TWI459020B - A method for manufacturing a heat resistant composite lens - Google Patents

A method for manufacturing a heat resistant composite lens Download PDF

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TWI459020B
TWI459020B TW097145715A TW97145715A TWI459020B TW I459020 B TWI459020 B TW I459020B TW 097145715 A TW097145715 A TW 097145715A TW 97145715 A TW97145715 A TW 97145715A TW I459020 B TWI459020 B TW I459020B
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lens
resin
group
resin layer
substrate
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TW201020581A (en
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Masatoshi Yuasa
Toshihiro Kawatani
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Nippon Steel & Sumikin Chem Co
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Description

耐熱性複合型透鏡之製造方法Heat-resistant composite lens manufacturing method

本發明係關於一種耐熱性複合型透鏡,其特徵係關於一種將樹脂層接合於透鏡基材上所成之複合型透鏡,例如搭載於行動電話、數位照相機等之附有透鏡之CCD(Charge Coupled Device)或附有透鏡之CMOS(相補性金屬氧化膜半導體)感應器等,而適合將半導體及透鏡作成一體化之照相機模組的透鏡等使用者。The present invention relates to a heat-resistant composite lens characterized by a composite lens in which a resin layer is bonded to a lens substrate, for example, a lens-attached CCD (Charge Coupled) mounted on a mobile phone or a digital camera. Device) or a CMOS (complementary metal oxide film semiconductor) sensor with a lens, etc., and is suitable for a user such as a lens of a camera module in which a semiconductor and a lens are integrated.

傳統上,照相機模組用透鏡係基於低價格化之目的而使用塑膠製之透鏡。塑膠製之透鏡,可將聚碳酸酯樹脂、甲基丙烯酸樹脂、脂環式烯烴聚合物等透明樹脂加以射出成形等,而製得凸透鏡或凹透鏡。Conventionally, a lens for a camera module uses a lens made of plastic based on the purpose of lowering the price. A plastic lens can be obtained by injection molding a transparent resin such as a polycarbonate resin, a methacrylic resin or an alicyclic olefin polymer to obtain a convex lens or a concave lens.

近年來,基於電子零件之實裝成本降低之目的,有提案將照相機模組與其他之電子零件同樣地,進行迴流焊接從而能一次性地實裝之方法,其須要能耐住迴焊爐之熱(260℃)。然而,現行之塑膠製透鏡因其耐熱溫度僅在180℃以下,故無法通過迴焊爐。In recent years, based on the purpose of reducing the cost of mounting electronic components, there is a proposal to reflow soldering the camera module in the same manner as other electronic components, so that it can be mounted in one time. (260 ° C). However, the current plastic lens cannot pass the reflow furnace because its heat resistance temperature is only below 180 °C.

解決此課題之手段之一,例如特開2004-133328號公報(專利文獻1)所記載者,係將能耐住迴焊溫度之熱或光硬化性樹脂作成後補材料。然而,一般而言,卻有硬化性樹脂容易因反應時所產生之硬化收縮而造成成形過程上之成型破裂,甚至難以確保成型物之模具複製性的安定等問題。For example, the heat or photocurable resin which can withstand the reflow temperature is used as a post-repair material as described in JP-A-2004-133328 (Patent Document 1). However, in general, the curable resin is liable to cause molding cracking in the forming process due to hardening shrinkage generated during the reaction, and it is difficult to ensure the stability of mold reproducibility of the molded product.

此外,又如特開2005-60657號公報(專利文獻2)所記載者,係將玻璃透鏡作為母材而在其表面上使熱或光硬化性樹脂成膜之複合型透鏡。然而,上述傳統之複合型透鏡,因玻璃與樹脂之線膨脹係數之差等因素,特別在濕熱環境下其與玻璃樹脂界面之密接性會容易降低,從而在耐久性之點上並不完全。進而,複合型透鏡,其母材的玻璃透鏡相較於塑膠製透鏡而言,卻因成形時間長、大量生產有困難,而導致其製造成本高,並在要求能使宜且大量生產之行動電話或數位相機用之照相機模組上,尚不適合。In addition, as described in JP-A-2005-60657 (Patent Document 2), a composite lens in which a glass lens is used as a base material and a heat or photocurable resin is formed on the surface thereof is used. However, in the conventional composite lens described above, the adhesion between the glass and the resin is particularly likely to be lowered in the wet heat environment due to the difference in linear expansion coefficient between the glass and the resin, and the durability is not complete. Further, in the composite lens, the glass lens of the base material is more expensive to manufacture due to the long forming time and the mass production than the plastic lens, and the action is required to be suitable and mass-produced. It is not suitable for camera modules for telephones or digital cameras.

專利文獻1:特開2004-133328公報Patent Document 1: JP-A-2004-133328

專利文獻2:特開2005-60657公報Patent Document 2: JP-A-2005-60657 Gazette

因此,本發明為解決上述課題起見,其目的在於提供一種耐熱性複合型透鏡,其特徵係適合於作為能耐住迴流焊接步驟之照相機模組用之透鏡等。In view of the above problems, an object of the present invention is to provide a heat-resistant composite lens which is suitable for use as a lens for a camera module capable of withstanding a reflow soldering step.

本發明者們,為解決傳統之塑膠製透鏡或複合型透鏡之問題點,而進行銳意檢討之結果,發現了至少將具有籠型構造之聚有機矽倍半氧烷(silsesquioxane)為主成分之聚矽酮樹脂所成之硬化樹脂適用於透鏡基材上,進而將由該硬化樹脂所成之樹脂層接合於在該透鏡基材上,就可提供一種便宜且可供應於迴流焊接步驟之耐熱性複合型透鏡,從而完成了本發明。As a result of intensive review to solve the problem of the conventional plastic lens or composite lens, the inventors have found that at least a polyorgano-silsesquioxane having a cage structure is mainly composed. The hardened resin formed by the polyketone resin is applied to the lens substrate, and the resin layer formed of the cured resin is bonded to the lens substrate to provide an inexpensive heat supply which can be supplied to the reflow soldering step. A composite lens has been completed, thereby completing the present invention.

亦即,本發明係:一種耐熱性複合型透鏡,其特徵為其係將樹脂層接合於透鏡基材上所成之複合型透鏡,且透鏡基材及樹脂層係各由硬化樹脂所成,至少透鏡基材係以下述一般式(1)所示,That is, the present invention is a heat-resistant composite lens characterized by being a composite lens in which a resin layer is bonded to a lens substrate, and the lens substrate and the resin layer are each formed of a hardened resin. At least the lens substrate is represented by the following general formula (1),

(RSiO1.5 )m (RsiO0.5 )n  (1)(RSiO 1.5 ) m (RsiO 0.5 ) n (1)

(惟,R係(a)-R1 -OCO-CR2 =CH2 、(b)-R1 -CR2 =CH2 或(c)-CH=CH2 所示之不飽和基、烷基、環烷基、環烯基、苯基、氫原子、烷氧基、或烷基甲矽烷氧基,式(1)中之多數R可為相異者,惟至少1個係含有上述(a)、(b)或(c)之任一者,R1 係伸烷基、烷叉或伸苯基,R2 係氫或烷基,m=8~16,n=0~4之數),在構造單位中係以具有籠型構造之聚有機矽倍半氧烷為主成分之聚矽酮樹脂進行硬化所成者。(R), R system (a)-R 1 -OCO-CR 2 =CH 2 , (b)-R 1 -CR 2 =CH 2 or (c)-CH=CH 2 unsaturated group, alkyl group a cycloalkyl group, a cycloalkenyl group, a phenyl group, a hydrogen atom, an alkoxy group or an alkylcarbomethoxy group, wherein a plurality of R in the formula (1) may be different, but at least one of the above contains (a) Or (b) or (c), R 1 is an alkyl group, an alkylidene or a phenyl group, R 2 is a hydrogen or an alkyl group, m = 8 to 16, and n = 0 to 4) In the structural unit, the polyfluorene ketone resin having a polyorgano sesquioxane having a cage structure as a main component is hardened.

此外,本發明之較佳態樣,其中上述樹脂層係以一般式(1)所示,且在構造單位中係以具有籠型構造之聚有機矽倍半氧烷為主成分之聚矽酮樹脂進行硬化所成者。Further, in a preferred aspect of the invention, the resin layer is represented by the general formula (1), and in the structural unit, a polyfluorene ketone having a polyorgano sesquioxanes having a cage structure as a main component The resin is hardened.

在本發明中,亦可獲得一種硬化樹脂,其中對於上述聚矽酮樹脂,係配合有在分子中至少具有1個氫化甲矽烷基之化合物及/或具有伸乙基性不飽和基之化合物,進而再配合氫化甲矽烷基化觸媒及/或自由基開始劑所得之硬化性樹脂組成物後,而使該硬化性樹脂組成物發生熱硬化或光硬化所成者。In the present invention, a hardening resin may be obtained, wherein the polyfluorene ketone resin is compounded with a compound having at least one hydrogenated methyl hydrazine group in the molecule and/or a compound having an ethylenically unsaturated group. Further, after the curable resin composition obtained by hydrogenating a formazan-catalyzed catalyst and/or a radical initiator is further added, the curable resin composition is thermally cured or photocured.

以下,茲具體地說明本發明。Hereinafter, the present invention will be specifically described.

本發明中之樹脂基材及樹脂層各係由硬化樹脂所成,其中至少樹脂基材係由以下具體說明之聚矽酮樹脂所硬化而成者。亦即,本發明所使用之聚矽酮樹脂,係以上述一般式(1)所示,亦即在構造單位中具有籠型構造之聚有機矽倍半氧烷(以下,亦稱為「籠型構造之聚有機矽倍半氧烷」)為主成分者。在此,構造單位,具體上係指在一般式(1)中以m或n所示之重複單位,所謂在構造單位中具有籠型構造者,係指m或n所示之重複單位之一者或二者係具有籠型構造之意。此外,具有籠型構造之聚有機矽倍半氧烷,如以下所說明者,係由三次元多面體構造骨架及R所構成者,惟其中三次元多面體構造骨架之一部為開環者(亦即不完全之籠型構造)亦包含在內。Each of the resin base material and the resin layer in the present invention is made of a cured resin, and at least the resin base material is cured by a polyketone resin which will be specifically described below. That is, the polyfluorene ketone resin used in the present invention is a polyorgano sesquioxanes having a cage structure as shown in the above general formula (1), that is, a cage structure in a structural unit (hereinafter, also referred to as "cage" The structure of polyorganophosphoric acid sesquioxane" is the main component. Here, the structural unit specifically refers to a repeating unit represented by m or n in the general formula (1), and the so-called cage type construct in the structural unit means one of the repeating units indicated by m or n. The two or both have the meaning of a cage structure. Further, the polyorganopurine sesquioxane having a cage structure is composed of a ternary polyhedral structural skeleton and R as described below, but one of the three-dimensional polyhedral structural skeletons is an open loop (also That is, the incomplete cage structure is also included.

在此,一般式(1)中,係以R之至少1個為上述(a)、(b)或(c)所示之不飽和基為必要,此等之不飽和基之具體例子,有3-甲基丙烯氧基丙基、3-丙烯氧基丙基、芳基、乙烯基、及苯乙烯基等。本發明之聚矽酮樹脂中,在具有籠型構造之聚有機矽倍半氧烷以外,尚包含具有以下構造或不包含籠型構造之聚矽酮樹脂,其比例則以未達30wt%為較佳。Here, in the general formula (1), it is necessary that at least one of R is an unsaturated group represented by the above (a), (b) or (c), and specific examples of such unsaturated groups are 3-methacryloxypropyl, 3-propenyloxypropyl, aryl, vinyl, and styryl groups. In the polyfluorene ketone resin of the present invention, in addition to the polyorganosilsesquioxane having a cage structure, a polyfluorene ketone resin having the following structure or no cage structure is included, and the ratio is less than 30% by weight. Preferably.

(上述式中,R之至少一部係以一般式(1)所示之基,y則係重複數1~1000)(In the above formula, at least one of R is a base represented by the general formula (1), and y is a repeat number of 1 to 1000)

一般式(1),係表示由三次元多面體構造骨架及R所構成之籠型聚矽氧烷,其各自之例子,當一般式(1)中之m為8且n為0時,其為下述構造式(3);當m為10且n為0時,其為下述構造式(4);當m為12且n為0時,其為下述構造式(5);以及,當m為8且n為2時,其為下述構造式(6)。惟,以一般式(1)所示之聚矽酮樹脂,並不限於此等之構造式(3)、(4)、(5)、及(6)所示者。The general formula (1) is a cage-type polyoxane composed of a ternary polyhedral structure skeleton and R, and each of them is an example. When m in the general formula (1) is 8 and n is 0, it is The following structural formula (3); when m is 10 and n is 0, it is the following structural formula (4); when m is 12 and n is 0, it is the following structural formula (5); When m is 8 and n is 2, it is the following structural formula (6). However, the polyketone resin represented by the general formula (1) is not limited to those represented by the structural formulae (3), (4), (5), and (6).

上述構造式(3)、(4)、及(5)所示之籠型聚矽氧烷,係可單獨或複數使用以下述一般式(7)所示之矽化合物,The cage polyoxyalkylene represented by the above structural formulas (3), (4), and (5) may be used singly or in combination with the oxime compound represented by the following general formula (7).

RSiX3  (7)RSiX 3 (7)

(惟,R係(a)-R1 -OCO-CR2 =CH2 、(b)-R1 -CR2 =CH2 或(c)-CH=CH2 所示之不飽和基、烷基、環烷基、環烯基、苯基、氫原子、烷氧基、或烷基甲矽烷氧基,R1 係伸烷基、烷叉或伸苯基,R2 係氫或烷基,此外,X為選自烷氧基、鹵原子、及羥基之群之1種之水解性基),而在鹼性觸媒下,以非極性溶劑及極性溶劑中之一者或二者同時使用之溶劑進行水解,同時使其一部縮合而製得。(R), R system (a)-R 1 -OCO-CR 2 =CH 2 , (b)-R 1 -CR 2 =CH 2 or (c)-CH=CH 2 unsaturated group, alkyl group , cycloalkyl, cycloalkenyl, phenyl, hydrogen, alkoxy, or alkylcarboxykoxy, R 1 is alkyl, alkyl or phenyl, R 2 is hydrogen or alkyl, X is a hydrolyzable group selected from the group consisting of an alkoxy group, a halogen atom, and a hydroxyl group, and is used as a one or both of a nonpolar solvent and a polar solvent under an alkaline catalyst. The solvent is hydrolyzed while being condensed in one part.

此外,以上述構造式(6)所示之籠型聚矽氧烷,則係可將構造式(3)、(4)、或(5)所示之籠型聚矽氧烷,進一步在非極性溶劑及鹼性觸媒之存在下使其發生再縮合所製得之再縮合物上,使二矽氧烷化合物進行平衡化反應而得者。Further, in the case of the cage type polyoxane represented by the above structural formula (6), the cage type polyoxane represented by the structural formula (3), (4), or (5) can be further The re-condensation product obtained by re-condensation in the presence of a polar solvent and a basic catalyst is obtained by subjecting a dioxane compound to an equilibrium reaction.

關於在得到構造式(3)~(6)之籠型矽氧烷時之極性溶劑,例如有甲醇、乙醇、2-丙醇等之醇類等。此外,關於非極性溶劑,例如有甲苯、二甲苯、苯等。再者,關於鹼性觸媒,例如有四甲基氫氧化銨、四乙基氫氧化銨、四丁基氫氧化銨、苄基三甲基氫氧化銨、苄基三乙基氫氧化銨等之氫氧化銨鹽。其中,又基於高觸媒活性之觀點,係以四甲基氫氧化銨為較佳。再者,鹼性觸媒,一般則使用水溶液。Examples of the polar solvent in the case of obtaining the cage-type siloxane of the structural formulae (3) to (6) include alcohols such as methanol, ethanol, and 2-propanol. Further, as the nonpolar solvent, for example, toluene, xylene, benzene or the like is mentioned. Further, examples of the basic catalyst include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide, benzyltrimethylammonium hydroxide, benzyltriethylammonium hydroxide, and the like. Ammonium hydroxide salt. Among them, tetramethylammonium hydroxide is preferred from the viewpoint of high catalyst activity. Further, in the case of an alkaline catalyst, an aqueous solution is generally used.

此外,在本發明中,對於聚矽酮樹脂,可配合在分子中至少具有1個伸乙基性不飽和雙鍵之化合物、或在分子中至少具有氫化甲矽烷基之化合物之任一者,而作成硬化性樹脂組成物;亦可將此等二者加以配合,而作成硬化性樹脂組成物。接著,亦可將此種硬化性樹脂組成物施以熱硬化或光硬化而得到透鏡基材或樹脂層之任一者或二者。在此,如係配合在分子中至少具有一個伸乙基性不飽和雙鍵之化合物時,可使其在硬化性樹脂組成物中含有自由基開始劑;又如係配合在分子中至少具有氫化甲矽烷基之化合物時,則可使其在硬化性樹脂組成物中含有氫化甲矽烷基化觸媒。Further, in the present invention, as the polyfluorenone resin, any one of a compound having at least one ethylenically unsaturated double bond in the molecule or a compound having at least a hydrogenated methyl group in the molecule may be blended. Further, a curable resin composition is prepared; and these two may be blended to form a curable resin composition. Next, the curable resin composition may be thermally cured or photocured to obtain either or both of a lens substrate or a resin layer. Here, if a compound having at least one ethylenically unsaturated double bond in the molecule is blended, it may contain a radical initiator in the curable resin composition; and if it is a compound, it has at least hydrogenation in the molecule. In the case of a compound of a germyl group, a hydroformylation catalyst can be contained in the curable resin composition.

關於在上述分子中至少具有一個伸乙基性不飽和雙鍵之化合物,只要係可與聚矽酮樹脂及自由基共聚合之不飽和化合物即可,惟在配合於上述聚矽酮樹脂上,適合者可大別為該構造單位之重複數為2~20左右之聚合物之反應性低聚物,以及低分子量且低黏度之反應性單體。此外,其亦可大別為具有1個不飽和基之單官能不飽和化合物及具有2個以上之多官能不飽和化合物。為得到良好之3次元交聯體起見,可含有極少量(1%以下左右)之多官能不飽和化合物,惟如期待共聚物之耐熱性、強度等時,係以每一個分子,平均1.1個以上為較佳,1.5個以上為更佳,1.6~5個為最佳。因此,亦可混合使用單官能不飽和化合物及具有2~5個不飽和基之多官能不飽和化合物,並調整其平均之官能基數。The compound having at least one ethylenically unsaturated double bond in the above molecule may be an unsaturated compound which can be copolymerized with a polyfluorene ketone resin and a radical, but is compounded on the above polyfluorene ketone resin. Suitable polymers are reactive oligomers of polymers having a repeat number of from 2 to 20, and low molecular weight and low viscosity reactive monomers. Further, it may be a monofunctional unsaturated compound having one unsaturated group and a polyfunctional unsaturated compound having two or more. For the purpose of obtaining a good 3D crosslinked body, a very small amount (about 1% or less) of a polyfunctional unsaturated compound may be contained, and when the heat resistance and strength of the copolymer are expected, the average molecular weight per molecule is 1.1. More than one is preferred, 1.5 or more is better, and 1.6 to 5 is the best. Therefore, a monofunctional unsaturated compound and a polyfunctional unsaturated compound having 2 to 5 unsaturated groups may be used in combination, and the average number of functional groups may be adjusted.

具體而言,反應性低聚物,例如有環氧基丙烯酸酯、環氧化油丙烯酸酯、胺基甲酸酯丙烯酸酯、不飽和聚酯、聚酯丙烯酸酯、聚醚丙烯酸酯、乙烯基丙烯酸酯、聚烯/硫醇、聚矽酮丙烯酸酯、聚丁二烯、聚苯乙烯乙基甲基丙烯酸酯等。此等係單官能不飽和化合物及多官能不飽和化合物,反應性之單官能單體,例如有苯乙烯、醋酸乙烯酯、N-乙烯基吡咯烷酮、丁基丙烯酸酯、2-乙基己基丙烯酸酯、n-己基丙烯酸酯、環己基丙烯酸酯、n-癸基丙烯酸酯、異冰片基丙烯酸酯、二環戊烯氧基乙基丙烯酸酯、苯氧基乙基丙烯酸酯、三氟乙基甲基丙烯酸酯等。此外,反應性之多官能單體,例如有一般式(2)以外之不飽和化合物之三丙二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、雙酚A二環氧丙基醚二丙烯酸酯、四乙二醇二丙烯酸酯、羥基三甲基乙酸新戊基乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸酯等。Specifically, reactive oligomers such as epoxy acrylate, epoxidized acrylate, urethane acrylate, unsaturated polyester, polyester acrylate, polyether acrylate, vinyl acrylic Ester, polyene/thiol, polyketone acrylate, polybutadiene, polystyrene ethyl methacrylate, and the like. These are monofunctional unsaturated compounds and polyfunctional unsaturated compounds, reactive monofunctional monomers such as styrene, vinyl acetate, N-vinyl pyrrolidone, butyl acrylate, 2-ethylhexyl acrylate , n-hexyl acrylate, cyclohexyl acrylate, n-mercapto acrylate, isobornyl acrylate, dicyclopentenyloxyethyl acrylate, phenoxyethyl acrylate, trifluoroethyl methyl Acrylate and the like. Further, a reactive polyfunctional monomer such as tripropylene glycol diacrylate, 1,6-hexanediol diacrylate, bisphenol A diepoxypropyl ether, which is an unsaturated compound other than the general formula (2) Acrylate, tetraethylene glycol diacrylate, hydroxytrimethylacetic acid neopentyl glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate Wait.

本發明所可使用之在分子中至少具有1個伸乙基性不飽和雙鍵之化合物,除上述所例示者外,並可使用各種反應性低聚物或單體。此外,此等之反應性低聚物或單體,可各自單獨使用,亦可將2種類以上混合使用。藉由將此等進行自由基共聚合,亦可同樣地製得聚矽酮樹脂共聚物。A compound having at least one ethylenically unsaturated double bond in the molecule which can be used in the present invention can be used, and various reactive oligomers or monomers can be used in addition to those exemplified above. Further, these reactive oligomers or monomers may be used singly or in combination of two or more kinds. The polyfluorenone resin copolymer can also be obtained in the same manner by radical copolymerization of these.

與在分子中至少具有1個伸乙基性不飽和雙鍵之化合物一起配合使用之自由基開始劑,只要係可作為光聚合開始劑或熱聚合開始劑皆可。在此,光聚合開始劑,其適合使用者有苯乙酮系、苯偶因系、二苯甲酮系、噻噸酮系、醯基膦氧化物系等之化合物。具體而言,例如有三氯苯乙酮、二乙氧基苯乙酮、1-苯基-2-羥基-2-甲基丙烷-1-酮、1-羥基-環己基苯基酮、2-甲基-1-(4-甲基硫苯基)-2-嗎啉代丙烷-1-酮、苯偶因甲基醚、噻噸酮、2,4,6-三甲基苯甲醯二苯基膦氧化物、甲基苯基乙醛酸酯、樟腦醌、苯偶醯、蒽醌、米蚩酮等。此外,亦可與光聚合開始劑加以組合而併用能發揮效果之光開始助劑或增感劑(sensitizer)。此等光聚合開始劑,可以單獨使用,亦可將2種類以上混合使用。The radical initiator which is used in combination with a compound having at least one ethylenically unsaturated double bond in the molecule may be used as a photopolymerization initiator or a thermal polymerization initiator. Here, the photopolymerization initiator is suitable for a compound such as an acetophenone-based, a benzoin-based, a benzophenone-based, a thioxanthone-based or a mercaptophosphine-based oxide. Specifically, for example, trichloroacetophenone, diethoxyacetophenone, 1-phenyl-2-hydroxy-2-methylpropan-1-one, 1-hydroxy-cyclohexyl phenyl ketone, 2- Methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, benzoin methyl ether, thioxanthone, 2,4,6-trimethylbenzhydryl Phenylphosphine oxide, methylphenylglyoxylate, camphorquinone, benzoin, anthracene, rice ketone, and the like. Further, it is also possible to use a photopolymerization initiator in combination with a photoinitiator or a sensitizer which can exert an effect. These photopolymerization initiators may be used singly or in combination of two or more types.

再者,基於上述目的所使用之熱聚合開始劑,其適合使用者有酮過氧化物系、過氧化縮酮系、氫過氧化物系、二烷基過氧化物系、二醯基過氧化物系、過氧基二碳酸酯系、過氧基酯系等各種之有機過氧化物。具體而言,例如有環己酮過氧化物、1,1-雙(t-六過氧)環己酮、枯烯氫過氧化物、二枯烯基過氧化物、苯甲醯過氧化物、二異丙基過氧化物、t-丁基過氧基-2-乙基己酸酯等,惟不限於此等之範圍。此外,此等熱聚合開始劑,可以單獨使用,亦可將2種類以上混合使用。Further, a thermal polymerization initiator used for the above purpose is suitable for a user having a ketone peroxide system, a peroxyketal system, a hydroperoxide system, a dialkyl peroxide system, and a dithiol peroxidation. Various organic peroxides such as a system, a peroxydicarbonate system, and a peroxy ester system. Specifically, for example, cyclohexanone peroxide, 1,1-bis(t-hexaperoxy)cyclohexanone, cumene hydroperoxide, dicumyl peroxide, benzamidine peroxide , diisopropyl peroxide, t-butylperoxy-2-ethylhexanoate, etc., but are not limited to these ranges. Further, these thermal polymerization initiators may be used singly or in combination of two or more kinds.

自由基開始劑,如配合有光聚合開始劑或熱聚合開始劑時,其添加量,相對於聚矽酮樹脂100重量份,係以0.1~5重量份之範圍為較佳,並以0.1~3重量份之範圍為最佳。此添加量如未達0.1重量份時,硬化會不完全,所得到之透鏡之強度或剛性會降低。另一方面,如超過5重量份時,則會產生透鏡之著色等問題。The radical initiator, when a photopolymerization initiator or a thermal polymerization initiator is blended, is preferably added in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the polyfluorenone resin, and is 0.1 to 0.1% by weight. The range of 3 parts by weight is optimal. If the amount is less than 0.1 part by weight, the hardening may be incomplete and the strength or rigidity of the obtained lens may be lowered. On the other hand, when it exceeds 5 parts by weight, problems such as coloring of the lens may occur.

另一方面,關於在上述分子中至少具有氫化甲矽烷基之化合物,其較佳者係低聚物及單體,且該低聚物及單體之特徵為在分子中之矽原子上至少具有1個以上之可氫化甲矽烷基化之氫原子。在矽原子上具有氫原子之低聚物,例如有聚氫二烯矽氧烷類、聚二甲基氫甲矽烷氧基矽氧烷類及其共聚物、末端係以二甲基氫甲矽烷氧基進行修飾之矽氧烷等。再者,在矽原子上具有氫原子之單體,例如有四甲基環四矽氧烷、五甲基環戊烷等之環狀矽氧烷類、二氫二矽氧烷類、三氫單矽烷類、二氫單矽烷類、單氫單矽烷類、二甲基甲矽烷氧基矽氧烷類等。此等亦可將2種類以上混合使用。On the other hand, as the compound having at least a hydrogenated methylation group in the above molecule, it is preferably an oligomer and a monomer, and the oligomer and the monomer are characterized by having at least a ruthenium atom in the molecule. More than one hydrogen atom which can be hydrogenated to formylated. An oligomer having a hydrogen atom on a ruthenium atom, for example, a polyhydrogenadiene oxyalkylene, a polydimethylhydroformaloxy alkoxy olefin, a copolymer thereof, and a terminal dimethyl hydroformane A methoxy group modified with an oxy group. Further, as the monomer having a hydrogen atom on the ruthenium atom, for example, a cyclic siloxane such as tetramethylcyclotetraoxane or pentamethylcyclopentane, dihydrodioxane or trihydrogen is used. Monodecanes, dihydromonodecanes, monohydromonodecanes, dimethylformamoxyoxyalkylenes, and the like. These may also be used in combination of two or more types.

與在分子中至少具有氫甲矽烷氧基之化合物一起配合使用之氫甲矽烷基觸媒,例如有氯鉑(IV)、氯鉑酸、氯鉑酸及醇、醛、酮之錯合物、氯鉑酸及烯烴類之錯合物、鉑及乙烯基矽氧烷之錯合物、二羰基二氯鉑及鈀系觸媒、銠系觸媒等鉑族金屬系觸媒。此等之中,基於觸媒活性之觀點,係以選自氯鉑酸、氯鉑酸及烯烴類之錯合物、以及鉑及乙烯基矽氧烷之錯合物為較佳。此外,此等可以單獨使用,亦可將2種類以上混合使用。a hydroformamidine catalyst used in combination with a compound having at least a hydroformyloxy group in the molecule, for example, a chloroplatinum (IV), a chloroplatinic acid, a chloroplatinic acid, and a complex of an alcohol, an aldehyde, a ketone, A complex of chloroplatinic acid and an olefin, a complex of platinum and a vinyl siloxane, a platinum group metal catalyst such as dicarbonyl chloroplatinum, a palladium catalyst or a ruthenium catalyst. Among these, from the viewpoint of catalyst activity, a complex selected from the group consisting of chloroplatinic acid, chloroplatinic acid, and an olefin, and a complex of platinum and vinyl decane are preferred. Further, these may be used alone or in combination of two or more types.

如配合有上述氫甲矽烷基化觸媒時,其添加量,相對於聚矽酮樹脂的重量,係以1~1000ppm為較佳,並以20~500ppm之範圍為最佳。氫甲矽烷基觸媒可以單獨使用,亦可與先前說明之自由基開始劑進行組合,而將2種類以上併用。When the hydroformylation catalyst is blended, the amount thereof is preferably from 1 to 1,000 ppm, more preferably from 20 to 500 ppm, based on the weight of the polyfluorene ketone resin. The hydroformylalkyl catalyst may be used singly or in combination with the radical initiator described above, and two or more types may be used in combination.

在本發明中,製得含有上述聚矽銅樹脂之硬化性樹脂組成物時,基於使含有聚矽酮樹脂硬化而得到複合型透鏡之目的,或將複合型透鏡之物性加以改良之目的,其係以適當選擇:在分子中至少具有1個伸乙基性不飽和雙鍵之化合物、在分子中至少具有1個氫甲矽烷基之化合物、自由基開始劑、氫甲矽烷基化觸媒等而加以配合為較佳。亦即,如配合有:具有伸乙基性不飽和雙鍵之化合物、或具有氫甲矽烷基之化合物時,可配合作為促進反應之添加劑之氫甲矽烷基化觸媒獲自由基開始劑(熱聚合開始劑或光聚合開始劑),進而,亦可配合熱聚合促進劑、光開始助劑、銳感劑等。此外,只要在不逸脫本發明目的之範圍下,可添加有機/無機填充劑、可塑劑、難燃劑、熱安定劑、抗氧化劑、光安定劑、紫外線吸收劑、滑劑、抗靜電劑、脫模劑、發泡劑、核劑、著色劑、交聯劑、分散助劑、樹脂成分等之各種添加劑。In the present invention, when the curable resin composition containing the above polyfluorene copper resin is obtained, the purpose of obtaining a composite lens by curing the polyfluorene-containing resin or improving the physical properties of the composite lens is It is suitably selected: a compound having at least one ethylenically unsaturated double bond in the molecule, a compound having at least one hydroformyl group in the molecule, a radical initiator, a hydroformylation catalyst, and the like. It is better to cooperate. That is, if a compound having an ethylenically unsaturated double bond or a compound having a hydroformyl group is blended, a hydroformylation catalyst as a promoter for promoting the reaction can be used as a radical initiator ( A thermal polymerization initiator or a photopolymerization initiator) may further contain a thermal polymerization accelerator, a photo-starting aid, a sharpening agent, and the like. In addition, organic/inorganic fillers, plasticizers, flame retardants, thermal stabilizers, antioxidants, light stabilizers, ultraviolet absorbers, slip agents, antistatic agents may be added as long as they do not deviate from the object of the present invention. Various additives such as a release agent, a foaming agent, a nucleating agent, a coloring agent, a crosslinking agent, a dispersing aid, and a resin component.

再者,在本發明中,樹脂層亦可使用上述聚矽酮樹脂進行硬化者以外之物。此時,亦可使用上述在分子中至少具有1個伸乙基性不飽和雙鍵之化合物進行硬化者。Further, in the present invention, the resin layer may be used other than those hardened by using the above polyketone resin. In this case, it is also possible to use a compound having at least one ethylenically unsaturated double bond in the molecule to be hardened.

本發明之複合型透鏡,可藉由將上述聚矽酮樹脂進行加熱或光照射而硬化、形成透鏡基材,並在該透鏡基材上形成樹脂層而製得。The composite lens of the present invention can be obtained by curing the above polyfluorene ketone resin by heating or light irradiation to form a lens substrate, and forming a resin layer on the lens substrate.

藉由加熱而製造透鏡基材時,該成形溫度,藉由熱聚合開始劑或促進劑等之選擇,可在由室溫起至200℃前後之廣大範圍中加以選擇。此時,例如可在金屬板或玻璃板上澆鑄聚矽酮樹脂(或硬化性樹脂組成物),並以加熱硬化而得到薄片狀之透鏡基材。When the lens substrate is produced by heating, the molding temperature can be selected from a wide range from room temperature to 200 ° C by selection of a thermal polymerization initiator or an accelerator. At this time, for example, a polyfluorene ketone resin (or a curable resin composition) may be cast on a metal plate or a glass plate, and cured by heat to obtain a flaky lens substrate.

此外,如藉由光照射而製造透鏡基材時,可以照射波長100~400nm之紫外線或波長400~700nm之可見光線,而製得成形體(透鏡基材)。所使用之光之波長並無特別之限制,惟其中係以波長200~400nm之近紫外線為適合。作為紫外線發生源之燈,例如有低壓水銀燈(輸出:0.4~4W/cm)、高壓水鋃燈(40~160W/cm)、超高壓水銀燈(173~435W/cm)、金屬鹵素燈(80~160W/cm)、脈衝氙燈(80~120W/cm)、無電極放電燈(80~120W/cm)等。此等之紫外線燈,由於在各自之分光分布上有其特徵之故,可根據所使用之光聚合開始劑之種類而加以選定。此外,與前述因加熱而製造之方法為相同地,例如可在玻璃板上澆鑄聚矽酮樹脂(或硬化性樹脂組成物),並以光硬化而得到薄片狀之透鏡基材。Further, when a lens substrate is produced by light irradiation, an ultraviolet ray having a wavelength of 100 to 400 nm or a visible ray having a wavelength of 400 to 700 nm can be irradiated to obtain a molded body (lens substrate). The wavelength of the light to be used is not particularly limited, but it is suitable for a near-ultraviolet light having a wavelength of 200 to 400 nm. As the light source of the ultraviolet light, for example, a low-pressure mercury lamp (output: 0.4 to 4 W/cm), a high-pressure water lamp (40 to 160 W/cm), an ultra-high pressure mercury lamp (173 to 435 W/cm), and a metal halide lamp (80~) 160W/cm), pulsed xenon lamp (80~120W/cm), electrodeless discharge lamp (80~120W/cm), etc. These ultraviolet lamps are characterized by their respective spectral distributions, and can be selected depending on the type of photopolymerization initiator to be used. Further, in the same manner as the above-described method of producing by heating, for example, a polyfluorene ketone resin (or a curable resin composition) may be cast on a glass plate, and photo-cured to obtain a flaky lens substrate.

再者,構成本發明之複合型透鏡之樹脂層,可將聚矽酮樹脂或具有伸乙基性不飽和雙鍵之化合物等之具有硬化性能者,載置於上述透鏡基材上(如係液狀物時,亦包含澆鑄等),並以加熱或光照射而使其硬化並形成。Further, the resin layer constituting the composite lens of the present invention may be provided on the lens substrate by a resin having a curing property such as a polyfluorene ketone resin or a compound having an ethylenically unsaturated double bond. In the case of a liquid, it also contains casting, etc., and it is hardened by heat or light irradiation.

再者,為使透鏡基材或樹脂層成為所定之形狀或厚度起見,可使用傳統上習知之方法。舉例而言,可在被加工成所定形狀之模具(例如具有球面形狀之凹部之模具等)中,將成為樹脂層之具有硬化性能之樹脂或化合物等,以定量進行充填,並於其上部側已設置有預先被硬化之透鏡基材之狀態下,以加熱或光照射使其硬化,而製得透鏡型狀之成型物。亦可藉由該成型物而作成複合型透鏡,惟在透鏡基材之剩下之另一面上亦可同樣地設置所定形狀之樹脂層,然後再將透鏡基材之兩面的2個樹脂層加以接合,以作成複合型透鏡。此外,在事先硬化之樹脂層上,亦可設置作成所定形狀之模具,再將聚矽酮樹脂(或硬化性樹脂組成物)填充其中,而形成透鏡基材。Further, in order to make the lens substrate or the resin layer into a predetermined shape or thickness, a conventionally known method can be used. For example, in a mold that is processed into a predetermined shape (for example, a mold having a spherical recessed shape, etc.), a resin or a compound having a hardening property as a resin layer may be filled in a quantitative manner and on the upper side thereof. In the state in which the lens substrate which has been previously hardened is provided, it is hardened by heating or light irradiation to obtain a molded article of a lens shape. A composite lens can also be formed by the molded article, but a resin layer of a predetermined shape can be similarly disposed on the remaining surface of the lens substrate, and then two resin layers on both sides of the lens substrate can be applied. Join to make a composite lens. Further, a mold having a predetermined shape may be provided on the resin layer which has been previously hardened, and a polyketone resin (or a curable resin composition) may be filled therein to form a lens substrate.

再者,在製得複合型透鏡時,如有必要,亦可基於防反射、賦予高硬度、提升耐磨耗性、賦予防霧度性等之改良之目的,而施加表面研磨、防靜電處理、硬塗佈處理、無反射塗佈處理、調光處理等習知之物理或化學處理。Further, when a composite lens is produced, if necessary, surface grinding and antistatic treatment may be applied for the purpose of improving antireflection, imparting high hardness, improving wear resistance, and imparting antifogging properties. Conventional physical or chemical treatments such as hard coating treatment, non-reflective coating treatment, and dimming treatment.

本發明之複合型透鏡,由於至少透鏡基材係以具有籠型構造之聚有機矽倍半氧烷為主成分之聚矽酮樹脂進行硬化所成者之故,其耐熱性優良。因此,其可供應於迴流焊接步驟,並適合利用於例如行動電話、搭載於數位照相機等之附有透鏡之CCD或附有透鏡之CMOS感應器等,將半導體及透鏡作成一體化之照相機模組的透鏡等使用者。In the composite lens of the present invention, at least the lens substrate is cured by a polyketone resin having a polyorgano sesquioxane having a cage structure as a main component, and the heat resistance is excellent. Therefore, it can be supplied to a reflow soldering step, and is suitable for use in, for example, a mobile phone, a lens-attached CCD mounted on a digital camera, or a CMOS sensor with a lens, etc., and a semiconductor camera and a lens integrated camera module. Users such as lenses.

實施發明之最佳型態The best form of implementing the invention

以下茲舉出實施例進一步地具體說明本發明。惟,本發明並不受這些實施例之範圍之任何限制。The invention is further illustrated by the following examples. However, the invention is not limited by the scope of the examples.

實施例Example

以下,說明本發明之實施例。此外,在下述實施例所使用之聚矽酮樹脂,係藉由以下之合成例所示方法而製得者。Hereinafter, embodiments of the invention will be described. Further, the polyfluorene ketone resins used in the following examples were obtained by the methods shown in the following synthesis examples.

合成例1Synthesis Example 1

在具有攪拌機、滴下漏斗及溫度計之反應容器中,裝入作為溶劑之2-丙醇(IPA)40ml及作為鹼性觸媒之5%四甲基氫氧化銨水溶液(TMAH水溶液)。另在滴下漏斗中裝入IPA 15ml及3-甲基丙烯氧基丙基三甲氧基矽烷(MTMS:東麗‧道康寧‧聚矽酮股份有限公司製SZ-6300)12.69g,將反應容器一面攪拌,一面以30分鐘將MTMS之IPA液滴入其中。在MTMS之滴下終了後,不加熱而攪拌2小時。再將2小時攪拌後之溶劑於減壓下除去其溶劑,以甲苯50ml進行溶解。再以飽和食鹽水將反應溶液水洗至中性,再以無水硫酸鎂使其脫水。將無水硫酸鎂濾掉,以濃縮得到8.6g之水解生成物(矽倍半氧烷)。該矽倍半氧烷係可溶於各種有機溶劑之無色黏性液體。Into a reaction vessel equipped with a stirrer, a dropping funnel and a thermometer, 40 ml of 2-propanol (IPA) as a solvent and a 5% aqueous solution of tetramethylammonium hydroxide (aqueous solution of TMAH) as a basic catalyst were charged. In addition, 12.69 g of IPA 15 ml and 3-methylpropoxypropyltrimethoxydecane (MTMS: SZ-6300, manufactured by Toray Dow Corning Co., Ltd.) were placed in a dropping funnel, and the reaction vessel was stirred on one side. The IPMS of MTMS was dropped into it for 30 minutes. After the end of the dropping of MTMS, the mixture was stirred without heating for 2 hours. The solvent which was stirred for 2 hours was removed under reduced pressure, and dissolved in 50 ml of toluene. The reaction solution was washed with water to a neutral state with saturated brine, and then dried over anhydrous magnesium sulfate. Anhydrous magnesium sulfate was filtered off and concentrated to give 8.6 g of a hydrolyzed product. The sesquioxanes are colorless viscous liquids which are soluble in various organic solvents.

接著,在具有攪拌機、「丁斯塔克」縮聚合裝置、及冷卻管之反應容器中,加入上述得到之矽倍半氧烷8.0g、甲苯32ml及10%TMAH水溶液1.2g,徐徐地加熱將水餾去再加熱至130℃,以迴流溫度使甲苯進行再縮合反應。此時之反應溶液之溫度係108℃。在甲苯還流後並攪拌2小時後,將反應終了。另以飽和食鹽水將反應溶液水洗至中性後,再以無水硫酸鎂使其脫水。將無水硫酸鎂濾掉,以濃縮得到具有下述平均組成式之聚矽酮樹脂(產量7.5g,產率87%)。所得到之聚矽酮樹脂係可溶於各種有機溶劑之無色黏性液體。Next, in a reaction vessel equipped with a stirrer, a "Dust Stark" polycondensation unit, and a cooling tube, 8.0 g of the above-obtained sesquioxanes, 32 ml of toluene, and 1.2 g of a 10% TMAH aqueous solution were added, and the mixture was heated slowly. The water was distilled and heated again to 130 ° C, and toluene was subjected to recondensation at a reflux temperature. The temperature of the reaction solution at this time was 108 °C. After the toluene was still flowed and stirred for 2 hours, the reaction was terminated. Further, the reaction solution was washed with a saturated saline solution until it was neutralized, and then dehydrated with anhydrous magnesium sulfate. Anhydrous magnesium sulfate was filtered off to concentrate to obtain a polyfluorene ketone resin (yield: 7.5 g, yield: 87%) having the following average composition. The obtained polyfluorenone resin is a colorless viscous liquid which is soluble in various organic solvents.

[CH2 =CH(CH3 )OCO(CH2 )3 SiO1.5 ]m [CH2 =CH(CH3 )OCO(CH2 )3 SiO0.5 ]n  (8)[CH 2 =CH(CH 3 )OCO(CH 2 ) 3 SiO 1.5 ] m [CH 2 =CH(CH 3 )OCO(CH 2 ) 3 SiO 0.5 ] n (8)

表1中,係彙整了所得到之聚矽酮樹脂(8)以液體色層分析大氣壓離子化分析計(LC/APC1-MS)進行之質量分析所測得之主要峰部,以及相當於其之聚矽酮樹脂(8)之m、n之數值。所測之峰部m/z,係聚矽酮樹脂(8)(惟m為8~16,n為0~4)所示之聚矽酮樹脂之分子量上附加有銨離子之值。In Table 1, the main peaks obtained by mass analysis of the obtained polyfluorene ketone resin (8) by liquid chromatography analysis atmospheric pressure ionization analyzer (LC/APC1-MS), and the equivalent The values of m and n of the polyketone resin (8). The measured peak portion m/z is a value of ammonium ion added to the molecular weight of the polyfluorene ketone resin represented by the polyfluorene ketone resin (8) (m is 8 to 16, n is 0 to 4).

合成例2Synthesis Example 2

在具有攪拌機、滴下漏斗及溫度計之反應容器中,裝入作為溶劑之甲苯150ml及2-丙醇(IPA)85ml及作為鹼性觸媒之5%四甲基氫氧化銨水溶液(TMAH水溶液)37.2g。另在滴下漏斗中裝入甲苯25ml及三甲氧基乙烯基矽烷(信越化學股份有限公司製KBM1003)50.3g,將反應容器一面攪拌,一面以3小時將三甲氧基乙烯基矽烷之甲苯溶液滴入其中。在三甲氧基乙烯基矽烷之滴下終了後,室溫下攪拌2小時。在1小時攪拌後,停止攪拌並靜置1日。將反應溶液以10%檸檬酸水溶液23.0g中和後,再以飽和食鹽水洗淨,另以無水硫酸鎂使其脫水。將無水硫酸鎂濾掉,以濃縮得到20.6g(產率77%)之聚縮合物。該聚縮合物係難溶於各種有機溶劑之難溶性白色固體。In a reaction vessel equipped with a stirrer, a dropping funnel and a thermometer, 150 ml of toluene as a solvent, 85 ml of 2-propanol (IPA), and 5% aqueous solution of tetramethylammonium hydroxide (aqueous solution of TMAH) as a basic catalyst were charged 37.2. g. In addition, 25 ml of toluene and 50.3 g of trimethoxyvinyl decane (KBM1003 manufactured by Shin-Etsu Chemical Co., Ltd.) were placed in a dropping funnel, and the toluene solution of trimethoxyvinyl decane was dropped over 3 hours while stirring the reaction vessel. among them. After completion of the dropwise addition of trimethoxyvinyl decane, it was stirred at room temperature for 2 hours. After stirring for 1 hour, the stirring was stopped and allowed to stand for 1 day. The reaction solution was neutralized with 23.0 g of a 10% aqueous citric acid solution, and then washed with saturated brine and dried over anhydrous magnesium sulfate. Anhydrous magnesium sulfate was filtered off and concentrated to give 20.6 g (yield: 77%) of a poly condensate. The polycondensate is a poorly soluble white solid which is insoluble in various organic solvents.

接著,在具有攪拌機、「丁斯塔克」縮聚合裝置、冷卻管、及溫度計之反應容器中,加入上述得到之聚縮合物15.0g、甲苯380ml及5%TMAH水溶液1.72g,於120℃下將水餾去,再將甲苯還流加熱以進行縮聚合反應。在甲苯還流後並攪拌3小時後,恢復室溫並使反應終了。將反應溶液以10%檸檬酸23.0g中和後,另以飽和食鹽水洗淨,再以無水硫酸鎂使其脫水。將無水硫酸鎂濾掉,以濃縮得到再縮合物14.5g。所得到之再縮合物係白色固體,且對於各種溶劑具有難溶性。Next, 15.0 g of the polycondensate obtained above, 380 ml of toluene, and 1.72 g of a 5% TMAH aqueous solution were placed in a reaction vessel equipped with a stirrer, a "Dust Stark" polycondensation unit, a cooling tube, and a thermometer at 120 ° C. The water was distilled off, and the toluene was further heated to carry out a polycondensation reaction. After the toluene was still flowed and stirred for 3 hours, room temperature was returned and the reaction was terminated. The reaction solution was neutralized with 23.0 g of 10% citric acid, and then washed with saturated brine, and then dried over anhydrous magnesium sulfate. Anhydrous magnesium sulfate was filtered off and concentrated to give 14.5 g of a recondensate. The resulting recondensate is a white solid and is poorly soluble for various solvents.

最後,在具有攪拌機、「丁斯塔克」縮聚合裝置、及冷卻管之反應容器中,加入所得到之再縮合物14.5g、甲苯300ml、5%TMAH水溶液3.0g、及1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷(TMDVDS:信越化學股份有限公司製LS-7250)9.76g,於120℃下將水餾去,再將甲苯還流加熱以進行縮聚合反應。在甲苯還流後並攪拌3小時後,恢復室溫並使反應終了。將反應溶液以10%檸檬酸3.24g中和後,另以飽和食鹽水洗淨,再以無水硫酸鎂使其脫水。將無水硫酸鎂濾掉,以濃縮得到具有下述平均組成式之聚矽酮樹脂(產量16.9g,產率88%)。所得到之聚矽酮樹脂,係可溶於各種有機溶劑之無色黏性液體。Finally, 14.5 g of the obtained recondensate, 300 ml of toluene, 3.0 g of a 5% TMAH aqueous solution, and 1,3-two were placed in a reaction vessel equipped with a stirrer, a "Dust Stark" polycondensation unit, and a cooling tube. 9.76 g of vinyl-1,1,3,3-tetramethyldioxane (TMDVDS: LS-7250, manufactured by Shin-Etsu Chemical Co., Ltd.), water was distilled off at 120 ° C, and toluene was further heated to carry out heat treatment. Polycondensation reaction. After the toluene was still flowed and stirred for 3 hours, room temperature was returned and the reaction was terminated. The reaction solution was neutralized with 3.24 g of 10% citric acid, and then washed with saturated brine and then dried over anhydrous magnesium sulfate. Anhydrous magnesium sulfate was filtered off to concentrate to obtain a polyfluorene ketone resin (yield: 16.9 g, yield: 88%) having the following average composition. The obtained polyfluorene ketone resin is a colorless viscous liquid which is soluble in various organic solvents.

[CH2 =CHSiO1.5 ]m [CH2 =CH(CH3 )2 SiO0.5 ]n  (9)[CH 2 =CHSiO 1.5 ] m [CH 2 =CH(CH 3 ) 2 SiO 0.5 ] n (9)

表2中,係彙整了上述得到之聚矽酮樹脂以液體色層分析大氣壓離子化分析計(LC/APC1-MS)進行之質量分析所測得之主要峰部,以及相當於其之聚矽酮樹脂(9)之m、n之數值。所測之峰部m/z,係聚矽酮樹脂(9)(惟m為8~16,n為0~4)所示之聚矽酮樹脂(9)之分子量上附加有銨離子之值。In Table 2, the main peaks measured by the mass analysis of the polyfluorenone resin obtained above by a liquid chromatography analysis atmospheric pressure ionization analyzer (LC/APC1-MS), and the aggregation corresponding thereto are collected. The value of m and n of the ketone resin (9). The measured peak portion m/z is the value of the ammonium ion added to the molecular weight of the polyfluorene ketone resin (9) represented by the polyfluorene ketone resin (9) (only m is 8 to 16, n is 0 to 4). .

實施例1Example 1

將上述合成例1所得到之在矽原子上具有甲基丙烯醯基之籠型聚矽酮樹脂:25重量份、二環戊基二丙烯酸酯:75重量份、作為光聚合開始劑之1-羥基環己基苯基酮:2.5重量份,進行混合,而製得透明之硬化性樹脂組成物(聚矽酮樹脂組成物)。表3中,係顯示了本實施例1所使用之聚矽酮樹脂組成物之組成。此外,表3中之數值係以重量份表示。The cage type polyfluorene ketone resin having a methacryl fluorenyl group on the ruthenium atom obtained in the above Synthesis Example 1 : 25 parts by weight, dicyclopentyl diacrylate: 75 parts by weight, as a photopolymerization initiator 1- Hydroxycyclohexyl phenyl ketone: 2.5 parts by weight, and mixed to obtain a transparent curable resin composition (polyfluorenone resin composition). In Table 3, the composition of the polyketone resin composition used in the present Example 1 is shown. Further, the numerical values in Table 3 are expressed in parts by weight.

表3中使用之符號A~E,其意義係如下所示。The symbols A to E used in Table 3 are as follows.

A:合成例1所得到之聚矽酮樹脂A: Polyacrylone resin obtained in Synthesis Example 1

B:二甲基丙烯氧基丙基聚二甲基矽氧烷(「阿茲馬克士」股份有限公司製DMS-R11)B: dimethyl methoxy propyl polydimethyl decane ("DMS-R11" manufactured by Azmaks Co., Ltd.)

C:二季戊四醇六丙烯酸酯(共榮社化學(股)製「來特」丙烯酸酯DPE-6A)C: dipentaerythritol hexaacrylate ("Excellent" acrylate DPE-6A manufactured by Kyoeisha Chemical Co., Ltd.)

D:二環戊基二丙烯酸酯(共榮社化學(股)製「來特」丙烯酸酯DCP-A:在一般式中,n=0,R=H)D: Dicyclopentyl diacrylate (Kelly acrylate DCP-A manufactured by Kyoeisha Chemical Co., Ltd.: in the general formula, n = 0, R = H)

E:1-羥基環己基苯基酮(聚合開始劑)E: 1-hydroxycyclohexyl phenyl ketone (polymerization initiator)

將上述硬化性樹脂組成物之一部流進以玻璃板組成之模型,使成為厚度2mm大小,使用30W/cm之高壓水銀燈,以2000mJ/cm2 之積算曝光量使其硬化,而得到所定厚度之薄片狀之聚矽酮樹脂成形體(透鏡基材1)。One part of the above-mentioned curable resin composition was poured into a model composed of a glass plate to have a thickness of 2 mm, and a high-pressure mercury lamp of 30 W/cm was used, and the exposure amount was 2000 mJ/cm 2 to harden it to obtain a predetermined thickness. A flaky polyketone resin molded body (lens substrate 1).

接著,如圖1所示,在所定之球面形狀上具有經加工之凹部的玻璃製之模具3中,將上述硬化性樹脂組成物2加以填充,並在填充之硬化性樹脂組成物2之表面(液面)可以接觸之情形下,以設置有透鏡基材1之狀態下使用30W/cm高壓水銀燈,另以1000mJ/cm2 之積算曝光量使其硬化,而在透鏡基材上形成厚度0.02mm之樹脂層。Next, as shown in FIG. 1, the curable resin composition 2 is filled in a glass mold 3 having a processed concave portion in a predetermined spherical shape, and is formed on the surface of the filled curable resin composition 2. When the liquid level is in contact with each other, a 30 W/cm high-pressure mercury lamp is used in a state where the lens substrate 1 is provided, and an exposure amount of 1000 mJ/cm 2 is used to harden it, and a thickness of 0.02 is formed on the lens substrate. Mm resin layer.

進一步,在透鏡基材1之剩下的表面上,將上述硬化性樹脂組成物2以同樣之方法使其硬化,而得到在透鏡基材1之兩面上有樹脂層4接合之複合型透鏡5。所得到之複合型透鏡5之物性值,係如表4所示。複合型透鏡5之物性評價,則係如下述行之。Further, on the remaining surface of the lens substrate 1, the curable resin composition 2 is cured in the same manner to obtain a composite lens 5 having a resin layer 4 joined on both surfaces of the lens substrate 1. . The physical property values of the obtained composite lens 5 are shown in Table 4. The physical property evaluation of the composite lens 5 is as follows.

1)全光線穿透率(參考規格JIS K 7361-1):使用紫外可見紅外分光光度計(V-630M日本分光(股)製)進行測定。1) Total light transmittance (reference specification JIS K 7361-1): Measurement was carried out using an ultraviolet-visible infrared spectrophotometer (V-630M manufactured by JASCO Corporation).

2)折射率:使用阿貝折射計(DR-M4雅達哥(株)製)進行測定。2) Refractive index: Measurement was carried out using an Abbe refractometer (DR-M4 manufactured by Yada Co., Ltd.).

3)吸水率:使樣品在50℃下乾燥後,測定其重量,再於25℃之溫水中浸漬24小時。測定24小時後之重量,依據下式求出其吸水率。3) Water absorption rate: After the sample was dried at 50 ° C, the weight was measured, and further immersed in warm water of 25 ° C for 24 hours. The weight after 24 hours was measured, and the water absorption rate was determined according to the following formula.

吸水率(%)=[(吸水重量-乾燥重量)/乾燥重量]×100Water absorption rate (%) = [(water absorption weight - dry weight) / dry weight] × 100

4)線膨脹係數:使用熱機械分析裝置(TMA製),以升溫速度5℃/分鐘、壓縮負重0.1N之條件,在30℃至200℃之範圍中測定其線膨脹係數。4) Linear expansion coefficient: The linear expansion coefficient was measured in the range of 30 ° C to 200 ° C using a thermomechanical analyzer (manufactured by TMA) at a temperature increase rate of 5 ° C / min and a compression load of 0.1 N.

5)耐熱變色性:在峰部溫度被設定在保持於260℃-15秒之迴焊爐,使其連續2次通過迴焊爐後,測定其樣品之光線穿透率(400nm)及通過前之光線穿透率,而將通過前後之穿透率變化(%)作為耐熱變色性進行評價。5) Heat-resistant discoloration: After the peak temperature was set at a reflow furnace maintained at 260 ° C for 15 seconds, the sample was passed through the reflow furnace twice, and the light transmittance (400 nm) of the sample was measured and passed. The light transmittance was evaluated by the change in transmittance (%) before and after the heat resistance.

(實施例2~5及比較例1、2)(Examples 2 to 5 and Comparative Examples 1 and 2)

除硬化性樹脂組成物之配合組成係如表3所示者外,其餘與實施例1相同地進行操作,而製得複合型透鏡5。此外,就所得到之複合型透鏡5之物性值,與實施例1同樣地進行評價。其結果示於表4。The composite lens 5 was obtained in the same manner as in Example 1 except that the composition of the curable resin composition was as shown in Table 3. Further, the physical properties of the obtained composite lens 5 were evaluated in the same manner as in Example 1. The results are shown in Table 4.

(實施例6)(Example 6)

將上述合成例2所得到之矽上具有乙烯基之樹脂60重量份、末端氫修飾甲基氫矽氧烷-苯基甲基矽氧烷共聚物(「阿茲馬克士」股份有限公司製HPM-502)40重量份、以及鉑-乙烯基矽氧烷錯合物(「阿茲馬克士」股份有限公司製SIP6830.3)0.5重量份,混合至均一為止,而作成硬化性樹脂組成物。在表5中,係表示使用本實施例6之硬化性樹脂組成物之組成。此外,表5中之數值係以重量份表示。60 parts by weight of a vinyl group-containing resin obtained in the above Synthesis Example 2, and a terminal hydrogen-modified methylhydroquinone-phenylmethyl decane copolymer ("HPZ manufactured by Azmak" Co., Ltd. - 502) 0.5 parts by weight of a platinum-vinyl oxime complex ("SIP 3030.3" manufactured by Azmak Co., Ltd.) was mixed and homogenized to form a curable resin composition. In Table 5, the composition of the curable resin composition of the present Example 6 was used. Further, the numerical values in Table 5 are expressed in parts by weight.

表5中使用之符號F~J,其意義係如下所示。The symbols F~J used in Table 5 are as follows.

F:合成例2所得到之聚矽酮樹脂F: Polyfluorene ketone resin obtained in Synthesis Example 2

G:二乙烯基聚二甲基聚矽酮(「阿茲馬克士」股份有限公司製DMS-V05)G: Divinylpolydimethylpolyfluorene ("Daz-V05" manufactured by Azmaks Co., Ltd.)

H:末端氫修飾甲基氫矽氧烷-苯基甲基矽氧烷共聚物-(「阿茲馬克士」股份有限公司製HPM-502)H: terminal hydrogen-modified methylhydroquinone-phenyl methoxy alkane copolymer-("Azmax" Co., Ltd. HPM-502)

I:鉑-乙烯基矽氧烷錯合物(「阿茲馬克士」股份有限公司製SIP6830.3)I: Platinum-vinyl oxirane complex ("SIPZ 0.30.3 by Azmak" Co., Ltd.)

J:二枯烯基過氧化物(日本油脂股份有限公司製「帕庫密爾D」)J: dicumyl peroxide ("Pakumur D" manufactured by Nippon Oil & Fat Co., Ltd.)

將上述得到之硬化性樹脂組成物流進以玻璃板組成之模型,使成為厚度2mm大小,再以100℃ 1小時、120℃ 1小時、140℃ 1小時、160℃ 1小時、180℃ 2小時進行加熱,而得到所定厚度之薄片狀之聚矽酮樹脂成形體(透鏡基材1)。The curable resin composition obtained above was introduced into a model of a glass plate to have a thickness of 2 mm, and further at 100 ° C for 1 hour, 120 ° C for 1 hour, 140 ° C for 1 hour, 160 ° C for 1 hour, and 180 ° C for 2 hours. The film was heated to obtain a sheet-like polyketone resin molded body (lens substrate 1) having a predetermined thickness.

接著,如圖1所示,在所定之球面形狀上具有經加工之凹部的玻璃製之模具3中,將上述硬化性樹脂組成物2加以填充,並在填充之硬化性樹脂組成物2之表面(液面)可以接觸之情形下,並在設置有事先形成之透鏡基材之狀態下,另以100℃ 1小時、120℃ 1小時、140℃ 1小時、160℃ 1小時、180℃ 2小時加熱使其硬化,而在透鏡基材上形成厚度0.02mm之樹脂層4。Next, as shown in FIG. 1, the curable resin composition 2 is filled in a glass mold 3 having a processed concave portion in a predetermined spherical shape, and is formed on the surface of the filled curable resin composition 2. (liquid level) can be contacted, and in a state in which a lens substrate formed in advance is provided, another one at 100 ° C for 1 hour, 120 ° C for 1 hour, 140 ° C for 1 hour, 160 ° C for 1 hour, and 180 ° C for 2 hours. The resin layer 4 having a thickness of 0.02 mm was formed on the lens substrate by heating to harden it.

進一步,在透鏡基材1之剩下的表面上,將上述硬化性樹脂組成物2以同樣之方法使其硬化,而得到在透鏡基材1之兩面上有樹脂層4接合之複合型透鏡5。就所得到之複合型透鏡5之物性值,與實施例1同樣地進行評價,其結果如表4所示。Further, on the remaining surface of the lens substrate 1, the curable resin composition 2 is cured in the same manner to obtain a composite lens 5 having a resin layer 4 joined on both surfaces of the lens substrate 1. . The physical properties of the obtained composite lens 5 were evaluated in the same manner as in Example 1. The results are shown in Table 4.

(實施例7~9及比較例3、4)(Examples 7 to 9 and Comparative Examples 3 and 4)

除硬化性樹脂組成物之配合組成係如表5所示者外,其餘與上述實施例6相同地進行操作,而製得複合型透鏡5。此外,就所得到之複合型透鏡5之物性值,同樣地進行評價。其結果示於表4。The composite lens 5 was produced in the same manner as in the above-described Example 6, except that the composition of the curable resin composition was as shown in Table 5. Moreover, the physical property values of the obtained composite lens 5 were similarly evaluated. The results are shown in Table 4.

產業上可利用性Industrial availability

本發明之耐熱性複合型透鏡,係適用於例如搭載於行動電話、數位照相機等之附有透鏡之CCD、附有透鏡之CMOS感應器等,而將半導體及透鏡作成一體化之照相機模組的透鏡等使用者。此外,其亦可利用於要求耐熱性之車載用照相機模組等之透鏡等上。The heat-resistant composite lens of the present invention is applied to, for example, a lens-equipped CCD, a lens-equipped CMOS sensor, or the like, which is mounted on a mobile phone or a digital camera, and a semiconductor camera and a lens integrated camera module. A user such as a lens. In addition, it can also be used for a lens or the like of a camera module for a vehicle that requires heat resistance.

1...透鏡基材1. . . Lens substrate

2...硬化性樹脂組成物2. . . Curable resin composition

3...玻璃製模具3. . . Glass mold

4...樹脂層4. . . Resin layer

5‧‧‧複合型透鏡5‧‧‧Composite lens

圖1:係表示本發明之耐熱性複合型透鏡之製造方法的流程圖。Fig. 1 is a flow chart showing a method of producing a heat resistant composite lens of the present invention.

Claims (3)

一種耐熱性複合型透鏡之製造方法,其係將樹脂層接合於透鏡基材上所成之複合型透鏡之製造方法,其特徵為透鏡基材及樹脂層係各自由硬化樹脂所成,至少透鏡基材係以下述一般式(1)所示,(RSiO1.5 )m (RsiO0.5 )n (1)(惟,R係(a)-R1 -OCO-CR2 =CH2 、(b)-R1 -CR2 =CH2 或(c)-CH=CH2 所示之不飽和基、烷基、環烷基、環烯基、苯基、氫原子、烷氧基、或烷基甲矽烷氧基,式(1)中之多數R可為相同或相異者,惟至少1個係含有上述(a)、(b)或(c)之任一者,R1 係伸烷基、烷叉或伸苯基,R2 係氫或烷基,m=8~16,n=1~4之數),在構造單位中係以具有籠型構造之聚有機矽倍半氧烷為主成分之聚矽酮樹脂,並為將包含分子中至少具有氫化甲矽烷基之化合物、及氫化甲矽烷基化觸媒之硬化性樹脂組成物硬化者,於具備凹部形狀之模具以特定量充填成為樹脂層之硬化性樹脂組成物,並以於其上部側設置有預先將硬化性樹脂組成物形成薄片狀之透鏡基材之狀態,加熱或光照射來將樹脂層硬化,藉此來將透鏡基材與樹脂層一體化。A method for producing a heat-resistant composite lens, which is a method for producing a composite lens in which a resin layer is bonded to a lens substrate, wherein the lens substrate and the resin layer are each formed of a hardened resin, at least a lens The substrate is represented by the following general formula (1), (RSiO 1.5 ) m (RsiO 0.5 ) n (1) (except that R is (a)-R 1 -OCO-CR 2 =CH 2 , (b)- R 1 -CR 2 =CH 2 or (c)-CH=CH 2 unsaturated group, alkyl group, cycloalkyl group, cycloalkenyl group, phenyl group, hydrogen atom, alkoxy group or alkyl formane The oxy group, a plurality of R in the formula (1) may be the same or different, but at least one of the above includes (a), (b) or (c), and the R 1 is an alkyl group or an alkyl group. Fork or phenyl, R 2 is hydrogen or alkyl, m = 8 to 16, n = 1 to 4), in the structural unit is a polyorgano sesquioxane with a cage structure as the main component The polyketone resin is a hardened resin composition containing a compound having at least a hydrogenated methyl hydrazine group in the molecule and a hydroformylation catalyst, and is filled into a resin in a specific amount in a mold having a concave shape. a layer of a hardening resin composition, and Its upper side is provided with a previously curable resin composition forming state of the lens substrate of a sheet, heating or light irradiation to the resin layer is hardened, whereby the lens to the substrate and the resin layer are integrated. 如申請專利範圍第1項之耐熱性複合型透鏡之製造方法,其中,對透鏡基材的內外兩側進行透鏡基材與樹脂層一體化之步驟。 The method for producing a heat-resistant composite lens according to the first aspect of the invention, wherein the lens substrate and the resin layer are integrated on both the inner and outer sides of the lens substrate. 如申請專利範圍第1項之耐熱性複合型透鏡之製造方法,其中樹脂層係以該一般式(1)所示,且為將含有在構造單位中係以具有籠型構造之聚有機矽倍半氧烷為主成分之聚矽酮樹脂之硬化性樹脂組成物進行硬化所成者。The method for producing a heat-resistant composite lens according to the first aspect of the invention, wherein the resin layer is represented by the general formula (1), and is a polyorgano-indene which has a cage structure in a structural unit. A curable resin composition of a polyfluorene ketone resin containing a semi-oxygen as a main component is cured.
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