TWI455792B - 可透視靜電吸板 - Google Patents

可透視靜電吸板 Download PDF

Info

Publication number
TWI455792B
TWI455792B TW101109609A TW101109609A TWI455792B TW I455792 B TWI455792 B TW I455792B TW 101109609 A TW101109609 A TW 101109609A TW 101109609 A TW101109609 A TW 101109609A TW I455792 B TWI455792 B TW I455792B
Authority
TW
Taiwan
Prior art keywords
see
plate body
electrical connection
adsorption plate
electrostatic adsorption
Prior art date
Application number
TW101109609A
Other languages
English (en)
Other versions
TW201338909A (zh
Inventor
hong jun Lin
Wen Zhang Su
Original Assignee
Intelligence Develop Engineering Aid Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intelligence Develop Engineering Aid Ltd filed Critical Intelligence Develop Engineering Aid Ltd
Priority to TW101109609A priority Critical patent/TWI455792B/zh
Publication of TW201338909A publication Critical patent/TW201338909A/zh
Application granted granted Critical
Publication of TWI455792B publication Critical patent/TWI455792B/zh

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Claims (3)

  1. 一種可透視靜電吸板，由一可透視板體、一可透視絕緣覆膜層及二電連接埠所構成，其中：該可透視板體的一面上形成二蝕刻電路部，該可透視板體為可透視並絕緣的材質所製成；該電連接埠電性連接各該蝕刻電路部；各該電連接埠電性連接各該蝕刻電路部；以及該可透視絕緣覆膜層覆蓋設置於該可透視板體具有蝕刻電路部的一面上，並使該電連接埠外露。
  2. 如申請專利範圍第1項所述的可透視靜電吸板，其中，該可透視板體為玻璃板。
  3. 如申請專利範圍第1項所述的可透視靜電吸板，其中，該可透視板體為壓克力板。
TW101109609A 2012-03-21 2012-03-21 可透視靜電吸板 TWI455792B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101109609A TWI455792B (zh) 2012-03-21 2012-03-21 可透視靜電吸板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101109609A TWI455792B (zh) 2012-03-21 2012-03-21 可透視靜電吸板

Publications (2)

Publication Number Publication Date
TW201338909A TW201338909A (zh) 2013-10-01
TWI455792B true TWI455792B (zh) 2014-10-11

Family

ID=49770674

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101109609A TWI455792B (zh) 2012-03-21 2012-03-21 可透視靜電吸板

Country Status (1)

Country Link
TW (1) TWI455792B (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW393794B (en) * 1997-12-25 2000-06-11 Rohm Co Ltd Protective case for electric parts and storage battery pack
TW472500B (en) * 1999-08-12 2002-01-11 Ibiden Co Ltd Ceramic substrate, ceramic heater, electrostatic chuck and wafer probe for semiconductor manufacturing and checking device
TW527264B (en) * 2001-06-28 2003-04-11 Lam Res Corp Ceramic electrostatic chuck assembly and method of making
US20050276928A1 (en) * 2003-02-03 2005-12-15 Octec Inc. Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method
TW200717650A (en) * 2005-09-29 2007-05-01 Tokyo Electron Ltd Substrate processing method
TW201205714A (en) * 2010-07-30 2012-02-01 Acrosense Technology Co Ltd Glass carrier for semiconductor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW393794B (en) * 1997-12-25 2000-06-11 Rohm Co Ltd Protective case for electric parts and storage battery pack
TW472500B (en) * 1999-08-12 2002-01-11 Ibiden Co Ltd Ceramic substrate, ceramic heater, electrostatic chuck and wafer probe for semiconductor manufacturing and checking device
US7078655B1 (en) * 1999-08-12 2006-07-18 Ibiden Co., Ltd. Ceramic substrate, ceramic heater, electrostatic chuck and wafer prober for use in semiconductor producing and inspecting devices
TW527264B (en) * 2001-06-28 2003-04-11 Lam Res Corp Ceramic electrostatic chuck assembly and method of making
US20050276928A1 (en) * 2003-02-03 2005-12-15 Octec Inc. Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method
TWI334173B (zh) * 2003-02-03 2010-12-01 Octec Inc
TW200717650A (en) * 2005-09-29 2007-05-01 Tokyo Electron Ltd Substrate processing method
TW201205714A (en) * 2010-07-30 2012-02-01 Acrosense Technology Co Ltd Glass carrier for semiconductor

Also Published As

Publication number Publication date
TW201338909A (zh) 2013-10-01

Similar Documents

Publication Publication Date Title
WO2011096700A3 (en) Touch panel and method of manufacturing the same
JP2013137997A5 (ja) 封止体及び発光装置
BR112013028115A2 (pt) painel com um elemento de conexão elétrica
TWI456262B (zh) 可切換式觸控立體影像裝置
JP2014013404A5 (zh)
JP2013118179A5 (ja) 発光モジュール
JP2015127951A5 (ja) 表示装置
JP2012238610A5 (zh)
JP2012247372A5 (zh)
JP2011086927A5 (ja) 半導体装置
JP2013030476A5 (ja) 発光装置
TW201102702A (en) Capacitive touch panel
WO2011099831A3 (ko) 그래핀을 이용한 유연성 투명 발열체 및 이의 제조 방법
JP2013509247A5 (zh)
JP2013525913A5 (zh)
JP2012118545A5 (zh)
JP2012182120A5 (zh)
JP2013080915A5 (zh)
WO2011118911A3 (ko) 터치패널용 패드 및 이를 이용한 터치패널
TWI456608B (zh) 積層型線圈零件
JP2012216522A5 (ja) 発光装置
JP2015028425A5 (zh)
JP2014045175A5 (zh)
EP2579134A3 (en) Touch panel and manufacturing method thereof
WO2011046389A3 (en) Touch panel and manufacturing method thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees