TWI453573B - Heat dissipating device - Google Patents

Description

Heat sink

The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from a heat source device through fluid transport.

With the rapid development of electronic technology and consumers' increasingly light, thin and portable for consumer electronic products, today's electronic products, such as tablet computers, notebook computers, mobile phones and other portable electronic devices, have been created. All of them have gradually developed towards miniaturization. For users who often move outside, portable electronic products become more portable and greatly enhance the convenience of use.

However, today's portable electronic devices, in addition to pursuing the slimness of the appearance, add various convenience functions, and also increase the computational load of the internal electronic components of the portable electronic device, and because of these portable electronic devices The operation speed of the electronic components inside the device is extremely fast, and the volume of the electronic components is small, and the heat generated per unit area is increased. If the heat energy accumulated on the electronic components is not dissipated in time, the excessive temperature will seriously affect the stability and efficiency of the electronic components during operation, and even result in shortened service life or damage.

In order to solve the heat dissipation problem of the portable electronic device, it is generally practiced to install a heat dissipation fan inside the electronic device to dissipate heat from the electronic component while reducing the ambient temperature in the device. However, in order to maintain the size and size of the portable electronic device, After deducting the necessary circuit wiring and the space occupied by the related electronic components, the free space inside the body is quite limited, and it is difficult to install an additional cooling fan. In addition, in order to cope with the overall heat dissipation efficiency of the portable electronic device, it is necessary to use a larger fan for heat dissipation, otherwise it is difficult to achieve the heat dissipation requirement, and thus the circuit inside the portable electronic device must cooperate with the fan. The change of the original wiring position, the manufacturing cost is increased, and the volume of the portable electronic device is also increased, which does not meet the current demand for light and thin electronic products.

Moreover, the conventional cooling fan introduces a large amount of air during operation, thereby generating a wind cut sound, which causes a fixed frequency noise. If a cooling fan is installed in a portable electronic device of a thin and light type, the noise generated by the fan may be directly transmitted to the outside of the device due to a short distance and an unobstructed factor, thereby causing considerable seriousness. Noise problems, and this noise problem is still one of the problems that technicians in the relevant field are trying to overcome.

In addition to portable electronic devices, general electronic devices are also facing increasing heat dissipation requirements due to the high-order design of internal electronic components. For example, the central processing unit disposed in the electronic device has a large demand for the user and various application software, so that the circuit layout is much more complicated than that at an early stage. Although these central processor integrated circuit chips provide many powerful functions, they also cause huge power consumption due to their complicated circuit design. These consumed electric energy will cause the temperature of the wafer to rise and cause serious troubles in use. Taking the server device as an example, the problem of this temperature rise will be worsened.

In general, in order to maximize the performance of the server device, it is very important to transfer heat quickly to the outside of the system, because when the heat is collected inside the server and cannot be dissipated immediately, the electronic components will not work properly, or even The entire server device is generated Dang. Therefore, in the normal operation of the conventional servo device, in order to improve the heat dissipation capability, a higher wattage fan must be used for heat dissipation. On the one hand, these higher wattage fans can generate larger air volume and improve heat dissipation efficiency, but on the other hand, they are caused by various factors such as high wattage, electromagnetic pole number, rotation speed and number of blades. The problem of noise.

In addition to heat source devices such as electronic devices, other heat source devices, such as lighting devices, also face the same heat dissipation problem. Among various lighting devices, LEDs can greatly reduce the amount of CO2 emissions generated during power generation, greatly contribute to the prevention of greenhouse effect and the greening of the global environment, and are more in line with the new generation of environmental protection and energy conservation. Demand, thus gradually replacing the lighting industry of traditional incandescent lamps and fluorescent lamps. However, in order to increase the illumination of the LED illuminator, a wider and higher illumination, such as a traffic light, a street light, a lamp, etc., a plurality of light-emitting diodes are arranged in series or in parallel to improve the light-emitting diode. The area of the body, and each of the light-emitting diodes is energized by the semiconductor material excited by the wafer to emit light. Therefore, when a conventional light-emitting diode lighting device is required to obtain high brightness, the current consumed by the light is increased, and of course, the generated heat energy is also increased, which causes the operating temperature of the light-emitting diode lighting device to rise. . If the operating temperature of the LED illumination device is too high, problems such as reduced luminance or reduced lifetime may occur.

In view of this, how to develop a heat dissipation device with good heat dissipation performance, small volume, low power consumption, and suitable for a heat source device such as a portable electronic device, an electronic device, or a lighting device, to solve the lack of the prior art, There is an urgent need for solving problems in the related art.

The purpose of this case is to provide a heat sink that is mainly loaded with heat through a fluid source. The heat dissipation system of the conventional heat source device has a large volume, and requires a large amount of electric energy, noise, and the like.

In order to achieve the above object, a broader aspect of the present invention provides a heat dissipating device comprising: a fluid; a fluid transport device for propelling the fluid; and a circulation conduit connected to the fluid transport device Passing, and at least a portion of the circulation line itself is in contact with a heat generating device to conduct thermal energy to the at least a portion of the circulation line such that the fluid is transferred by the fluid delivery device to the remainder of the circulation line. The circulation line flows to carry out a conveying cycle, thereby dissipating heat to the heat source device.

In order to achieve the above object, another broad aspect of the present invention provides a heat dissipating device comprising: a fluid; a fluid transport device for propelling the fluid; and a heat sink device for contacting the heat generating device. The heat energy generated by the heat source device is absorbed; and a circulation line is connected to the fluid delivery device, and the circulation line is in contact with the heat absorption device, so that the heat energy absorbed by the heat absorption device is transmitted to the circulation tube. In the road, the fluid is transferred by the fluid delivery device to the rest of the circulation line, and flows through the circulation line to perform a heat transfer process.

3‧‧‧heating device

1‧‧‧Fluid conveyor

2‧‧‧Circulation line

4‧‧‧Generating heat source device

101‧‧‧ Entrance Channel

102‧‧‧Export channel

10‧‧‧ valve body seat

10a, 10b‧‧‧ openings

10c‧‧‧ liquid storage room

10d‧‧‧ Groove

10e‧‧‧Seal ring

11‧‧‧ valve body film

11a‧‧‧Inlet valve structure

11b‧‧‧Export valve structure

12‧‧‧ valve body cover

12a‧‧‧ inlet valve passage

12b‧‧‧Export valve passage

12c‧‧‧pressure chamber

13‧‧‧Actuating device

13a‧‧‧Vibration film

13b‧‧‧Actuator

14‧‧‧ Cover

15‧‧‧Upper cover

16‧‧‧ Lower cover

5, 6‧‧‧heat absorption device

51‧‧‧Heat-absorbing parts

52‧‧‧floor

53‧‧‧ channel

60‧‧‧ body

61‧‧‧Heat fins

62‧‧‧ entrance

63‧‧‧Export

The first figure is a schematic structural view of a heat dissipating device according to a first preferred embodiment of the present invention.

Second Figure A: It is a schematic diagram of the front exploded structure of the fluid delivery device shown in the first figure.

Second Figure B: It is a schematic diagram of the reverse side decomposition structure of the fluid delivery device shown in Figure 2A.

Third Figure A: The front part of the fluid delivery device of the second preferred embodiment of the present invention Solution structure diagram.

Third Figure B: It is a schematic diagram of the reverse side decomposition structure of the fluid delivery device shown in Figure 3A.

Figure 4: It is a schematic view of the top view of the fluid delivery device shown in Figure A.

Figure 5 is a schematic view showing the structure of the heat absorbing device of the fluid transporting device of the third preferred embodiment of the present invention.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and drawings are intended to be illustrative and not limiting.

Please refer to the first figure, which is a schematic structural view of a heat dissipating device according to a first preferred embodiment of the present invention. As shown, the heat sink 3 is mainly composed of a fluid transport device 1 and a circulation line 2, wherein the fluid transport device 1 has an actuating device 13 (as shown in Figure 2A), and the fluid transport device 1 is The circulation line 2 is in communication, and the circulation line 2 is in contact with the heat generating source unit 4. In the present embodiment, both ends of the circulation line 2 are connected to the inlet passage 101 and the outlet passage 102 of the fluid delivery device 1, thereby forming a closure of the delivery device 1 when the circulation line 2 is formed with the fluid as a liquid. The circuit, when the fluid is in the form of a gas, forms an open circuit. In this way, when the actuating device 13 of the fluid transport device 1 is actuated, a fluid can be pushed from the outlet channel 102 of the fluid transport device 1 into the circulation line 2, and the flow of the fluid causes the heat to be conducted to At least a part of the circulation line 2, the heat exchange of the heat source device 4 is performed, and the heat energy generated by the heat source device 4 is generated and transported along with the flow of the fluid. So that the fluid is transferred by the fluid delivery device 1 to the rest of the circulation line 2, and finally the fluid carrying the heat is transported from the inlet channel 101 to the fluid delivery device 1, thereby effecting the generation of the heat source device 4. Cooling.

Taking this embodiment as an example, at least a portion of the circulation line 2 is in contact with the heat generating source device 4, thereby performing heat exchange with the heat generating source device 4. In other embodiments, the circulation line 2 may also be disposed inside the heat generating device 4, or even in a structure integrally formed with the heat generating device 4, and is not limited thereto. In addition, the circulation line 2 can also be provided with heat dissipation fins or assembled with another heat dissipation fin structure to increase heat dissipation performance. Regarding the various heat dissipation type designs of the circulation line 2, the changes can be made according to the actual application situation, and are not limited thereto.

Please refer to FIG. 2A, which is a front exploded view of the fluid delivery device shown in the first figure. As shown, the fluid transport device 1 is sequentially from top to bottom by the upper cover 15, the cover 14, the actuating device 13, the valve body cover 12, the valve body film 11, the valve body 10, and the lower cover 16. composition. The assembly method is such that the valve body film 11 is disposed between the valve body seat 10 and the valve body cover body 12, and the valve body film 11 and the valve body seat 10 and the valve body cover body 12 are stacked on each other, and the valve body cover is The corresponding position on the body 12 is further provided with an actuating device 13. The actuating device 13 is assembled by a vibrating membrane 13a and an actuator 13b for driving the fluid transporting device 1, and in the unactuated state, the vibrating membrane 131 is separated from the valve body cover 12 to The definition forms the pressure chamber 12c.

The valve body seat 10 has an inlet passage 101 and an outlet passage 102 through which fluid is delivered to the opening 10a of the valve body seat 10 and thereafter to the valve body film 11. When the fluid is transported downward from the valve body membrane 11, it can flow through the opening 10b and be discharged by the outlet passage 102 of the valve body seat 10.

Please also refer to the second drawing A and B. The valve body film 11 is mainly a sheet structure having substantially the same thickness, and has a plurality of hollow valve switches thereon, including a first valve switch and a second valve switch. In the example, the first valve opening relationship is the inlet valve structure 11a and the second valve opening relationship is the outlet valve structure 11b. The valve body cover 12 has an inlet valve passage 12a and an outlet valve passage 12b, which respectively correspond to the inlet valve structure 11a and the outlet valve structure 11b. And, on one surface of the valve body cover 12, there is a pressure chamber 12c provided corresponding to the actuator 13b of the actuating device 13, and the pressure chamber 12c is in communication with the inlet valve passage 12a and the outlet valve passage 12b.

In addition, the fluid conveying device 1 further has a plurality of groove structures for the sealing ring (not shown) to be disposed thereon, and the sealing ring disposed in the groove enables the two adjacent structures to be closely attached. For example, between the valve body seat 10 and the lower cover body 16, that is, a close fit between the groove structure 10d around the liquid storage chamber 10c and the seal ring 10e, to prevent leakage of fluid. Similarly, a similar structure is provided between the valve body cover 12 and the valve body film 11, or between the valve body cover 12 and the actuating device 13, so that the front structure can be formed by the groove structure. It is assembled with the sealing ring to achieve a close fit and prevent fluid leakage.

In the present embodiment, when the actuator 13b of the fluid delivery device 1 is driven by a voltage, the actuation device 13 will be deformed upwardly, so that the volume of the pressure chamber 12c is changed, thereby generating a pressure difference to push the fluid, by the inlet. The passage 101 flows through the inlet valve structure 11a, enters the pressure chamber 12c, and flows from the outlet valve structure 11b through the opening 10b to the outlet flow passage 102, and then, as shown in the first figure, the fluid flows from the outlet flow passage 102 to the circulation pipe. In the road 2, and flowing along the flow path of the circulation line 2, and heat exchange with the heat source device 4, and finally flowing back to the fluid delivery device 1 through the inlet channel 101, to achieve the transmission of the fluid to the heat source device 4 For the purpose of heat dissipation.

Since the fluid transport device 1 has the advantages of small volume, good heat dissipation efficiency, and low noise, it is suitable for use in a heat source device 4 that is light, thin, and heat-producing. For example, the heat generating device 4 can be, but is not limited to, a light emitting diode (LED) lighting device, such as a traffic light, a street light, or a vehicle light. In other embodiments, the heat generating device 4 can be, but is not limited to, an electronic device, such as a server, a tablet computer, a notebook computer, or other electronic device that generates a heat source. In other embodiments, the heat generating device 4 can be a handheld communication device, and is not limited thereto. It can be seen that the heat sink 3 has a wide range of applications, and is not limited to the heat source device 4, and the heat source device 4 can be used in the case of a small heat source, high heat generation, and heat generating fan. 4 heat dissipation device 3 for heat dissipation.

Please refer to FIG. 3A and FIG. 3B respectively, which are schematic diagrams showing the front exploded structure and the reverse exploded structure of the fluid transport device of the second preferred embodiment of the present invention. In the present embodiment, the structure and assembly method of the fluid transport device 1 of the heat dissipating device 3 are similar to those of the previous embodiment, and are mainly composed of the upper cover body 15, the cover body 14, the actuating device 13, the valve body cover body 12, and the valve body. The film 11 and the valve body 10 are composed, so the details are not described herein. However, in the embodiment, the heat sink 3 further includes the heat sink 5, and as shown in FIG. A, the valve body 10 can absorb heat. The devices 5 are assembled to each other such that the heat absorbing member 51 of the heat absorbing device 5 is disposed in the liquid storage chamber 10c so that fluid flows between the heat absorbing members 51 when flowing from the opening 10b of the valve body seat 10 into the liquid storage chamber 10c. The flow passage 53 (as shown in the fourth diagram) is again discharged from the outlet passage 102 on the valve body seat 10. The assembly of the fluid transport device 1 of the present embodiment is similar to that of the previous embodiment, and the structure of the cover 14, the actuating device 13, the valve body cover 12, and the valve body film 11 are sequentially stacked on the valve body. In the seat 10, thereafter, the heat absorbing device 5 is correspondingly disposed under the valve body seat 10 such that the bottom plate 52 of the heat absorbing device 5 closes the liquid storage chamber 10c on the bottom surface of the valve body seat 10 while being on the valve body seat 10. An upper cover 16 is further provided to complete the assembly of the fluid delivery device 1 and the heat absorption device 5, and at the same time, a closed fluid circuit device can be formed.

Please refer to the fourth figure, which is a top view of the fluid delivery device shown in FIG. As shown in the fourth figure, the inlet passage 101 and the outlet passage 102 of the present embodiment are disposed on the same side of the valve body seat 10, but are not limited thereto. And the inlet passage 101 is in communication with the inlet valve structure 11a. When the actuation device 13 is driven by the voltage to cause bending deformation, the volume of the pressure chamber 12c is caused to change, thereby generating a pressure difference to push the fluid, so that the fluid passes through the inlet passage 101. Flowing through the inlet valve structure 11a, entering the pressure chamber 12c, flowing from the outlet valve structure 11b into the liquid storage chamber 10c, flowing along the flow passage 53 of the heat absorption device 5, and then discharged through the outlet passage 102, thereby reaching The purpose of heat dissipation of the fluid.

The heat absorbing device 5 is generally a plate-like structure, and a plurality of heat dissipating structures 51 are disposed on the heat absorbing member 51. In this embodiment, the heat absorbing member 51 can be, but is not limited to, an upright fin structure, and each A heat absorbing member 51 is arranged in parallel with each other to define a plurality of flow passages 52, whereby the fluid can flow in the plurality of flow passages 52, and is in contact with the adjacent heat absorbing members 51 during the flow. . In some embodiments, the heat absorbing member 51 is made of a heat absorbing material, such as a metal material, but not limited thereto, so that the fluid can transfer heat to the contact heat absorbing process during contact with the heat absorbing member 51. On the part 51, the crucible is cooled by water.

In other embodiments, the heat absorbing member 51 may be, but is not limited to, a micro-cylinder structure, but is not limited thereto. In addition, in some embodiments, the structure of the valve body 10, the valve body 12, and the like of the fluid delivery device 1 may be formed of a heat-absorbing material, such as a metal material, but not limited thereto. The heat exchange can be performed during the transportation between the valve body seat 10 and the valve body seat 12, and the heat dissipation can be further promoted. .

Please refer to FIG. 5 , which is a schematic structural view of a heat sink of a heat dissipating device according to a third preferred embodiment of the present invention. In the present embodiment, the heat absorbing device 6 has a body 60, an inlet 62 and an outlet 63, wherein the inlet 62 and the outlet 63 are connected to the circulation line, and the heat absorbing device 6 is connected to the fluid delivery device 1 to form a The helium fluid circuit, and a portion of the body 60 of the heat sink 6, is in contact with the heat generating device to exchange heat with the heat generating device, but is not limited thereto. In some embodiments, in order to improve the heat dissipation efficiency of the heat sink, a plurality of heat dissipation fins 61 may be added to the body 60 of the heat absorption device 6 to promote heat dissipation, or may be combined with a device having heat dissipation fins 61. Connect to increase heat dissipation efficiency. As for the various heat dissipation type design of the heat absorbing device 6, the system can be changed according to the actual application situation, and is not limited thereto.

In summary, the heat dissipating device of the present invention is mainly composed of a fluid conveying device and a circulation pipeline, and is actuated by the actuating device of the fluid conveying device to push the conveying fluid to flow in the circulation pipeline, and is connected with the circulation pipeline. The thermal energy generated by the contact device and generated by the heat source device is transported and circulated according to the flow of the fluid, thereby dissipating heat to the heat generating device. In addition, heat exchange can be performed on the heat generating device through an additional heat absorbing device, and the heat absorbing device passes through the vertical fin structure or the heat absorbing member of the micro cylinder to flow the fluid in the flow path between the heat absorbing members. Heat is transferred through metal conduction between the heat absorbing member and convection between the fluids. In addition to the functions of heat absorption and heat dissipation, the heat sink of the present invention has the advantages of thin thickness, low power consumption and wide application.

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

1‧‧‧Fluid conveyor

101‧‧‧ Entrance Channel

102‧‧‧Export channel

10‧‧‧ valve body seat

10a, 10b‧‧‧ openings

11‧‧‧ valve body film

11a‧‧‧Inlet valve structure

11b‧‧‧Export valve structure

12‧‧‧ valve body cover

12a‧‧‧ inlet valve passage

12b‧‧‧Export valve passage

12c‧‧‧pressure chamber

13‧‧‧Actuating device

13a‧‧‧Vibration film

13b‧‧‧Actuator

14‧‧‧ Cover

15‧‧‧Upper cover

16‧‧‧ Lower cover

Claims (16)

A heat dissipating device comprising: a fluid; a fluid conveying device comprising an upper cover body, a cover body, a valve body cover body, a valve body film, a valve body seat and a lower cover body stacked on each other, wherein a corresponding position on the valve body cover having an actuating device for driving the fluid; and a circulation line communicating with the fluid conveying device, and at least a portion of the circulating line itself and a heat generating device Contacting, causing thermal energy to be conducted to at least a portion of the circulation line such that the fluid is transferred by the fluid delivery device to the remainder of the circulation line, flowing in the circulation line for cyclic transportation, thereby dissipating heat to the heat generating device . The heat sink device of claim 1, wherein the heat source device is a light-emitting diode street light or a light-emitting diode vehicle light. The heat sink device of claim 1, wherein the heat generating device is a server, a tablet computer, a notebook computer or a handheld communication device. The heat dissipating device of claim 1, wherein the fluid conveying device has an inlet and an outlet, and the two ends of the circulating pipe are respectively connected to the inlet and the outlet of the fluid conveying device. The heat dissipation device of claim 1, wherein the circulation pipeline further has a plurality of heat dissipation fins. The heat dissipating device of claim 1, wherein the circulating pipe is further connected to a heat dissipating fin. The heat sink of claim 1, wherein the circulation line is disposed in the heat source device. The heat sink of claim 1, wherein the circulation line is integrally formed with the heat source device. A heat dissipating device comprising: a fluid; a fluid conveying device comprising an upper cover body, a cover body, a valve body cover body, a valve body film, a valve body seat and a lower cover body stacked on each other, wherein a corresponding position on the valve body cover body has an actuating device for driving the fluid; a heat absorbing device is in contact with a heat generating device to absorb the heat energy generated by the heat source device; and a circulation line And communicating with the fluid transport device and the heat absorbing device, wherein the heat absorbed by the heat absorbing device is conducted to the circulation pipeline by the fluid, and the fluid flows in the circulation pipeline for cyclic transportation, thereby generating the The heat source device dissipates heat. The heat sink device of claim 9, wherein the heat generating device is a light emitting diode street light or a light emitting diode vehicle light. The heat sink device of claim 9, wherein the heat generating device can be a server, a tablet computer, a notebook computer or a handheld communication device. The heat dissipating device of claim 9, wherein the fluid conveying device has an inlet and an outlet, and the two ends of the circulating pipe are respectively connected to the inlet and the outlet of the fluid conveying device. The heat dissipation device of claim 9, wherein the circulation pipeline further has a plurality of heat dissipation fins. The heat dissipating device of claim 9, wherein the circulating pipe is further connected to a heat dissipating fin. The heat sink of claim 9, wherein the heat sink further comprises a plurality of heat sink fins. The heat sink of claim 9, wherein the heat sink is further connected to a heat sink fin.