TWI458413B - Three - dimensional surface laser guided through filling line method - Google Patents

Description

Three-dimensional curved laser guiding through hole filling line method

The invention relates to a three-dimensional curved laser guiding and filling hole filling line method, in particular to apply a laser drilling method to achieve a smaller aperture, micro-aperture processing on a formed plastic part, and through a plated hole filling method, Accurate wiring and line continuity.

In the current industrial technology, when a perforation process is performed on a workpiece, a drill is often used for drilling, or a workpiece having a guide hole is directly formed by injection molding. However, due to the technical limitations of the drill bit or injection molding, the perforation, which is generally made by drilling or injection molding, has a minimum aperture limit (about 0.1 mm). In order to perform finer aperture processing, it is usually necessary to use laser drilling or etching to achieve a smaller aperture (minimum aperture of up to about 6 μm).

However, when the workpiece is a formed plastic part, drilling, injection molding, or etching is not applicable if micro-aperture processing is performed on the formed plastic part. For example, when circuit processing is performed on a printed circuit board, if the line pattern is a three-dimensional line, a small aperture guide hole is included, and after the drilling, the remaining line pattern must be engraved, and the designed line is designed. The pattern is plated with metal to complete the circuit fabrication. Investigating the Republic of China Invention Patent Bulletin No. 457157 "Application Method of Chemical Micro-etching of Copper Foil Surface in Direct Laser Drilling"; focusing on the use of chemical micro-etching technology to clearly locate the area to be laser drilled Although related to laser drilling technology, the previous specifications did not mention the specifications of laser drilling technology. Chinese people National Patent Publication No. I313631, "Laser Drilling System and Method for Flexible Printed Circuit Boards", the present case focuses on the use of lasers of different wavelengths in the past for drilling, and is limited to flexible printed circuit boards. However, its hole depth and aperture ratio are not good. The Republic of China Invention Publication No. 201029539, "Printed Circuit Board and Method of Manufacturing the Same", focuses on laser drilling from both sides of a printed circuit board, and a tapered shape is formed on both sides, and then plated and electrically conductive. The material is in turn turned on. None of the above cases can achieve the perforation of the small aperture. Therefore, a process method is needed to achieve the small aperture guide hole, especially the guide hole with a hole diameter of 0.04 mm or less, so that the chemical hole filling can be filled.

Therefore, in view of the above-mentioned shortcomings, the present invention proposes a three-dimensional curved laser guided through-filling line method for solving the shortcomings of the prior art.

An object of the present invention is to provide a method for stereoscopic curved laser through-hole filling line, which uses laser direct structuring (LDS) processing method to perform micro-aperture processing and line pattern engraving of the via hole, and to perform plating The way to perform metal line deposition is to complete the circuit pattern.

Another object of the present invention is to provide a method for stereoscopic curved laser guided through-filling line, which uses laser light to perform micro-aperture processing (0.04 mm or less), and then performs three-dimensional laser engraving processing to complete the designed circuit pattern.

A further object of the present invention is to provide a three-dimensional curved laser guided through hole filling line method, which is characterized by chemical deposition to plate copper, nickel, gold and other metals. The use of laser drilling and plated hole filling methods for injection molding of plastic parts (LDS special materials) can achieve wire conduction, simple processing, smaller parts and more precise parts.

In order to achieve the above and other objects, the present invention provides a method for stereoscopic curved laser through-hole filling line, comprising: providing a substrate having a curved layer and a body layer; and transmitting through a light source having a miniature spot size Penetrating the substrate to form a laser activation guide via on the curved layer and the body layer; performing a three-dimensional circuit layout on the curved layer to form a conductive loop, wherein the conductive loop passes through the conductive a perforated connection; and plating a metal to the conductive loop to change electrical characteristics of the conductive loop.

Compared with the prior art, the three-dimensional curved laser guiding and filling hole filling method of the present invention can be applied to the injection molding plastic parts (LDS special materials) by the laser drilling and the chemical plating filling method. Simple processing, smaller part design and more precise.

In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail with reference to the accompanying drawings. A flow chart of a method for stereoscopic curved laser guided through-filling lines of an embodiment is respectively described as follows: providing a substrate having a curved layer and a body layer (step 100); and penetrating through a light source having a micro spot size Through this a substrate for forming a laser activation via hole on the curved layer and the body layer (step 200); performing a three-dimensional circuit layout on the curved layer to form a conductive loop, wherein the conductive loop transmits through the conductive loop a via connection (step 300); and plating a metal layer on the conductive loop to change the electrical characteristics of the conductive loop (step 400).

The above steps are described in detail below. The substrate in step 100 can be a plastic injection molding material, and the material of the material can be thermosetting plastic DAP and thermoplastic plastic PPA, LCP, PA6/6, PC or PC/ABS, and the thickness of the section is less than 2 mm. good. In step 200, the light source having the micro spot size is generally laser light, and the laser three-dimensional space on the surface of the product is laser-based, and laser activation is performed according to the penetration of the laser light to produce a via hole. Generally, the minimum aperture diameter of the via is preferably less than 0.04 mm. The three-dimensional circuit layout in step 300 uses the vias to connect the conductive loops. In step 400, the metal layer is plated on the conductive circuit by means of a chemical plating method. For example, in one embodiment, the order of the metal layers is: a. plating (copper), conductive (electric) metal layer, the thickness of which is Within 30μm; b. plating (nickel), protect the copper layer from oxidation, better wear resistance, its thickness is within 10μm; chemical plating (gold), the best anti-oxidation layer, its thickness is within 0.2μm. In the embodiment of the above production step, the preferred thickness of each metal layer is 15 μm for the copper-plated copper metal layer 30, 5 μm for the nickel-plated metal layer 40, and 0.1 μm for the gold-plated metal layer 50. For the film thickness limitation of this plating process, the via hole with the hole diameter of 0.04 mm or less can be filled to ensure the connection of the via hole to the conductive loop.

Hereinafter, the method of the three-dimensional curved laser guided through-filling line of the present invention will be described in detail with reference to the second to sixth figures, respectively. The second figure is a substrate of a laser according to an embodiment of the present invention. Schematic diagram of the cross-section before drilling; the laser drilling is carried out on various substrates, such as the housing of the 3C product plastic part 10, using laser and plating technology to produce metal wiring like PCB. The traditional planar wiring is transferred to three-dimensional, and has the function of stereo conduction. In addition to the simplification of the product, the simplified multi-layer PCB is realized. The continuity of the conduction and the reduction of the joint of the planar PCB line make it more capable of the circuit. Conducted more smoothly. The material of the plastic part 10 may include: thermosetting plastic diene phthalate (DAP; Diallyl Phthalate) and thermoplastic plastic polyphthalamide (PPA; Polyphthalamide), high performance engineering plastics (LCP; Liquid Crystal Polyester), polyamide 6/6 (PA6/6; Nylon), polycarbonate (PC; Polycarbonate), polycarbonate / polypropylene (PC / ABS; Polycarbonate / Acrylonitrile Butadiene Styrene) and other materials, the special material The method may include a plurality of uniformly dispersed metal particles having an average particle diameter of less than 100 μm (micrometers), and the material is selected from the group consisting of palladium and copper, and the foregoing metal particles and thermoplastic (solid) properties The plastic is combined into a metal (also known as a polymer chelate), which is an organometallic composite.

Referring to the third figure, a schematic cross-sectional view of the substrate of the above embodiment before laser plating after laser drilling. In the third figure, the diagonal part of the product plastic part 10 is a section thereof, and a three-dimensional stereo circuit is fabricated by laser direct structuring (LDS; Laser Direct Structuring), and the laser light is incident on the entrance hole D before the plating. The perforation outlet d exits to form the via hole 20, and at the same time, the remaining three-dimensional circuit layout is subjected to lightning engraving on the curved layer of the product plastic part 10 (ie, the upper surface in the figure) to form a conductive loop, wherein the conductive loop is transmitted through the guide The perforations 20 are connected. The minimum aperture of the outlet d of the guide hole 20 does not exceed 0.04 mm to ensure that the vias are completely filled during the subsequent plating, so that the conductive loops are connected through the vias 20. This picture shows the laser hole before the plating.

Referring to the fourth figure, a schematic view of the substrate of the above embodiment after the copper plating metal layer is formed. In the fourth figure, the metallization layer material used is copper, and the copper plating metal layer 30 is formed to function as a conductive (electric) metal layer, and the thickness thereof is preferably 30 μm or less.

Referring to the fifth drawing, a schematic view of the substrate of the above embodiment after the nickel plating metal layer is formed. In the fifth figure, the metal plating layer material used is nickel, and a nickel-plated metal layer 40 is formed on the outer side of the copper-plated metal layer 30, and its function is to form a protective layer having a thickness of 10 μm or less.

Referring to the sixth drawing, a schematic view of the substrate of the above embodiment after the gold plating metal layer is formed. In the sixth figure, the metal plating layer material used is gold, and a gold plating metal layer 50 is formed on the outer side of the nickel plating metal layer 40, and the function thereof constitutes an oxidation resistant layer, and the thickness thereof is preferably 0.2 μm or less.

In each of the above metal layers, the thickness of each of the metal layers is 15 μm for the copper-plated copper metal layer 30, 5 μm for the nickel-plated metal layer 40, and 0.1 μm for the gold-plated metal layer 50. Using a preferred thickness of the metal layer, it is ensured that the minimum diameter of the exit d of the via 20 is not more than 0.04 mm, and the via hole can be completely filled during the plating.

In the above, the present invention is a laser direct molding process and uses an LDS-defining material. Since the material has good hardness, good wear resistance and lightness, it can be used to efficiently process each workpiece, and more preferably. Effectively save the space of the traditional two-dimensional PCB board.

The present invention has been disclosed in the above preferred embodiments, and is familiar with the present technology. It is to be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention.

10‧‧‧plastic parts (substrate)

20‧‧‧Guiding

30‧‧‧Chemical copper plating

40‧‧‧Ni-plated metal layer

50‧‧‧metallized metal layer

Step 100‧‧‧ Provide a substrate with a curved layer and a body layer

Step 200‧‧‧ penetrate the base through a light source with a miniature spot size Material, to form a laser activation of the guide layer on the curved layer and the body layer

Step 300‧‧‧ performing a three-dimensional circuit layout on the curved layer to form a conductive loop through which the conductive loop is connected

Step 400‧‧‧ plating a metal layer on the conductive loop to change the electrical characteristics of the conductive loop

D‧‧‧Guide perforation entrance

D‧‧‧guide piercing exit

The first figure is a flow chart of a method for a three-dimensional curved laser guided through hole filling line according to an embodiment of the present invention.

The second figure is a schematic cross-sectional view of a substrate according to an embodiment of the present invention before laser drilling.

The third figure is a schematic cross-sectional view of the substrate of the above embodiment before laser plating after laser drilling.

The fourth figure is a schematic view of the substrate of the above embodiment after the copper plating metal layer.

Fig. 5 is a schematic view showing the substrate of the above embodiment after the nickel-plated metal layer.

Fig. 6 is a schematic view showing the substrate of the above embodiment after the gold plating metal layer.

Step 100‧‧‧ Provide a substrate with a curved layer and a body layer

Step 200 ‧ ‧ penetrates the substrate through a light source having a miniature spot size to form a laser activation via hole on the curved layer and the body layer

Step 300‧‧‧ performing a three-dimensional circuit layout on the curved layer to form a conductive loop through which the conductive loop is connected

Step 400‧‧‧ plating a metal layer on the conductive loop to change the electrical characteristics of the conductive loop

Claims (5)

A method for stereoscopic curved laser through-hole filling line includes: providing a substrate having a curved layer and a body layer; and penetrating the substrate through a light source having a miniature spot size to Forming a laser activating via hole on the body layer; performing a three-dimensional circuit layout on the curved layer to form a conductive loop, wherein the conductive loop is connected through the via; and plating a metal layer on the conductive loop To change the electrical characteristics of the conductive loop. The method of claim 3, wherein the material of the substrate comprises a thermosetting plastic DAP and a thermoplastic plastic PPA, LCP, PA6/6, PC or PC/ABS. The method of claim 3, wherein the substrate further comprises a plurality of uniformly dispersed metal particles. The method of claim 3, wherein the metal particles have a size of less than 100 micrometers. The method of claim 3, wherein the material of the metal particles is selected from the group consisting of palladium and copper.