TWI457187B - Processing method of base plate - Google Patents

Description

Substrate processing method

The present invention relates to a method of processing a substrate, and more particularly to a method of processing a substrate having a trench.

Conventional light emitting diodes (LEDs) are usually disposed on an aluminum substrate during manufacturing because of heat dissipation considerations. In this way, the high heat dissipation characteristics of the aluminum material can quickly dissipate the high thermal energy generated by the light-emitting diode during operation.

In the process of lighting devices for general light-emitting diodes, the layout of the layout is first performed on the aluminum substrate, and finally the light-emitting diodes are attached to the aluminum substrate. For example, in the case of a light-emitting diode used for a television screen, an aluminum substrate is formed into a strip shape in accordance with the requirement of thinning the screen, and a plurality of light-emitting diodes are disposed on the elongated aluminum substrate. For the manufacturing process of the elongated aluminum substrate, it is conventional practice to apply a plurality of wires to a flat aluminum substrate (for example, a rectangular size of 600 mm * 480 mm), and then perform grooving processing on the aluminum substrate. Further, a plurality of parallel grooves are formed on the flat rectangular aluminum substrate without damaging the wires. These grooves penetrate the aluminum substrate without cutting the aluminum substrate. In this way, a plurality of strip-shaped elongated substrates are formed between the trenches, and the two ends of the adjacent two elongated substrates are connected to each other. Then, the light-emitting diode is attached to the elongated substrate, and the connection between the two ends of the two elongated substrates is cut off to complete the process.

In addition, there are two main manufacturing methods for opening a plurality of parallel grooves on an aluminum substrate, one is to punch a groove on an aluminum substrate using a mold, and the other is to use a milling cutter to mill a groove on the aluminum substrate.

However, the above-mentioned process for stamping the groove by the mold has a poor quality yield, for example, the edge of the groove punched by the die is prone to burrs, and when the die is pressed with the aluminum substrate, the aluminum substrate is easily warped and deformed, which is disadvantageous for subsequent processing. Process. In addition, each different size of the groove requires a separate mold, which increases the production preparation cycle and material cost of the mold. Moreover, the length and width ratio of the groove to be formed will be limited by the method of stamping the mold. When the length of the groove to be formed is long, it cannot be done using a single mold. As a result, the process of stamping with a mold will be detrimental to the use of large-sized displays and fluorescent lamps. In addition, some of the aluminum substrates used in the illumination device of the light-emitting diodes are covered with a ceramic layer, and the material properties of the ceramic layer are brittle, so that the aluminum substrate coated with the ceramic layer is not suitable for stamping with the mold. The process is to form a trench. Further, when the material of the aluminum base material is a high-strength aluminum alloy, it cannot be processed by a die pressing process.

If the milling cutter is used to mill the groove, it can improve the quality yield and overcome the problem that the die can not make a long groove, but the milling cutter can only mill a groove at a time. If an aluminum substrate needs to open ten grooves, the milling cutter needs to be processed back and forth ten times. As a result, the processing time of the aluminum substrate is too long, resulting in insufficient productivity, so that the process of milling the groove by the milling cutter is not mass-produced.

The present invention provides a method for processing a substrate, thereby solving the problems in the process of forming a trench on a conventional aluminum substrate.

The method for processing a substrate disclosed in the present invention comprises the steps of providing a sawing device, the sawing device comprising a plurality of side-by-side saw blades. Then, a saw blade is cut by the saw blades of the sawing device to form a plurality of grooves arranged side by side on the substrate. Each of the grooves includes a first long side and a second long side, and a short side at one of the first long side and the second long side. Next, one of the grooves is milled by a milling cutter of a milling device that moves from an infeed point along a first infeed path. The feed point maintains a distance from the short side, the first infeed path intersects the first long side, and the first infeed path extends toward the short side and away from the groove. Next, the milling cutter is moved along a second infeed path connecting the first infeed path. Next, the milling cutter is moved to a separation point along a third infeed path connecting the second infeed path to complete removal of a portion of the substrate located at the short side. The separation point is maintained at a distance from the short side, the third infeed path intersects the second long side, and the third infeed path extends toward the groove and away from the short side to the point of separation.

The method for processing a substrate disclosed in the present invention comprises the steps of providing a substrate having at least one trench thereon. The groove includes a first long side and a second long side, and a short side at one end of the first long side and the second long side. Next, one of the grooves is milled by a milling cutter of a milling device that moves from an infeed point along a first infeed path. The feed point maintains a distance from the short side, the first infeed path intersects the first long side, and the first infeed path extends toward the short side and away from the groove. Next, the milling cutter is moved along a second infeed path connecting the first infeed path. Next, the milling cutter is moved to a separation point along a third infeed path connecting the second infeed path to complete removal of a portion of the substrate located at the short side. The separation point is maintained at a distance from the short side, the third infeed path intersects the second long side, and the third infeed path extends toward the groove and away from the short side to the point of separation.

According to the processing method of the substrate disclosed in the above invention, the sawing device has a plurality of side-by-side saw blades, so that the plurality of side-by-side grooves can be formed at one time in the same processing step to reduce the processing time. And, since the first infeed path intersects the first long side, the first infeed path extends toward the short side and away from the groove, and the third infeed path intersects the second long side, the third The infeed path extends toward the groove and away from the short side, so that a milled edge after milling will smoothly engage the first long side and the second long side for subsequent processing.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Referring to FIG. 1 and FIG. 2A to FIG. 3 together, FIG. 1 is a flowchart of a method for processing a substrate according to an embodiment of the present invention, and FIG. 2A is a composite according to an embodiment of the present invention. 2B is a side view of a structure of a compound processing machine according to an embodiment of the present invention, and FIG. 2C is a partial structural view of a milling device according to an embodiment of the present invention, FIG. A schematic view of a saw blade formed on a substrate according to an embodiment of the invention.

First, as shown in FIGS. 2A-2C, a composite processing machine 10 is provided. The composite processing machine 10 includes a sawing device 100 and a milling device 200. The sawing device 100 includes a plurality of side-by-side saw blades 110. The milling device 200 includes a milling cutter 210 (S1).

Furthermore, the composite processing machine 10 can include a body 11 on which the sawing device 100 and the milling device 200 are located. That is, the sawing device 100 and the milling device 200 are located in the same body 11. It should be noted that the features of the above-mentioned sawing device 100 and the milling device 200 in the same body 11 are not intended to limit the present invention. In other embodiments, the sawing device and the milling device may also be located on different two bodies.

In addition, the body 11 of the embodiment has a carrying platform 16 for carrying a substrate. The compound processing machine 10 further includes an X-axis guide rail 14, a Z-axis guide rail 12 and a Y-axis guide rail 15, and the X-axis guide rail 14, the Z-axis guide rail 12 and the Y-axis guide rail 15 are disposed on the body 11 on.

The sawing device 100 and the milling device 200 are mounted on the X-axis rail 14 and the Z-axis rail 12 and face the carrier 16. The sawing device 100 and the milling device 200 can be displaced in the X-axis direction or the Z-axis direction along the X-axis rail 14 and the Z-axis rail 12 relative to the carrier 16 by driving, for example, a linear motor. The stage 16 is mounted on the Y-axis guide rail 15 and is displaceable relative to the body 11 in the Y-axis direction along the Y-axis guide rail 15 by, for example, a linear motor.

In addition, the sawing device 100 of the present embodiment includes five side-by-side saw blades 110, and the saw blades 110 are disposed on a rotating shaft 150. That is, the saw blades 110 are coaxially arranged. It should be noted that the number of saw blades 110 is not intended to limit the present invention, and those skilled in the art can adjust the number of saw blades 110 according to actual needs.

Please refer to FIG. 6A together. FIG. 6A is a partial structural diagram of a trench according to an embodiment of the present invention. Next, as shown in FIGS. 3 and 6A, a substrate 30 is cut by the saw blades 110 of the sawing device 100, so that a plurality of grooves 300 are formed in parallel on the substrate 30. Each of the grooves 300 includes a first long side 301 and a second long side 302, and a short side 303 (S2) at one end of the first long side 301 and the second long side 302. .

The substrate 30 of the present embodiment is a circuit board, and particularly an aluminum substrate on which a light-emitting diode is mounted, but is not limited thereto. Since the sawing device 100 has a plurality of side-by-side saw blades 110, a plurality of side-by-side grooves 300 can be formed at one time in the same processing step to reduce processing time.

Also, in the present embodiment, the saw blades 110 have the same diameter, however, the features of the saw blade 110 having the same diameter are not intended to limit the present invention. For example, in another embodiment, as shown in FIG. 4, the saw blades 110 include a plurality of first saw blades 111 and a second saw blade 112 side by side, and the first saw blades 111 and the first saw blade 111 The second saw blade 112 is coaxially disposed. The second saw blade 112 is adjacent to the first saw blades 111, and the diameter of the second saw blade 112 is greater than the diameter of each of the first saw blades 111. The trenches 300 include a long trench 320 and a plurality of short trenches 310 adjacent to the long trench 320. The short trenches 310 are formed by the first saw blade 111 sawing the substrate 30, and the long trench 320 is formed by The second saw blade 112 saws the substrate 30 and is formed correspondingly.

Alternatively, in another embodiment, as shown in FIG. 5A, the saw blades 110 include a plurality of first saw blades 111 and two second saw blades 112 side by side, and the first saw blades 111 and the second second saws The slices 112 are arranged coaxially. These first saw blades 111 are interposed between the two second saw blades 112, and each second saw blade 112 has a diameter greater than the diameter of each of the first saw blades 111. The trenches 300 include two long trenches 320 and a plurality of short trenches 310 between the two long trenches 320. The short trenches 310 are formed by the saw blades 30 being sawed by the first saw blades 111. The long trench 320 is formed by sawing the substrate 30 by the second saw blade 112. It is worth mentioning that if the short trenches 310 and the two long trenches 320 as shown in FIG. 5A are formed on the substrate 30, the substrate 30 can be post-processed by, for example, a milling cutter or a saw blade. Two cutting grooves 330 are formed, and the two cutting grooves 330 are respectively connected to both ends of the two long grooves 320, as shown in FIG. 5B. As a result, the two slit grooves 330 and the two long grooves 320 will form a rectangular groove surrounding the short grooves 310, and a part of the substrate 31 is separated from the substrate 30 to form a unit of a semi-finished panel.

Please refer to FIG. 6A to FIG. 8 together with FIG. 1 , FIG. 6B is a cross-sectional view taken along line 6B of FIG. 6A, and FIG. 7 is a cross-sectional view of the substrate according to another embodiment of the present invention. Figure 8 is an enlarged schematic view of the feed path of the milling cutter according to an embodiment of the present invention.

When the saw blades 110 are formed on the substrate 30 correspondingly to form a plurality of side-by-side grooves 300, the short sides 303 at either end of the front and rear of the grooves 300 are not a neat edge, but a sharp burr 304 is present. Short side 303. The reason for this is that the saw blades 110 are disc-shaped bodies having curvatures, so that the saw blades 110 form a burr 304 having a circular arc edge at the short side 303 of the groove 300, as shown in Fig. 6B. Moreover, since the short side 303 of the trench 300 may be extended to form some mechanism slots in the subsequent processing, it is necessary to remove the burrs 304 for subsequent processing.

Further, as shown in Fig. 7, in practice, the saw blades 110 generally simultaneously cut the two stacked substrates 30, 30' to improve overall process efficiency. Therefore, when the saw blades 110 form the grooves 300, 300' on the two-sided stacked substrates 30, 30', since the saw blade 110 has a curvature relationship, the upper trench 300 and the lower trench 300' The length is inconsistent. Therefore, it is necessary to carry out subsequent processing processes for the trenches 300, 300'.

Therefore, one of the grooves 300 is then milled by the milling cutter 210 of the milling device 200 of Fig. 2B. Next, as shown in FIG. 8, the milling cutter 210 moves from an infeed point a along a first infeed path D1, and the infeed point a is maintained at a distance L4 from the short side 303, and the first infeed path D1 intersects. On the first long side 301, and the first infeed path D1 is directed toward the short side 303 and extends away from the groove 300 (S3). Among them, in practice, the distance L4 can be 3cm, but not limited to this.

Furthermore, the infeed point a of the embodiment is located in the groove 300, and the first infeed path D1 is advanced from the infeed point a toward the short side 303, and the first infeed path D1 and the first The angle at which the long sides 301 intersect is an acute angle θ1.

Next, the milling cutter 210 is moved along a second infeed path D2 that is connected to the first infeed path D1 (S4).

Furthermore, the second infeed path D2 of the embodiment is located outside the trench 300, and the second infeed path D2 is adjacent to the short side 303. Further, in the present embodiment, the second infeed path D2 is roughly a curved path of the parallel short side 303 as shown in FIG. It should be noted that the feature that the second infeed path D2 is a curved path is not intended to limit the present invention. In other embodiments, the second infeed path D2 may also be a polygonal path as shown in FIG. Alternatively, in other embodiments, the second infeed path D2 may also be a straight path.

Next, the milling cutter 210 is moved along a third infeed path D3 connected to the second infeed path D2 to a separation point b to complete the removal of the partial substrate 30 located at the short side 303. The separation point b is maintained at a distance L4 from the short side 303, the third infeed path D3 intersects the second long side 302, and the third infeed path D3 extends toward the groove 300 and away from the short side 303. To the point of separation b (S5). Wherein, the distance L4 can be 3 cm, but not limited thereto.

Furthermore, the separation point b of the embodiment is located in the groove 300, and the third infeed path D3 is advanced from the cutting point b toward the short side 303, and the third infeed path D3 and the second length are The angle at which the side edges 302 intersect is an acute angle θ2.

The processing path formed by the first infeed path D1, the second infeed path D2, and the third infeed path D3 surrounds the short side 303. Therefore, when the milling cutter 210 is moved from the infeed point a along the first infeed path D1, the second infeed path D2, and the third infeed path D3 to the off point b, the flash 304 on the short side 303 will Can be removed smoothly, as shown in Figure 9.

Since the first infeed path D1 and the first long side 301 are at an acute angle θ1, the third infeed path D3 and the second long side 302 are at an acute angle θ2, so the milling cutter 210 is along the first infeed path D1. The milling edge 305 formed by the second infeed path D2 and the third infeed path D3 milling the substrate 30 will smoothly engage the first long side 301 and the second long side 302, as shown in FIG. In this way, it is possible to avoid a step difference between the milling edge 305 and the first long side 301 or the second long side 302 due to the positioning tolerance of the milling cutter 210, so as to facilitate the subsequent processing of the groove and avoid the illumination. The problem of light leakage caused by the diode.

Further, as shown in FIG. 8, in practice, the distance L1 between the first long side 301 and the second long side 302 is a design value or a manufacturing target value L±tolerance value t. Wherein, the distance L2 between the infeed point a and the off-cut point b is Lt, and the end point c of the first infeed path D1 (ie, the starting point of the second infeed path D2) and the starting point of the third infeed path D3 The distance L3 of d (i.e., the end point of the second infeed path D2) is L+t. For example, if the range of the distance L1 is 2.0 ± 0.1 cm, the distance L2 is 1.9 cm and the distance L3 is 2.1 cm. In this way, regardless of the tolerance value t of the distance L1 between the first long side 301 and the second long side 302, it is ensured that the infeed point a and the off point b are located in the groove 300, and the first The end point c of an infeed path D1 and the start point d of the third infeed path D3 are located on the substrate 30 outside the groove 300. Therefore, by the above-mentioned distance L2 and distance L3 and parameter setting, as long as the width (distance L1) of the groove 300 of each substrate 30 is within the tolerance range, the same program can be applied to each substrate 30 without additional Perform the corrective action.

According to the processing method of the substrate of the above embodiment, the sawing device has a plurality of side-by-side saw blades, so that the plurality of side-by-side grooves can be formed at one time in the same processing step to reduce the processing time. Moreover, since the first infeed path and the first long side are at an acute angle, the third infeed path and the second long side are also at an acute angle, so that the milling edge can smoothly connect the first long side and the second side. The long sides are used for subsequent processing of the grooves and to avoid light leakage problems.

Moreover, the method of sawing the substrate to form the groove by the saw blade can also overcome the problems that are currently encountered in forming the groove by die stamping or milling processing, thereby improving productivity and yield and overcoming the groove size. And processing limitations of the substrate material and avoiding waste of materials.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

10. . . Compound processing machine

11. . . Body

12. . . Z axial guide

14. . . X-axis guide

15. . . Y axial guide

16. . . Carrying platform

100. . . Sawing device

110. . . Saw blade

111. . . First saw blade

112. . . Second saw blade

150. . . Rotating shaft

200. . . Milling device

210. . . Milling cutter

30. . . Substrate

30’. . . Substrate

31. . . Part of the substrate

300. . . Trench

300’. . . Trench

301. . . First long side

302. . . Second long side

303. . . Short side

304. . . Burr

305. . . Milling edge

310. . . Short groove

320. . . Long groove

330. . . Cutting slot

1 is a flow chart showing a method of processing a substrate according to an embodiment of the present invention.

2A is a schematic structural view of a compound processing machine according to an embodiment of the present invention.

Fig. 2B is a side view showing the structure of a compound processing machine according to an embodiment of the present invention.

2C is a partial structural view of a milling device according to an embodiment of the present invention.

3 is a schematic view showing a saw blade formed on a substrate according to an embodiment of the present invention.

4 is a schematic view showing a saw blade formed on a substrate according to another embodiment of the present invention.

Fig. 5A is a schematic view showing a saw blade formed on a substrate according to another embodiment of the present invention.

Fig. 5B is a schematic view of the post-processing of the substrate according to Fig. 5A.

Figure 6A is a partial structural view of a trench according to an embodiment of the present invention.

Fig. 6B is a cross-sectional view taken along line 6B of Fig. 6A.

Figure 7 is a cross-sectional view of a substrate in accordance with another embodiment of the present invention.

Figure 8 is an enlarged schematic view of the feed path of the milling cutter according to an embodiment of the present invention.

Figure 9 is a partially enlarged elevational view of a groove processed by a milling cutter in accordance with an embodiment of the present invention.

Fig. 10 is a schematic view showing a feeding path of a milling cutter according to another embodiment of the present invention.

Claims (12)

A method for processing a substrate, comprising: providing a sawing device, the sawing device comprising a plurality of side-by-side saw blades; cutting the substrate with the saw blades of the sawing device to form a plurality of side by side corresponding to the substrate a groove, each of the grooves includes a first long side and a second long side, and a short side at one end of the first long side and the second long side; a milling cutter of the milling device milling one of the grooves, the milling cutter moving from an infeed point along a first infeed path, the infeed point maintaining a distance from the short side, the first The infeed path intersects the first long side, and the first infeed path extends toward the short side and away from the groove; the milling cutter is along a first line connecting the first infeed path Moving the second infeed path; and moving the milling cutter along a third infeed path connecting the second infeed path to a separation point to complete removal of a portion of the substrate at the short side, The separation point maintains a distance from the short side, and the third infeed path intersects the second long side And the third line path towards the infeed direction of the groove and the short side away from the blade and extending to the point. The method of processing a substrate according to claim 1, wherein the infeed point and the separation point are located in the groove, and the second infeed path is located outside the groove. The method of processing a substrate according to claim 2, wherein an angle between the first infeed path and the first long side is an acute angle, and an angle between the third infeed path and the second long side is an acute angle. The processing method of the substrate of claim 2, wherein the distance between the first long side and the second long side is a design value or a manufacturing target value L±tolerance value t, wherein The distance between the infeed point and the point of separation is Lt, and the distance between the end of the first infeed path and the starting point of the third infeed path is L+t. The processing method of the substrate of claim 1, wherein the saw blades comprise a plurality of first saw blades and two second saw blades side by side, the first saw blades being interposed between the second saw blades And each of the second saw blades has a diameter larger than a diameter of each of the first saw blades, and the grooves comprise two long grooves and a plurality of short grooves between the two long grooves, The first saw blade saws the substrate to form the short trenches correspondingly, and the two second saw blades saw the substrate to form the two long trenches. The method of processing a substrate according to claim 5, wherein the first saw blade and the second saw blade are coaxial. The method for processing a substrate according to claim 1, wherein the saw blades comprise a plurality of first saw blades and a second saw blade, the second saw blade being adjacent to the first saw blades, and the first saw blade The diameter of the two saw blades is larger than the diameter of each of the first saw blades, and the grooves comprise a long groove and a plurality of short grooves adjacent to the long groove, the first saw blades sawing the substrate to correspond The short trenches are formed, and the second saw blade saws the substrate to form the long trench correspondingly. The method of processing a substrate according to claim 7, wherein the first saw blade and the second saw blade are coaxial. A method for processing a substrate, comprising: providing a substrate having at least one trench, the trench including an opposite first long side and a second long side, and the first long side a short side with one end of the second long side; a milling cutter of a milling device moves from an infeed point along a first infeed path to mill the substrate, the infeed point is short Maintaining a distance, the first infeed path intersects the first long side, and the first infeed path is toward the short side and extends away from the groove; the milling cutter is connected along the side Moving a second infeed path of the first infeed path; and moving the milling cutter along a third infeed path connecting the second infeed path to an off-going point to complete the removal at the short a portion of the substrate at the edge, the separation point maintaining a distance from the short side, the third infeed path intersecting the second long side, and the third infeed path is toward the groove and away from the The direction of the short side extends to the point of separation. The method of processing a substrate according to claim 9, wherein the infeed point and the separation point are located in the groove, and the second infeed path is located outside the groove. The method of processing a substrate according to claim 10, wherein an angle between the first infeed path and the first long side is an acute angle, and an angle between the third infeed path and the second long side is an acute angle. The processing method of the substrate of claim 10, wherein the distance between the first long side and the second long side is a design value or a manufacturing target value L±tolerance value t, wherein The distance between the infeed point and the point of separation is Lt, and the distance between the end of the first infeed path and the starting point of the third infeed path is L+t.