JP4312476B2 - Pattern forming method, electronic device, electronic device array, and image display device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pattern forming method using an organic material, an electronic element, an electronic element array, and an image display device.
[0002]
[Prior art]
Patent Document 1 proposes a patterning method for an organic electroluminescence (EL) material. This patterning method creates an organic EL element through the following steps 1-7.
[0003]
1. After embedding a fine structure including a driving circuit in a transparent substrate and forming a protective thin film, a lyophilic transparent electrode is formed.
[0004]
2. Next, after covering the entire surface of the transparent substrate with an insulating film made of a lyophilic material such as a silicon oxide film, by patterning it, the region where the transparent electrode is not formed, that is, the protective thin film is exposed. Cover the area with an insulating film.
[0005]
3. This is put in a sealed container together with heptadecafluorotetrahydrodecyltriethoxysilane and allowed to stand at room temperature for 96 hours to form a liquid repellent film on the entire surface of the transparent substrate.
[0006]
4). Next, the surface of the transparent substrate is selectively irradiated with ultraviolet rays through a mask to decompose and remove the liquid repellent film in the pixel formation region portion of the liquid repellent film.
[0007]
5). Next, a hole injection material is applied to the pixel formation region by an inkjet method and dried to form a hole injection layer.
[0008]
6). Similarly, an organic EL layer is also formed to form a light emitting layer.
[0009]
7. Finally, a cathode layer is formed to complete the organic EL element.
[0010]
[Patent Document 1]
JP 2002-15866 A
[0011]
[Problems to be solved by the invention]
Compared to electronic devices using inorganic materials, electronic devices using organic materials
(1). Easy manufacturing process such as film formation
(2). Easy to fabricate on flexible board because the material itself is flexible
Various applications such as an insulating film, a dielectric film, a conductive film, a semiconductor element, a light emitting element, and a flexible and lightweight image display device using them are expected. On the other hand, the processing method has not been established yet, and rapid development of the processing method is desired.
[0012]
On the other hand, as a patterning method used for manufacturing an electronic device, a photolithography technique is widely used in the field of inorganic materials. In the photolithography technique, patterning is generally performed by the following processes 1 to 5. That is,
1. First, a material to be patterned (hereinafter referred to as material A) is formed on the entire surface of the substrate.
[0013]
2. Next, a photoresist is coated on the formed material A, dried, and a pattern to be formed is exposed using a photomask.
[0014]
3. Then, a resist pattern is formed by developing and rinsing the resist.
[0015]
4). Thereafter, the material A is etched with an etching agent that dissolves the material A.
[0016]
5). After this etching, the material A can be patterned into a desired pattern by removing the resist.
[0017]
However, regarding the patterning of organic materials, it is difficult to use the patterning method of inorganic materials as they are for the following reasons.
(1). Organic materials are more susceptible to physical and chemical damage than inorganic materials. That is, it is easy to be damaged during etching or removal of the resist after etching, and it is difficult to suppress deterioration of the material.
(2). The resist agent used for patterning the inorganic material is an organic material, and depending on the organic material to be patterned, there is a risk of being damaged by the solvent of the resist agent when the resist agent is applied.
[0018]
Therefore, as disclosed in Patent Document 1, a method for patterning an organic EL material has been proposed.
[0019]
However, this method has a disadvantage that it takes a long time to form the liquid repellent film and is not practical.
[0020]
Further, in the technique of Patent Document 1, since the fluorine-containing organic film is decomposed and removed during patterning, the fluorine-containing organic film generates harmful decomposition gas due to decomposition, which is not preferable in terms of safety and environment. There are also defects.
[0021]
An object of the present invention is to reduce manufacturing costs and improve safety and environmental performance in a manufacturing process when forming a pattern of an organic material or the like.
[0031]
[Means for Solving the Problems]
  Claim1The invention described in (1) includes forming a gate electrode, a gate insulating film, a source electrode, and a drain electrode on an insulating substrate, and forming the gate electrode, the gate insulating film, the source electrode, and the drain electrode of the insulating substrate. Forming a liquid repellent layer that is a negative pattern of the pattern of the organic semiconductor layer by applying a silicone-based material that is polymerized by an electron beam or an ultraviolet ray to the surface on the exposed side and irradiating the electron beam or the ultraviolet ray; Forming an organic semiconductor layer that is a pattern of the organic semiconductor material by applying a liquid containing the organic semiconductor material to a surface of the insulating substrate on which the liquid-repellent layer is formed. This is a pattern forming method.
[0032]
Therefore, when the liquid repellent layer repels the liquid containing the organic semiconductor material, the organic semiconductor layer is formed only on the portion where the liquid repellent layer is not formed on the insulating substrate. The liquid repellent layer is selectively formed on the surface of the insulating substrate for each portion of the surface, and the liquid repellent material is not partially removed after the liquid repellent material is formed entirely on the substrate surface as in the past. Therefore, the formation of the liquid repellent layer can be completed in a short time to reduce the manufacturing cost, and no safety or environmental problems due to the generation of harmful decomposition gas are caused.
  furtherHigher productivity than vapor deposition and unpolymerizedSiliconeBy collecting the materials,SiliconeWaste of materials can be reduced.
[0035]
  In the step of forming the liquid repellent layer, a material obtained by mixing a photocatalyst with the silicone-based material that is polymerized by the electron beam or ultraviolet light may be applied.2). In this case, if the photocatalyst uses titanium dioxide particles (claim)3), Which is desirable because it has a strong photocatalytic action.
[0036]
  Claim4The invention described in claim 1 to claim 13In the pattern forming method according to any one of the above, in the step of forming the organic semiconductor layer, the liquid containing the organic semiconductor material is applied to the side of the insulating substrate on which the liquid repellent layer is formed in the step of forming the organic semiconductor layer. It is characterized by giving to the surface.
[0037]
  Therefore, the required amount of organicsemiconductorMaterial can be applied selectively,InsulationOn the surface of the boardLiquid repellent layerIs formed, so even if the inkjet spraying position accuracy is not accurate,Liquid repellent layerOrganicsemiconductorA liquid containing the material can be applied.
[0038]
  Claim5The invention described in claim 1 to claim 13In the pattern forming method according to any one of the above, in the step of forming the organic semiconductor layer, a liquid containing the organic semiconductor material is applied by spin coating to the side on which the liquid-repellent layer of the insulating substrate is formed. It is characterized by giving to the surface of.
[0039]
  Therefore,Insulation properties of liquids containing organic semiconductor materialsTo substrate surfaceWithGivenLiquid repellent layerFrom aboveRemovalCan be done at the same time, compared to the inkjet methodInsulationAll over the board at onceContains organic semiconductor materialsSince liquid can be applied, it is efficientOrganic semiconductorA layer can be formed.
[0040]
  Claim6The invention described in claim 1 to claim 13In the pattern forming method according to any one of the above, in the step of forming the organic semiconductor layer, the liquid containing the organic semiconductor material is applied to the side on which the liquid repellent layer of the insulating substrate is formed by dip coating. It is characterized by giving to the surface of.
[0041]
  Therefore,Organic semiconductorThe layer formation efficiency is high,Contains organic semiconductor materialsLiquidInsulationSince it adheres only to the non-liquid-repellent part of the substrate and all the excess liquid is recovered, no material is wasted.
[0042]
  Claim7The invention described in 1 is an electronic device including an insulating substrate, a gate electrode, a gate insulating film, a source electrode, a drain electrode, a liquid repellent layer, and an organic semiconductor layer,6It is manufactured using the pattern formation method as described in any one of these.
[0043]
  Therefore, this electronic device, MadeIt is possible to reduce manufacturing costs, maintain safety in the manufacturing process, and maintain environmental performance.
[0044]
  Claim8The invention according to claim 1 is an electronic element array comprising an insulating substrate, a gate electrode, a gate insulating film, a source electrode, a drain electrode, a liquid repellent layer, and an organic semiconductor layer.6It is manufactured using the pattern formation method as described in any one of these.
[0045]
  Therefore, this electronic element array, MadeIt is possible to reduce manufacturing costs, maintain safety in the manufacturing process, and maintain environmental performance.
[0046]
  Claim9The invention described in claim8It is an image display apparatus provided with the electronic element array of description.
[0047]
Therefore, it is possible to provide an image display device manufactured by an electronic element array having high safety and high environmental performance at a low manufacturing cost.
[0048]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 of the Invention
One embodiment of the present invention will be described as Embodiment 1 of the present invention.
[0049]
1 and 2 are longitudinal sectional views of an electronic element array 1 being manufactured by the organic pattern formation method of the present embodiment. Each embodiment described below will be described with reference to FIGS. 1 and 2.
[0050]
(1) First step
As shown in FIG. 1, first, a gate electrode 12, a gate insulating film 13, a source electrode 14, and a drain electrode 15 are sequentially formed on an insulating substrate 11 in this order by a normal photolithography process.
[0051]
(2) Second step (negative pattern forming step)
Next, using a compound having a fluoroalkyl group as a liquid repellent material that selectively repels a liquid containing a predetermined organic material for each surface portion on the surface of the substrate 11, a negative pattern of the pattern of the organic material Is formed by vapor deposition using a mask. In other words, the masked substrate 11 and a compound containing a fluoroalkyl group are placed in a vacuum chamber (not shown), and the compound containing a fluoroalkyl group is heated at 200 ° C. or lower for vapor deposition.
[0052]
As an example, a liquid repellent layer 16 having a predetermined negative pattern is obtained by depositing a metal mask (not shown) on the surface of the substrate 11 and depositing a fluorine-based coating agent (using “OPTOOL DSX” manufactured by Daikin Industries). Form.
[0053]
(2) Third step (material layer forming step)
And the liquid containing the above-mentioned organic material is given to the surface of the board | substrate 11 in which the negative pattern of the liquid repellent layer 16 was formed. As a result, the liquid repellent layer 16 repels the liquid containing the organic material, whereby the material layer 17 having the organic material pattern is formed on the surface of the substrate 11 where the negative pattern is not formed.
[0054]
For example, a material layer (organic semiconductor layer) 17 is applied to the surface of the substrate 11 by applying a liquid obtained by dissolving poly (3-hexylthiophene) in chloroform with an inkjet liquid and then drying, as shown in FIG. Form.
[0055]
By the above manufacturing method, the liquid repellent layer 16 is selectively formed on the surface of the substrate 11 for each part of the surface, and after the liquid repellent material is formed entirely on the surface of the substrate 11 as in the prior art. Since it is not partly removed, the formation of the negative pattern can be completed in a short time, and there are no safety and environmental problems due to generation of harmful decomposition gas.
[0056]
The decomposition temperature of a compound containing a fluoroalkyl group varies depending on its molecular structure, but is generally higher than 200 ° C. Therefore, a negative pattern can be obtained by heating and vapor-depositing a compound containing a fluoroalkyl group at 200 ° C. or less. If formed, the liquid repellent pattern can be safely formed on the substrate without the liquid repellent material being decomposed.
[0057]
Furthermore, since inkjet is used as a method for applying a liquid containing an organic material, a necessary amount of the organic material can be selectively applied, and a liquid repellent negative pattern is formed on the surface of the substrate 11. Therefore, even if the accuracy of the ink jet spraying position is not accurate, a liquid containing a negative pattern organic material can be applied. In this case, if necessary, it is possible to remove unnecessary liquid adhering to the negative pattern by performing air blow or the like on the substrate surface after applying the liquid by inkjet.
[0058]
[Embodiment 2 of the Invention]
Another embodiment of the present invention will be described as a second embodiment of the present invention.
[0059]
(1) First step
Since it is the same as that of Embodiment 1, it abbreviate | omits.
[0060]
(2) Second step (negative pattern forming step)
Next, as a liquid repellent material that selectively repels a liquid containing a predetermined organic material for each surface portion on the surface of the substrate 11, a compound having a fluoroalkyl group and polymerized by electron beam or ultraviolet light And a negative pattern of the organic material pattern is formed by irradiating it with an electron beam or ultraviolet rays. In order to polymerize by ultraviolet rays or electron beams, the material applied to the substrate 11 may have a functional group activated by ultraviolet rays or electron beams such as an acrylic group, an epoxy group, or a thiol group.
[0061]
As an example, the liquid repellent layer 16 having a predetermined negative pattern is formed by coating perfluorooctyl acrylate on the surface of the substrate 11 and polymerizing it by irradiating ultraviolet rays through a photomask (not shown).
[0062]
(2) Third step (material layer forming step)
And the liquid containing the above-mentioned organic material is given to the surface of the board | substrate 11 in which the negative pattern of the liquid repellent layer 16 was formed. As a result, the liquid repellent layer 16 repels the liquid containing the organic material, whereby the material layer 17 having the organic material pattern is formed on the surface of the substrate 11 where the negative pattern is not formed.
[0063]
As an example, a material layer (organic semiconductor layer) 17 is formed on the surface of the substrate 11 by dip-coating a liquid obtained by dissolving poly-3-hexylthiophene in chloroform and then drying, as shown in FIG. .
[0064]
By the above manufacturing method, the liquid repellent layer 16 is selectively formed on the surface of the substrate 11 for each part of the surface, and after the liquid repellent material is formed entirely on the surface of the substrate 11 as in the prior art. Since it is not partly removed, the formation of the negative pattern can be completed in a short time, and there are no safety and environmental problems due to generation of harmful decomposition gas.
[0065]
Further, since a negative pattern can be formed by applying a liquid repellent material and irradiating with an electron beam or ultraviolet rays, productivity is improved as compared with the case of using vapor deposition.
[0066]
In order to polymerize by ultraviolet rays or electron beams, it is only necessary to have functional groups activated by ultraviolet rays or electron beams, such as acrylic groups, epoxy groups, and thiol groups. In this case, the liquid repellent material does not decompose, so it is safe. A negative pattern can be formed on the substrate.
[0067]
Furthermore, if the dip coating method is used, the material layer is formed with high efficiency, and the liquid adheres only to the non-liquid-repellent portion of the substrate, and all excess liquid is collected, so that no material is wasted.
[0068]
Embodiment 3 of the Invention
Another embodiment of the present invention will be described as a third embodiment of the present invention.
[0069]
(1) First step
Since it is the same as that of Embodiment 1, it abbreviate | omits.
[0070]
(2) Second step (negative pattern forming step)
Next, a silicone-based material is applied to the surface of the substrate 11 as a liquid repellent material that selectively repels a liquid containing a predetermined organic material for each part of the surface, and the organic material is deposited by vapor deposition using a mask. A negative pattern of the pattern is formed.
[0071]
As an example, a predetermined negative pattern of a predetermined negative pattern is obtained by coating a substrate 11 with ultraviolet polymerization type silicone (using TPR6500 made by GE Toshiba Silicone) and irradiating it with ultraviolet rays through a photomask (not shown). A liquid repellent layer 16 is formed.
[0072]
(2) Third step (material layer forming step)
And the liquid containing the above-mentioned organic material is given to the surface of the board | substrate 11 in which the negative pattern of the liquid repellent layer 16 was formed. As a result, the liquid repellent layer 16 repels the liquid containing the organic material, whereby the material layer 17 having the organic material pattern is formed on the surface of the substrate 11 where the negative pattern is not formed.
[0073]
As an example, a material layer (organic semiconductor layer) 17 is formed on the surface of the substrate 11 by spin-coating a liquid obtained by dissolving poly-3-hexylthiophene in chloroform and then drying, as shown in FIG. .
[0074]
By the above manufacturing method, the liquid repellent layer 16 is selectively formed on the surface of the substrate 11 for each part of the surface, and after the liquid repellent material is formed entirely on the surface of the substrate 11 as in the prior art. Since it is not partly removed, the formation of the negative pattern can be completed in a short time, and there are no safety and environmental problems due to generation of harmful decomposition gas.
[0075]
Also, since the silicone material does not release harmful substances even when heated, a negative pattern can be safely formed on the substrate.
[0076]
Furthermore, if the spin coating method is used, the liquid can be applied to the surface of the substrate 11 and the liquid can be removed from the negative pattern at the same time, and once on the entire surface of the substrate 11 as compared with the ink jet method described above. Since the liquid can be applied to the material layer 16, the material layer 16 can be formed efficiently.
[0077]
[Embodiment 4 of the Invention]
Another embodiment of the present invention will be described as a fourth embodiment of the present invention.
[0078]
(1) First step
Since it is the same as that of Embodiment 1, it abbreviate | omits.
[0079]
(2) Second step (negative pattern forming step)
Next, a liquid-repellent material that selectively repels a liquid containing a predetermined organic material for each portion of the surface on the surface of the substrate 11 is a silicone-based material that is polymerized by electron beams or ultraviolet rays, By irradiating with an electron beam or ultraviolet rays, a negative pattern of the organic material pattern is formed. In order to polymerize by ultraviolet rays or electron beams, the material applied to the substrate 11 may have a functional group activated by ultraviolet rays or electron beams such as an acrylic group, an epoxy group, or a thiol group.
[0080]
For example, a material in which titanium dioxide particles having a particle size of 30 nm are mixed with UV-polymerized silicone (using TPR6500 made by GE Toshiba Silicone) as a photocatalyst is coated on the surface of the substrate 11 to form a photomask (not shown). The liquid repellent layer 16, which is a negative pattern of an organic material pattern, is formed on the surface of the substrate 11 by being irradiated with ultraviolet rays.
[0081]
Note that a photocatalyst is a material that is activated by an irradiated electron beam or ultraviolet light and accelerates a molecular polymerization reaction or decomposition reaction. In particular, titanium dioxide is desirable because it has a strong photocatalytic action. In this case, the larger the surface area of titanium dioxide, the higher the effect as a photocatalyst. Further, in order to maintain the liquid repellency of the liquid repellent layer 16 when the film is formed, it is preferable that the particle diameter is small. Although depending on the film thickness and content, it is 500 nm or less, preferably 50 nm or less.
[0082]
(2) Third step (material layer forming step)
Since it is the same as that of Embodiment 1, it abbreviate | omits.
[0083]
By the above manufacturing method, the liquid repellent layer 16 is selectively formed on the surface of the substrate 11 for each part of the surface, and after the liquid repellent material is formed entirely on the surface of the substrate 11 as in the prior art. Since it is not partly removed, the formation of the negative pattern can be completed in a short time, and there are no safety and environmental problems due to generation of harmful decomposition gas.
[0084]
In addition, productivity is higher than when vapor deposition is used, and waste of the liquid repellent material can be reduced by collecting the unpolymerized liquid repellent material.
[0085]
Furthermore, if functional groups such as acrylic, methacrylic, epoxy, and thiol groups that are polymerized by ultraviolet rays and electron beams are used, a negative pattern can be safely formed on the substrate without decomposing the liquid repellent material. Can do. In this example, the ultraviolet irradiation time required for the polymerization was about 2/3 as compared with the case of the fourth embodiment.
[0086]
  [Reference example 1]
  Of the present inventionReference exampleTheReference example 1Will be described.
[0087]
(1) First step
Since it is the same as that of Embodiment 1, it abbreviate | omits.
[0088]
(2) Second step (negative pattern forming step)
Next, a silicone-based material having liquid repellency that repels a liquid containing a predetermined organic material, which is decomposed by an electron beam or ultraviolet rays, is applied to the surface of the substrate 11. The silicon-based material is selectively decomposed for each region of the surface of the substrate 11 to form the liquid repellent layer 16 that is a negative pattern of the organic material pattern on the surface of the substrate 11.
[0089]
As an example, a silicone resin coating agent (using SR2410 made by Toray Dow Corning Silicone) is applied onto the substrate 11, and this is dried and cured to form a liquid repellent layer 16, on which a photomask (not shown) is formed. The formed liquid repellent layer 16 is selectively decomposed for each region of the surface of the substrate 11 by irradiating ultraviolet rays through the substrate 11, and the liquid repellent layer 16 that is a negative pattern of the organic material pattern is formed on the substrate 11. Form on the surface.
[0090]
(2) Third step (material layer forming step)
Since it is the same as that of Embodiment 1, it abbreviate | omits.
[0091]
In each of the above embodiments, the liquid repellent layer 16 has a liquid repellency of repelling poly-3hexylthiophene from a liquid containing an organic material such as chloroform, that is, a property that the liquid repellent layer 16 does not wet the liquid. Specifically, as the liquid repellent material used for the liquid repellent layer 16, it is desirable to use a material having a surface energy of 20 mN / m or less.
[0092]
Accordingly, since the silicone material does not release harmful substances due to decomposition, a negative pattern can be formed safely, and productivity is increased because a vacuum chamber is not used as compared with formation by vapor deposition.
[0093]
  [Sixth Embodiment of the Invention]
  Embodiments 1 to 3 as described above4 and Reference Example 1Through one of the manufacturing methods, an electronic element array 1 having a cross-sectional configuration shown in FIG. 2 in which a plurality of transistors 18 as electronic elements are arranged is manufactured. And if this electronic element array 1 is used, the image display apparatus 21 (refer FIG. 4) which displays an image can be produced.
[0094]
When the characteristics of each transistor 18 produced in this way were evaluated, the same characteristics as those obtained when a single transistor was produced using the same material were shown, and it was confirmed that each transistor 18 operated well. As a comparative example, when the organic semiconductor layer 17 is formed on the entire surface of the substrate 1 without forming the negative pattern of the liquid repellent material as shown in FIG. Mutual interference due to leakage current was large.
[0095]
  Embodiment 14 and Reference Example 1In the electronic element array 1 manufactured by the above method, the liquid repellent layer 16 is selectively formed for each part of the surface of the substrate 1, so that the liquid repellent layer 16 is provided between the material layer 17 and the substrate 11. Not formed at all. On the other hand, in the technique disclosed in Patent Document 1 described above, the liquid repellent layer 16 is once formed on the entire surface of the substrate 11 and then the unnecessary portion of the liquid repellent layer 16 is removed. In some cases, the liquid repellent layer 16 remains between the material layer 17 and the substrate 11.
[0096]
In the above example, only the example of the electronic element array 1 composed of the transistor 18 and the manufacturing technique thereof is shown. However, the insulating film or dielectric film made of an organic material, the patterning of the conductive film, the diode, Semiconductor elements other than transistors, such as organic light emitting elements, can also be manufactured by this technique.
[0097]
Embodiment 7 of the Invention
FIG. 4 is a longitudinal sectional view of an image display device 21 using the electronic element array 1.
[0098]
As shown in FIG. 4, the image display device 21 includes a display element 24 provided between the above-described electronic element array substrate 1 and a second substrate 23 having a transparent conductive film 22, and a drain electrode also serving as a pixel electrode. 15 display elements 24 are switched. As the second substrate 23, plastic such as glass, polyester, polycarbonate, polyarylate, polyether sulfone, or the like can be used. As the display element 24, methods such as liquid crystal, electrophoresis, and organic EL can be used.
[0099]
In this case, since the liquid crystal display element is driven by an electric field, the power consumption is small, and since the driving voltage is low, the driving frequency of the transistor can be increased, which is suitable for large-capacity display. Examples of liquid crystal display elements include TN, STN, guest-host type, polymer-dispersed liquid crystal (PDLC), etc. PDLC is a reflective type that provides a bright white display. Is preferred.
[0100]
The image display device 21 using electrophoresis is composed of a dispersion liquid in which particles exhibiting a first color (for example, white) are dispersed in a coloring dispersion medium exhibiting a second color, and particles exhibiting the first color. By being charged in the colored dispersion medium, the position of the dispersion medium in the dispersion medium can be changed by the action of an electric field, thereby changing the displayed color. This display method is particularly suitable from the viewpoint of power consumption because it can display brightly and with a wide viewing angle and has a display memory property.
[0101]
In addition, by using a microcapsule in which the dispersion is wrapped with a polymer film, the display operation is stabilized and the display device can be easily manufactured. Microcapsules can be produced by a known method such as a coacervation method, an in-situ polymerization method, or an interfacial polymerization method. Titanium oxide is particularly preferably used as the white particles, and surface treatment or compounding with other materials is performed as necessary. Examples of the dispersion medium include aromatic hydrocarbons such as benzene, toluene, xylene, naphthenic hydrocarbons, aliphatic hydrocarbons such as hexane, cyclohexane, kerosene, and paraffinic hydrocarbons, trichloroethylene, tetrachloroethylene, trichlorofluoroethylene, odor It is desirable to use an organic solvent having a high resistivity such as halogenated carbon (hydrocarbon) such as ethyl halide, fluorine-containing ether compound, fluorine-containing ester compound, or silicone oil. In order to color the dispersion medium, oil-soluble dyes such as anthraquinones and azo compounds having desired absorption characteristics are used. A surfactant or the like may be added to the dispersion for stabilization of dispersion.
[0102]
Furthermore, since the image display device 21 using organic EL is a self-luminous type, it can perform vivid full color display. Further, since the EL layer is a very thin organic thin film, it has a high flexibility and is particularly suitable for being formed on a flexible substrate.
[0103]
FIG. 5 is a longitudinal sectional view showing an example of a method for manufacturing the image display device 21.
[0104]
The image display device 21 shown in FIG. 5 is manufactured as follows.
[0105]
That is, microcapsules 34 containing titanium oxide particles 32 and isopar 33 colored with oil blue are mixed in a PVA aqueous solution and applied onto a polycarbonate substrate 23 on which a transparent electrode 22 made of ITO is formed. A layer 36 made of PVA binder 35 was formed. And this board | substrate and the electronic element array 1 manufactured in Embodiment 5 are adhere | attached.
[0106]
Then, the driver IC for scanning signal is connected to the bus line connected to the gate electrode 12, and the driver IC for data signal is connected to the bus line connected to the source electrode.
[0107]
Thus, when the manufactured image display apparatus 21 was driven and the screen was switched every 0.5 seconds, a good still image display could be performed.
[0112]
  Claim1In the invention described in (1), the formation of the liquid repellent layer can be completed in a short time and the manufacturing cost can be reduced, and there are no safety and environmental problems due to generation of harmful decomposition gas.
  Furthermore, waste of the silicone material can be reduced.
[0114]
  Claim4In the invention described in (1), it is possible to apply a liquid containing an organic semiconductor material to the liquid repellent layer even if the accuracy of the spraying position of the ink jet is not accurate.
[0115]
  Claim5The invention described in (1) can simultaneously apply a liquid containing an organic semiconductor material to the surface of the insulating substrate and remove the liquid from the negative pattern. Since a liquid containing an organic semiconductor material can be applied, an organic semiconductor layer can be efficiently formed.
[0116]
  Claim6In the invention described in (1), the formation efficiency of the organic semiconductor layer is high, and waste of the organic semiconductor material does not occur.
[0117]
  Claim7,8The invention described in 1 can reduce manufacturing costs, maintain safety in the manufacturing process, and maintain environmental performance.
[0118]
  Claim9The invention described in 1 can provide an image display device manufactured by an electronic element array having high safety and environmental performance.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a longitudinal sectional view of an electronic element array in the course of manufacture, illustrating a method for forming a pattern of organic material according to an embodiment of the present invention.
FIG. 2 is a longitudinal sectional view of an electronic element array for explaining a method for forming a pattern of an organic material according to an embodiment of the present invention.
FIG. 3 is a longitudinal sectional view of an electronic element array as a comparative example.
FIG. 4 is a longitudinal sectional view of an image display device using an electronic element array.
FIG. 5 is a longitudinal sectional view for explaining a manufacturing process for the image display device.
[Explanation of symbols]
1 Electronic element array
11 Substrate
16 Liquid repellent layer
17 Material layer
18 Electronic elements
21 Image display device

Claims (9)

Forming a gate electrode, a gate insulating film, a source electrode and a drain electrode on an insulating substrate;
By applying a silicone-based material that is polymerized by an electron beam or ultraviolet rays to the surface of the insulating substrate on which the gate electrode, gate insulating film, source electrode and drain electrode are formed, and irradiating the electron beam or ultraviolet rays. Forming a liquid repellent layer that is a negative pattern of the pattern of the organic semiconductor layer;
Forming an organic semiconductor layer that is a pattern of the organic semiconductor material by applying a liquid containing the organic semiconductor material to the surface of the insulating substrate on which the liquid-repellent layer is formed. A pattern forming method. In the step of forming the liquid repellent layer, a pattern forming method according to claim 1, characterized in that applying a material obtained by mixing a photocatalyst in a silicone material to be polymerized by the electron beam or ultraviolet radiation. The pattern forming method according to claim 2 , wherein the photocatalyst is titanium dioxide particles. In the step of forming the organic semiconductor layer, according to claim 1, wherein providing a liquid containing the organic semiconductor material by inkjet on the insulating said liquid repellent layer is formed on the side surface of the substrate The pattern formation method as described in any one of these. 2. The step of forming the organic semiconductor layer, wherein a liquid containing the organic semiconductor material is applied to a surface of the insulating substrate on the side where the liquid repellent layer is formed by spin coating. the pattern forming method according to any one of 3. 2. The step of forming the organic semiconductor layer, wherein a liquid containing the organic semiconductor material is applied to the surface of the insulating substrate on the side where the liquid repellent layer is formed by dip coating. the pattern forming method according to any one of 3. An electronic device comprising an insulating substrate, a gate electrode, a gate insulating film, a source electrode, a drain electrode, a liquid repellent layer, and an organic semiconductor layer,
Electronic device characterized by being manufactured by using the pattern forming method according to any one of claims 1 to 6. An electronic element array comprising an insulating substrate, a gate electrode, a gate insulating film, a source electrode, a drain electrode, a liquid repellent layer, and an organic semiconductor layer,
Electronics array, characterized in that it is produced using the pattern forming method according to any one of claims 1 to 6. An image display device comprising the electronic element array according to claim 8 .

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