TWI456324B - Design and manufacturing processes of backplane for direct drive displays,process for plugging gaps between segment electrodes in a direct drive display and direct drive displays thus obtained - Google Patents

Claims (16)

A method of filling a gap between segment electrodes in a direct drive display that is filled with a display grid filled with an electrophoretic fluid, wherein the electrophoretic fluid comprises charged pigment particles dispersed in a solvent, the method comprising the following sequential steps: a Applying a liquid type of heat or radiation hardenable material to the top surface of the segment electrode, b) laminating the release film on the top surface, thereby extruding the material into the gap between the segment electrodes and by a The clamping rolls control the pressure of the laminate, c) harden the heat or radiation hardenable material, and d) remove the release film after hardening the heat or radiation hardenable material. A method for fabricating a direct drive display substrate comprising a display grid filled with an electrophoretic fluid, wherein the electrophoretic fluid comprises charged pigment particles dispersed in a solvent, the method comprising the following sequential steps: a) in non-conducting Conductive wiring is formed on the basal layer; b) the conductive wiring is covered by a photo-visible material; c) the photo-developable material connected to the area of the conductive wiring is removed to form the open area; d) by the first a conductive material stacks the open area to form a conductive region embedded in the photo-developable material; e) forming a segment electrode by plating a second conductive material on the photo-developable material; f) Type of heat or radiation hardenable material applied to the section a top surface of the electrode; g) laminating a release film on the top surface, thereby pressing the material into the gap between the segment electrodes and controlling the pressure of the laminate by a pinch roll; h) hardening the heat or radiation a hardenable material; and i) removing the release film after hardening the heat or radiation hardenable material. The method of claim 2, wherein the conductive wiring is formed of copper. The method of claim 2, wherein the photo-developable material is a solder resist, a negative-tone photoresist, or a positive-tone photoresist. The method of claim 2, wherein the photo-developable material is an epoxy-based solder resist. The method of claim 2, wherein the heat or radiation hardenable material has more than 85% by weight solid content. A method for fabricating a direct drive display substrate comprising a display grid filled with an electrophoretic fluid, wherein the electrophoretic fluid comprises charged pigment particles dispersed in a solvent, the method comprising the following sequential steps: a) conducting The material is formed on the non-conductive base layer on both sides of the non-conductive base layer to form a through hole; b) the through hole is filled with a conductive paste; c) on one side of the non-conductive base layer Segmented electrodes are formed on the laminated or coated conductive material, and conductive wiring is formed on the conductive material laminated or coated on the other side of the non-conductive underlying layer; d) liquid type heat or radiation Hardenable material applied to the section a top surface of the electrode; e) laminating a release film on the top surface, thereby pressing the material into the gap between the segment electrodes and controlling the pressure of the laminate by a pinch roll; f) hardening the heat or radiation a hardenable material; and g) removing the release film after hardening the heat or radiation hardenable material. The method of claim 7, wherein the through hole is formed by mechanical or laser drilling. For example, in the method of claim 7, wherein the conductive paste is a carbon paste, a copper paste, a nickel paste, a cobalt paste, a silver paste, a silver coated copper paste. A silver coated nickel paste, a silver coated cobalt paste, or a composite or alloy paste thereof. The method of claim 7, wherein the heat or radiation hardenable material has more than 85% by weight solid content. The method of claim 1, wherein the heat or radiation hardenable material remaining on the top surface of the segment electrode has a thickness of 0.1 μm or less. The method of claim 2, wherein the heat or radiation hardenable material remaining on the top surface of the segment electrode has a thickness of 0.1 μm or less. The method of claim 7, wherein the heat or radiation hardenable material remaining on the top surface of the segment electrode has a thickness of 0.1 μm or less. The method of claim 1, wherein the heat or radiation The hardenable material has a dielectric constant ranging from about 1 to about 10. The method of claim 2, wherein the heat or radiation hardenable material has a dielectric constant ranging from about 1 to about 10. The method of claim 7, wherein the heat or radiation hardenable material has a dielectric constant ranging from about 1 to about 10.