TWI450985B - Co-Si copper alloy plate - Google Patents

Description

Co-Si copper alloy plate

The present invention relates to a Co-Si based copper alloy sheet.

Requires connector and other electrical. The electronic device has been miniaturized, and a Co-Si-based copper alloy (Carson alloy) having excellent strength has been developed. However, since the Co-Si-based Carson alloy generates precipitates from Co and Si, it is required to form a solid oxide film on the surface thereof by solid solution or aging treatment at a high temperature, thereby deteriorating the solder wettability. Further, since the Carson alloy also has a step of performing relaxation annealing after final rolling, it causes the oxide film to further grow. Therefore, after the final heat treatment, pickling is performed to dissolve the oxide film, and the step of removing the oxide film by buff polishing (hereinafter referred to as " pickling polishing" is suitable).

According to this, a copper alloy material having a surface roughness Ra of 0.2 μm or less and an Rt of 2 μm or less and improved solder wettability has been developed (Patent Document 1).

Further, when the above-described pickling polishing is performed, the solder wettability is reduced due to the ridge-like irregularities caused by polishing on the surface, so that pickling or degreasing treatment is performed before the finish rolling, and the solder is wetted. A copper alloy material having improved wettability (Patent Document 2). If the pickling or degreasing treatment is carried out before the finish rolling, the peak position in the degree distribution map indicating the surface unevenness component appears on the average line of the roughness curve (zero position in the degree distribution map). (Convex component), which improves solder wettability or plating properties.

Patent Document 1: International Publication WO2010/13790

Patent Document 2: Japanese Patent No. 4413992 (paragraph 0013)

However, in the case of the technique described in Patent Document 1, even if the solder wettability is good, the oxide film on the surface of the material cannot be removed, or the pickling or polishing is performed before the final rolling, so that foreign matter is caused by calendering. When pressed in, pinholes (partial areas where solder is not attached) are generated. If the number of pinholes is increased, soldering defects are likely to occur, and in particular, if a pinhole is formed in a portion where solder is attached when the Carson alloy is formed into a terminal, soldering failure may result.

Further, in the case of the technique described in Patent Document 2, since pickling or degreasing treatment is necessary before the finish press, the steps are complicated and the productivity is deteriorated. In addition, since the oxide film of the Co-Si-based Carson alloy is very strong, it is not easy to be peeled off by pickling only, and the technique described in Patent Document 2 is a step of performing pickling only after the heat treatment without polishing. Or the steps of pickling and grinding are not performed, and it is considered that the oxide film on the surface of the material cannot be sufficiently removed, and pinholes are easily generated.

In other words, the present invention has been made to solve the above problems, and an object of the invention is to provide a Co-Si-based copper alloy sheet which is excellent in solder wettability and has few pinholes at the time of soldering.

The present inventors conducted various studies and found that the oxide film on the surface of the material was removed or calendered by using a polishing wheel having a finer particle (abrasive grain) to perform a sufficient number of times of the final heat treatment. The pressed foreign matter, and by making the surface a smooth surface having a specific anisotropy, the solder wettability is excellent, and pinholes are reduced.

In order to achieve the above object, the Co-Si-based copper alloy sheet of the present invention contains Co: 0.5 to 3.0% by mass, Si: 0.1 to 1.0% by mass, and the remainder consists of Cu and unavoidable impurities, and {(calender) 60 degree specular gloss G(RD) in the parallel direction - (60 degree specular gloss G (TD) in the direction of the right angle) ≧ 90%.

It is preferable that the surface roughness Ra (RD) 压 0.07 μm in the parallel direction of rolling.

It is preferable that the surface roughness Rz(RD) ≦ 0.50 μm in the parallel direction of rolling.

Preferably, the peak position in the degree distribution map indicating the surface unevenness component in the direction perpendicular to the rectangular direction is located on the negative side (concave component side) of the average line for the roughness curve.

It is preferable to further contain 2.0 mass% or less selected from the group consisting of Mn, Fe, Mg, Ni, Cr, V, Nb, Mo, Zr, B, Ag, Be, Zn, Sn, misch metal, and P. One or two or more of the group.

According to the present invention, a Co-Si-based copper alloy sheet excellent in solder wettability and having a small number of pinholes during welding can be obtained.

Hereinafter, a Co-Si-based copper alloy sheet according to an embodiment of the present invention will be described. In the present invention, the % is % unless otherwise specified.

In addition, the surface roughness Ra means the center line average roughness defined by JIS-B0601 (2001), and the surface roughness Rz means the maximum height prescribed by the JIS.

First, the technical idea of the present invention will be described with reference to Fig. 1 . Fig. 1 shows an example of a procedure for producing a Co-Si-based copper alloy sheet according to an embodiment of the present invention.

First, the copper alloy sheet 2 after the final heat treatment is introduced into the pickling tank 4 for pickling, and the oxide film is dissolved substantially uniformly in the rolling parallel direction (RD) and the rolling orthogonal direction (TD) to reduce the thickness. Therefore, the 60-degree specular gloss G (RD) in the parallel direction after pickling and the 60-degree specular gloss G (TD) in the right-angle direction are approximately the same, and the difference is {G(RD)-G(TD) }≒0 (refer to Figure 1 (a)).

Next, if the pickled copper alloy plate is ground using the polishing wheel 6, a scratch of the polishing mark caused by the polishing wheel is attached. In the rolling parallel direction (RD) which is the direction of rotation of the polishing wheel 6, the oxide film which is insoluble by pickling disappears from the surface of the material due to the polishing of the surface of the material, so that the surface of the material becomes smooth and G(RD) Become bigger. On the other hand, even if the surface of the material is polished in the direction perpendicular to the rolling (TD), since the surface of the material in the TD direction is formed with a scratch of the polishing trace caused by the polishing wheel, the degree of smoothness of the surface does not largely change. And G (TD) has not changed much. Therefore, it can be judged that if {G(RD)-G(TD)}>0 and {G(RD)-G(TD)}≧90%, polishing and polishing will sufficiently remove the oxide film, and the solder will be wet. The wetness will increase and the pinholes will decrease during soldering. Although the upper limit of {G(RD)-G(TD)} is not specified, 400% or less is more practical.

Furthermore, the 60 degree specular gloss reflects the surface state of the material of a particular area. On the other hand, the surface roughness (Ra, etc.) reflects the surface state of the material on a specific straight line. Therefore, it is considered that the 60 degree mirror gloss is better than the surface roughness. More preferably, it reflects a state in which an oxide film or a foreign matter which is locally present on the surface of the material.

Further, the polishing wheel 6 has a cylindrical shape, and abrasive grains adhere to the surface thereof. Further, the polishing pad 6 is rotated in the direction of the through-plate of the copper alloy plate 2 (from left to right in Fig. 1) so that the abrasive grains of the polishing wheel 6 are cut over the surface of the copper alloy plate 2. Therefore, the degree of removal of the oxide film by polishing and polishing can be adjusted by the particle size (particle size) of the abrasive grains, the number of passes of the copper alloy plate 2, the plate speed (linear velocity), the number of rotations of the polishing wheel 6, and the like.

Further, it is preferable that the surface roughness Ra (RD) in the rolling parallel direction is 0.07 μm or less. When the Ra (RD) is 0.07 μm or less, there is a case where the zero cross time becomes small.

In the present invention, the peak position in the power distribution map of the surface unevenness component in the direction perpendicular to the rolling direction may be specified. Here, the degree distribution map of the surface unevenness component is the same as that described in Patent Document 2, and the horizontal axis is the height from the average line for the roughness curve, and the vertical axis is plotted as the frequency (measurement data number). Figure. Further, in the present invention, the horizontal axis is set from the height from the average line of the roughness curve at an interval (scale) of 0.05 μm, and the number of measurement data for each interval is totaled as a frequency and plotted. In addition, the "average line for the roughness curve" is defined by JIS-B0601.

The degree distribution map is specifically produced as follows. (1) First, the "height from the average line for the roughness curve" is measured along the direction perpendicular to the rolling of the sample. In other words, since the height data from the average line for the roughness curve can be obtained at each surface position (hereinafter referred to as "measurement data" is suitable), the peak position and the like can be obtained from the obtained measurement data, and Measurement The data is processed numerically to calculate Ra and Rz. (2) The height from the "average line for the roughness curve" is separated by a distance of 0.05 μm. (3) The number of measurements (degrees) was counted at each of the above 0.05 μm intervals.

Further, the measurement data was measured with a standard length of 1.25 mm, a cutoff value of 25 mm (according to JIS-B0601), and a scanning speed of 0.1 mm/sec. The surface roughness measuring machine (Surfcorder SE3400) manufactured by Kosaka Research Laboratory Co., Ltd. was used for the measurement, and the measurement length was 1.25 mm, and the number of measurement data was 7,500 points.

The specific measurement method of the above-described peak position is also the same as that described in Patent Document 2, and in the obtained measurement data, a component having a height greater than 0 from the "average line for roughness curve" is set as the upper (positive) component. The degree distribution is plotted by classifying less than 0 as the lower (negative) component. When the horizontal axis is taken as the height (μm) from the "average line for roughness curve", and the total number of measurement data per 0.05 μm is redrawn as the vertical axis, FIG. 2 and FIG. 3 can be obtained. (corresponding to Fig. 3 of Patent Document 2). In Fig. 2 and Fig. 3, if the height from the "average line for the roughness curve" from the pull line to the horizontal axis is 0 μm, the peak position of the discriminant frequency is the concave component (negative side) and the convex component. (positive side), (also or 0).

Here, the determination of the above-mentioned "peak position" is performed as follows. First, in the graph of the height from the average line of the frequency-roughness curve (see FIGS. 2 and 3), the frequency with the highest value is P1, and the frequency of the next highest value is P2. Further, (1) the so-called peak position is a concave component (negative side) means a case where both P1 and P2 are on the negative side, or P2/P1 <99% and P1 is on the negative side. (2) The so-called peak position is a convex component (positive side) It refers to the case where both P1 and P2 are on the positive side, or P2/P1 <99% and P1 is on the positive side. (3) The case where the peak position is 0 means P2/P1 ≧ 99% (except that both P1 and P2 are on the negative side and P1 and P2 are on the positive side).

Further, a line having a height of 0 μm from the average line of the roughness curve means an average line for the roughness curve.

In addition, when the peak position obtained by the three times of measurement is dispersed in positive and negative, if the peak in the second measurement is in the upper (positive) component, it is regarded as the convex component side.

Fig. 2 is a graph which is redrawn based on the actual measurement data of the following Example 4, with the vertical axis as the frequency (%) and the horizontal axis as the height (μm) from the average line of the roughness curve.

Further, Fig. 3 is a graph which is redrawn based on the actual measurement data of the following Example 18, with the vertical axis as the frequency (%) and the horizontal axis as the height (μm) from the average line of the roughness curve.

In the case of Fig. 3, it can be seen that the peak position in the degree distribution map of the surface unevenness component is closer to the positive side (convex component side) than the average line of the roughness curve. In the case of Fig. 2, it is known that the peak position is rough. The average curve for the degree curve is on the negative side (the concave component side). That is, in the present invention (for example, Fig. 2 and Example 4), even if the peak position is on the negative side (concave component side), the wetting property is good, and the wetting property is not determined by the peak position. Further, in Example 18, the peak position was made positive by changing the pickling liquid during pickling.

The method for measuring the surface roughness Ra and Rz described above is the same as that described in Patent Document 2, and has a standard length of 1.25 mm and a cutoff value of 25 mm (according to JIS-B0601), scanning speed 0.1 mm/sec. The measurement was performed using a surface roughness measuring machine (Surfcorder SE3400) manufactured by Kosaka Research Co., Ltd., and the measurement length was 1.25 mm and the number of measurement data was 7,500 points. Further, the surface roughness Ra and Rz were measured three times, and the average value thereof was taken.

Next, other regulations and compositions of the Co-Si-based copper alloy sheet of the present invention will be described.

<composition>

It contains Co: 0.5 to 3.0% by mass, Si: 0.1 to 1.0% by mass, and the remainder is Cu and unavoidable impurities.

When the content of Co and Si is less than the above range, the precipitation strengthening of Co ₂ Si is insufficient, and the strength cannot be improved. On the other hand, when the content of Co and Si exceeds the above range, the electrical conductivity is deteriorated and the hot workability is deteriorated. The content of Co is preferably from 1.5 to 2.5% by mass, more preferably from 1.7 to 2.2% by mass. The content of Si is preferably from 0.3 to 0.7% by mass, more preferably from 0.4 to 0.55% by mass.

The Co/Si quality is preferably 3.5 to 5.0, more preferably 3.8 to 4.6. When the Co/Si mass ratio is in this range, Co ₂ Si can be sufficiently precipitated.

It is preferable to further contain a total of 2.0% by mass or less selected from the group consisting of Mn, Mg, Ag, P, B, Zr, Fe, Ni, Cr, V, Nb, Mo, Be, Zn, Sn, and a bismuth alloy. One or two or more. When the total amount of the above elements exceeds 2.0% by mass, the following effects are saturated and the productivity is deteriorated. However, when the total amount of the above elements is less than 0.001% by mass, the effect is small. Therefore, the total amount of the above elements is preferably 0.001 to 2.0% by mass, more preferably 0.01 to 2.0% by mass, most preferably 0.04. ~2.0% by mass.

Here, since a small amount of Mn, Mg, Ag, and P are added, the product characteristics such as strength and stress relaxation characteristics are improved without impairing the electrical conductivity. These elements exert the above effects mainly by solid solution toward the mother phase, but further exert an effect by being contained in the second phase particles.

By adding B, Zr, and Fe, it is also possible to improve product properties such as strength, electrical conductivity, stress relaxation characteristics, and plating properties. These elements exert the above effects mainly by solid solution toward the mother phase, but further exert an effect by being contained in the second phase particles or by forming the second phase particles of a new composition.

Ni, Cr, V, Nb, Mo, Be, Zn, Sn, and bismuth alloys complement each other's characteristics, not only for strength, electrical conductivity, but also for stress relaxation properties, bending workability, plating properties, or The manufacturability of the ingot structure is improved to improve the hot workability.

Further, elements not specifically described in the specification may be added in a range that does not adversely affect the characteristics of the alloy of the present invention.

Next, an example of a method for producing a Co-Si-based copper alloy sheet of the present invention will be described. First, an ingot composed of copper, a necessary alloying element, and an unavoidable impurity is hot-rolled, and then subjected to surface-cutting and cold rolling, and after solution treatment, aging treatment is performed to precipitate Co ₂ Si. Next, it is finished to a specific thickness by final cold rolling, and further subjected to relaxation annealing as needed, and finally subjected to pickling and immediately subjected to polishing.

The solution treatment can be selected, for example, in the range of 700 ° C to 1000 ° C. Further, the aging treatment can be carried out, for example, at 400 ° C to 650 ° C for 1 to 20 hours.

Further, the final calendering degree is preferably from 5 to 50%, more preferably from 20% to 30%. The crystal grain size of the alloy material of the present invention is not particularly limited, and is generally 3 ~20 μm or less. The particle size of the precipitate is 5 nm to 10 μm.

[Examples]

The ingots of the composition shown in Table 1 were cast, and hot rolled to a thickness of 10 mm at 960 ° C or higher. After the scale of the surface was cut, cold rolling was performed, and then solid solution was performed at 700 ° C or more and 1000 ° C or less. The treatment is finally carried out at 400 ° C ~ 650 ° C for 1 to 20 hours of aging treatment. Next, at a processing rate of 5% to 40%, the final cold-rolling is finished to a specific thickness, and then subjected to a relaxation annealing at 300 to 600 ° C for 0.05 to 3 hours, and finally pickled under the conditions shown in Table 1 and immediately Polishing is performed. Further, the pickling liquid used for pickling before polishing is a solution of dilute sulfuric acid, hydrochloric acid or dilute nitric acid having a concentration of 20 to 30% by mass and a pH of 1 or less, and the pickling time of the pickling is set to 60 to 180. second. The polishing wheel used for polishing and polishing uses abrasive grains made of alumina and contains alumina in the nylon nonwoven fabric. Further, a polishing wheel which changes the polishing roughness (particle size of the abrasive grains), respectively, is used. The particle size of the abrasive particles indicates the number of mesh per 1 inch of the abrasive particles and is specified by JIS R6001. For example, if the particle size is 1000, the average particle diameter of the abrasive grains is 18 to 14.5 μm. Further, in Example 18, the same procedure as in the other examples was carried out except that an aqueous solution of nitric acid having a concentration of 40 to 50% by mass and a pH of 1 or less was used as pickling by pickling polishing.

Each of the samples thus obtained was evaluated for each characteristic.

(1) Ra and Rz

The center line average roughness Ra and the maximum height Rz were measured in accordance with JIS-B0601 (2001). The measurement system measures the rolling parallel direction (RD) and the rolling orthogonal direction (TD), respectively. In the measurement, the standard length is set to 1.25. Mm, cutoff value of 0.25 mm (according to JIS above), scanning speed of 0.1 mm/sec, and surface roughness measuring machine (Surfcorder 5E3400) manufactured by Kosaka Research Institute, measuring length 1.25 mm and setting the number of measured data It is 7500 points.

(2) Degree distribution map

For the measurement data of the right angle direction of the rolling obtained in (1), in the measurement data, the composition is classified into the composition of the upper (positive) and the lower (negative) from the "average line for the roughness curve", and the self-roughness curve is obtained. The height distribution is plotted with a height of 0.05 μm as the scale. According to the measurement data, the vertical axis is the frequency (%), and the horizontal axis is the height (μm) from the average line from the roughness curve, and FIG. 2 and FIG. 3 are obtained. In FIGS. 2 and 3, if a line is drawn on 0 μm of the height from the average line of the roughness curve from the horizontal axis, the peak of the frequency can be determined to be a concave component (negative side) or a convex component (positive side). ), (or is 0).

(3) Glossiness

The 60-degree specular gloss is measured at an incident angle of 60 degrees in the rolling parallel direction RD and the rolling orthogonal direction TD in accordance with a gloss meter (manufactured by Nippon Denshoku Industries Co., Ltd., trade name "PG-1M") according to JIS Z8741. .

Fig. 2 is a graph in which the actual measurement data of Example 4 is redrawn with the vertical axis as the frequency (%) and the horizontal axis as the height (μm) from the average line of the roughness curve.

In addition, Fig. 3 is a graph in which the actual measurement data of the following Example 18 is redrawn with the vertical axis as the frequency (%) and the horizontal axis as the height (μm) from the average line of the roughness curve.

(3) Solder characteristics (3-1) Number of pinholes

The number of pinholes refers to the number of holes that can be observed on the substrate (copper alloy material) without wetting the solder. If the number of pinholes is increased, it is easy to cause poor soldering. The number of pinholes is tested by pickling a 10 mm wide sample with a 10% by mass aqueous solution of dilute sulfuric acid, and then immersing it at a depth of 12 mm and an immersion speed of 25 mm/ s. When the immersion time was immersed in a solder bath for 10 sec, the front and back surfaces were observed with an optical microscope (magnification: 50 times), and the number of pinholes of the substrate was observed, and five or less were made good.

The solder test was carried out in accordance with JIS-C60068-2-54. The composition of the solder bath was 60 wt% of tin and 40 wt% of lead, and a flux (25 wt% of rosin, 75 wt% of ethanol) was added in an appropriate amount, and the solder temperature was set to 235 ° C ± 3 ° C.

(3-2) soldering time (T2 value)

The soldering time (T2 value) is the time until the wetting stress value becomes zero. The shorter the soldering time, the easier the solder is to wet. The test was carried out by pickling a sample with a 10 wt% aqueous solution of dilute sulfuric acid, and immersing the sample in a solder bath of 235 ° C ± 3 ° C at an immersion depth of 4 mm, an immersion speed of 25 mm/s, and an immersion time of 10 sec. According to JIS C60068-2-54, the soldering time was determined by a curved surface soldering method (meniscograph). The soldering time is 2.0 seconds or less, and the solder wettability is good.

The results obtained are shown in Tables 1 to 3. In addition, in the "treatment before processing and rolling" in Tables 1 and 2, the A method and the B method are subjected to pickling and polishing using the following conditions. For example, Example 9 is subjected to pickling polishing before the finish rolling Grinding, and further pickling and polishing after the finish press. The pickling liquid used for pickling in the pickling polishing slurry before the finish press is the same as the pickling liquid used for the pickling and polishing after the above-mentioned fine rolling.

Method A: Polishing and grinding times 1 times, plate speed 40 m/min, polishing roughness (abrasive grain) 1000 grain size, polishing wheel rotation number 500 rpm

Method B: 3 times of polishing and grinding, 10 m/min of passing speed, 2000 roughness of polishing roughness (abrasive grain), and 1400 rpm of polishing wheel rotation

Further, for a part of the samples, only the immersion in a 10% sulfuric acid aqueous solution for 30 seconds was carried out before the finish rolling. Further, for a part of the samples, only degreasing was performed by immersing in hexane for 30 seconds before the finish rolling. Further, for the other samples, no treatment was performed before the finish rolling.

According to Tables 1 to 3, it is known that the solder wettability is excellent in the case of each of the examples of pickling and polishing after a sufficient number of final heat treatments (slip annealing) using a polishing wheel having a fine texture (abrasive grain). And the pinhole is reduced. Each of the examples is {(60 degree specular gloss G(RD) in the parallel direction of the rolling) - (60 degree specular gloss G (TD) in the direction of the right angle of the rolling) ≧ 90%, and it can be considered that the oxidation of the surface of the material is sufficiently removed. The film and foreign matter are pressed in and the surface is smoothed.

Further, in each of the examples, pickling polishing is performed under the conditions of the abrasive grains of 2000 or more, the number of times of the pass of the plate of 2 or more, the plate speed of 10 mpm or less, and the number of rotations of 1200 rpm or more, which may of course vary depending on the manufacturing apparatus. The best range of these.

On the other hand, pickling polishing was not sufficiently performed in each of the comparative examples, and the oxide film on the surface of the material or the press-fitting of foreign matter could not be sufficiently removed. Therefore, in each comparative example, {(60 degree specular gloss G(RD) in the parallel direction of rolling)-(60 degree specular gloss G(TD) of the rectangular direction of the rolling direction)}<90%, and pinholes increase, oxidation Remaining of the film leads to deterioration of solder wettability.

The reason for the deterioration is considered to be due to the case of the comparative examples 1, 2, 15, 17, and 19, because the speed of the plated by the pickling polishing is more than 20 mpm.

In the case of Comparative Examples 3, 5, 8, and 20, it can be considered that the number of passes through the pickling and polishing was less than 2 times. Further, in Comparative Example 20, pickling and polishing were carried out by the above-described A method after final rolling.

In the case of Comparative Example 13, it was considered that the reason was that although pickling was performed, polishing polishing was not performed.

In the case of Comparative Examples 6 and 7, it is considered that the abrasive grains which were subjected to pickling polishing were 4000 particles, and the abrasive grains were too fine, so that polishing was hardly performed, and the Ra (RD) reduction effect was small.

In the case of Comparative Examples 11, 12, the reason was considered to be that the number of rotations of the pickling polishing was less than 1200 rpm.

In the case of Comparative Examples 9 and 10, the abrasive grains were too rough to cause the pickling polishing surface to be rough, and {(the 60-degree specular gloss G(RD) of the rolling parallel direction)-(the 60-degree specular gloss in the right angle direction was rolled) Degree G(TD))}<90% and causes an increase in pinholes, and the soldering time is deteriorated. This case is considered to be because the abrasive grains which are subjected to pickling polishing are 500 grit, and thus the abrasive grains are too rough.

In the case of Comparative Examples 4, 14, 16, 18, and 21, it was considered that since the pickling and polishing were not performed after the final rolling, the oxide film on the surface and the foreign matter were not removed, and the surface state of the original rolling was maintained. Further, Comparative Example 21 was produced in the same manner as in the respective examples except that the roughness of the roll to be finally rolled was made fine.

Further, in the case of Comparative Examples 16 and 18, since the treatment was carried out before the finish press (pickling or degreasing), and the pickling and polishing were not performed, the peak position was used as the average line for the roughness curve (indicating The position of the zero in the degree distribution map of the surface unevenness component is more on the positive side (the convex component side). That is, these comparative examples show the copper alloy sheets of Patent Document 2.

Further, in the case of Comparative Examples 4, 13, 16, and 21, the soldering time exceeded 2.0 seconds, and the solder wettability was also deteriorated. This reason was considered to be because the pickling and polishing were not performed once, so that the oxide film was formed. More residual in the metal watch surface. (Further, Comparative Example 16 corresponds to the conditions described in Patent Document 2)

2‧‧‧ copper alloy plate

4‧‧‧ Pickling tank

6‧‧‧ polishing wheel

Ra‧‧‧ surface roughness

Rz‧‧‧ surface roughness

TD‧‧‧Rolling right angle

RD‧‧‧Rolling parallel direction

P1‧‧‧ frequency

P2‧‧‧ frequency

Fig. 1 is a view showing an example of a procedure for producing a Co-Si-based copper alloy sheet according to an embodiment of the present invention.

Fig. 2 is a graph showing the degree distribution of the surface unevenness component of Example 4.

Fig. 3 is a graph showing the degree distribution of the uneven component on the surface of Example 18.

2‧‧‧ copper alloy plate

4‧‧‧ Pickling tank

6‧‧‧ polishing wheel

G‧‧‧Gloss

Ra‧‧‧ surface roughness

TD‧‧‧Rolling right angle

RD‧‧‧Rolling parallel direction

Claims (6)

A Co-Si-based copper alloy sheet containing Co: 0.5 to 3.0% by mass, Si: 0.1 to 1.0% by mass, and the remainder consisting of Cu and unavoidable impurities, and {(60-degree specular gloss in the parallel direction) G(RD))-(60 degree specular gloss G(TD)) in the direction of the right angle is 90%. A Co-Si-based copper alloy sheet according to the first aspect of the invention, wherein the surface roughness Ra (RD) of the rolling parallel direction is 0.07 μm. A Co-Si-based copper alloy sheet according to the second aspect of the invention, wherein the surface roughness Rz (RD) 压 0.50 μm in the parallel direction of rolling is obtained. The Co-Si-based copper alloy sheet according to any one of claims 1 to 3, wherein the peak position in the degree distribution map indicating the surface unevenness in the direction perpendicular to the rolling direction is located at an average line of the roughness curve. On the negative side (concave component side). The Co-Si-based copper alloy sheet according to any one of claims 1 to 3, further comprising 2.0% by mass or less selected from the group consisting of Mn, Fe, Mg, Ni, Cr, V, Nb, Mo, Zr, One or two or more of the group consisting of B, Ag, Be, Zn, Sn, a bismuth alloy, and P. A Co-Si-based copper alloy sheet according to claim 4, further comprising 2.0% by mass or less selected from the group consisting of Mn, Fe, Mg, Ni, Cr, V, Nb, Mo, Zr, B, Ag, Be, One or two or more of the group consisting of Zn, Sn, a bismuth alloy, and P.