TWI451937B - Method for grinding drill - Google Patents
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- TWI451937B TWI451937B TW100131638A TW100131638A TWI451937B TW I451937 B TWI451937 B TW I451937B TW 100131638 A TW100131638 A TW 100131638A TW 100131638 A TW100131638 A TW 100131638A TW I451937 B TWI451937 B TW I451937B
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Description
本發明係關於一種研磨鑽頭的方法,尤指一種可以判斷鑽頭研磨面分離或重疊狀況的產生,又可以進行鑽頭中心線高度不準的校正,以研磨出具有高度精密性的研磨面的鑽頭之方法。The invention relates to a method for grinding a drill bit, in particular to a drill bit which can judge the generation of the separation or overlapping condition of the grinding surface of the drill bit, and can correct the height of the center line of the drill bit to grind the grinding surface with high precision. method.
印刷線路板(PCB)的應用是非常廣泛的,甚至是造成第三次工業革命的主要因素之一。日常生活的食、衣、住、行,幾乎沒有一項是印刷線路板所不介入的。食的方面,可以加熱或烹煮食物的微波爐;衣的方面,可以清洗衣服的洗衣機;住的方面,可以照亮室內的燈具;行的方面,可以提供乘載人員的汽車。因此,如以上所述,所有日常生活每天必利用的工具,就必然有印刷線路板存在其中。The application of printed circuit boards (PCBs) is very extensive and even one of the main factors contributing to the third industrial revolution. Almost none of the daily food, clothing, housing, and travel is printed circuit boards. In terms of food, a microwave oven that can heat or cook food; in terms of clothing, a washing machine that can clean clothes; in terms of living, it can illuminate indoor lamps; in terms of line, it can provide a car for passengers. Therefore, as described above, all the tools that must be used every day in daily life, there must be a printed circuit board.
隨著印刷電路板的應用範圍增加,由早期的單層板增加成多層板。於是,在各層之間的電路即需要有連接線路,以可讓各層板的印刷電路彼此電性連接。因此,這些貫穿於各層板的連接線路是要透過一些極端細小的鑽頭鑽孔後,才可通透於各層板間。這些細小的鑽頭其尺寸可能如頭髮一般細小,如此才可鑽出細小的孔洞,以供印刷電路板的線路通過。依據上述的需求與應用,可以得出幾個重點:As the range of applications for printed circuit boards has increased, they have been added to multi-layer boards from early single-layer boards. Thus, the circuit between the layers requires a connection line to allow the printed circuits of the layers to be electrically connected to each other. Therefore, these connecting lines running through the various layers are drilled through some extremely thin drill bits before they can penetrate between the layers. These tiny drill bits may be as small as the hair so that small holes can be drilled for the printed circuit board to pass through. Based on the above requirements and applications, several key points can be drawn:
1.需求量大:概因印刷線路板的應用廣泛,所以其週邊工業亦隨之成正比增加。1. Large demand: Due to the wide application of printed circuit boards, the surrounding industries have also increased in proportion.
2.尺寸精準:概因應用於精密工業,故鑽頭之各種尺寸是必須非常精準的。2. Accurate size: The reason is applied to precision industry, so the various dimensions of the drill bit must be very precise.
所以,在鑽頭精準地去鑽孔之前,其自身的精度也必須是非常高的。若是精密度不夠而有誤差,則所鑽出來的孔會相對地誤差更大,也有可能造成鑽頭斷裂。因此,在生產製造時對鑽頭的研磨,其精密度是非常重要的。Therefore, before the drill bit is accurately drilled, its own precision must be very high. If the precision is not enough and there is an error, the hole drilled will have a relatively large error, and it may cause the bit to break. Therefore, the precision of grinding the drill bit during production is very important.
請參考第六圖,係一鑽頭中心線高度與二研磨砂輪裝置中心假想連接線高度之相對位置關係示意圖。如圖所示,一鑽頭座R10挟持著一鑽頭R11,該鑽頭R11的一研磨部R12被一支架U所支持著,以將鑽頭R11的一鑽頭中心線L7之高度保持與二研磨砂輪裝置W1與W2之一中心假想連接線L6高度相同。第六圖顯示正常的鑽頭與該二研磨砂輪的位置關係;而該研磨部R12之一端面S則是被研磨的部分。Please refer to the sixth figure, which is a schematic diagram showing the relative positional relationship between the height of the centerline of a drill bit and the height of the imaginary connecting line of the center of the two grinding wheel device. As shown, a drill bit R10 holds a drill bit R11, and a grinding portion R12 of the drill bit R11 is supported by a bracket U to maintain the height of a bit center line L7 of the drill bit R11 with the two grinding wheel device W1. It is the same height as the center imaginary connection line L6 of W2. The sixth figure shows the positional relationship between the normal drill bit and the two grinding wheels; and the one end surface S of the grinding portion R12 is the portion to be ground.
請參考第七圖與第八圖,係一鑽頭中心線高度低於二研磨砂輪裝置中心假想連接線高度所研磨出之鑽頭端面示意圖與一鑽頭中心線高度高於二研磨砂輪裝置中心假想連接線高度所研磨出之鑽頭端面示意圖。如第六圖所示,一鑽頭之端面S(即被研磨面)與二研磨砂輪裝置W1與W2,實際研磨時,該端面S會直接垂直接觸研磨砂輪裝置W1與W2之二研磨面W11與W22。所以,第七圖所示的二研磨砂輪裝置WI與W2是從側邊視之,而端面S則是從前面視之,如此得以顯示研磨後的端面S具有四個研磨面,包括一第一被研磨面M1、一第二被研磨面N1、一第三被研磨面O1與一第四被研磨面P1。鑽頭之端面與研磨砂輪裝置W1與W2之詳細相對位置,將可參考本文後段說明。第七圖中,鑽頭中心線L7高度低於二研磨砂輪裝置W1、W2之中心假想連接線L6高度,研磨後得出該第一被研磨面M1、該第二被研磨面N1、該第三被研磨面O1與該第四被研磨面P1,其中,第一被研磨面M1由複數個點A6、B6、C6、D6、D7、A7所圍成之區域,第二被研磨面N1由複數個點A7、D7、E7、F7所圍成之區域,第三被研磨面O1由複數個點A6、A7、F7、H7、I7、I6所圍成之區域,第四被研磨面P1由複數個點A6、I6、J6、B6所圍成之區域。顯而易見,點A6與點A7並無交於一點,第二被研磨面N1與第四被研磨面P1未有交點,所以業界稱分離。然,如第七圖所示,以鑽頭中心線高度L7低於二研磨砂輪裝置中心假想連接線L6高度1μm而言,研磨的過程中在產生了第一被研磨面M1與第二被研磨面N1後,會被固定鑽頭的鑽頭座進行自體旋轉180度,以再研磨產生第三被研磨面O1與第四被研磨面P1。所以,如圖所示,當四個研磨面產生後,第二被研磨面N1與第四被研磨面P1的二邊線即差了2μm。這樣的誤差對鑽PCB上的孔而言,是不被接受的。再者,本研磨鑽頭的機器具有二個研磨砂輪裝置,再加上其它配合的機具,如驅動裝置、底座、砂輪座等,整體而言是非常沉重的。在這樣的條件下,若要調整研磨砂輪裝置這邊的機具1μm,幾乎是不可能的。Please refer to the seventh and eighth figures, which is a schematic diagram of the end face of a bit grounded by the height of the center line of the drill bit lower than the height of the imaginary connecting line of the center of the grinding wheel device, and the height of the center line of a bit is higher than the imaginary connecting line of the center of the grinding wheel device. A schematic view of the end face of the drill bit that is ground. As shown in the sixth figure, the end surface S of a drill bit (ie, the surface to be polished) and the two grinding wheel devices W1 and W2, when actually ground, the end surface S will directly contact the grinding surface of the grinding wheel device W1 and W2. W22. Therefore, the two grinding wheel devices WI and W2 shown in the seventh figure are viewed from the side, and the end surface S is viewed from the front, so that the polished end surface S has four grinding faces, including a first The surface to be polished M1, a second surface to be polished N1, a third surface to be polished O1, and a fourth surface to be polished P1. The detailed relative position of the end face of the drill bit and the grinding wheel device W1 and W2 will be described later in this document. In the seventh figure, the height of the drill center line L7 is lower than the height of the center imaginary connection line L6 of the two grinding wheel devices W1 and W2, and the first polished surface M1, the second ground surface N1, and the third are obtained after grinding. The surface to be polished O1 and the fourth surface to be polished P1, wherein the first surface to be polished M1 is surrounded by a plurality of points A6, B6, C6, D6, D7, and A7, and the second surface to be polished N1 is plural The area surrounded by points A7, D7, E7, and F7, the third surface to be polished O1 is surrounded by a plurality of points A6, A7, F7, H7, I7, and I6, and the fourth surface to be polished P1 is plural The area enclosed by points A6, I6, J6, and B6. Obviously, the point A6 and the point A7 do not intersect at one point, and the second surface to be polished N1 and the fourth surface to be polished P1 do not intersect, so the industry refers to separation. However, as shown in the seventh figure, in the grinding process, the first surface to be polished M1 and the second surface to be polished are produced in the process of grinding, the height L7 of the drill bit is lower than the height of the center of the two imaginary connecting lines L6 of the two grinding wheel device. After N1, the drill bit of the fixed drill bit is rotated 180 degrees by itself to re-grind to produce the third surface to be polished O1 and the fourth surface to be polished P1. Therefore, as shown in the figure, when the four polished faces are generated, the two sides of the second polished surface N1 and the fourth polished surface P1 are 2 μm apart. Such errors are not acceptable for drilling holes in the PCB. Furthermore, the machine for grinding the drill bit has two grinding wheel devices, and other matching tools, such as a driving device, a base, a wheel holder, etc., are very heavy overall. Under such conditions, it is almost impossible to adjust the machine 1 μm on the side of the grinding wheel device.
如第八圖所示,鑽頭中心線L7高度高於二研磨砂輪裝置中心假想連接線L6高度。研磨後得出第一被研磨面M1、第二被研磨面N1、第三被研磨面O1與第四被研磨面P1,其中,第一被研磨面M1由複數個點A6、B6、C6、D6、D7所圍成之區域,第二被研磨面N1由複數個點A7、A6、D7、E7、F7所圍成之區域,第三被研磨面O1由複數個點A7、F7、H7、I7所圍成之區域,第四被研磨面P1由複數個點A6、A7、I6、J6、B6所圍成之區域。顯而易見,點A6與點A7並無交於一點,第二被研磨面N1與第四被研磨面P1各有一線段A6A7是彼此的交線,所以業界稱重疊。然,如第八圖所示,以鑽頭中心線L7高度高於二研磨砂輪裝置中心假想連接線L6高度1μm而言,研磨的過程中在產生了第一被研磨面M1與第二被研磨面N1後,會被固定鑽頭的鑽頭座進行自體旋轉180度,以再研磨產生第三被研磨面O1與第四被研磨面P1。所以,如圖所示,當四個研磨面產生後,第二被研磨面N1與第四被研磨面P1的二邊線即差了2μm。As shown in the eighth figure, the height of the drill center line L7 is higher than the height of the center imaginary connection line L6 of the two grinding wheel device. After polishing, the first surface to be polished M1, the second surface to be polished N1, the third surface to be polished O1 and the fourth surface to be polished P1 are obtained, wherein the first surface to be polished M1 is composed of a plurality of points A6, B6, C6, The area surrounded by D6 and D7, the second surface to be polished N1 is surrounded by a plurality of points A7, A6, D7, E7, and F7, and the third surface to be polished O1 is composed of a plurality of points A7, F7, and H7. In the region surrounded by I7, the fourth polished surface P1 is surrounded by a plurality of points A6, A7, I6, J6, and B6. Obviously, the point A6 and the point A7 do not intersect one point, and the second polished surface N1 and the fourth polished surface P1 each have a line segment A6A7 which is the intersection of each other, so the industry refers to the overlap. However, as shown in the eighth figure, the height of the drill center line L7 is higher than the height of the center of the two grinding wheel device center imaginary connection line L6 by 1 μm, and the first surface to be polished M1 and the second surface to be polished are generated during the grinding process. After N1, the drill bit of the fixed drill bit is rotated 180 degrees by itself to re-grind to produce the third surface to be polished O1 and the fourth surface to be polished P1. Therefore, as shown in the figure, when the four polished faces are generated, the two sides of the second polished surface N1 and the fourth polished surface P1 are 2 μm apart.
總結第七圖與第八圖所述的誤差原因,這樣的誤差對鑽PCB上的孔而言,是不被接受的。再者,本研磨鑽頭的機器具有二個研磨砂輪裝置,再加上其它配合的機具,如驅動裝置、底座、砂輪座等,整體而言是非常沉重的。在這樣的條件下,若要調整研磨砂輪裝置這邊的機具1μm,幾乎是不可能的。於是,只有可能從調整固持鑽頭這邊的機具之高低的方向來思考了。Summarizing the causes of the errors described in Figures 7 and 8, such errors are not acceptable for drilling holes in the PCB. Furthermore, the machine for grinding the drill bit has two grinding wheel devices, and other matching tools, such as a driving device, a base, a wheel holder, etc., are very heavy overall. Under such conditions, it is almost impossible to adjust the machine 1 μm on the side of the grinding wheel device. Therefore, it is only possible to think from the direction of adjusting the height of the implement holding the drill bit.
請參考第九圖與第十圖,係習知技術中對二研磨砂輪裝置之左研磨砂輪裝置進行後退之二研磨砂輪裝置中心假想連接線之位移差示意圖與習知技術中對二研磨砂輪裝置之右研磨砂輪裝置進行前進之二研磨砂輪裝置中心假想連接線之位移差示意圖。承接上一段所述,考慮調整研磨砂輪裝置這邊的機具1μm,則如第九圖所示,左研磨砂輪裝置W2後退1μm至圖中虛線位置,則二研磨砂輪裝置中心假想連接線L6高度會升高2.801μm;如第十圖所示,將右研磨砂輪裝置W1前進1μm至圖中虛線位置,則二研磨砂輪裝置中心假想連接線L6高度會升高3.165μm。其高度差h之計算公式為:Please refer to the ninth and tenth drawings, which are schematic diagrams showing the displacement difference of the center imaginary connecting line of the grinding wheel device of the second grinding wheel device of the second grinding wheel device in the prior art, and the conventional grinding wheel device of the prior art. The right grinding wheel device performs the displacement difference diagram of the imaginary connecting line of the center of the grinding wheel device. As mentioned in the previous paragraph, considering adjusting the machine 1μm on the side of the grinding wheel device, as shown in the ninth figure, the left grinding wheel device W2 is retracted by 1 μm to the dotted line position in the figure, and the height of the center of the two grinding wheel device imaginary connection line L6 will be The height is 2.801 μm; as shown in the tenth figure, when the right grinding wheel device W1 is advanced by 1 μm to the dotted line position in the figure, the height of the center imaginary connection line L6 of the second grinding wheel device is increased by 3.165 μm. The formula for calculating the height difference h is:
研磨砂輪裝置之移動量/(tan(∠右研磨砂輪裝置W1)-tan(∠左研磨砂輪裝置))*cos(∠移動之研磨砂輪裝置)=hThe amount of movement of the grinding wheel device / (tan (∠ right grinding wheel device W1) - tan (∠ left grinding wheel device)) * cos (∠ moving grinding wheel device) = h
因此,由第七圖至第十圖所示得知,要修正2μm的分離/重疊量,只可以調整二研磨砂輪裝置中心假想連接線L6其1μm的移動量。若要以機械方式調整如左研磨砂輪裝置W2的移動量,則只能移動0.357μm,其計算公式為:[tan(∠右研磨砂輪裝置W1)-tan(∠左研磨砂輪裝置W2)]*cos(∠左研磨砂輪裝置W2)*左研磨砂輪裝置W2移動之垂直距離(如第九圖所顯示的垂直距離d,本處之值為1,單位為μm)。所以,以現行機械方式仍有一定難度,因為距離實在太小了。Therefore, as shown in Figs. 7 to 10, it is known that the amount of separation/overlap of 2 μm is corrected, and only the movement amount of 1 μm of the center of the grinding wheel device center imaginary connection line L6 can be adjusted. If the amount of movement of the left grinding wheel device W2 is mechanically adjusted, it can only move 0.357 μm, and the calculation formula is: [tan (∠ right grinding wheel device W1)-tan (∠ left grinding wheel device W2)]* Cos (∠ left grinding wheel device W2) * The vertical distance of the left grinding wheel device W2 (as shown in the ninth figure, the vertical distance d, the value of this place is 1, the unit is μm). Therefore, it is still difficult to use the current mechanical method because the distance is too small.
於是,如何設計出一種可以判斷鑽頭研磨面分離或重疊狀況的產生,又可以進行鑽頭中心線高度不準的校正,以可以精準地應用於鑽孔時的所需,實是當前熟悉相關技藝之人士所需注意的一項重要課題。Therefore, how to design a kind of judgment to determine the separation or overlap of the grinding surface of the drill bit, and to correct the height of the center line of the drill bit, so as to be accurately applied to the drilling, is currently familiar with the relevant art. An important topic that people need to pay attention to.
本發明之主要目的在於提供一種研磨鑽頭的方法,以可以判斷鑽頭研磨面分離或重疊狀況的產生,又可以進行鑽頭中心線高度不準的校正,以研磨出具有高度精密性的研磨面的鑽頭。The main object of the present invention is to provide a method for grinding a drill bit, which can judge the generation of the separation or overlapping condition of the grinding surface of the drill bit, and can also correct the height deviation of the center line of the drill bit to grind the drill bit with the highly precise grinding surface. .
一種研磨鑽頭的方法,係包括以下步驟:(1)開始;(2)將一第一鑽頭進行研磨,以定義出二研磨砂輪裝置之圓心間之一假想連接線之一高度H;(3)校正該第一鑽頭之一中心線之一高度H1與該二研磨砂輪裝置之圓心間之該假想連接線之該高度H成相同高度,以定義出一承載第一鑽頭之鑽頭座之一標準高度P;(4)將另一待研磨之鑽頭裝設於該鑽頭座,並調整鑽頭座至該標準高度P,且檢測該另一待研磨之鑽頭之一中心線之一高度H2;(5)校正待研磨之鑽頭之該中心線之該高度H2與二研磨砂輪裝置之圓心間之假想連接線之高度H成相同高度,並完成待研磨之鑽頭的研磨;(6)判斷是否尚有鑽頭需要研磨,若是,則進入步驟(4),若否,則至下一步驟;及(7)結束。A method of grinding a drill bit, comprising the steps of: (1) starting; (2) grinding a first drill bit to define a height H of one of the imaginary connecting lines between the centers of the two grinding wheel devices; (3) Correcting a height H1 of one of the center lines of the first drill bit to be the same height as the height H of the imaginary connecting line between the centers of the two grinding wheel devices to define a standard height of a bit holder carrying the first drill bit P; (4) mounting another drill bit to be ground to the bit holder, and adjusting the bit holder to the standard height P, and detecting a height H2 of one of the center lines of the other bit to be ground; (5) Correcting the height H2 of the center line of the drill to be ground to the same height as the height H of the imaginary connection line between the centers of the two grinding wheel devices, and completing the grinding of the drill to be ground; (6) determining whether there is a drill bit required Grinding, if yes, proceed to step (4), if not, proceed to the next step; and (7) end.
一種研磨鑽頭的方法,係包括以下步驟:(1)開始;(2)將一第一鑽頭進行研磨,以定義出二研磨砂輪裝置之圓心間之一假想連接線之一高度H;(3)校正該第一鑽頭之一中心線之一高度H1與該二研磨砂輪裝置之圓心間之該假想連接線之該高度H成相同高度,以定義出一承載二研磨砂輪裝置之砂輪座之一標準高度P’;(4)將另一待研磨之鑽頭裝設於一鑽頭座,並調整該砂輪座至該標準高度P’,且檢測該另一待研磨之鑽頭之一中心線之一高度H2;(5)校正待研磨之鑽頭之該中心線之該高度H2與二研磨砂輪裝置之圓心間之假想連接線之高度H成相同高度,並完成待研磨之鑽頭的研磨;(6)判斷是否尚有鑽頭需要研磨,若是,則進入步驟(4),若否,則至下一步驟;及(7)結束。A method of grinding a drill bit, comprising the steps of: (1) starting; (2) grinding a first drill bit to define a height H of one of the imaginary connecting lines between the centers of the two grinding wheel devices; (3) Correcting a height H1 of one of the center lines of the first drill bit and the height H of the imaginary connecting line between the centers of the two grinding wheel devices to define a standard of a wheel holder carrying the two grinding wheel device a height P'; (4) mounting another drill bit to be grounded to a drill bit seat, adjusting the wheel head to the standard height P', and detecting a height H2 of one of the center lines of the other drill bit to be ground (5) correcting the height H2 of the center line of the drill to be ground to the same height as the height H of the imaginary connection line between the centers of the two grinding wheel devices, and completing the grinding of the drill to be ground; (6) judging whether There is still a drill that needs to be ground. If yes, go to step (4), if not, go to the next step; and (7) end.
請參閱第一圖,係本發明之一種研磨鑽頭的方法所應用之鑽頭研磨系統之一較佳實施例立體示意圖,該改良之鑽頭研磨系統包括:一砂輪承載裝置1,係具有一底座11、一砂輪座12與二驅動裝置13、14,該砂輪座12係裝設於該底座11之一上平面111上,且砂輪座12具有一第一研磨砂輪裝置121與一第二研磨砂輪裝置122,該二研磨砂輪裝置121、122係延著底座11之該上平面111之一假想長軸Y’以排列配置,且該第一研磨砂輪裝置121與該第二研磨砂輪裝置122之一第一圓心A與一第二圓心B的一假想連接線AB係與該假想長軸Y’平行,第一研磨砂輪裝置121與第二研磨砂輪裝置122之一第一研磨面1211與一第二研磨面1221分別與該假想連接線AB平行,該第一研磨面1211與該第二研磨面1221分別與底座11之上平面111呈現一第一角度α與一第二角度β之傾斜,本實施例之該第一角度α係小於該第二角度β,該二驅動裝置係一第一驅動裝置13與一第二驅動裝置14,且分別驅動第一研磨砂輪裝置121與第二研磨砂輪裝置122,該砂輪承載裝置1係可利用一驅動軸15進行與假想長軸Y’平行的方向作往復式的移動;一鑽頭進退裝置2,係一旋轉裝置,以將裝設於其上的一鑽頭固定裝置21進行平行於砂輪承載裝置1之底座11之上平面111的擺動,該鑽頭固定裝置21具有一第一鑽頭座211與一第二鑽頭座212,該第一鑽頭座211與該第二鑽頭座212係可分別固定一待研磨之鑽頭D,以準備進行研磨,且在第一鑽頭座211擺動至第一研磨砂輪裝置121與第二研磨砂輪裝置122進行研磨時,第二鑽頭座212可在一可更換鑽頭的位置,以將一研磨好的鑽頭更換下,而裝上另一待研磨的鑽頭;一調校系統3,係具有一第一影像擷取調校裝置31與一第二影像擷取調校裝置32,該第一影像擷取調校裝置31包括一第一攝像裝置311與一第一電荷耦合裝置(CCD)312,係經由該第一攝像裝置311對鑽頭影像的攝影及該第一電荷耦合裝置312對鑽頭影像的擷取,以從垂直於砂輪承載裝置1之底座11之上平面111的方向監測第一鑽頭座211與第二鑽頭座212,以對固定於第一鑽頭座211與第二鑽頭座212之已經研磨好與待研磨之複數個鑽頭之每一個鑽頭的相關尺寸,與固定於第一鑽頭座211與第二鑽頭座212時之鑽頭各相關位置進行監測與調整,該第二影像擷取調校裝置32包括一第二攝像裝置321與一第二電荷耦合裝置(CCD)322,係經由該第二攝像裝置321對鑽頭影像的攝影及該第二電荷耦合裝置322對鑽頭影像的擷取,以係從平行於砂輪承載裝置1之底座11之上平面111的方向監測第一鑽頭座211與第二鑽頭座212,以對固定於第一鑽頭座211與第二鑽頭座212之已經研磨好與待研磨之複數個鑽頭之每一個鑽頭的相關尺寸,與固定於第一鑽頭座211與第二鑽頭座212時之各相關位置進行監測與調整,其中,該第二攝像裝置321更具有一環狀光源裝置3211,以對鑽頭提供一環型光源(圖中未示),概因鑽頭之頂部很細,必須使用環型光源照射,才可提供無死角的照射,以進行精密的檢測;及一進退料裝置4,係包括一鑽頭翻轉裝置41及一鑽頭交換裝置42,其中,當一待研磨之鑽頭從外部送入時,該待研磨之鑽頭之一長軸向是與該砂輪承載裝置1之該底座11之該上平面111呈現垂直的方向送入,該鑽頭翻轉裝置41將該待研磨之鑽頭翻轉方向,使鑽頭之該長軸向(本文以後相關方向描述皆係〝長軸向〞)呈現與上平面111平行的方向,該鑽頭交換裝置42於是挾取待研磨之鑽頭,並將待研磨之鑽頭裝設於該第一鑽頭座211或該第二鑽頭座212上,於是,該鑽頭進退裝置2進行一定角度的擺動,以將裝上待研磨之鑽頭的第一鑽頭座211或第二鑽頭座212運送至該第一研磨砂輪裝置121與該第二研磨砂輪裝置122處進行研磨,且鑽頭進退裝置2對運送第一鑽頭座211與第二鑽頭座212所作的二偏轉方向是相反的,再者,當第一鑽頭座211或第二鑽頭座212進行裝設待研磨之鑽頭時,另一裝設於第一鑽頭座211或第二鑽頭座212之鑽頭正進行被研磨著,當裝設於第一鑽頭座211或第二鑽頭座212之待研磨之鑽頭進行被運送至第一研磨砂輪裝置121與第二研磨砂輪裝置122處之時,該另一裝設於第一鑽頭座211或第二鑽頭座212之鑽頭已經研磨完畢,並正在被運送至鑽頭交換裝置42處,再經由鑽頭交換裝置42將已經研磨好之鑽頭從第一鑽頭座211或第二鑽頭座212中挾取出,此時挾取出之研磨好之鑽頭呈現與上平面111平行的方向,鑽頭交換裝置42再將研磨好之鑽頭運送至鑽頭翻轉裝置41,鑽頭翻轉裝置41再將研磨好之鑽頭翻轉方向,使研磨好之鑽頭與上平面111呈現垂直的方向,以待取出至該外部。Referring to the first drawing, a perspective view of a preferred embodiment of a drill grinding system for use in a method of grinding a drill bit according to the present invention, the improved drill grinding system includes: a grinding wheel carrier device 1 having a base 11 A wheel base 12 and two driving devices 13 and 14 are mounted on an upper surface 111 of the base 11, and the wheel base 12 has a first grinding wheel device 121 and a second grinding wheel device 122. The two grinding wheel devices 121 and 122 are arranged in an array along the imaginary long axis Y′ of the upper plane 111 of the base 11 , and the first grinding wheel device 121 and the second grinding wheel device 122 are first. An imaginary connecting line AB of the center A and a second center B is parallel to the imaginary long axis Y', and the first grinding surface 1211 and the second grinding surface of the first grinding wheel device 121 and the second grinding wheel device 122 are 1221 is parallel to the imaginary connecting line AB, and the first polishing surface 1211 and the second polishing surface 1221 respectively exhibit a first angle α and a second angle β tilt with the upper surface 111 of the base 11 , which is the embodiment. The first angle α is smaller than the The second driving angle is a first driving device 13 and a second driving device 14, and drives the first grinding wheel device 121 and the second grinding wheel device 122 respectively, and the grinding wheel carrier device 1 can utilize one The drive shaft 15 performs a reciprocating movement in a direction parallel to the imaginary long axis Y'; a drill advance/retract device 2 is a rotating device for paralleling a drill bit fixing device 21 mounted thereon to the grinding wheel carrier device 1 The drill bit fixing device 21 has a first bit holder 211 and a second bit holder 212. The first bit holder 211 and the second bit holder 212 can be respectively fixed to be ground. The drill bit D is ready for grinding, and when the first bit holder 211 is swung to the first grinding wheel device 121 and the second grinding wheel device 122 for grinding, the second bit holder 212 can be at a position of the replaceable bit A grinding bit is replaced and another bit to be ground is mounted; a calibration system 3 has a first image capturing and adjusting device 31 and a second image capturing and adjusting device 32, First image capture adjustment The device 31 includes a first imaging device 311 and a first charge coupled device (CCD) 312. The first imaging device 311 captures the bit image and the first charge coupling device 312 captures the bit image. The first bit holder 211 and the second bit holder 212 are monitored from a direction perpendicular to the plane 111 above the base 11 of the grinding wheel carrier 1 to be ground and fixed to the first bit holder 211 and the second bit holder 212. The relevant size of each of the plurality of drill bits is monitored and adjusted, and the position of each of the drill bits fixed to the first bit holder 211 and the second bit holder 212 is monitored and adjusted. The second image capturing and adjusting device 32 includes a The second imaging device 321 and a second charge coupled device (CCD) 322 are used to capture the bit image through the second camera device 321 and the bit image captured by the second charge coupled device 322 to be parallel to The direction of the plane 111 above the base 11 of the grinding wheel carrier 1 monitors the first bit holder 211 and the second bit holder 212 to fix the plurality of the first bit holder 211 and the second bit holder 212 that have been ground and to be ground. Drill bit The relevant dimensions of each of the drill bits are monitored and adjusted with respect to the respective positions of the first bit holder 211 and the second bit holder 212. The second camera unit 321 further has an annular light source device 3211. The drill bit provides a ring-shaped light source (not shown) because the top of the drill bit is very thin and must be illuminated by a ring-shaped light source to provide a blind-free illumination for precise inspection; and an incoming and outgoing device 4 includes a bit turning device 41 and a bit changing device 42, wherein when a bit to be ground is fed from the outside, one of the long axes of the bit to be ground is the same as the base 11 of the wheel carrier 1 The plane 111 is fed in a vertical direction, and the bit turning device 41 reverses the direction of the bit to be ground, so that the long axis of the bit (the related direction is described later is a long axial direction) and is parallel to the upper plane 111. In the direction of the bit exchange device 42, the drill bit to be ground is then taken, and the drill bit to be ground is mounted on the first bit holder 211 or the second bit holder 212, so that the bit advance and retreat device 2 performs a certain Swinging to transport the first bit holder 211 or the second bit holder 212 loaded with the bit to be ground to the first grinding wheel device 121 and the second grinding wheel device 122 for grinding, and the bit advance and retreat device 2 The two deflection directions for transporting the first bit holder 211 and the second bit holder 212 are opposite. Further, when the first bit holder 211 or the second bit holder 212 is mounted with the bit to be ground, the other device is mounted. The drill bit of the first bit holder 211 or the second bit holder 212 is being ground, and the bit to be ground mounted on the first bit holder 211 or the second bit holder 212 is transported to the first grinding wheel device 121. At the same time as the second grinding wheel device 122, the other bit mounted on the first bit holder 211 or the second bit holder 212 has been ground and is being transported to the bit exchange device 42 and then through the bit exchange device. 42. The drill bit that has been ground is taken out from the first bit holder 211 or the second bit holder 212. At this time, the drilled bit that has been taken out is in a direction parallel to the upper plane 111, and the bit exchange device 42 is further polished. Drill bit to drill Reversing means 41, bit reversing means 41 of the milling bit better then the roll direction, it is good to make the milling bit 111 rendered on a plane perpendicular to a direction to be taken out to the outside.
請參閱第二圖與第三圖,本發明之研磨鑽頭的方法所應用之鑽頭研磨系統之該較佳實施例上視立體示意圖與本發明之研磨鑽頭的方法所應用之鑽頭研磨系統之較佳實施例之鑽頭進退裝置與調校系統之側視立體示意圖。如第二圖與第三圖所示中,將以更邏輯式的描述以將整個系統是如何以先後次序進行研磨的程序。第二圖與第三圖中,待研磨之鑽頭從一輸送裝置5之一入料輸送帶51運送至一機械手臂52,該機械手臂52於是將待研磨之鑽頭挾取運送至鑽頭翻轉裝置41,此時鑽頭是與上平面111呈現垂直的方向,故鑽頭翻轉裝置41將鑽頭翻轉成與上平面111平行的方向,鑽頭交換裝置42於是可以取得待研磨之鑽頭,並接著偏轉一角度θ3(或有另一實施方式,即鑽頭翻轉裝置41可以平移),此時,一X軸向位移裝置25則往調校系統3移動,並接近到第二攝像裝置321所在之處,待研磨之鑽頭於是被轉送至且固定於第一鑽頭座211之一頭端,第一攝像裝置311、第一電荷耦合裝置312與第二攝像裝置321、第二電荷耦合裝置322並配合環狀光源裝置3211對待研磨之鑽頭D提供的環型光源,對待研磨之鑽頭D的相關尺寸與固定於第一鑽頭座211時之各相關位置進行監測,與透過一Z軸大行程位移裝置23、一旋轉軸26(旋轉角度θ1)調整、該X軸向位移裝置25、一Z軸微調位移裝置24與一迴轉軸裝置22(旋轉角度θ2)彼此間的動作配合,進行各種調整,調校完成後,該迴轉軸裝置22進行一角度的迴轉,以將待研磨之鑽頭D移動至介於第一圓心A與第一研磨砂輪裝置121與第二研磨砂輪裝置122之中間位置M之間,此時,砂輪承載裝置1會沿著假想長軸Y’往第三圖所示的該輸送裝置5的方向移動,待研磨之鑽頭D於是會先後經過第一研磨面1211與第二研磨面1221,以進行第一次研磨,當經過第一次研磨之待研磨之鑽頭D位於介於第二圓心B與第一研磨砂輪裝置121與第二研磨砂輪裝置122之中間位置M之間時,砂輪承載裝置1會沿著假想長軸Y’往第三圖所示的輸送裝置5的相反方向移動,以令經過第一次研磨之鑽頭D移動回到介於第一圓心A與第一研磨砂輪裝置121與第二研磨砂輪裝置122之中間位置M之間,該旋轉軸26會旋轉角度θ1度(本實施例係180度),以轉換鑽頭D另一側尚未研磨的部分而進行第二次研磨,此時,砂輪承載裝置1會再沿著假想長軸Y’往第三圖所示的輸送裝置5的方向移動,待研磨之鑽頭D於是會再先後經過第一研磨面1211與第二研磨面1221,以進行第二次研磨,當經過第二次研磨之已經研磨好之鑽頭D再度位於介於第二圓心B與第一研磨砂輪裝置121與第二研磨砂輪裝置122之中間位置M之間時,砂輪承載裝置1會再度沿著假想長軸Y’往第三圖所示的輸送裝置5的相反方向移動,以令經過第二次研磨之鑽頭D移動而再度回到介於第一圓心A與第一研磨砂輪裝置121與第二研磨砂輪裝置122之中間位置M之間,再者,砂輪承載裝置1停止移動,迴轉軸裝置22再進行一角度的迴轉,以將研磨好之鑽頭D移動至剛剛進行調校的位置,第一攝像裝置311、第一電荷耦合裝置312與第二攝像裝置321、第二電荷耦合裝置322並配合環狀光源裝置3211對研磨好之鑽頭D提供的環型光源,對鑽頭D的相關尺寸進行監測,監測完畢後,鑽頭交換裝置42會將固定於第一鑽頭座211之該頭端的研磨好之鑽頭D取下,再偏轉一角度θ3以移至鑽頭翻轉裝置41附近處(或有另一實施方式,即鑽頭翻轉裝置41可以平移回來),此時鑽頭D與上平面111平行,鑽頭翻轉裝置41將鑽頭D自鑽頭交換裝置42取下並翻轉90度,以使鑽頭D與上平面111垂直,以方便機械手臂52將研磨好之鑽頭D挾取運送至一出料輸送帶53,並運送出去。以上所述係單一之鑽頭從待研磨到研磨好的整個程序,而另一安裝於第二鑽頭座212之一頭端則是相反的。亦即,當安裝於第一鑽頭座211之頭端的鑽頭正在被研磨著時,第二鑽頭座212之頭端正在安裝另一待研磨之鑽頭;當安裝於第一鑽頭座211之頭端的鑽頭研磨完畢而進行自第一鑽頭座211之頭端卸載時,安裝於第二鑽頭座212之頭端的鑽頭正在被研磨著,如此則可以往復地運用。值得注意的是,第一鑽頭座211移動至研磨位置時,鑽頭進退裝置2所擺動的方向恰與第二鑽頭座212移動至研磨位置時,鑽頭進退裝置2所擺動的方向相反,如第一圖中之往復箭頭所示。Referring to the second and third figures, the preferred embodiment of the drill grinding system to which the method of grinding a drill bit of the present invention is applied is preferably a top perspective view and a drill grinding system to which the method of grinding a drill bit of the present invention is applied. A side perspective view of the drill advance and retreat device and the calibration system of the embodiment. As shown in the second and third figures, a more logical description will be used to program the entire system in a sequential order. In the second and third figures, the drill bit to be ground is transported from a feed conveyor belt 51 of a conveyor device 5 to a robot arm 52, which then transports the drill bit to be ground to the bit turning device 41. At this time, the drill bit is in a direction perpendicular to the upper plane 111, so that the bit turning device 41 turns the drill bit into a direction parallel to the upper plane 111, and the bit changing device 42 can then obtain the drill bit to be ground, and then deflect an angle θ3 ( Or another embodiment, that is, the bit turning device 41 can be translated). At this time, an X-axis displacement device 25 moves to the calibration system 3 and approaches to where the second camera device 321 is located. Then, it is transferred to and fixed to one of the head ends of the first bit holder 211, and the first imaging device 311, the first charge coupled device 312 and the second image capturing device 321 and the second charge coupled device 322 are matched with the annular light source device 3211 for grinding. The ring-shaped light source provided by the drill bit D, the relevant size of the drill bit D to be ground and the relevant positions fixed when the first bit holder 211 is fixed, and the transmission through a Z-axis large stroke displacement device 23, The rotation shaft 26 (rotation angle θ1) is adjusted, the X-axis displacement device 25, a Z-axis fine adjustment displacement device 24, and a rotary shaft device 22 (rotation angle θ2) are matched with each other, and various adjustments are made. After the adjustment is completed, The rotary shaft device 22 performs an angle rotation to move the drill D to be grounded between the first center A and the intermediate position M between the first grinding wheel device 121 and the second grinding wheel device 122. The grinding wheel carrier 1 will move along the imaginary long axis Y' in the direction of the conveying device 5 shown in the third figure, and the drill D to be polished will then pass through the first grinding surface 1211 and the second polishing surface 1221 in order to carry out For the first grinding, when the drill D to be ground after the first grinding is located between the second center B and the intermediate position M between the first grinding wheel device 121 and the second grinding wheel device 122, the grinding wheel carrier 1 Moving along the imaginary long axis Y' in the opposite direction of the conveying device 5 shown in the third figure, so that the first grinding bit D is moved back to between the first center A and the first grinding wheel device 121. Middle of the second grinding wheel device 122 Between M, the rotating shaft 26 is rotated by an angle of θ1 (180 degrees in this embodiment) to perform a second grinding by converting the unmilled portion on the other side of the drill D. At this time, the grinding wheel carrier 1 will Moving along the imaginary long axis Y' to the direction of the conveying device 5 shown in the third figure, the drill bit D to be polished then passes through the first grinding surface 1211 and the second grinding surface 1221 again for the second grinding. When the drill D which has been ground by the second grinding is again located between the second center B and the intermediate position M between the first grinding wheel device 121 and the second grinding wheel device 122, the grinding wheel carrier 1 will again follow The imaginary long axis Y' is moved in the opposite direction of the conveying device 5 shown in the third figure to move the bit D that has undergone the second grinding to return to the first center A and the first grinding wheel device 121. Between the intermediate positions M of the second grinding wheel device 122, the grinding wheel carrier device 1 stops moving, and the rotary shaft device 22 performs another angle of rotation to move the ground drill D to the position just adjusted. First camera device 311, first battery The coupling device 312 and the second imaging device 321 and the second charge coupling device 322 cooperate with the annular light source device 3211 to monitor the relevant size of the drill D for the ring-shaped light source provided by the drill bit D. After the monitoring is completed, the drill bit is exchanged. The device 42 removes the ground drill D fixed to the head end of the first bit holder 211 and deflects it by an angle θ3 to move to the vicinity of the bit turning device 41 (or another embodiment, that is, the bit turning device 41) Can be translated back), at this time the drill D is parallel to the upper plane 111, the drill turning device 41 removes the drill D from the drill exchange device 42 and flips it 90 degrees so that the drill D is perpendicular to the upper plane 111 to facilitate the robot 52 to The ground drill D is picked up and transported to a discharge conveyor belt 53 and transported out. As described above, the single bit is from the entire process to be ground to the grinding, and the other end of the second bit holder 212 is opposite. That is, when the drill bit mounted at the head end of the first bit holder 211 is being ground, another bit to be ground is being installed at the head end of the second bit holder 212; when the bit is mounted at the head end of the first bit holder 211 When the grinding is completed and the tip end of the first bit holder 211 is unloaded, the drill bit attached to the tip end of the second bit holder 212 is being ground, and thus can be used reciprocally. It should be noted that when the first bit holder 211 is moved to the grinding position, the direction in which the bit advancing and retracting device 2 swings is just opposite to the direction in which the bit advancing and retracting device 2 is swung when the second bit holder 212 is moved to the grinding position, such as the first The reciprocating arrows in the figure are shown.
請參閱第四A圖至第四D圖,係本發明之研磨鑽頭的方法之一鑽頭之一端面成型之步驟圖。如第四A圖所示,鑽頭的端面在研磨後共有四個研磨面,係一第一被研磨面M、一第二被研磨面N、一第三被研磨面O與一第四被研磨面P,其中,該第一被研磨面M係由一直線A2B2、一曲線B2C1、一曲線C1D2、一曲線D2D3與一直線D3A2所圍成之區域,該第二被研磨面N係由該直線A2D3、一曲線D3E1、一直線E1F1與一直線F1A2所圍成之區域,該第三被研磨面O係由該直線A2F1、一曲線F1H1、一曲線H1I2、一曲線I2I3及一直線I3A2所圍成之區域,該第四被研磨面P係由該直線A2I3、一直線I3J1、一直線J1B2及該直線B2A2圍成之區域。如第四A圖所示,當鑽頭端面經過該第一研磨面1211時,會研磨出一直線A1B1、一曲線BIC1、一曲線C1D1及一直線D1A1所圍成之區域;如第四B圖所示,當鑽頭端面經過該第二研磨面1221時,會研磨出一直線A1'D3、一曲線D3E1、一直線E1F1’及一直線F1’A1’所圍成之區域;如此,整體鑽頭會經由第一鑽頭座211與第二鑽頭座212進行180°的自轉,鑽頭端面會再經過該第一研磨面1211研磨,而得出如第四C圖所示,由一直線G1F1、一曲線F1H1、一曲線H1I1及一直線I1G1所圍成之區域;如第四D圖所示,當鑽頭端面經過該第二研磨面1221時,會研磨出由一直線A2I3、一曲線I3J1、一直線J1B2及一直線B2A2所圍成之區域。因著研磨時會有超出各被研磨面的範圍,故有依次研磨出的被研磨面與完全磨出的四個被研磨面所呈現的範圍稍有不一樣。Please refer to FIGS. 4A to 4D, which are diagrams showing the steps of forming one end of the drill bit, which is one of the methods for grinding the drill bit of the present invention. As shown in FIG. 4A, the end faces of the drill bit have a total of four polished surfaces after grinding, and are a first polished surface M, a second polished surface N, a third polished surface O and a fourth ground surface. a surface P, wherein the first surface to be polished M is a region surrounded by a straight line A2B2, a curved line B2C1, a curved line C1D2, a curved line D2D3, and a straight line D3A2, and the second polished surface N is composed of the straight line A2D3, a region surrounded by a curve D3E1, a straight line E1F1 and a straight line F1A2, wherein the third surface to be polished O is an area surrounded by the straight line A2F1, a curve F1H1, a curve H1I2, a curve I2I3, and a straight line I3A2. The four polished surface P is a region surrounded by the straight line A2I3, the straight line I3J1, the straight line J1B2, and the straight line B2A2. As shown in FIG. 4A, when the end face of the drill passes through the first polishing surface 1211, the area enclosed by the straight line A1B1, the curved line BIC1, the curved line C1D1, and the straight line D1A1 is ground; as shown in the fourth B, When the end face of the bit passes through the second grinding surface 1221, the area enclosed by the straight line A1'D3, a curve D3E1, the straight line E1F1' and the straight line F1'A1' is ground; thus, the integral bit passes through the first bit holder 211. The second bit holder 212 is rotated by 180°, and the end face of the bit is further polished by the first grinding surface 1211 to obtain a line G1F1, a curve F1H1, a curve H1I1 and a straight line I1G1 as shown in the fourth C diagram. The enclosed area; as shown in the fourth D diagram, when the end face of the drill passes through the second polished surface 1221, a region surrounded by a straight line A2I3, a curved line I3J1, a straight line J1B2, and a straight line B2A2 is ground. Since there is a range beyond the surface to be polished due to the polishing, the surface to be polished which is sequentially polished is slightly different from the range in which the four surfaces to be polished are completely polished.
然而,上述各研磨面的形成,是在鑽頭整體或端面之中心線高度等於第一研磨砂輪裝置121與第二研磨砂輪裝置122之假想連接線AB的高度,才不會有第二被研磨面N與第四被研磨面P分離或重疊的狀況發生。本發明之研磨鑽頭的方法即在於可以避免鑽頭整體或端面之中心線高度高於或低於第一研磨砂輪裝置121與第二研磨砂輪裝置122之假想連接線AB的高度,而不致有第二研磨面N與第四被研磨面P分離或重疊的狀況發生。請參閱第五圖,係本發明之研磨鑽頭的方法之一第一較佳實施例之步驟圖式。該方法包括以下步驟:However, each of the above-mentioned polishing surfaces is formed such that the height of the center line of the entire drill or the end surface is equal to the height of the imaginary connection line AB of the first grinding wheel device 121 and the second grinding wheel device 122, so that there is no second surface to be polished. A condition in which N is separated or overlapped from the fourth surface to be polished P occurs. The method of grinding the drill bit of the present invention is to prevent the height of the center line of the whole or the end surface of the drill bit from being higher or lower than the height of the imaginary connection line AB of the first grinding wheel device 121 and the second grinding wheel device 122, without causing the second The condition in which the polishing surface N is separated or overlaps with the fourth surface to be polished P occurs. Please refer to the fifth drawing, which is a step diagram of a first preferred embodiment of the method for grinding a drill bit of the present invention. The method includes the following steps:
(1)開始;(1) start;
(2)將該待研磨之第一鑽頭裝設於第一鑽頭座211,並將第一鑽頭送至二研磨砂輪裝置121、122間作研磨,並完成研磨;(2) the first drill bit to be ground is mounted on the first drill bit 211, and the first drill bit is sent to the two grinding wheel devices 121, 122 for grinding, and the grinding is completed;
(3)利用第一鑽頭之四個研磨面定義出該二研磨砂輪裝置121、122之圓心A、B間一假想連接線AB之高度H,如第四D圖所示的第四被研磨面P之兩點A2、I3連成之線段其高度,即為二研磨砂輪裝置121、122之圓心A、B間之假想連接線AB之高度H;(3) Defining the height H of an imaginary connecting line AB between the centers A and B of the two grinding wheel devices 121 and 122 by using the four grinding faces of the first drill bit, and the fourth ground surface as shown in the fourth D drawing The height of the line connecting the two points A2 and I3 of P is the height H of the imaginary connecting line AB between the centers A and B of the two grinding wheel devices 121 and 122;
(4)判斷該完成研磨之第一鑽頭之一中心線高度H1(圖中未示)是否與該二研磨砂輪裝置之假想連接線之高度H不同,若是,進入步驟(5),若否,進入步驟(10);(4) determining whether the center line height H1 (not shown) of the first drill bit that is finished grinding is different from the height H of the imaginary connection line of the two grinding wheel devices, and if yes, proceeding to step (5), if not, Go to step (10);
(5)判斷該中心線高度H1是否高於二研磨砂輪裝置之假想連接線之高度H,若是,則是重疊,進入步驟(6),若否,進入步驟(7);(5) determining whether the centerline height H1 is higher than the height H of the imaginary connecting line of the two grinding wheel device, if yes, then overlapping, proceeds to step (6), and if not, proceeds to step (7);
(6)利用一Z軸微調位移裝置24將該鑽頭座211降低,並進入步驟(9);(6) using a Z-axis fine-tuning displacement device 24 to lower the bit holder 211, and proceeds to step (9);
(7)中心線高度H1低於二研磨砂輪裝置121、122之假想連接線AB之高度H,則是分離;(7) the center line height H1 is lower than the height H of the imaginary connecting line AB of the two grinding wheel devices 121, 122, and is separated;
(8)利用該Z軸微調位移裝置24將該鑽頭座211升高,並進入步驟(9);(8) using the Z-axis fine-tuning displacement device 24 to raise the bit holder 211, and proceeds to step (9);
(9)將該第一鑽頭送至二研磨砂輪裝置121、122間作研磨,並完成研磨,進入步驟(4);(9) the first bit is sent to the two grinding wheel devices 121, 122 for grinding, and the grinding is completed, proceeds to step (4);
(10)中心線高度H1等於二研磨砂輪裝置121、122之假想連接線之高度H;(10) the center line height H1 is equal to the height H of the imaginary connecting line of the two grinding wheel devices 121, 122;
(11)記錄該鑽頭座211此時之高度P(圖中未示),得出鑽頭座211之一標準高度;(11) recording the height P (not shown) of the bit holder 211 at this time, and obtaining a standard height of the bit holder 211;
(12)將該待研磨之第二鑽頭裝設於鑽頭座211,利用Z軸微調位移裝置24調整鑽頭座211至一標準高度P,並檢測得到鑽頭之一中心線高度H2(圖中未示);(12) The second drill to be ground is mounted on the bit holder 211, and the bit holder 211 is adjusted to a standard height P by the Z-axis fine adjustment displacement device 24, and the center line height H2 of one of the drill bits is detected (not shown) );
(13)判斷該鑽頭之一中心線高度H2是否與一二研磨砂輪裝置121、122之二圓心A、B之假想連接線AB高度H不同,若是,進入步驟(14),若否,進入步驟(18);(13) determining whether the center line height H2 of the drill bit is different from the height H of the imaginary connection line AB of the two centers A and B of the two grinding wheel devices 121 and 122, and if yes, proceeding to step (14), if not, proceeding to the step (18);
(14)判斷該中心線高度H2是否高於二研磨砂輪裝置121、122之假想連接線AB之高度H,若是,進入步驟(15),若否,進入步驟(16);(14) determining whether the center line height H2 is higher than the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122, and if so, proceeds to step (15), and if not, proceeds to step (16);
(15)利用Z軸微調位移裝置24將鑽頭座211降低,以達中心線高度H2等於二研磨砂輪裝置121、122之假想連接線AB之高度H,並進入步驟(19);(15) using the Z-axis fine-tuning displacement device 24 to lower the bit holder 211, so that the center line height H2 is equal to the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122, and proceeds to step (19);
(16)中心線高度H2低於二研磨砂輪裝置121、122之假想連接線AB之高度H;(16) the center line height H2 is lower than the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122;
(17)利用Z軸微調位移裝置24將鑽頭座211升高,以達中心線高度H2等於二研磨砂輪裝置121、122之假想連接線AB之高度H,並進入步驟(19);(17) using the Z-axis fine-tuning displacement device 24 to raise the bit holder 211, so that the center line height H2 is equal to the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122, and proceeds to step (19);
(18)中心線高度H2等於二研磨砂輪裝置121、122之假想連接線AB之高度H;(18) the center line height H2 is equal to the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122;
(19)將鑽頭送至該二研磨砂輪裝置121、122間作研磨,並完成研磨;(19) sending a drill bit to the two grinding wheel devices 121, 122 for grinding, and finishing grinding;
(20)退出完成研磨之鑽頭;(20) withdrawing the drill bit that has finished grinding;
(21)是否尚有鑽頭待研磨,若是,進入步驟(12),若否,進入步驟(22);及(21) Is there still a bit to be ground, if yes, go to step (12), if no, go to step (22); and
(22)結束。(22) End.
請參閱第十一圖,係本發明之研磨鑽頭的方法之一第二較佳實施例之步驟圖式。該方法包括以下步驟:Please refer to the eleventh drawing, which is a step diagram of a second preferred embodiment of the method for grinding a drill bit of the present invention. The method includes the following steps:
(1’)開始;(1’) begins;
(2’)將該待研磨之第一鑽頭裝設於第一鑽頭座211,並將第一鑽頭送至二研磨砂輪裝置121、122間作研磨,並完成研磨;(2') the first drill bit to be ground is mounted on the first drill bit 211, and the first drill bit is sent to the two grinding wheel devices 121, 122 for grinding, and the grinding is completed;
(3’)利用第一鑽頭之四個研磨面定義出該二研磨砂輪裝置121、122之圓心A、B間一假想連接線AB之高度H,如第四D圖所示的第四被研磨面P之兩點A2、I3連成之線段其高度,即為二研磨砂輪裝置121、122之圓心A、B間之假想連接線AB之高度H;(3') using the four grinding faces of the first drill bit to define the height H of an imaginary connecting line AB between the centers A and B of the two grinding wheel devices 121, 122, and the fourth being polished as shown in the fourth D-picture The height of the line connecting the two points A2 and I3 of the surface P is the height H of the imaginary connecting line AB between the centers A and B of the two grinding wheel devices 121 and 122;
(4’)判斷該完成研磨之第一鑽頭之一中心線高度H1(圖中未示)是否與該二研磨砂輪裝置之假想連接線之高度H不同,若是,進入步驟(5’),若否,進入步驟(10’);(4') determining whether the center line height H1 (not shown) of the first drill bit that is finished grinding is different from the height H of the imaginary connection line of the two grinding wheel devices, and if so, proceeding to step (5'), if No, proceed to step (10');
(5’)判斷該中心線高度H1是否高於二研磨砂輪裝置之假想連接線之高度H,若是,則是重疊,進入步驟(6’),若否,進入步驟(7’);(5') determining whether the center line height H1 is higher than the height H of the imaginary connecting line of the two grinding wheel devices, and if so, overlapping, proceeds to step (6'), and if not, proceeds to step (7');
(6’)利用該Z軸微調位移裝置24將該承載二研磨砂輪裝置之砂輪座12提高,並進入步驟(9’);(6') using the Z-axis fine adjustment displacement device 24 to raise the wheel holder 12 carrying the two grinding wheel device, and proceeds to step (9');
(7’)中心線高度H1低於二研磨砂輪裝置121、122之假想連接線AB之高度H,則是分離;(7') the center line height H1 is lower than the height H of the imaginary connecting line AB of the two grinding wheel devices 121, 122, and is separated;
(8’)利用該Z軸微調位移裝置24將該砂輪座12降低,並進入步驟(9’);(8') using the Z-axis fine adjustment displacement device 24 to lower the wheel head 12, and proceeds to step (9');
(9’)將該第一鑽頭送至二研磨砂輪裝置121、122間作研磨,並完成研磨,進入步驟(4’);(9') the first bit is sent to the two grinding wheel devices 121, 122 for grinding, and the grinding is completed, into the step (4');
(10’)中心線高度H1等於二研磨砂輪裝置121、122之假想連接線之高度H;(10') the center line height H1 is equal to the height H of the imaginary connecting line of the two grinding wheel devices 121, 122;
(11’)記錄該砂輪座12此時之高度P(圖中未示),得出砂輪座12之一標準高度;(11') recording the height P (not shown) of the wheel head 12 at this time, and obtaining a standard height of the wheel head 12;
(12’)將該待研磨之第二鑽頭裝設於鑽頭座211,利用Z軸微調位移裝置24調整砂輪座12至一標準高度P’,並檢測得到鑽頭之一中心線高度H2(圖中未示);(12') The second drill to be ground is mounted on the bit holder 211, and the wheel base 12 is adjusted to a standard height P' by the Z-axis fine adjustment displacement device 24, and the center line height H2 of one of the drill bits is detected (in the figure) Not shown);
(13’)判斷該鑽頭之一中心線高度H2是否與二研磨砂輪裝置121、122之二圓心A、B之假想連接線AB高度H不同,若是,進入步驟(14’),若否,進入步驟(18’);(13') determining whether the center line height H2 of the drill bit is different from the imaginary connection line AB height H of the two centers A and B of the two grinding wheel devices 121, 122, and if so, proceeds to step (14'), and if not, enters Step (18');
(14’)判斷該中心線高度H2是否高於二研磨砂輪裝置121、122之假想連接線AB之高度H,若是,進入步驟(15’),若否,進入步驟(16’);(14') determining whether the center line height H2 is higher than the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122, and if so, proceeds to step (15'), and if not, proceeds to step (16');
(15’)利用Z軸微調位移裝置24將砂輪座12升高,以達中心線高度H2等於二研磨砂輪裝置121、122之假想連接線AB之高度H,並進入步驟(19’);(15') using the Z-axis fine-tuning displacement device 24 to raise the wheel head 12 to reach the center line height H2 equal to the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122, and proceeds to step (19');
(16’)中心線高度H2低於二研磨砂輪裝置121、122之假想連接線AB之高度H;(16') the center line height H2 is lower than the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122;
(17’)利用Z軸微調位移裝置24將砂輪座12降低,以達中心線高度H2等於二研磨砂輪裝置121、122之假想連接線AB之高度H,並進入步驟(19’);(17') using the Z-axis fine-tuning displacement device 24 to lower the wheel base 12 so that the center line height H2 is equal to the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122, and proceeds to step (19');
(18’)中心線高度H2等於二研磨砂輪裝置121、122之假想連接線AB之高度H;(18') the center line height H2 is equal to the height H of the imaginary connection line AB of the two grinding wheel devices 121, 122;
(19’)將鑽頭送至該二研磨砂輪裝置121、122間作研磨,並完成研磨;(19') feeding the drill bit to the two grinding wheel devices 121, 122 for grinding, and completing the grinding;
(20’)退出完成研磨之鑽頭;(20') exiting the drill bit that has finished grinding;
(21’)是否尚有鑽頭待研磨,若是,進入步驟(12’),若否,進入步驟(22’);及(21') whether there is a drill bit to be ground, if yes, proceed to step (12'), and if not, proceed to step (22');
(22’)結束。(22’) ends.
第一實施例之步驟係調整鑽頭座之高度,第二實施例之步驟係調整砂輪座之高度,以令待研磨鑽頭之中心線高度等於二研磨砂輪裝置之假想連接線之高度相同。因此,由以上步驟得知,本發明之研磨鑽頭的方法具有以下兩種優點:The steps of the first embodiment adjust the height of the bit holder. The second embodiment adjusts the height of the wheel holder so that the height of the center line of the bit to be ground is equal to the height of the imaginary connection line of the two grinding wheel devices. Therefore, it is known from the above steps that the method of grinding a drill bit of the present invention has the following two advantages:
1.判斷鑽頭研磨面分離或重疊狀況是否發生。1. Determine whether the separation or overlap of the grinding surface of the drill bit occurs.
2.校正鑽頭中心線高度。2. Correct the height of the drill centerline.
如此,本發明可以確實解決習知技術中所產生的『分離』與『重疊』的狀況,進而達到先找出研磨砂輪裝置中心線之標準高度,再對每一隻待研磨的鑽頭其中心線高度的校正的功效。Thus, the present invention can surely solve the "separation" and "overlap" conditions generated in the prior art, thereby achieving the standard height of the center line of the grinding wheel device and the center line of each bit to be ground. The effect of a high degree of correction.
再者,第四A圖至第四D圖所顯示的四個被研磨面M、N、O、P係屬對稱平均分佈之勢;然,目前市售的鑽頭亦有非對稱分佈的被研磨面,本發明之研磨鑽頭的方法亦可以生產出該非對稱分佈的被研磨面。Furthermore, the four polished surfaces M, N, O, and P shown in the fourth to fourth D diagrams are symmetrically distributed; however, the currently available drill bits are also asymmetrically distributed and ground. In addition, the method of grinding a drill bit of the present invention can also produce the asymmetrically distributed surface to be polished.
於是,本發明專利申請案係利用發明人豐富的經驗,以極富創意的構思,設計出簡單卻能充分解決習知技術的問題。因此,本發明專利申請案的功能,確實符合具有新穎性與進步性的專利要件。Thus, the patent application of the present invention utilizes the inventor's rich experience to design a simple but fully problematic solution to the conventional technology with a very creative concept. Therefore, the function of the patent application of the present invention does meet the patent requirements of novelty and progress.
唯以上所述者,僅為本發明之較佳實施例,當不能以之限制本發明範圍。即大凡依本發明申請專利範圍所做之均等變化及修飾,仍將不失本發明之要義所在,亦不脫離本發明之精神和範圍,故都應視為本發明的進一步實施狀況。The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. It is to be understood that the scope of the present invention is not limited by the spirit and scope of the present invention, and should be considered as a further embodiment of the present invention.
S...端面S. . . End face
W1...研磨砂輪裝置W1. . . Grinding wheel device
W2...研磨砂輪裝置W2. . . Grinding wheel device
W11...研磨面W11. . . Grinding surface
W22...研磨面W22. . . Grinding surface
M1...第一被研磨面M1. . . First ground surface
N1...第二被研磨面N1. . . Second surface to be polished
O1...第三被研磨面O1. . . Third surface to be polished
P1...第四被研磨面P1. . . Fourth ground surface
L7...鑽頭中心線L7. . . Bit center line
L6...研磨砂輪裝置中心假想連接線L6. . . Grinding wheel device center imaginary connection line
R10...鑽頭座R10. . . Bit holder
R11...鑽頭R11. . . drill
R12...研磨部R12. . . Grinding department
U...支架U. . . support
S...端面S. . . End face
A6...點A6. . . point
B6...點B6. . . point
C6...點C6. . . point
D6...點D6. . . point
D7...點D7. . . point
A7...點A7. . . point
F7...點F7. . . point
H7...點H7. . . point
I7...點I7. . . point
I6...點I6. . . point
J6...點J6. . . point
D...鑽頭D. . . drill
Y’...假想長軸Y’. . . Imaginary long axis
M...第一被研磨面M. . . First ground surface
N...第二被研磨面N. . . Second surface to be polished
O...第三被研磨面O. . . Third surface to be polished
P...第四被研磨面P. . . Fourth ground surface
A2...點A2. . . point
B2...點B2. . . point
C1...點C1. . . point
D2...點D2. . . point
D3...點D3. . . point
E1...點E1. . . point
F1...點F1. . . point
H1...點H1. . . point
I2...點I2. . . point
I3...點I3. . . point
J1...點J1. . . point
G1...點G1. . . point
I1...點I1. . . point
F1’...點F1’. . . point
A1’...點A1’. . . point
1...砂輪承載裝置1. . . Wheel carrier
11...底座11. . . Base
111...上平面111. . . Upper plane
12...砂輪座12. . . Wheel seat
121...第一研磨砂輪裝置121. . . First grinding wheel device
1211...第一研磨面1211. . . First abrasive surface
122...第二研磨砂輪裝置122. . . Second grinding wheel device
1221...第二研磨面1221. . . Second abrasive surface
13...第一驅動裝置13. . . First drive
14...第二驅動裝置14. . . Second drive
15...驅動軸15. . . Drive shaft
2...鑽頭進退裝置2. . . Drill advance and retreat device
21...鑽頭固定裝置twenty one. . . Drill fixing device
211...第一鑽頭座211. . . First bit holder
212...第二鑽頭座212. . . Second bit holder
22...迴轉軸裝置twenty two. . . Rotary shaft device
23...Z軸大行程位移裝置twenty three. . . Z-axis large stroke displacement device
24...Z軸微調位移裝置twenty four. . . Z-axis fine adjustment displacement device
25...X軸向位移裝置25. . . X axial displacement device
26...旋轉軸26. . . Rotary axis
3...調校系統3. . . Calibration system
31...第一影像擷取調校裝置31. . . First image capture adjustment device
311...第一攝像裝置311. . . First camera
312...第一電荷耦合裝置312. . . First charge coupled device
32...第二影像擷取調校裝置32. . . Second image capture adjustment device
321...第二攝像裝置321. . . Second camera
3211...環狀光源裝置3211. . . Ring light source device
322...第二電荷耦合裝置322. . . Second charge coupled device
4...進退料裝置4. . . Advance and return device
41...鑽頭翻轉裝置41. . . Bit turning device
42...鑽頭交換裝置42. . . Bit exchange device
5...輸送裝置5. . . Conveyor
51...入料輸送帶51. . . Feed conveyor
52...機械手臂52. . . Mechanical arm
θ3...角度Θ3. . . angle
θ1...旋轉角度Θ1. . . Rotation angle
θ2...旋轉角度Θ2. . . Rotation angle
(1)~(22)、(1’)~(22’)...係步驟編號(1)~(22), (1’)~(22’). . . Department step number
第一圖係本發明之一種研磨鑽頭的方法所應用之鑽頭研磨系統之一較佳實施例立體示意圖;BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of a preferred embodiment of a drill grinding system to which the method of grinding a drill bit of the present invention is applied;
第二圖係本發明之研磨鑽頭的方法所應用之鑽頭研磨系統之該較佳實施例上視立體示意圖;2 is a top perspective view of the preferred embodiment of the drill grinding system to which the method of grinding a drill bit of the present invention is applied;
第三圖係本發明之研磨鑽頭的方法所應用之鑽頭研磨系統之較佳實施例之鑽頭進退裝置與調校系統之側視立體示意圖;3 is a side perspective view of a drill advancement and retreat device and a calibration system of a preferred embodiment of a drill grinding system to which the method of grinding a drill bit of the present invention is applied;
第四A圖至第四D圖係本發明之研磨鑽頭的方法之一鑽頭之一端面成型之步驟圖;4A to 4D are the steps of forming one end face of one of the drills of the method for grinding a drill bit of the present invention;
第五圖係本發明之研磨鑽頭的方法之一第一較佳實施例之步驟圖式;Figure 5 is a diagram showing the steps of a first preferred embodiment of the method of grinding a drill bit of the present invention;
第六圖係一鑽頭中心線高度低於二研磨砂輪裝置中心假想連接線高度之相對位置關係示意圖;The sixth figure is a schematic diagram showing the relative positional relationship between the height of a drill center line and the height of the imaginary connecting line of the center of the grinding wheel device;
第七圖係一鑽頭中心線高度低於二研磨砂輪裝置中心假想連接線高度所研磨出之鑽頭端面示意圖;The seventh figure is a schematic diagram of the end face of the drill bit which is grounded by the height of the center line of the drill bit lower than the height of the imaginary connecting line of the center of the grinding wheel device;
第八圖係一鑽頭中心線高度高於二研磨砂輪裝置中心假想連接線高度所研磨出之鑽頭端面示意圖;The eighth figure is a schematic diagram of the end face of the drill bit which is grounded by the height of the center line of the drill bit higher than the height of the imaginary connecting line of the center of the two grinding wheel device;
第九圖係習知技術中對二研磨砂輪裝置之左研磨砂輪裝置進行後退之二研磨砂輪裝置中心假想連接線之位移差示意圖;The ninth figure is a schematic diagram of the displacement difference of the center imaginary connecting line of the grinding wheel device of the second grinding wheel device of the two grinding wheel device in the prior art;
第十圖係習知技術中對二研磨砂輪裝置之右研磨砂輪裝置進行前進之二研磨砂輪裝置中心假想連接線之位移差示意圖;及The tenth figure is a schematic diagram of the displacement difference of the center imaginary connecting line of the grinding wheel device of the second grinding wheel device of the two grinding wheel device in the prior art;
第十一圖係本發明之研磨鑽頭的方法之一第二較佳實施例之步驟圖式。Figure 11 is a diagram showing the steps of a second preferred embodiment of the method of grinding a drill bit of the present invention.
(1)~(22)...係步驟編號(1)~(22). . . Department step number
Claims (10)
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TWM305080U (en) * | 2006-03-16 | 2007-01-21 | Hotwu Technology Co Ltd | Grinding drill device |
TWM409127U (en) * | 2010-12-13 | 2011-08-11 | you-ren Zhang | Grinding drill device |
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TWM305080U (en) * | 2006-03-16 | 2007-01-21 | Hotwu Technology Co Ltd | Grinding drill device |
TWM409127U (en) * | 2010-12-13 | 2011-08-11 | you-ren Zhang | Grinding drill device |
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