from the water source 64 is supplied and filled into the water filling chamber 60 via the on-off valve 66 and the water supply port 62.
本實施形態的拍攝單元54具有閃光燈光源70。自閃光燈光源70所射出之閃光燈光的一部分是被分光鏡72反射，而經由接物鏡68及透光窗59照射在保持於夾盤20上的晶圓W。The imaging unit 54 of the present embodiment has a flash light source 70. A part of the flash light emitted from the flash light source 70 is reflected by the beam splitter 72, and is irradiated onto the wafer W held on the chuck 20 via the objective lens 68 and the light transmission window 59.
在接物鏡68的光軸上配設有用於拍攝以閃光燈光所照射之晶圓W的CCD相機74。CCD相機74所拍攝的影像輸入至影像處理部76進行影像處理，並且經影像處理部76進行影像處理之影像則以影像記憶部78記憶。A CCD camera 74 for taking a wafer W irradiated with flash light is disposed on the optical axis of the objective lens 68. The image captured by the CCD camera 74 is input to the image processing unit 76 for image processing, and the image subjected to image processing by the image processing unit 76 is stored by the image storage unit 78.
CCD相機74的輸出也同時輸入至LCD等顯示器82，操作員可確認顯示在顯示器82上之切削溝(carve)84的狀態。86為在切削溝84上所形成的缺口(chipping)。The output of the CCD camera 74 is also simultaneously input to a display 82 such as an LCD, and the operator can confirm the state of the cutting groove 84 displayed on the display 82. 86 is a chipping formed on the cutting groove 84.
CCD相機74與閃光燈光源70之發光同步而拍攝保持在夾盤20上之晶圓W的拍攝區域。進而，與閃光燈光源70之發光同步，讀取頭18讀取刻度16之X座標值，該經讀取的X座標值則記憶於X座標記憶部80中。The CCD camera 74 captures the imaging area of the wafer W held on the chuck 20 in synchronization with the illumination of the flash light source 70. Further, in synchronization with the illumination of the flash light source 70, the read head 18 reads the X coordinate value of the scale 16, and the read X coordinate value is stored in the X coordinate storage unit 80.
以下針對如上述所構成之拍攝單元54之作用進行說明。首先，藉由夾盤20吸引保持作為切削加工對象之晶圓W，並驅動X軸移送機構14使晶圓W定位於拍攝單元54正下方。The operation of the imaging unit 54 configured as described above will be described below. First, the wafer W as a cutting target is sucked and held by the chuck 20, and the X-axis transfer mechanism 14 is driven to position the wafer W directly under the imaging unit 54.
本實施形態之拍攝單元54中，由於CCD相機74與閃光燈光之照射同步而拍攝晶圓W之拍攝區域，因此即使晶圓W還在移動中，也能夠取得清楚的靜止影像。In the imaging unit 54 of the present embodiment, since the CCD camera 74 captures the imaging region of the wafer W in synchronization with the illumination of the flash light, a clear still image can be obtained even when the wafer W is still moving.
應切削之晶圓W進行校準時，係一面使夾盤20旋轉θ，一面在沿著同一溝道S1或S2的至少2點實施圖案匹配，該圖案匹配係根據預先記憶於影像處理部76的影像與藉由CCD相機74所取得之影像的目標圖案。When the wafer W to be diced is calibrated, the chuck 20 is rotated by θ, and pattern matching is performed at least two points along the same channel S1 or S2, and the pattern matching is previously stored in the image processing unit 76. The image and the target pattern of the image acquired by the CCD camera 74.
接著，藉由使切削單元46在Y軸方向移動僅目標圖案與溝道S1或S2之中心線之距離分，達成使切削刀片50整齊排列於應切削之切削道S1或S2之校準。Next, by moving the cutting unit 46 in the Y-axis direction only by the distance between the target pattern and the center line of the channel S1 or S2, the alignment of the cutting insert 50 in the cutting path S1 or S2 to be cut is achieved.
完成校準時，由於保持在夾盤20的晶圓W上未附著有切削水或切削屑等，因此不必供給水至水充填室60內。以本實施形態之拍攝單元54在校準時所進行的拍攝，由於是在來自閃光燈光源70的閃光燈光照射時以CCD相機74同步拍攝，因此即使被保持在夾盤20上的晶圓W仍在拍攝單元54的下方移動中，也能拍攝到靜止影像。藉此，能夠迅速地進行晶圓W之拍攝，並能夠縮短校準所需的時間。When the calibration is completed, since the cutting water, the chips, and the like are not attached to the wafer W held on the chuck 20, it is not necessary to supply water into the water filling chamber 60. The photographing performed at the time of calibration by the photographing unit 54 of the present embodiment is simultaneously photographed by the CCD camera 74 when the strobe light from the flash light source 70 is irradiated, so that even the wafer W held on the chuck 20 is still A still image can also be captured while moving below the imaging unit 54. Thereby, the imaging of the wafer W can be performed quickly, and the time required for the calibration can be shortened.
結束校準時，一邊以X軸移送機構14在X軸方向上對夾盤20進行加工移送，一邊使高速旋轉的切削刀片50通過晶圓W切入預定量至切割膠帶T為止，藉此對溝道S1進行切削。When the calibration is completed, the chuck 20 is processed and transferred in the X-axis direction by the X-axis transfer mechanism 14, and the cutting insert 50 that is rotated at a high speed is cut into a predetermined amount by the wafer W to the dicing tape T, thereby aligning the channel. S1 performs cutting.
驅動Y軸移送機構36以使切削刀片50變位移送，並且切削同一方向的所有溝道S1。接著，使夾盤20旋轉90度，對與溝道S1垂直的溝道S2進行切削。The Y-axis transfer mechanism 36 is driven to shift the cutting insert 50 and cut all the channels S1 in the same direction. Next, the chuck 20 is rotated by 90 degrees to cut the channel S2 perpendicular to the channel S1.
在晶圓W之切削過程中欲確認切削溝的狀態時，也就是欲進行缺口檢查時，則驅動X軸移送機構14，使保持在夾盤20上的晶圓W定位至拍攝單元54之正下方。When the state of the cutting groove is to be confirmed during the cutting of the wafer W, that is, when the notch inspection is to be performed, the X-axis transfer mechanism 14 is driven to position the wafer W held on the chuck 20 to the positive of the photographing unit 54. Below.
開啟開關閥66而供水至水充填室60內，然後以乾淨的水沖洗附著在晶圓W上的切削屑以及/或切削水。一邊持續供水至水充填室60內，一邊使閃光燈光源70發光並以閃光燈光照明晶圓W之拍攝區域。The on-off valve 66 is opened to supply water into the water filling chamber 60, and then the chips and/or cutting water attached to the wafer W are rinsed with clean water. While continuing to supply water into the water filling chamber 60, the flash light source 70 is illuminated and the shooting area of the wafer W is illuminated with flash light.
由於與閃光燈光源70之發光同步，而使用CCD相機74拍攝，因此即使夾盤20還在移動中，也能夠以CCD相機74拍攝到清晰的靜止影像。CCD相機74所取得的影像是由影像處理部76進行影像處理，然後該經影像處理過的影像則由影像記憶部78進行記憶。Since it is photographed by the CCD camera 74 in synchronization with the light emission of the flash light source 70, a clear still image can be captured by the CCD camera 74 even if the chuck 20 is still moving. The image obtained by the CCD camera 74 is subjected to image processing by the image processing unit 76, and the image processed image is then memorized by the image storage unit 78.
由於CCD相機74的輸出也同時輸入至顯示器82上，因此在顯示器82上顯示拍攝到的切削溝84。操作員能一邊看著顯示器82上的影像，一邊觀察在切削溝84產生的缺口86等，能確認切削溝84的狀態。Since the output of the CCD camera 74 is also simultaneously input to the display 82, the photographed cutting groove 84 is displayed on the display 82. The operator can observe the image of the display 82 and observe the notch 86 or the like generated in the cutting groove 84, thereby confirming the state of the cutting groove 84.
當在切削溝83之兩側產生之缺口86的比例增多時，則判斷為在切削刀片50上有產生孔隙堵塞等，操作員可執行將切削刀片50更換為新的切削刀片等的處置。When the ratio of the notch 86 generated on both sides of the cutting groove 83 is increased, it is determined that there is a pore clogging or the like on the cutting insert 50, and the operator can perform a treatment of replacing the cutting insert 50 with a new cutting insert or the like.
由於讀取頭18與閃光燈光源70之發光同步而讀取刻度16之X座標值，並記憶在X座標記憶部80中，因此能夠在必要時確認CCD相機74所拍攝之拍攝區域的X軸座標值。Since the read head 18 reads the X coordinate value of the scale 16 in synchronization with the light emission of the flash light source 70 and memorizes it in the X coordinate storage unit 80, it is possible to confirm the X-axis coordinate of the photographing area photographed by the CCD camera 74 as necessary. value.
以本實施形態的拍攝單元54確認切削溝的狀態時，也就是進行缺口檢測時，由於是一邊供水至水充填室60內，一邊以CCD相機74與閃光燈光同步地拍攝拍攝區域，因此即使夾盤20仍在移動中，也能以CCD相機74拍攝靜止影像。因此，能夠迅速地進行截口確認，且即使進行截口確認也能抑制生產性降低。When the photographing unit 54 of the present embodiment confirms the state of the cutting groove, that is, when the notch is detected, the image is captured by the CCD camera 74 in synchronization with the flash light while being supplied into the water filling chamber 60. The disc 20 is still moving, and a still image can be taken with the CCD camera 74. Therefore, it is possible to promptly perform the kerf confirmation, and it is possible to suppress the decrease in productivity even if the kerf is confirmed.
2．．．切削裝置2. . . Cutting device
4．．．靜止基台4. . . Stationary abutment
6．．．導軌6. . . guide
8．．．X軸移動滑塊8. . . X-axis moving slider
10．．．滾珠螺桿10. . . Ball screw
12．．．脈衝馬達12. . . Pulse motor
14．．．X軸移送機構14. . . X-axis transfer mechanism
16．．．刻度16. . . Scale
18．．．讀取頭18. . . Read head
20．．．夾盤20. . . Chuck
22．．．支撐構件twenty two. . . Support member
24．．．吸著部twenty four. . . Sucking department
26．．．夾子26. . . Clip
28．．．導軌28. . . guide
30．．．Y軸移動滑塊30. . . Y axis moving slider
32．．．滾珠螺桿32. . . Ball screw
34．．．脈衝馬達34. . . Pulse motor
36．．．Y軸移送機構36. . . Y-axis transfer mechanism
38．．．導軌38. . . guide
40．．．Z軸移動滑塊40. . . Z axis moving slider
42．．．脈衝馬達42. . . Pulse motor
44．．．Z軸移送機構44. . . Z-axis transfer mechanism
46．．．切削單元46. . . Cutting unit
48．．．主軸殼體48. . . Spindle housing
50．．．切削刀片50. . . Cutting insert
52．．．校準單元52. . . Calibration unit
54．．．拍攝單元54. . . Shooting unit
56．．．框體56. . . framework
56a．．．前端56a. . . front end
58．．．間隔壁58. . . Partition wall
59．．．透光窗59. . . Light transmission window
60．．．水充填室60. . . Water filling room
62．．．供水口62. . . Water supply port
64．．．水源64. . . Water source
66．．．開關閥66. . . Switch valve
68．．．接物鏡68. . . Mirror
70．．．閃光燈光源70. . . Flash light source
72．．．分光鏡72. . . Beam splitter
74．．．CCD相機74. . . CCD camera
76．．．影像處理部76. . . Image processing department
78．．．影像記憶部78. . . Image memory department
80．．．X座標記憶部80. . . X coordinate memory
82．．．顯示器82. . . monitor
84．．．切削溝84. . . Cutting groove
86．．．缺口86. . . gap
W．．．晶圓W. . . Wafer
F．．．環形框架F. . . Ring frame
D．．．元件D. . . element
T．．．切割膠帶T. . . Cutting tape
S1．．．第1溝道S1. . . First channel
S2．．．第2溝道S2. . . Second channel
第1圖係本發明實施形態之切削裝置之概略構成圖。Fig. 1 is a schematic configuration diagram of a cutting device according to an embodiment of the present invention.
第2圖係經由切割膠帶而保持在環狀框架上之半導體晶圓的立體圖。Fig. 2 is a perspective view of a semiconductor wafer held on a ring frame via a dicing tape.
第3圖係本發明實施形態之拍攝單元的構成圖。Fig. 3 is a view showing the configuration of an imaging unit according to an embodiment of the present invention.
16．．．刻度16. . . Scale
18．．．讀取頭18. . . Read head
20．．．夾盤20. . . Chuck
54．．．拍攝單元54. . . Shooting unit
56．．．框體56. . . framework
56a．．．前端56a. . . front end
58．．．間隔壁58. . . Partition wall
59．．．透光窗59. . . Light transmission window
60．．．水充填室60. . . Water filling room
62．．．供水口62. . . Water supply port
64．．．水源64. . . Water source
66．．．開關閥66. . . Switch valve
68．．．接物鏡68. . . Mirror
70．．．閃光燈光源70. . . Flash light source
72．．．分光鏡72. . . Beam splitter
74．．．CCD相機74. . . CCD camera
76．．．影像處理部76. . . Image processing department
78．．．影像記憶部78. . . Image memory department
80．．．X座標記憶部80. . . X coordinate memory
82．．．顯示器82. . . monitor
84．．．切削溝84. . . Cutting groove
86．．．缺口86. . . gap
W．．．晶圓W. . . Wafer
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| JP2012253297A (en) * | 2011-06-07 | 2012-12-20 | Disco Abrasive Syst Ltd | Process device |
| JP5846768B2 (en) * | 2011-06-07 | 2016-01-20 | 株式会社ディスコ | Processing equipment |
| JP2012253298A (en) * | 2011-06-07 | 2012-12-20 | Disco Abrasive Syst Ltd | Process device |
| TW201249586A (en) * | 2011-06-09 | 2012-12-16 | Tech Plus Prec Machinery Industry Co Ltd | Machining center allowing multi-workpiece alignment |
| JP5904721B2 (en) * | 2011-06-10 | 2016-04-20 | 株式会社ディスコ | Line detection method |
| JP2012256794A (en) * | 2011-06-10 | 2012-12-27 | Disco Abrasive Syst Ltd | Processing device |
| JP2012256795A (en) * | 2011-06-10 | 2012-12-27 | Disco Abrasive Syst Ltd | Processing device |
| JP5751940B2 (en) * | 2011-06-10 | 2015-07-22 | 株式会社ディスコ | Processing equipment |
| JP5777415B2 (en) * | 2011-06-10 | 2015-09-09 | 株式会社ディスコ | Line detection method |
| CN107664833B (en) * | 2016-07-29 | 2020-10-16 | 上海微电子装备（集团）股份有限公司 | Machine vision system for aligning substrate and aligning device |
| JP2019040916A (en) * | 2017-08-22 | 2019-03-14 | 株式会社ディスコ | Processing method |
| CN115037839A (en) * | 2021-03-05 | 2022-09-09 | 周万中 | Data shooting device |
| CN114169675B (en) * | 2021-11-01 | 2022-12-13 | 深圳市匠心智汇科技有限公司 | Method and device for monitoring cutting processing, terminal equipment and storage medium |
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| JP5274960B2 (en) | 2013-08-28 |
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