1239888 (1) 玖、發明說明 【發明所屬之技術領域】 本發明涉及一種藉由照射光束使原料粉末燒結硬化而 製造出三維物體之方法。 【先前技術】 所謂三維物體，其製造方式是從三維物體的設計資料 (CAD資料）獲得理想厚度的切片之多層截面形狀資料 ，並根據這些層的截面資料計算出掃描輪廓形狀，且藉由 重複對原料粉末照射光束而使粉末固化，以便使這些層聯 合成一欲燒結硬化的三維物體。所以，這種製造三維物體 之方法，其特徵在於不需要所謂的CAM ( Computer Aided Manufacturing，電腦輔助製造）裝置，也能夠製造出任意 形狀的三維物體，而且，相較於切削加工等加工方法，具 有能夠迅速製造所希望形狀的三維物體之優點。 在曰本專利第2620353號案中，揭示了 一種製造三維 物體的方法，眾所周知爲光成形法。根據日本專利第 2620353號案中所揭示之製造方法，藉由向原料粉末層的 預定部位照射光束，使原料粉末燒結而形成一燒結層，藉 由重複原料粉末層的形成與燒結層的形成而製造出三維物 體。根據此方法，藉由一移除步驟，就是將疊層式的臨時 三維物體之一表面僅移除一次多餘的部分，最後就能製作 出具有想要形狀之三維物體。 然而’當照射光束使原料粉末燒結時，係利用光束照 (2) 1239888 射所産生的熱。所產生出來的熱也會傳導到燒結部分的周 圍’致使周圓部分也會被加熱到很高的溫度。由於被加熱 到高溫的周阖部分具有很高的反應性，所以容易黏附周圍 所存在的原料粉末。假如原料粉末黏附到周圍部分的話， 該黏附的原料粉末就會因産生的熱而變質成低密度的黏附 物。爲了得到具有光滑表面的三維物體，就必須將低密度 的黏附物去除。 因此’本發明人在日本專利申請第2000-306546號案 中提出了如下的製造方法。即，日本專利申請第2 00 0-306546號案中所提出的製造方法，包含以下步驟：形成 原料粉末層；在此原料粉末層的預定部位照射光束且使該 預定部位的原料粉末產生燒結，而形成燒結層；重複上述 步驟’形成由多數燒結層聯合的燒結塊；從該燒結塊的一 表面除去多餘部分而得到想要的外觀形狀；對於除去多餘 部分的燒結塊，重複上述原料粉末層形成步驟與燒結層形 成步驟。也就是說，申請人提出了一種方法，藉此形成出 由多數燒結層聯合的一下燒結塊，再從該下燒結塊將多餘 部分切削去除後’接著形成上燒結塊的第一燒結層。在此 方法中，藉由重複進行燒結塊形成步驟以及從燒結塊中將 多餘部分切削去除的步驟，便可以不受工具長度的限制， 而得到具有光滑平面的三維物體。 但是’在具有從燒結塊中將多餘部分切削去除步驟之 上述方法中，存在有以下的問題。 即，如圖1 4所示，首先’對於由多數燒結層聯合的 -6- (3) 1239888 一下燒結塊B ’使用切削工具4等對其表面或側面上存在 的多餘部分予以去除。接著’當形成一上燒結塊B + 1時 ，藉此下燒結塊B可在其表面上與多數燒結層聯合在一起 。對於已經將多餘部分去除且具有光滑完成表面的下燒結 塊B之外側面’則周圍所存在的多餘粉末會黏附燒結餘其 上。因此，會形成像垂冰一樣下垂的多餘燒結部1 7。然 後，即使使用切削工具4對燒結塊B + 1再進行切削去除 此多於部位，該多餘燒結部1 7也無法去除而仍然殘留。 因此，在所完成的三維物體外表面上，就生成由多餘燒結 部1 7所形成的凹凸。 當然，在去除上燒結塊B +1的多餘燒結部1 7時，也 會將下燒結塊B的上層部外側所生成的多餘燒結部i 7〜 倂去除。但是，在這種情況下，去除物件的面積變大，且 去除多餘燒結部1 7所需要的時間也延長。而且，由於& 多數燒結塊中去除每一多餘燒結部1 7的加工時間之增加 ，導致整個去除與加工時間會顯著地增加很多。 【發明內容】 鑒於上述問題，本發明的目的在於提供一種製造^ _ 物體之方法，能夠解決由多餘燒結部所産生的問題。 本發明之製造三維物體之方法，其特徵在於包含以γ 步驟：（a )形成一無機原料粉末層；（b )對該原料粉来 層之預定部位予以照射光束，以便形成第一燒結層，且將 該第一燒結層與其下方之第二燒結層形成一體；（c) _ (4) 1239888 複步驟（a )與（b )，以便形成一燒結塊，此燒結塊聯合 有多數第一與第二燒結層，該燒結塊的側面具有一凹部； (d)從該燒結塊的一表面除去多餘部分；（e)對於除去 多餘部分的燒結塊，重複步驟（c )與（d )，以便製作由 多數燒結塊聯合成的三維物體之目標形狀。根據本發明， 藉由在燒結塊的側面設置凹部，將燒結塊的上部相對於外 側推擠，則使燒結塊下部之凹部能夠接收多餘燒結部的下 垂部分。 根據本發明之方法，其中上述凹部是形成在燒結塊的 一下部上。多餘燒結部的下垂部分會經過燒結塊上部的側 面，然後燒結塊的下部之凹部所接收。 根據本發明之方法，該凹部的一上表面，從外側向內 側向下傾斜。多餘燒結部的下垂部位被燒結塊的下部之凹 部所接收，且在傾斜的空間可接收更多的多餘燒結部之下 垂部位。 根據本發明之方法，進而包含聯合一薄板之步驟，此 薄板係覆蓋在除去多餘部分的燒結塊之頂面上。藉由配置 比燒結塊面積更大的薄板，覆蓋住除去多餘部分的燒結塊 ，則能夠防止多餘燒結部的下垂。 根據本發明之方法，進而包含對除去多餘部分的燒結 塊表面進行表面處理之步驟，以使其不與原料粉末發生反 應。藉由對除去多餘部分的燒結塊表面進行處理，使其與 原料粉末產生很低的反應性，能夠防止多餘燒結部的生成 -8- (5) 1239888 根據本發明之方法，在表面處理步驟之後，進而包含 將非黏結性粉體放置在燒結塊表面周圍之步驟。藉由在進 行7表面處理之燒結塊表面周圍放置非黏結性粉體，能夠 防止由於原料粉末黏附至燒結塊表面周圍而產生之多餘燒 結部。 根據本發明之方法，在表面處理步驟之後，進而包含 在燒結塊的頂面上放置一面罩之步驟，此面罩具有與燒結 塊的輪廓大致相同之孔徑。藉由放置具有與表面處理過的 燒結塊輪廓大致相同之孔徑的面罩，能夠防止由於原料粉 末黏附至燒結塊表面周圍而產生之多餘燒結部。 此外，本發明另外可包含以下步驟：（a )形成一無 機物原料粉末層；（b )沿著欲燒結有原料粉末層的預定 部位輪廓予以照射光束，而形成一輪廓燒結部；（c )將 欲燒結有原料粉末層的預定部位輪廓全體照射光束，以便 形成第一燒結層，且將該第一燒結層與其下方之第二燒結 層形成一體；（d )重複步驟（a )及（c )，以便形成一 燒結塊’此燒結塊聯合有多數第一及第二燒結層；（e ) 從該燒結塊的一表面除去多餘部分；（f )對於除去了多 餘部分之燒結塊，重複步驟（a )〜（e )之步驟，以由多 數燒結塊聯合成的三維物體之目標形狀。假如在沿著欲燒 結的預定部位之輪廓上設置一高熱傳導性的輪廓燒結部之 後，對欲燒結的整個部位照射光束時，則由光束照射所產 生的熱，會透過高熱傳導性的輪廓燒結部而傳導至其內側 的原料粉末層及下燒結塊上，所以能夠防止熱從輪廓燒結 -9- (6) 1239888 部傳導至外部。因此，藉上，能夠防止由於原料粉末黏附 在下燒結塊側表面上所產生出的垂冰狀多餘燒結部。1239888 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a three-dimensional object by sintering and hardening a raw material powder by irradiating a light beam. [Previous technology] The so-called three-dimensional object is manufactured by obtaining the multilayer cross-section shape data of slices of ideal thickness from the design data (CAD data) of the three-dimensional object, and calculating the scanning contour shape based on the cross-section data of these layers, and by repeating The powder is irradiated with a light beam to solidify the powder, so that the layers are combined into a three-dimensional object to be sintered and hardened. Therefore, this method of manufacturing a three-dimensional object is characterized in that a so-called CAM (Computer Aided Manufacturing) device is not required, and a three-dimensional object of any shape can be manufactured. In addition, compared with processing methods such as cutting, This has the advantage that a three-dimensional object of a desired shape can be manufactured quickly. Japanese Patent No. 2620353 discloses a method for manufacturing a three-dimensional object, which is well known as a photoforming method. According to the manufacturing method disclosed in Japanese Patent No. 2620353, a sintered layer is formed by irradiating a predetermined portion of a raw material powder layer with a light beam to sinter the raw material powder, and by repeating the formation of the raw material powder layer and the formation of the sintered layer, Create three-dimensional objects. According to this method, with a removing step, one surface of a laminated temporary three-dimensional object is removed only once, and finally a three-dimensional object having a desired shape can be produced. However, when the raw material powder is sintered by irradiating the light beam, the heat generated by the light beam (2) 1239888 is used. The generated heat is also conducted to the periphery of the sintered portion ', so that the peripheral portion is also heated to a very high temperature. Since the peripheral part heated to a high temperature has high reactivity, it easily adheres to the raw material powders existing around it. If the raw material powder is adhered to the surrounding portion, the adhered raw material powder is deteriorated into a low-density adherend by the generated heat. In order to obtain a three-dimensional object with a smooth surface, low-density adhesion must be removed. Therefore, the present inventor proposed the following manufacturing method in Japanese Patent Application No. 2000-306546. That is, the manufacturing method proposed in Japanese Patent Application No. 2000-306546 includes the following steps: forming a raw material powder layer; irradiating a light beam at a predetermined portion of the raw material powder layer and sintering the raw material powder at the predetermined portion, Forming a sintered layer; repeating the above steps' to form a sintered block composed of a plurality of sintered layers; removing an excess portion from one surface of the sintered block to obtain a desired appearance shape; for the sintered block from which the excess portion is removed, repeating the above-mentioned raw material powder layer A forming step and a sintered layer forming step. That is, the applicant has proposed a method by which a lower sintered block formed by combining a plurality of sintered layers is formed, and then an unnecessary portion is cut and removed from the lower sintered block 'to form a first sintered layer of the upper sintered block. In this method, by repeating the step of forming the sintered block and the step of cutting and removing the excess part from the sintered block, a three-dimensional object having a smooth plane can be obtained without being limited by the length of the tool. However, the above-mentioned method having the step of cutting and removing an unnecessary portion from the sintered block has the following problems. That is, as shown in FIG. 14, first, the -6- (3) 1239888 lower sintered block B, which is combined by a plurality of sintered layers, is used to remove an unnecessary portion existing on the surface or side surface using a cutting tool 4 or the like. Then, when an upper sintered block B + 1 is formed, the lower sintered block B can be combined with most sintered layers on its surface. With respect to the outer side of the lower sintered block B having the smooth finished surface which has been removed, the excess powder existing around it will stick to the sintered residue. Therefore, an excessive sintered portion 17 is formed which sags like ice. Then, even if the sintered block B + 1 is further removed by cutting with the cutting tool 4, the excess sintered portions 17 cannot be removed and remain. Therefore, on the outer surface of the completed three-dimensional object, irregularities formed by the excess sintered portions 17 are generated. Of course, when the excess sintered portion 17 of the upper sintered block B + 1 is removed, the excess sintered portions i 7 to 倂 generated outside the upper layer portion of the lower sintered block B are also removed. However, in this case, the area for removing the object becomes large, and the time required to remove the excess sintered portion 17 also increases. Moreover, as the processing time for removing each of the excess sintered portions 17 in most sintered blocks increases, the overall removal and processing time will increase significantly. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a method for manufacturing a ^ _ object, which can solve the problems caused by the excess sintered portion. The method for manufacturing a three-dimensional object according to the present invention is characterized by including a step of: (a) forming an inorganic raw material powder layer; (b) irradiating a predetermined portion of the raw material powder layer with a light beam to form a first sintered layer, And the first sintered layer is integrated with the second sintered layer below it; (c) _ (4) 1239888 repeat steps (a) and (b) in order to form a sintered block, which has a majority of the first and A second sintered layer having a recess on the side of the sintered block; (d) removing an excess portion from one surface of the sintered block; (e) repeating steps (c) and (d) for the sintered block from which the excess portion is removed, so that Create a target shape of a three-dimensional object formed by combining a large number of sintered blocks. According to the present invention, by providing a recessed portion on the side of the sintered block and pushing the upper portion of the sintered block relative to the outside, the recessed portion of the lower portion of the sintered block can receive the sagging portion of the excess sintered portion. According to the method of the present invention, the recessed portion is formed on a lower portion of the sintered block. The sagging part of the excess sintered part will pass through the side of the upper part of the sintered block, and then be received by the concave part of the lower part of the sintered block. According to the method of the present invention, an upper surface of the recess is inclined downward from the outside to the inside. The sag portion of the excess sintered portion is received by the concave portion at the lower portion of the sintered block, and more sag portions of the excess sintered portion can be received in the inclined space. The method according to the present invention further includes the step of combining a thin plate, which is covered on the top surface of the sintered block from which unnecessary portions are removed. By arranging a thin plate having a larger area than the sintered block to cover the sintered block from which the unnecessary portion is removed, it is possible to prevent the excessive sintered portion from sagging. The method according to the present invention further includes a step of surface-treating the surface of the sintered block from which unnecessary portions are removed so as not to react with the raw material powder. By treating the surface of the sintered block from which the excess portion is removed, it has a low reactivity with the raw material powder, which can prevent the generation of the excess sintered portion. 8- (5) 1239888 According to the method of the present invention, after the surface treatment step, , Further comprising the step of placing a non-adhesive powder around the surface of the sintered block. By placing a non-adhesive powder around the surface of the sintered block subjected to the surface treatment of 7, it is possible to prevent an excessive sintered portion due to the adhesion of the raw material powder to the surface of the sintered block. According to the method of the present invention, after the surface treatment step, the method further includes the step of placing a mask on the top surface of the sintered block, the mask having a hole diameter substantially the same as the contour of the sintered block. By placing a mask having a hole diameter approximately the same as that of the surface-treated sintered block outline, it is possible to prevent an excessive sintered portion due to the adhesion of the raw material powder to the periphery of the surface of the sintered block. In addition, the present invention may further include the following steps: (a) forming an inorganic raw material powder layer; (b) irradiating a light beam along a contour of a predetermined portion where the raw material powder layer is to be sintered to form a contour sintered portion; (c) applying The entire contour of the predetermined portion of the raw material powder layer to be sintered is irradiated with a light beam to form a first sintered layer, and the first sintered layer is integrated with a second sintered layer below it; (d) Repeat steps (a) and (c) In order to form a sintered block, this sintered block is combined with most of the first and second sintered layers; (e) removing the excess portion from one surface of the sintered block; (f) repeating the steps for the sintered block from which the excess portion has been removed ( a) to (e), the target shape of the three-dimensional object formed by combining a plurality of sintered blocks. If a high-thermal-conductivity contour sintering part is provided along the contour of a predetermined part to be sintered, and when a beam is irradiated to the entire part to be sintered, the heat generated by the beam irradiation will pass through the high-thermal-conductivity contour sintering. It can be conducted to the raw material powder layer on the inner side and the lower sintered block, so it is possible to prevent heat from being transmitted from the contour sintering-9- (6) 1239888 to the outside. Therefore, by this, it is possible to prevent the sintered ice-like excess sintered portion caused by the adhesion of the raw material powder to the side surface of the lower sintered block.
根據本發明，能夠防止當原料粉末黏附在燒結塊側面 上所產生之多餘燒結部，且即使在燒結塊的側表面上形成 了多餘燒結部，也能夠防止多餘燒結部沿著燒結塊的側面 下垂以及露出該側面外。因此，由於藉由去除裝置去除掉 多餘燒結部之加工深度會對應於大約一個燒結塊之厚度， 所以能夠縮短去除的加工時間。 【實施方式】 圖12是表示光成形法製造三維物體的裝置。圖12所 示的裝置設置有粉末層形成機構2、燒結層形成機構3、 以及切削去除機構4。 粉末層形成機構2，是設置在形成三維物體用的工作 臺上，即設置在可上下升降的一升降臺20上並且此升降 臺之周圍被被包圍起來。粉末層形成機構係用以藉由擠壓 刀片2 1將供給的無機物原料粉末1 0 a擠壓至一空間內（ 成形箱2 5 )，以便形成具有預定厚度△ 11的原料粉末層 1 〇。燒結層形成機構3，是藉由電流鏡3 1等掃描光學系 統將由雷射震盪器3 0所輸出的雷射在上述原料粉末層上 掃描，使原料粉末層1 〇燒結而形成燒結層1 1。切削去除 機構4，例如可以是銑削頭41。銑削頭4 1被安裝在一 XY 驅動機構40上，此機構可相對於上述粉末層形成機構2 的基板22在XY方向上自由移動。 -10- (7) 1239888 下面，參照圖1 3說明三維物體的基本製作順序。在 升降臺2 0上表面所配置的基板2 0之表面上供給預定量的 原料粉末10a，並由刀片21進行平整而形成第一原料粉 末層1 〇。藉由對該原料粉末層1 0之欲燒結部位照射光束 (雷射）L，使原料粉末層1 0燒結，且同時形成與基扳 2 2 —體化的一燒結層1 1。 然後，藉由在將升降臺2 0少許下降並再次供給原料 粉末1〇，以刀片21平整而形成第二原料粉末層1〇。藉由 對該原料粉末層1 0之的欲燒結部位照射光束（雷射）L， 使原料粉末層1 0燒結，同時形成與下層的燒結層n 一體 化之燒結層1 1。藉由重複升降臺2 0下降、形成新的原料 粉末層1 0 ’及照射光束L使所需要的部位形成燒結層i i 等一系列步驟，就能夠製作構成目標三維物體的一部分之 燒結塊B。 光束L的照射路徑，是基於三維c A D模型的資料而 預先製作的。也就是說，類似於習知技術，將由三維 CAD模型貝料所生成的stl( Stereo Lithography立體照 相）資料以等節距（例如0.05mm )切片爲層狀。在得到 各截面層的外形輪廓形狀p之後，由此外形輪廓形狀p進 而得到一掃描輪廓形狀R。此時，最好進行照射光束L， 以便將燒結塊B的至少最上表面燒結成高密度（氣孔率 5%以下）。 在重複進行上述形成原料粉末層1 〇後照射光束L形 成燒結層1 1之步驟時’假如燒結層1 1的整個厚度達到了 -11 - (8) 1239888 切削去除機構4中銑削頭4 1的工具長度所決定之需要値 得話，則切削去除機構4就僅操作一次，且對所製成的燒 結塊B的一表面部（含側面）進行切削加工。其結果是， 能夠得到表面平滑且具有想要的外形輪廓形狀P之燒結塊 B。例如，具有直徑1 mm且有效刃長3 mm之銑削頭4 1的 工具（圓頭銳刀），能夠進行深度爲3 m m之銑削加工。 然後，如果原料粉末層10的厚度ΔΠ爲0.05mm，當在製 作出聯合有5 0層的燒結層1 1之燒結塊B時，藉由切削去 除機構4之動作，可以進行切削加工。 由於燒結塊B的表面所黏附的原料粉末1 0 a會藉由照 射光束L所産生的熱而變質，所以在燒結塊B的表面上 會生成低密度的表面層，此低密度的表面層會受到切削去 除機構4而去除。此時，可以削鑿此低密度表面層而直到 高密度部內，這樣使燒結塊B的表面全面露出高密度部。 在這種情況下，進行了切削加工的燒結塊B是由比所希望 的外形輪廓形狀P稍大的尺寸所構成。由切削去除機構4 進行切削加工的路徑，係類似光束L的照射路徑，乃由三 維CAD資料預先製成。然後，對於已經藉由上述切削去 除機構4將低密度層予以切削加工之下燒結塊B，再次重 複形成原料粉末層1 0與燒結層1 1，如此會在下燒結塊B 上形成一新的上燒結塊B。 在上頭重疊有多數燒結層1 1的燒結塊B中，設計該 燒結塊B的下層部Lp，使其在水平方向上中心方向後退 (回折）且較短。換句話說，各層的掃描輪廓線R的尺寸 -12- 1239888 Ο) 構成方式，能使在設計上層部Up時一側端會具有從下層 部L p的側端向外側伸出之形狀。例如，如圖a、1 B、1 C 所示’由多數燒結層11所疊層的燒結塊B之側面，建構 出掃描輪廓形狀R的資料，以便具有從上層部Up到下層 部Lp呈大致斜面狀之缺口。如圖丨C中所示，當沿著基於 三維CAD資料的掃描輪廓線R照射光束L而形成各燒結 層1 1時’由於在欲照射的燒結層1 1之側面上所存在的原 料粉末1 0 a也一起被燒結，因此導致在燒結層1 1的側面 上形成多餘燒結部1 7。光束L所掃描的掃描輪廓線R， 係位於下層部Lp的燒結層1 1中縱向（圖中水平方向）內 側的一較短尺寸位置上，而在上層部Up的燒結層1 1中之 縱向外側的較長尺寸位置上。假如燒結層1 1的建構方式 使得此燒結層1 1的縱向尺寸會從下層部Lp逐漸長朝向上 層部U p增加，則凹部g的上表面可以從外側向內側向下 略微傾斜。然後，在照射光束L後的燒結塊B中，在上 層部U p的側表面上形成向外側伸出的一突出部f，且在下 層部Lp的側表面上形成向斜下方縮進的凹部g。在重疊 燒結層1 1的過程中所生成的多餘燒結部1 7可被收容於此 凹部g中，以便不會露出此凹部g下方緊接燒結塊B之側 表面。藉由對燒結塊B的側表面之多餘燒結部1 7的切削 加工’能夠得到具有想要外形輪廓形狀P的燒結塊B。另 外，如圖2A及2B所示，燒結塊B的側表面之下層部Lp 被設計爲矩形縮進的尺寸結構。然後，在燒結塊B的上層 部U p的側表面上，形成向外側伸出的突出部f，在燒結塊 •13- (10) 1239888 β的下層部Lp的側面形成矩形向內側縮進的凹部g。 而且’在製作具有這樣形狀的燒結塊B之過程中，如 圖4 C所示，在光束L的光點中，使用能夠得到7 0〜8 0 % 以上的燒結密度p且直徑爲2 L r之光點。在燒結塊B的下 層部lp側面上，如圖4A.所示，光束L沿著基於三維 C AD資料所計算出的掃描輪廓線進行掃描。在燒結塊 B的上層部up側，如圖4B所示，光束L沿著根據三維 C AD資料所計算出的掃描輪廓線Rl向外更加突出f的掃 描輪廓線Ru而進行掃描。這樣，就能夠形成突出部f。 而且1燒結塊B的上層部Up向外側伸出的部分f， 在該燒結塊B上形成的下一個上燒結塊B之燒結完成時 ’會與多餘燒結部1 7 —起被切削去除。 另外’在上述實施例中，雖然有必要對上燒結塊B的 上層部Up之突出部f進行切削去除，但是與多餘燒結部 1 7會從上燒結塊B下垂到下燒結塊B之習知技術相比， 切削去除所需要的人力與工時都非常短。 圖5表示的是其他的實施例。在圖5中，在對下燒結 塊B實行切削去除之後，使與下一個上燒結塊β相對應 的原料粉末層1 0之想要部位進行燒結時，光束L’則掃描 欲先燒結的部分’也就是沿著外圍或內圍的掃描輪廓線掃 描。因此，沿著窄細的掃描輪廓線形成了 一輪廓燒結部 1 8作爲臨時的燒結部。接著，將輪廓燒結部1 8所包圍的 欲燒結部位上照射光束L且進行此部位之燒結，則形成了 作爲真正燒結部的燒結層1 1。在此，用於形成輪廓燒結 -14- (11) 1239888 部1 8的光束L ’，藉由將其能量設定得比真正燒結 高速掃描用之光束L的能量小，使燒結的程度變小 沿著掃描輪廓線索形成的輪廓燒結部1 8 (非 多餘燒結部17)，能夠在當接受光束L照射時產 ，以便將來自光束L的熱釋放到已經形成的下燒 中。因此，能夠防止多餘燒結部1 7的大幅成長且 下燒結塊B的外表面上。在對下燒結塊b進行切 之後，在形成下一個上燒結塊B的第一燒結層1 1 形成輪廓燒結部1 8。然而，輪廓燒結部1 8的形成 僅於第一燒結層1 1時，也可以在形成其他燒結層： 間上。換句話說’輪廓燒結部1 8的形成至少進行 而燒結層1 1的形成則進行多次。 圖6及圖7表示的是其他的實施例。在該實施 由切削去除機構4對下燒結塊B進行切削加工之後 燒結塊B上放置一由薄鐵板構成的薄板7，以便由 覆蓋下燒結塊B與作爲切削去除機構4的加工軌跡 溝槽1 9 °然後，使用切削去除機構4，在薄板7與 塊B上開設一孔7〇’並在該孔內塡充原料粉末 藉由對孔70內所塡充的原料粉末1〇a照射光束[ 板7與下燒結塊B可以整體地燒結黏合在一起。 之後’轉移到下一個上燒結塊B的製作步驟。 說’在形成原料粉末層1 〇之後，形成燒結層丨工。 成原料粉末層1 0與燒結層1 1，以便形成上燒結塊 此情形中’由於薄板7將下燒結塊B的溝槽1 9覆 及進行 〇 常小的 生作用 結塊B 下垂在 削加工 時，可 並不是 Π的時 一次， 例中， ，在下 薄板7 之外圍 下燒結 1 0 a ° ，使薄 明確地 重複形 B。在 蓋住， -15- (12) 1239888 所以來自上燒結塊B的多餘燒結部1 7就不會下垂進入溝 槽1 9。然後，在上燒結塊B的切削去除步驟中，使用切 削去除機構4，將上述薄板7的不要部分切削去除。 進而’如圖8所示’在作爲使用切削去除機構4相對 於燒結塊B進行切削加工的加工軌迹而生成之外圍溝槽 19表面上，能夠進行表面處理，以便防止原料粉末i〇a 黏附到溝槽1 9上。由於該表面處理，可以在噴灑空氣或 氧化劑A的同時進行照射光束L a，則會在燒結塊B的上 部側面形成一氧化膜。由於通過這樣的表面處理能夠使原 料粉末1 0 a難以黏附到溝槽1 9表面上，所以可抑制引起 的多餘燒結部1 7的形成。另外，即使在燒結塊B上形成 多餘燒結部1 7，由於多餘燒結部1 7對於燒結塊B的黏附 情形很微弱，所以也容易將多餘燒結部1 7從燒結塊B脫 離。換句話說，在對燒結塊B進行切削加工時，多餘燒結 部1 7很容易從燒結塊B脫離去除。 另外，如圖9所示，在作爲由切削去除裝置4進行切 削加工的加工軌迹所生成的溝槽1 9內，也可以塡充不易 與燒結塊B (即，燒結層1 1 )黏結的材料C，例如塡充粒 徑爲〜φ50//ιη的陶瓷粉末，然後，再進行形成 下一個上燒結塊B的燒結層1 1。即使是由上燒結塊B生 成多餘燒結部1 7並向下燒結塊B下垂，但由於下燒結塊 B的周圍是由非黏結性材料C所覆蓋，所以在下燒結塊B 的側面不會黏附結合多餘燒結部1 7。 如圖1 Ο A及1 0B所示，非黏結性材料C是由分配器 -16- (13) 1239888 8所供給。也就是說，安裝在XY驅動機構（可以利用切 削去除機構4中的ΧΥ驅動機構40 )上的分配器8，係放 置在燒結塊Β的周圍所形成的溝槽丨9內。隨後，將適量 的非黏結性材料C從分配器8正確地塡充至溝槽1 9中。 而且，如圖1 1 A所示，在由切削去除機構4對下燒 結塊B進行切削去除之後，如圖1 1 B所示，燒結塊B被 一面罩板Μ所覆蓋，此面罩板設有一孔徑，其形狀大約 與下燒結塊Β的平面輪廓形狀相同。在這種狀態下，進行 形成與下一個上燒結塊Β相對應的原料粉末層1 0，並形 成燒結層1 1。藉由設置面罩板Μ，能夠防止多餘燒結部 17越過面罩板Μ而移動至下燒結塊Β。 而且，作爲原料粉末1 0a，可使用無機物或有機物的 粉末。例如’作爲無機物的原料粉末，可以使用日本專利 申請第200 1 - 1 52204號案中所揭示的粉末，即包含包括含 鐵粉末與不含鐵的粉末，其中此不含鐵的粉末是從鎳、鎳 合金、銅、及銅合金中所選擇之一種以上的金屬粉末。另 外，還可以使用鐵、銅、鈦、鋁、鎂等超硬質合金等。作 爲有機物的原料粉末，最好使用以尼龍、AB S等爲主要成 分之熱塑性樹脂。 【圖式簡單說明】 圖1 A是表示本發明的一實施例的立體圖； 圖1 B是一剖面圖，顯示本發明之一實施例； 圖1 C是一說明圖，顯示本發明之一實施例； -17- (14) 1239888 圖2A是表示本發明另一實施例的立體圖； 圖2 B是一剖面圖，顯示本發明之另一竇施例； 圖3是三維CAD模型之立體圖； 圖4A是一說明圖，說明在燒結塊的下部掃描光束之 情形； 圖4B是一說明圖，說明在燒結塊的下部掃描光束之 情形； 圖4 C是一說明圖，說明光束能量密度與光點直徑之 間的關係； 圖5 A是一剖面圖，表示用以燒結（臨時燒結）本發 明中另一實施例的輪廓部之方式； 圖5B是一剖面圖’表不在圖5A所不的輪廊部之燒 結（臨時燒結）後，實行針真正燒結的方式； 圖6是本發明另一實施例的步驟說明圖； 圖7是接續圖6的步驟說明圖之後的步驟說明圖； 圖8是說明本發明另一實施例之剖面圖； 圖9是說明本發明另一實施例之剖面圖； 圖1 Ο A是說明圖9中所示實施例之立體圖； 圖1 Ο B是說明圖9中所示實施例之截面圖； 圖1 1 A是說明本發明的另一實施例的立體圖，表示 燒結層之形成方式； 圖1 1 B是說明本發明的另一實施例的立體圖，表示了 在燒結層上配置一面罩板之情形； 圖12是一立體圖，表示用以製造三維物體的裝置之 -18- (15) 1239888 整體結構； 圖1 3是說明圖1 2所示製造三維物體的裝置之基本操 作； 圖1 4是說明習知技術中三維物體之製造程序。 【主要元件對照表】 B 燒 結 塊 L 光 束 C 非 黏 結 性 材 料 Μ 面 罩 板 2 粉 末 層 形 成 機 構 3 燒 結 層 形 成 機 構 4 切 割 移 除 機 構 7 薄 板 8 分 配 器 10 原 料 粉 末 層 10a 4τττ ιπΊΤ J\\\ 機 粉 末 原 料 11 燒 結 層 17 多 餘 燒 結 部 位 18 輪 廓 燒 結 部 19 溝 槽 20 升 降 臺 2 1 擠 壓 刀 片 22 基 板 -19- (16) 1239888 25 成形箱 3 0 雷射震盪器 3 1 電流鏡 40 XY驅動機構 4 1 銑削頭 70 孔According to the present invention, it is possible to prevent an excessive sintered portion generated when the raw material powder is adhered to the side of the sintered block, and to prevent the excessive sintered portion from sagging along the side of the sintered block even if the excessive sintered portion is formed on the side surface of the sintered block And expose that side. Therefore, since the processing depth of the excess sintered portion removed by the removal device corresponds to the thickness of about one sintered block, the processing time for removal can be shortened. [Embodiment] Fig. 12 shows an apparatus for manufacturing a three-dimensional object by a photoforming method. The apparatus shown in FIG. 12 is provided with a powder layer forming mechanism 2, a sintered layer forming mechanism 3, and a cutting and removing mechanism 4. The powder layer forming mechanism 2 is provided on a table for forming a three-dimensional object, that is, on a lifting table 20 that can be raised and lowered vertically, and the periphery of the lifting table is enclosed. The powder layer forming mechanism is configured to press the supplied inorganic raw material powder 10 a into a space (the forming box 25) by the pressing blade 21 to form a raw material powder layer 10 having a predetermined thickness Δ 11. The sintered layer forming mechanism 3 scans the laser output from the laser oscillator 30 on the raw material powder layer with a scanning optical system such as a current mirror 31, and sinters the raw material powder layer 10 to form a sintered layer 1 1 . The cutting and removing mechanism 4 may be, for example, a milling head 41. The milling head 41 is mounted on an XY driving mechanism 40, which can move freely in the XY direction relative to the substrate 22 of the powder layer forming mechanism 2 described above. -10- (7) 1239888 Next, the basic manufacturing sequence of a three-dimensional object will be described with reference to Figs. A predetermined amount of raw material powder 10a is supplied on the surface of the substrate 20 arranged on the upper surface of the lifting table 20, and is flattened by the blade 21 to form a first raw material powder end layer 10. By irradiating a light beam (laser) L to the sintered portion of the raw material powder layer 10, the raw material powder layer 10 is sintered, and at the same time, a sintered layer 11 is integrated with the substrate 2 2. Then, the raw material powder 10 is lowered a little by the lifting table 20, and the raw material powder 10 is supplied again, and the blade 21 is flattened to form a second raw material powder layer 10. By irradiating a light beam (laser) L to a portion to be sintered of the raw material powder layer 10, the raw material powder layer 10 is sintered, and at the same time, a sintered layer 11 integrated with the sintered layer n of the lower layer is formed. By repeating a series of steps of descending the lifting table 20, forming a new raw material powder layer 10 ', and irradiating the light beam L to form a sintered layer i i at a desired portion, a sintered block B constituting a part of the target three-dimensional object can be produced. The irradiation path of the light beam L is prepared in advance based on the data of the three-dimensional c A D model. That is, similar to the conventional technique, the stl (Stereo Lithography) data generated from the three-dimensional CAD model shell material is sliced into layers at equal pitches (for example, 0.05 mm). After obtaining the outline contour shape p of each cross-section layer, a contour outline shape R is obtained from the outline contour shape p. At this time, it is preferable to irradiate the light beam L so that at least the uppermost surface of the sintered block B is sintered to a high density (porosity is 5% or less). When repeating the above steps of forming the raw material powder layer 10 and irradiating the light beam L to form the sintered layer 11 'if the entire thickness of the sintered layer 1 1 reaches -11-(8) 1239888 of the milling head 4 1 in the cutting and removing mechanism 4 If it is determined by the tool length, the cutting and removing mechanism 4 is operated only once, and one surface portion (including the side surface) of the manufactured sintered block B is cut. As a result, a sintered block B having a smooth surface and a desired outer contour shape P can be obtained. For example, a tool (round sharp knife) with a milling head 41 with a diameter of 1 mm and an effective cutting edge length of 3 mm can perform milling operations with a depth of 3 mm. Then, if the thickness ΔΠ of the raw material powder layer 10 is 0.05 mm, when the sintered block B with 50 layers of sintered layers 11 1 is produced, the cutting and removing mechanism 4 can be used to perform cutting processing. Since the raw material powder 10 a adhered to the surface of the sintered block B is deteriorated by the heat generated by irradiating the light beam L, a low-density surface layer will be generated on the surface of the sintered block B. This low-density surface layer will It is removed by the cutting removal mechanism 4. At this time, the low-density surface layer can be chipped to the inside of the high-density portion, so that the surface of the sintered block B is completely exposed to the high-density portion. In this case, the sintered block B which has been subjected to a cutting process has a size slightly larger than the desired outer shape P. The cutting process performed by the cutting and removing mechanism 4 is similar to the irradiation path of the light beam L, and is prepared in advance from three-dimensional CAD data. Then, for the lower sintered block B which has been cut and processed by the above-mentioned cutting and removing mechanism 4, the raw material powder layer 10 and the sintered layer 11 are repeatedly formed again, so that a new upper layer is formed on the lower sintered block B. Sintered block B. In the sintered block B on which a plurality of sintered layers 11 are superimposed on the top, the lower layer portion Lp of the sintered block B is designed so that it is retracted (turned back) in the center in the horizontal direction and is short. In other words, the size of the scanning contour line R of each layer is -12- 1239888 〇) The structure is such that when designing the upper layer portion Up, one side end has a shape protruding from the side end of the lower layer portion L p to the outside. For example, as shown in FIGS. A, 1 B, and 1 C, the side of the sintered block B laminated with the majority of the sintered layers 11 is constructed to scan the profile R of the profile so that the upper layer portion Up to the lower layer portion Lp is approximately Bevel-like notches. As shown in FIG. 丨 C, when each sintered layer 11 is formed by irradiating the light beam L along the scanning contour line R based on the three-dimensional CAD data, 'the raw material powder 1 exists on the side of the sintered layer 1 1 to be irradiated. 0 a is also sintered together, so that an excessive sintered portion 17 is formed on the side of the sintered layer 11. The scanning contour line R scanned by the light beam L is located at a shorter dimension position inside the longitudinal direction (horizontal direction in the figure) of the sintered layer 11 of the lower layer Lp, and the longitudinal direction of the sintered layer 11 of the upper layer Up. On the longer outside position. If the sintered layer 11 is constructed in such a way that the longitudinal dimension of the sintered layer 11 increases gradually from the lower layer portion Lp toward the upper layer portion U p, the upper surface of the recessed portion g may be slightly inclined downward from the outside to the inside. Then, in the sintered block B after the light beam L is irradiated, a protruding portion f protruding outward is formed on the side surface of the upper layer portion U p, and a recessed portion that is recessed obliquely downward is formed on the side surface of the lower layer portion Lp. g. The excess sintered portion 17 generated during the overlapping of the sintered layer 11 can be accommodated in this recessed portion g so that the side surface of the sintered block B immediately below the recessed portion g is not exposed. By cutting the excess sintered portion 17 on the side surface of the sintered block B ', a sintered block B having a desired external contour P can be obtained. In addition, as shown in Figs. 2A and 2B, the layer portion Lp below the side surface of the sintered block B is designed to have a rectangular indented size structure. Then, on the side surface of the upper layer portion U p of the sintered block B, a protruding portion f protruding outward is formed, and a side of the lower layer portion Lp of the sintered block • 13- (10) 1239888 β is formed to be indented inwardly and inwardly. Recessed part g. Moreover, in the process of making the sintered block B having such a shape, as shown in FIG. 4C, in the light spot of the light beam L, a sintered density p of 70 to 80% or more can be used and the diameter is 2 L r Light spot. On the side of the lower layer part lp of the sintered block B, as shown in FIG. 4A, the light beam L is scanned along the scanning contour line calculated based on the three-dimensional CAD data. On the up side of the sintered block B, as shown in FIG. 4B, the light beam L is scanned along the scanning contour line Ru that protrudes outward from the scanning contour line R1 calculated from the three-dimensional CAD data. In this way, the protruding portion f can be formed. Furthermore, the portion f protruding from the upper layer portion Up of the sintered block B to the outside is cut and removed together with the excess sintered portion 17 when the next upper sintered block B formed on the sintered block B is sintered. In addition, in the above-mentioned embodiment, although it is necessary to cut and remove the protruding portion f of the upper layer portion Up of the upper sintered block B, the conventional sintered portion 17 will sag from the upper sintered block B to the lower sintered block B. Compared to technology, the labor and man-hours required for cutting removal are very short. FIG. 5 shows another embodiment. In FIG. 5, after cutting and removing the lower sintered block B and sintering a desired portion of the raw material powder layer 10 corresponding to the next upper sintered block β, the light beam L ′ scans the portion to be sintered first. 'That is, scanning along the outer or inner scanning contour line. Therefore, a contour sintered portion 18 is formed along the narrow scanning contour line as a temporary sintered portion. Next, the portion to be sintered surrounded by the contour sintered portion 18 is irradiated with a light beam L and sintered at this portion to form a sintered layer 11 as a true sintered portion. Here, the beam L 'used for forming the contour sintering-14- (11) 1239888 part 18 is set to have a smaller energy than that of the beam L for high-speed scanning for true sintering, so that the degree of sintering becomes smaller. The contour sintered portion 18 (non-excessive sintered portion 17) formed along the scanning contour cues can be produced when the light beam L is irradiated, so as to release heat from the light beam L to the already formed under fire. Therefore, it is possible to prevent the excessive growth of the excessive sintered portion 17 from coming on the outer surface of the lower sintered block B. After the lower sintered block b is cut, a contoured sintered portion 18 is formed on the first sintered layer 1 1 forming the next upper sintered block B. However, the contour sintered portion 18 is formed only when the first sintered layer 11 is formed, and other sintered layers may be formed. In other words, the formation of the 'profile sintered portion 18 is performed at least and the formation of the sintered layer 11 is performed multiple times. 6 and 7 show other embodiments. After the lower sintered block B is cut by the cutting and removing mechanism 4 in this embodiment, a thin plate 7 made of a thin iron plate is placed on the sintered block B so as to cover the lower sintered block B and the machining track groove as the cutting and removing mechanism 4. 19 ° Then, using the cutting and removing mechanism 4, a hole 70 ′ is opened in the thin plate 7 and the block B, and the raw material powder is filled in the hole. The raw material powder 10a filled in the hole 70 is irradiated with the light beam. [The plate 7 and the lower sintered block B may be integrally sintered and bonded together. After that, it shifts to the next manufacturing step of the upper sintered block B. It is said that after the raw material powder layer 10 is formed, a sintered layer is formed. The raw material powder layer 10 and the sintered layer 11 are formed so as to form the upper sintered block. In this case, 'the sheet 7 covers the grooves 19 of the lower sintered block B and performs the normal small active block B. This time, it is not the time of Π. In the example, sintering 10 a ° under the periphery of the lower sheet 7 makes the thin repeat the shape B clearly. In the cover, -15- (12) 1239888 so that the excess sintered part 17 from the upper sintered block B will not sag into the groove 19. Then, in the cutting and removing step of the upper sintered block B, the unnecessary portion of the thin plate 7 is removed by cutting using the cutting and removing mechanism 4. Furthermore, as shown in FIG. 8, on the surface of the peripheral groove 19 generated as a machining track for cutting processing with respect to the sintered block B using the cutting and removing mechanism 4, a surface treatment can be performed to prevent the raw material powder i〇a from adhering to Trenches 19 and 9. Due to this surface treatment, the air beam or a can be irradiated while spraying air or oxidant A, and an oxide film is formed on the upper side of the sintered block B. Since such a surface treatment makes it difficult for the raw material powder 10 a to adhere to the surface of the groove 19, it is possible to suppress the formation of an excessive sintered portion 17 caused by the surface powder. In addition, even if the excessive sintered portion 17 is formed on the sintered block B, since the excessive sintered portion 17 is weakly adhered to the sintered block B, it is easy to detach the redundant sintered portion 17 from the sintered block B. In other words, when the sintered block B is cut, the excess sintered portion 17 can be easily removed from the sintered block B and removed. In addition, as shown in FIG. 9, the grooves 19 generated as the machining trajectories of the cutting process performed by the cutting and removing device 4 may be filled with a material that is not easily bonded to the sintered block B (that is, the sintered layer 1 1). C, for example, filling ceramic powder with a particle diameter of ~ φ50 // ιη, and then proceeding to form a sintered layer 11 of the next upper sintered block B. Even if the excess sintered part 17 is generated from the upper sintered block B and the downward sintered block B sags, since the periphery of the lower sintered block B is covered by the non-adhesive material C, the side of the lower sintered block B is not adhered and bonded. Excess sintered part 1 7. As shown in Figures 10A and 10B, the non-adhesive material C is supplied by the distributor -16- (13) 1239888 8. In other words, the distributor 8 mounted on the XY driving mechanism (the XY driving mechanism 40 in the cutting and removing mechanism 4 can be used) is placed in the groove 9 formed around the sintered block B. Subsequently, an appropriate amount of the non-adhesive material C is correctly charged from the dispenser 8 into the groove 19. Moreover, as shown in FIG. 1A, after the lower sintered block B is removed by the cutting and removing mechanism 4, as shown in FIG. 1B, the sintered block B is covered by a mask plate M, which is provided with a mask plate M The shape of the hole diameter is approximately the same as the shape of the plane outline of the lower sintered block B. In this state, the formation of the raw material powder layer 10 corresponding to the next upper sintered block B is performed, and the sintered layer 11 is formed. By providing the mask plate M, it is possible to prevent the excessive sintered portion 17 from moving beyond the mask plate M to the lower sintered block B. As the raw material powder 10a, an inorganic or organic powder can be used. For example, as the raw material powder of the inorganic substance, the powder disclosed in Japanese Patent Application No. 200 1-1 52204 can be used, that is, the powder includes iron-containing powder and iron-free powder, wherein the iron-free powder is from nickel , Nickel alloy, copper, and copper alloy selected from more than one metal powder. In addition, cemented carbides such as iron, copper, titanium, aluminum, and magnesium can also be used. As a raw material powder of an organic substance, a thermoplastic resin containing nylon, ABS, etc. as a main component is preferably used. [Brief Description of the Drawings] FIG. 1A is a perspective view showing an embodiment of the present invention; FIG. 1B is a sectional view showing an embodiment of the present invention; FIG. 1C is an explanatory view showing an implementation of the present invention Example; -17- (14) 1239888 Fig. 2A is a perspective view showing another embodiment of the present invention; Fig. 2B is a sectional view showing another sinus embodiment of the present invention; Fig. 3 is a perspective view of a three-dimensional CAD model; 4A is an explanatory diagram illustrating a case where a light beam is scanned under the sintered block; FIG. 4B is an explanatory diagram illustrating a case where a light beam is scanned under the sintered block; FIG. 4C is an explanatory diagram illustrating a beam energy density and a light spot Relationship between diameters; FIG. 5A is a cross-sectional view showing a method for sintering (temporarily sintering) a contour portion of another embodiment of the present invention; FIG. 5B is a cross-sectional view showing a wheel not shown in FIG. 5A After sintering (temporary sintering) of the gallery, the needle is actually sintered. Fig. 6 is a step explanatory diagram of another embodiment of the present invention; Fig. 7 is a step explanatory diagram subsequent to the step explanatory diagram of Fig. 6; A section illustrating another embodiment of the present invention Figure 9 is a cross-sectional view illustrating another embodiment of the present invention; Figure 10A is a perspective view illustrating the embodiment shown in Figure 9; Figure 10B is a cross-sectional view illustrating the embodiment shown in Figure 9; 1 1 A is a perspective view illustrating another embodiment of the present invention, showing a method for forming a sintered layer; FIG. 1 1 B is a perspective view illustrating another embodiment of the present invention, showing a case where a mask plate is disposed on the sintered layer Figure 12 is a perspective view showing the overall structure of a device for manufacturing a three-dimensional object (15) 1239888; Figure 13 is a diagram illustrating the basic operation of the device for manufacturing a three-dimensional object shown in Figure 12; Figure 14 is a description Manufacturing process of three-dimensional objects in conventional technology. [Comparison table of main components] B Sintered block L Beam C Non-adhesive material M Mask plate 2 Powder layer forming mechanism 3 Sintered layer forming mechanism 4 Cutting and removing mechanism 7 Sheet 8 Distributor 10 Raw material powder layer 10a 4τττ ιπΊΤ J \\\ Machine powder raw material 11 Sintered layer 17 Excessive sintered part 18 Contour sintered part 19 Groove 20 Lifting table 2 1 Extrusion blade 22 Substrate -19- (16) 1239888 25 Forming box 3 0 Laser oscillator 3 1 Current mirror 40 XY drive Mechanism 4 1 Milling head 70 holes