TWI456217B - Probing method of leadless semiconductor package - Google Patents

Probing method of leadless semiconductor package Download PDF

Info

Publication number
TWI456217B
TWI456217B TW101138485A TW101138485A TWI456217B TW I456217 B TWI456217 B TW I456217B TW 101138485 A TW101138485 A TW 101138485A TW 101138485 A TW101138485 A TW 101138485A TW I456217 B TWI456217 B TW I456217B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
lead frame
package structure
probe
external
Prior art date
Application number
TW101138485A
Other languages
Chinese (zh)
Other versions
TW201416684A (en
Inventor
Cha Chi Yeh
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW101138485A priority Critical patent/TWI456217B/en
Publication of TW201416684A publication Critical patent/TW201416684A/en
Application granted granted Critical
Publication of TWI456217B publication Critical patent/TWI456217B/en

Links

Claims (2)

一種無外接腳式半導體封裝構造之探測方法，包含：提供一無外接腳式半導體封裝構造，其係包含一封膠體、一被該封膠體密封之晶片以及複數個導線架引指，該封膠體係具有一底面以及複數個側面，該晶片係電性連接至該些導線架引指，該封膠體係局部密封該些導線架引指而使每一導線架引指具有一顯露在該底面之接合面以及一顯露在該側面之探觸面；抓取該無外接腳式半導體封裝構造並安裝在一測試槽座內，其中該測試槽座內係設置有複數個側向探針；以及利用該些側向探針探觸該些導線架引指之探觸面，以對該無外接腳式半導體封裝構造進行電性測試。A method for detecting a semiconductor package structure without an external pin comprises: providing an external pin type semiconductor package structure comprising a glue body, a wafer sealed by the sealant body, and a plurality of lead frame fingers, the sealant The system has a bottom surface and a plurality of sides, the wafer is electrically connected to the lead frame fingers, and the sealing system partially seals the lead frame fingers so that each lead frame index has a light exposed on the bottom surface a bonding surface and a probe surface exposed on the side; grasping the external semiconductor package structure and mounting in a test socket, wherein the test socket is provided with a plurality of lateral probes; and utilizing The lateral probes probe the probe faces of the leadframes for electrical testing of the pedestal-free semiconductor package construction. 依據申請專利範圍第1項之無外接腳式半導體封裝構造之探測方法，其中在探觸該些導線架引指之探觸面之過程中，該些導線架引指之接合面係不緊貼於該測試槽座之底部。According to the method for detecting an external-pin type semiconductor package structure according to the first aspect of the patent application, in the process of detecting the probe faces of the lead frames, the joint faces of the lead frames are not closely attached. At the bottom of the test socket.
TW101138485A 2012-10-18 2012-10-18 Probing method of leadless semiconductor package TWI456217B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101138485A TWI456217B (en) 2012-10-18 2012-10-18 Probing method of leadless semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101138485A TWI456217B (en) 2012-10-18 2012-10-18 Probing method of leadless semiconductor package

Publications (2)

Publication Number Publication Date
TW201416684A TW201416684A (en) 2014-05-01
TWI456217B true TWI456217B (en) 2014-10-11

Family

ID=51293766

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101138485A TWI456217B (en) 2012-10-18 2012-10-18 Probing method of leadless semiconductor package

Country Status (1)

Country Link
TW (1) TWI456217B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04329277A (en) * 1991-04-30 1992-11-18 I T T Canon:Kk Printed board connecting device
TW498443B (en) * 2001-06-21 2002-08-11 Advanced Semiconductor Eng Singulation method for manufacturing multiple lead-free semiconductor packages
TW200601537A (en) * 2004-06-23 2006-01-01 Advanced Semiconductor Eng Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04329277A (en) * 1991-04-30 1992-11-18 I T T Canon:Kk Printed board connecting device
US5288238A (en) * 1991-04-30 1994-02-22 Itt Industries, Inc. IC chip to PC board connector system
TW498443B (en) * 2001-06-21 2002-08-11 Advanced Semiconductor Eng Singulation method for manufacturing multiple lead-free semiconductor packages
TW200601537A (en) * 2004-06-23 2006-01-01 Advanced Semiconductor Eng Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Also Published As

Publication number Publication date
TW201416684A (en) 2014-05-01

Similar Documents

Publication Publication Date Title
JP2012039090A5 (en)
JP2012209396A5 (en)
WO2011090574A3 (en) Semiconductor package and method
CN106019126B (en) A kind of semiconductor test apparatus and its test method
JP2013247131A5 (en) Semiconductor device
EP2743708A3 (en) Testing device and testing method thereof
WO2015088658A3 (en) Integrated wire bonder and 3d measurement system with defect rejection
JP2015018144A5 (en)
JP2013012470A5 (en) Method for manufacturing light emitting device
TWI716532B (en) Resin-encapsulated semiconductor device
EP2733736A3 (en) Method for electrically connecting wafers using butting contact struture and semiconductor device fabricated through the same
JP2008160163A5 (en)
TW200729429A (en) Semiconductor package structure and fabrication method thereof
WO2016026203A1 (en) Electronic packaging device, and manufacturing method and packaging effect detection method therefor
TWM485346U (en) Optoelectronic semiconductor lamp strip structure
JP2010287737A5 (en)
JP2017511976A5 (en)
TWI456217B (en) Probing method of leadless semiconductor package
TWI552246B (en) Test element group field-effect transistor and ?the testing method thereof
JP2013004984A5 (en)
JP2010040955A5 (en)
JP2007324506A5 (en)
TW201443452A (en) Test assembly
CN205789923U (en) A kind of integrated circuit package structure
CN202816921U (en) SOT89-5L package lead frame