Claims (11)
一種硬碟基板用研磨液組合物，其係含有氧化鋁粒子、二氧化矽粒子以及水者；上述氧化鋁粒子之二次粒子藉由雷射光繞射法所測定的體積中值粒徑為0.1~0.8μm；上述二氧化矽粒子之一次粒子藉由穿透式電子顯微鏡觀察所測定的體積中值粒徑為40~150nm；上述二氧化矽粒子之一次粒子藉由穿透式電子顯微鏡觀察所測定的以個數為基準之粒徑標準偏差為11~35nm。
A polishing liquid composition for a hard disk substrate comprising alumina particles, cerium oxide particles, and water; and a volume median diameter of the secondary particles of the alumina particles measured by a laser diffraction method is 0.1 ~0.8 μm; the volume median diameter of the primary particles of the above cerium oxide particles measured by a transmission electron microscope is 40 to 150 nm; and the primary particles of the above cerium oxide particles are observed by a transmission electron microscope The standard deviation of the particle diameter based on the number of measurements was 11 to 35 nm.
如請求項1之硬碟基板用研磨液組合物，其中氧化鋁粒子含有α-氧化鋁。
The polishing liquid composition for a hard disk substrate according to claim 1, wherein the alumina particles contain α-alumina.
如請求項1之硬碟基板用研磨液組合物，其中二氧化矽粒子為膠體二氧化矽。
The polishing liquid composition for a hard disk substrate according to claim 1, wherein the cerium oxide particles are colloidal cerium oxide.
如請求項1之硬碟基板用研磨液組合物，其中上述二氧化矽粒子含有相對於二氧化矽粒子總量為40體積%以上的粒徑20~120nm之二氧化矽粒子；且其中含有相對於二氧化矽粒子總量為1~40體積%的粒徑20~40nm之二氧化矽粒子、相對於二氧化矽粒子總量為5~90體積%的粒徑60~80nm之二氧化矽粒子、以及相對於二氧化矽粒子總量為0~40體積%的粒徑100~120nm之二氧化矽粒子。
The polishing liquid composition for a hard disk substrate according to claim 1, wherein the cerium oxide particles contain cerium oxide particles having a particle diameter of 20 to 120 nm with respect to a total amount of cerium oxide particles of 40% by volume or more; The cerium oxide particles having a particle diameter of 20 to 40 nm in a total amount of cerium oxide particles of 1 to 40% by volume and the cerium oxide particles having a particle diameter of 60 to 80 nm in an amount of 5 to 90% by volume based on the total amount of cerium oxide particles And cerium oxide particles having a particle diameter of 100 to 120 nm with respect to the total amount of cerium oxide particles of 0 to 40% by volume.
如請求項1之硬碟基板用研磨液組合物，其中上述氧化鋁粒子與上述二氧化矽粒子之重量比(氧化鋁粒子重量/二氧化矽粒子重量)為60/40~10/90之範圍。
The polishing liquid composition for a hard disk substrate according to claim 1, wherein a weight ratio of the alumina particles to the cerium oxide particles (weight of the alumina particles/weight of the cerium oxide particles) is in the range of 60/40 to 10/90. .
如請求項1之硬碟基板用研磨液組合物，其係混合具有不同粒徑分布之2種以上之二氧化矽粒子而獲得者。
The polishing liquid composition for a hard disk substrate according to claim 1, which is obtained by mixing two or more kinds of cerium oxide particles having different particle diameter distributions.
如請求項1之硬碟基板用研磨液組合物，其中氧化鋁粒子進一步含有中間氧化鋁。
The polishing liquid composition for a hard disk substrate according to claim 1, wherein the alumina particles further contain intermediate alumina.
如請求項1至7中任一項之硬碟基板用研磨液組合物，其進一步含有具有以下述式(I)所表示之結構單元、以及來自對於100g之20℃水的溶解度為2g以下的疏水性單體之結構單元的共聚物及/或其鹽：
[上述式(I)中，R1
為氫原子或甲基；R2
為氫原子或碳數1~4之烷基；AO為碳數2~8之氧化烯基；p為0或1，n為AO之總平均加成莫耳數，且為9~250之數；(AO)n中之氧乙烯基所占之比例為80莫耳%以上]。The polishing liquid composition for a hard disk substrate according to any one of claims 1 to 7, which further comprises a structural unit represented by the following formula (I) and a solubility of water of 20 g or less at 100 ° C of 2 g or less a copolymer of a structural unit of a hydrophobic monomer and/or a salt thereof:
[In the above formula (I), R1
Is a hydrogen atom or a methyl group; R2
Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; AO is an oxyalkylene group having 2 to 8 carbon atoms; p is 0 or 1, n is the total average addition molar number of AO, and is 9 to 250 The ratio of oxyethylene groups in (AO)n is 80% by mole or more].
一種硬碟基板之製造方法，其包含使用請求項1至8中任一項之研磨液組合物研磨被研磨基板之步驟，且上述研磨中之研磨負載為10.3~16.7kPa。
A method of producing a hard disk substrate, comprising the step of polishing a substrate to be polished using the polishing composition of any one of claims 1 to 8, wherein the polishing load in the polishing is 10.3 to 16.7 kPa.
如請求項9之硬碟基板之製造方法，其中硬碟基板為垂直磁性記錄方式用硬碟基板。
The method of manufacturing a hard disk substrate according to claim 9, wherein the hard disk substrate is a hard disk substrate for a perpendicular magnetic recording method.
一種研磨方法，其係包含使用請求項1至8中任一項之研磨液組合物研磨被研磨基板之步驟者；上述被研磨基板係用於製造垂直磁性記錄方式用硬碟基板之基板，上述研磨中之研磨負載為10.3~16.7kPa，並且上述研磨步驟為粗研磨步驟。
A polishing method comprising the step of polishing a substrate to be polished using the polishing composition according to any one of claims 1 to 8, wherein the substrate to be polished is used for manufacturing a substrate for a hard disk substrate for a perpendicular magnetic recording method, The grinding load in the grinding is 10.3 to 16.7 kPa, and the above grinding step is a coarse grinding step.