TWI456736B - 避免漏電流之暫態電壓抑制器 - Google Patents

避免漏電流之暫態電壓抑制器 Download PDF

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Publication number
TWI456736B
TWI456736B TW100143298A TW100143298A TWI456736B TW I456736 B TWI456736 B TW I456736B TW 100143298 A TW100143298 A TW 100143298A TW 100143298 A TW100143298 A TW 100143298A TW I456736 B TWI456736 B TW I456736B
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heavily doped
region
disposed
doped region
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TW100143298A
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TW201322424A (zh
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Che Hao Chuang
Kun Hsien Lin
Ryan Hsin Chin Jiang
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Amazing Microelectronic Corp
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  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)

Claims (10)

  1. 一種避免漏電流之暫態電壓抑制器,包括:一P型基板;一N型磊晶層,其係設於該P型基板上,且一第一N型重摻雜區與一第一P型重摻雜區設於該N型磊晶層中;一第一N型埋區,其係設於該N型磊晶層之底部,以與該P型基板相鄰,且該第一N型埋區位於該第一N型重摻雜區與該第一P型重摻雜區下方;一靜電放電(ESD)元件,其係設於該N型磊晶層中,並連接該第一N型重摻雜區,該靜電放電元件更包含:一箝位P型井區,其係設於該N型磊晶層中,且一第二N型重摻雜區係設於該箝位P型井區中;一第三N型重摻雜區,其係設於該N型磊晶層中,並連接該第一N型重摻雜區與該第二N型重摻雜區;一第二P型重摻雜區,其係設於該N型磊晶層中;一第二N型埋區,其係與該第一N型埋區共同位於一水平面,並共同設於該N型磊晶層之該底部,以與該P型基板相鄰,該第二N型埋區位於該第三N型重摻雜區與該第二P型重摻雜區下方;一第四N型重摻雜區,其係設於該N型磊晶層中,該第四N型重摻雜區與該第一P型重摻雜區皆連接一第一輸入輸出接腳(I/O pin);以及 一第五N型重摻雜區,其係設於該N型磊晶層中,該第五N型重摻雜區與該第二P型重摻雜區皆連接一第二輸入輸出接腳,且該深溝渠隔離結構之該深度大於該第二N型埋區之深度,該深溝渠隔離結構更鄰接該第二N型埋區,以隔離該第一N型埋區、該第二N型埋區、該箝位P型井區、該第四N型重摻雜區與該第五N型重雜區;以及至少一深溝渠隔離結構,設於該N型磊晶層中,該深溝渠隔離結構之深度係大於該第一N型埋區之深度,並鄰接該第一N型埋區,以隔離該第一N型埋區與該靜電放電元件。
  2. 如請求項1所述之避免漏電流之暫態電壓抑制器,其中該P型基板為P型重摻雜基板。
  3. 如請求項1所述之避免漏電流之暫態電壓抑制器,其中該N型磊晶層為N型輕摻雜磊晶層。
  4. 如請求項1所述之避免漏電流之暫態電壓抑制器,其中該P型基板為浮接。
  5. 如請求項1所述之避免漏電流之暫態電壓抑制器,更包含一第一P型井區,其係設於該N型磊晶層中,並位於該第一N型埋區之上方,且該第一N型重摻雜區位於該第一P型井區中。
  6. 如請求項1所述之避免漏電流之暫態電壓抑制器,更包含一第二P型井區,其係設於該N型磊晶層中,並位於該第二N型埋區之上方,該第三N型重摻雜區係設於該第二P型井區中。
  7. 一種避免漏電流之暫態電壓抑制器,包括: 一P型基板;一N型磊晶層,其係設於該P型基板上,且一第一N型重摻雜區與一第一P型重摻雜區設於該N型磊晶層中;一第一N型埋區,其係設於該N型磊晶層之底部,以與該P型基板相鄰,且該第一N型埋區位於該第一N型重摻雜區與該第一P型重摻雜區下方;一靜電放電(ESD)元件,其係設於該N型磊晶層中,並連接該第一N型重摻雜區,該靜電放電元件更包含:複數個二極體結構,其係設於該N型磊晶層中,每一該二極體結構更包含:一第三P型重摻雜區,其係設於該N型磊晶層中;以及一第六N型重摻雜區,其係設於該N型磊晶層中,每一該二極體結構藉由該第三P型重摻雜區與該第六N型重摻雜區彼此串連;複數個第三N型埋區,其係與該第一N型埋區共同位於一水平面,並共同設於該N型磊晶層之該底部,以與該P型基板相鄰,每一該第三N型埋區係位於一該第三P型重摻雜區與一該第六N型重摻雜區之下方;以及一接觸P型井區,其係設於該N型磊晶層中,且一第四P型重摻雜區係設於該接觸P型井區中,並連接最後一該第六N型重摻雜區,第一該第三P型重摻雜區連接該第一N型重摻雜區,且該深溝渠隔離結構之該深度係大於每一該第三N型埋區之深 度,該深溝渠隔離結構更鄰接每一該第三N型埋區,以隔離該第四P型重摻雜區、該第一N型埋區與每一該第三N型埋區;以及至少一深溝渠隔離結構,設於該N型磊晶層中,該深溝渠隔離結構之深度係大於該第一N型埋區之深度,並鄰接該第一N型埋區,以隔離該第一N型埋區與該靜電放電元件。
  8. 如請求項7所述之避免漏電流之暫態電壓抑制器,其中該第一P型重摻雜區連接一高電壓接腳,且該P型基板連接一接地接腳。
  9. 如請求項7所述之避免漏電流之暫態電壓抑制器,其中該第一P型重摻雜區連接一第三輸入輸出接腳,該P型基板連接一第四輸入輸出接腳。
  10. 如請求項7所述之避免漏電流之暫態電壓抑制器,更包含複數個第三P型井區,其係設於該N型磊晶層中,並位於該第三N型埋區之上方,每一該第六N型重摻雜區分別設於一該第三P型井區中。
TW100143298A 2011-11-25 2011-11-25 避免漏電流之暫態電壓抑制器 TWI456736B (zh)

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TWI584382B (zh) * 2016-02-01 2017-05-21 力祥半導體股份有限公司 暫態電壓抑制器之二極體元件及其製造方法
US10777546B2 (en) * 2016-11-30 2020-09-15 Taiwan Semiconductor Manufacturing Co., Ltd. Planar and non-planar FET-based electrostatic discharge protection devices
TWI745595B (zh) 2018-06-05 2021-11-11 源芯半導體股份有限公司 靜電放電防護元件
US10930636B2 (en) 2018-08-20 2021-02-23 Amazing Microelectronic Corp. Transient voltage suppression device
US10388647B1 (en) * 2018-08-20 2019-08-20 Amazing Microelectronic Corp. Transient voltage suppression device

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US20070073807A1 (en) * 2005-02-11 2007-03-29 Alpha & Omega Semiconductor, Ltd Latch-up free vertical TVS diode array structure using trench isolation
US20080203534A1 (en) * 2007-02-26 2008-08-28 Freescale Semiconductor, Inc. Complementary zener triggered bipolar esd protection
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US20110212595A1 (en) * 2010-02-26 2011-09-01 Jerry Hu Semiconductor device structure and methods of making

Patent Citations (5)

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US6586317B1 (en) * 2001-05-08 2003-07-01 National Semiconductor Corporation Method of forming a zener diode in a npn and pnp bipolar process flow that requires no additional steps to set the breakdown voltage
US20070073807A1 (en) * 2005-02-11 2007-03-29 Alpha & Omega Semiconductor, Ltd Latch-up free vertical TVS diode array structure using trench isolation
US20080203534A1 (en) * 2007-02-26 2008-08-28 Freescale Semiconductor, Inc. Complementary zener triggered bipolar esd protection
CN201556940U (zh) * 2009-11-17 2010-08-18 杭州华三通信技术有限公司 一种rs-232接口防护电路
US20110212595A1 (en) * 2010-02-26 2011-09-01 Jerry Hu Semiconductor device structure and methods of making

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