TWI453235B - Underlayer film for forming image - Google Patents

Underlayer film for forming image Download PDF

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TWI453235B
TWI453235B TW098135951A TW98135951A TWI453235B TW I453235 B TWI453235 B TW I453235B TW 098135951 A TW098135951 A TW 098135951A TW 98135951 A TW98135951 A TW 98135951A TW I453235 B TWI453235 B TW I453235B
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carbon atoms
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polyimine
film
coo
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TW201031687A (en
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Shinichi Maeda
Go Ono
Satoshi Minami
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Nissan Chemical Ind Ltd
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Description

形成畫像用下層膜Underlayer film

本發明係關於形成畫像用下層膜,進而關於使用該形成畫像之下層膜製作之有機電晶體。The present invention relates to an underlayer film for forming an image, and further relates to an organic transistor produced by using a film formed under the image.

目前,電子裝置之製造步驟中,對於形成電極或機能性薄膜之圖型主要使用遮罩蒸鍍法或利用光微影蝕刻之蝕刻方法。該等以往之方法受被指出有基板之大型化困難且步驟繁複等之問題點。At present, in the manufacturing steps of the electronic device, a mask evaporation method or an etching method using photolithography is mainly used for forming a pattern of an electrode or a functional film. These conventional methods have been pointed out to be problematic in that the size of the substrate is large and the steps are complicated.

近年來,對於該等以往之方法,已提出利用液體潤濕性之差異之分開塗佈技術應用於機能性薄膜之圖型化中。此係於板表面上製作由液體易潤濕之領域與液體不易潤濕之領域所組成之圖型化層,接著,將形成機能性薄膜材料之溶液塗佈於該圖型化層之上,並經乾燥,僅在液體易潤濕之領域上形成機能性薄膜,而製作有機EL(電致發光)元件或有機FET(電場效型電晶體)元件等之電子裝置之方法。In recent years, for such conventional methods, a separate coating technique utilizing the difference in liquid wettability has been proposed for use in the patterning of functional films. This is to form a patterned layer on the surface of the board which is composed of a field in which the liquid is easily wetted and which is not easily wetted by the liquid. Then, a solution forming the functional film material is applied onto the patterned layer. A method of producing an electronic device such as an organic EL (electroluminescence) device or an organic FET (electric field effect transistor) device by drying a functional film only in the field where the liquid is easily wetted.

該等機能性薄膜用之圖型化層已知有透過遮罩於由二氧化鈦與有機聚矽氧烷所構成之含光觸媒層上照射紫外線而成者(例如參照專利文獻1)、於由染料等之具有光吸收部位之化合物與含氟聚合物所構成之層上照射雷射或透過遮罩照射紫外光而成者(例如參照專利文獻2)等。另外,亦提出透過遮罩蒸鍍氟系塗覆劑而形成上述圖型化層之方法(例如參照專利文獻3)。It is known that the patterned layer for the functional film is irradiated with ultraviolet light through a photocatalyst layer composed of titanium oxide and an organic polysiloxane (for example, refer to Patent Document 1), for dyes, and the like. The compound having the light absorbing portion and the fluoropolymer are irradiated with a laser or transmitted through a mask to irradiate ultraviolet light (see, for example, Patent Document 2). Further, a method of forming the above-described patterned layer by vapor deposition of a fluorine-based coating agent is also proposed (for example, see Patent Document 3).

上述專利文獻等截至目前為止提出之圖型化層僅管達成機能性薄膜之圖型化之角色,但在元件中仍殘存。因此,該圖型化層對於隨後步驟之耐久性及即使處於電子裝置中亦不會對其特性造成不良影響之信賴性成為必要。圖型化層之該等必要特性係隨著所製作之圖型或圖型化層之使用部位而不同,其中,電極之圖型化層之電絕緣性為重要之必要特性。The patterning layer proposed so far in the above-mentioned patent documents and the like only achieves the role of patterning of the functional film, but remains in the element. Therefore, the patterned layer is necessary for the durability of the subsequent steps and the reliability of the electronic device without adversely affecting its characteristics. These necessary characteristics of the patterned layer differ depending on the pattern used or the location of the patterned layer, wherein the electrical insulation of the patterned layer of the electrode is an important characteristic.

又,迄今為止提出之方法僅將重點放在圖型化層之特性上。因此,例如將有機FET元件之源極電極及汲極電極圖型化時,必須在圖型化層之下方另外準備閘極絕緣膜。Moreover, the method proposed so far only focuses on the characteristics of the graphical layer. Therefore, for example, when the source electrode and the drain electrode of the organic FET device are patterned, it is necessary to separately prepare a gate insulating film under the patterned layer.

另一方面,聚醯亞胺之耐熱性或機械強度、電絕緣性、耐藥品性等優異而已使用於各式各樣之電子裝置中。使用聚醯亞胺作為圖型化層之例已揭示有使用具有脂環構造之四羧酸酐者(例如參照專利文獻4)。然而,於該等之例由於紫外線之照射量極大,故不得不進行長時間的曝光處理。On the other hand, polyimine is excellent in heat resistance, mechanical strength, electrical insulation, chemical resistance, and the like, and has been used in various electronic devices. The use of polyimine as a patterning layer has been disclosed using a tetracarboxylic anhydride having an alicyclic structure (for example, refer to Patent Document 4). However, in such cases, since the amount of irradiation of ultraviolet rays is extremely large, it is necessary to perform long-time exposure processing.

專利文獻1:特開2000-223270號公報Patent Document 1: JP-A-2000-223270

專利文獻2:特開2004-146478號公報Patent Document 2: JP-A-2004-146478

專利文獻3:特開2004-273851號公報Patent Document 3: JP-A-2004-273851

專利文獻4:特開2006-185898號公報Patent Document 4: JP-A-2006-185898

本發明係有鑑於該情況而完成者,本發明係提供一種即使以少量的紫外線照射量,仍可容易地改變所形成之形成畫像用下層膜之膜表面的親疏水性之形成畫像用下層膜。The present invention has been made in view of the above circumstances, and the present invention provides an underlayer film for forming an image which can easily change the hydrophilicity of the formed film surface of the underlayer film for image formation even with a small amount of ultraviolet irradiation.

[用以解決課題之手段][Means to solve the problem]

本發明者為達成上述目的而重複積極檢討之結果,發現藉由於聚醯亞胺前驅物或由該聚醯亞胺前驅物獲得之聚醯亞胺之側鏈中含有硫醇酯構造,於由該聚醯亞胺前驅物及聚醯亞胺獲得之硬化膜之表面上,可以少量之曝光量使水接觸角變大,因而完成本發明。As a result of repeating the positive review for achieving the above object, the present inventors have found that the thiol ester structure is contained in the side chain of the polyimine imide obtained from the polyimide or the polyimide precursor. On the surface of the cured film obtained from the polyimide precursor and the polyimide, the contact angle of the water can be made small by a small amount of exposure, and thus the present invention has been completed.

亦即,本發明之第一觀點係關於一種形成畫像用下層膜,其特徵為含有以下述式(1)表示之重複構造之聚醯亞胺前驅物或使該聚醯亞胺前驅物脫水閉環所得之聚醯亞胺:That is, the first aspect of the present invention relates to an underlayer film for forming an image characterized by containing a polyimine precursor having a repetitive structure represented by the following formula (1) or dehydrating the polyimine precursor. The resulting polyimine:

(式中,A表示4價有機基,B表示以下述式(2)或(3)表示之2價構造,R1 、R2 分別獨立表示氫原子或1價有機基,n表示自然數);(wherein A represents a tetravalent organic group, B represents a divalent structure represented by the following formula (2) or (3), and R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, and n represents a natural number) ;

(式中,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示可經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。(wherein, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, - CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which may be substituted by a fluorine atom, and R each independently represents a fluorine atom, an alkoxy group having 1 to 3 carbon atoms or An alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3.

本發明之第二觀點係關於一種形成畫像用下層膜,其特徵為包含使含有以下述式(6)表示之四羧酸二酐之四羧酸二酐成分與含有以式(7)表示之二胺之二胺成分反應所得之聚醯亞胺前驅物,或使該聚醯亞胺前驅物脫水閉環所得之聚醯亞胺:The second aspect of the present invention relates to an underlayer film for forming an image, which comprises a tetracarboxylic dianhydride component containing a tetracarboxylic dianhydride represented by the following formula (6) and containing the formula (7). The polyimine precursor obtained by reacting the diamine component of the diamine, or the polyimine obtained by dehydrating and ring-closing the polyimine precursor:

HH 22 N-B-NHN-B-NH 22  (7)(7)

[式中,A表示4價有機基,B表示以式(2)或式(3)表示之2價構造:Wherein A represents a tetravalent organic group, and B represents a divalent structure represented by formula (2) or formula (3):

(式中,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示可經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)]。(wherein, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, - CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which may be substituted by a fluorine atom, and R each independently represents a fluorine atom, an alkoxy group having 1 to 3 carbon atoms or An alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3)].

第三觀點係關於第一或第二觀點所述之形成畫像用下層膜,其中式(2)或式(3)之Z表示任意氫原子經氟原子取代之碳原子數3至26之脂肪族烴基。The third aspect relates to the underlayer film for forming an image according to the first or second aspect, wherein Z of the formula (2) or the formula (3) represents an aliphatic group having 3 to 26 carbon atoms substituted by a fluorine atom of any hydrogen atom. Hydrocarbyl group.

第四觀點係關於第一觀點至第三觀點所述之形成畫像用下層膜,其中A表示具有脂肪族環或僅由脂肪族所構成之4價有機基。The fourth aspect relates to an underlayer film for forming an image described in the first to third aspects, wherein A represents a tetravalent organic group having an aliphatic ring or only an aliphatic group.

第五觀點係關於第一觀點至第四觀點任一項中所述之形成畫像用下層膜,其中B表示以式(2)表示之2價構造。The fifth aspect relates to the underlayer film for forming an image described in any one of the first to fourth aspects, wherein B represents a divalent structure represented by the formula (2).

第六觀點係關於第一觀點至第五觀點中任一項所述之形成畫像用下層膜,其中X及Y表示單鍵。The sixth aspect is the lower layer film for forming an image according to any one of the first to fifth aspects, wherein X and Y represent a single bond.

第七觀點係關於一種有機電晶體,其特徵為含有第一觀點至第六觀點中任一項所述之形成畫像下層膜。The seventh aspect relates to an organic transistor characterized by comprising the underlayer film formed as described in any one of the first to sixth aspects.

第八觀點係關於一種以下述式(14)或下述式(15)表示之二胺化合物,The eighth aspect relates to a diamine compound represented by the following formula (14) or the following formula (15),

(式中,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示任意的氫原子經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。(wherein, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, - CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms substituted by a fluorine atom, and R each independently represents a fluorine atom and an alkyl group having 1 to 3 carbon atoms. An oxy group or an alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3.

第九觀點係關於一種聚醯亞胺,其含有以下述式(1)表示之重複單位之聚醯亞胺前驅物或使該聚醯亞胺前驅物脫水閉環所得,The ninth aspect relates to a polyimine which contains a polyimine precursor which is a repeating unit represented by the following formula (1) or which is obtained by dehydrating and ring-closing the polyimine precursor.

(式中,A表示4價有機基,B表示以下述式(2a)或(3a)表示之2價構造,R1 、R2 分別獨立表示氫原子或1價有機基,n表示自然數);(wherein A represents a tetravalent organic group, B represents a divalent structure represented by the following formula (2a) or (3a), and R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, and n represents a natural number) ;

(式中,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示任意的氫原子經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。(wherein, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, - CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms substituted by a fluorine atom, and R each independently represents a fluorine atom and an alkyl group having 1 to 3 carbon atoms. An oxy group or an alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3.

第十觀點係關於一種形成畫像下層膜塗佈液,其特徵為包含使含有以下述式(6)表示之四羧酸二酐之四羧酸二酐成分與含有以式(7)表示之二胺之二胺成分反應所得之聚醯亞胺前驅物或使該聚醯亞胺前驅物脫水閉環所得之聚醯亞胺:The tenth aspect relates to a method for forming an image forming film of a lower layer, comprising a tetracarboxylic dianhydride component containing a tetracarboxylic dianhydride represented by the following formula (6) and containing the formula (7). The polyimine precursor obtained by reacting the amine diamine component or the polyimine obtained by dehydrating and ring-closing the polyimine precursor:

HH 22 N-B-NHN-B-NH 22  (7)(7)

(式中,A表示4價有機基,B表示以式(2)或式(3)表示之2價構造:(wherein A represents a tetravalent organic group, and B represents a divalent structure represented by formula (2) or formula (3):

R1 、R2 分別獨立表示氫原子或1價有機基,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示可經氟原子取代之碳原子數3至26之脂肪族烴基,R獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-. , -CONH-, -CH 2 O-, -CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which may be substituted by a fluorine atom, and R independently represents a fluorine atom, An alkoxy group having 1 to 3 carbon atoms or an alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3.

第十一觀點係關於第十觀點所述之形成畫像用下層膜塗佈液,其中式(2)或式(3)之Z表示任意氫原子經氟原子取代之碳原子數3至26之脂肪族烴基。The eleventh aspect is the lower layer film coating liquid for forming an image according to the tenth aspect, wherein the Z of the formula (2) or the formula (3) represents a fat having 3 to 26 carbon atoms in which any hydrogen atom is replaced by a fluorine atom. A hydrocarbon group.

第十二觀點係關於第十觀點或第十一觀點所述之形成畫像下層膜塗佈液,其中進一步含有醯亞胺化率為80%以上之可溶性聚醯亞胺。The twelfth aspect is the image forming underlayer film coating liquid according to the tenth aspect or the eleventh aspect, which further comprises a soluble polyimine having a ruthenium iodide ratio of 80% or more.

第十三觀點係關於一種形成畫像之下層膜,其特徵為使第十觀點是第十二觀點所述之形成畫像下層膜塗佈液燒成而得。The thirteenth aspect relates to a layer film for forming an image, which is characterized in that the tenth aspect is the formation of the image forming underlayer film coating liquid described in the twelfth aspect.

第十四觀點係關於一種有機電晶體,其特徵為具有使第十觀點至第十三觀點所述之形成畫像下層膜塗佈液燒成而得之膜。The fourteenth aspect relates to an organic transistor characterized by having a film obtained by firing the formed underlayer film coating liquid described in the tenth to thirteenth aspects.

[發明效果][Effect of the invention]

本發明之形成畫像用下層膜為可以少量之紫外線照射量,將膜之表面由疏水性改變成親水性,據此,可利用該特性形成電極等之機能性材料等之畫像。因此,可大幅縮短電子裝置製造中之步驟時間,成為就生產性而言相當有效之材料。In the lower layer film for forming an image of the present invention, the surface of the film can be changed from hydrophobic to hydrophilic by a small amount of ultraviolet irradiation, and accordingly, an image of a functional material such as an electrode can be formed by using the property. Therefore, the step time in the manufacture of the electronic device can be greatly shortened, and it becomes a material which is quite effective in terms of productivity.

本發明係關於含有由側鏈上具有硫醇酯鍵之聚醯亞胺前驅物或該聚醯亞胺前驅物獲得之聚醯亞胺的新穎形成畫像之下層膜。進而,本發明係關於使用前述形成畫像之膜之有機電晶體。The present invention relates to a novel formation underlayer film comprising a polyimine imide obtained from a polythioimine precursor having a thiol ester bond in a side chain or the polyimine precursor. Further, the present invention relates to an organic transistor using the above-described film forming an image.

[聚醯亞胺前驅物]本發明為一種形成畫像用下層膜,其特徵為含有以下述式(1)表示之重複構造之聚醯亞胺前驅物或使該聚醯亞胺前驅物脫水閉環所得之聚醯亞胺:[Polyimine precursor] The present invention is an underlayer film for forming an image, which is characterized in that it contains a polyimine precursor having a repetitive structure represented by the following formula (1) or dehydration of the polyimine precursor. The resulting polyimine:

(式中,A表示4價有機基,B表示以下述式(2)或(3)表示之2價構造,R1 、R2 分別獨立表示氫原子或1價有機基,n表示自然數)。(wherein A represents a tetravalent organic group, B represents a divalent structure represented by the following formula (2) or (3), and R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, and n represents a natural number) .

上述式(1)中,R1 、R2 分別表示氫原子或1價有機基,1價有機基之具體例列舉為例如碳原子數1至4之烷基。In the above formula (1), R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, and specific examples of the monovalent organic group are, for example, an alkyl group having 1 to 4 carbon atoms.

碳原子數1至4之烷基可列舉為甲基、乙基、丙基、異丙基、丁基、異丁基、第三丁基。The alkyl group having 1 to 4 carbon atoms may, for example, be a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group or a tert-butyl group.

其中,R1 及R2 較好為氫原子。Among them, R 1 and R 2 are preferably a hydrogen atom.

上述式(1)中,以A表示之有機基之構造只要是4價有機基則無特別限制。又,聚醯亞胺前驅物亦可具有一種或複數種以式(1)表示之構造。因此,聚醯亞胺前驅物中,以A表示之有機基之構造可為一種,亦可混合複數種。其中A較好為具有脂肪族環或僅由脂肪族所構成之4價有機基。更好為具有脂肪族環之4價有機基。In the above formula (1), the structure of the organic group represented by A is not particularly limited as long as it is a tetravalent organic group. Further, the polyimine precursor may have one or a plurality of structures represented by the formula (1). Therefore, in the polyimine precursor, the structure of the organic group represented by A may be one type, or a plurality of kinds may be mixed. Wherein A is preferably a tetravalent organic group having an aliphatic ring or only an aliphatic group. More preferably, it is a tetravalent organic group having an aliphatic ring.

以A表示之有機基之較佳具體例可列舉為下述式A-1至A-46之有機基。Preferred specific examples of the organic group represented by A are exemplified by the organic groups of the following formulae A-1 to A-46.

上述式A-1至A-46作為形成畫像用下層膜時,可依據所要求之特性適當選擇。When the above formulae A-1 to A-46 are used as the underlayer film for forming an image, they can be appropriately selected depending on the desired characteristics.

例如,上述式A-1至A-46中,作為提高曝光感度(本說明書中,所謂曝光感度表示每曝光量(紫外線照射量)之自疏水性變換成親水性之程度)之4價有機基列舉為式A-1至A-25之具有脂肪族環或僅由脂肪族所構成之4價有機基,效果最高之有機基列舉為A-1、A-6、A-16或A-19。For example, in the above formulas A-1 to A-46, as a tetravalent organic group for improving the exposure sensitivity (in the present specification, the exposure sensitivity indicates the degree of self-hydrophobicity per hydrophilic amount of ultraviolet light irradiation) Listed as the tetravalent organic group having an aliphatic ring or an aliphatic group of the formulae A-1 to A-25, the most effective organic group is listed as A-1, A-6, A-16 or A-19. .

又,式A-1至A-25之4價有機基就提高絕緣性效果之觀點而言亦較佳。Further, the tetravalent organic group of the formulae A-1 to A-25 is also preferable from the viewpoint of improving the insulating effect.

前述式(1)中,以A表示之有機基中,混合式A-1至A-25以外之基時,式A-1至A-25之比例較好為10莫耳%以上,更好為50莫耳%以上,最好為80莫耳%以上。In the above formula (1), in the organic group represented by A, when the group other than the formula A-1 to A-25 is mixed, the ratio of the formulae A-1 to A-25 is preferably 10 mol% or more, more preferably It is 50 mol% or more, preferably 80 mol% or more.

上述式(1)中,B表示如以下述式(2)或式(3)表示之側鏈上具有硫醇酯鍵之2價構造。In the above formula (1), B represents a divalent structure having a thiol ester bond in a side chain represented by the following formula (2) or formula (3).

藉由於含有以式(1)表示之重複構造之聚醯亞胺前驅物(或由此獲得之聚醯亞胺)之側鏈上含有硫醇鍵,於硫醇酯基經光分解時,透過硫醇酯基鍵結之側鏈將從聚合物主鏈切斷。因此,藉由調整透過硫醇鍵鍵結之側鏈的親疏水性,可期待利用紫外線等之光照射而使親疏水性產生變化者。By the thiol bond on the side chain of the polyimine precursor containing the repetitive structure represented by the formula (1) (or the polyimine thus obtained), when the thiol ester group is photodecomposed, The side chain of the thiol ester linkage will be cleaved from the polymer backbone. Therefore, by adjusting the hydrophilicity and hydrophobicity of the side chain bonded through the thiol bond, it is expected that the hydrophilicity and the like are changed by irradiation with light such as ultraviolet rays.

上述式(2)或(3)中,X表示單鍵或碳原子數6至20之2價芳香族基。In the above formula (2) or (3), X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms.

Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-。Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, -CH 2 COO- or -CH 2 CH 2 COO-.

Z表示碳原子數3至26之脂肪族烴基,且任意之氫原子可經氟原子取代。Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms, and any hydrogen atom may be substituted with a fluorine atom.

R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數。R each independently represents a fluorine atom, an alkoxy group having 1 to 3 carbon atoms or an alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3.

以上述式(2)或(3)表示之B之構造,就提高紫外線之吸收效率之觀點而言,側鏈構造中亦可包含芳香族之碳環。In the structure of B represented by the above formula (2) or (3), an aromatic carbon ring may be contained in the side chain structure from the viewpoint of improving the absorption efficiency of ultraviolet rays.

因此,上述式(2)或(3)中,X表示碳原子數6至20之2價芳香族基時,較佳之芳香族基列舉為伸苯基、聯苯基、三聯苯基、伸萘基、伸蒽基等。Therefore, in the above formula (2) or (3), when X represents a divalent aromatic group having 6 to 20 carbon atoms, preferred aromatic groups are phenyl, biphenyl, terphenyl, and naphthene. Base, stretch base, etc.

上述Z中之碳原子數3至26之脂肪族烴基列舉為例如丙基、異丙基、丁基、異丁基、第三丁基、戊基、己基、辛基、2-乙基己基、壬基、第二壬基、異壬基、癸基、十二烷基、十四烷基、十六烷基、十八烷基等之直鏈狀或分支狀烷基;烯丙基、己烯基等之烯基;具有環丁烷、環戊烷、環己烷、環癸烷、類固醇骨架、金剛烷等之脂環式烴基;甲酸乙酯、乙酸甲酯、乙酸乙酯、丙酸甲酯、雙乙醯酮(diacetyl)、異丁酸甲酯、異丁酸乙酯、丁酸乙酯、丁酸丙酯、乙酸異丁酯、異丁酸異丁酯、丁酸異丁酯、異戊酸異丁酯、乙酸異戊酯、丙酸異戊酯、丙酸戊指、異丁酸戊酯、丁酸戊酯、異戊酸戊酯、己酸烯丙酯、乙醯基乙酸乙酯、庚酸乙酯、乙酸庚酯、辛酸乙酯、乙酸硬脂酯、乙酸壬酯、乙酸冰片酯、苯二甲酸二乙酯之酯基等,最好為碳原子數12至26之直鏈狀烷基。The aliphatic hydrocarbon group having 3 to 26 carbon atoms in the above Z is exemplified by propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, hexyl, octyl, 2-ethylhexyl, a linear or branched alkyl group of a fluorenyl group, a second fluorenyl group, an isodecyl group, a decyl group, a dodecyl group, a tetradecyl group, a hexadecyl group or an octadecyl group; an allyl group Alkenyl group such as alkenyl group; alicyclic hydrocarbon group having cyclobutane, cyclopentane, cyclohexane, cyclodecane, steroid skeleton, adamantane or the like; ethyl formate, methyl acetate, ethyl acetate, propionic acid Methyl ester, diacetyl, methyl isobutyrate, ethyl isobutyrate, ethyl butyrate, propyl butyrate, isobutyl acetate, isobutyl isobutyrate, isobutyl butyrate , isobutyl isovalerate, isoamyl acetate, isoamyl propionate, pentyl propionate, amyl isobutyrate, amyl butyrate, amyl isovalerate, allyl hexanoate, acetyl Ethyl acetate, ethyl heptanoate, heptyl acetate, ethyl octanoate, stearyl acetate, decyl acetate, borneol acetate, ester of diethyl phthalate, etc., preferably having a carbon number of 12 to 26 a linear alkyl group.

上述之脂肪族烴基之任意氫原子亦可經氟原子取代,較好任意氫原子經氟原子取代之碳原子數3至26之脂肪族烴基,最好為碳數4至7之直鏈狀氟烷基。Any hydrogen atom of the above aliphatic hydrocarbon group may be substituted by a fluorine atom, preferably an aliphatic hydrocarbon group having 3 to 26 carbon atoms substituted by a fluorine atom, preferably a linear fluorine having 4 to 7 carbon atoms. alkyl.

以上述式(2)或(3)表示之B構造之較佳具體例列舉為下述[B-1]至[B-17]所示之構造。該等2價之構造中,就疏水性容易提高之觀點而言,最好為以[B-13]至[B-17]表示之2價構造,又更好為以[B-15]至[B-17]表示之2價構造。Preferred specific examples of the B structure represented by the above formula (2) or (3) are as shown in the following structures [B-1] to [B-17]. Among these divalent structures, from the viewpoint of easy improvement in hydrophobicity, it is preferably a divalent structure represented by [B-13] to [B-17], and more preferably [B-15] to [B-17] indicates a two-valent structure.

又,考慮到其他特性,例如絕緣性、溶劑溶解性、成膜性、進而膜之密著性等亦為重要特性時,本發明之形成畫像用下層膜中所用之聚醯亞胺前驅物(及由其獲得之聚醯亞胺)亦可為除了以前述式(1)表示之構造以外,亦含有前述式(1)中之2價有機基B置換成側鏈上不具有硫醇酯鍵之其他2價有機基D之以下述式(4)表示之構造之聚醯亞胺前驅物(及由其獲得之聚醯亞胺)。Further, in consideration of other characteristics, such as insulating properties, solvent solubility, film formability, and further adhesion of the film, the polyimine precursor used in the underlayer film for forming an image of the present invention ( And the polyimine obtained therefrom may be in addition to the structure represented by the above formula (1), and the divalent organic group B in the above formula (1) may be substituted to have no thiol ester bond in the side chain. The polyvalent imine precursor of the other divalent organic group D represented by the following formula (4) (and the polyimine obtained therefrom).

此時,含有於側鏈上具有硫醇酯鍵之2價有機基B之以上述式(1)表示之構造與含有於側鏈上不具有硫醇酯鍵之其他2價有機基之式(4)之構造之鍵結可為嵌段鍵結及/或無規鍵結之任一種。In this case, the structure represented by the above formula (1) and the other divalent organic group having no thiol ester bond in the side chain are contained in the divalent organic group B having a thiol ester bond in the side chain ( 4) The bond of the structure may be any of block bonding and/or random bonding.

式中,A、R1 及R2 與上述式(1)中之定義相同,m表示自然數,D表示側鏈上不具有硫醇酯鍵之其他2價之構造。In the formula, A, R 1 and R 2 are the same as defined in the above formula (1), m represents a natural number, and D represents another divalent structure having no thiol ester bond in the side chain.

本發明之形成畫像用下層膜中所用之聚醯亞胺前驅物(及由其獲得之聚醯亞胺)中,式(4)中,D為側鏈上具有長鏈烷基時,若過度提高以式(4)表示之構造(側鏈上不具有硫醇酯鍵之構造)之含有比例將使對於紫外線之感度下降。據此,含有以式(4)表示之構造時,以式(1)表示之構造(側鏈上具有硫醇酯鍵之構造)之比例較好為30莫耳%以上。In the polyimine precursor (and the polyimine obtained therefrom) used in the formation of the underlayer film of the present invention, in the formula (4), when D is a long-chain alkyl group in the side chain, excessive Increasing the content ratio of the structure represented by the formula (4) (the structure having no thiol ester bond in the side chain) will lower the sensitivity to ultraviolet rays. According to this, when the structure represented by the formula (4) is contained, the ratio of the structure represented by the formula (1) (structure having a thiol ester bond in the side chain) is preferably 30 mol% or more.

又,為了進一步提高曝光感度,縮短紫外線之照射時間,有必要進一步提高以式(1)表示之構造之含有比例,此時之含有比例較好為50莫耳%以上。Moreover, in order to further improve the exposure sensitivity and shorten the irradiation time of the ultraviolet rays, it is necessary to further increase the content ratio of the structure represented by the formula (1), and the content ratio in this case is preferably 50 mol% or more.

又式(4)中,D於側鏈上不具有長鏈烷基時,由於膜之疏水性主要受以式(1)表示之構造之比例影響,故考慮畫像形成液之表面張力或與上層構件之密著性等,而決定以式(1)表示之構造之比例即可。Further, in the formula (4), when D does not have a long-chain alkyl group in the side chain, since the hydrophobicity of the film is mainly affected by the ratio of the structure represented by the formula (1), the surface tension of the image forming liquid or the upper layer is considered. The ratio of the structure represented by the formula (1) may be determined by the adhesion of the member or the like.

又,以上述式(2)或式(3)表示之構造中,Z之脂肪族烴基之一部份經氟原子取代時,以式(1)表示之構造之比例即使為10莫耳%以下亦可獲得高的疏水性與感度。亦即,認為膜之親疏水性之變化係導因於側鏈構造之分解‧分離,於式(1)之比例為10莫耳%以下時,曝光感度亦未必會降低。Further, in the structure represented by the above formula (2) or (3), when one part of the aliphatic hydrocarbon group of Z is substituted by a fluorine atom, the ratio of the structure represented by the formula (1) is 10 mol% or less. High hydrophobicity and sensitivity can also be obtained. That is, it is considered that the change in the hydrophilicity of the film is caused by the decomposition of the side chain structure, and the exposure sensitivity is not necessarily lowered when the ratio of the formula (1) is 10 mol% or less.

上述式(4)中,不具有硫醇酯鍵之其他2價構造D較好為具有絕緣性高之構造者,具體而言,可列舉為下述[D-1]至[D-57]之構造。In the above formula (4), the other divalent structure D having no thiol ester bond is preferably a structure having high insulating properties, and specifically, the following [D-1] to [D-57] are mentioned. Construction.

下述[D-1]至[D-57]中,就提高絕緣性容易性之觀點而言較好為[D-1]至[D-5]之構造。In the following [D-1] to [D-57], the structure of [D-1] to [D-5] is preferable from the viewpoint of improving the ease of insulation.

又,溶劑溶解性提高效果較高之構造列舉為[D-2]、[D-5]、[D-7]、[D-8]、[D-12]、[D-22]、[D-24]至[D-27]、[D-29]。Further, the structures having a high solvent solubility improving effect are listed as [D-2], [D-5], [D-7], [D-8], [D-12], [D-22], [ D-24] to [D-27], [D-29].

又,側鏈上具有長鏈烷基之疏水性構造之具體例可列舉為[D-55]至[D-27]之構造,但作為有機電晶體之特性,可期待絕緣性之提高,可在不降低感度之範圍內使用,該等使用時需注意其使用比例等。Further, specific examples of the hydrophobic structure having a long-chain alkyl group in the side chain include the structures of [D-55] to [D-27], but as the characteristics of the organic transistor, improvement in insulation can be expected. Use within the range of not reducing the sensitivity, such use should pay attention to the proportion of use.

前述聚醯亞胺前驅物係藉由例如使四羧酸二酐及其衍生物與二胺聚合而製造。尤其,就以四羧酸酐成分與二胺成分作為原料進行反應比較簡便之理由,較好為以下述式(5)表示之聚醯亞胺前驅物(聚醯胺酸)。The polyimine precursor is produced by, for example, polymerizing a tetracarboxylic dianhydride and a derivative thereof with a diamine. In particular, the polyimine precursor (polylysine) represented by the following formula (5) is preferred because the tetracarboxylic anhydride component and the diamine component are relatively simple to react.

(式中,A、B及n與式(1)中之定義相同)。(wherein, A, B and n are the same as defined in the formula (1)).

《四羧酸二酐及其衍生物》"Tetracarboxylic dianhydride and its derivatives"

本發明中,四羧酸二酐及其衍生物並無特別限制,但較好使用以下述式(6)表示之四羧酸二酐。式中之A與上述式(1)之定義相同,其具體例列舉為上述之式A-1至A-46所示者。In the present invention, the tetracarboxylic dianhydride and the derivative thereof are not particularly limited, but a tetracarboxylic dianhydride represented by the following formula (6) is preferably used. A in the formula is the same as defined in the above formula (1), and specific examples thereof are as shown in the above formulas A-1 to A-46.

(式中,A與式(1)中之定義相同)。(wherein A is the same as defined in the formula (1)).

如截至目前所述,聚醯亞胺前驅物中,以A表示之有機基之構造可為一種,亦可混合存在複數種。其中A較好為具有脂肪族環或僅由脂肪族所構成之4價有機基,更好為具有脂肪族環之4價有機基。據此,四羧酸二酐成分中較好含有較多之A為具有脂肪族環或僅由脂肪族所構成之4價有機基之式(6)化合物。更好,以含有較多之A為具有脂肪族環之4價有機基之式(6)化合物較佳。As described so far, in the polyimine precursor, the structure of the organic group represented by A may be one type, and a plurality of kinds may be mixed. Wherein A is preferably a tetravalent organic group having an aliphatic ring or only an aliphatic group, more preferably a tetravalent organic group having an aliphatic ring. Accordingly, the tetracarboxylic dianhydride component preferably contains a large amount of a compound of the formula (6) having an aliphatic ring or a tetravalent organic group composed only of an aliphatic group. More preferably, a compound of the formula (6) containing a large amount of A as a tetravalent organic group having an aliphatic ring is preferred.

此於僅使用芳香族酸二酐製造聚醯亞胺前驅物等,作為形成畫像用下層膜時,有若對該形成畫像用下層膜施加高電場時絕緣性顯著降低之傾向。相反地,使用脂肪族酸二酐時,於高電場之絕緣性優異。When a polyimine precursor or the like is produced using only the aromatic acid dianhydride, the insulating film is remarkably lowered when a high electric field is applied to the underlayer film for forming an image. On the contrary, when an aliphatic acid dianhydride is used, it is excellent in insulation in a high electric field.

例如,有機電晶體之作動電壓亦有成為1MV/cm左右之時,於該用途之情況,就絕緣性之觀點而言,尤其以使用脂肪酸二酐作為聚醯亞胺前驅物之原料較適宜。For example, when the operating voltage of the organic transistor is about 1 MV/cm, in the case of the use, it is preferable to use a fatty acid dianhydride as a raw material of the polyimide precursor in view of the insulating property.

《二胺》Diamine

本發明中,二胺成分中所用之二胺為以下述式(7)表示,B為以下述式(2)或下述式(3)表示之構造,亦即為於側鏈上具有硫醇酯鍵之2價構造。B之具體例列舉為以上述之[B-1]至[B-17]所示之構造。In the present invention, the diamine used in the diamine component is represented by the following formula (7), and B is a structure represented by the following formula (2) or the following formula (3), that is, having a mercaptan in the side chain. The divalent structure of the ester bond. Specific examples of B are as shown in the above [B-1] to [B-17].

[化24][Chem. 24]

HH 22 N─B─NHN-B-NH 22  (7)(7)

(式中,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示可經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。(wherein, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, - CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which may be substituted by a fluorine atom, and R each independently represents a fluorine atom, an alkoxy group having 1 to 3 carbon atoms or An alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3.

又,在展現本發明效果之範圍內,除了以式(7)表示之二胺以外,亦可倂用以式(Q1)表示之式(7)以外之二胺。Further, in addition to the diamine represented by the formula (7), a diamine other than the formula (7) represented by the formula (Q1) may be used in the range in which the effects of the present invention are exhibited.

[化26][Chem. 26]

HH 22 N─D─NHN-D-NH 22  (Q1)(Q1)

式(Q1)中,D與上述式(4)中之定義相同。據此,以式(Q1)表示之二胺之具體例列舉為D之構造具有上述[D-1]至[D-57]所示之2價構造之二胺。In the formula (Q1), D is the same as defined in the above formula (4). According to this, a specific example of the diamine represented by the formula (Q1) is a diamine having a divalent structure represented by the above [D-1] to [D-57].

[二胺化合物之合成方法][Synthesis method of diamine compound]

以上述式(7)表示之二胺中,獲得B為式(2)構造之二胺之方法並無特別限制。若以一例顯示,則合成對應之以下述通式(8)表示之二硝基化合物,且將硝基還原轉換成胺基而獲得。還原二硝基化合物之方法並無特別限制,通常使用鈀-碳、氧化鉑、阮尼鎳、鐵、氯化錫、鉑黑、銠-氧化鋁等作為觸媒,使用乙酸乙酯、甲苯、四氫呋喃、二噁烷、醇系等溶劑,氫氣、聯胺、氯化氫、氯化銨等反應進行之方法。本發明中,二硝基化合物之骨架中具有硫原子等之化合物由於偶爾會成為觸媒毒,有時會使觸媒失活,故更好使用利用阮尼鎳、鐵、氯化錫等之化學還原法。Among the diamines represented by the above formula (7), a method of obtaining a diamine having a structure of the formula (2) is not particularly limited. When it is shown by an example, the dinitro compound represented by the following general formula (8) is synthesized, and the nitro group is converted into an amine group. The method for reducing the dinitro compound is not particularly limited, and palladium-carbon, platinum oxide, nickel iridium, iron, tin chloride, platinum black, lanthanum-alumina or the like is usually used as a catalyst, and ethyl acetate, toluene, and the like are used. A method in which a solvent such as tetrahydrofuran, dioxane or an alcohol is reacted with hydrogen, hydrazine, hydrogen chloride or ammonium chloride. In the present invention, a compound having a sulfur atom or the like in the skeleton of the dinitro compound may occasionally become a catalytic agent, and may inactivate the catalyst. Therefore, it is more preferable to use nickel, iron, tin chloride, or the like. Chemical reduction method.

(式中,X、Y、Z、R及t與上述式(2)中之定義相同)。(wherein, X, Y, Z, R and t are the same as defined in the above formula (2)).

上述式(8)之二硝基化合物可藉由使下述所示之二硝基苯甲醯氯(9)與含有硫醇基之化合物(10)之反應等而獲得。The dinitro compound of the above formula (8) can be obtained by reacting dinitrobenzhydryl chloride (9) shown below with a compound (10) containing a thiol group.

(式中,X、Y、Z、R及t與上述式(2)中之定義相同)。(wherein, X, Y, Z, R and t are the same as defined in the above formula (2)).

以上述式(7)表示之二胺中,獲得B為式(3)構造之二胺之方法並無特別限制。例如,可合成對應之以下述式(11)表示之二硝基化合物,隨後與如上述二硝基化合物(8)之情況同樣地使硝基還原轉換成胺基而獲得。Among the diamines represented by the above formula (7), a method of obtaining a diamine having a structure of the formula (3) is not particularly limited. For example, a dinitro compound represented by the following formula (11) can be synthesized, and then obtained by reductively converting a nitro group into an amine group as in the case of the above dinitro compound (8).

(式中,X、Y、Z、R及t與上述式(3)中之定義相同)。(wherein, X, Y, Z, R and t are the same as defined in the above formula (3)).

上述式(11)之二硝基化合物可藉由下述所示之含有硫醇基之二硝基化合物(12)與具有亦可含有氟原子之脂肪族烴之醯氯(13)反應等而獲得。The dinitro compound of the above formula (11) can be reacted with a thiol group-containing dinitro compound (12) shown below and a ruthenium chloride (13) having an aliphatic hydrocarbon which may also contain a fluorine atom. obtain.

(式中,X、Y、Z、R及t與上述式(3)中之定義相同)。(wherein, X, Y, Z, R and t are the same as defined in the above formula (3)).

《聚醯亞胺前驅物之製造方法》"Manufacturing method of polyimine precursors"

獲得具有以式(1)表示之重複構造之聚醯亞胺前驅物而言,使包含以上述式(6)表示之四羧酸二酐之四羧酸二酐成分與包含以上述式(7)表示之二胺以及依據需要之以上述式(Q1)表示之二胺成分之二胺成分於有機溶劑中混合並反應之方法為簡便之方法。In the case of obtaining a polyimine precursor having a repeating structure represented by the formula (1), a tetracarboxylic dianhydride component containing the tetracarboxylic dianhydride represented by the above formula (6) and containing the above formula (7) The method of mixing and reacting the diamine represented by the diamine component represented by the above formula (Q1) in an organic solvent as needed is a simple method.

使四羧酸二酐成分與二胺成分於有機溶劑中混合之方法,列舉為使二胺成分分散或溶解於有機溶劑中之溶液予以攪拌,並直接添加四羧酸二酐直接或者將其分散或溶解於有機溶劑中添加之方法;相反地將二胺成分添加於將四羧酸二酐成分分散或溶解於有機溶劑之溶液中之方法;交互添加四羧酸二酐成分與二胺成分之方法等。A method of mixing a tetracarboxylic dianhydride component and a diamine component in an organic solvent is exemplified by stirring a solution in which a diamine component is dispersed or dissolved in an organic solvent, and directly adding or dispersing a tetracarboxylic dianhydride. Or a method of adding in an organic solvent; instead, a diamine component is added to a solution in which a tetracarboxylic dianhydride component is dispersed or dissolved in an organic solvent; and a tetracarboxylic dianhydride component and a diamine component are alternately added. Method, etc.

又,四羧酸二酐成分與二胺成分以複數種存在之化合物之情況,可以事先混合該等複數種成分之狀態進行聚合反應,亦可個別依序進行聚合反應。Further, in the case where the tetracarboxylic dianhydride component and the diamine component are in a plurality of compounds, the polymerization reaction may be carried out in a state in which the plurality of components are mixed in advance, or the polymerization reaction may be carried out in an orderly manner.

本發明所用之上述聚醯亞胺前驅物聚合之際,四羧酸二酐成分與二胺成分之調配比,亦即(四羧酸二酐成分之總莫耳數〉:(二胺成分之總莫耳數〉較好為1:0.5至1:1.5。與通常聚合反應相同,其莫耳比越接近1:1所生成之聚醯亞胺前驅物之聚合度越大,分子量增加。When the polyimine precursor used in the present invention is polymerized, the ratio of the tetracarboxylic dianhydride component to the diamine component, that is, the total molar amount of the tetracarboxylic dianhydride component: (diamine component) The total molar number is preferably from 1:0.5 to 1:1.5. As with the usual polymerization reaction, the closer the molar ratio is to 1:1, the greater the degree of polymerization of the polyimine precursor formed, and the molecular weight increases.

前述聚醯亞胺前驅物之製造方法中,使四羧酸二酐成分與二胺成分在有機溶劑中反應時之溫度通常為-20至150℃,較好為0至80℃。In the method for producing a polyimine precursor, the temperature at which the tetracarboxylic dianhydride component and the diamine component are reacted in an organic solvent is usually -20 to 150 ° C, preferably 0 to 80 ° C.

將反應溫度設定成高溫時聚合反應迅速進行並完成,但過高時會有無法獲得高分子量之聚醯亞胺前驅物之情況。When the reaction temperature is set to a high temperature, the polymerization reaction proceeds rapidly and is completed, but when it is too high, a high molecular weight polyimine precursor cannot be obtained.

又,在有機溶劑中進行聚合反應時,溶劑中之兩成分(四羧酸酐成分及二胺成分之合計質量)之固體成分濃度並無特別限制,但濃度太低時難以獲得高分子量之聚醯亞胺前驅物,濃度太高時反應液體之黏度過高而難以均勻攪拌,故較好為1至50質量%,更好為5至30質量%。亦可為聚合反應初期以高濃度進行,隨後與聚合物(聚醯亞胺前驅物)純化同時追加有機溶劑。Further, when the polymerization reaction is carried out in an organic solvent, the solid content concentration of the two components (the total mass of the tetracarboxylic anhydride component and the diamine component) in the solvent is not particularly limited, but it is difficult to obtain a high molecular weight polyfluorene when the concentration is too low. In the imine precursor, when the concentration is too high, the viscosity of the reaction liquid is too high to be uniformly stirred, so it is preferably from 1 to 50% by mass, more preferably from 5 to 30% by mass. It may be carried out at a high concentration in the initial stage of the polymerization, and then an organic solvent may be added together with the purification of the polymer (polyimine precursor).

上述聚合反應中所用之有機溶劑只要是可溶解生成之聚醯亞胺前驅物者即無特別限制,但若要列舉其具體例,則可列舉為N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、N-甲基己內醯胺、二甲基亞碸、四甲基脲、吡啶、二甲基碸、六甲基亞碸、γ-丁內酯等。該等可單獨使用,亦可混合兩種以上使用。另外,即使為無法溶解聚醯亞胺前驅物之溶劑,只要在不使生成之聚醯亞胺前驅物析出之範圍內,亦可混合於上述溶劑中。The organic solvent to be used in the above-mentioned polymerization reaction is not particularly limited as long as it is a polyimine precursor which can be dissolved, but specific examples thereof include N,N-dimethylformamide and N. , N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methyl caprolactam, dimethyl hydrazine, tetramethyl urea, pyridine, dimethyl hydrazine, hexamethyl Kea, γ-butyrolactone and the like. These may be used singly or in combination of two or more. Further, even a solvent in which the polyimide intermediate precursor cannot be dissolved may be mixed in the solvent as long as it does not precipitate the formed polyimide precursor.

如此獲得之含有聚醯亞胺前驅物之溶液可直接使用於調製後述之形成畫像之下層膜塗佈液中。又,亦可在水、甲醇、乙醇等弱溶劑中使聚醯亞胺前驅物沉澱單離並回收後使用。The solution containing the polyimine precursor thus obtained can be used as it is in the formation of a film coating liquid under the image. Further, the polyimide precursor may be precipitated and recovered in a weak solvent such as water, methanol or ethanol, and recovered.

[聚醯亞胺][polyimine]

可使具有以前述式(1)及(4)(以及前述式(5))表示之構造之聚醯亞胺前驅物藉由脫水閉環成為聚醯亞胺。該醯亞胺化反應之方法並無特別限制,但使用鹼性觸媒與酸酐之觸媒醯亞胺化,由於在醯亞胺化反應時不易引起醯亞胺分子量降低,且醯亞胺化率之控制較容易故而較佳。The polyimine precursor having a structure represented by the above formulas (1) and (4) (and the above formula (5)) can be subjected to dehydration ring closure to form a polyimine. The method for the ruthenium imidization reaction is not particularly limited, but the imidization of a catalyzed ruthenium using a basic catalyst and an acid anhydride is less likely to cause a decrease in the molecular weight of the quinone imine during the ruthenium imidization reaction, and the ruthenium imidization The control of the rate is easier and better.

觸媒醯亞胺化可藉由使前述聚醯亞胺前驅物在有機溶劑中,於鹼性觸媒及酸酐存在下攪拌1至100小時。The catalyst imidization can be carried out by stirring the aforementioned polyimine precursor in an organic solvent in the presence of a basic catalyst and an acid anhydride for 1 to 100 hours.

又其中,聚醯亞胺前驅物亦可直接(未經單離)使用包含由前述四羧酸酐成分及二胺成分之聚合獲得之聚醯亞胺前驅物之溶液。Further, the polyimine precursor may be directly (unalone) a solution containing a polyimide precursor obtained by polymerization of the above tetracarboxylic anhydride component and a diamine component.

鹼性觸媒可列舉為吡啶、三乙基胺、三甲基胺、三丁基胺、三辛基胺等。其中,吡啶由於進行反應時帶有適度之鹼性故而較佳。The basic catalyst may, for example, be pyridine, triethylamine, trimethylamine, tributylamine or trioctylamine. Among them, pyridine is preferred because it has a moderate alkalinity in carrying out the reaction.

作為酸酐可列舉為乙酸酐、偏苯三酸酐、均苯四酸酐等。其中乙酸酐由於醯亞胺化結束後所得之聚醯亞胺之純化較容易故而較佳。Examples of the acid anhydride include acetic anhydride, trimellitic anhydride, and pyromellitic anhydride. Among them, acetic anhydride is preferred because it is easier to purify the polyimine obtained after the ruthenium imidization.

作為有機溶劑可使用前述聚醯亞胺前驅物聚合反應時所用之溶劑。As the organic solvent, a solvent used in the polymerization of the above polyimine precursor can be used.

觸媒醯亞胺化時之反應溫度較好為-20至250℃,更好為0至180℃。反應溫度設定在高溫時醯亞胺化會迅速進行,但過高時有聚醯亞胺之分子量降低之情況。The reaction temperature in the imidization of the catalyst oxime is preferably from -20 to 250 ° C, more preferably from 0 to 180 ° C. When the reaction temperature is set to a high temperature, the imidization will proceed rapidly, but when it is too high, the molecular weight of the polyimine will decrease.

鹼性觸媒之量相對於前述聚醯亞胺前驅物中之酸醯胺基較好為0.5至30莫耳倍,更好為2至20莫耳倍。又,酸酐之量相對於前述聚醯亞胺前驅物中之酸醯胺基為1至50莫耳倍,更好為3至30莫耳倍。The amount of the basic catalyst is preferably from 0.5 to 30 moles, more preferably from 2 to 20 moles, relative to the acid amide group in the polyimine precursor. Further, the amount of the acid anhydride is from 1 to 50 moles, more preferably from 3 to 30 moles, relative to the acid amide group in the aforementioned polyimide intermediate.

調整上述反應溫度及觸媒量,可控制所得聚醯亞胺之醯亞胺化率。By adjusting the above reaction temperature and the amount of the catalyst, the yield of the obtained ruthenium imine can be controlled.

如上述獲得之溶劑可溶性聚醯亞胺之反應溶液,雖可直接使用於後述之閘極絕緣膜之製作,但由於反應液中含有醯亞胺化觸媒,故較好使用聚醯亞胺經純化‧回收‧洗淨者。The reaction solution of the solvent-soluble polyimine obtained as described above can be directly used for the production of the gate insulating film described later, but since the reaction solution contains a ruthenium-based catalyst, it is preferred to use a polyimide reaction. Purification ‧ Recycling ‧ Washers

聚醯亞胺之回收之簡便方法為在攪拌下將反應液倒入弱溶劑中使聚醯亞胺沉澱,並將其過濾之方法。A convenient method for recovering polyimine is to pour the reaction solution into a weak solvent under stirring to precipitate the polyimine and filter it.

此時使用之弱溶劑並無特別限制,但可例示為甲醇、己烷、庚烷、乙醇、甲苯、水等。過濾回收沉澱物後,較好以上述弱溶劑洗淨。The weak solvent to be used at this time is not particularly limited, and may, for example, be methanol, hexane, heptane, ethanol, toluene, water or the like. After the precipitate is recovered by filtration, it is preferably washed with the above weak solvent.

回收之聚醯亞胺可在常壓或減壓下,於常溫或加熱乾燥成為聚醯亞胺粉末。The recovered polyimine can be dried to a polyimine powder at normal temperature or under reduced pressure under normal pressure or reduced pressure.

使該聚醯亞胺粉末進一步溶解於良溶劑中,於弱溶劑中再沉澱重複操作2至10次,亦可進一步減少聚合物中之雜質。The polyimine powder is further dissolved in a good solvent, and reprecipitation is repeated in a weak solvent for 2 to 10 times, and impurities in the polymer can be further reduced.

此時使用之良溶劑只要是可溶解聚醯亞胺前驅物或聚醯亞胺則無特別限制,但其例列舉為例如N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、2-吡咯啶酮、N-甲基-2-吡咯啶酮、N-乙基-2-吡咯啶酮、N-乙烯基-2-吡咯啶酮、N-甲基己內醯胺、二甲基亞碸、四甲基脲、吡啶、γ-丁內酯等。The good solvent to be used at this time is not particularly limited as long as it is a soluble polyimide precursor or polyimine, but examples thereof are, for example, N,N-dimethylformamide, N,N-dimethyl Acetamide, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N-methyl caprolactone Amine, dimethyl hydrazine, tetramethyl urea, pyridine, γ-butyrolactone and the like.

又,使用例如醇類、酮類、烴等三種類以上之弱溶劑作為再沉殿所用之弱溶劑時,可進一步提高純化效率。Further, when three or more kinds of weak solvents such as alcohols, ketones, and hydrocarbons are used as the weak solvent used in the re-sinking chamber, the purification efficiency can be further improved.

[形成畫像之下層膜塗佈液][Formation of film coating liquid under the image]

本發明之形成畫像用下層膜可使用形成畫像之下層膜塗佈液而形成。該形成畫像之下層膜塗佈液可為含有前述之聚醯亞胺前驅物、前述之聚醯亞胺、以及溶劑,及依據需要可進一步含有後述之偶合劑或界面活性劑之塗佈液,較好為包含使含有以下述式(6)表示之四羧酸二酐之四羧酸二酐成分及含有以式(7)表示之二胺之二胺成分反應獲得之聚醯亞胺前驅物,或使該聚醯亞胺前驅物經脫水閉環獲得之聚醯亞胺之塗佈液。The underlayer film for forming an image of the present invention can be formed by forming a film coating liquid under the image. The film coating liquid under the formation of the image may be a coating liquid containing the above-mentioned polyimide precursor, the above-mentioned polyimine, and a solvent, and if necessary, a coupling agent or a surfactant which will be further described, It is preferred to contain a polyfluorene imine precursor obtained by reacting a tetracarboxylic dianhydride component containing a tetracarboxylic dianhydride represented by the following formula (6) and a diamine component containing a diamine represented by the formula (7). Or a coating liquid of the polyimine obtained by subjecting the polyimine precursor to dehydration ring closure.

HH 22 N─B─NHN-B-NH 22  (7)(7)

(式中,A表示4價有機基,B表示以式(2)或(3)表示之2價構造,(wherein A represents a tetravalent organic group, and B represents a divalent structure represented by formula (2) or (3),

R1 、R2 分別獨立表示氫原子或1價有機基,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示可經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-. , -CONH-, -CH 2 O-, -CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which may be substituted by a fluorine atom, and R each independently represents a fluorine atom An alkoxy group having 1 to 3 carbon atoms or an alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3.

最好為前述式(2)或(3)之Z表示任意氫原子經氟原子取代之碳原子數3至26之脂肪族烴基之形成畫像之下層膜塗佈液。It is preferable that the Z of the above formula (2) or (3) represents a layered film coating liquid which is formed by forming an aliphatic hydrocarbon group having 3 to 26 carbon atoms which is substituted with a fluorine atom.

前述之形成畫像之下層膜塗佈液中所用之前述聚醯亞胺前驅物及/或聚醯亞胺之分子量,就操作之容易性、膜形成時之耐溶劑性等安定性之觀點而言,宜使用聚乙二醇(或聚環氧乙烷)換算之重量平均分子量(以GPC測定之結果)為2,000至200,000,更好為5,000至50,000者。The molecular weight of the polyimine precursor and/or polyimine used in the film coating liquid formed in the image forming layer described above is from the viewpoints of ease of handling and solvent resistance at the time of film formation. The weight average molecular weight (result as measured by GPC) in terms of polyethylene glycol (or polyethylene oxide) is preferably 2,000 to 200,000, more preferably 5,000 to 50,000.

使用前述之形成畫像之下層膜塗佈液製作形成畫像用下層膜,且照射紫外線時,關於親疏水性之變化量由於在聚醯亞胺前驅物與聚醯亞胺之間並無太大差異,故所得形成畫像用下層膜以該點為重點時,醯亞胺化率並無特別限制。When the underlayer film for forming an image is formed by using the above-mentioned underlayer film coating liquid for forming an image, and the ultraviolet ray is irradiated, the amount of change in the hydrophobicity is not greatly different between the polyimine precursor and the polyimine. Therefore, when the underlayer film for forming an image is focused on this point, the yield of hydrazine imidation is not particularly limited.

然而,藉由使用聚醯亞胺,可獲得在塑膠基板可對應之低溫燒成(180℃以下)之信賴性高之膜的觀點而言,由於聚醯亞胺比聚醯亞胺前驅物之極性低,可獲得提高紫外線照射前之水接觸角(可提高疏水性)方面等之優點,故以使用聚醯亞胺更佳。However, by using polyimide, it is possible to obtain a highly reliable film which can be fired at a low temperature (180 ° C or lower) which is compatible with a plastic substrate, since the polyimide is more than a polyimide precursor. Since the polarity is low, the advantage of improving the water contact angle before ultraviolet irradiation (which can improve the hydrophobicity) can be obtained, so that it is more preferable to use polyimine.

另一方面,於重點為絕緣性之形成畫像用下層膜(例如閘極絕緣膜)中使用前述形成畫像之下層膜塗佈液時,該塗佈液之醯亞胺化率較好為90%以上。但,在不損及溶劑溶解性之情況下亦可降低醯亞胺化率,但該情況下,形成膜時,藉由使用後述之摻合手法使最下層成為高醯亞胺化(高絕緣性),可保有作為下層膜之高絕緣性而為有用。On the other hand, when the underlayer film coating liquid is formed in the underlayer film (for example, a gate insulating film) which is mainly used for forming an insulating layer, the coating solution has a yttrium imidation ratio of preferably 90%. the above. However, the ruthenium imidization ratio can be lowered without impairing the solvent solubility. However, in this case, when the film is formed, the lowermost layer is made into a high-yield imidization by using a blending method described later (high insulation). It is useful to retain high insulation as a lower film.

前述之形成畫像之下層膜塗佈液中使用之溶劑只要是可溶解聚醯亞胺前驅物或聚醯亞胺者即無特別限制,其例列舉為N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、2-吡咯啶酮、N-甲基-2-吡咯啶酮、N-乙基-2-吡咯啶酮、N-乙烯基-2-吡咯啶酮、N-甲基己內醯胺、二甲基亞碸、四甲基脲、吡啶、γ-丁內酯等良溶劑。該等可單獨使用一種,亦可混合使用,再者,亦可將醇類、酮類、烴等弱溶劑與前述良溶劑混合使用。The solvent used in the above-mentioned layer forming film coating liquid is not particularly limited as long as it is a soluble polyimide precursor or a polyimide, and examples thereof are N,N-dimethylformamide. N,N-dimethylacetamide, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, A good solvent such as N-methyl caprolactam, dimethyl hydrazine, tetramethyl urea, pyridine or γ-butyrolactone. These may be used singly or in combination, and a weak solvent such as an alcohol, a ketone or a hydrocarbon may be used in combination with the above-mentioned good solvent.

前述形成畫像之下層膜塗佈液中之固體成分比例,只要使亦包含後述之偶合劑等之各成分均勻溶解於溶劑中即無特別的限制,例如為1至30質量%,又例如為5至20質量%。其中,所謂固體成分係指自形成畫像之下層膜塗佈液之全部成分去除溶劑者。The ratio of the solid content in the layer coating liquid to be formed in the image formation layer is not particularly limited as long as the components including the coupling agent to be described later are uniformly dissolved in the solvent, and are, for example, 1 to 30% by mass, for example, 5 Up to 20% by mass. Here, the solid content means that the solvent is removed from all the components of the layer coating liquid under the formation image.

前述形成畫像之下層膜塗佈液之調製方法並無特別限制,但亦可直接使用包含由前述之四羧酸酐成分及二胺成分之聚合所得之聚醯亞胺前驅物之溶液,或者使用該溶液所得之聚醯亞胺之反應溶液。The method for preparing the layer coating liquid under the formation of the image is not particularly limited, but a solution containing the polyimine precursor obtained by polymerization of the tetracarboxylic anhydride component and the diamine component described above may be used as it is, or The reaction solution of the polyimine obtained by the solution.

又,於前述之形成畫像之下層膜塗佈液中,為提高該塗佈液與基板之密著性,只要不損及本發明之效果,亦可進而含有偶合劑。Moreover, in order to improve the adhesiveness of this coating liquid and a board|substrate in the coating film formation liquid below the image formation, the coupling agent may further be contained, in order to not damage the effect of this invention.

上述偶合劑可列舉為含有官能性矽烷之化合物或含有環氧基之化合物,具體而言可列舉為3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、2-胺基丙基三甲氧基矽烷、2-胺基丙基三乙氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、3-脲基丙基三甲氧基矽烷、3-脲基丙基三乙氧基矽烷、N-乙氧基羰基-3-胺基丙基三甲氧基矽烷、N-乙氧基羰基-3-胺基丙基三乙氧基矽烷、N-三甲氧基矽烷基丙基三伸乙基三胺、N-三乙氧基矽烷基丙基三伸乙基三胺、10-三甲氧基矽烷基-1,4,7-三氮雜癸烷、10-三乙氧基矽烷基-1,4,7-三氮雜癸烷、9-三甲氧基矽烷基-3,6-二氮雜壬基乙酸酯、9-三乙氧基矽烷基-3,6-二氮雜壬基乙酸酯、N-苄基-3-胺基丙基三甲氧基矽烷、N-苄基-3-胺基丙基三乙氧基矽烷、N-苯基-3-胺基丙基三甲氧基矽烷、N-苯基-3-胺基丙基三乙氧基矽烷、N-雙(氧基伸乙基)-3-胺基丙基三甲氧基矽烷、N-雙(氧基伸乙基)-3-胺基丙基三乙氧基矽烷、乙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、三丙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、新戊二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、丙三醇二縮水甘油醚、2,2-二溴新戊二醇二縮水甘油醚、6-四縮水甘油基-2,4-己二醇、N,N,N’,N’-四縮水甘油基-間-二甲苯二胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、N,N,N’,N’-四縮水甘油基-4,4’-二胺基二苯基甲烷等化合物。The coupling agent may, for example, be a compound containing a functional decane or a compound containing an epoxy group, and specific examples thereof include 3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxydecane, and 2 -Aminopropyltrimethoxydecane, 2-aminopropyltriethoxydecane, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane, N-(2-amine Benzyl)-3-aminopropylmethyldimethoxydecane, 3-ureidopropyltrimethoxydecane, 3-ureidopropyltriethoxydecane, N-ethoxycarbonyl-3 -Aminopropyltrimethoxydecane, N-ethoxycarbonyl-3-aminopropyltriethoxydecane, N-trimethoxydecylpropyltriethylamine, N-triethoxy Base alkyl propyl triethylamine, 10-trimethoxydecyl-1,4,7-triazadecane, 10-triethoxydecyl-1,4,7-triaza Decane, 9-trimethoxydecyl-3,6-diazadecyl acetate, 9-triethoxydecyl-3,6-diazaindolyl acetate, N-benzyl 3-aminopropyltrimethoxydecane, N-benzyl-3-aminopropyltriethoxydecane, N-phenyl-3-aminopropyltrimethoxydecane, N-phenyl- 3- Propyltriethoxydecane, N-bis(oxyethyl)-3-aminopropyltrimethoxydecane, N-bis(oxyethyl)-3-aminopropyltriethoxy Decane, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, glycerol diglycidyl ether, 2,2-dibromoneopentyl glycol diglycidyl ether, 6-tetraglycidyl-2,4-hexanediol, N, N,N',N'-tetraglycidyl-m-xylylenediamine, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, N,N,N', A compound such as N'-tetraglycidyl-4,4'-diaminodiphenylmethane.

該等可單獨使用一種,亦可組合兩種以上使用。These may be used alone or in combination of two or more.

使用該偶合劑時,其含量相對於形成畫像之下層膜塗佈液100質量份,較好以0.1至30質量份添加,更好為1至20質量份。When the coupling agent is used, the content thereof is preferably from 0.1 to 30 parts by mass, more preferably from 1 to 20 parts by mass, per 100 parts by mass of the film coating liquid under the formation of the image.

再者前述形成畫像之下層膜塗佈液中,為提高該塗佈液之塗佈性、自該塗佈液獲得之膜之膜厚均勻性或表面平化性,亦可含有界面活性劑。Further, in the layer coating liquid for forming the image, the surfactant may be contained in order to improve the coating property of the coating liquid, the film thickness uniformity or the surface flatness of the film obtained from the coating liquid.

前述界面活性劑並無特別限制,列舉為例如氟系界面活性劑、聚矽氧系界面活性劑、非離子系界面活性劑等。該種界面活性劑列舉為例如F TO PEF301、EF303、EF352(Jamco(股)製造)、MEGAFACE F171、F173、R-30(大日本油墨化學(股)製造)、FLORARD FC430、FC431(住友3M化學工業(股)製造)、ASAHIGUARD AG710、SURFLON S-382、SC101、SC102、SC103、SC104、SC105、SC106(旭硝子(股)製造)等。The surfactant is not particularly limited, and examples thereof include a fluorine-based surfactant, a polyfluorene-based surfactant, and a nonionic surfactant. Such surfactants are listed, for example, as F TO PEF 301, EF 303, EF 352 (manufactured by Jamco), MEGAFACE F171, F173, R-30 (manufactured by Dainippon Ink Chemicals Co., Ltd.), FLORARD FC430, FC431 (Sumitomo 3M Chemicals) Industrial (stock) manufacturing), ASAHIGUARD AG710, SURFLON S-382, SC101, SC102, SC103, SC104, SC105, SC106 (made by Asahi Glass Co., Ltd.).

使用該界面活性劑時,其含量相對於形成畫像之下層膜塗佈液中所含之聚合物成分100質量份,較好為0.01至2質量份,更好為0.01至1質量份。When the surfactant is used, the content thereof is preferably 0.01 to 2 parts by mass, more preferably 0.01 to 1 part by mass, per 100 parts by mass of the polymer component contained in the layer coating liquid formed in the image forming layer.

[有關聚合物摻合物][Related polymer blends]

前述之形成畫像之下層膜塗佈液,除前述之聚醯亞胺前驅物或聚醯亞胺以外,亦可混合可形成膜之其他聚合物(例如高絕緣性聚合物),成為所謂聚合物摻合物之形態。The layer film coating liquid formed as described above may be mixed with other polymers (for example, highly insulating polymers) which can form a film in addition to the above-mentioned polyimide precursor or polyimine, and become a so-called polymer. The form of the blend.

該聚合物摻合物中,藉由適當調整含有之聚合物(前述之聚醯亞胺前驅物、聚醯亞胺及其他聚合物)之構造等,可於形成畫像用下層膜形成時可於膜內厚度方向產生聚合物之濃度梯度,故可利用作為有用之手段。In the polymer blend, by appropriately adjusting the structure of the polymer (the polyimine precursor, the polyimine, and other polymers described above), it is possible to form an underlayer film for forming an image. The concentration gradient of the polymer in the thickness direction of the film can be utilized as a useful means.

例如,為了主要在膜表面引起親疏水性之變化,就該觀點而言,只要僅在形成畫像用下層膜之上層(表面層)上存在有前述之於側鏈具有硫醇酯鍵之聚醯亞胺前驅物及/或聚醯亞胺即可。For example, in order to cause a change in the hydrophobicity of the film mainly on the surface of the film, as far as this is concerned, as long as the above-mentioned layer (surface layer) of the underlayer film for forming an image is present, the aforementioned polyamido having a thiol bond in the side chain exists. The amine precursor and/or polyimine can be used.

因此,使前述形成畫像之下層膜塗佈液設為聚合物摻合物之形態(以下將該形態之塗佈液稱為摻合物塗佈液)時,前述聚醯亞胺前驅物或聚醯亞胺之調配比例在該摻合物塗佈液之固體成分中為1質量%至100質量%。若為1質量%以下時,於膜上形成該摻合物塗佈液時難以完全覆蓋膜之最表面,而有形成畫像之能力劣化之虞。Therefore, when the film formation liquid under the formation of the image forming film is in the form of a polymer blend (hereinafter, the coating liquid of the form is referred to as a blend coating liquid), the polyimine precursor or the poly The blending ratio of the quinone imine is 1% by mass to 100% by mass in the solid content of the blend coating liquid. When it is 1% by mass or less, it is difficult to completely cover the outermost surface of the film when the blend coating liquid is formed on the film, and the ability to form an image is deteriorated.

上述聚合物摻合物成為有用者可列舉為例如要求特別高絕緣性之閘極絕緣膜用途中使用前述形成畫像之下層膜塗佈液之情況。The polymer blend is useful, for example, in the case of using a gate coating liquid for forming an image under the use of a gate insulating film which requires particularly high insulating properties.

用於閘極絕緣膜用途時,該塗佈液被要求有對應於180℃以下之燒成溫度、可藉由塗佈成膜、對於有機半導體塗佈液之耐溶劑性(二甲苯、三甲基苯等極性溶劑)、低吸水率等之各種特性,但關於絕緣性之要求性能特別高。為達成此高絕緣性,前述之形成畫像之下層膜塗佈液之醯亞胺化率至少為80%以上,依據情況有時亦要求90%以上,但相反地,醯亞胺化率超過90%以上時會喪失溶劑溶解性。此時,藉由僅使高絕緣性之層位在該絕緣膜之最下層,由前述之形成畫像之下層膜塗佈液所構成之層為在上層,可保有該絕緣膜之高絕緣性,且亦可消除溶解性問題。When it is used for a gate insulating film, the coating liquid is required to have a firing temperature corresponding to 180 ° C or lower, can be formed into a film by coating, and is solvent resistant to an organic semiconductor coating liquid (xylene, top three Various properties such as a polar solvent such as benzene and a low water absorption rate, but the performance required for insulation is particularly high. In order to achieve such high insulation properties, the imidization ratio of the film coating liquid formed under the above-mentioned image formation is at least 80% or more, and may be required to be 90% or more depending on the case, but conversely, the imidization ratio exceeds 90%. Solubility is lost when it is above %. In this case, by providing only a layer having a high insulating property in the lowermost layer of the insulating film, the layer formed by the layer coating liquid under the image formation described above is in the upper layer, and the insulating property of the insulating film can be maintained. It also eliminates solubility problems.

如上述,為了使形成畫像用下層膜之下層成為高絕緣層,上層為親疏水性變換層,亦可將該等層依序層合製作,但操作相當繁雜。As described above, in order to form the lower layer of the lower layer film for forming an image as a high insulating layer, and the upper layer is a hydrophilic/hydrophobic conversion layer, the layers may be laminated in this order, but the operation is rather complicated.

此時,將高絕緣層之材料與親疏水性變換層之材料(亦即前述之聚醯亞胺前驅物及/或聚醯亞胺)混合,此時,若使上層材料之極性或分子量比下層者小,則將混合物塗佈於基板上並經乾燥使溶劑蒸發之過程中,由於顯示上層材料移行至表面而形成層之舉動,故可輕易地控制上述濃度梯度(此處稱為層分離)。At this time, the material of the high insulating layer is mixed with the material of the hydrophilic-hydrophobic conversion layer (that is, the aforementioned polyimide precursor and/or polyimine), and at this time, if the polarity or molecular weight of the upper material is lower than the lower layer If the mixture is coated on a substrate and dried to evaporate the solvent, the above-mentioned concentration gradient (herein referred to as layer separation) can be easily controlled by the action of forming the layer by moving the upper layer material to the surface. .

可形成前述下層之高絕緣性膜之形成材料最佳者為可溶性聚醯亞胺。使用可溶性聚醯亞胺作為下層材料時,就絕緣性之觀點而言,以溶液中之聚醯亞胺之醯亞胺化率高者較佳,至少為50%以上,較好為80%以上,最好為90%以上。The material for forming the high insulating film of the lower layer described above is preferably a soluble polyimine. When the soluble polyimine is used as the underlayer material, the imidization ratio of the polyimine in the solution is preferably from the viewpoint of the insulating property, and is preferably at least 50% or more, preferably 80% or more. , preferably 90% or more.

可作為下層材料使用之其他材料列舉為環氧樹脂、丙烯酸樹脂、聚丙烯、聚乙烯醇、聚乙烯酚、聚異丁烯、聚甲基丙烯酸甲酯等之一般有機聚合物。Other materials which can be used as the underlayer material are exemplified by general organic polymers such as epoxy resin, acrylic resin, polypropylene, polyvinyl alcohol, polyvinyl phenol, polyisobutylene, polymethyl methacrylate and the like.

至於較佳之可溶性聚醯亞胺列舉為由選自由式(16)之構造所構成群組之一種或複數種之構造所構成之可溶性聚醯亞胺。The preferred soluble polyimine is exemplified by a soluble polyimine consisting of one or a plurality of structures selected from the group consisting of the structures of formula (16).

(式中A表示脂肪族環或僅由脂肪族所構成之4價有機基,D表示2價有機基)。(In the formula, A represents an aliphatic ring or a tetravalent organic group composed only of an aliphatic group, and D represents a divalent organic group).

前述可溶性聚醯亞胺之分子量宜使用聚乙二醇(或聚環氧乙烷)換算之重量平均分子量(以GPC測定之結果)較好為2,000至200,000,更好為5,000至50,000者。The molecular weight of the above-mentioned soluble polyimine is preferably from 2,000 to 200,000, more preferably from 5,000 to 50,000, by weight average molecular weight (result as measured by GPC) in terms of polyethylene glycol (or polyethylene oxide).

式(16)中,A之具體例列舉為選自A-1至A-25之4價有機基,D之具體例列舉為D-1至D-57。其中,就使可溶性聚醯亞胺具有高溶解性之觀點而言,最好A之構造為A-5、A-6、A-16、A-18、A-19、A-20、A-21、A-22、A-25之4價有機基,D之構造為D-7、D-8、D-9、D-12、D-19、D-20、D-22、D-29、D-39、D-41、D-42之2價有機基。In the formula (16), specific examples of A are exemplified by a tetravalent organic group selected from A-1 to A-25, and specific examples of D are exemplified as D-1 to D-57. Among them, from the viewpoint of making the soluble polyimine having high solubility, it is preferable that the structure of A is A-5, A-6, A-16, A-18, A-19, A-20, A- 21, A-22, A-25 four-valent organic group, D is constructed as D-7, D-8, D-9, D-12, D-19, D-20, D-22, D-29 , a divalent organic group of D-39, D-41, and D-42.

該等可溶性聚醯亞胺可單獨使用亦可組合複數種使用。These soluble polyimines may be used singly or in combination of plural kinds.

又,上述聚合物摻合物使用於例如要求膜厚400nm左右之有機電晶體用途時,設置上層(親疏水性變換層)所必要之前述聚醯亞胺前驅物及/或聚醯亞胺在該聚合物摻合物中之含有比例為1質量%以上即可。過少時形成畫像用之下層膜表面物性之面內有偏差較大之情況。較好為5質量%以上。Further, when the polymer blend is used, for example, in an organic transistor having a film thickness of about 400 nm, the polyimine precursor and/or polyimine which are necessary for providing an upper layer (hydrophobic cross-linking layer) is used. The content ratio in the polymer blend may be 1% by mass or more. When there is too little, there is a case where there is a large variation in the surface properties of the underlying film for the image. It is preferably 5% by mass or more.

[塗膜及形成畫像用下層膜之製造方法][Method for Producing Underlayer Film for Coating Film and Forming Image]

以浸漬法、旋轉塗佈法、轉印印刷法、輥塗佈法、噴墨法、噴佈法、刷毛塗佈等,將前述之形成畫像之下層膜塗佈液塗佈於聚丙烯、聚乙烯、聚碳酸酯、聚對苯二甲酸乙二酯、聚醚碸、聚萘二甲酸乙二酯、聚醯亞胺等廣泛使用之塑膠基板或玻璃基板等之上,隨後,以加熱板或烘箱等預乾燥,藉此形成塗膜。隨後藉由使該塗膜進行加熱處理,形成可作為形成畫像用下層膜或絕緣膜使用之形成畫像用下層膜。Applying the above-mentioned image forming film under the image forming method to polypropylene, poly by a dipping method, a spin coating method, a transfer printing method, a roll coating method, an inkjet method, a spray coating method, a brush coating method, or the like. On the plastic substrate or glass substrate, etc., which are widely used, such as ethylene, polycarbonate, polyethylene terephthalate, polyether oxime, polyethylene naphthalate, polyimine, etc., followed by a hot plate or An oven or the like is pre-dried to form a coating film. Then, the coating film is subjected to a heat treatment to form an underlayer film for forming an image which can be used as an underlayer film or an insulating film for forming an image.

上述加熱處理方法並無特別限制,可例示為使用加熱板或烘箱,在適當氛圍氣體中,亦即大氣、氮氣等惰性氣體、真空等中進行之方法。The heat treatment method is not particularly limited, and can be exemplified by a method using a hot plate or an oven in an atmosphere of an appropriate atmosphere, that is, an inert gas such as air or nitrogen, or a vacuum.

燒成溫度就促進聚醯亞胺前驅物之熱醯亞胺之觀點而言,較好為180℃至250℃,由在塑膠基板上成膜之觀點而言更好為180℃以下。The firing temperature is preferably from 180 ° C to 250 ° C from the viewpoint of promoting the thermal imine of the polyimide precursor, and is preferably 180 ° C or less from the viewpoint of film formation on a plastic substrate.

燒成亦可使用兩階段以上之溫度變化。階段性燒成可更提高所得膜之均勻性。It is also possible to use a temperature change of two or more stages for firing. The staged firing can further improve the uniformity of the resulting film.

又製作形成畫像用下層膜時,形成畫像之下層膜塗佈液由於為包含聚醯亞胺前驅物及/或聚醯亞胺及上述溶劑之形態,故可直接用於基板之塗佈,但為了調整濃度,或確保塗膜之平坦性,或提高塗佈液對基板之潤濕性、塗佈液之表面張力、極性、沸點之調整等之目的,亦可添加上述溶劑、額外之其他各種溶劑作為塗佈液使用。When the underlayer film for forming an image is formed, the film coating liquid under the image formation can be directly used for coating the substrate because it is in the form of a polyimide precursor and/or a polyimide and the solvent. In order to adjust the concentration, or to ensure the flatness of the coating film, or to improve the wettability of the coating liquid to the substrate, the surface tension of the coating liquid, the polarity, and the boiling point, etc., the above solvent may be added, and various other various substances may be added. The solvent is used as a coating liquid.

該等溶劑之具體例,除上述說明書第29頁第一段所述之溶劑以外,可列舉有乙基溶纖素、丁基溶纖素、乙基卡必醇、丁基卡必醇、乙基卡必醇乙酸酯、乙二醇等,1-甲氧基-2-丙醇、1-乙氧基-2-丙醇、1-丁氧基-2-丙醇、1-苯氧基-2-丙醇、丙二醇單乙酸酯、丙二醇二乙酸酯、丙二醇-1-單甲基醚-2-乙酸酯、丙二醇-1-單乙基醚-2-乙酸酯、二丙二醇、2-(2-甲氧基丙氧基)丙醇、2-(2-乙氧基丙氧基)丙醇及2-(2-丁氧基丙氧基)丙醇等丙二醇衍生物,乳酸甲酯、乳酸乙酯、乳酸正丙酯、乳酸正丁酯、乳酸異戊酯等乳酸衍生物等。該等可單獨使用亦可倂用。Specific examples of such solvents include, in addition to the solvent described in the first paragraph of the above-mentioned specification, ethyl cellosolve, butyl cellosolve, ethyl carbitol, butyl carbitol, ethyl card. Alcohol acetate, ethylene glycol, etc., 1-methoxy-2-propanol, 1-ethoxy-2-propanol, 1-butoxy-2-propanol, 1-phenoxy- 2-propanol, propylene glycol monoacetate, propylene glycol diacetate, propylene glycol-1-monomethyl ether-2-acetate, propylene glycol-1-monoethyl ether-2-acetate, dipropylene glycol, Propylene glycol derivatives such as 2-(2-methoxypropoxy)propanol, 2-(2-ethoxypropoxy)propanol and 2-(2-butoxypropoxy)propanol, lactic acid A lactic acid derivative such as methyl ester, ethyl lactate, n-propyl lactate, n-butyl lactate or isoamyl lactate. These can be used alone or in combination.

又,就提高塗佈液之保存性、塗膜之膜厚均勻性之觀點,較好全部溶劑量之20至80質量%係選自N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、γ-丁內酯、二甲基亞碸之至少一種溶劑。Further, from the viewpoint of improving the preservability of the coating liquid and the uniformity of the film thickness of the coating film, it is preferred that 20 to 80% by mass of the total amount of the solvent is selected from N,N-dimethylformamide, N,N- At least one solvent of dimethylacetamide, N-methyl-2-pyrrolidone, γ-butyrolactone, dimethyl hydrazine.

塗佈液之濃度並無特別限制,但聚醯亞胺前驅物及聚醯亞胺之固成分濃度較好為0.1至30質量%,更好為1至10質量%。該等可藉由塗佈裝置之規格或所得膜厚任意設定。The concentration of the coating liquid is not particularly limited, but the solid concentration of the polyimine precursor and the polyimine is preferably from 0.1 to 30% by mass, more preferably from 1 to 10% by mass. These can be arbitrarily set by the specification of the coating apparatus or the obtained film thickness.

如上述製作之本發明之形成畫像用下層膜使用作為形成畫像用下層膜時,若膜厚太薄則經紫外線照射後之圖型化性降低,又若太厚則將損及表面均勻性。據此,其膜厚較好為5nm至1000nm,更好為10nm至300nm,最好為20nm至100nm。When the underlayer film for forming an image of the present invention produced as described above is used as a lower layer film for forming an image, if the film thickness is too thin, the patterning property after ultraviolet irradiation is lowered, and if it is too thick, the surface uniformity is impaired. Accordingly, the film thickness thereof is preferably from 5 nm to 1000 nm, more preferably from 10 nm to 300 nm, still more preferably from 20 nm to 100 nm.

另外,本發明之形成畫像用下層膜在絕緣性充分高之情況下亦可作為絕緣膜發揮機能。該情況下,該形成畫像用下層膜在例如有機FET元件中,係直接配置在閘極電極上作為閘極絕緣膜使用。此時,該形成畫像用下層膜之膜厚為了確保絕緣性,較好比作為上述形成畫像用下層膜使用時更厚。其膜厚較好為20nm至1000nm,更好為50nm至800nm,最好為100nm至500nm。Further, the underlayer film for forming an image of the present invention can also function as an insulating film when the insulating property is sufficiently high. In this case, the underlayer film for forming an image is used as a gate insulating film directly on the gate electrode, for example, in an organic FET device. In this case, in order to secure the insulating property, the film thickness of the underlayer film for forming an image is preferably thicker than when it is used as the underlayer film for forming the image. The film thickness thereof is preferably from 20 nm to 1000 nm, more preferably from 50 nm to 800 nm, most preferably from 100 nm to 500 nm.

[形成畫像用電極之製造方法][Method of Manufacturing Electrode for Forming Image]

對本發明之形成畫像用下層膜以圖型狀照射紫外線,接著,藉由塗佈後述之畫像形成液,可製造形成畫像用電極。The underlayer film for forming an image of the present invention is irradiated with ultraviolet rays in a pattern, and then an image forming electrode is produced by applying an image forming liquid described later.

本發明中,對上述形成畫像用下層膜以圖型狀照射紫外線之方法並無特別限制,列舉為例如透過描繪有電極圖型之遮罩進行照射之方法,使用雷射光描繪電極圖型之方法等。In the present invention, the method of irradiating the lower layer film for forming an image into a pattern is not particularly limited, and for example, a method of irradiating with a mask in which an electrode pattern is drawn, and a method of drawing an electrode pattern using laser light is exemplified. Wait.

上述遮罩之材質或形狀並無特別限制,只要使電極必要之區域透過紫外線,其以外之區域不透過紫外線即可。The material or shape of the mask is not particularly limited as long as the region necessary for the electrode is transmitted through the ultraviolet ray, and the region other than the ultraviolet ray is not transmitted.

此時,所用紫外線之波長通常為200nm至500nm之範圍,較好選擇符合使用之形成畫像用下層膜之種類之適宜紫外線波長。具體而言列舉為248nm、254nm、303nm、313nm、365nm等波長。最好為248nm、254nm。In this case, the wavelength of the ultraviolet light to be used is usually in the range of 200 nm to 500 nm, and it is preferred to select a suitable ultraviolet wavelength which is suitable for the type of the underlayer film for forming an image to be used. Specifically, wavelengths of 248 nm, 254 nm, 303 nm, 313 nm, and 365 nm are exemplified. It is preferably 248 nm or 254 nm.

本發明之形成畫像用下層膜係藉由紫外線照射使其表面能量緩慢上升,成為充分照射量同時飽和。該表面能量之上升導致畫像形成液之接觸角降低,結果提高紫外線照射部之畫像形成液之潤濕性。In the formation image of the present invention, the surface energy of the underlayer film is gradually increased by ultraviolet irradiation, and the irradiation amount is sufficiently saturated. The increase in the surface energy causes a decrease in the contact angle of the image forming liquid, and as a result, the wettability of the image forming liquid in the ultraviolet ray irradiation portion is improved.

據此,在經紫外線照射後之本發明形成畫像用下層膜上塗佈畫像形成液時,沿著於形成畫像用下層膜上以表面能量差所描繪之圖型形狀,畫像形成液形成自我組織之圖型,可獲得任意圖型形狀之電極。According to this, when the image forming liquid is applied onto the underlayer film for forming an image of the present invention after ultraviolet irradiation, the image forming liquid forms a self-organization along the pattern shape drawn by the surface energy difference on the underlying film for forming the image. With the pattern, an electrode of any shape can be obtained.

據此,對形成畫像用下層膜之紫外線照射量有必要照射使畫像形成液之接觸角充分變化之量,但就能量效率與縮短製造步驟之時間等方面而言,較好為20J/cm2 以下,更好為10J/cm2 以下,最好為5J/cm2 以下。In this case, it is necessary to irradiate the amount of ultraviolet rays to form the lower layer film for image formation so that the contact angle of the image forming liquid is sufficiently changed. However, in terms of energy efficiency and time for shortening the production step, it is preferably 20 J/cm 2 . Hereinafter, it is more preferably 10 J/cm 2 or less, and most preferably 5 J/cm 2 or less.

又,形成畫像用下層膜之紫外線照射部與未照射部之畫像形成液之接觸角差異愈大愈容易圖型化,使電極加工成複雜之圖型或細微之圖型成為可能。因此,由紫外線照射引起之接觸角變化量較好為5°以上,更好為10°以上,最好為20°以上。Further, the larger the difference in the contact angle between the ultraviolet ray irradiation portion forming the lower layer film for the image and the image forming liquid in the non-irradiation portion, the easier the pattern is formed, and the electrode can be processed into a complicated pattern or a fine pattern. Therefore, the amount of change in the contact angle by ultraviolet irradiation is preferably 5 or more, more preferably 10 or more, and most preferably 20 or more.

基於同樣理由,較好畫像形成液之接觸角在紫外線未照射部為30°以上,在紫外線照射部為20°以下。For the same reason, the contact angle of the preferred image forming liquid is 30° or more in the ultraviolet non-irradiated portion and 20° or less in the ultraviolet irradiation portion.

又目前,由於畫像形成液之溶劑大多使用水,故對下層膜之性能評價,亦可簡易地以水之接觸角變化量代替前述畫像形成液接觸角之變化量進行評價。At present, since water is often used as the solvent for the image forming liquid, the performance evaluation of the underlayer film can be easily evaluated by changing the amount of change in the contact angle of the image forming liquid in accordance with the amount of change in the contact angle of water.

本發明中所謂的畫像形成液為塗佈於基板上之後,藉由蒸發掉其中所含之溶劑,而可作為機能性薄膜使用之塗佈液,列舉為例如使電荷輸送性物質溶解或均勻分散於至少一種溶劑中而成者。此處,所謂電荷輸送性係與導電性同義,意指電洞輸送性、電子輸送性、電洞及電子之二電荷輸送性之任一種。The image forming liquid in the present invention is a coating liquid which can be used as a functional film by evaporating the solvent contained therein after being applied onto a substrate, and is, for example, dissolved or uniformly dispersed in a charge transporting substance. It is made up of at least one solvent. Here, the charge transport property is synonymous with conductivity, and means any one of hole transportability, electron transport property, and hole and electron charge transportability.

上述電荷輸送性物質只要具有可輸送電洞或電子之導電性即無特別限制。其實例列舉為例如金、銀、銅、鋁等金屬微粒子或碳黑、富勒烯類、碳奈米管等無機材料,或聚噻吩、聚苯胺、聚吡咯、聚茀及該等之衍生物等有機π共軛聚合物等。The charge transporting substance is not particularly limited as long as it has conductivity capable of transporting holes or electrons. Examples thereof are metal fine particles such as gold, silver, copper, aluminum, or inorganic materials such as carbon black, fullerenes, and carbon nanotubes, or polythiophenes, polyanilines, polypyrroles, polyfluorenes, and derivatives thereof. Such as organic π conjugated polymers and the like.

又,為了提高電荷輸送物質之電荷輸送能,亦可於畫像形成液中進一步添加鹵素、路易士酸、質子酸、過渡金屬化合物(具體例為Br2 、I2 、Cl2 、FeCl3 、MoCl5 、BF3 、AsF5 、SO3 、HNO3 、H2 SO4 、聚苯乙烯磺酸等)等之電荷接受性物質,或者鹼金屬、烷基銨離子(具體例為Li、Na、K、Cs、四伸乙基銨、四丁基銨等)等電荷供給物質作為摻雜物。Further, in order to increase the charge transporting ability of the charge transporting substance, a halogen, a Lewis acid, a protic acid, or a transition metal compound may be further added to the image forming liquid (specific examples are Br 2 , I 2 , Cl 2 , FeCl 3 , MoCl). 5 , charge accepting substances such as BF 3 , AsF 5 , SO 3 , HNO 3 , H 2 SO 4 , polystyrene sulfonate, etc., or alkali metal or alkylammonium ions (specific examples are Li, Na, K) A charge supply substance such as Cs, tetraethylammonium or tetrabutylammonium or the like is used as a dopant.

畫像形成液之溶劑只要是可使上述電荷輸送性物質或摻雜物溶解或均勻分散者即無限制。但,就獲得正確之電極圖型之觀點而言,較好對於形成畫像用下層膜之紫外線未照射部顯示足夠大之接觸角,且就對於本發明之形成畫像用下層膜之損害較少而言,較好為水或各種醇類。The solvent of the image forming liquid is not limited as long as it can dissolve or uniformly disperse the above-mentioned charge transporting substance or dopant. However, from the viewpoint of obtaining a correct electrode pattern, it is preferred to exhibit a sufficiently large contact angle with respect to the ultraviolet non-irradiated portion forming the underlayer film for image formation, and it is less harmful to the underlayer film for forming an image of the present invention. In other words, it is preferably water or various alcohols.

又,N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、2-吡咯啶酮、N-甲基-2-吡咯啶酮、N-乙基-2-吡咯啶酮、N-乙烯基-2-吡咯啶酮、N-甲基己內醯胺、二甲基亞碸、四甲基脲等極性溶劑對有機系電荷輸送性物質之溶解性亦優異,就對於形成畫像用下層膜之紫外線未照射部顯示足夠大之接觸角之觀點而言較佳,但該等較好在對本發明之形成畫像用下層膜之損壞最少之範圍內使用。Further, N,N-dimethylformamide, N,N-dimethylacetamide, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidine Polar solvents such as ketone, N-vinyl-2-pyrrolidone, N-methylcaprolactam, dimethyl hydrazine, and tetramethyl urea are also excellent in solubility in organic charge transporting substances. It is preferable from the viewpoint that the ultraviolet non-irradiated portion of the underlayer film is formed to have a sufficiently large contact angle, but these are preferably used in a range in which the damage of the underlayer film for forming an image of the present invention is minimized.

畫像形成液中之電荷輸送性物質之濃度較好為0.01至30質量%,更好為0.1至10質量%,最好為1至5質量%。The concentration of the charge transporting substance in the image forming liquid is preferably from 0.01 to 30% by mass, more preferably from 0.1 to 10% by mass, most preferably from 1 to 5% by mass.

本發明之畫像形成液之具體例列舉為Baytron(註冊商標)P(聚伸乙基二氧基噻吩,Bayer公司製造)等。Specific examples of the image forming liquid of the present invention include Baytron (registered trademark) P (polyethylidene dioxythiophene, manufactured by Bayer Co., Ltd.).

本發明之電極係將上述畫像形成液塗佈於本發明之形成畫像用下層膜上,形成圖型後,使溶劑蒸發而製作。溶劑之蒸發方法並無特別限制,但可使用加熱板或烘箱,在適當氛圍氣體中,亦即大氣、氮氣等惰性氣體、真空中等進行蒸發,獲得均勻之成膜面。In the electrode of the present invention, the image forming liquid is applied onto the underlayer film for forming an image of the present invention to form a pattern, and then a solvent is evaporated to produce the film. The evaporation method of the solvent is not particularly limited, but it can be evaporated by using a hot plate or an oven in an appropriate atmosphere, that is, an inert gas such as air or nitrogen, or a vacuum to obtain a uniform film formation surface.

蒸發溶劑之溫度並無特別限制,較好在40至250℃進行。就達成圖型形狀之維持及膜厚均勻性等之觀點而言,亦可利用兩階段以上之溫度變化。The temperature of the solvent to be evaporated is not particularly limited, and it is preferably carried out at 40 to 250 °C. From the viewpoint of maintaining the shape of the pattern and uniformity of the film thickness, it is also possible to use a temperature change of two or more stages.

由該畫像形成液作成之電極不僅可利用使用作為連接電子裝置彼此之配線,亦可利用作為電場效電晶體、雙極電晶體、各種二極體、各種感應器等電子裝置之電極等。The electrode formed of the image forming liquid can be used not only as a wiring for connecting electronic devices but also as an electrode for an electric device such as an electric field effect transistor, a bipolar transistor, various diodes, or various inductors.

本發明之電子裝置為具有上述本發明之電極者。The electronic device of the present invention is the electrode having the above-described present invention.

以下顯示於有機FET元件中使用本發明之形成畫像用下層膜之例,但本發明並不限於該等。The following is an example in which the underlayer film for forming an image of the present invention is used in an organic FET device, but the present invention is not limited to these.

首先準備高摻雜型n型矽基板。較好基板預先以洗劑、醇、純水等進行液體洗淨而淨化,在使用之前進行臭氧處理,氧-電漿處理等表面處理。以熱氧化、濺鍍、CVD、蒸鍍等方法將SiO2 、Ta2 O5 、Al2 O3 等成膜於基板上,形成閘極絕緣膜。閘極絕緣膜之膜厚隨有機FET之用途而不同,但就兼顧驅動電壓與電絕緣性而言,較好為30nm至1000nm之範圍。First, a highly doped n-type germanium substrate is prepared. Preferably, the substrate is preliminarily cleaned by washing with a lotion, alcohol, pure water or the like, and subjected to surface treatment such as ozone treatment or oxygen-plasma treatment before use. SiO 2 , Ta 2 O 5 , Al 2 O 3 or the like is formed on the substrate by thermal oxidation, sputtering, CVD, vapor deposition or the like to form a gate insulating film. The film thickness of the gate insulating film varies depending on the application of the organic FET, but it is preferably in the range of 30 nm to 1000 nm in terms of driving voltage and electrical insulating properties.

接著,於絕緣膜上依前述順序形成含有具有以前述通式(1)表示之重複構造之聚醯亞胺前驅物及/或聚醯亞胺之層。層之膜厚較好為20nm至100nm。隨後,使用欲獲得期望電極形狀之遮罩等照射紫外線。Next, a layer containing a polyimine precursor having a repeating structure represented by the above formula (1) and/or a polyimine is formed on the insulating film in the above-described order. The film thickness of the layer is preferably from 20 nm to 100 nm. Subsequently, ultraviolet rays are irradiated using a mask or the like for obtaining a desired electrode shape.

接著,將使用水等極性溶劑之畫像形成液塗佈於形成畫像用下層膜表面上。經塗佈之畫像形成液排斥疏水性部(紫外線未照射部)並加速擴展至親水性部(紫外線照射部)而安定化,使之乾燥,形成圖型化之源極及汲極電極。畫像形成液之塗佈法不特別限定於旋轉塗佈法、澆鑄法等,但較好為易控制液量之噴墨印刷法或噴佈塗佈法。Next, an image forming liquid using a polar solvent such as water is applied onto the surface of the underlayer film for forming an image. The applied image forming liquid repels the hydrophobic portion (ultraviolet-irradiated portion) and accelerates to the hydrophilic portion (ultraviolet irradiation portion) to be stabilized and dried to form a patterned source and a drain electrode. The coating method of the image forming liquid is not particularly limited to a spin coating method or a casting method, but is preferably an ink jet printing method or a spray coating method which is easy to control the amount of liquid.

最後,使有機FET之活性層的并五苯、聚烯烴等之有機半導體材料成膜而完成。有機半導體材料之成膜方法並未特別限制,但舉例有例如真空蒸鍍或使溶液旋轉塗佈法、澆鑄法、噴墨印刷法或噴佈塗佈法等。Finally, the organic semiconductor material such as pentacene or polyolefin of the active layer of the organic FET is formed into a film. The film formation method of the organic semiconductor material is not particularly limited, and examples thereof include vacuum evaporation, a solution spin coating method, a casting method, an inkjet printing method, and a spray coating method.

如此,所製作之有機FET可大幅削減製造步驟,再者可製作比遮罩蒸鍍法更短通道之有機FET,故於使用低移動度之有機半導體材料作為活性層時,亦可能取出大電流。又,由本發明方法所得之形成畫像用下層膜亦具有優異之電絕緣性,故亦可使用作為閘極絕緣層,製造步驟可更簡略化。In this way, the fabricated organic FET can greatly reduce the number of manufacturing steps, and an organic FET having a shorter channel than the mask vapor deposition method can be fabricated. Therefore, when a low mobility organic semiconductor material is used as the active layer, a large current may be taken out. . Further, since the underlayer film for forming an image obtained by the method of the present invention also has excellent electrical insulating properties, it can also be used as a gate insulating layer, and the manufacturing steps can be simplified.

[實施例][Examples]

以下以實施例更詳細說明本發明,但本發明並不受該等之限制。The invention is illustrated in more detail below by way of examples, but the invention is not limited thereto.

[數平均分子量及重量平均分子量之測定][Determination of number average molecular weight and weight average molecular weight]

依循以下合成例獲得之聚醯亞胺前驅物之數平均分子量(以下稱為Mn)及重量平均分子量(以下稱為Mw)係以GPC(常溫凝膠滲透層析儀),以下述裝置及測定條件測定,且以聚乙二醇(或聚環氧乙烷)換算值算出。The number average molecular weight (hereinafter referred to as Mn) and the weight average molecular weight (hereinafter referred to as Mw) of the polyimide precursor obtained by the following synthesis examples are GPC (normal temperature gel permeation chromatography), and the following apparatus and measurement were carried out. The conditions were measured and calculated based on the value of polyethylene glycol (or polyethylene oxide).

GPC裝置:昭和電工(股)製造之Shodex(註冊商標)(GPC-101)GPC device: Shodex (registered trademark) (GPC-101) manufactured by Showa Denko Electric Co., Ltd.

管柱:昭和電工(股)製造之Shodex(註冊商標)(KD803、KD805串聯)Pipe column: Shodex (registered trademark) manufactured by Showa Denko (share) (KD803, KD805 series)

管柱溫度:50℃Column temperature: 50 ° C

溶離液:N,N-二甲基甲醯胺Dissolution: N,N-dimethylformamide

(作為添加劑:溴化鋰-水合物(LiBr‧H2 O)30mmol/L,磷酸‧無水結晶(o-磷酸)30mmol/L,四氫呋喃(THF)10ml/L)(As an additive: lithium bromide-hydrate (LiBr‧H 2 O) 30 mmol/L, phosphoric acid ‧ anhydrous crystals (o-phosphoric acid) 30 mmol/L, tetrahydrofuran (THF) 10 ml/L)

流速:1.0ml/分鐘Flow rate: 1.0ml/min

檢量線作成用標準樣品:Standard sample for calibration line preparation:

TOSOH(股)製造之TSK標準聚環氧乙烷(分子量:約900,000、150,000、100,000、30,000)TSK standard polyethylene oxide manufactured by TOSOH (molecular weight: about 900,000, 150,000, 100,000, 30,000)

Polymer‧Laboratory公司製造之聚乙二醇(分子量:約12,000、4,000、1,000)Polyethylene glycol manufactured by Polymer ‧ Laboratory (molecular weight: about 12,000, 4,000, 1,000)

[膜厚測定][Measurement of film thickness]

聚醯亞胺膜之膜厚係以切割刀剝離膜之一部份,且使用全自動細微形狀測定機(ET4000A,小坂研究所(股)製造),測定力為10μN,掃描速度為0.05mm/秒測定其段差而求得。The film thickness of the polyimide film is a part of the peeling film of the dicing blade, and a fully automatic fine shape measuring machine (ET4000A, manufactured by Otaru Research Institute Co., Ltd.) is used, and the measuring force is 10 μN, and the scanning speed is 0.05 mm/ Determined by measuring the step difference in seconds.

[紫外線照射][UV irradiation]

紫外線係透過使以高壓水銀燈作為光源之波長254nm之光通過帶通濾波器照射在聚醯亞胺膜上。The ultraviolet ray was irradiated onto the polyimide film by a band pass filter using light having a wavelength of 254 nm using a high pressure mercury lamp as a light source.

又,於聚醯亞胺膜上曝光量之計算,係於照度計(OAI公司製造,MODEL306)上安裝於波長253.7nm具有高峰值感度之Deep UV用探針測定紫外線之照度。Further, the amount of exposure on the polyimide film was measured by an illuminometer (manufactured by OAI Co., Ltd., MODEL 306), and was attached to a Deep UV probe having a high peak sensitivity at a wavelength of 253.7 nm to measure the illuminance of the ultraviolet ray.

所得照度為45~50mW/cm2 。所得照度乘以曝光時間作為曝光量(J/cm2 )。The obtained illuminance is 45 to 50 mW/cm 2 . The obtained illuminance was multiplied by the exposure time as the exposure amount (J/cm 2 ).

[接觸角之測定][Measurement of contact angle]

接觸角之測定係在恆溫恆濕環境(25℃±2℃,50% RH±5%)中,使用全自動接觸角計CA-W(協和介面化學公司製造)測定。The contact angle was measured in a constant temperature and humidity environment (25 ° C ± 2 ° C, 50% RH ± 5%) using a fully automatic contact angle meter CA-W (manufactured by Kyowa Interface Chemical Co., Ltd.).

水之接觸角係由液量3μL,著液後靜止5秒後測定。The contact angle of water was measured by the amount of liquid 3 μL, and after standing for 5 seconds after liquid administration.

丙二醇單甲基醚(PGME)之接觸角係由液量3.0~3.5μL,著液後靜止5秒後測定。The contact angle of propylene glycol monomethyl ether (PGME) was measured by a liquid amount of 3.0 to 3.5 μL, and after standing for 5 seconds after liquid administration.

〈合成例〉<Synthesis Example> [合成例1:二胺化合物(DA-1:3,5-二胺基硫代苯甲酸十八烷酯)之合成][Synthesis Example 1: Synthesis of Diamine Compound (DA-1: Octadecyl 3,5-Diaminothiobenzoate)]

於氮氣氛圍下,使含化合物[ii](20.00g,69.79mmol)、三乙胺(8.07g,79.76mmol)之四氫呋喃(155g)溶液冷卻至10℃,且邊注意發熱邊滴加含化合物[i](15.33g,66.47mmol)之四氫呋喃(70g)溶液。滴加結束後,使反應溫度上升至23℃,再進行反應。以HPLC(高速液體層析)確認反應結束後,將反應液排空倒入蒸餾水(1.8L)中,過濾析出之固體,水洗後,以甲醇(192g)分散洗淨,獲得化合物[iii](產量:26.4g,產率:83%)。A solution of the compound [ii] (20.00 g, 69.79 mmol) and triethylamine (8.07 g, 79.76 mmol) in tetrahydrofuran (155 g) was cooled to 10 ° C under nitrogen atmosphere, and the compound was added dropwise while paying attention to heat. i] (15.33 g, 66.47 mmol) in tetrahydrofuran (70 g). After completion of the dropwise addition, the reaction temperature was raised to 23 ° C, and the reaction was further carried out. After confirming the completion of the reaction by HPLC (high-speed liquid chromatography), the reaction liquid was drained and poured into distilled water (1.8 L), and the precipitated solid was filtered, washed with water, and then washed with methanol (192 g) to obtain compound [iii] ( Yield: 26.4 g, yield: 83%).

1 H-NMR(400MHz,CDCl3 ,δppm):9.21-9.20(1H,m),9.07-9.06(2H,m),3.18(12H,t),1.73-1.67(2H,m),1.48-1.37(2H,m),1.23(28H,s),0.86(3H,t)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 9.21-9.20 (1H, m), 9.07-9.06 (2H, m), 3.18 (12H, t), 1.73-1.67 (2H, m), 1.48-1.37 (2H, m), 1.23 (28H, s), 0.86 (3H, t).

在氮氣氛圍下,將化合物[iii](19.95g,41.5mmol)、鐵粉(還原鐵,13.91g,249.0mmol)、乙酸乙酯(180g)之混合物加熱至70℃後,滴加氯化銨(6.66g,124.5mmol)之10%水溶液。以HPLC確認反應結束後,以矽藻土過濾過濾固體。以乙酸乙酯及蒸餾水各200mL洗淨後,去除水層,以蒸餾水(300mL)洗淨有機層3次。隨後,有機層以無水硫酸鎂乾燥,過濾後,餾除溶劑。以甲醇(104g)使所得化合物(DA-1)之粗產物再結晶,獲得化合物(DA-1)(產量:11.7g,產率:67%)。A mixture of the compound [iii] (19.95 g, 41.5 mmol), iron powder (reduced iron, 13.91 g, 249.0 mmol) and ethyl acetate (180 g) was heated to 70 ° C under a nitrogen atmosphere, and then ammonium chloride was added dropwise. (6.66 g, 124.5 mmol) of a 10% aqueous solution. After confirming the completion of the reaction by HPLC, the solid was filtered through Celite. After washing with 200 mL of each of ethyl acetate and distilled water, the aqueous layer was removed, and the organic layer was washed three times with distilled water (300 mL). Subsequently, the organic layer was dried over anhydrous magnesium sulfate, filtered, and then evaporated. The crude product of the obtained compound (DA-1) was recrystallized from methanol (104 g) to give Compound (DA-1) (yield: 11.7 g, yield: 67%).

1 H-NMR(400MHz,CDCl3 ,δppm):6.69(2H,dd),6.18(1H,t),3.69(4H,brs),3.00(2H,t),1.66-1.56(2H,m),1.42-1.25(30H,m),0.88(3H,t)。 1 H-NMR (400MHz, CDCl 3, δppm): 6.69 (2H, dd), 6.18 (1H, t), 3.69 (4H, brs), 3.00 (2H, t), 1.66-1.56 (2H, m), 1.42-1.25 (30H, m), 0.88 (3H, t).

[合成例2:聚醯亞胺前驅物(PI-1)之合成][Synthesis Example 2: Synthesis of Polyimine Precursor (PI-1)]

於氮氣流下,在50mL之四頸燒瓶中置入合成例1中調製之3,5-二胺基氧代苯甲酸十八烷酯(DA-1) 1.2621g(0.003mol),溶解於10.42g之N-甲基-2-吡咯啶酮(爾後稱為NMP)後,添加0.5766g(0.003mol)之1,2,3,4-環丁烷四羧酸酐(爾後稱為CBDA),使之在23℃攪拌10小時進行聚合反應,再以NMP稀釋,獲得聚醯亞胺前驅物(PI-1)之8質量%溶液。Under a nitrogen flow, 1.2621 g (0.003 mol) of 3,5-diaminooxybenzoic acid octadecyl ester (DA-1) prepared in Synthesis Example 1 was placed in a 50 mL four-necked flask, and dissolved in 10.42 g. After N-methyl-2-pyrrolidone (hereinafter referred to as NMP), 0.5766 g (0.003 mol) of 1,2,3,4-cyclobutanetetracarboxylic anhydride (hereinafter referred to as CBDA) was added thereto. The polymerization reaction was carried out by stirring at 23 ° C for 10 hours, and further diluted with NMP to obtain an 8 mass% solution of the polyimine precursor (PI-1).

所得聚醯亞胺前驅物(PI-1)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=11,650,Mw=28,380。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine precursor (PI-1) were Mn = 11,650 and Mw = 28,380, respectively.

[合成例3:聚醯亞胺前驅物(PI-2)之合成][Synthesis Example 3: Synthesis of Polyimine Precursor (PI-2)]

於氮氣流下,在50mL之四頸燒瓶中置入DA-10.8835g(0.0021mol)、對-苯二胺(p-PDA) 0.0973g(0.0009mol),溶解於8.83g之NMP後,添加0.5766g(0.00294mmol)之CBDA,使之在23℃下攪拌10小時進行聚合反應,再以NMP稀釋,獲得聚醯亞胺前驅物(PI-2)之6質量%溶液。Under a nitrogen flow, DA-10.8835g (0.0021mol) and p-phenylenediamine (p-PDA) 0.0973g (0.0009mol) were placed in a 50mL four-necked flask, dissolved in 8.83g of NMP, and 0.5766g was added. (0.00294 mmol) of CBDA was stirred at 23 ° C for 10 hours to carry out a polymerization reaction, and then diluted with NMP to obtain a 6 mass% solution of a polyimine precursor (PI-2).

所得聚醯亞胺前驅物(PI-2)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=34,670,Mw=97,560。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine precursor (PI-2) were Mn = 34,670 and Mw = 97,560, respectively.

[合成例4:聚醯亞胺前驅物(PI-3)之合成][Synthesis Example 4: Synthesis of Polyimine Precursor (PI-3)]

於氮氣流下,在200mL之四頸燒瓶中置入15.065g(0.040mol)之1-十八烷氧基-2,4-二胺基苯(APC18),溶解於127.6g之NMP後,添加7.45g(0.038mol)之CBDA,使之在23℃攪拌12小時進行聚合反應,再以NMP稀釋,獲得聚醯亞胺前驅物(PI-3)之6重量%溶液。Under a nitrogen flow, 15.065 g (0.040 mol) of 1-octadecyloxy-2,4-diaminobenzene (APC18) was placed in a 200 mL four-necked flask, and dissolved in 127.6 g of NMP, and 7.45 was added. g (0.038 mol) of CBDA was stirred at 23 ° C for 12 hours to carry out polymerization, and then diluted with NMP to obtain a 6 wt% solution of polyimine precursor (PI-3).

所得聚醯亞胺前驅物(PI-3)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=16,000,Mw=48,000。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine precursor (PI-3) were Mn = 16,000 and Mw = 48,000, respectively.

[合成例5:二胺化合物(DA-2)][Synthesis Example 5: Diamine Compound (DA-2)]

DA-2之合成Synthesis of DA-2

於氮氣氛圍下,在120℃攪拌含化合物[iv](42.63g,209.9mmok)、化合物[v](102.97g,230.9mmok)、銅粉(29.35g,461.8mmok)、2,2’-聯吡啶(3.28g,20.99mmol)、二甲基亞碸(341g)之混合物。以HPLC確認反應結束後,將反應液加於蒸餾水(2730g)中,過濾且以蒸餾水(2L)、乙酸乙酯(1.5L)洗淨過濾物。接著,於過濾液中添加己烷(500g),以飽和食鹽水(1L)洗淨有機層三次,以無水硫酸鎂乾燥。隨後,過濾、餾除溶劑,獲得化合物[vi](產量:75.33g,產率:81%)。1 H-NMR(400MHz,CDCl3 ,δppm):7.48(2H,d),7.32(2H,d),2.52(3H,s)。The compound [iv] (42.63 g, 209.9 mmok), compound [v] (102.97 g, 230.9 mmok), copper powder (29.35 g, 461.8 mmok), 2, 2'-linked were stirred at 120 ° C under a nitrogen atmosphere. A mixture of pyridine (3.28 g, 20.99 mmol) and dimethyl hydrazine (341 g). After confirming the completion of the reaction by HPLC, the reaction mixture was poured into distilled water (2730 g), filtered, and the filtrate was washed with distilled water (2 L) and ethyl acetate (1.5 L). Next, hexane (500 g) was added to the filtrate, and the organic layer was washed three times with saturated brine (1 L) and dried over anhydrous magnesium sulfate. Subsequently, the solvent was filtered and evaporated to give Compound [vi] (yield: 75.33 g, yield: 81%). 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.48 (2H, d), 7.32 (2H, d), 2.52 (3H, s).

在氮氣氛圍下,於含化合物[vi](52.00g,117.6mmol)之乙腈(347g)/純水(17g)溶液中添加N-氟-N’-(氯甲基)三乙二胺雙(四氟硼酸酯)(43.63g,123.2mmol),在23℃進行反應。以HPLC確認反應結束後,餾除溶劑。接著,添加二氯甲烷(1.2L),以少量添加飽和碳酸氫鈉水溶液(700mL)。去除水層後,以飽和食鹽水(700mL)洗淨有機層三次,有機層以無水硫酸鎂乾燥。隨後,過濾進行溶劑餾除,獲得化合物[vii](產量:48.05g,產率:89%)。N-Fluoro-N'-(chloromethyl)triethylenediamine bis (N-fluoro-N'-(chloromethyl)triethylenediamine bis(N) was added to a solution of compound [vi] (52.00 g, 117.6 mmol) in acetonitrile (347 g) / purified water (17 g). Tetrafluoroborate) (43.63 g, 123.2 mmol) was reacted at 23 °C. After confirming the completion of the reaction by HPLC, the solvent was distilled off. Next, dichloromethane (1.2 L) was added, and a saturated aqueous sodium hydrogencarbonate solution (700 mL) was added in small portions. After the aqueous layer was removed, the organic layer was washed three times with saturated brine (700 mL). Subsequently, the solvent was distilled off by filtration to obtain a compound [vii] (yield: 48.05 g, yield: 89%).

1 H-NMR(400MHz,CDCl3 ,δppm):7.81(2H,d),7.78(2H,d),2.71(3H,s)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.81 (2H, d), 7.78 (2H, d), 2.71 (3H, s).

在氮氣氛圍下,於化合物[vii](26.03g,56.8mmol)中添加乙酸酐(46.39g,454.4mmol),於加熱回流下進行反應。以HPLC確認反應結束後,餾除溶劑,獲得化合物[viii]之粗製產物。所得粗製產物以管柱層析儀(SiO2 ,己烷/乙酸乙酯)純化,獲得化合物[viii](產量:24.11g,產率:85%)。Acetic anhydride (46.39 g, 454.4 mmol) was added to the compound [vii] (26.03 g, 56.8 mmol) under a nitrogen atmosphere, and the reaction was carried out under reflux with heating. After confirming the completion of the reaction by HPLC, the solvent was distilled off to obtain a crude product of compound [viii]. The obtained crude product was purified by column chromatography (SiO 2 , hexane / ethyl acetate) to yield compound [viii] (yield: 24.11 g, yield: 85%).

1 H-NMR(400MHz,CDCl3 ,δppm):7.54(4H,s),5.50(2H,s),2.14(3H,s)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.54 (4H, s), 5.50 (2H, s), 2.14 (3H, s).

在氮氣氛圍下,於含化合物[viii](37.67g,75.3mmol)之甲醇(150g)溶液中添加28%之氨水溶液(13.73g),在23℃進行攪拌。以HPLC確認反應結束後,以35%鹽酸將pH調整成6後,餾除溶劑。隨後,使粗產物溶解於二氯甲烷(1L)後,以飽和食鹽水(500mL)洗淨三次,以無水硫酸鎂進行乾燥。隨後,過濾、餾除溶劑,獲得化合物[ix](產量:31.28g,產率:97%)。Under a nitrogen atmosphere, a 28% aqueous ammonia solution (13.73 g) was added to a solution of the compound [viii] (37.67 g, 75.3 mmol) in methanol (150 g), and stirred at 23 °C. After confirming the completion of the reaction by HPLC, the pH was adjusted to 6 with 35% hydrochloric acid, and then the solvent was evaporated. Subsequently, the crude product was dissolved in dichloromethane (1 L), washed three times with saturated brine (500 mL) and dried over anhydrous magnesium sulfate. Subsequently, the solvent was filtered and evaporated to give Compound [ ix] (yield: 31.28 g, yield: 97%).

1 H-NMR(400MHz,CDCl3 ,δppm):7.44(2H,d),7.37(2H,d),3.61(1H,s)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.44 (2H, d), 7.37 (2H, d), 3.61 (1H, s).

於氮氣氛圍下,使含化合物[ix](31.00g,72.4mmol)、三乙胺(7.33g,72.4mmol)之四氫呋喃(139g)溶液冷卻至10℃以下,且邊注意發熱邊滴加含化合物[i](15.90g,68.95mmol)之四氫呋喃(100g)溶液。滴加結束後,反應溫度上升至23℃,再進行反應。以HPLC確認反應結束後,將反應液倒入蒸餾水(1.9L)中,過濾析出之固體,水洗後,自2-丙醇(257g)再結晶,獲得化合物[x](產量:27.01g,產率:63%)。The solution containing the compound [ix] (31.00 g, 72.4 mmol) and triethylamine (7.33 g, 72.4 mmol) in tetrahydrofuran (139 g) was cooled to below 10 ° C under nitrogen atmosphere, and the compound was added dropwise while paying attention to heat. [i] (15.90 g, 68.95 mmol) in tetrahydrofuran (100 g). After the completion of the dropwise addition, the reaction temperature was raised to 23 ° C, and the reaction was further carried out. After confirming the completion of the reaction by HPLC, the reaction mixture was poured into distilled water (1.9 L), and the precipitated solid was filtered, washed with water and then recrystallized from 2-propanol (257 g) to give compound [x] (yield: 27.01 g, yield. Rate: 63%).

1 H-NMR(400MHz,CDCl3 ,δppm):9.30(1H,t),9.15(2H,d),7.74(4H,q)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 9.30 (1H, t), 9.15 (2H, d), 7.74 (4H, q).

在氮氣氛圍下,於氫存在下,於23℃攪拌含化合物[x](14.00g,22.5mmol)、3%鉑-碳(擔持0.3%鐵,含水,2.8g,20wt%)、甲醇(210g)之混合物。以HPLC確認反應結束後,以矽藻土過濾反應混合物,以甲醇(50mL)洗淨矽藻土,且進行溶劑餾除。以2-丙醇(60g)分散洗淨所得化合物(DA-2)之粗產物,進行過濾、乾燥,獲得化合物(DA-2)(產量:9.13g,產率:72%)。The compound [x] (14.00 g, 22.5 mmol), 3% platinum-carbon (supporting 0.3% iron, water, 2.8 g, 20 wt%), methanol (hydrogen) was stirred at 23 ° C in the presence of hydrogen under a nitrogen atmosphere. A mixture of 210 g). After confirming the completion of the reaction by HPLC, the reaction mixture was filtered over celite, and the celite was washed with methanol (50 mL), and the solvent was distilled off. The crude product of the obtained compound (DA-2) was washed with 2-propanol (60 g), and filtered and dried to give Compound (DA-2) (yield: 9.13 g, yield: 72%).

1 H-NMR(400MHz,CDCl3 ,δppm):7.65(4H,s),6.73(2H,d),6.24(1H,t),3.76(4H,brs)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.65 (4H, s), 6.73 (2H, d), 6.24 (1H, t), 3.76 (4H, brs).

[合成例6:二胺化合物(DA-3)][Synthesis Example 6: Diamine Compound (DA-3)]

DA-3之合成Synthesis of DA-3

於氮氣氛圍下,在120℃攪拌含化合物[iv](27.05g,133.2mmol)、化合物[xi](80.00g,146.5mmol)、銅粉(18.62g,293.0mmol)、2,2’-聯吡啶(2.08g,13.32mmol)、二甲基亞碸(216g)之混合物。以HPLC確認反應結束後,將反應液加於蒸餾水(1730g)中,經過濾且以蒸餾水(1L)、乙酸乙酯(1L)洗淨過濾物。接著,於過濾液中添加己烷(500g),以飽和食鹽水(1L)洗淨有機層三次,以無水硫酸鎂乾燥。隨後,經過濾、餾除溶劑,獲得化合物[xii](產量:65.72g,產率:91%)。The compound [iv] (27.05 g, 133.2 mmol), the compound [xi] (80.00 g, 146.5 mmol), copper powder (18.62 g, 293.0 mmol), 2, 2'-linked were stirred at 120 ° C under a nitrogen atmosphere. A mixture of pyridine (2.08 g, 13.32 mmol) and dimethyl hydrazine (216 g). After confirming the completion of the reaction by HPLC, the reaction mixture was poured into distilled water (1730 g), filtered, and the filtrate was washed with distilled water (1 L) and ethyl acetate (1 L). Next, hexane (500 g) was added to the filtrate, and the organic layer was washed three times with saturated brine (1 L) and dried over anhydrous magnesium sulfate. Subsequently, the solvent was filtered off, and the compound [xii] (yield: 65.72 g, yield: 91%) was obtained.

1 H-NMR(400MHz,CDCl3 ,δppm):7.58(2H,d),7.47(2H,d),2.54(3H,s)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.58 (2H, d), 7.47 (2H, d), 2.54 (3H, s).

在氮氣氛圍下,於含化合物[xii](50.00g,92.21mmol)之乙腈(333g)/純水(17g)溶液中添加N-氟-N’-(氯甲基)三乙二胺雙(四氟硼酸酯)(32.67g,92.21mmol),在23℃進行反應。以HPLC確認反應結束後,餾除溶劑。接著,添加二氯甲烷(800mL),以少量添加飽和碳酸氫鈉水溶液(500mL)。去除水層後,以飽和食鹽水(500mL)洗淨有機層三次,有機層以無水硫酸鎂乾燥。隨後,經過濾進行溶劑餾除,獲得化合物[xiii](產量:47.98g,產率:93%)。N-Fluoro-N'-(chloromethyl)triethylenediamine bis (by a solution of the compound [xii] (50.00 g, 92.21 mmol) in acetonitrile (333 g) / purified water (17 g) Tetrafluoroborate) (32.67 g, 92.21 mmol) was reacted at 23 °C. After confirming the completion of the reaction by HPLC, the solvent was distilled off. Next, dichloromethane (800 mL) was added, and a saturated aqueous sodium hydrogencarbonate solution (500 mL) was added in small portions. After the aqueous layer was removed, the organic layer was washed three times with brine (500 mL) Subsequently, solvent distillation was carried out by filtration to obtain a compound [xiii] (yield: 47.98 g, yield: 93%).

1 H-NMR(400MHz,CDCl3 ,δppm):7.81(2H,d),7.77(2H,d),2.78(3H,s)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.81 (2H, d), 7.77 (2H, d), 2.78 (3H, s).

在氮氣氛圍下,於化合物[xiii](70.63g,126.5mmol)中添加三氟乙酸酐(220.56g,1.05mol),於加熱回流下進行反應。以HPLC確認反應結束後,餾除溶劑,獲得粗產物。接著,添加甲醇(226g)及三乙胺(211.89g),在23℃攪拌30分鐘後,進行溶劑之餾除。接著,以乙酸乙酯(1L)使所得粗產物溶解後,以飽和氯化銨水溶液(1L)、飽和食鹽水(1L)洗淨兩次後,有機層以硫酸鎂乾燥,餾除溶劑,獲得化合物[xiv](產量:64.7g,產率:97%)。Trifluoroacetic anhydride (220.56 g, 1.05 mol) was added to the compound [xiii] (70.63 g, 126.5 mmol) under a nitrogen atmosphere, and the reaction was carried out under reflux with heating. After confirming the completion of the reaction by HPLC, the solvent was evaporated to give a crude product. Next, methanol (226 g) and triethylamine (211.89 g) were added, and the mixture was stirred at 23 ° C for 30 minutes, and then the solvent was distilled off. Next, the obtained crude product was dissolved in ethyl acetate (1 L), and the mixture was washed twice with saturated aqueous ammonium chloride (1 L) and brine (1L). Compound [xiv] (yield: 64.7 g, yield: 97%).

1 H-NMR(400MHz,CDCl3 ,δppm):7.44(2H,d),7.36(2H,d),3.61(1H,s)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.44 (2H, d), 7.36 (2H, d), 3.61 (1H, s).

於氮氣氛圍下,使含化合物[xiv](69.00g,130.62mmol)、三乙胺(13.22g,130.62mmol)之四氫呋喃(290g)溶液冷卻至10℃以下,邊注意發熱邊滴加含化合物[i](28.68g,124.40mmol)之四氫呋喃(145g)溶液。滴加結束後,反應溫度上升至23℃,再進行反應。以HPLC確認反應結束後,將反應液倒入蒸餾水(3.5L)中,過濾析出之固體,經水洗後,自2-丙醇(270g)再結晶,獲得化合物[xv](產量:77.99g,產率:88%)。The solution containing the compound [xiv] (69.00 g, 130.62 mmol) and triethylamine (13.22 g, 130.62 mmol) in tetrahydrofuran (290 g) was cooled to below 10 ° C under nitrogen atmosphere, and the compound was added dropwise while taking care of the heat. i] (28.68 g, 124.40 mmol) in tetrahydrofuran (145 g). After the completion of the dropwise addition, the reaction temperature was raised to 23 ° C, and the reaction was further carried out. After confirming the completion of the reaction by HPLC, the reaction mixture was poured into distilled water (3.5 L), and the precipitated solid was filtered, washed with water and then recrystallized from 2-propanol (270 g) to obtain compound [xv] (yield: 77.99 g, Yield: 88%).

1 H-NMR(400MHz,CDCl3 ,δppm):9.27(1H,t),9.17(2H,d),7.61(4H,q)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 9.27 (1H, t), 9.17 (2H, d), 7.61 (4H, q).

在氮氣氛圍下,於氫存在下,於23℃攪拌含化合物[xvii](8.00g,11.1mmol)、3%鉑-碳(擔持0.3%鐵,含水,1.6g,20wt%)、甲醇(120g)之混合物。以HPLC確認反應結束後,以矽藻土過濾反應混合物,以甲醇(30mL)洗淨矽藻土,且進行溶劑餾除。以2-丙醇(28g)分散洗淨所得化合物(DA-3)之粗產物,並進行過濾、乾燥,獲得化合物(DA-3)(產量:5.6g,產率:76%)。The compound [xvii] (8.00 g, 11.1 mmol), 3% platinum-carbon (supporting 0.3% iron, water, 1.6 g, 20 wt%), methanol (supported under stirring in a hydrogen atmosphere at 23 ° C in a nitrogen atmosphere) a mixture of 120 g). After confirming the completion of the reaction by HPLC, the reaction mixture was filtered over celite, and the celite was washed with methanol (30 mL), and the solvent was distilled off. The crude product of the obtained compound (DA-3) was washed with 2-propanol (28 g), and filtered and dried to give Compound (DA-3) (yield: 5.6 g, yield: 76%).

1 H-NMR(400MHz,CDCl3 ,δppm):7.65(4H,s),6.73(2H,d),6.24(1H,t),3.76(4H,brs)。 1 H-NMR (400 MHz, CDCl 3 , δ ppm): 7.65 (4H, s), 6.73 (2H, d), 6.24 (1H, t), 3.76 (4H, brs).

[合成例7:二胺化合物(DA-4)][Synthesis Example 7: Diamine Compound (DA-4)]

DA-4之合成Synthesis of DA-4

於氮氣氛圍下,使含化合物[xvi](21.87g,45.54mmol)、三乙胺(4.61g,45.54mmol)之四氫呋喃(90g)溶液冷卻至10℃以下,邊注意發熱邊滴加含化合物[i](10.00g,43.37mmol)之四氫呋喃(60g)溶液。滴加結束後,反應溫度上升至23℃,再進行反應。以HPLC(高速液體層析儀)確認反應結束後,將反應液倒入蒸餾水(1.2L)中,過濾析出之固體,經水洗後,以2-丙醇(232g)分散洗淨,獲得化合物[xvii](產量:27.69g,產率:95%)。The solution containing the compound [xvi] (21.87 g, 45.54 mmol) and triethylamine (4.61 g, 45.54 mmol) in tetrahydrofuran (90 g) was cooled to below 10 ° C under nitrogen atmosphere, and the compound was added dropwise while paying attention to heat. i] (10.00 g, 43.37 mmol) in tetrahydrofuran (60 g). After the completion of the dropwise addition, the reaction temperature was raised to 23 ° C, and the reaction was further carried out. After confirming the completion of the reaction by HPLC (High Speed Liquid Chromatography), the reaction mixture was poured into distilled water (1.2 L), and the precipitated solid was filtered, washed with water, and washed with 2-propanol (232 g) to obtain a compound [ Xvii] (yield: 27.69 g, yield: 95%).

1 H-NMR(400MHz,DMSO-d6 ,δppm):9.06(1H,t),8.86(2H,d),3.44(2H,t),2.79-2.66(2H,m)。 1 H-NMR (400 MHz, DMSO-d 6 , δ ppm): 9.06 (1H, t), 8.86 (2H, d), 3.44 (2H, t), 2.79-2.66 (2H, m).

在氮氣氛圍下,將含化合物[xvii](25.00g,37.1mmol)、鐵粉(還原鐵,12.42g,222.5mmol)、乙酸乙酯(225g)之混合物加熱至70℃後,滴加氯化銨(5.95g,111.3mmol)之10%水溶液。以HPLC確認反應結束後,以矽藻土過濾固體。以乙酸乙酯及蒸餾水各500mL洗淨後,去除水層,且以蒸餾水(500mL)洗淨有機層3次。隨後,有機層以無水硫酸鎂乾燥,經過濾後,餾除溶劑。以己烷(60g)分散洗淨所得化合物(DA-4)之粗產物,進行過濾‧乾燥,獲得化合物(DA-4)(產量:19.5g,產率:85%)。The mixture containing the compound [xvii] (25.00 g, 37.1 mmol), iron powder (reduced iron, 12.42 g, 222.5 mmol) and ethyl acetate (225 g) was heated to 70 ° C under a nitrogen atmosphere, and chlorination was added dropwise. A 10% aqueous solution of ammonium (5.95 g, 111.3 mmol). After confirming the completion of the reaction by HPLC, the solid was filtered with celite. After washing with 500 mL of each of ethyl acetate and distilled water, the aqueous layer was removed, and the organic layer was washed three times with distilled water (500 mL). Subsequently, the organic layer was dried over anhydrous magnesium sulfate, and filtered, and then evaporated. The crude product of the obtained compound (DA-4) was washed with hexane (60 g), filtered, and dried to give Compound (DA-4) (yield: 19.5 g, yield: 85%).

1 H-NMR(400MHz,DMSO-d6 ,δppm):6.36(2H,d),6.06(1H,t),5.14(4H,brs),3.19(2H,t),2.64-2.51(2H,m)。 1 H-NMR (400MHz, DMSO -d 6, δppm): 6.36 (2H, d), 6.06 (1H, t), 5.14 (4H, brs), 3.19 (2H, t), 2.64-2.51 (2H, m ).

[合成例8:聚醯亞胺(PI-4)之合成][Synthesis Example 8: Synthesis of Polyimine (PI-4)]

在氮氣流中,於100mL之四頸燒瓶中注入3.5837g(8.73mmol)之2,2-雙(4-胺基苯氧基苯基)丙烷(爾後稱為BAPP)、0.1518g(0.27mmol)之DA-2,且溶解於36.02g之NMP之後,添加2.6214g(8.73mmol)之3,4-二羧基-1,2,3,4-四氫-1-萘琥珀酸二酐(爾後稱為TDA),使之在50℃下攪拌24小時進行聚合反應。所得聚醯胺酸之溶液以NMP稀釋成8質量%。In a nitrogen gas stream, 3.5837 g (8.73 mmol) of 2,2-bis(4-aminophenoxyphenyl)propane (hereinafter referred to as BAPP) and 0.1518 g (0.27 mmol) were injected into a 100 mL four-necked flask. After DA-2, and dissolved in 36.02g of NMP, add 2.6214g (8.73mmol) of 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic dianhydride (hereinafter referred to as It was TDA), and it was stirred at 50 ° C for 24 hours to carry out a polymerization reaction. The resulting solution of polyamic acid was diluted to 8 mass% with NMP.

於30g之該溶液中添加11g作為醯亞胺化觸媒之乙酸酐、5.2g之吡啶,在50℃下反應3小時,獲得聚醯亞胺溶液。將該溶液倒入大量甲醇中,濾掉所得白色沉澱物,經乾燥、獲得白色之聚醯亞胺粉末。該聚醯亞胺粉末以1 H-NMR確認為90%以上醯亞胺化。使2.1g之該粉末溶解於27.7g之γ-丁內酯及5.3g之二丙二醇單甲基醚之混合溶劑中,獲得聚醯亞胺(PI-4)之6質量%溶液。To 30 g of this solution, 11 g of acetic anhydride as a ruthenium iodide catalyst and 5.2 g of pyridine were added, and the mixture was reacted at 50 ° C for 3 hours to obtain a polyimine solution. The solution was poured into a large amount of methanol, and the resulting white precipitate was filtered off and dried to give a white polyimine powder. The polyimine powder was confirmed to be 90% or more imidized by 1 H-NMR. 2.1 g of this powder was dissolved in a mixed solvent of 27.7 g of γ-butyrolactone and 5.3 g of dipropylene glycol monomethyl ether to obtain a 6 mass% solution of polyimine (PI-4).

所得聚醯亞胺(PI-4)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=14,300,Mw=38,000。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine (PI-4) were Mn = 14,300 and Mw = 38,000, respectively.

[合成例9:聚醯亞胺(PI-5)之合成][Synthesis Example 9: Synthesis of Polyimine (PI-5)]

在氮氣流中,於100mL之四頸燒瓶中置入3.4728g(8.46mmol)之BAPP、0.3037g(0.54mmol)之DA-2,溶解於36.25g之NMP之後,添加2.6214g(8.73mmol)之TDA,使之在50℃攪拌24小時進行聚合反應。所得聚醯胺酸之溶液以NMP稀釋成8質量%。3.4728 g (8.46 mmol) of BAPP and 0.3037 g (0.54 mmol) of DA-2 were placed in a 100 mL four-necked flask under a nitrogen stream, and after dissolving in 36.25 g of NMP, 2.6214 g (8.73 mmol) was added. TDA was stirred at 50 ° C for 24 hours to carry out a polymerization reaction. The resulting solution of polyamic acid was diluted to 8 mass% with NMP.

於30g之該溶液中添加11g作為醯亞胺化觸媒之乙酸酐、5.2g之吡啶,在50℃反應3小時,獲得聚醯亞胺溶液。將該溶液倒入大量甲醇中,濾掉所得白色沉澱物,經乾燥、獲得白色之聚醯亞胺粉末。該聚醯亞胺粉末以1 H-NMR確認為90%以上之醯亞胺化。使2.1g之該粉末溶解於27.7g之γ-丁內酯及5.3g之二丙二醇單甲基醚之混合溶劑中,獲得聚醯亞胺(PI-5)之6質量%溶液。To 30 g of this solution, 11 g of acetic anhydride as a ruthenium-imiding catalyst and 5.2 g of pyridine were added, and the mixture was reacted at 50 ° C for 3 hours to obtain a polyimine solution. The solution was poured into a large amount of methanol, and the resulting white precipitate was filtered off and dried to give a white polyimine powder. The polyimine powder was confirmed to be imidized by 90% or more by 1 H-NMR. 2.1 g of this powder was dissolved in a mixed solvent of 27.7 g of γ-butyrolactone and 5.3 g of dipropylene glycol monomethyl ether to obtain a 6 mass% solution of polyimine (PI-5).

所得聚醯亞胺(PI-5)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=16,400,Mw=39.400。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine (PI-5) were Mn = 16,400 and Mw = 39.400, respectively.

[合成例10:聚醯亞胺(PI-6)之合成][Synthesis Example 10: Synthesis of Polyimine (PI-6)]

在氮氣流中,於100mL之四頸燒瓶中置入3.6206g(8.82mmol)之BAPP、0.1192g(0.18mmol)之DA-3,且溶解於36.05g之NMP後,添加2.6214g(8.73mmol)之TDA,使之在50℃攪拌24小時進行聚合反應。所得聚醯胺酸之溶液以NMP稀釋成8質量%。3.6206 g (8.82 mmol) of BAPP and 0.1192 g (0.18 mmol) of DA-3 were placed in a 100 mL four-necked flask under a nitrogen stream, and after dissolving in 36.05 g of NMP, 2.6214 g (8.73 mmol) was added. The TDA was stirred at 50 ° C for 24 hours to carry out a polymerization reaction. The resulting solution of polyamic acid was diluted to 8 mass% with NMP.

於30g之該溶液中添加11g作為醯亞胺化觸媒之乙酸酐、5.2g之吡啶,在50℃反應3小時,獲得聚醯亞胺溶液。將該溶液倒入大量甲醇中,濾掉所得白色沉澱物,經乾燥,獲得白色之聚醯亞胺粉末。該聚醯亞胺粉末以1 H-NMR確認為90%以上之醯亞胺化。使2.1g之該粉末溶解於27.7g之γ-丁內酯及5.3g之二丙二醇單甲基醚之混合溶劑中,獲得聚醯亞胺(PI-6)之6質量%溶液。To 30 g of this solution, 11 g of acetic anhydride as a ruthenium-imiding catalyst and 5.2 g of pyridine were added, and the mixture was reacted at 50 ° C for 3 hours to obtain a polyimine solution. The solution was poured into a large amount of methanol, and the resulting white precipitate was filtered off and dried to give a white polyimine powder. The polyimine powder was confirmed to be imidized by 90% or more by 1 H-NMR. 2.1 g of this powder was dissolved in a mixed solvent of 27.7 g of γ-butyrolactone and 5.3 g of dipropylene glycol monomethyl ether to obtain a 6 mass% solution of polyimine (PI-6).

所得聚醯亞胺(PI-6)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=20,200,Mw=51,400。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine (PI-6) were Mn = 20,200 and Mw = 51,400, respectively.

[合成例11:聚醯亞胺(PI-7)之合成][Synthesis Example 11: Synthesis of Polyimine (PI-7)]

在氮氣流中,於100mL之四頸燒瓶中置入3.9819g(9.7mmol)之BAPP、0.1842g(0.3mmol)之DA-4,且溶解於40.11g之NMP之後,添加2.9126g(9.7mmol)之TDA,使之在50℃攪拌24小時進行聚合反應。所得聚醯胺酸之溶液以NMP稀釋成8質量%。3.9819 g (9.7 mmol) of BAPP and 0.1842 g (0.3 mmol) of DA-4 were placed in a 100 mL four-necked flask under a nitrogen stream, and after dissolving in 40.11 g of NMP, 2.9126 g (9.7 mmol) was added. The TDA was stirred at 50 ° C for 24 hours to carry out a polymerization reaction. The resulting solution of polyamic acid was diluted to 8 mass% with NMP.

於30g之該溶液中添加11g作為醯亞胺化觸媒之乙酸酐、5.2g之吡啶,且在50℃反應3小時,獲得聚醯亞胺溶液。將該溶液倒入大量甲醇中,濾掉所得白色沉澱物,經乾燥,獲得白色之聚醯亞胺粉末。該聚醯亞胺粉末以1 H-NMR確認為90%以上醯亞胺化。使2.1g之該粉末溶解於27.7g之γ-丁內酯及5.3g之二丙二醇單甲基醚之混合溶劑中,獲得聚醯亞胺(PI-7)之6質量%溶液。To 30 g of this solution, 11 g of acetic anhydride as a ruthenium iodide catalyst and 5.2 g of pyridine were added, and reacted at 50 ° C for 3 hours to obtain a polyimine solution. The solution was poured into a large amount of methanol, and the resulting white precipitate was filtered off and dried to give a white polyimine powder. The polyimine powder was confirmed to be 90% or more imidized by 1 H-NMR. 2.1 g of this powder was dissolved in a mixed solvent of 27.7 g of γ-butyrolactone and 5.3 g of dipropylene glycol monomethyl ether to obtain a 6 mass% solution of polyimine (PI-7).

所得聚醯亞胺(PI-7)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=17,800,Mw=45,000。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine (PI-7) were Mn = 17,800 and Mw = 45,000, respectively.

[合成例12:聚醯亞胺前驅物(PI-8)之合成][Synthesis Example 12: Synthesis of Polyimine Precursor (PI-8)]

在氮氣流中,於100mL之四頸燒瓶中置入3.9819g(9.7mmol)之BAPP、0.1842g(0.3mmol)之DA-4,且溶解於34.39g之NMP後,添加1.9023g(9.7mmol)之CBDA,使之在23℃攪拌10小時進行聚合反應,再以NMP稀釋,獲得聚醯亞胺前驅物(PI-8)之6質量%溶液。3.9819 g (9.7 mmol) of BAPP and 0.1842 g (0.3 mmol) of DA-4 were placed in a 100 mL four-necked flask under a nitrogen stream, and after dissolving in 34.39 g of NMP, 1.9023 g (9.7 mmol) was added. The CBDA was stirred at 23 ° C for 10 hours to carry out a polymerization reaction, and then diluted with NMP to obtain a 6 mass% solution of a polyimine precursor (PI-8).

所得聚醯亞胺前驅物(PI-8)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=14,300,Mw=32,100。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine precursor (PI-8) were Mn = 14,300 and Mw = 32,100, respectively.

[合成例13:掺合物用聚醯亞胺(PI-9)之合成][Synthesis Example 13: Synthesis of Polyimine (PI-9) for Blend]

在氮氣流中,於200mL之四頸燒瓶中置入4.86g(0.045mol)之對-苯二胺、1.74g(0.005mol)之4-十六烷氧基-1,3-二胺基苯,溶解於122.5g之NMP後,添加15.01g(0.05mol)之TDA,使之在室溫攪拌10小時進行聚合反應。所得聚醯胺酸之溶液以NMP稀釋成8質量%。4.86 g (0.045 mol) of p-phenylenediamine and 1.74 g (0.005 mol) of 4-hexadecyloxy-1,3-diaminobenzene were placed in a 200 mL four-necked flask under a nitrogen stream. After dissolving in 122.5 g of NMP, 15.01 g (0.05 mol) of TDA was added, and the mixture was stirred at room temperature for 10 hours to carry out polymerization. The resulting solution of polyamic acid was diluted to 8 mass% with NMP.

於50g之該溶液中添加10.8g作為醯亞胺化觸媒之乙酸酐、5.0g之吡啶,在50℃下反應3小時,獲得聚醯亞胺溶液。將該溶液倒入大量甲醇中,濾掉所得白色沉澱物,經乾燥,獲得白色之聚醯亞胺粉末。該聚醯亞胺粉末以1 H-NMR確認為90%以上醯亞胺化。使4g之該粉末溶解於52.67g之γ-丁內酯及10g之二丙二醇單甲基醚之混合溶劑中,獲得聚醯亞胺(PI-9)之6質量%溶液。To 50 g of this solution, 10.8 g of acetic anhydride as a ruthenium iodide catalyst and 5.0 g of pyridine were added, and the mixture was reacted at 50 ° C for 3 hours to obtain a polyimine solution. The solution was poured into a large amount of methanol, and the resulting white precipitate was filtered off and dried to give a white polyimine powder. The polyimine powder was confirmed to be 90% or more imidized by 1 H-NMR. 4 g of this powder was dissolved in a mixed solvent of 52.67 g of γ-butyrolactone and 10 g of dipropylene glycol monomethyl ether to obtain a 6 mass% solution of polyimine (PI-9).

所得聚醯亞胺(PI-9)之數平均分子量(Mn)與重量平均分子量(Mw)分別為Mn=18,000,Mw=54,000。The number average molecular weight (Mn) and weight average molecular weight (Mw) of the obtained polyimine (PI-9) were Mn = 18,000 and Mw = 54,000, respectively.

[合成例14:聚合物掺合物(組成物A)之調製][Synthesis Example 14: Modulation of polymer blend (composition A)]

混合9g之合成例13中調製之聚醯亞胺(PI-9)之6wt%溶液與1g之合成例11中調製之聚醯亞胺(PI-7)之6wt%溶液,在室溫攪拌6小時,獲得組成物A。9 g of a 6 wt% solution of the polyimine (PI-9) prepared in Synthesis Example 13 and 1 g of a 6 wt% solution of the polyimine (PI-7) prepared in Synthesis Example 11 were mixed, and stirred at room temperature 6 In hours, composition A was obtained.

[合成例15:聚合物掺合物(組成物B)之調製][Synthesis Example 15: Preparation of polymer blend (composition B)]

混合9g之合成例13中調製之聚醯亞胺(PI-9)之6wt%溶液與1g之合成例12中調製之聚醯亞胺(PI-8)之6wt%溶液,在室溫攪拌6小時,獲得組成物B。9 g of a 6 wt% solution of polyimine (PI-9) prepared in Synthesis Example 13 and 1 g of a 6 wt% solution of polyimine (PI-8) prepared in Synthesis Example 12 were mixed, and stirred at room temperature 6 In hours, composition B was obtained.

[合成例16:聚合物掺合物(組成物C)之調製][Synthesis Example 16: Preparation of Polymer Blend (Composition C)]

混合8g之合成例13中調製之聚醯亞胺(PI-9)之6wt%溶液與2g之合成例12中調製之聚醯亞胺(PI-8)之6wt%溶液,在室溫攪拌6小時,獲得組成物C。8 g of a 6 wt% solution of the polyimine (PI-9) prepared in Synthesis Example 13 and 2 g of a 6 wt% solution of the polyimine (PI-8) prepared in Synthesis Example 12 were mixed, and stirred at room temperature 6 In hours, composition C was obtained.

以下顯示於實施例中合成或使用之四羧酸酐以及二胺化合物之構造式。The structural formula of the tetracarboxylic anhydride and the diamine compound synthesized or used in the examples is shown below.

[於本實施例使用之四羧酸酐][Tetracarboxylic anhydride used in this example]

[於本實施例使用之二胺][Diamine used in this example]

<實施例1> 水接觸角變化<Example 1> Water contact angle change

於附有ITO之玻璃基板(2.5cm邊長,厚度0.7mm)上,使用附有0.2μm孔過濾器之針筒滴加合成例2所調製之PI-1之溶液,藉由旋轉塗佈法塗佈。隨後於大氣下,以80℃之加熱板加熱處理5分鐘,使有機溶劑揮發,接著於210℃之加熱板燒成30分鐘,獲得膜厚約400nm之聚醯亞胺膜。測定該聚醯亞胺膜之水接觸角θ(°)。On the glass substrate with ITO (2.5 cm side length, thickness 0.7 mm), a solution of PI-1 prepared in Synthesis Example 2 was dropped using a syringe equipped with a 0.2 μm pore filter by spin coating. Coating. Subsequently, it was heat-treated at 80 ° C for 5 minutes in the atmosphere to evaporate the organic solvent, followed by firing on a hot plate at 210 ° C for 30 minutes to obtain a polyimide film having a film thickness of about 400 nm. The water contact angle θ (°) of the polyimide film was measured.

以同樣順序製作2片聚醯亞胺膜,以20J/cm2 或40J/cm2 之照射量照射紫外線後,測定該膜之水接觸角θ(°)。Two sheets of polyimide film were produced in the same order, and after irradiating ultraviolet rays with an irradiation amount of 20 J/cm 2 or 40 J/cm 2 , the water contact angle θ (°) of the film was measured.

結果示於表A。The results are shown in Table A.

<實施例2> 水接觸角變化<Example 2> Water contact angle change

除使用合成例3調製之PI-2之溶液以外,使用與實施例1同樣順序製作3片聚醯亞胺膜,設為紫外線未照射膜、照射紫外線20J/cm2 之膜或照射紫外線40J/cm2 之膜,測定各膜之水接觸角θ(°)。Three sheets of polyimide film were produced in the same manner as in Example 1 except that the solution of PI-2 prepared in Synthesis Example 3 was used, and the film was irradiated with ultraviolet rays, irradiated with ultraviolet rays of 20 J/cm 2 or irradiated with ultraviolet rays of 40 J/. The film of cm 2 was measured for the water contact angle θ (°) of each film.

結果示於表A。The results are shown in Table A.

<比較例1> 水接觸角變化<Comparative Example 1> Change in water contact angle

除使用合成例4調製之PI-3之溶液以外,使用與實施例1同樣順序製作2片聚醯亞胺膜,各設為紫外線未照射膜或照射紫外線40J/cm2 之膜,測定各膜之水接觸角θ(°)。Two sheets of polyimide film were produced in the same manner as in Example 1 except that the solution of PI-3 prepared in Synthesis Example 4 was used, and each of the films was an ultraviolet non-irradiated film or a film irradiated with ultraviolet rays of 40 J/cm 2 , and each film was measured. The water contact angle θ (°).

結果示於表A。The results are shown in Table A.

<實施例3> PGME接觸角變化<Example 3> PGME contact angle change

使用與實施例1同樣順序製作3片聚醯亞胺膜,各設為紫外線未照射膜、照射紫外線2J/cm2 之膜或照射紫外線6J/cm2 之膜,測定各膜之PGME之接觸角θ(°)。Three polyimine films were produced in the same manner as in Example 1, and each was an ultraviolet non-irradiated film, a film irradiated with ultraviolet rays of 2 J/cm 2 or a film irradiated with ultraviolet rays of 6 J/cm 2 , and the contact angle of PGME of each film was measured. θ(°).

結果示於表B。The results are shown in Table B.

<比較例2> PGME接觸角變化<Comparative Example 2> PGME contact angle change

除使用合成例4調製之PI-3之溶液以外,使用與實施例1同樣順序製作2片聚醯亞胺膜,各設為紫外線未照射膜或照射紫外線6J/cm2 之膜,測定各膜之PGME接觸角θ(°)。Two sheets of polyimide film were produced in the same manner as in Example 1 except that the solution of PI-3 prepared in Synthesis Example 4 was used, and each of the films was an ultraviolet non-irradiated film or a film irradiated with ultraviolet rays of 6 J/cm 2 , and each film was measured. The PGME contact angle θ (°).

結果示於表B。The results are shown in Table B.

<實施例4> PGME接觸角變化<Example 4> Change in contact angle of PGME

於附有ITO之玻璃基板(2.5cm邊長,厚度0.7mm)上,使用附有0.2μm孔過濾器之針筒滴加合成例8所調製之PI-4之溶液,藉由旋轉塗佈法塗佈。隨後於大氣下,以80℃之加熱板加熱處理5分鐘,使有機溶劑揮發,接著於180℃之加熱板燒成30分鐘,獲得膜厚約400nm之聚醯亞胺膜。測定該聚醯亞胺膜之PGME溶液之接觸角θ(°)。On a glass substrate with ITO (2.5 cm side length, thickness 0.7 mm), a solution of PI-4 prepared in Synthesis Example 8 was dropped using a syringe equipped with a 0.2 μm pore filter by spin coating. Coating. Subsequently, it was heat-treated at 80 ° C for 5 minutes in the atmosphere to evaporate the organic solvent, followed by firing on a hot plate at 180 ° C for 30 minutes to obtain a polyimide film having a film thickness of about 400 nm. The contact angle θ (°) of the PGME solution of the polyimide film was measured.

以同樣順序製作1片聚醯亞胺膜,以1J/cm2 之照射量照射紫外線後,測定該膜之PGME接觸角θ(°)。One piece of the polyimide film was produced in the same order, and after irradiating ultraviolet rays with an irradiation amount of 1 J/cm 2 , the PGME contact angle θ (°) of the film was measured.

結果示於表C。The results are shown in Table C.

<實施例5> PGME接觸角變化<Example 5> PGME contact angle change

除使用合成例9調製之PI-5以外,使用與實施例4同樣順序製作2片聚醯亞胺膜,各設為紫外線未照射膜、照射紫外線1J/cm2 之膜,測定各膜之PGME接觸角θ(°)。Two sheets of polyimide film were produced in the same manner as in Example 4 except that PI-5 prepared in Synthesis Example 9 was used, and each of the films was irradiated with an ultraviolet ray-free film and irradiated with ultraviolet rays of 1 J/cm 2 to measure the PGME of each film. Contact angle θ (°).

結果示於表C。The results are shown in Table C.

<實施例6> PGME接觸角變化<Example 6> PGME contact angle change

除使用合成例10調製之PI-6以外,使用與實施例4同樣順序製作2片聚醯亞胺膜,各設為紫外線未照射膜、照射紫外線1J/cm2 之膜,測定各膜之PGME接觸角θ(°)。Two sheets of polyimide film were produced in the same manner as in Example 4 except that PI-6 prepared in Synthesis Example 10 was used, and each of the films was irradiated with an ultraviolet ray-free film and irradiated with ultraviolet rays of 1 J/cm 2 to measure the PGME of each film. Contact angle θ (°).

結果示於表C。The results are shown in Table C.

<實施例7> PGME接觸角變化<Example 7> PGME contact angle change

除使用合成例14調製之組成物A以外,使用與實施例4同樣順序製作2片聚醯亞胺膜,各設為紫外線未照射膜、照射紫外線1J/cm2 之膜,測定各膜之PGME接觸角θ(°)。Two sheets of polyimide film were produced in the same manner as in Example 4 except that the composition A prepared in Synthesis Example 14 was used, and each of the films was irradiated with an ultraviolet ray-free film and irradiated with ultraviolet rays of 1 J/cm 2 to measure the PGME of each film. Contact angle θ (°).

結果示於表C。The results are shown in Table C.

<實施例8> PGME接觸角變化<Example 8> PGME contact angle change

除使用合成例16調製之組成物C以外,使用與實施例6同樣順序製作2片聚醯亞胺膜,各設為紫外線未照射膜、照射紫外線1J/cm2 之膜,測定各膜之PGME接觸角θ(°)。In the same procedure as in Example 6, except that the composition C prepared in Synthesis Example 16 was used, two polyimide films were prepared in the same manner as in Example 6, and each of the films was irradiated with ultraviolet rays of 1 J/cm 2 , and the PGME of each film was measured. Contact angle θ (°).

結果示於表C。The results are shown in Table C.

如表A、表B及表C所示,使用由側鏈上具有硫醇鍵之二胺所製作之聚醯亞胺及聚醯亞胺前驅物之實施例中,紫外線照射後之PGME接觸角任一情況均有大幅變化。As shown in Table A, Table B, and Table C, the PGME contact angle after ultraviolet irradiation in the examples using the polyimine and the polyimine precursor prepared from the diamine having a thiol bond in the side chain Any situation has changed dramatically.

另一方面,使用未利用側鏈上具有硫醇鍵之二胺所製作之聚醯亞胺前驅物(PI-3)之比較例1及2中,水或PGME之接觸角變化量小。On the other hand, in Comparative Examples 1 and 2 in which the polyimine precursor (PI-3) produced by using a diamine having a thiol bond in a side chain was not used, the amount of change in contact angle of water or PGME was small.

此結果認為是,若聚醯亞胺前驅物為側鏈為透過硫醇酯基存在有疏水性機之構造,亦即該硫醇酯基因紫外線照射而產生光分解,使側鏈之疏水性部分自主鏈切斷並分離,藉此使親疏水性產生大幅變化之結果。The result is considered to be that if the polyimine precursor is a structure in which a side chain is a thiol ester group, a hydrophobic machine exists, that is, the thiol ester gene is irradiated by ultraviolet light to cause photodecomposition, and the hydrophobic portion of the side chain is obtained. The autonomous strand is cleaved and separated, thereby causing a large change in the hydrophilicity and hydrophobicity.

<實施例9> 電極圖型化性評估<Example 9> Electrode patterning evaluation

於附有ITO之玻璃基板(2.5cm邊長,厚度0.7mm)上,使用附有0.2μm孔過濾器之針筒滴加合成例8所調製之PI-4之溶液,藉由旋轉塗佈法塗佈。隨後於大氣下,以80℃之加熱板加熱處理5分鐘,使有機溶劑揮發,接著於180℃之加熱板燒成30分鐘,獲得膜厚約400nm之聚醯亞胺膜。於該聚醯亞胺薄膜上透過光罩(線寬100μm、間距100μm之線及空間)照射紫外線1J/cm2 ,使聚醯亞胺之一部份親水化。接著於紫外線照射部微量滴加銀微粒子分散液,以180℃之加熱板燒成60分鐘,形成膜厚50nm之銀電極。On a glass substrate with ITO (2.5 cm side length, thickness 0.7 mm), a solution of PI-4 prepared in Synthesis Example 8 was dropped using a syringe equipped with a 0.2 μm pore filter by spin coating. Coating. Subsequently, it was heat-treated at 80 ° C for 5 minutes in the atmosphere to evaporate the organic solvent, followed by firing on a hot plate at 180 ° C for 30 minutes to obtain a polyimide film having a film thickness of about 400 nm. The polyimide film was irradiated with ultraviolet rays of 1 J/cm 2 through a mask (line width of 100 μm and a pitch of 100 μm and space) to hydrophilize one part of the polyimide. Subsequently, the silver fine particle dispersion was added dropwise to the ultraviolet irradiation portion, and fired at 180 ° C for 60 minutes to form a silver electrode having a film thickness of 50 nm.

此銀電極之顯微鏡照片示於圖1。由PI-4所構成之膜可形成成為目的線寬之銀電極。A micrograph of this silver electrode is shown in Fig. 1. The film composed of PI-4 can form a silver electrode which becomes a target line width.

<實施例10> 電極圖型化性評估<Example 10> Electrode patterning evaluation

除使用合成例14調製之組成物A以外,使用與實施例9同樣順序成膜聚醯亞胺膜,於此聚醯亞胺薄膜上透過光罩(線寬100μm、間距100μm之線及空間)照射紫外線1J/cm2 ,使聚醯亞胺之一部份親水化。接著於紫外線照射部微量滴加銀微粒子分散液,以180℃之加熱板燒成60分鐘,形成膜厚50nm之銀電極。A polyimide film was formed in the same manner as in Example 9 except that the composition A prepared in Synthesis Example 14 was used. The polyimide film was passed through a mask (line width 100 μm, line and space of 100 μm). One part of the polyimine was hydrophilized by irradiating ultraviolet rays at 1 J/cm 2 . Subsequently, the silver fine particle dispersion was added dropwise to the ultraviolet irradiation portion, and fired at 180 ° C for 60 minutes to form a silver electrode having a film thickness of 50 nm.

此銀電極之顯微鏡照片示於圖2。由組成物A所構成之膜可形成成為目的線寬之銀電極。A micrograph of this silver electrode is shown in Fig. 2. The film composed of the composition A can form a silver electrode which becomes a target line width.

<比較例3> 電極圖型化性評估<Comparative Example 3> Electrode patterning evaluation

除使用合成例4調製之PI-3,且燒成溫度設為210℃以外,使用與實施例11同樣順序成膜聚醯亞胺膜,於此聚醯亞胺薄膜上透過光罩(線寬100μm、間距100μm之線及空間)照射紫外線1J/cm2 。隨後微量滴加銀微粒子分散液,但由於紫外線照射部未被親水化故無法形成電極。A polyimide film was formed in the same manner as in Example 11 except that PI-3 prepared in Synthesis Example 4 was used, and the firing temperature was 210 ° C. The film was passed through the mask on the polyimide film (line width). 100 μm, a line of 100 μm pitch and space) was irradiated with ultraviolet rays of 1 J/cm 2 . Subsequently, the silver fine particle dispersion was added in a small amount, but since the ultraviolet irradiation portion was not hydrophilized, the electrode could not be formed.

實施例9至實施例10與比較例3之結果顯示於表D。The results of Examples 9 to 10 and Comparative Example 3 are shown in Table D.

由具有硫醇酯鍵之PI-4以及組成物A所構成之膜,以1J/cm2 之紫外線照射量親水性已充分變化,而可形成100μm線寬之銀電極,相反地,由不具有硫醇酯鍵之組成物D所構成之膜,以1J/cm2 之紫外線照射量親水性未充分變化,而無法形成電極。A film composed of PI-4 having a thiol ester bond and a composition A has a hydrophilicity which is sufficiently changed by an ultraviolet irradiation amount of 1 J/cm 2 to form a silver electrode having a line width of 100 μm, and conversely, In the film composed of the composition D of the thiol ester bond, the hydrophilicity of the ultraviolet irradiation amount of 1 J/cm 2 was not sufficiently changed, and the electrode could not be formed.

<實施例11> 絕緣性<Example 11> Insulation

於附有ITO之玻璃基板(2.5cm邊長,厚度0.7mm)上,使用附有0.2μm孔過濾器之針筒滴加合成例2所調製之PI-1之溶液,藉由旋轉塗佈法塗佈。隨後於大氣下,以80℃之加熱板加熱處理5分鐘,使有機溶劑揮發,接著於210℃之加熱板燒成30分鐘,獲得膜厚約450nm之聚醯亞胺膜。On the glass substrate with ITO (2.5 cm side length, thickness 0.7 mm), a solution of PI-1 prepared in Synthesis Example 2 was dropped using a syringe equipped with a 0.2 μm pore filter by spin coating. Coating. Subsequently, it was heat-treated at 80 ° C for 5 minutes in the atmosphere to evaporate the organic solvent, followed by firing on a hot plate at 210 ° C for 30 minutes to obtain a polyimide film having a film thickness of about 450 nm.

接著為獲得ITO電極與測定裝置之探針間之良好接觸,削取聚醯亞胺膜之一部份使ITO露出後,使用真空蒸鍍裝置,在聚醯亞胺膜上及ITO上層合直徑1.0mm、膜厚100nm之鋁電極。此時之真空蒸鍍條件設為室溫、真空度3×10-3 Pa以下、鋁蒸鍍速度0.3nm/秒以下。藉由如此於聚醯亞胺膜之上下形成電極,製作聚醯亞胺膜之電流-電壓特性評價用樣品。Then, in order to obtain good contact between the ITO electrode and the probe of the measuring device, one part of the polyimide film is peeled off to expose the ITO, and then the diameter is laminated on the polyimide film and the ITO by using a vacuum evaporation device. 1.0 mm aluminum electrode with a film thickness of 100 nm. The vacuum vapor deposition conditions at this time were set to room temperature, the degree of vacuum was 3 × 10 -3 Pa or less, and the aluminum vapor deposition rate was 0.3 nm / sec or less. By forming an electrode above and below the polyimide film, a sample for evaluation of current-voltage characteristics of the polyimide film was prepared.

所製作之樣品立即於氮氣氛圍中,測定電流-電壓特性。測定電壓設為自0V每2V上升至90V。此時之聚醯亞胺膜之比介電率為3.37,洩漏電流密度為3×10-10 A/cm2 。又,聚醯亞胺膜於2MV/cm之電場絕緣未被破壞。The prepared sample was immediately subjected to a current-voltage characteristic in a nitrogen atmosphere. The measured voltage is set to rise from 0V every 2V to 90V. The polyimine film at this time had a specific dielectric constant of 3.37 and a leakage current density of 3 × 10 -10 A/cm 2 . Further, the electric field insulation of the polyimide film at 2 MV/cm was not broken.

圖3顯示氮氣氛圍中之電流-電壓特性測定結果。Figure 3 shows the results of measurement of current-voltage characteristics in a nitrogen atmosphere.

接著,與上述相同的樣品在大氣(25度,濕度45%)靜置15小時後,測定電流-電壓特性。測定電壓設為自0V每2V上升至90V。此時之樣品洩漏電流密度為1.8×10-7 A/cm2Next, the same sample as above was allowed to stand in the atmosphere (25 degrees, humidity 45%) for 15 hours, and then the current-voltage characteristics were measured. The measured voltage is set to rise from 0V every 2V to 90V. The sample leakage current density at this time was 1.8 × 10 -7 A/cm 2 .

圖4顯示大氣中之電流-電壓特性測定結果。Figure 4 shows the results of measurement of current-voltage characteristics in the atmosphere.

<實施例12> 絕緣性<Example 12> Insulation

除聚醯亞胺膜之燒成溫度設為230℃以外,使用與實施例11相同順序製作電流-電壓特性評價用樣品。此時之聚醯亞胺膜之比介電率為3.14,洩漏電流密度為1.0×10-10 A/cm2 。又,聚醯亞胺膜於2MV/cm之電場絕緣未被破壞。A sample for current-voltage characteristic evaluation was produced in the same manner as in Example 11 except that the firing temperature of the polyimide film was 230 °C. The polyimine film at this time had a specific dielectric constant of 3.14 and a leakage current density of 1.0 × 10 -10 A/cm 2 . Further, the electric field insulation of the polyimide film at 2 MV/cm was not broken.

接著,與上述相同的樣品在大氣(25度,濕度45%)靜置15小時後,測定電流-電壓特性。測定電壓設為自0V每2V上升至90V。此時之樣品洩漏電流密度為1.8×10-8 A/cm2Next, the same sample as above was allowed to stand in the atmosphere (25 degrees, humidity 45%) for 15 hours, and then the current-voltage characteristics were measured. The measured voltage is set to rise from 0V every 2V to 90V. The sample leakage current density at this time was 1.8 × 10 -8 A/cm 2 .

圖3顯示於氮氣氛圍中之電流-電壓特性測定結果,圖4顯示大氣中之電流-電壓特性測定結果。Fig. 3 shows the results of measurement of current-voltage characteristics in a nitrogen atmosphere, and Fig. 4 shows the results of measurement of current-voltage characteristics in the atmosphere.

<實施例13> 絕緣性<Example 13> Insulation

於附有ITO之玻璃基板(2.5cm邊長,厚度0.7mm)上,使用附有0.2μm孔過濾器之針筒滴加合成例8所調製之PI-4之溶液,藉由旋轉塗佈法塗佈。隨後於大氣下,以80℃之加熱板加熱處理5分鐘,使有機溶劑揮發,接著於180℃之加熱板燒成30分鐘,獲得膜厚約400nm之聚醯亞胺膜。接著為獲得ITO電極與測定裝置之探針間之良好接觸,削取聚醯亞胺膜之一部份使ITO露出後,使用真空蒸鍍裝置,在聚醯亞胺膜上及ITO上層合直徑1.0mm、膜厚100nm之鋁電極。此時之真空蒸鍍條件設為室溫、真空度3×10-3 Pa以下、鋁蒸鍍速度0.3nm/秒以下。藉由如此於聚醯亞胺膜之上下形成電極,製作聚醯亞胺膜之電流-電壓特性評價用樣品。On a glass substrate with ITO (2.5 cm side length, thickness 0.7 mm), a solution of PI-4 prepared in Synthesis Example 8 was dropped using a syringe equipped with a 0.2 μm pore filter by spin coating. Coating. Subsequently, it was heat-treated at 80 ° C for 5 minutes in the atmosphere to evaporate the organic solvent, followed by firing on a hot plate at 180 ° C for 30 minutes to obtain a polyimide film having a film thickness of about 400 nm. Then, in order to obtain good contact between the ITO electrode and the probe of the measuring device, one part of the polyimide film is peeled off to expose the ITO, and then the diameter is laminated on the polyimide film and the ITO by using a vacuum evaporation device. 1.0 mm aluminum electrode with a film thickness of 100 nm. The vacuum vapor deposition conditions at this time were set to room temperature, the degree of vacuum was 3 × 10 -3 Pa or less, and the aluminum vapor deposition rate was 0.3 nm / sec or less. By forming an electrode above and below the polyimide film, a sample for evaluation of current-voltage characteristics of the polyimide film was prepared.

所製作之樣品於23℃±3℃、濕度45%±5%之環境下靜置15小時後,測定電流電壓特性。測定電壓設為自0V每2V上升至100V。此樣品於1MV/cm之洩漏電流密度為4.3×10-11 A/cm2 。又,聚醯亞胺膜直至2MV/cm絕緣仍未被破壞。The prepared sample was allowed to stand in an environment of 23 ° C ± 3 ° C and a humidity of 45% ± 5% for 15 hours, and then the current-voltage characteristics were measured. The measurement voltage was set to rise from 0 V every 2 V to 100 V. The leakage current density of this sample at 1 MV/cm was 4.3 × 10 -11 A/cm 2 . Further, the polyimide film was not damaged until 2 MV/cm of insulation.

圖5顯示電流-電壓特性測定結果。Figure 5 shows the results of current-voltage characteristics measurement.

<實施例14> 絕緣性<Example 14> Insulation

除使用合成例14調製之組成物A以外,以與實施例13相同順序製作電流-電壓特性評價用樣品。A sample for current-voltage characteristic evaluation was produced in the same manner as in Example 13 except that the composition A prepared in Synthesis Example 14 was used.

此樣品於1MV/cm之洩漏電流密度為1.7×10-10 A/cm2 。又,聚醯亞胺膜直至2MV/cm絕緣仍未被破壞。The leakage current density of this sample at 1 MV/cm was 1.7 × 10 -10 A/cm 2 . Further, the polyimide film was not damaged until 2 MV/cm of insulation.

圖5顯示電流-電壓特性測定結果。Figure 5 shows the results of current-voltage characteristics measurement.

<實施例15> 絕緣性<Example 15> Insulation

除使用合成例15調製之組成物B且燒成溫度設為230℃以外,以與實施例13相同順序製作電流-電壓特性評價用樣品。A sample for current-voltage characteristic evaluation was produced in the same manner as in Example 13 except that the composition B prepared in Synthesis Example 15 was used and the baking temperature was 230 °C.

此樣品於1MV/cm之洩漏電流密度為1.2×10-10 A/cm2 。又,聚醯亞胺膜直至2MV/cm絕緣仍未被破壞。The leakage current density of this sample at 1 MV/cm was 1.2 × 10 -10 A/cm 2 . Further, the polyimide film was not damaged until 2 MV/cm of insulation.

圖5顯示電流-電壓特性測定結果。Figure 5 shows the results of current-voltage characteristics measurement.

<實施例16> 絕緣性<Example 16> Insulation

除使用合成例16調製之組成物C且燒成溫度設為230℃以外,以與實施例13相同順序製作電流-電壓特性評價用樣品。A sample for current-voltage characteristic evaluation was produced in the same manner as in Example 13 except that the composition C prepared in Synthesis Example 16 was used and the baking temperature was 230 °C.

此樣品於1MV/cm之洩漏電流密度為3.4×10-10 A/cm2 。又,聚醯亞胺膜直至2MV/cm絕緣仍未被破壞。The leakage current density of this sample at 1 MV/cm was 3.4 × 10 -10 A/cm 2 . Further, the polyimide film was not damaged until 2 MV/cm of insulation.

圖5顯示電流-電壓特性測定結果。Figure 5 shows the results of current-voltage characteristics measurement.

如圖3所示,由PI-1所構成之膜在氮氣氛圍中為優異之絕緣膜(實施例11及實施例12)。As shown in Fig. 3, the film composed of PI-1 was an excellent insulating film in a nitrogen atmosphere (Example 11 and Example 12).

且如圖4所示,由PI-1所構成之膜,易受水分影響,可見到於大氣中之洩漏電流密度比氮氣氛圍中更增加,但仍為作為形成畫像用下層膜之用途毫無問題之水準(實施例11及實施例12)。As shown in Fig. 4, the film composed of PI-1 is susceptible to moisture, and the leakage current density in the atmosphere is more increased than in the nitrogen atmosphere, but it is still used as a lower film for forming an image. The level of the problem (Example 11 and Example 12).

又,如圖5所示,由PI-4及組成物A至C所構成之膜均為優異之絕緣膜(實施例13至實施例16)。Further, as shown in Fig. 5, the film composed of PI-4 and the compositions A to C was an excellent insulating film (Examples 13 to 16).

亦即,本發明之形成畫像形成用下層膜為具有作為形成畫像形成用下層膜之充分絕緣性能之下層膜。In other words, the underlayer film for forming an image forming method of the present invention has a layer film which is a sufficient insulating property for forming an underlayer film for image formation.

<實施例17:電晶體特性><Example 17: Crystal characteristics>

於附有Cr電極之玻璃基板(2.5cm邊長,厚度0.7mm)上,使用附有0.2μm孔過濾器之針筒滴加合成例8所調製之PI-4之溶液,藉由旋轉塗佈法塗佈。隨後於大氣下,以80℃之加熱板加熱處理5分鐘,使有機溶劑揮發,接著於180℃之加熱板燒成30分鐘,獲得膜厚約450nm之聚醯亞胺膜。於此聚醯亞胺薄膜上透過光罩照射紫外線2J/cm2 ,使聚醯亞胺之一部份親水化。接著於紫外線照射部微量滴加銀微粒子分散液,以180℃之加熱板燒成60分鐘,形成膜厚50nm之源極‧汲極電極。On a glass substrate (2.5 cm side length, thickness 0.7 mm) with a Cr electrode, a solution of PI-4 prepared in Synthesis Example 8 was dropped using a syringe equipped with a 0.2 μm pore filter, and spin-coated. Method coating. Subsequently, it was heat-treated at 80 ° C for 5 minutes in the atmosphere to evaporate the organic solvent, followed by firing on a hot plate at 180 ° C for 30 minutes to obtain a polyimide film having a film thickness of about 450 nm. On the polyimide film, a portion of the polyimine was hydrophilized by irradiating ultraviolet rays of 2 J/cm 2 through a photomask. Subsequently, a silver fine particle dispersion liquid was added dropwise to the ultraviolet irradiation portion, and fired at 180 ° C for 60 minutes to form a source ‧ 汲 electrode having a thickness of 50 nm.

於此銀電極上,藉由真空蒸鍍法使并五苯(Aldrich製)成膜70nm。并五苯之蒸鍍速度設為0.05nm/秒。On the silver electrode, pentacene (manufactured by Aldrich) was formed into a film of 70 nm by vacuum evaporation. The vapor deposition rate of pentacene was set to 0.05 nm/second.

以上述所得之有機薄膜電晶體之電特性藉由測定源極電流相對於閘極電壓之變化而予以評價。The electrical characteristics of the organic thin film transistor obtained above were evaluated by measuring the change in the source current with respect to the gate voltage.

詳言之,源極‧汲極電壓(VD )設為-80V,閘極電壓(VG )自+20V至-80V以2V步進變化,於各電壓在電流充分安定之前保持1秒電壓後之值作為汲極電流之測定值予以記錄,重複5次此操作。且測定係使用半導體參數分析儀HP4156C(AGILENT技術公司製),在氮氣氛圍中測定。In detail, the source ‧thole voltage (V D ) is set to -80V, the gate voltage (V G ) varies from +20V to -80V in 2V steps, and the voltage is maintained for 1 second before the current is fully stabilized. The latter value is recorded as the measured value of the drain current, and this operation is repeated 5 times. Further, the measurement was carried out by using a semiconductor parameter analyzer HP4156C (manufactured by AGILENT Technologies Co., Ltd.) in a nitrogen atmosphere.

通常,於飽和狀態之汲極電流ID 可以下述式表示。亦即有機半導體之移動度μ可由以汲極電流ID 之絕對值平方根為縱軸,以閘極電壓VG 為橫軸作圖時之圖型斜率求得。Generally, the drain current I D in a saturated state can be expressed by the following equation. That is, the mobility μ of the organic semiconductor can be obtained by plotting the slope of the graph when the square root of the absolute value of the drain current I D is the vertical axis and the gate voltage V G is plotted on the horizontal axis.

ID =WCμ(VG -VT )2 /2LI D = WCμ(V G -V T ) 2 /2L

上述式中,W為電晶體之通道寬度,L為電晶體之通道長度,C為閘極絕緣膜之靜電電容,VT 為電晶體之閾值電壓,μ為移動度。以本實施例作成之電晶體W=2mm,L=100μm,C=6.4nF/cm2In the above formula, W is the channel width of the transistor, L is the channel length of the transistor, C is the electrostatic capacitance of the gate insulating film, V T is the threshold voltage of the transistor, and μ is the mobility. The transistor W made in this example was W = 2 mm, L = 100 μm, and C = 6.4 nF/cm 2 .

并五苯之移動度μ基於該式計算後,平均為5×10-2 cm2 /Vs。又,閾值電壓自-18V至-20V,開(ON)狀態與關(OFF)狀態之比(開/關比)為106 等級。又進行重複測定亦未見到傳達特性(Transfer Characteristics)偏移而獲得安定特性(圖6)。The mobility of pentacene is calculated to be 5 × 10 -2 cm 2 /Vs on the basis of this formula. Further, the threshold voltage is from -18V to -20V, and the ratio of the ON state to the OFF state (ON/OFF ratio) is 10 6 levels. Further, repeated measurements were carried out without any transfer characteristic shift to obtain stability characteristics (Fig. 6).

顯示由PI-4所得之膜不僅作為電極形成膜優異且作為有機電晶體用之閘極絕緣膜亦優異。The film obtained from PI-4 is excellent not only as an electrode forming film but also as a gate insulating film for an organic transistor.

<實施例18:電晶體特性><Example 18: Crystal characteristics>

除使用合成例14調製之組成物A以外,與實施例17同樣地製作有機電晶體。於本實施例作成之電晶體W=2mm,L=100μm,C=6.5nF/cm2An organic transistor was produced in the same manner as in Example 17 except that the composition A prepared in Synthesis Example 14 was used. The transistor W made in this example was W = 2 mm, L = 100 μm, and C = 6.5 nF/cm 2 .

并五苯之移動度μ基於該式計算後,平均為5×10-2 cm2 /Vs。又,閾值電壓自-19V至-21V,開狀態與關狀態之比(開/關比)為106 等級。又進行重複測定亦未見到傳達特性偏移而獲得安定特性(圖7)。The mobility of pentacene is calculated to be 5 × 10 -2 cm 2 /Vs on the basis of this formula. Further, the threshold voltage is from -19V to -21V, and the ratio of the on state to the off state (on/off ratio) is 10 6 . Further, repeated measurement was carried out, and no characteristic shift was observed to obtain stability characteristics (Fig. 7).

顯示由組成物A所得之膜不僅作為電極形成膜優異且作為有機電晶體用之閘極絕緣膜亦優異。The film obtained from the composition A is excellent not only as an electrode forming film but also as a gate insulating film for an organic transistor.

<實施例19:電晶體特性><Example 19: Crystal characteristics>

除紫外線照射量設為1J/cm2 以外,與實施例17同樣地製作有機電晶體。於本實施例作成之電晶體W=2mm,L=100μm,C=6.4nF/cm2An organic transistor was produced in the same manner as in Example 17 except that the amount of ultraviolet irradiation was set to 1 J/cm 2 . The transistor W made in this example had W = 2 mm, L = 100 μm, and C = 6.4 nF/cm 2 .

并五苯之移動度μ基於該式計算後,平均為3×10-2 cm2 /Vs。又,閾值電壓自-16V至-20V,開狀態與關狀態之比(開/關比)為106 等級。又進行重複測定亦未見到傳達特性偏移而獲得安定特性(圖8)。The mobility of pentacene is calculated to be 3 × 10 -2 cm 2 /Vs on the basis of this formula. Further, the threshold voltage is from -16V to -20V, and the ratio of the on state to the off state (on/off ratio) is 10 6 levels. Further, repeated measurements were carried out, and no characteristic shift was observed to obtain stability characteristics (Fig. 8).

顯示由組成物A所得之膜不僅作為電極形成膜優異且作為有機電晶體用之閘極絕緣膜亦優異。The film obtained from the composition A is excellent not only as an electrode forming film but also as a gate insulating film for an organic transistor.

[產業上之可能利用性][Industry possible use]

依據本發明之形成畫像用下層膜可實現縮短用以使親疏水性產生變化之必要曝光時間,可期待縮減於形成電極等之機能性材料之圖型化層時之製造成本。According to the underlayer film for forming an image of the present invention, it is possible to shorten the necessary exposure time for changing the hydrophilicity and hydrophobicity, and it is expected to reduce the manufacturing cost when forming a patterned layer of a functional material such as an electrode.

此外,藉由照射偏光UV,亦可對由前述聚醯亞胺前驅物及聚醯亞胺所得之膜賦予異向性。亦即,亦可使用作為液晶或半導體等之機能性材料之配向處理膜,與作為形成畫像用下層膜時同樣,可期待縮短製造時間。Further, by irradiating the polarized light UV, an anisotropy can be imparted to the film obtained from the polyimine precursor and the polyimine. In other words, it is possible to use an alignment treatment film which is a functional material such as a liquid crystal or a semiconductor, and it is expected to shorten the manufacturing time as in the case of forming an underlayer film for an image.

圖1為表示實施例9所製作之PI-4上之銀電極的顯微鏡照片圖(銀電極線寬為100μm)。Fig. 1 is a photomicrograph showing a silver electrode on PI-4 produced in Example 9 (silver electrode line width: 100 μm).

圖2為表示實施例10所製作之組成物A上之銀電極的顯微鏡照片圖(銀電極線寬為100μm)。Fig. 2 is a photomicrograph showing a silver electrode on the composition A produced in Example 10 (silver electrode line width: 100 μm).

圖3為顯示將聚醯亞胺前驅物(PI-1)燒成所得之聚醯亞胺膜於氮氛圍中之電流-電壓特性之圖(實施例11及實施例12)。Fig. 3 is a graph showing current-voltage characteristics of a polyimide film obtained by firing a polyimide precursor (PI-1) in a nitrogen atmosphere (Example 11 and Example 12).

圖4為顯示將聚醯亞胺前驅物(PI-1)燒成所得之聚醯亞胺膜於大氣中之電流-電壓特性之圖(實施例11及實施例12)。Fig. 4 is a graph showing current-voltage characteristics of a polyimide film obtained by firing a polyimide precursor (PI-1) in the atmosphere (Example 11 and Example 12).

圖5為顯示於實施例13至實施例16所製作之聚醯亞胺膜於大氣中之電流-電壓特性之圖。Fig. 5 is a graph showing current-voltage characteristics of the polyimide film produced in Examples 13 to 16 in the atmosphere.

圖6為顯示對由PI-4所得之膜照射2J/cm2 紫外線並加工電極之有機電晶體之傳達特性之圖(實施例17)。Fig. 6 is a view showing the transmission characteristics of an organic transistor in which an electrode obtained by irradiating a film of PI-4 was irradiated with 2 J/cm 2 of ultraviolet rays and processed (Example 17).

圖7為顯示對由組成物A所得之膜照射2J/cm2 紫外線並加工電極之有機電晶體之傳達特性之圖(實施例18)。Fig. 7 is a view showing the transmission characteristics of an organic transistor in which an electrode obtained by irradiating a film of the composition A with 2 J/cm 2 of ultraviolet rays and processing the electrode (Example 18).

圖8為顯示對由PI-4所得之膜照射1J/cm2 紫外線並加工電極之有機電晶體之傳達特性之圖(實施例19)。Fig. 8 is a view showing the transmission characteristics of an organic transistor in which an electrode obtained by irradiating a film of PI-4 was irradiated with 1 J/cm 2 of ultraviolet rays and an electrode was processed (Example 19).

Claims (14)

一種形成畫像用下層膜,其特徵為包含含有以下述式(1)表示之重複構造之聚醯亞胺前驅物或使該聚醯亞胺前驅物脫水閉環所得之聚醯亞胺: (式中,A表示4價有機基,B表示以下述式(2)或(3)表示之2價構造,R1 、R2 分別獨立表示氫原子或1價有機基,n表示自然數); (X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示可經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。An underlayer film for forming an image, characterized by comprising a polyimine precursor containing a repeating structure represented by the following formula (1) or a polyimine imine obtained by dehydrating and ring-closing the polyimine precursor: (wherein A represents a tetravalent organic group, B represents a divalent structure represented by the following formula (2) or (3), and R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, and n represents a natural number) ; (X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, -CH 2 COO - or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which may be substituted by a fluorine atom, and R each independently represents a fluorine atom, an alkoxy group having 1 to 3 carbon atoms or a carbon number An alkyl group of 1 to 3, and t represents an integer of 0 to 3.). 一種形成畫像用下層膜,其特徵為包含使含有以 下述式(6)表示之四羧酸二酐之四羧酸二酐成分與含有以下述式(7)表示之二胺之二胺成分反應所得之聚醯亞胺前驅物,或使該聚醯亞胺前驅物脫水閉環所得之聚醯亞胺: [式中,A表示4價有機基,B表示以式(2)或式(3)表示之2價構造: (式中,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示可經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)]。An underlayer film for forming an image, which comprises reacting a tetracarboxylic dianhydride component containing a tetracarboxylic dianhydride represented by the following formula (6) with a diamine component containing a diamine represented by the following formula (7) The obtained polyimine precursor, or the polyimine obtained by dehydrating and ring-closing the polyimine precursor: Wherein A represents a tetravalent organic group, and B represents a divalent structure represented by formula (2) or formula (3): (wherein, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, - CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which may be substituted by a fluorine atom, and R each independently represents a fluorine atom, an alkoxy group having 1 to 3 carbon atoms or An alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3)]. 如申請專利範圍第1項之形成畫像用下層膜,其中式(2)或式(3)之Z表示任意氫原子經氟原子取代之碳原子數3至26之脂肪族烴基。 The underlayer film for forming an image as in the first aspect of the patent application, wherein Z of the formula (2) or the formula (3) represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which is substituted with a fluorine atom by any hydrogen atom. 如申請專利範圍第1項之形成畫像用下層膜,其中A表示具有脂肪族環或僅由脂肪族所構成之4價有機基。 The underlayer film for forming an image as in the first aspect of the patent application, wherein A represents a tetravalent organic group having an aliphatic ring or only an aliphatic group. 如申請專利範圍第1項之形成畫像用下層膜,其中B表示以式(2)表示之2價構造。 The underlayer film for forming an image as in the first aspect of the patent application, wherein B represents a divalent structure represented by the formula (2). 如申請專利範圍第1項之形成畫像用下層膜,其中X及Y表示單鍵。 An underlayer film for forming an image as in the first aspect of the patent application, wherein X and Y represent a single bond. 一種有機電晶體,其特徵為含有申請專利範圍第1至6項中任一項之形成畫像下層膜。 An organic transistor characterized by comprising the underlayer film for forming an image according to any one of claims 1 to 6. 一種以下述式(14)或下述式(15)表示之二胺化合物, (式中,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示任意的氫原子經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。a diamine compound represented by the following formula (14) or the following formula (15), (wherein, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, - CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms substituted by a fluorine atom, and R each independently represents a fluorine atom and an alkyl group having 1 to 3 carbon atoms. An oxy group or an alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3. 一種聚醯亞胺,其特徵為含有以下述式(1)表示之重複單位之聚醯亞胺前驅物或使該聚醯亞胺前驅物脫水 閉環所得, (式中,A表示4價有機基,B表示以下述式(2a)或(3a)表示之2價構造,R1 、R2 分別獨立表示氫原子或1價有機基,n表示自然數); (式中,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示任意的氫原子經氟原子取代之碳原子數3至26之脂肪族烴基,R各獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。A polyimine which is characterized by containing a polyimine precursor having a repeating unit represented by the following formula (1) or dehydrating and ring-closing the polyimine precursor, (wherein A represents a tetravalent organic group, B represents a divalent structure represented by the following formula (2a) or (3a), and R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, and n represents a natural number) ; (wherein, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-, -CONH-, -CH 2 O-, - CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms substituted by a fluorine atom, and R each independently represents a fluorine atom and an alkyl group having 1 to 3 carbon atoms. An oxy group or an alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3. 一種形成畫像下層膜塗佈液,其特徵為包含使含有以下述式(6)表示之四羧酸二酐之四羧酸二酐成分與含有以下述式(7)表示之二胺之二胺成分反應所得之聚醯亞胺前驅物,或使該聚醯亞胺前驅物脫水閉環所得之聚醯亞胺: (式中,A表示4價有機基,B表示以式(2)或式(3)表示之2價構造: R1 、R2 分別獨立表示氫原子或1價有機基,X表示單鍵或碳原子數6至20之2價芳香族基,Y表示單鍵、-O-、-COO-、-OCO-、-CONH-、-CH2 O-、-CH2 COO-或-CH2 CH2 COO-,Z表示可經氟原子取代之碳原子數3至26之脂肪族烴基,R獨立表示氟原子、碳原子數1至3之烷氧基或碳原子數1至3之烷基,t表示0至3之整數)。An image forming underlayer film coating liquid comprising a tetracarboxylic dianhydride component containing a tetracarboxylic dianhydride represented by the following formula (6) and a diamine containing a diamine represented by the following formula (7) The polyimine precursor obtained by the reaction of the component, or the polyimine obtained by dehydrating and ring-closing the polyimine precursor: (wherein A represents a tetravalent organic group, and B represents a divalent structure represented by formula (2) or formula (3): R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, X represents a single bond or a divalent aromatic group having 6 to 20 carbon atoms, and Y represents a single bond, -O-, -COO-, -OCO-. , -CONH-, -CH 2 O-, -CH 2 COO- or -CH 2 CH 2 COO-, Z represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms which may be substituted by a fluorine atom, and R independently represents a fluorine atom, An alkoxy group having 1 to 3 carbon atoms or an alkyl group having 1 to 3 carbon atoms, and t represents an integer of 0 to 3. 如申請專利範圍第10項之形成畫像下層膜塗佈液,其中式(2)或式(3)之Z表示任意氫原子經氟原子取代之碳原子數3至26之脂肪族烴基。 The underlayer film coating liquid is formed by the method of claim 10, wherein Z of the formula (2) or the formula (3) represents an aliphatic hydrocarbon group having 3 to 26 carbon atoms in which any hydrogen atom is substituted with a fluorine atom. 如申請專利範圍第10項之形成畫像用下層膜塗佈液,其中進一步含有醯亞胺化率為80%以上之可溶性聚醯亞胺。 The underlayer film coating liquid for forming an image according to claim 10, further comprising a soluble polyimine having a ruthenium iodide ratio of 80% or more. 一種形成畫像之下層膜,其特徵為使申請專利範 圍第10至12項之形成畫像下層膜塗佈液燒成而得。 a film formed under the portrait, which is characterized by a patent application The formation of the underlayer film coating liquid in the form of the items 10 to 12 is obtained by firing. 一種有機電晶體,其特徵為具有使申請專利範圍第10至12項之形成畫像下層膜塗佈液燒成而得之膜。 An organic transistor characterized by having a film obtained by firing an underlayer film coating liquid of the image forming method of Items 10 to 12.
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